JP2000353806A - Power semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a power semiconductor device of an embedded insulated-gate structure, which has a large electric current breaking capacity while being made low in on-state resistance equivalent to a thyristor, and protecting a parasitic thyristor against latch-up. SOLUTION: Stripe-like grooves 5 are provided on the side of a P-type base layer 4 of a structure composed of a P-type emitter layer 3, an N-type base layer 1, and a P-type base layer 4, and insulated gate electrodes 7 are each embedded and formed in the grooves 5. N-type turn-off channel layers 8 are formed in the P-type base layer 4 which comes into contact with the sides of the grooves 5 respectively, and P-type drain layer 9 are formed on the surfaces of the channel layers 8. An N-type shallow source layer 10 is provided by diffusion to the P-type base layer 4, so that a thyristor will not latch up, and a cathode electrode 11 is formed, at the same time, coming into contact with both the P-type drain layer 9 and the N-type source layer 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power semiconductor device having a buried insulated gate structure.

[0002]

2. Description of the Related Art As is well known, various thyristors such as a GTO can realize a low on-resistance (thus a small on-voltage) because of latch-up in an on state, but have a small maximum breaking current density. In particular, a thyristor with an insulated gate that performs turn-off using an insulated gate structure has a lower current interrupting capability than a normal GTO thyristor. Conversely, IGBTs and the like have a built-in thyristor structure, but are designed to be used under conditions where they do not latch up. Therefore, the maximum breaking current density is relatively large, but the on-resistance is high because they do not latch up.

[0003]

As described above, the conventional power semiconductor device requires pnp to obtain a low on-resistance.
It is necessary to latch up the n thyristors,
There is a problem that it is difficult to interrupt the current when the thyristor is latched up.

[0004] The present invention provides a buried insulated gate type power supply which can realize a sufficiently low on-resistance without latch-up and which can have a large maximum breaking current density without latch-up. An object is to provide a semiconductor element.

[0005]

According to the power semiconductor device of the present invention, the first conductivity type emitter region and the injection of the first conductivity type carrier from the first conductivity type emitter region are substantially performed through the channel. A high-resistance base region that causes conduction modulation in an on state, a second conductivity-type emitter region that injects a second conductivity-type carrier into the high-resistance base region, and a second conductivity-type in the high-resistance base region. A second conductivity type drain region for discharging carriers, wherein the carrier concentration in the high resistance base region in the on state is closer to the first conductivity type emitter region than the concentration at the center of the high resistance base region. It is characterized by having a high concentration portion.

A power semiconductor device according to the present invention is formed in a high resistance base layer, an insulated gate buried at a predetermined interval on the surface of the high resistance base layer, and in a region sandwiched by the insulated gates. A first conductivity type emitter layer;
A channel region induced by the insulated gate to inject carriers of the first conductivity type from the emitter layer of the first conductivity type into the high resistance base layer; and a second conductivity type of injecting carriers of the second conductivity type into the high resistance base layer. An emitter layer, a second conductivity type drain layer formed in a region sandwiched by the insulated gates and discharging the second conductivity type carrier from the high resistance base layer, and a distance between the second conductivity type drain layers is 2
C, when the width of the region sandwiched by the insulated gates is 2 W, and the distance from the interface between the second conductivity type drain and the high resistance base layer to the tip of the insulated gate is D, X = ｛(C−W) + D The parameter X represented by the formula 式 / W satisfies X ≧ 5.

[0007]

According to the present invention, a parasitic thyristor structure can be realized by optimizing the depth, width and spacing of the buried insulated gate portion formed and arranged with fine dimensions by optimizing the design of the emitter layer with low implantation efficiency. An on-resistance as low as that of a thyristor can be obtained without latch-up. The reason will be described in detail later, but in the structure of the present invention,
When a broadly defined emitter region is defined including the buried gate electrode portion and the second conductivity type drain layer and the first conductivity type emitter layer adjacent to the buried gate electrode portion, the resistance Rp of the second conductivity type carrier in the emitter region is defined as: This is because by setting the ratio Rp / Rn of the resistance Rn of the turn-on channel formed on the groove side surface to the first conductivity type carrier to be 4 or more, a sufficiently large emitter injection efficiency can be obtained.

The parameter X is a quantity indicating how far the bypass or drain layer of the second conductive type carrier on the first conductive type emitter layer side is apart from each other, and is a high resistance base layer on the first conductive type emitter layer side. This is introduced because the short-circuit resistance is proportional to the distance 2D + 2 (C−W) straddling the adjacent buried gate portion and inversely proportional to the emitter width 2W. This parameter X means that the smaller the parameter X, the lower the discharge resistance of the second conductive type carrier on the first conductive type emitter layer side. By optimizing the dimensions of each part so as to satisfy X ≧ 5, it is possible to obtain a sufficiently low on-voltage without performing a thyristor operation.

In the device of the present invention, the emitter implantation efficiency γ in a broad sense including a buried gate is obtained as follows. First, the current flowing between the trenches is converted into the electron current I flowing through the ON MOS channel.
Let us consider ch [A] and the other current density JT [A / cm ² ] separately. However, the current density is considered as a unit depth of 1 cm from the element cross section. The current density flowing in the unit cell is J [A / cm
² ], groove interval 2W [cm], unit cell size 2C
[Cm], and imaginary injection efficiency in the groove is γT. Γ = (Ich + γT × JT × W × 1) / (Ich + JT × W × 1) (1) where C · J = JT × W × 1 + Ich (2) Ich = Δψ / Rch (3) Rch is the resistance of the ON MOS channel. Δψ is on M
It is a potential difference between both ends of the OS channel (potential difference between both ends of the depth D), and a formula of current continuity in the groove Jp = (1-γT) JT = -kTμp (dn / dx) -qμp · n (dψ / dx) (4) Jn = γT JT = kTμn (dn / dx) −qμn · n (dψ / dx) (5), Δ 、 = (kT / q) × ｛μn (1-γT) + μpγT } / {Μn (1−γT) −μpγT} × [log (n) −log {n− (dn / dx) D}] (6) dn / dx = − (JT / 2kT) ｛(1− γT) / μp−γT / μn} (7) From these equations (2) to (7), the injection efficiency of equation (1) can be obtained. By optimizing W, D, and C, the injection efficiency of the emitter region in a broad sense can be increased without increasing the injection efficiency of the emitter (or source) layer on the cathode side. As a result, carriers accumulated in the high-resistance base layer at the time of ON can be increased, and a bipolar transistor or an IGBT having a small accumulation of carriers in an ON state (small conduction modulation) compared to a thyristor can be used as described above. By applying the “carrier injection concept” described above, the on-voltage of these devices can be reduced to the level of a thyristor.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a layout of a buried insulated gate power semiconductor device according to a first embodiment of the present invention,
FIGS. 2, 3, 4 and 5 are respectively A-
It is A ', BB', CC ', and DD' sectional drawing.

In this insulated gate semiconductor device, a p-type emitter layer 3 is formed on one surface of a high-resistance n-type base layer 1 via an n-type buffer layer 2. On the other surface of the n-type base layer 1, a p-type base layer 4 is formed by diffusion.

A plurality of stripe-shaped grooves 5 are formed in the p-type base layer 1 at minute intervals. A gate electrode 7 is buried in these trenches 5 via a gate oxide film 6. An n-type turn-off channel layer 8 is formed in every other stripe-shaped region between the grooves 5, and a p-type drain layer 9 is formed on the surface of the turn-off channel layer 8. Thereby, a vertical p-channel MOSFET in which the side surface of the n-type turn-off channel layer 8 is controlled by the buried gate electrode 7 is formed. An n-type source layer 10 is diffused on the surface of the remaining stripe-shaped region. Here, the n-type source layer 10 is shallowly diffused so that the parasitic thyristor structure constituted by the n-type source layer 10, the p-type base layer 4, the n-type base layer 1 and the p-type emitter layer 3 does not latch up. ing.

Therefore, the layout on the cathode side is as follows: the buried gate electrode 7 -the p-type drain layer 9 -the buried gate electrode 7-
It has a pattern in which the arrangement of the n-type source layer 10 is repeated.

The cathode electrode 11, which is the first main electrode,
The n-type source layer 10 and the p-type drain layer 9 are provided so as to be in simultaneous contact with each other. On the p-type emitter layer 3, an anode electrode 12 as a second main electrode is formed.

Specific element dimensions are, for example, as follows. The high resistance to be the n-type base layer 1 is such that the thickness of the n-type wafer is 450 μm, and the n-type buffer layer 2
The p-type base layer 4 is formed at a depth of 5 μm and a depth of 2 μm. p
The groove 5 formed in the mold base layer 4 has a width and an interval of 1 μm,
The depth is 5 μm. The gate oxide film 6 is a thermal oxide film or an ONO film (oxide film / nitride film / oxide film) of 0.1 μm or less. The n-type turn-off channel layer 8 has a channel length of substantially 0.5 μm with the p-type drain layer 9 formed on the surface. The n-type source layer 10 is 1 μm or less, and the p-type emitter layer 3
Diffuses to a depth of about 4 μm.

The operation of the insulated gate semiconductor device thus configured is as follows. When a positive voltage is applied to the gate electrode 7 with respect to the cathode, the turn-on channel around the p-type base layer 4 conducts, electrons are injected from the n-type source layer 10 into the n-type base layer 1, and turned on by the IGBT operation. I do. When a negative voltage is applied to the gate electrode 7, the trench side surface of the n-type turn-off channel layer 8 in the buried gate portion is inverted, and the carriers of the p-type base layer 4 are changed to the p-type drain layer 9 by the operation of the p-channel MOS transistor.
Is sucked into the cathode electrode 11 through the gate electrode and turns off.

In the case of this embodiment, even if the element is in the ON state,
n-type source layer 10-p-type base layer 4-n-type base layer 1-
The parasitic thyristor constituted by the p-type emitter layer 3 is designed not to latch up. When the on-channel is closed, the injection of electrons from the n-type source layer 10 stops.

According to this embodiment, the unit cell size is 4 μm.
m (that is, a buried gate 1 μm-p-type drain layer 1
(μm-buried gate portion 1 μm-n-type source layer 1 μm), the depth and density of the buried gate portion are designed to be sufficiently large, so that a sufficiently small on-resistance can be obtained even though thyristor operation is not performed. can get. The fact that the turn-off channel is closed when the element is on is another reason why a low on-resistance is obtained.
Also, since the parasitic thyristor does not latch up in the ON state and the turn-off channel opens when the OFF state is made to bypass the holes, the maximum current interrupting ability is larger than that of a GTO thyristor or the like, which is turned off after latching up once.

FIG. 6 shows a layout of a buried insulated gate type power semiconductor device according to a second embodiment of the present invention. FIGS. 7, 8 and 9 show AA 'and B- of FIG.
It is B 'and CC' sectional drawing. Parts corresponding to those in the previous embodiment are denoted by the same reference numerals as in the previous embodiment, and detailed description is omitted.

In this embodiment, the grooves 5 which are periodically arranged are formed so as to penetrate deeply through the p-type base layer 4. For example, assuming that the p-type base layer is 3 μm,
Is about 6 μm. The gate electrode 7 is buried in the groove 5 via the gate oxide film 6 as in the previous embodiment.

In this embodiment, the interval between the grooves 5 is wider than that of the previous embodiment, for example, 2 μm. An n-type turn-off channel layer 8 and a p-type drain layer 9 are formed in all the stripe regions between the grooves 5 in contact with the grooves 5, and an n-type source layer 10 is formed at a position away from the grooves 5. Here, the fact that the n-type source layer 10 is formed such that the parasitic thyristor formed between it and the p-type base layer 4, the n-type base layer 1 and the p-type emitter layer 3 does not latch up is as follows. This is the same as the previous embodiment. However, the n-type source layer 10 and the n-type turn-off channel layer 8 are continuous.

In this embodiment, the side surface of the groove 5 of the p-type base layer 4 below the n-type turn-off channel layer 8 is a turn-on channel. That is, the gate electrode 7 buried in the groove 5 serves both for turn-on and for turn-off, and is formed in a state where a p-channel MOSFET for turn-off and an n-channel MOSFET for turn-on are vertically stacked.

The device of this embodiment is turned on by applying a positive voltage to the gate electrode 7 and forming an n-type channel on the side surface of the groove 5 of the p-type base layer 4. Then n
Electrons are injected from the type source layer 10 to the n-type base layer 1 via the n-type turn-off channel layer 8 and the inverted n-type channel. A negative voltage or zero voltage is applied to the gate electrode 7, and the gate electrode 7 is turned off as in the previous embodiment.

According to this embodiment, the same effect as in the previous embodiment can be obtained.

FIG. 10 is a layout of a buried insulated gate power semiconductor device according to a third embodiment of the present invention.
1, 12 and 13 are respectively AA ',
It is BB 'and CC' sectional drawing. This example is
This embodiment is based on the configuration of the second embodiment, in which the ratio of the width of the buried gate electrode portion to the width of the region sandwiched by the buried gate electrode portion is further increased.

The specific element dimensions are as follows. The high resistance to be the n-type base layer 1 is such that the thickness of the n-type wafer is 450 μm, the n-type buffer layer 2 is 15 μm from both sides, and the p-type base layer 4
Is formed at a depth of 2 μm. The grooves 5 formed in the p-type base layer 4 are 5 μm in width, 1 μm in interval, and 5 μm in depth. The gate oxide film 6 is a thermal oxide film having a thickness of 0.1 μm or less or ONO.
A membrane. The n-type turn-off channel layer 8 has a channel length of substantially 0.5 μm with the p-type drain layer 9 formed on the surface. The n-type source layer 10 is formed to a depth of 1 μm or less, and the p-type emitter layer 3 is formed to a depth of about 4 μm.

The device of this embodiment operates similarly to the second embodiment. In this embodiment, the area occupied by the buried gate electrode portion in the device is made sufficiently larger than the area of the region sandwiched by the buried gate electrode portion. As a result, the resistance to holes in the broadly defined emitter region including the buried gate electrode portion increases, and as a result, the electron injection efficiency of the broadly defined emitter region increases. That is, despite the area of the buried gate electrode region being larger than the area of the n-type source layer 10 region, an equivalently large electron injection efficiency can be obtained by the difference between the resistance to the electron current and the resistance to the hole current, Low on-resistance is realized. Since the actual electron injection efficiency of the n-type source layer 10 itself is low, the turn-off capability is I
It is as high as GBT.

FIG. 14 shows a layout of an embodiment obtained by modifying the third embodiment. FIGS. 15, 16 and 17 show AA ', BB' and CC 'of FIG. 14, respectively. It is sectional drawing. In this embodiment, unlike the previous embodiment, the groove 5 stops in the p-type base layer 4.

In this embodiment, both the low on-resistance and the high current interrupting capability can be achieved, as in the previous embodiment, by optimizing the design of the element dimensions of each part.

FIG. 18 shows a sectional structure of a unit cell portion of an embodiment in which a similar buried gate structure is applied to the anode side based on the element of the second embodiment. That is, as described in the second embodiment, the buried gate electrode 7 is formed on the surface of the n-type base layer on the cathode side, and the p-type base layer and the n-type source layer are formed between the buried grooves 4. , The n-type turn-off channel layer and the p-type
A mold drain layer is formed. In contrast to the cathode side, a groove 20 is also formed on the anode side, and a gate electrode 21 is buried therein, and a diffusion layer having a conductivity type opposite to that of the cathode side is provided between the grooves 20. Are formed.

FIG. 18 shows specific device dimensions. 19 (a) and 19 (b) show the impurity concentration distributions of the AA 'portion and the BB' portion on the cathode side, respectively.
It is like.

In the device of this embodiment, at the time of turn-on, a negative voltage is applied to the buried gate electrode 21 on the anode side with respect to the anode electrode. At the time of turn-off, zero or positive voltage is applied to the buried gate electrode 21 on the anode side with respect to the anode electrode. According to the element of this embodiment, the same effect as that of the previous embodiment can be obtained.

Here, the reason why the buried insulated gate type element of the present invention employs a pnpn structure in which a thyristor does not operate even in a large current region and obtains an ON resistance as low as a thyristor will be described in detail with reference to simulation data. I do.

FIG. 20 shows a half of the model used for the calculation.
FIG. 21 is a sectional view of the cell, and FIG. 21 is a view for explaining the principle of the new emitter structure. Since the base of FIG. 20 is an IGBT, there is no n-type emitter in a normal thyristor. Electron injection on the cathode side is performed by a MOS channel, and the n-type drain layer constituting this MOSFET is n-type.
The bypass resistance of the hole current is designed to be sufficiently small so that the parasitic thyristor does not latch up as a mold emitter. However, reducing the bypass resistance of the hole current is equivalent to lowering the injection efficiency of the n-type emitter when the structure of FIG. 20 is compared with a thyristor (or a diode), and increases the on-voltage of the element. Results.

FIG. 21 shows this fact clearly. In the device of the present invention in which the MOS source layer and the buried gate are arranged in fine dimensions, the entire region including the MOS source layer and the buried gate portion is considered as an emitter region.
It is easier to understand the injection efficiency. That is, if the region surrounded by the broken line in the figure is defined as a broadly defined emitter region, the injection efficiency γ of the broadly defined emitter region is determined by the hole current resistance R
It can be expressed as follows by p and the electron current resistance Rn.

Γ = Jn / (Jn + Jp) = (Rp / Rn) / {1+ (Rp / Rn)} (8) However, it is assumed that there is no lateral potential distribution at the end of the emitter region in a broad sense. ing. Here, if Rp / Rn = 3, γ = 0.75, and if Rp / Rn = 4, γ
= 0.8.

Considering that the emitter injection efficiency of a normal thyristor or diode is 0.7 or more, FIG.
Even in an IGBT having a buried insulated gate structure of 0, if the injection efficiency of the emitter in a broad sense is set to 0.8 or more, that is, Rp /
If Rn> 4, it means that an on-voltage equivalent to that of a thyristor can be obtained.

In a current IGBT having a planar gate structure, R
When p / Rn is approximately 3 and Rp / Rn> 4, the latch-up resistance decreases. Although there are several reasons, for example, in a IGBT having a planar gate structure, it may be difficult to make a difference between the electron current resistance and the hole current resistance in the lateral direction due to the structure. Low on-state lateral resistance (10
At a current density of 0 A / cm ² , carriers of about 3 × 10 ¹⁶ / cm ³ are present, and the hole lateral resistance due to the p-type base layer is reduced.) Even if an attempt is made to increase the resistance, the number of MOS on-channels per unit area is reduced, and consequently the electron current resistance is increased, so that the injection efficiency of the emitter in a broad sense is reduced. In the case of EST or the like, the cell size is increased to increase the hole current resistance. However, this method reduces the number of on-channels per unit area, and increases the electron current resistance before the hole current resistance increases sufficiently. As a result, the injection efficiency of the emitter region in a broad sense does not increase, and it is difficult to reduce the on-resistance of the device. Further, if the hole current resistance is simply increased by lowering the short-circuit rate of the hole current, the latch-up resistance decreases.

Therefore, it is necessary to have a structure in which the hole current resistance is four times or more the electron current resistance without increasing the short-circuit resistance of the hole current while increasing the number of MOS channels per unit area. According to the examination results of the present inventors, it has become clear that such conditions can be realized by optimizing the width, depth, interval, and the like of the buried gate structure.

The following is a specific example of schlation data.
You. First, the IGBT structure of FIG.
It has a blocking voltage of 4500 V, and its element parameters
The data is as follows. Impurity concentration 1 × 10¹³/cm^Three, Thickness
Using an n-type high-resistance silicon substrate with a thickness of 450 μm,
15 μm depth, surface concentration 1 × 10¹⁶/cm ^Three
Buffer layer with a depth of 4 μm and a surface concentration of 1 × 10¹⁹
/cm^ThreeIs formed. On the cathode side
Is 2 μm depth and 1 × 10 surface concentration¹⁷/cm^ThreeP-type ba
Layer, depth 0.2μm, surface concentration 1 × 10¹⁹/cm^Threeof
A p-type source layer is formed. Embedded cathode on cathode side
The gate electrode at the gate is a 0.05μm thick silicon oxide film
Alternatively, they are separated by an ONO film or the like.

As shown in FIG. 20, the depth of the buried gate portion is D (portion protruding from the p-type base layer into the n-type base layer), the cell size is 2C, and the emitter width is 2W. The ratio of the width of the buried gate to the width of the emitter is W / (C−W). These dimensions C, W, D
Using the hole lifetime τp as a parameter, the effect of the buried gate electrode structure on the on-state voltage of the device was examined. The results are shown in FIGS.

FIG. 22 shows that the cell size is 2C = 6 μm, the emitter width is 2W = 1 μm, and therefore the width of the buried gate is 2 (C−W) = 5 μm, and the hole lifetime is τp =
In the model of τn = 2.0 μsec, the anode-cathode voltage 2.6 V when the depth D of the buried gate is changed
This is the result of obtaining the element current density at. The gate applied voltage is +15 V (common for all on-voltage calculations).

FIG. 23 shows an emitter width 2W = 1 μm, a buried gate depth D = 5 μm, and a hole lifetime τp =
This is a result of obtaining a device current density at an anode-cathode voltage of 2.6 V when the width CW of the buried gate portion is changed in a model of 30 μsec.

As shown in FIG. 23, when the width of the buried gate portion is about 1 μm to 5 μm, the device current increases sharply as the width of the buried gate portion increases.
The current reaches a plateau at about μm, and at 15 μm, the element current starts to decrease. This phenomenon can be explained as follows. When the width of the buried gate portion is larger than the width of the emitter, the hole current density near the side of the buried groove immediately below the emitter increases, and as a result, the potential rises on the lower side of the buried groove. As a result, when the MOS channel is not saturated, the ratio of the hole current to the electron current increases, and as a result, the injection efficiency of the emitter region in a broad sense increases, and the device current density increases. However, when the width of the buried gate portion is further increased, the MOS channel is saturated, and the number of MOS channels per unit area is reduced. As a result, the MOS channel resistance of the electron current is increased, and the electron current flowing through the element is limited. As a result, the emitter injection efficiency decreases, and the device current decreases.

When the contact between the p-type base layer and the n-type emitter layer is considered as a cathode short-circuit, the same effect as increasing the lateral resistance of the cathode short-circuit when the width of the buried gate portion is increased (in terms of injection efficiency, This is equivalent to reducing the short-circuit rate of the cathode in the emitter region in a broad sense), and as a result, the injection efficiency increases and the on-voltage decreases. However, if the width of the buried gate portion is too large, the number of on-channels per unit area is reduced, so that the electron current resistance is increased, so that the injection efficiency is reduced and the on-voltage is increased.

FIG. 24 shows that the emitter width 2W = 1 μm, the buried gate depth D = 5 μm, and the hole lifetime τp =
This is a result of obtaining a device current density at an anode-cathode voltage of 2.6 V when the width CW of the buried gate portion is changed in a model of 2.0 μsec. The current increases rapidly when the width of the buried gate is about 1 μm to 5 μm,
It reaches a plateau at 10 μm to 15 μm. τp = 30μse
The reason why the width of the buried gate where the current is saturated is wider than in the case of c is that the absolute value of the current flowing through the element is small (1/1).
0).

FIG. 25 shows that the emitter width 2W = 1 μm, the depth D of the buried gate portion is 5 μm, and the hole lifetime τp =
2μsec model, buried gate width 2 (CW)
Is a plot of the current characteristics when the forward voltage between the anode and the cathode is changed, when (a) is 1 μm and (B) is 15 μm.

As shown in the figure, the currents cross at a point where the anode-cathode voltage is 13V. At 13 V or lower, the current value is larger in the buried gate portion having a width of 15 μm, especially at 2 V or lower, the single digit current value is higher. 13
Above V, the magnitude of the current value is reversed.

FIG. 26 shows the device model of FIG. 30 in which the IGBT device model of FIG. 20 is changed to the device structure of the second embodiment. The emitter width is 2 W = 3 μm, and the width of the buried gate portion is 2 (C− W) = 13 μm, buried gate depth D = 12.5 μm, p-type base layer depth 2.5 μm,
The depth of the n-type source layer is 1 μm, and the depth of the p-type drain layer is 0.
This is a current-voltage characteristic when 5 μm and hole lifetime τp = 1.85 μsec. Τp is set so that the device current becomes 100 A / cm ² when the anode-cathode voltage is 2.6 V.

FIG. 27 shows a turn-off waveform of the model shown in FIG. 30 with a resistance load from a current density Iak = 5223 [A / cm ² ] and Vak = 25 V. The gate voltage is changed from +15 V to -15 V at a gate voltage rise rate dVG / dt = -30 [V / .mu.sec].

By the way, 100 A / cm^TwoEmitter at the time
The carrier concentration just below the region is 1 × 10 ¹⁶/cm^ThreeAssume
And emitter width W = 1.5 μm, buried gate depth
The hole current resistance at D = 12.5 μm is: Rp = 0.5 × 12.5 × 10^-Four÷ 1.5 × 10^-Four = 4.2 Ω (9), and assuming that the electron current resistance is Rn = 1 Ω, the injection efficiency is
Is γ = 0.81.

As is clear from the above data, by optimizing the shape and size of the emitter region in a broad sense including the buried insulated gate portion, it is possible to realize an on-resistance as low as that of the thyristor without operating the thyristor. I understand.

In the conventional method, the emitter layer is composed of a single high-concentration impurity diffusion layer, and carriers are injected from this emitter diffusion layer into the high-resistance base layer. The present invention provides a structure for controlling the MOS channel and carrier discharge flow for carrier injection and discharge to the high resistance base instead of the conventional single high concentration impurity diffusion layer (ie, the carrier discharge resistance or diffusion current is locally controlled). The present invention relates to a structure for obtaining high injection efficiency without using a conventional high-concentration impurity diffusion layer.

In the present invention, the p-base short-circuit resistance on the cathode side is equal to the distance 2D + 2 straddling the adjacent buried gate portion.
It tends to be proportional to (C−W) and inversely proportional to the emitter width 2W. Therefore, the following parameter X is introduced.

X = {2D + 2 (C−W)} / 2W = {D + (C−W)} / W (10) This parameter X is determined by how far the hole bypass or drain layer on the cathode side is separated from each other. The amount
The smaller the value is, the smaller the discharge resistance (short circuit resistance) of holes on the cathode side is.

FIG. 28 shows the life time τp of the element and the density of current flowing through the element when D, C, and W are changed with the parameter X as the horizontal axis.
Open circles are τp = 30 μsec, W = 0.5 μm, D = 5 μm
When C is changed by m, black circles are τp = 2 μsec,
When D is changed with W = 0.5 μm and C = 1 μm, double circles are τp = 2 μsec, W = 1.5 μm, C = 8
μm, D = 15 μm, x mark τp = 2 μsec
, W = 0.4 μmec, C = 1 μm, and D is changed.

A device having a forward withstand voltage of 4500 V has a current of 100 A /
In order to secure a current capacity of cm ² , for example, W = 0.5
It is necessary that X ≧ 5, where μm, D = 2 μm, and C = 1 μm. Further, from the data of FIGS. 22 to 28, when W = 0.5 μm, D = 5 μm, and C = 1 μm, X = 11, W = 1.5 μm, and D = 13.5 μm.
When m and C = 8 μm, X〜13. That is, X
> 8 or X> 10, and more preferably, X> 13, the characteristics are remarkably improved.

FIG. 29 shows the carrier concentration distribution in the ON state in this case together with the corresponding cross section.
In the graph on the right side, the solid line is the present invention, and the broken line is the conventional example.
Compared to the case of the IGBT structure, the feature of the present invention is that the n ⁻ -type base layer has a peak of the carrier concentration distribution on the cathode side. The carrier concentration of the n − -type base layer in the on state is 10 ¹¹ to 10 ¹⁸ / cm ³ , more preferably 1 ×
It is designed to be about 10 ¹⁵ to 1 × 10 ¹⁸ / cm ³ .

Further, the smaller the W among the dimensions W, D and C, the larger the X and the actual device characteristics are improved. However, as D increases, not only the hole resistance increases, but also the resistance of carriers injected into the high-resistance base through the on-channel increases. For example, when D = 500 μm, the voltage drop due to the resistance of the injected carriers and the voltage drop due to the resistance of the discharged holes become equal, and the total on-voltage of the device increases.

When C is increased, the current density in the range of W is increased and the emitter injection efficiency in a broad sense is increased. However, when C is increased, the number of on-channels per unit area is reduced, and C is excessively increased. Increasing the value increases the substantial on-channel resistance. As can be seen in FIG.
Since the tendency appears when X> 30 μm or more, C is 500
It is preferable to design to be less than μm.

FIG. 31 shows a layout of a buried insulated gate type power semiconductor device according to another embodiment of the present invention.
33 and FIG. 33 respectively show AA 'and B-
It is B 'sectional drawing.

In this embodiment, the groove 5 is formed so as to surround the p-type base layer 4 in a rectangular shape with a depth reaching the n-type base layer 1, and a plurality of stripe-shaped grooves 5 are formed in the periphery thereof. It is formed continuously with the groove 5. A buried gate electrode 7 is formed in the trench 5 with a gate oxide film 6 interposed therebetween.

An n-type turn-off channel layer 8 is formed in the p-type base layer 4 in the stripe region between the grooves 5. The groove 5 is formed in the n-type turn-off channel layer 8.
The p-type drain layer 9 and the n-type source layer 10 are alternately formed along the longitudinal direction of the above. The p-type drain layer 9 is formed on the surface of the n-type turn-off channel layer 8, and the n-type source layer 10 and the n-type turn-off channel layer 8 are formed.
Are actually the same diffusion layer.

The device of this embodiment has the n-type emitter layer 10
The side surface portion of the groove 5 of the p-type base layer 4 below serves as a turn-on channel. The side surface of the groove 5 of the n-type turn-off channel layer 8 below the p-type drain layer 9 serves as a turn-off channel. Therefore, similarly to the previous embodiment, the gate electrode 7 buried in the groove 5 serves both for turning on and for turning off.

The device of this embodiment has a buried gate electrode 7
Is turned on by applying a positive voltage to the p-type base layer 4 to form an n-type channel on the groove side surface. When a negative voltage is applied to the buried gate electrode 7, a p-type channel is formed on the side surface of the groove of the n-type turn-off channel layer 8, and the p-type channel is turned off in the same manner as in each of the above embodiments.

According to this embodiment, the same effects as those of the previous embodiments can be obtained. Further, in the device of this embodiment, since the buried gate portion bears the breakdown voltage as in the previous embodiment, the impurity concentration of the p-type base layer 4 can be reduced. For example, the peak impurity concentration of the p-type base layer 4 is 1 × 10
¹⁶ / cm ³ approximately and it is possible to, 1 peak impurity concentration of n type turn off channel layer 8 along with this × 10 ¹⁷ /
cm ³ . As a result, the threshold necessary for forming a p-type channel on the trench side surface of the n-type turn-off channel layer 8 can be as small as, for example, about 5 V, and off-control can be performed with a small gate voltage.

FIG. 34 is a layout of a buried insulated gate semiconductor device according to another embodiment of the present invention. FIGS. 35 and 36 are AA 'and B-B of FIG. 34, respectively.
It is B 'sectional drawing.

The device of this embodiment is a device in which the p-type base layer 4 of the embodiment of FIGS. 31 to 33 is omitted, and is a so-called electrostatic induction thyristor. If the impurity concentration of the n-type base layer 1 and the width of the groove 5 (the width of the n-type base layer 1 sandwiched between the grooves 5 shown in the cross section of FIG. 35) are set to appropriate values,
The potential of the entire portion of the n-type base layer 1 sandwiched between the trenches 5 can be controlled by the buried gate electrode 7.

By applying a positive voltage to the gate electrode 7,
When the potential of the n-type base layer 1 sandwiched between is increased, electrons are injected from the n-type source layer 10 and the device is turned on. When a negative voltage is applied to the gate electrode 7, a p-type channel is formed on the groove side surface of the n-type turn-off channel layer 8, and carriers of the n-type base layer 1 are discharged to the cathode electrode 13 via the p-type drain layer 9. And the device turns off.

FIG. 37 is a layout of a buried insulated gate semiconductor device of still another embodiment, and FIGS. 38 and 39 are sectional views taken along lines AA 'and BB' of FIG. 37, respectively.

This embodiment is a slightly modified element of the embodiment shown in FIGS. The plurality of stripe-shaped grooves 5 are independent of each other, and their periphery is surrounded by a deep p-type base layer 4 ′. The distribution, depth, and the like of the n-type turn-off channel layer 8, the p-type drain layer 9, and the n-type source layer 10 formed in the p-type base layer 4 between the buried gate portions are the same as in the previous embodiment.

FIG. 40 is a layout of a buried insulated gate type semiconductor device of still another embodiment, and FIGS. 41 and 42 are sectional views taken along lines AA 'and BB' of FIG. 40, respectively.

This embodiment is a modification of the element of the embodiment shown in FIGS. 34 to 35 in the same manner as the embodiment shown in FIGS. 37 to 39.

According to these embodiments, the same effects as those of the preceding embodiments can be obtained.

FIGS. 42 to 44 show an embodiment in which the embodiment of FIGS. 31 to 33 is modified to make the p-type base layer 4 deeper than the buried gate portion.

FIGS. 46 to 48 further show FIGS.
In this embodiment, the n-type turn-off channel layer 8 is omitted.

FIGS. 49 to 51 further show FIGS. 46 to 48.
This is an embodiment in which the p-type base layer is omitted in the structure of FIG.

According to these embodiments, as described above, the shape and dimensions of each part, especially the width and the interval of the buried gate part, are optimally designed, and the injection efficiency of the emitter region in a broad sense is sufficiently increased to reduce the low on-resistance. Can be realized.

FIGS. 52 to 55 show an embodiment in which the same structure as the embodiment of FIGS. 11 to 14 is applied to an IGBT. Groove 5
An n-type source layer 10 is formed in contact with the side surface of the substrate, and the cathode electrode 1 simultaneously contacts the n-type source layer 10 and the p-type base layer 4 exposed therebetween.

FIGS. 56 to 58 are similar to FIGS. 37 to 39.
Is an embodiment in which the structure of FIG. 1 is applied to an IGBT.

FIG. 59 is a modification of FIG. If the width 2 (CW) of the buried gate portion is too large with respect to the emitter width 2W, the reliability of the groove processing is reduced. In such a case, the yield can be improved by forming a plurality of grooves, each of which is originally one. No p-type base or n-type source is formed in the n-type base layer exposed in the width 2 (C-W).

FIGS. 60 to 62 show a horizontal type IGB according to the present invention.
Layout of the unit cell section of the embodiment applied to T and its A
-A ', BB' sectional drawing. First silicon substrate 2
0 and the second silicon substrate 22 of the wafer obtained by directly bonding the second silicon substrate 22 with the oxide film 21 interposed therebetween.
The side is defined as an element region, which is processed to a predetermined thickness to form an n-type base layer 1. The bottom oxide film 21 is formed on the n-type base layer 1.
The groove 5 is formed to a depth reaching the gate electrode 71, and the gate electrode 71 is buried therein. P-type base layer 4 between buried gates
And an n-type source layer 10 on which a surface gate electrode 72 continuous with the buried gate electrode 7 via a gate oxide film 6 is formed. A p-type emitter layer 3 is formed at a position away from the buried gate portion by a predetermined process. Between the p-type emitter layer 3 and the buried gate portion, p ⁻
A mold RESURF layer 23 is formed.

FIGS. 63 to 65 are a layout of a horizontal IGBT embodiment in which a buried gate is provided on the anode side by modifying the above embodiment, and sectional views taken along lines AA 'and BB'. Using the second substrate 22 on the element formation side as the p ⁻ type base layer 24, a groove 5 is formed in the same manner as in the above embodiment, and a buried gate electrode 71 is formed therein. An n-type base layer 1 'is formed between the grooves, and a p-type drain layer 3' is formed therein.
On these, a surface gate electrode 72 is formed similarly to the above embodiment. Then, at a predetermined distance from the drain region, n
A mold source layer 10 'is formed.

FIGS. 66 to 68 are layouts of an embodiment in which the same elements as those in the embodiment of FIGS. 1 to 5 are realized as horizontal elements, and sectional views taken along lines AA 'and BB'. Parts corresponding to those in the previous embodiment are denoted by the same reference numerals as in the previous embodiment, and detailed description is omitted.

FIG. 69 to FIG. 71 show the layout of the element of the embodiment in which the conductivity types of the respective parts of the above embodiment are reversed, and their layouts.
It is A 'and BB' sectional drawing.

In the embodiment shown in FIG. 31, the width dN + of the n-type source layer and the width dP + of the p-type drain layer are shown to be substantially equal, but if dN +> dP +, the ON characteristics are improved.
If dN + <dP +, the off characteristic is improved. Therefore, desired characteristics can be obtained by optimally designing the relationship between these widths. This is shown in FIGS. 34, 37, 40,
The same applies to the elements of FIGS. 43, 46, 49, and 56.

In order to increase the maximum controllable current, dN + is desirably formed to be about the carrier diffusion length or less, and when it is desired to reduce the ON voltage, the dN + should be increased as long as the minimum controllable maximum current can be guaranteed. It is desirable to do.

As described above, according to the present invention, a deep buried insulated gate structure, a structure in which narrow hole current paths formed between the buried insulated gates are formed at wide intervals, and injection efficiency is suppressed to be small. The combination of the cathode-emitter structure makes it possible to realize characteristics similar to those of a GTO thyristor without causing latch-up due to a voltage-driven element.

Some further examples of the lateral element will be described.

FIGS. 72 to 74 show embodiments in which the elements of the embodiments of FIGS. 66 to 68 are modified. In this embodiment, p
The mold drain layer 9 is provided so as to extend not only to the region sandwiched by the buried gates 72 but also to the side walls on the cathode side of the buried gates 72.

FIGS. 75 to 77 show an embodiment in which the structure of FIGS. 72 to 74 is modified, in which the n-type emitter layer 8 is formed by diffusion to a depth that does not reach the bottom of the element.

The embodiment shown in FIGS. 78 to 80 uses the second substrate 22.
As shown in FIG. 76, a p ⁻ type substrate having ap ⁺ type layer 25 at the bottom is used, and an n ⁻ type base layer 1 is formed on the surface thereof.
77 to FIG. 77.

FIGS. 81 to 83 show modifications of the embodiment of FIGS. 78 to 80. The width of the surface gate electrode 72 is selected to be larger than the width of the buried gate electrode 71, and is sandwiched between the buried gate electrodes 71. In this embodiment, a turn-on channel region and a turn-off channel region controlled by a surface gate electrode 72 are formed on a cathode side which is separated from a region by a predetermined distance.

FIG. 84 et seq. Show 1 / th of another embodiment of the vertical element.
2 shows a two-cell cross-sectional structure.

FIG. 84 shows an embodiment in which a buried gate as shown in FIG. 59 is not provided in a region (represented by width L) between regions (represented by width W) where a long electron injection channel is formed. It is.

FIG. 85 shows an embodiment in which a buried insulated gate structure is formed in a region where an electron injection channel is not formed in the device of FIG. 84. The gate electrode 7 is formed continuously along the plurality of grooves 5 without completely filling the grooves 5. Then, a CVD oxide film 31 is formed on the element surface on which the gate electrode 7 is formed so as to fill the groove 5 and flatten the surface.

FIG. 86 shows an embodiment in which the p-type layer 32 is formed between the grooves where the electron injection channel is not formed in the device of FIG. 84. By providing the p-type layer 32, the withstand voltage between the cathode electrode 11 and the n-type base layer 1 in a region where a channel is not formed can be made sufficient.

FIG. 87 shows that, in the device structure of FIG. 86, the gate electrode 7 is formed by a polycrystalline silicon film so as not to completely fill the groove 5, and Al and Ti are overlapped on the region where no channel is formed. , Mo, etc. low resistance metal gate 3
3 is formed. The low resistance metal gate 33 is covered with an organic insulating film 34 such as polyimide.

FIG. 88 further shows that a groove 5 is formed in the entire region where a channel is not formed, a polysilicon gate electrode 7 is formed along the groove 5, and a low-resistance metal gate 33 is formed at the bottom of the groove 5. This is an embodiment in which burying is formed.

In each of the embodiments described above, in order to increase the hole current bypass resistance in the channel region sandwiched between the buried gates, a low carrier lifetime layer by ion implantation or the like, or a layer higher than the n-type base layer is used. It is also effective to provide an n-type layer having a concentration.

For example, FIG. 89 shows the device of FIG.
In this embodiment, an n-type layer 35 having a higher concentration than the n-type base layer 1 is provided under the p-type base layer 4. FIG. 90 shows an embodiment in which the low carrier lifetime layer 36 is formed under the p-type base layer 4.

FIG. 91 shows an embodiment in which the structure shown in FIG. 87 is modified, in which a floating n ⁺ -type emitter layer 36 is formed on a p-type layer 32. The electron injection portion has no p-type drain and has an IGBT structure.
When a positive voltage is applied, a channel is formed between the n-type source layer 10 and the n ⁺ -type emitter layer 36 along the side wall of the groove 5, and the n ⁺ -type emitter layer 36 is connected to the cathode electrode 11.

FIG. 92 similarly shows the device of FIG.
This is an embodiment in which a modification similar to that of FIG. 91 is performed.

FIG. 93 shows an embodiment in which the p-type layer 32 formed simultaneously with the p-type base layer 4 is provided between the grooves outside the electron injection channel region in the device of the embodiment shown in FIG. FIG. 94 shows an embodiment in which the p-type layer 32 of FIG. 93 is formed deeper than the p-type base layer 4 and a floating n-type emitter layer 36 is formed thereon.

FIG. 95 shows the p-type layer 32 and n ⁺
The emitter layer 36 is formed deeper and the buried gate 2
7 is an embodiment in which the turn-on channel controlled by 7 is shortened.

The embodiments described above are based on the concept of "increase the hole bypass resistance due to the uniquely arranged trench gate electrode structure, thereby improving the electron injection efficiency and reducing the on-resistance of the semiconductor device". ing. An important fact to note here is that, according to the present invention, achieving a reduced on-resistance does not have to be inherently "increasing the hole bypass resistance". This is because enhancement of carrier injection is based on the principle of "increase the ratio of hole diffusion current to electron current" which includes the concept of "increase in hole bypass resistance".

FIG. 96 shows an IE according to a further embodiment of the present invention.
GT (injection-Enhanced Gate Bipolar Transistor)
97, FIG. 98, FIG. 99, and FIG. 100 are AA ', BB', and C-
It is C 'and DD' sectional drawing. In this transistor structure, the same parts as those in the embodiment of FIGS. 6 to 9 are denoted by the same reference numerals.

The n-type source layer is composed of the n ⁺ -type semiconductor layer 10. These source regions 10 extend at right angles to the trench gate electrode 7 on the surface of the p-type drain layer 4 as shown in FIG. These source areas 1
FIG. 97 shows a cross section associated with the zero trench gate electrode 7. The n ⁺ -type layer 10 located between each pair of two adjacent trench gate electrodes 7 is electrically insulated from the first main electrode layer 11 by the surface insulating layer 202.

As shown in FIG. 98, between adjacent trench gate electrodes 7, n ⁺ -type layers 10 are alternately arranged with p ⁺ -type layers 9 functioning as p-type drains. The sectional view of each trench gate electrode 7 shown in FIG. 99 is the same as that of FIG. A sectional view of the p ⁺ type drain region 9 in a direction perpendicular to the trench gate electrode 7 is shown in FIG.
00 is shown. Here, with the same manner as in the case of FIG. 97, the p-type drain layer 9 located between each pair of two adjacent trench gate electrodes 7 is made of the above-mentioned surface insulating layer.
By 202, it is electrically insulated from the first main electrode layer 11. The specific dimensions of this transistor structure are shown in FIGS.
It may be similar to that in the device of FIG.

The IEGT operation in this embodiment is as follows. When a positive voltage is applied to the gate electrode 7 with respect to the cathode electrode 11, the turn-on channel located in the peripheral portion of the p-type base layer 4 conducts. Electrons are injected from the n-type source layer 10 into the n-type base layer 1, causing conduction modulation in the n-type base layer 1. As a result, IEGT becomes IG
It is turned on by the BT operation.

When a negative voltage is applied to the gate electrode 7 with respect to the cathode electrode 11, injection of electrons from the turn-on channel region is stopped. An inversion layer is formed on a side surface portion (groove side surface portion) of the trench gate portion facing the trench 5. The carriers in the p-type base layer 4 are discharged to the cathode electrode 11 via the p-type drain layer 9 by the well-known p-channel MOS transistor operation. The semiconductor device turns off. In this embodiment, even when the device is turned on, the n-type source layer 10,
p-type base layer 4, n-type base layer 1, and p-type emitter layer 3
The parasitic thyristor constituted by the above is particularly arranged as described above so as not to latch up. When the on-channel is closed, the injection of electrons from the n-type source layer 10 stops immediately.

According to the IEBT, a pair of trench gates 7, a P ⁺ -type drain layer 9 located between the pair of trench gate electrodes and insulated from the electrode 11,
The other P ⁺ -type drain layer 9 that contacts and electrodes 11 and Tonariai across the trench gate electrode 7 corresponding to the isolated P ⁺ -type drain layer, "unit cell" is defined.

Between the electrode 11 and the p ⁺ drain layer which is in contact, the electrode 1 is surrounded by a relatively narrow trench.
By forming the region insulated from 1, it is possible to avoid the technical difficulty of forming a wide trench groove (2C-2W) and achieve the same effect as a wide trench groove. .

By appropriately arranging the depth, interval, and number of the plurality of trench gate electrodes 7 (specific examples have already been given), it is possible to obtain a sufficiently low on-resistance while preventing the device from operating as a thyristor. IEG
"Thinned out" of the T main electrode 11 to the p-type drain layer 9
The contact contributes to the reduction of the hole bypass current, that is, the reduced on-resistance. In this embodiment, the parasitic thyristor does not latch up in the ON state,
At the time of turn-off, a turn-off channel is opened to form a hole flow bypass. Thus, the maximum breaking current capability is enhanced compared to current GTO thyristors configured to turn off once latched up.

Here, it will be added that a large electron injection efficiency can be obtained by arranging the ratio of the hole diffusion current to the total current.

When the impurity concentration of the emitter region in a broad sense (an example is shown by a portion surrounded by a broken line in FIG. 21) is relatively low, for example, a portion in the emitter region in a broad sense in which n to p conduction modulation occurs. Hole diffusion current I
p, especially the vertical direction (diffusion current flowing parallel to the anode-cathode direction of the device) and the electron current In (= I-Ip, I:
By providing a structure that increases the ratio of the total current) in the broadly defined emitter region, the injection efficiency of the broadly defined emitter region can be increased, and the on-resistance of the device can be reduced.

The hole current Jp flowing through the emitter region in a broad sense
(A / cm ² ) and n-base broadly defined emitter concentration n (cm ⁻³ ) (n in FIG. 29).

Assuming that the hole current flowing through the emitter region in a broad sense is only the diffusion current of carriers in the vertical direction (AK direction), Jp = 2 · μp · k · T · W · n / (C · D) (12). Here, μp is the hole mobility,
k is the Boltzmann coefficient and T is the temperature.

The hole injection efficiency γp of the emitter region in a broad sense
Γp = Jp / J = Jp / (Jn + Jp) = 2 μp · k · T · W · n / (C · D · J) (13) If Y = W / (C · D), γp = 2 ( μp · k · T · n / J) · Y γp is μp = 500, k · T = 4.14 × 10
^-21 , J = 100 A / cm ² , γp = 2 × (500 × 4.14 × 10 ⁻²¹ / 100) × 1 × 10 ¹⁶ × Y = 4.14 × 10 ⁻⁴ .Y (16) γp will be about γp = Jp / (Jn + Jp) = μp / (μn + μp) = 0.3 (17) when the injection efficiency is sufficiently low. In other words, the high injection efficiency of the emitter region in a broad sense means that γp <0.3 (18), and Y that satisfies this condition is 4.14 × 10 ⁻⁴ Y <0.3 Y < 0.3 / 4.14 × 10 ⁻⁴ Y <7.25 × 10 ² (cm ⁻¹ ) (19) When n = 7 × 10 ¹⁵ when the on-voltage is relatively high, Y <1. 0 × 10 ³ (cm ⁻¹ ) (20)

That is, by designing the parameter Y in the above range, the injection efficiency of the emitter region in a broad sense can be increased even if the injection efficiency of the impurity diffusion layer in contact with the cathode electrode is low. That is, the accumulation of carriers in the ON state of the high resistance base layer can be increased, and the ON resistance of the element can be reduced.

When the device is arranged as described above, the cathode diffusion layer with low injection efficiency guarantees high current control capability and high-speed switching, and the effect of the present invention is to increase the injection efficiency of the emitter region in a broad sense. A low element on-resistance can be realized at the same time.

When the emitter region in a broad sense has a trench structure as shown in FIG. 20, the value of Y is, as described above, D and D in FIG.
It is determined by C and W.

When a high-impurity region (where Jp flows by a resistor) and a low-impurity region coexist in the broadly defined emitter region, the injection efficiency of the broadly defined emitter region depends on the parameters X and Y described above. Both need to be considered.

The sectional structure of FIG. 100 is modified as shown in FIG. Here, the n ⁺ -type source layer 10 extends so as to be joined to both side end surfaces of each trench 5 in which the trench gate electrode 7 is buried.

IEGT shown in FIGS. 102 to 106
Is basically a combination of the device of FIGS. 96 to 100 and the device of FIGS. 6 to 9. In other words, this IEGT is characteristically different from FIGS. 96 to 100 in that each p ⁺ -type drain layer 9 has a “ladder-shaped planar shape”. In particular, the n-type source layer 1 described with reference to FIG.
0 is formed on the surface of the p ⁺ type base layer 4. n
In the type source layer 10, the p-type drain layer 9 is arranged so as to be joined to both upper side ends of each trench 5. The p-type drain layer 9 is shallower than the n-type source layer 10. The portion of the n-type source layer 10 sandwiched by the bottom of the p-type drain layer 9 and the p-type drain layer 4
It functions as the n-type turn-off channel layer 10 described in FIG. N between two adjacent trench gate electrodes 7
The central portion of the type source layer 10 corresponds to the n-type source layer 10 in FIG. Looking at the substrate surface, between two adjacent trench gate electrodes 7, the p-type drain layer 9
The n-type source layer 10 is surrounded in a planar manner, thereby exhibiting a ladder-shaped planar shape.

As shown in FIG. 104, the n-type saw
Layer 10 is p⁺Deeper than the drain layer 9 and therefore
According to the sectional structure shown in FIG.
Is p ⁺Mold drain layer 9. As shown in FIG.
The cross-sectional structure of each trench gate electrode 7 shown in FIG.
Is the same as As shown in FIG.⁺Type
The drain layer 9 is "decimated" by the surface insulating layer 202.
Contact with the electrode 11.

According to the IEGT of this embodiment, the side surface of the trench junction of the p-type base layer 4 located immediately below the n-type turn-off channel layer functions as a turn-on channel.
Therefore, it can be said that both of the plurality of trench gate electrodes 7 also serve as the turn-on drive electrode and the turn-off drive electrode. That is, a p-channel MOSFET for turn-off
And a turn-on n-channel MOSFET are vertically stacked inside the device. Trench gate electrode 7
When a positive polarity voltage is applied to the p-type base layer 4, an n-type channel is formed on each trench junction side surface of the p-type base layer 4, thereby turning on the device. At this time, each n-type source layer 10
Then, electrons are injected into the n-type base layer 1 through the n-type turn-off channel and the n-type channel appearing due to the formation of the inversion layer. The turn-off operation is performed in the same manner as in the embodiment 200 shown in FIGS. 96 to 100 by applying a negative voltage to the trench gate electrode 7. IEGT of this embodiment
In this case, the same effects as those of the embodiment shown in FIGS. 96 to 100 can be obtained.

Finally, two modifications of the horizontal IGBT disclosed in FIGS. 60 to 83 are presented in FIGS. 107 to 202. The horizontal IGBT of FIGS.
112 is different from the previous example of the IGBT in that the difference in cell structure parameters “C” and “W” is set along the thickness direction of the substrate.

As shown in FIGS. 108 and 109, a trench 222 having a uniform rectangular cross section is formed on the surface of the n ⁻ -type upper substrate on the intermediate insulating layer 21. The conductive layer 224 is buried insulatively in the trench 222. The thickness of the conductive layer 224 is greater than the depth of the trench 222, so that the upper half of the conductive layer 224 protrudes from the surface of the upper substrate. The conductive layer 224 functions as a trench gate electrode. The thickness of the upper substrate is C. The thickness of the trench portion of the information substrate, that is, the thickness of the active layer sandwiched between the bottom of the trench 222 and the intermediate insulating layer 21 is W, as shown in FIG. A channel region for electron injection or turn-off is formed at a portion in contact with the bottom of trench gate electrode 224.

In such a lateral IGBT, the turn-off control electrode has a MOS control thyristor (MCT) structure. As in the embodiment of FIGS.
If the p-type drain layer width Dp and the n-type source layer width Dn satisfy Dp <Dn, the ON characteristics are enhanced, and if Dp> Dn, the turn-off characteristics are enhanced. By arranging the width relationship of these layers optimally, desired IGBT on / off characteristics can be easily realized. In order to increase the maximum controllable current of the IGBT, it is desirable to form the width Dn to be about the carrier diffusion length or less. In order to reduce the ON voltage, it is desirable to increase the width Dn within a range in which the minimum required level of the maximum controllable current can be guaranteed.

According to the IGBT, a structure in which narrow (W) hole current paths sandwiched between the trench gate electrode structure 224 and the intermediate insulating film 21 are formed at widened intervals, and the injection efficiency is low. By the combination of the suppressed cathode-emitter structure, it is possible to realize a voltage-driven power switch device in which the on-voltage is reduced like a current GTO thyristor while achieving suppressed latch-up.

The horizontal IGBT shown in FIGS.
It is similar to that of FIGS. 107 to 109 except that a mold hole bypass resistance layer 226 is added. The hole bypass resistance layer 226 is formed at the bottom of the trench gate electrode 224, and is in contact with the n ⁺ -type layer 10, as shown in FIG. If the impurity concentration of the hole bypass resistance layer 226 is high (for example, about 10 ¹⁶ to 10 ²¹ cm ⁻³ ), the ON characteristics of the IGBT are improved. If the impurity concentration of the hole bypass resistance layer 226 is (for example, 10 ¹³ to 10 ¹⁸
If it is low (to about cm ⁻³ ), a moderate improvement in the ON characteristics can be expected while maintaining the OFF characteristics of the IGBT high.

In addition, the present invention can be variously modified and implemented without departing from the spirit thereof.

[0135]

As described above, according to the present invention, a large current interruption capability is realized by a fine cell structure having a buried insulated gate, and the parasitic thyristor is latched up by designing the width and interval of the buried insulated gate portion. It is possible to obtain an insulated gate type power semiconductor device that realizes an on-resistance equivalent to that of a thyristor without causing the above problem.

[Brief description of the drawings]

FIG. 1 is a layout diagram of an insulated gate semiconductor device according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA ′ of FIG. 1;

FIG. 3 is a sectional view taken along the line BB ′ of FIG. 1;

FIG. 4 is a sectional view taken along the line CC ′ of FIG. 1;

FIG. 5 is a sectional view taken along the line DD ′ of FIG. 1;

FIG. 6 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 7 is a sectional view taken along the line AA ′ of FIG. 6;

FIG. 8 is a sectional view taken along the line BB ′ of FIG. 6;

FIG. 9 is a sectional view taken along the line CC ′ of FIG. 6;

FIG. 10 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 11 is a sectional view taken along the line AA ′ of FIG. 10;

FIG. 12 is a sectional view taken along line BB ′ of FIG. 10;

FIG. 13 is a sectional view taken along the line CC ′ in FIG. 10;

FIG. 14 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 15 is a sectional view taken along the line AA ′ of FIG. 14;

FIG. 16 is a sectional view taken along line BB ′ of FIG. 14;

FIG. 17 is a sectional view taken along the line CC ′ of FIG. 14;

FIG. 18 is a sectional view showing a unit cell structure of an insulated gate semiconductor device of another embodiment.

FIG. 19 is a diagram showing one of AA ′ and BB ′ impurity concentration distributions of the device of FIG. 18;

FIG. 20 is a sectional view of a buried insulated gate IBGT of a simulation model.

FIG. 21 is a diagram for explaining the operation principle of the model in FIG. 20;

FIG. 22 is a view showing the relationship between the depth of a buried gate portion and the current density in the same model.

FIG. 23 is a view showing the relationship between the width of an embedded gate portion and the current density in the same model.

FIG. 24 is a view showing the relationship between the width of the buried gate portion and the current density under another condition of the model.

FIG. 25 is a view showing current-voltage characteristics of the model.

FIG. 26 is a diagram showing current-voltage characteristics under other conditions of the same model.

FIG. 27 is a view showing current and voltage change characteristics of the same model.

FIG. 28 is a diagram showing a relationship between parameters X (D, W, C) and carrier lifetime τp and current density of an element.

FIG. 29 is a diagram showing a carrier concentration distribution in an ON state of an element.

FIG. 30 is a view showing a structure in which the same model is applied to the device of the embodiment in FIG. 6;

FIG. 31 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 32 is a sectional view taken along the line AA ′ of FIG. 31;

FIG. 33 is a sectional view taken along the line BB ′ of FIG. 31;

FIG. 34 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 35 is a sectional view taken along line AA ′ of FIG. 34;

FIG. 36 is a sectional view taken along line BB ′ of FIG. 34;

FIG. 37 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 38 is a sectional view taken along the line AA ′ of FIG. 37;

FIG. 39 is a sectional view taken along the line BB ′ of FIG. 37;

FIG. 40 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 41 is a sectional view taken along the line AA ′ of FIG. 40;

FIG. 42 is a sectional view taken along line BB ′ of FIG. 40;

FIG. 43 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 44 is a sectional view taken along line AA ′ of FIG. 43;

FIG. 45 is a sectional view taken along line BB ′ of FIG. 43;

FIG. 46 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 47 is a sectional view taken along the line AA ′ of FIG. 46;

FIG. 48 is a sectional view taken along line BB ′ of FIG. 46;

FIG. 49 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 50 is a sectional view taken along the line AA ′ of FIG. 49;

FIG. 51 is a sectional view taken along the line BB ′ of FIG. 49;

FIG. 52 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 53 is a sectional view taken along the line AA ′ of FIG. 52;

FIG. 54 is a sectional view taken along line BB ′ of FIG. 52;

FIG. 55 is a sectional view taken along the line CC ′ of FIG. 52;

FIG. 56 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 57 is a sectional view taken along the line AA ′ of FIG. 56;

FIG. 58 is a sectional view taken along the line BB ′ of FIG. 56;

FIG. 59 is a view showing a modification of FIG. 53;

FIG. 60 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 61 is a sectional view taken along the line AA ′ of FIG. 60;

FIG. 62 is a sectional view taken along the line BB ′ of FIG. 60;

FIG. 63 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 64 is a sectional view taken along line AA ′ of FIG. 63;

FIG. 65 is a sectional view taken along the line BB ′ of FIG. 63;

FIG. 66 is a layout diagram of an insulated gate semiconductor device of another embodiment.

67 is a sectional view taken along the line AA ′ of FIG. 66.

FIG. 68 is a sectional view taken along line BB ′ of FIG. 66.

FIG. 69 is a layout diagram of an insulated gate semiconductor device of another embodiment.

70 is a sectional view taken along the line AA ′ of FIG. 69.

FIG. 71 is a sectional view taken along the line BB ′ of FIG. 69;

FIG. 72 is a layout diagram of an insulated gate semiconductor device of another embodiment.

73 is a sectional view taken along the line AA ′ of FIG. 72.

74 is a sectional view taken along the line BB ′ of FIG. 72.

FIG. 75 is a layout diagram of an insulated gate semiconductor device of another embodiment.

76 is a sectional view taken along the line AA ′ of FIG. 75.

77 is a sectional view taken along the line BB ′ of FIG. 75.

FIG. 78 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 79 is a sectional view taken along the line AA ′ of FIG. 78;

FIG. 80 is a sectional view taken along the line BB ′ of FIG. 78;

FIG. 81 is a layout diagram of an insulated gate semiconductor device of another embodiment.

FIG. 82 is a sectional view taken along the line AA ′ of FIG. 81;

83 is a sectional view taken along the line BB ′ of FIG. 81.

FIG. 84 is a view showing a half-cell sectional structure of another embodiment.

FIG. 85 is a diagram showing a half-cell sectional structure of another embodiment.

FIG. 86 is a view showing a half-cell sectional structure of another embodiment.

FIG. 87 is a view showing a half-cell sectional structure of another embodiment.

FIG. 88 is a view showing a half-cell sectional structure of another embodiment.

FIG. 89 is a diagram showing a half-cell sectional structure of another embodiment.

FIG. 90 is a view showing a half-cell sectional structure of another embodiment.

FIG. 91 is a view showing a half-cell sectional structure of another embodiment.

FIG. 92 is a diagram showing a half-cell cross-sectional structure of another embodiment.

FIG. 93 is a view showing a half-cell sectional structure of another embodiment.

FIG. 94 is a view showing a half-cell sectional structure of another embodiment.

FIG. 95 is a view showing a half-cell sectional structure of another embodiment.

FIG. 96 is a layout diagram of an IEGT according to another embodiment.

FIG. 97 is a sectional view taken along the line AA ′ of FIG. 96;

FIG. 98 is a sectional view taken along the line BB ′ of FIG. 96;

FIG. 99 is a sectional view taken along the line CC ′ of FIG. 96;

FIG. 100 is a sectional view taken along the line DD ′ of FIG. 96;

FIG. 101 is a sectional view showing a modification of FIG. 100;

FIG. 102 is a layout diagram of an IEGT according to another embodiment.

FIG. 103 is a sectional view taken along the line AA ′ of FIG. 102;

FIG. 104 is a sectional view taken along the line BB ′ of FIG. 102;

FIG. 105 is a sectional view taken along the line CC ′ of FIG. 102;

106 is a sectional view taken along the line DD ′ of FIG. 102.

FIG. 107 is a view showing a modification of the horizontal IGBT of FIGS. 60 to 83;

FIG. 108 is a view showing a modification of the horizontal IGBT of FIGS. 60 to 83;

FIG. 109 is a view showing a modification of the horizontal IGBT of FIGS. 60 to 83;

FIG. 110 is a view showing a modification of the horizontal IGBT of FIGS. 60 to 83;

FIG. 111 is a view showing a modification of the horizontal IGBT of FIGS. 60 to 83;

FIG. 112 is a view showing a modification of the horizontal IGBT of FIGS. 60 to 83;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... n-type base layer, 2 ... n-type buffer layer, 3 ... p-type emitter layer, 4 ... p-type base layer, 5 ... groove | channel, 6 ... gate oxide film, 7 ... gate electrode, 8 ... n-type turn-off channel layer Reference numeral 9 denotes a p-type drain layer, 10 denotes an n-type source layer, 11 denotes a cathode electrode, and 12 denotes an anode electrode.

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] June 28, 2000 (2006.2.
8)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) H01L 29/786 H01L 29/78 622 626Z

Claims (1)

[Claims] A second conductive type emitter layer; a first conductive type base layer formed in contact with the second conductive type emitter layer; and a plurality of grooves formed in the first conductive type base layer. A gate electrode buried through a gate insulating film, a first conductivity type turn-off channel layer formed in contact with a side surface of the groove on a surface portion of the base layer of the first conductivity type; A second conductivity type drain layer formed on the surface of the turn-off channel layer in contact with the first conductivity type; A source layer, a first main electrode formed in simultaneous contact with the second conductivity type drain layer and the first conductivity type source layer, and a second main electrode formed in the second conductivity type emitter layer. , Characterized by having Power semiconductor device.