JP2000357909A - Manufacture of chip-like electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily form the side conductor pattern of chip-like electronic parts with satisfactory positional accuracy. SOLUTION: A base material substrate body 6 for forming plural chip-like substrate bodies 2 constituting chip-like electronic components is prepared. The plural base material substrate bodies 6 are laminated. The laminated body of the base material substrate bodies 6 is divided at every row group 10 or column group 11 of the chip-like substrate body 2. A side conductor pattern is formed in the side forming areas 12 of the chip-like substrate bodies 2 in the row group 10 or the column group 11 of the chip-like substrate bodies 2. Namely, the side conductor pattern is formed into the chip-like substrate bodies 2, before the respective chip-like substrate bodies 2 are separated. The row group 10 or the column group 11 of the chip-like substrate bodies 2 are divided by each column or row in the chip-like substrate bodies 2 and the laminated bodies 13 of the chip-like substrate bodies 2 are formed. Then, the laminated bodies 13 of the chip-like substrate bodies 2 are separated by each chip-like substrate body 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-shaped electronic component such as a chip-shaped antenna element.

[0002]

2. Description of the Related Art FIG. 3 shows an example of a chip antenna element which is a chip electronic component. As shown in FIG. 3, the chip-shaped antenna element 1 is a surface-mount type antenna element and has a chip-shaped substrate 2. The chip-shaped substrate 2 is formed of a dielectric material such as ceramics, and a radiation electrode 3, a ground electrode 4, and a power supply electrode 5 are formed on side surfaces thereof. In the example shown in FIG. 3, the radiation electrode 3 is formed in a region extending from the side surface 2 a to the side surface 2 c via the side surface 2 b of the chip-shaped substrate 2, and the ground electrode 4 communicates with the radiation electrode 3 and It is formed on the entire side surface 2 d of the substrate 2. Also,
The power supply electrode 5 is formed in a region sandwiched between the end 3a of the radiation electrode 3 and the end 4a of the ground electrode 4, and the power supply electrode 5 is arranged at an interval from the radiation electrode 3 and the ground electrode 4. Is formed.

In the chip-shaped antenna element 1 having the above structure, a voltage applying means (not shown) is electrically connected to the power supply electrode 5, and when a voltage is applied to the power supply electrode 5 by the voltage application means, the radiation electrode is turned off. 3 and the power supply electrode 5
A capacitance is generated between the end face 5a and the radiating electrode 3 due to capacitive coupling by the capacitance, and the antenna operates as a resonance type surface mount antenna.

[0004] The chip-shaped antenna element 1 having the above configuration has been manufactured as follows. First, a plurality of chip-like substrate bodies 2 are separated from a base material substrate body 6 as shown in FIG.
(B), and the radiation electrode 3, the ground electrode 4, and the power supply electrode 5 as described above are formed on the side surface of the chip-shaped substrate 2 for each chip-shaped substrate 2.

[0005] The radiation electrode 3, the ground electrode 4, and the power supply electrode 5
Although there are various methods for forming the image, the following method is used. For example, first, a conductive material is formed on the entire surface of the chip-shaped substrate body 2, and then, using a photoresist method, an etching resist is applied to the surface of the conductive material by using the radiation electrode 3, the ground electrode 4, and the power supply electrode. A coating is formed on the formation region of No. 5. Then, a portion of the conductive material which is not covered with the etching resist is removed by etching with an etching solution. Thus, the radiation electrode 3, the ground electrode 4, and the power supply electrode 5 are formed.

After the radiation electrode 3, the ground electrode 4, and the power supply electrode 5 are formed as described above, the radiation electrode 3, the
An adjustment is made to make the capacitance generated between the power supply electrode 5 and the power supply electrode 5 a predetermined value. That is, the radiation electrode 3 and the feeding electrode 5
When the capacitance between the electrodes is larger than a predetermined value, one or both of the radiation electrode 3 and the power supply electrode 5 are trimmed to increase the distance between the end face 3a of the radiation electrode 3 and the end face 5a of the power supply electrode 5. Or, by reducing the facing area between the end face 3a of the radiation electrode 3 and the end face 5a of the power supply electrode 5 by the trimming, in a direction to decrease the capacitance between the radiation electrode 3 and the power supply electrode 5 toward a predetermined value. adjust. In addition, the surface treatment of the chip-shaped substrate body 2 is appropriately performed, and the manufacture of the chip-shaped antenna element 1 is completed.

[0007]

Conventionally, as described above, after the chip-shaped substrate 2 is cut out from the base material substrate 6, the radiation electrode 3 and the ground are provided on the side surfaces of the cut-out chip-shaped substrate 2. The electrode 4 and the power supply electrode 5 were formed. However, the chip-shaped substrate body 2 is very fine, and the side surfaces of the fine chip-shaped substrate body 2 are subjected to an electrode forming process using the photoresist method or the like, and the radiation electrode 3, the ground electrode 4, and the power supply electrode are formed. It was very difficult to form 5 with good positional accuracy.

Further, as described above, the electrodes 3, 4, and 5 are formed for each individual chip-shaped substrate 2, so that
There was a problem that productivity was very low.

In view of this, it is conceivable to arrange the chip-shaped substrate bodies 2 on a jig and collectively form the radiation electrode 3, the ground electrode 4, and the power supply electrode 5 on a plurality of chip-shaped substrate bodies 2. The substrate 2 must be accurately arranged at a predetermined position on the jig, and the work is troublesome. In addition, even if the chip-like substrate 2 is carefully arranged on the jig, the chip-like substrate 2 is deviated from a predetermined value. In many cases, the radiation electrode 3, the ground electrode 4, and the power supply electrode 5 cannot be formed on the side surface of the chip-shaped substrate 2 with high positional accuracy due to the positional shift.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to make it possible to easily form a side conductor pattern on the side surface of a chip-shaped substrate body with high positional accuracy. The present invention relates to a method for manufacturing a chip-shaped electronic component.

[0011]

In order to achieve the above-mentioned object, the present invention provides means for solving the above-mentioned problems with the following arrangement. That is, a first invention is a method of manufacturing a chip-shaped electronic component in which a conductive material is formed on a side surface of a chip-shaped substrate body in a predetermined pattern to form a side-surface conductor pattern. Prepare a base material substrate for forming the chip-shaped substrate,
First, the plurality of base material substrate bodies are stacked, and then, the stacked body of the base material substrate bodies is divided into predetermined rows or columns of a matrix arrangement of chip-shaped substrate bodies, and thereafter, the chip-shaped substrate bodies are separated. The above-mentioned side conductor pattern is formed in each of the side surface forming regions of each chip-shaped substrate body in the row or column group of the body, and thereafter, the row or column group of the chip-shaped substrate body is divided into columns or rows of the chip-shaped substrate body. This is a means for solving the above-mentioned problem by a structure in which a laminate of chip-shaped substrate bodies is formed by dividing the chip-shaped substrate body, and then the laminate of chip-shaped substrate bodies is separated for each chip-shaped substrate body.

According to a second aspect of the present invention, there is provided the configuration of the first aspect of the invention, wherein when a plurality of base material substrates are stacked, the plurality of base material substrates are integrated using a bonding material. When separating the laminated body of the chip-shaped substrate into each chip-shaped substrate, the bonding force of the bonding material is reduced to separate the laminated body of the chip-shaped substrate into each chip-shaped substrate. Is configured as

According to a third aspect of the present invention, there is provided the configuration of the first or second aspect, wherein the chip-shaped electronic component is a chip-shaped antenna element.

In the invention having the above-described structure, for example, after the stacked body of the base material substrate is cut into predetermined rows or columns of the matrix arrangement of the chip-shaped substrate, the rows or columns of the chip-shaped substrate are separated. A side conductor pattern is formed in each of the side surface forming regions of each chip-shaped substrate body. That is, before separating each chip-shaped substrate, a side conductor pattern is formed on each chip-shaped substrate.

After the side conductor patterns are formed in the side surface forming regions of each chip substrate in the row or column group of the chip substrate as described above, each chip substrate is separated. Thus, a chip-shaped electronic component is manufactured.

The row or column group of the chip-shaped substrate is larger than the chip-shaped substrate, and each chip-shaped substrate in the row or column group of the chip-shaped substrate is provided with a side conductor for each fine chip-shaped substrate. It is possible to form the side conductor pattern more easily and with higher positional accuracy than when forming the pattern.

For this reason, it is possible to form a complicated side conductor pattern on the side surface of the chip substrate without enlarging the chip substrate, and the side conductor pattern required for the chip electronic component can be formed. It is possible to provide a chip-shaped electronic component capable of sufficiently coping with the complexity of the semiconductor device (increasing the density of a circuit network).

Further, as described above, since the side conductor pattern is formed on the chip substrate before separation into each chip substrate, the side conductor pattern is collectively formed on a plurality of chip substrates. As a result, the productivity of chip-shaped electronic components can be significantly improved.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

This embodiment is directed to a chip antenna element which is a chip electronic component as shown in FIG. That is, it has a chip-shaped substrate 2, and a conductive material is exposed and formed on a side surface of the chip-shaped substrate 2 in a predetermined pattern to form a radiation electrode 3, a ground electrode 4, and a power supply electrode 5 which are side conductor patterns. It is intended for a chip-shaped electronic component on which is formed. This embodiment is characterized in the manufacturing process of the above-mentioned chip-shaped antenna element, and the manufacturing process of the characteristic chip-shaped antenna element will be described below.

First, a base material body 6 as shown in FIG. 4 for forming a plurality of chip-like substrate bodies 2 of chip-like antenna elements is prepared. Next, as shown in FIG. 1A, a plurality of base material substrates 6 are stacked. In this case, the plurality of base material substrates 6 are integrated using a bonding material. The bonding material is, for example, an organic adhesive, a glue, a fat, a resin, a brazing material, or the like, and has a bonding strength of an acidic or alkaline solvent, water, an organic solvent, heat, light, or the like. This is a bonding material having a reduced value.

Thereafter, as shown in FIG. 1B, the laminated body of the base material substrates 6 is divided into predetermined rows and columns 10 of the matrix arrangement of the chip-shaped substrate 2, or as shown in FIG. It is divided for each column group 11 as shown in c). Note that there are various methods such as wire cutting for separating the stacked body of the base material substrate 6. Here, any of these methods is used to separate the stacked structure of the base material substrate 6. The description of the dividing method may be omitted.

Next, predetermined side conductor patterns are formed in the side surface forming regions 12 of each chip substrate in the row group 10 or the column group 11 of the chip substrate 2, respectively. There are various methods for forming the side-surface conductor pattern. Here, any of these methods may be used, and description thereof will be omitted.

In the chip-shaped antenna element 1 shown in FIG. 3, since the side conductor patterns are formed on all four side surfaces of the chip-shaped substrate 2, in this step, of the four side surfaces of the chip-shaped substrate 2, Side conductor patterns are formed on the two side surfaces.

Thereafter, as shown in FIG. 1D, the row group 10 or the column group 11 of the chip substrate 2 is divided into columns or rows of each chip substrate to form a chip substrate. A second laminate 13 is formed. The remaining side conductor pattern is formed in the side surface forming region of the chip-shaped substrate body 2 exposed by the cutting. As for the side conductor pattern forming method in this step, the side conductor pattern may be formed by a method appropriately selected from a plurality of forming methods, as described above, and the description thereof is omitted here.

Next, as shown in FIG. 1E, the bonding force of the bonding material is reduced by a predetermined method using, for example, a solvent, heat, light, or the like to reduce the bonding strength of the chip-like substrate 13. Is separated for each chip-shaped substrate 2.

Thereafter, if necessary, trimming for adjusting the capacitance between the radiation electrode 3 and the feed electrode 5 as described above is performed, or a member for protecting the conductor pattern or plating for enhancing the function is applied. And other surface treatments.

Through the above manufacturing steps, the manufacture of the chip-shaped electronic component is completed.

According to this embodiment, in the state of the row group 10 or the column group 11 of the chip-shaped substrate body 2 and the stacked body 13 of the chip-shaped substrate body 2, the side conductor pattern is formed on each chip-shaped substrate body 2. The row group 10 or the column group 11 of the chip-shaped substrate 2 and the stacked body 13 of the chip-shaped substrate 2 are larger than the chip-shaped substrate 2.
The row group 10 or the column group 11 and the respective chip-shaped substrate bodies 2 in the state of the stacked body 13 of the chip-shaped substrate bodies 2 are used when forming a side conductor pattern on a very fine chip-shaped substrate body 2. In comparison, the side conductor pattern can be easily formed. Moreover, the side conductor pattern can be formed on each chip-shaped substrate 2 with high positional accuracy.

As described above, since the side conductor pattern can be formed on the side surface of the chip-shaped substrate body 2 with high positional accuracy, the problem of a decrease in the yield of chip-shaped electronic components due to the displacement of the side conductor pattern can be prevented. be able to.

As described above, in this embodiment, in the state of the row group 10 or the column group 11 of the chip-like substrate 2 and the stacked body 13 of the chip-like substrate 2, that is, each chip-like substrate 2 Since the side conductor pattern is formed before separation for each body 2, the side conductor pattern can be collectively formed on a plurality of chip-shaped substrate bodies 2. The productivity of chip-shaped electronic components can be remarkably improved as compared with the case where one side conductor pattern is formed for each fine chip-shaped substrate body 2 obtained.

As described above, by improving the yield and productivity of the chip-shaped electronic components, the price of the chip-shaped electronic components can be suppressed, and as described above, a complicated side conductor pattern can be easily formed. So you can
An epoch-making effect of being able to provide an inexpensive and high-performance chip-shaped antenna element 1 can be obtained.

It should be noted that the present invention is not limited to the above embodiment, but can adopt various embodiments. For example, in the embodiment described above, the chip-shaped antenna element 1 as shown in FIG. 3 has been described as an example, but the present invention is not limited to the chip-shaped antenna element 1, and the chip-shaped substrate 2 The present invention can be applied to any chip-shaped electronic component having a side surface conductive pattern formed on the side surface.

When the present invention is applied to a chip-like electronic component having a circuit pattern formed by forming a conductor pattern on the chip-like substrate 2, as described above, the side surface of the chip-like substrate 2 Since complex side conductor patterns can be formed easily and with high positional accuracy, complicated side conductor patterns can be easily manufactured without increasing the size of the chip-shaped substrate 2. It is possible to obtain a chip-shaped electronic component that can sufficiently cope with the required complexity of the conductor pattern (higher density of a circuit network).

For example, in the example shown in FIG. 3, no conductive material is formed on the surface (upper surface) and the bottom surface of the chip-shaped substrate 2, but one or both of the surface and the bottom of the chip-shaped substrate 2 are provided. A conductive pattern may be formed by forming a conductive material in a predetermined pattern.

As described above, when the conductor pattern is formed on one or both of the surface and the bottom surface of the chip-shaped substrate 2, first, the surface-forming region of each chip-shaped substrate 2 in the base material substrate 6 or A predetermined conductor pattern is collectively formed in each of the bottom surface forming regions, and thereafter, a plurality of base material substrates 6 are stacked as shown in FIG.

Further, the shape of the side conductor pattern of the chip-shaped electronic component is not limited to the shape of the side conductor pattern shown in FIG. 3, but can take an appropriate shape.

Further, in the above embodiment, the conductive material is formed on all four side surfaces of the chip-shaped substrate body 2 to form the side-surface conductor pattern. The side conductor pattern may be formed on the three or less sides.

In the above embodiment, the chip-shaped substrate 2 is made of a dielectric material. However, the chip-shaped substrate 2 may be made of, for example, glass, ceramics, silicon, resin, or a metal coated with an insulating material. It may be made of an appropriate material selected from various materials such as materials.

Further, in the above embodiment, the chip-shaped substrate 2 is constituted by one substrate.
The chip-shaped substrate 2 may have a configuration in which a plurality of substrates are stacked. In this case, a plurality of substrates for forming a plurality of substrates (hereinafter, referred to as chip configuration substrates) constituting the chip-shaped substrate body 2 are prepared, and the substrates are stacked to form the base material substrate body 6. You.

As described above, when the chip-shaped substrate 2 is formed of a laminate of chip-configured substrates, a conductor pattern may be formed on one or both of the front and bottom surfaces of the chip-configured substrate. Further, through holes may be formed in the chip-constituting substrate as necessary. By forming in this way, a circuit can be formed inside the chip-shaped substrate body 2 and a further circuit network Density can be increased.

Further, in the above embodiment, the laminated body of the base material substrate 6 is divided into one row group 10 or one column group 11 of the chip-shaped substrate body 2. In the case where the side conductor pattern is formed on three or less of the four side surfaces of the chip-shaped substrate body 2, the base material substrate body 6
The stacked body of FIG. 2 is divided into two rows 10 of the chip-shaped substrate 2 as shown in FIG. 2A, or two columns of the chip-shaped substrate 2 as shown in FIG. It may be divided for each group 11.

Further, the chip-shaped substrate 2 of the chip-shaped electronic component may be provided with a through hole penetrating from the front side to the bottom side, or a concave / convex portion on the front side or the bottom side, as necessary. As described above, when the through holes and the concave / convex portions are provided in the chip-shaped substrate body 2, for example, when the base material substrate body 6 (chip-shaped substrate body 2) is ceramic, the base material substrate is formed at the time of firing and forming the ceramic. The through hole and the concave / convex portions may be simultaneously formed in the formation area of each chip-shaped substrate body 2 while the body 6 is formed. When the base material substrate 6 is made of a resin, the through holes and the concave / convex portions may be formed simultaneously with the molding of the base material substrate 6. Further, the through-holes and the concave / convex portions may be provided in the formation region of each chip-shaped substrate body 2 in the formed base material substrate body 6. As described above, it is desirable to provide the through holes and the concave / convex portions before separating each chip-shaped substrate body 2, but after separating each chip-shaped substrate body 2,
Each chip-shaped substrate 2 may be provided with a through hole or a concave / convex portion.

[0044]

According to the present invention, the side conductor pattern is formed on the chip-shaped substrate in a state of rows or columns of the chip-shaped substrate, that is, before being separated for each chip-shaped substrate. Since the row or column group of the chip-shaped substrate body is larger than the chip-shaped substrate body, the chip-shaped substrate is formed as compared with the case where the side conductor pattern is formed on the side surface of each very fine chip-shaped substrate body. Side conductor patterns can be formed easily and with high positional accuracy on the side surface forming regions of each chip-shaped substrate in the rows or columns of the substrate.

As described above, since the side conductor pattern can be formed on each chip-shaped substrate body with high positional accuracy, it is possible to prevent a problem of a decrease in the yield of chip-shaped electronic components due to a displacement of the side conductor pattern. it can.

In addition, since the side conductor pattern is formed on the chip substrate before being separated for each chip substrate, the side conductor pattern is collectively formed on a plurality of chip substrates. Thus, the productivity of the chip-shaped electronic component can be remarkably improved as compared with the conventional case where the side conductor pattern is formed for each chip-shaped substrate.

As described above, the effect of preventing the yield of chip-shaped electronic components from lowering and the effect of improving the productivity are combined, so that the cost of chip-shaped electronic components can be easily suppressed, and the cost of chip-shaped electronic components can be reduced. Parts can be provided.

Further, as described above, since the side conductor pattern can be formed on the side surface of the chip-shaped substrate body with high positional accuracy, a complicated side conductor pattern can be formed without increasing the size of the chip-shaped substrate body. This makes it possible to easily and inexpensively manufacture a chip-shaped electronic component that can sufficiently cope with the increasingly required complexity of side conductor patterns (higher density of a circuit network).

Further, when a plurality of base material substrates are laminated, the base material substrates are integrated by using a bonding material, and when the stacked body of chip-shaped substrates is separated for each chip-shaped substrate, In a configuration in which the bonding strength of the bonding material is reduced to separate the stack of chip-shaped substrate bodies for each chip-shaped substrate body, the stacked body of the base material substrate body is In the case of separating each row or column group, the problem that the stacked body of the base material substrate collapses can be reliably prevented. Further, the stacked body of the chip-shaped substrate bodies can be easily separated for each chip-shaped substrate body.

In the case where the chip-shaped electronic component is a chip-shaped antenna element, the chip-shaped antenna element is required to form the side conductor pattern with high positional accuracy, but the chip-shaped antenna element can sufficiently meet the demand. An antenna element can be obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing one embodiment of a method for manufacturing a chip-shaped electronic component according to the present invention.

FIG. 2 is an explanatory diagram showing another embodiment.

FIG. 3 is a model diagram showing an example of a chip antenna element.

FIG. 4 is an explanatory diagram showing a conventional problem.

DESCRIPTION OF SYMBOLS 1 Chip-shaped antenna element 2 Chip-shaped substrate 6 Base material substrate 10 Row group of chip-shaped substrate 11 Column group of chip-shaped substrate 12 Side surface forming area of chip-shaped substrate 13 Chip-shaped substrate Laminate

Claims (3)

[Claims] 1. A method for manufacturing a chip-shaped electronic component in which a conductive material is formed on a side surface of a chip-shaped substrate body in a predetermined pattern to form a side-surface conductive pattern. A base material body for forming a substrate body is prepared, first, the plurality of base material substrate bodies are stacked, and then, the stacked body of the base material body is arranged in a predetermined matrix of chip-shaped substrate bodies. Then, the side surface conductor patterns are formed in the side surface forming regions of the respective chip-shaped substrate bodies in the row or column group of the chip-shaped substrate body, and thereafter, the chip-shaped substrate body is formed. Are divided into columns or rows of the chip-shaped substrate to form a stacked body of the chip-shaped substrate, and then the stacked body of the chip-shaped substrate is separated for each chip-shaped substrate. Manufacture of chip-shaped electronic components characterized by the following: Method. 2. When laminating a plurality of base material substrates, the plurality of base material substrates are integrated by using a bonding material, and the stacked body of chip-shaped substrates is separated for each chip-shaped substrate. 2. The method for manufacturing a chip-like electronic component according to claim 1, wherein, when separating the chip-like electronic parts, the bonding strength of the bonding material is reduced to separate the stack of chip-like substrate bodies into individual chip-like substrate bodies. . 3. The method for manufacturing a chip-shaped electronic component according to claim 1, wherein the chip-shaped electronic component is a chip-shaped antenna element.