JP2000353828A - Photoelectric conversion element and manufacture of the same - Google Patents
Photoelectric conversion element and manufacture of the sameInfo
- Publication number
- JP2000353828A JP2000353828A JP11165482A JP16548299A JP2000353828A JP 2000353828 A JP2000353828 A JP 2000353828A JP 11165482 A JP11165482 A JP 11165482A JP 16548299 A JP16548299 A JP 16548299A JP 2000353828 A JP2000353828 A JP 2000353828A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- photoelectric conversion
- chip
- base part
- conversion element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は発光用、受光用など
の目的でプリント回路基板などに取付けられて用いられ
るＬＥＤランプ、受光素子あるいは受発光素子など光電
変換素子に関するものであり、詳細には、前記光電変換
素子のコストダウンを可能とする製造方法の提供を目的
とする。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoelectric conversion element such as an LED lamp, a light receiving element or a light emitting / receiving element which is used by being attached to a printed circuit board for light emission, light reception, and the like. It is another object of the present invention to provide a manufacturing method capable of reducing the cost of the photoelectric conversion element.
【０００２】[0002]
【従来の技術】従来のこの種の光電変換素子の構成をＬ
ＥＤランプの例を示すものが図８および図９であり、先
ず、図８に示すＬＥＤランプ９０においては、ＬＥＤチ
ップ９１をダイボンドしワイヤ９２による配線を行った
状態のリードフレーム９３を金型（図示は省略する）中
に所定位置として設置し、前記ＬＥＤチップ９１および
ワイヤ９２を覆うように透明な樹脂を注入するトランス
ファーモールドによりケース部９４を形成するものであ
る。2. Description of the Related Art The structure of a conventional photoelectric conversion element of this type is represented by L
8 and 9 show examples of the ED lamp. First, in the LED lamp 90 shown in FIG. 8, a lead frame 93 in a state where the LED chip 91 is die-bonded and the wiring is performed by the wire 92 is used as a mold ( (Not shown), and a case portion 94 is formed by transfer molding in which a transparent resin is injected so as to cover the LED chips 91 and the wires 92.
【０００３】また、図９に示すＬＥＤランプ８０におい
ては、予めにリードフレーム８１をインサートモールド
することでベース部８２中に埋設しておき、このリード
フレーム８１にＬＥＤチップ８３をダイボンドし、ワイ
ヤ８４による配線を行った後に貼着など適宜な手段によ
りケース部８５を取付け、ＬＥＤチップ８３を覆うもの
である。In an LED lamp 80 shown in FIG. 9, a lead frame 81 is embedded in a base portion 82 by insert molding in advance, and an LED chip 83 is die-bonded to the lead frame 81 to form a wire 84. After the wiring according to the above, the case 85 is attached by an appropriate means such as sticking to cover the LED chip 83.
【０００４】尚、前記ＬＥＤチップ９１、８３をＰＤ
（ホトダイオード）チップに代替させれば、上記の製造
方法により受光素子が得られるものとなる。また、ＬＥ
ＤチップとＰＤチップとの双方を配置すればＬＥＤチッ
プから放射した光が対象物で反射するのをＰＤチップで
検知し検出する検出センサが得られるものと成る。The LED chips 91 and 83 are connected to a PD.
If a (photodiode) chip is substituted, a light receiving element can be obtained by the above manufacturing method. Also, LE
By arranging both the D chip and the PD chip, a detection sensor can be obtained in which the PD chip detects and detects that light emitted from the LED chip is reflected by the object.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記し
た従来の製造方法の図８に示したものでは、既にＬＥＤ
チップ９１が取付けられワイヤ９２で配線が行われたリ
ードフレーム９３に対してケース部９４の成形を行うも
のであるので、例えば樹脂の注入時の応力でワイヤ９２
が断線するなどの可能性がある。However, in the above-described conventional manufacturing method shown in FIG.
Since the case portion 94 is formed on the lead frame 93 on which the chip 91 is mounted and wired with the wires 92, for example, the wires 92 are formed by the stress at the time of resin injection.
May be disconnected.
【０００６】これを防止するためには樹脂の注入速度な
どに厳密な管理を行うことも有効ではあるが、このため
にはケース部９４を成形するための成型機に非常に高精
度のものが必要となり高価なものと成るので、製品のコ
ストアップの要因となる。また、別の手段として、ケー
ス部８５の成型前にＬＥＤチップ９１とワイヤ９２とを
予めに覆う方法もあるが、この場合にも別工程の追加が
必要となり、コストアップは避けられないものとなる。In order to prevent this, it is effective to strictly control the injection speed of the resin and the like, but for this purpose, a molding machine for molding the case portion 94 needs to have a very high precision. Since it is necessary and expensive, the cost of the product increases. As another means, there is a method of covering the LED chip 91 and the wire 92 in advance before the molding of the case portion 85. However, in this case, an additional step is required, and an increase in cost is unavoidable. Become.
【０００７】また、図９に示したものでは、ＬＥＤチッ
プ８３が所定の位置にダイボンドが行われるものとする
ためには、リードフレーム８１とベース部８２とに高い
精度が要求され上記と同様に厳密な管理が必要となり生
産性が低下すると共に、略摺鉢状の底面にＬＥＤチップ
８３のダイボンドと配線を行わなければならないものと
なるので、この面でも生産性が低下し、同様にコストア
ップする問題点を生じている。[0009] In the structure shown in FIG. 9, in order for the LED chip 83 to be die-bonded to a predetermined position, high precision is required for the lead frame 81 and the base portion 82, as described above. Strict control is required, which lowers productivity, and also requires die bonding and wiring of the LED chips 83 on the substantially bottom-shaped bottom surface, which also lowers productivity and similarly increases costs. Problem.
【０００８】[0008]
【課題を解決するための手段】本発明は前記した従来の
課題を解決するための具体的手段として、リードフレー
ムの半導体チップが搭載された側の面からケース部を係
合させておき、その背面から熱可塑性の接着剤による接
着シートを貼着すると共にベース部を重ね合わせ、この
状態で前記ケース部と前記ベース部とで前記リードフレ
ームを挟む方向への加圧を行いながら加熱して接着シー
トを溶融させ前記リードフレーム、ケース部、ベース部
の一体化を行うことを特徴とする光電変換素子の製造方
法を提供することで課題を解決するものである。According to the present invention, as a specific means for solving the above-mentioned conventional problems, a case portion is engaged from a surface of a lead frame on which a semiconductor chip is mounted, and An adhesive sheet made of a thermoplastic adhesive is adhered from the back and the base portion is overlapped. In this state, the case portion and the base portion are heated and bonded while applying pressure in a direction to sandwich the lead frame. An object of the present invention is to solve the problem by providing a method for manufacturing a photoelectric conversion element, wherein a lead sheet, a case portion, and a base portion are integrated by melting a sheet.
【０００９】[0009]
【発明の実施の形態】つぎに、本発明を図に示す実施形
態に基づいて詳細に説明する。尚、この実施形態でも光
電変換素子がＬＥＤランプのときの例で示すが、上記し
たようにＬＥＤチップをＰＤチップ、受発光素子チップ
などに置換して実施することは自在である。図１〜図４
は、本発明に係るＬＥＤランプの製造方法を工程の順に
示すものであり、第一の工程としては図１に示すように
リードフレーム１の所定位置にＬＥＤチップ２のダイボ
ンドを行い、ワイヤ３による配線を行う。Next, the present invention will be described in detail based on an embodiment shown in the drawings. In this embodiment, an example in which the photoelectric conversion element is an LED lamp will be described. However, the LED chip may be replaced with a PD chip, a light emitting / receiving element chip, or the like as described above. 1 to 4
1 shows a method of manufacturing an LED lamp according to the present invention in the order of steps. As a first step, die bonding of an LED chip 2 is performed at a predetermined position of a lead frame 1 as shown in FIG. Perform wiring.
【００１０】尚、前記リードフレーム１は複数が外枠１
ａなどにより一体化されているものであるので、上記の
ダイボンド、配線は自動機、半自動機などで行うことが
可能であり、効率良く行えるものである。 ここで、本
発明においては、前記リードフレーム１の例えば２個所
には貫通孔１ｂが設けられていて、後に説明するケース
部４との位置決め手段とされている。A plurality of lead frames 1 are provided on the outer frame 1.
Since they are integrated by a or the like, the above-described die bonding and wiring can be performed by an automatic machine, a semi-automatic machine, or the like, and can be performed efficiently. Here, in the present invention, through-holes 1b are provided at, for example, two places of the lead frame 1, and serve as positioning means for the case portion 4 described later.
【００１１】図２は、同じく本発明に係るＬＥＤランプ
の製造方法の第二の工程を示すものであり、上記ＬＥＤ
チップ２の取付が行われたリードフレーム１にはＬＥＤ
チップ２を覆うようにしてケース部４の取付けが行われ
る。このときに前記ケース部４には前記貫通孔１ｂに対
応するボス４ａが設けられていて、貫通孔１ｂとボス４
ａとを嵌合させることで、リードフレーム１とケース部
４とが所定の位置として係合が行われるものとされてい
る。FIG. 2 shows a second step of the method for manufacturing an LED lamp according to the present invention.
An LED is mounted on the lead frame 1 on which the chip 2 is mounted.
The case portion 4 is attached so as to cover the chip 2. At this time, the case portion 4 is provided with a boss 4a corresponding to the through hole 1b.
The lead frame 1 and the case portion 4 are engaged at a predetermined position by fitting a with each other.
【００１２】そして、リードフレーム１のケース部４が
取付けられた面の背面側から接着シート５が貼着され、
更に、前記接着シート５に重ねてはベース部６が載置さ
れる。前記接着シート５は例えばガラス繊維の不繊布に
エポキシ樹脂を含浸したもの、あるいは、エポキシ樹脂
自体をフィルム状に形成したものであり、常温では形成
された形状を維持し、且つ、多少の粘着性を有するもの
であるので、前記リードフレーム１、ケース部４、ベー
ス部６に対して仮止め程度の作用は行うものとなる。Then, an adhesive sheet 5 is attached from the back side of the surface of the lead frame 1 to which the case portion 4 is attached,
Further, a base portion 6 is placed on the adhesive sheet 5. The adhesive sheet 5 is formed, for example, by impregnating a non-woven cloth of glass fiber with an epoxy resin, or by forming the epoxy resin itself into a film shape, maintaining the formed shape at normal temperature, and having a slight tackiness. Accordingly, the lead frame 1, the case part 4, and the base part 6 perform an action of a degree of temporary fixing.
【００１３】図３は、同じく本発明に係るＬＥＤランプ
の製造方法の第三の工程を示すものであり、上記のよう
にしてケース部４とベース部６とを取付けた後には、適
宜な治具などにより前記ケース部４とベース部６とでリ
ードフレーム１を挟む方向に応力が加えられ、この状態
を維持してトンネル状の連続炉などにより加熱が行われ
る。FIG. 3 shows a third step of the method for manufacturing an LED lamp according to the present invention. After the case section 4 and the base section 6 are attached as described above, an appropriate treatment is performed. A stress is applied to the lead frame 1 between the case portion 4 and the base portion 6 by a tool or the like, and heating is performed in a tunnel-shaped continuous furnace or the like while maintaining this state.
【００１４】図４は前記接着シート５の加熱時の特性Ｐ
を示すものであり、図は１５０℃に加熱した条件下で、
加えられた外部からの圧力により溶融したエポキシ樹脂
が拡がる面積を倍率で示してある。図によれば２５０ｇ
／ｃｍ2 程度の圧力下においては略３倍の面積に拡がる
流動性を有するものとなるので、前記したリードフレー
ム１の貫通孔１ｂとケース部４のボス４ａとの間隙にも
流入し、リードフレーム１の一方の面に接着シート５を
貼着した状態でもケース部４の接着が可能となる。FIG. 4 shows a characteristic P when the adhesive sheet 5 is heated.
The figure shows that under the condition heated to 150 ° C.,
The area where the epoxy resin melted by the applied external pressure spreads is indicated by the magnification. 250g according to the figure
Under a pressure of about / cm 2, the fluid has a fluidity that spreads to approximately three times the area, so that it flows into the gap between the through hole 1b of the lead frame 1 and the boss 4a of the case portion 4 and leads. Even when the adhesive sheet 5 is adhered to one surface of the frame 1, the case portion 4 can be adhered.
【００１５】上記の接着が行われた後には、例えばリー
ドフレーム１の外枠１ａからの切断切り離し、あるい
は、リードフレーム１の端子部となる部分の成型加工な
ど通常のＬＥＤランプの工程が行われて、図５に示すＬ
ＥＤランプ１０が得られるものとなる。After the above-described bonding is performed, a normal LED lamp process such as cutting and separating the lead frame 1 from the outer frame 1a or molding a portion of the lead frame 1 to be a terminal portion is performed. And L shown in FIG.
An ED lamp 10 is obtained.
【００１６】図６、図７は本発明の別な実施形態であ
り、上記のＬＥＤランプ１０においては、ＬＥＤチップ
２はケース部４内で大気（屈折率＝１）に囲まれるもの
と成っている。よって、例えば屈折率≒３であるＬＥＤ
チップ２と大気との接触面ではＬＥＤチップ２側に内面
反射を生じて、光の取出し効率が低下するものとなる問
題点を生じる。FIGS. 6 and 7 show another embodiment of the present invention. In the LED lamp 10 described above, the LED chip 2 is surrounded by the atmosphere (refractive index = 1) in the case portion 4. I have. Therefore, for example, an LED having a refractive index of ≒ 3
At the contact surface between the chip 2 and the atmosphere, internal reflection occurs on the LED chip 2 side, causing a problem that light extraction efficiency is reduced.
【００１７】この点の解決方法としては、ＬＥＤチップ
２が大気よりも屈折率の高い樹脂中に埋設することが有
効とされているが、本発明の製造方法においてはこの点
にも対応が可能であり、図６に示すようにベース部８に
開口部８ａを設け、このベース部８を貼着する接着シー
ト７も対応する形状としておく。As a solution to this problem, it is effective to bury the LED chip 2 in a resin having a higher refractive index than the atmosphere. However, the manufacturing method of the present invention can cope with this problem. An opening 8a is provided in the base 8 as shown in FIG. 6, and the adhesive sheet 7 to which the base 8 is attached is also formed in a corresponding shape.
【００１８】そして、加熱、加圧によるベース部８およ
びケース部４のリードフレーム１への接着を行った後
に、前記開口部８ａからエポキシ樹脂など透明樹脂９の
滴下（ポッテング）モールドを行えば、ＬＥＤチップ２
とケース部４間は透明樹脂９で充填され、図７に示すＬ
ＥＤランプ１１が得られるものとなる。After bonding the base portion 8 and the case portion 4 to the lead frame 1 by heating and pressurizing, a dropping (potting) molding of a transparent resin 9 such as an epoxy resin from the opening 8a is performed. LED chip 2
The space between the housing and the case part 4 is filled with a transparent resin 9, as shown in FIG.
An ED lamp 11 is obtained.
【００１９】このときには、既にケース部４によりＬＥ
Ｄランプ１１の外観形状は形成されているものであるの
で、上記した滴下モールド時には金型などは不要であ
り、よって、特に成型機なども用意する必要はなく、例
えば定量の樹脂の注入が行えるシリンダーなどで充分で
あり、組立工程への負担の増加も低いものとすることが
できる。At this time, the LE has already been set by the case 4.
Since the external shape of the D lamp 11 is formed, a mold or the like is not required at the time of the above-described drop molding, and therefore, it is not necessary to prepare a molding machine or the like in particular. For example, a fixed amount of resin can be injected. A cylinder or the like is sufficient, and the increase in the burden on the assembly process can be reduced.
【００２０】次いで、上記した本発明の製造方法とする
ときの作用および効果について説明を行う。先ず、本発
明においてはケース部４およびベース部６（８）を接着
シート５（７）で貼着するものであるので、ケース部４
およびベース部６（８）は、通常の樹脂成型機により予
めに形成しておくことが可能となる。Next, the operation and effects of the above-described manufacturing method of the present invention will be described. First, in the present invention, the case 4 and the base 6 (8) are adhered with the adhesive sheet 5 (7).
And the base part 6 (8) can be formed in advance by a normal resin molding machine.
【００２１】従って、ＬＥＤランプ１０（１１）の製造
工程中で高価なトランスファ成型機などを使用すること
はなく、工程数が短縮されると共に設備投資も低減さ
れ、もって、ＬＥＤランプ１０（１１）の生産コストを
低減することが可能となる。また、前記ケース部４ある
いはベース部６（８）を変更するのみで生産工程に負担
を生じることなく各種の形状のＬＥＤランプの製造が可
能となるので、生産品種の切換などが速やかに行えるも
のとなり、更には、ＬＥＤチップ２をＰＤチップに代替
させることで工程に何らの変更もなく受光素子の生産も
可能となり、生産ラインの機動性も格段に向上する。Therefore, an expensive transfer molding machine or the like is not used in the manufacturing process of the LED lamp 10 (11), and the number of steps is reduced and the capital investment is reduced. Production cost can be reduced. In addition, it is possible to manufacture LED lamps of various shapes without changing the production process only by changing the case portion 4 or the base portion 6 (8). Further, by substituting the LED chip 2 with the PD chip, it becomes possible to produce the light receiving element without any change in the process, and the mobility of the production line is remarkably improved.
【００２２】[0022]
【発明の効果】以上に説明したように本発明により、リ
ードフレームの半導体チップが搭載された側の面からケ
ース部を係合させておき、その背面から熱可塑性の接着
剤による接着シートを貼着すると共にベース部を重ね合
わせ、この状態で前記ケース部と前記ベース部とで前記
リードフレームを挟む方向への加圧を行いながら加熱し
て接着シートを溶融させ前記リードフレーム、ケース
部、ベース部の一体化を行う光電変換素子の製造方法と
したことで、第一には、通常の成型機で予めに成型して
おいたケース部あるいはベース部を採用可能として、Ｌ
ＥＤランプの生産工程中でケース部あるいはベース部を
形成するという工程を排除し、生産工程の短縮と、高価
なトランスファ成型機を不要として、この種のＬＥＤラ
ンプなど光電変換素子のコストダウンに極めて優れた効
果を奏するものである。As described above, according to the present invention, the case portion is engaged with the surface of the lead frame on which the semiconductor chip is mounted, and an adhesive sheet made of a thermoplastic adhesive is attached from the back surface. At this time, the base portion is overlapped, and in this state, the adhesive is melted by heating while applying pressure in a direction to sandwich the lead frame between the case portion and the base portion to melt the adhesive sheet. First, by adopting a method of manufacturing a photoelectric conversion element that integrates parts, a case part or a base part that has been molded in advance with a normal molding machine can be adopted, and L
Eliminates the process of forming the case or base in the ED lamp production process, shortening the production process and eliminating the need for expensive transfer molding machines, greatly reducing the cost of photoelectric conversion elements such as LED lamps of this type. It has excellent effects.
【００２３】また、本発明によれば、ＬＥＤランプの生
産はリードフレームへのケース部とベース部との貼着で
良いものとなり、これらケース部とベース部との形状変
更にはそれ程に生産工程の変更を要しないものとなるの
で、例えば発光用、受光用など用途が異なるものを含む
多品種少量生産などにも対応が可能となり、生産ライン
の機動性が向上するという優れた効果も併せて奏するも
のとなる。Further, according to the present invention, the production of the LED lamp can be achieved by sticking the case portion and the base portion to the lead frame. It does not need to be changed, so it is possible to cope with high-mix low-volume production including those with different uses such as light emission and light reception, and also has the excellent effect of improving the mobility of the production line. Will play.
【図１】 本発明に係る光電変換素子（ＬＥＤランプ）
の製造方法の第一の工程を示す平面図である。FIG. 1 shows a photoelectric conversion element (LED lamp) according to the present invention.
FIG. 5 is a plan view showing a first step of the manufacturing method.
【図２】 同じく本発明に係る製造方法の第二の工程を
示す断面図である。FIG. 2 is a sectional view showing a second step of the manufacturing method according to the present invention.
【図３】 同じく本発明に係る製造方法の第三の工程を
示す断面図である。FIG. 3 is a cross-sectional view showing a third step of the manufacturing method according to the present invention.
【図４】 同じく本発明が採用する接着シートの特性を
示すグラフである。FIG. 4 is a graph showing characteristics of an adhesive sheet employed in the present invention.
【図５】 本発明に係る製造方法により製造されたＬＥ
Ｄランプを示す断面図である。FIG. 5 shows an LE manufactured by the manufacturing method according to the present invention.
It is sectional drawing which shows D lamp.
【図６】 同じく本発明に係る製造方法の別の実施形態
を貼着工程の完了後の状態で示す断面図である。FIG. 6 is a sectional view showing another embodiment of the manufacturing method according to the present invention in a state after completion of the attaching step.
【図７】 別の実施形態により得られる光電変換素子
（ＬＥＤランプ）を示す断面図である。FIG. 7 is a cross-sectional view showing a photoelectric conversion element (LED lamp) obtained according to another embodiment.
【図８】 従来例を示す断面図である。FIG. 8 is a sectional view showing a conventional example.
【図９】 別の従来例を示す断面図である。FIG. 9 is a sectional view showing another conventional example.
１……リードフレーム １ａ……外枠 １ｂ……貫通孔 ２……ＬＥＤチップ ３……ワイヤ ４……ケース部 ４ａ……ボス ５、７……接着シート ６、８……ベース部 ８ａ……開口部 ９……透明樹脂 １０、１１……ＬＥＤランプ（光電変換素子） DESCRIPTION OF SYMBOLS 1 ... Lead frame 1a ... Outer frame 1b ... Through-hole 2 ... LED chip 3 ... Wire 4 ... Case part 4a ... Boss 5, 7 ... Adhesive sheet 6, 8 ... Base part 8a ... Opening 9: Transparent resin 10, 11: LED lamp (photoelectric conversion element)
Claims (6)
れた側の面からケース部を係合させておき、その背面か
ら熱可塑性の接着剤による接着シートを貼着すると共に
ベース部を重ね合わせ、この状態で前記ケース部と前記
ベース部とで前記リードフレームを挟む方向への加圧を
行いながら加熱して接着シートを溶融させ前記リードフ
レーム、ケース部、ベース部の一体化を行うことを特徴
とする光電変換素子の製造方法。1. A case portion is engaged with a surface of a lead frame on which a semiconductor chip is mounted, an adhesive sheet made of a thermoplastic adhesive is adhered from the back surface, and a base portion is overlapped. It is characterized in that in this state, the lead frame, the case portion and the base portion are integrated by heating while applying pressure in a direction sandwiching the lead frame between the case portion and the base portion to melt the adhesive sheet. Of manufacturing a photoelectric conversion element.
あることを特徴とする請求項１記載の光電変換素子の製
造方法。2. The method according to claim 1, wherein the thermoplastic adhesive is an epoxy resin.
ことを特徴とする請求項１または請求項２記載の光電変
換素子の製造方法。3. The method according to claim 1, wherein the semiconductor chip is an LED chip.
とを特徴とする請求項１または請求項２記載の光電変換
素子の製造方法。4. The method according to claim 1, wherein the semiconductor chip is a PD chip.
チップまたは受発光一体型チップであることを特徴とす
る請求項１または請求項２記載の光電変換素子の製造方
法。5. The semiconductor chip is an LED chip and a PD.
The method for manufacturing a photoelectric conversion element according to claim 1, wherein the method is a chip or an integrated light receiving and emitting chip.
造方法により製造されたことを特徴とする光電変換素
子。6. A photoelectric conversion element manufactured by the manufacturing method according to claim 1. Description:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16548299A JP3449538B2 (en) | 1999-06-11 | 1999-06-11 | Photoelectric conversion element and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16548299A JP3449538B2 (en) | 1999-06-11 | 1999-06-11 | Photoelectric conversion element and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000353828A true JP2000353828A (en) | 2000-12-19 |
| JP3449538B2 JP3449538B2 (en) | 2003-09-22 |
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ID=15813251
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16548299A Expired - Lifetime JP3449538B2 (en) | 1999-06-11 | 1999-06-11 | Photoelectric conversion element and method for manufacturing the same |
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| Country | Link |
|---|---|
| JP (1) | JP3449538B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1496551A2 (en) | 2003-07-09 | 2005-01-12 | Nichia Corporation | Semiconductor light emitting device and method of manufacturing the same |
| JP2005217369A (en) * | 2004-02-02 | 2005-08-11 | Three M Innovative Properties Co | Adhesive sheet for light-emitting-diode device, and light-emitting-diode device |
| JP2006080251A (en) * | 2004-09-09 | 2006-03-23 | Nichia Chem Ind Ltd | Light-emitting device and manufacturing method therefor |
| JP2007208061A (en) * | 2006-02-02 | 2007-08-16 | Sharp Corp | Semiconductor light emitting element, manufacturing method thereof, and assembly thereof |
| JP2008098600A (en) * | 2006-10-11 | 2008-04-24 | Alti Electronics Co Ltd | Light emitting diode package |
| JP2009111180A (en) * | 2007-10-30 | 2009-05-21 | Panasonic Electric Works Co Ltd | Led unit |
| JP2016086189A (en) * | 2016-02-03 | 2016-05-19 | 京セラコネクタプロダクツ株式会社 | Holder for semiconductor light-emitting element and semiconductor light-emitting element module |
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1999
- 1999-06-11 JP JP16548299A patent/JP3449538B2/en not_active Expired - Lifetime
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|---|---|---|---|---|
| EP1496551A3 (en) * | 2003-07-09 | 2006-10-18 | Nichia Corporation | Semiconductor light emitting device and method of manufacturing the same |
| CN100353574C (en) * | 2003-07-09 | 2007-12-05 | 日亚化学工业株式会社 | Light emitting device, method of manufacturing the same and lighting equipment |
| US7211835B2 (en) | 2003-07-09 | 2007-05-01 | Nichia Corporation | Light emitting device, method of manufacturing the same and lighting equipment |
| EP1496551A2 (en) | 2003-07-09 | 2005-01-12 | Nichia Corporation | Semiconductor light emitting device and method of manufacturing the same |
| WO2005076376A3 (en) * | 2004-02-02 | 2006-03-09 | 3M Innovative Properties Co | Adhesive sheet for light-emitting diode device and light-emitting diode device |
| WO2005076376A2 (en) * | 2004-02-02 | 2005-08-18 | 3M Innovative Properties Company | Adhesive sheet for light-emitting diode device and light-emitting diode device |
| JP2005217369A (en) * | 2004-02-02 | 2005-08-11 | Three M Innovative Properties Co | Adhesive sheet for light-emitting-diode device, and light-emitting-diode device |
| US7646088B2 (en) | 2004-02-02 | 2010-01-12 | 3M Innovative Properties Company | Adhesive sheet for light-emitting diode device and light-emitting diode device |
| US7973403B2 (en) | 2004-02-02 | 2011-07-05 | 3M Innovative Properties Company | Adhesive sheet for light-emitting diode device and light-emitting diode device |
| JP2006080251A (en) * | 2004-09-09 | 2006-03-23 | Nichia Chem Ind Ltd | Light-emitting device and manufacturing method therefor |
| JP4654639B2 (en) * | 2004-09-09 | 2011-03-23 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
| JP2007208061A (en) * | 2006-02-02 | 2007-08-16 | Sharp Corp | Semiconductor light emitting element, manufacturing method thereof, and assembly thereof |
| JP2008098600A (en) * | 2006-10-11 | 2008-04-24 | Alti Electronics Co Ltd | Light emitting diode package |
| JP2009111180A (en) * | 2007-10-30 | 2009-05-21 | Panasonic Electric Works Co Ltd | Led unit |
| JP2016086189A (en) * | 2016-02-03 | 2016-05-19 | 京セラコネクタプロダクツ株式会社 | Holder for semiconductor light-emitting element and semiconductor light-emitting element module |
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