JP2000500265A5 - - Google Patents
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- Publication number
- JP2000500265A5 JP2000500265A5 JP1997507104A JP50710497A JP2000500265A5 JP 2000500265 A5 JP2000500265 A5 JP 2000500265A5 JP 1997507104 A JP1997507104 A JP 1997507104A JP 50710497 A JP50710497 A JP 50710497A JP 2000500265 A5 JP2000500265 A5 JP 2000500265A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19527059.2 | 1995-07-25 | ||
| DE19527059 | 1995-07-25 | ||
| PCT/DE1996/001408 WO1997005644A1 (de) | 1995-07-25 | 1996-07-24 | Verfahren und vorrichtung zur ionendünnung in einem hochauflösenden transmissionselektronenmikroskop |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000500265A JP2000500265A (ja) | 2000-01-11 |
| JP2000500265A5 true JP2000500265A5 (OSRAM) | 2004-08-26 |
Family
ID=7767678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9507104A Pending JP2000500265A (ja) | 1995-07-25 | 1996-07-24 | 高分解能透過電子顕微鏡におけるイオン薄肉化方法および装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6218663B1 (OSRAM) |
| EP (1) | EP0840940B1 (OSRAM) |
| JP (1) | JP2000500265A (OSRAM) |
| DE (2) | DE19680624D2 (OSRAM) |
| WO (1) | WO1997005644A1 (OSRAM) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19802848B4 (de) * | 1998-01-26 | 2012-02-02 | Display Products Group,Inc. | Verfahren und Vorrichtung zum Testen eines Substrats |
| JP2000035391A (ja) * | 1998-07-16 | 2000-02-02 | Seiko Instruments Inc | 薄片化加工時の試料歪除去方法 |
| JP3970656B2 (ja) * | 2002-03-27 | 2007-09-05 | 株式会社日立ハイテクノロジーズ | 透過電子顕微鏡による試料観察方法 |
| WO2004035211A1 (en) * | 2002-10-15 | 2004-04-29 | Advanced Research Corporation | Solid state membrane channel device for the measurement and characterization of atomic and molecular sized samples |
| US7002152B2 (en) * | 2003-02-15 | 2006-02-21 | Bal-Tec Ag | Sample preparation for transmission electron microscopy |
| EP1501115B1 (en) * | 2003-07-14 | 2009-07-01 | FEI Company | Dual beam system |
| US8723144B2 (en) * | 2004-07-14 | 2014-05-13 | Applied Materials Israel, Ltd. | Apparatus for sample formation and microanalysis in a vacuum chamber |
| US7132673B2 (en) * | 2004-07-30 | 2006-11-07 | E.A. Fischione Instruments, Inc. | Device and method for milling of material using ions |
| KR20070101204A (ko) * | 2004-08-24 | 2007-10-16 | 셀라 세미컨덕터 엔지니어링 라보라토리스 리미티드 | 워크피스를 밀링하기 위해 이온빔을 가하고 다수회편향시키고, 그 정도를 결정 및 제어하기 위한 방법, 장치및 시스템 |
| US7214935B2 (en) * | 2004-09-30 | 2007-05-08 | International Business Machines Corporation | Transmission electron microscopy sample preparation method for electron holography |
| US20060076511A1 (en) * | 2004-10-08 | 2006-04-13 | Applied Materials, Inc. | Shallow angle cut along a longitudinal direction of a feature in a semiconductor wafer |
| JP4664041B2 (ja) * | 2004-10-27 | 2011-04-06 | 株式会社日立ハイテクノロジーズ | 荷電粒子ビーム装置及び試料作製方法 |
| EP1657736B1 (en) * | 2004-11-15 | 2016-12-14 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | High current density particle beam system |
| EP1883094B1 (en) * | 2006-07-24 | 2012-05-02 | ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle beam device and method for inspecting specimen |
| JP2007250542A (ja) * | 2007-03-13 | 2007-09-27 | National Institute For Materials Science | 微細加工方法 |
| JP5702552B2 (ja) * | 2009-05-28 | 2015-04-15 | エフ イー アイ カンパニＦｅｉ Ｃｏｍｐａｎｙ | デュアルビームシステムの制御方法 |
| CN101581637B (zh) * | 2009-06-19 | 2011-08-17 | 武汉钢铁(集团)公司 | 一种带有硅钢片涂层的电镜薄膜样品的制备方法 |
| JP5871440B2 (ja) * | 2010-07-14 | 2016-03-01 | エフ・イ−・アイ・カンパニー | 走査共焦点電子顕微鏡のコントラストの向上 |
| EP2710109B1 (de) * | 2011-05-19 | 2017-10-25 | NMI Naturwissenschaftliches und Medizinisches Institut an der Universität Tübingen | Verfahren und verwendung einer vorrichtung zur automatisierten positionsbestimmung eines mikrosystems zur manipulation eines sphärischen mikro-objekts |
| US20230268157A1 (en) * | 2020-07-03 | 2023-08-24 | Mel-Build Corporation | Specimen holder |
| CN114923753B (zh) * | 2022-05-25 | 2025-07-15 | 江苏第三代半导体研究院有限公司 | 用于电子显微镜的样品的制备方法 |
| CN115159446B (zh) * | 2022-06-17 | 2024-07-12 | 燕山大学 | 硅微/纳米柱的制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2243616A1 (de) | 1972-09-01 | 1974-03-07 | Siemens Ag | Korpuskularstrahlgeraet mit einer blende zwischen zwei vakuumraeumen |
| US4128765A (en) | 1976-10-29 | 1978-12-05 | Joseph Franks | Ion beam machining techniques and apparatus |
| JP2811073B2 (ja) * | 1988-11-01 | 1998-10-15 | セイコーインスツルメンツ株式会社 | 断面加工観察装置 |
| JPH0775156B2 (ja) * | 1992-03-06 | 1995-08-09 | ▲巌▼ 大泊 | イオン照射装置及び方法 |
| JP3132938B2 (ja) | 1993-02-03 | 2001-02-05 | セイコーインスツルメンツ株式会社 | 断面加工観察用荷電ビーム装置および加工方法 |
| JP3119959B2 (ja) * | 1993-02-05 | 2000-12-25 | セイコーインスツルメンツ株式会社 | 集束イオンビーム装置および加工観察装置 |
| JP2987417B2 (ja) | 1993-03-04 | 1999-12-06 | 科学技術庁金属材料技術研究所長 | 透過型電子顕微鏡用の薄膜試料のその場作製および観察方法並びにその装置 |
| US5443684A (en) * | 1994-02-28 | 1995-08-22 | The United States Of America As Represented By The Secretary Of The Army | Method for measuring thin film thickness |
| JP3221797B2 (ja) * | 1994-06-14 | 2001-10-22 | 株式会社日立製作所 | 試料作成方法及びその装置 |
| JP3265901B2 (ja) * | 1995-03-24 | 2002-03-18 | 株式会社日立製作所 | 集束イオンビーム装置及び集束イオンビーム照射方法 |
| DE29507225U1 (de) | 1995-04-29 | 1995-07-13 | Grünewald, Wolfgang, Dr.rer.nat., 09122 Chemnitz | Ionenstrahlpräparationsvorrichtung für die Elektronenmikroskopie |
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1996
- 1996-07-24 JP JP9507104A patent/JP2000500265A/ja active Pending
- 1996-07-24 WO PCT/DE1996/001408 patent/WO1997005644A1/de not_active Ceased
- 1996-07-24 EP EP96930950A patent/EP0840940B1/de not_active Expired - Lifetime
- 1996-07-24 US US09/011,594 patent/US6218663B1/en not_active Expired - Lifetime
- 1996-07-24 DE DE19680624T patent/DE19680624D2/de not_active Expired - Fee Related
- 1996-07-24 DE DE59605446T patent/DE59605446D1/de not_active Expired - Lifetime