JP2000349431A - Method and device for controlling temperature of circuit board to be heated - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a temperature data of a circuit board surface with high reliability by controlling the temperature of a circuit board using the basic temperature data for a plurality of specified discrete points along the temperature measurement line on the surface of circuit board. SOLUTION: A lattice processing part decides the coordinate position of an actual measurement point where three or more contact temperature measuring means 21 are provided, and sets an applied interpolation function using the actual measurement temperature data as a basic data. From the interpolation function, a predicted temperature data is obtained for one or more arbitrary predicted points on the temperature measurement line which is positioned between adjoining two or more actual measurement points is acquired. An image display processing part 35 displays the temperature distribution for the surface of a circuit board 20 which is to be heated and prepared from the actual- measurement temperature data and predicted temperature data. Based on the provided actual measurement temperature data and predicted temperature data, the temperature of the circuit board 20 is controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for controlling the temperature of a circuit board to be heated by a heating means.

[0002]

2. Description of the Related Art At present, in a process of mounting electronic components such as various active elements or passive elements on a printed circuit board, the electronic components are arranged on the surface of the printed circuit board, and this is welded by soldering or the like. Electrical and mechanical connections are required depending on the material. In particular,
An electronic component placed on the surface of a printed circuit board via a welding material such as a ball grid array (BGA) made of a solder alloy is introduced into a heating area by a transport mechanism such as a conveyor in a so-called reflow furnace. By passing through, the welding material is melted, and thereby, all target electronic components are collectively connected.

However, in recent years, in the process of mounting electronic components, it is required to arrange and connect the electronic components at a high density with the miniaturization of the electronic circuit on the printed circuit board. A comparatively large electronic component such as 40 mm, for example, 0.6 m long
In many cases, it is required to mount the electronic component together with a small electronic component such as 0.3 mm in width and 0.3 mm in width.

[0004] However, in a case where electronic components having greatly different sizes are collectively connected, since the heat capacities of the welding materials for the respective electronic components are greatly different, all the welding materials are heated to the appropriate temperature. In such a case, it is difficult to melt the welding material insufficiently, resulting in poor wetting, or a problem that the electronic component is overheated and damaged.

[0005] Further, in each part of the printed circuit board, the actual temperature differs depending on the arrangement density of the electronic components, so that it may not be possible to heat all the parts to a target appropriate temperature range. is there.

On the other hand, generally used solder alloys contain lead as a component, but since lead causes environmental pollution, in recent years, as a welding material,
For example, tin-silver (Sn-Ag) solder alloy, tin-silver-copper (Sn-Ag-Cu) solder alloy, tin-zinc (Sn-Z)
Lead-free solder alloys that do not contain lead, such as n) solder alloys, have been developed. However, such a lead-free solder alloy is, for example, 10 to 20 ° C. in comparison with a lead-based solder alloy.
It has a high melting point and poor wettability with a printed circuit board. For this reason, it is necessary to heat the welding material for a long time to ensure that the welding material is melted.In such a case, perform sufficient temperature control so as not to exceed the heat resistance limit of electronic components. is necessary.

Conventionally, in order to control the temperature of a printed circuit board heated by a reflow furnace, the temperature of several local points on the heated printed circuit board is measured. Since this method does not cover the surface area of the printed circuit board, it is not possible to perform sufficient temperature management, and for example, there is a high possibility that an overheating state occurs at a non-measurement point.

As a method of performing temperature management for a surface area, for example, a method using a thermo camera is known. However, since a thermo camera uses infrared rays, a printed circuit in a reflow furnace is used. It is impossible to control the temperature of the surface area of the substrate. As described above, conventionally, there is a problem that the temperature of the printed circuit board to be heated cannot be sufficiently controlled.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to obtain a highly reliable temperature data for a surface area of a surface of a circuit board to be heated. Accordingly, it is an object of the present invention to provide a temperature management method and a temperature management device for a circuit board to be heated, which can be obtained with high performance and can sufficiently control the temperature of the circuit board to be heated.

[0010]

According to the present invention, there is provided a method for controlling the temperature of a circuit board to be heated, the method comprising the steps of: selecting a linear temperature measurement line on a surface of the circuit board to be heated by heating means; A basal temperature data acquiring step of acquiring basal temperature data for at least three specified locations arranged in a line, and an interpolating function equation for setting an interpolating function equation to be applied in the next temperature estimating step, satisfying the relationship in the basal temperature data A setting step, and a temperature prediction step of obtaining predicted temperature data for any one or more predicted points on a temperature measurement line located between two adjacent ones of the designated points by the interpolation function formula. The temperature information obtaining operation including the temperature information is performed, and the base temperature data and the predicted temperature data obtained by the temperature information obtaining operation are used to perform the heating. And performing temperature control of the road substrate.

In the above method for controlling the temperature of the circuit board to be heated, the basic temperature data used in the step of setting the interpolation function is obtained by the contact type temperature measuring means in contact with the surface of the circuit board to be heated. It can be measured temperature data.

Further, the above temperature information obtaining operation is performed, and further, using the predicted temperature data obtained in the temperature prediction step in the temperature information obtaining operation as basic data, an interpolation function formula setting step, a temperature prediction step, It can be performed.

In the method for controlling the temperature of a circuit board to be heated according to the present invention, a plurality of different temperature measurement lines are selected, and the above-mentioned temperature information acquisition operation is repeated for each temperature measurement line. It is preferable that the temperature of the circuit board to be heated is controlled based on the basic temperature data and the predicted temperature data obtained by the method.

In the above-described method for controlling the temperature of the circuit board to be heated, the temperature of the circuit board to be heated is controlled so that all measured temperature data and predicted temperature data are within the target heating temperature range set for the circuit board to be heated. It may include an operation of confirming that there is. Further, the temperature management of the circuit board to be heated is corrected when at least one of the measured temperature data and the predicted temperature data deviates from the target heating temperature range set for the circuit board to be heated. Thus, the operation of controlling the heating means can be included.

The temperature control device of the present invention is carried along with a circuit board to be heated conveyed through the heating area of the heating means, and is selected on a linear temperature measurement line on the surface of the circuit board to be heated. A sensor unit comprising: an actually measured temperature recording circuit for recording measured temperature data from contact temperature measuring means in contact with at least three specified locations spaced apart from each other and arranged in a heat-insulating outer casing. And a data processing unit that processes the actual measurement data recorded in the actual measurement temperature recording circuit of the sensor unit. The data processing unit uses the actual measurement temperature data as basic data, and is applied based on the basic data. An applied interpolation function formula setting function for setting an interpolation function expression, and two adjacent ones of the actually measured points are used by the applied interpolation function expression. For any one or more predicted position on the temperature measurement line located between, and having a temperature prediction function of acquiring predicted temperature data.

The above-mentioned temperature control device for a circuit board to be heated includes:
It can be suitably used for temperature control of the surface of a printed circuit board heated by a reflow furnace for soldering.

[0017]

According to the above-described method for controlling the temperature of the circuit board to be heated, the temperature information acquisition operation is performed, so that two adjacent specified points on the selected temperature measurement line on the surface of the printed circuit board to be heated are obtained. , The predicted temperature data can be obtained with high reliability for an arbitrary predicted location.

By selecting a plurality of temperature measurement lines on the surface of the printed circuit board to be heated and performing a temperature information acquisition operation, temperature data for the surface area of the printed circuit board can be obtained. By utilizing this, sufficient temperature management can be performed for the surface area on the surface of the printed circuit board.

Specifically, it is confirmed that all the temperature data on the surface of the printed circuit board is within the target heating temperature range set for the printed circuit board at any point on the printed circuit board. This makes it possible to reliably heat the actual printed circuit board in the target heating temperature range. If it is confirmed that there is a part that deviates from the target heating temperature range, the heating unit may be controlled so that the temperature of the part deviating from the target heating temperature range falls within the set target heating temperature range. it can.

According to the temperature management apparatus of the present invention, since the above-described method is executed, it is possible to obtain the temperature data for the surface area on the surface of the printed circuit board with high reliability. As a result, sufficient temperature control can be performed for the surface area of the printed circuit board, and it is particularly useful for processing the printed circuit board in a reflow furnace.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A temperature control apparatus according to the present invention is a simulated printed circuit board (hereinafter, referred to as a "heated circuit") for acquiring temperature data similar to an actual printed circuit board heated by a reflow furnace for soldering. It is suitable for controlling the temperature of the surface of the substrate. For this reason, the case of the heat treatment in the reflow furnace will be specifically described below.

The reflow furnace has a transfer mechanism composed of, for example, a conveyor for moving the circuit board to be heated so as to pass through the heating area. The transfer speed of the circuit board to be heated by this transfer mechanism is usually It is controlled to a constant transport speed. The heating method of the reflow furnace is a heating method in which a coil heater made of, for example, a nichrome wire is driven, hot air is supplied into the reflow furnace, and the welding material is melted using convection heat. The reflow furnace is controlled based on a preset target temperature profile. The target temperature profile is, for example, the melting temperature of the welding material for joining the circuit board to be heated and the electronic component,
It is set in consideration of the heat-resistant temperature of the electronic component, the transfer speed of the transfer mechanism of the reflow furnace, and the like.

The temperature management device according to the present invention basically comprises a sensor unit and a data processing unit. FIG. 1 is an explanatory perspective view showing a schematic configuration of an example of a sensor unit constituting a temperature management device in use, and FIG. 2 is a block diagram showing an electrical configuration of the sensor unit together with a circuit board to be heated. . Sensor unit 1
Numeral 0 is provided with an actually measured temperature recording circuit 10B in an outer casing 10A having heat insulation properties, and a connector section 22 is formed on the front surface (the right side surface in the example of FIG. 1) of the outer casing 10A. As will be described later, for example, three or more contact-type temperature measuring means 21 including a thermocouple disposed on the circuit board 20 to be heated are detachably connected to the connector section 22 of the sensor unit 10. . In FIG. 1, only two contact-type temperature measuring means are shown.
The sensor unit 10 is introduced into the heating area at a constant speed by the transport mechanism of the reflow furnace, accompanied by the circuit board 20 to be heated, in a state in which the circuit board 20 is ahead, and passes through the reflow furnace. .

The measured temperature recording circuit 1 of the sensor unit 10
0B denotes an A / D converter 11 for converting a signal from each contact-type temperature measuring means into a digital signal as shown in FIG.
And a clock generation unit 13 for generating a reference clock signal at regular intervals in time, and based on the reference clock signal,
A memory section 12 for recording a temperature data signal from the A / D converter 11, a temperature data output section 14 for outputting the temperature data signal recorded in the memory section 12, a power supply section 15 using a secondary battery; It consists of.

FIG. 3 is a block diagram showing a functional configuration of an example of the data processing unit. The data processing unit 30 includes a temperature data input unit 31 to which measured temperature data from the temperature data output unit 14 of the sensor unit 10 is input, and coordinates of an actual measurement location where three or more contact temperature measurement units 21 are arranged. Grid processing unit 32 for determining position
And an interpolation function formula setting unit 33 for setting an interpolation function formula to be applied using the actually measured temperature data as basic data, and a temperature measurement located between two adjacent ones of the actually measured locations by the interpolation function formula. A predicted temperature data acquiring unit 34 for acquiring predicted temperature data for any one or more predicted points on the line, and a temperature distribution on the surface of the circuit board 20 to be heated created based on the measured temperature data and the predicted temperature data. And an image display processing unit 35.

According to the above temperature management device, as described below, the temperature measurement step is performed in the sensor unit 10 and the data processing unit 30
An interpolation function formula setting step and a temperature prediction step are performed to perform a temperature information acquisition operation, and the circuit board 2 to be heated is obtained based on the actually measured temperature data and the predicted temperature data thus obtained.
Zero temperature management is performed.

More specifically, in the temperature measurement step, first, as shown in FIG. 4, for example, four temperature measurement lines L11 to L11 extending in one direction (left and right directions in the figure) on the surface of the circuit board 20 to be heated. L14 are selected so as to be at equal intervals, and four temperature measurement lines L21 to L24 each extending in a perpendicular direction (vertical direction in the figure).
Are selected so as to be at equal intervals, and the contact-type temperature measuring means 21 is arranged at each intersection of the vertical and horizontal temperature measurement lines (the four intersections on the temperature measurement line L11 are indicated by R1 to R4). . Here, the separation distance d between the temperature measurement lines is, for example, 50 mm. Then, the sensor unit 10 to which each contact-type temperature measuring means 21 is connected is sufficiently preheated in a state where the sensor unit 10 is attached to the circuit board 20 to be heated in a state where the circuit board 20 is ahead of the sensor unit 10. Introduced within.

When the circuit board 20 to be heated is introduced into the reflow furnace, the temperature data signal detected and measured by each contact-type temperature measuring means 21 on the circuit board 20 to be heated is transmitted to the sensor unit 10. Measured temperature recording circuit 10
B is input to the A / D converter 11. This temperature data signal is converted into a digital signal by the A / D converter 11 and then measured at each measurement time at each actual measurement location based on a reference clock signal generated at equal time intervals by the clock generator 13. It is recorded in the memory unit 12 as the actually measured temperature data associated with the time.

After completion of the temperature measuring step, the sensor unit 10 from which the contact-type temperature measuring means 21 has been removed,
As shown in FIG. 5, the sensor unit 10 is inserted into the sensor unit insertion portion 30A of the data processing unit 30, and
The processing of the actually measured temperature data recorded in is performed. 40 is a monitor.

The measured temperature data recorded in the memory unit 12 of the sensor unit 10 is input from the temperature data output unit 14 to the temperature data input unit 31 of the data processing unit 30.

The actually measured temperature data at each measurement time input to the temperature data input unit 31 is
A grid processing step is performed to determine the coordinate position of each actual measurement location. FIG. 6 shows a distribution state of the actually measured temperature data T1 to T4 at the actually measured points R1 to R4 on the temperature measurement line L11 whose coordinate position is specified.

Next, the interpolation function equation setting section 33 sets an interpolation function equation that satisfies the relationship between the measured temperature data T1 to T4 whose coordinate positions are specified. This interpolation function formula is applied in a temperature prediction step described later.

The interpolation function formula can be set using, for example, Lagrange interpolation method, Bezier interpolation method or B-spline interpolation method. Among these, even when the number of known basic data is small, It is preferable to use the Lagrange interpolation method because the degree of the interpolation function can be reduced. The case of the Lagrange interpolation method will be described. For example, in the xy orthogonal coordinate system as shown in FIG.
A function formula representing a curve passing through 1) points is represented by the following formula 1, and a function formula representing a curve passing through (n + 1) points in the y direction is represented by the following formula 2. That is, the functional expressions represented by Expressions 1 and 2 are interpolation functional expressions.

[0034]

(Equation 1)

[0035]

(Equation 2)

Specifically, in the case of the example shown in FIG.
As shown in FIG. 8, the temperature curve P passing through the temperature values T1 to T4 at the actual measurement points R1 to R4 on the temperature measurement line L11.
Is set by the above equation (1).

After the interpolation function is set, a temperature prediction step is performed. That is, assuming that two actual measurement locations adjacent to each other on the temperature measurement line L11, for example, five locations a1 to a5 selected at equal intervals between R1 and R2 are the prediction locations, the prediction locations a1 to a5 Primary predicted temperature data Ta1 to Ta5 in each of them is obtained by an interpolation function formula for the temperature measurement line L11. The same operation is performed for the predicted points between the actually measured points R2 and R3 and between the points R3 and R4, and the primary prediction is performed at the predicted points (shown by crosses) on the temperature measurement line L11. Temperature data is obtained.

Then, by performing the gridding process, the interpolation function formula setting process, and the temperature prediction process on the actually measured temperature data, the temperature measurement line L11
The temperature information acquisition operation for is completed. Then, the same temperature information acquisition operation is performed by another temperature measurement line L1 in the x direction.
2 to L14, and temperature measurement lines L21 to L in the y direction
24 are sequentially performed, and as shown in FIG. 9, primary predicted temperature data at predicted locations (shown by crosses) on all temperature measurement lines at the first measurement time is obtained. Is done. In the interpolation function formula setting step for the temperature measurement lines L21 to L24 in the y direction described above, the interpolation function formula is set by the above equation (2).

As described above, the primary predicted temperature data on all the temperature measurement lines is acquired, so that even if the number of actual measurement points is small, the required surface area on the circuit board 20 to be heated is targeted. Temperature data for a large number of locations distributed over the entire area can be acquired with high reliability, and thus sufficient temperature management can be performed on the circuit board 20 to be heated.

Further, a secondary temperature measurement line M1 extending in the y direction through the above-mentioned predicted location a1 is selected, and the secondary temperature measurement line M1 and the temperature measurement lines L12 to L1 are selected.
4, using the primary predicted temperature data at the respective intersections b1, c1, and d1 as basic data in the same manner as described above.
By performing the interpolation function formula setting step and the temperature data prediction step, secondary predicted temperature data is also obtained for a secondary predicted point located between points a1 and b1 on the secondary temperature measurement line M1. By the same operation, the secondary predicted temperature data can be obtained for all the secondary predicted points on the secondary temperature measurement line (shown by a broken line) in FIG. .

As described above, by obtaining the secondary predicted temperature data, the temperature of the circuit board 20 to be heated can be controlled with higher reliability.

Further, by repeatedly performing the same operation, it is possible to obtain higher-order predicted temperature data of the third order or higher, whereby the temperature of the circuit board 20 to be heated with higher reliability can be obtained. Can manage.

The actually measured temperature data and the predicted temperature data (secondary or higher) on the surface of the circuit board 20 to be heated during the heat treatment in the reflow furnace, obtained by performing the above-described temperature information acquisition operation. All the temperature data (including the higher-order data) are visually displayed on the monitor 40 by the image display processing unit 35 as the temperature distribution of the surface area of the surface of the circuit board 20 to be heated. This temperature distribution is displayed, for example, in a three-dimensional manner such as a bar graph or a temperature mountain wave by displaying the level of the temperature in terms of color shading or color change, or a target temperature profile in the reflow furnace, or in the reflow furnace. Can be displayed so as to overlap with the schematic configuration diagram of the reflow furnace showing the scheduled position.

Then, the temperature control on the heated circuit board 20 is performed based on all the actually measured temperature data and the predicted temperature data on the surface of the heated circuit board 20 obtained as described above. , The values of all the measured temperature data and the predicted temperature data are
An operation for confirming that the temperature is within the target heating temperature range set for 0 is performed.

For example, as shown in FIG. 10, a temperature curve P represented by an interpolation function equation for the temperature measurement line L11 is obtained by, for example, setting an upper limit set temperature Tmax set in consideration of the heat-resistant temperature of the electronic component and, for example, a welding material. When it is confirmed that the temperature is within the target heating temperature range determined by the lower limit set temperature Tmin set in consideration of the melting temperature of the circuit board 20 to be heated,
Means that it is sufficiently certain that the heat treatment is performed within the target heating temperature range in all the areas.

On the other hand, for example, in FIG. 10, if it is confirmed that the upper limit set temperature of the target heating temperature range is Tc and that there is a portion where the temperature curve P deviates from the target heating temperature range, In order to mean that an overheated portion occurs in the circuit board 20, for example, the temperature of the hot air supplied into the reflow furnace, the amount of the hot air, the direction in which the hot air blows out, or the transport speed of the circuit board 20 to be heated, The target temperature profile in the reflow furnace is corrected by controlling such a deviation to disappear. Then, again, the circuit board 20 to be heated
Is performed to confirm that the values of all the measured temperature data and the predicted temperature data are within the target heating temperature range set for the circuit board 20 to be heated.

In the above, the temperature state of the reflow furnace is prevented from being disturbed by the sensor unit 10 by introducing the circuit board 20 to be heated into the reflow furnace in advance. The temperature data of the circuit board 20 to be heated can be accurately measured under the same temperature condition as when the mounting operation of the board is performed.

The predicted temperature data at the non-measured portion of the circuit board 20 to be heated is predicted by an interpolation function obtained based on the actually measured temperature data at the actually measured portion, and the predicted temperature data has extremely high reliability. Therefore, even if the number of measured points is small,
Sufficiently reliable temperature data can be obtained,
Therefore, the temperature of the circuit board 20 to be heated can be sufficiently controlled.

In practice, it is preferable that the distance d between adjacent temperature measurement lines be 10 to 70 mm or less.

The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments.
For example, as shown in FIG. 11, for example, four contact points on the surface of the circuit board 20 are arranged on the surface of the circuit board 20 to be heated. Lines L11 to L14 are selected, and for each temperature measurement line, 4
The contact-type temperature measuring means 13 may be arranged in a staggered lattice at two locations. The distance d between adjacent contact-type temperature measuring means does not need to be equal.

Further, the temperature management device transmits the measured temperature data to the data processing unit even when the sensor unit is moving in the reflow furnace by providing the sensor unit with the wireless terminal. Alternatively, the configuration may be such that the measured temperature data is processed.

As described above, according to the present invention, information substantially equivalent to the temperature history to be experienced by an actual printed circuit board heated in a reflow furnace can be obtained.
Therefore, by using this information, the heating state of the reflow furnace can be controlled corresponding to the printed circuit board to be processed, and as a result, the temperature of the printed circuit board is once simulated. As a result, heat treatment of many identical printed circuit boards can be performed with extremely high reliability. Therefore, a heating process in which heating temperature conditions are severely restricted, for example, a process of collectively connecting electronic component groups including both large electronic components and small electronic components, or a non-lead-based solder alloy The temperature management method and temperature management apparatus for a circuit board to be heated according to the present invention are extremely useful for a step of performing a connection process using a welding material.

In the method for controlling the temperature of a circuit board to be heated according to the present invention, the printed circuit board to be heated may be one of those actually used, but a simulated printed circuit board for acquiring temperature data is used. It may be a circuit board. Further, the present invention can be effectively applied not only when the heat treatment of the printed circuit board is performed by the reflow furnace but also when the heat treatment is performed by another heating means.

[0054]

According to the temperature management method for a circuit board to be heated according to the present invention, by performing the temperature information acquisition operation, an arbitrary prediction on the temperature measurement line selected on the surface of the printed circuit board to be heated is performed. Predicted temperature data can be obtained with high reliability at each location, and by using this, sufficient temperature management can be performed for a surface area on the surface of the printed circuit board.

Specifically, it is confirmed that all the temperature data on the surface of the printed circuit board is within the target heating temperature range set for the printed circuit board at any point on the printed circuit board. This makes it possible to reliably heat the actual printed circuit board in the target heating temperature range. When it is confirmed that there is a part that deviates from the target heating temperature range, the actual heating of the printed circuit board is reliably performed by controlling the heating means so as to eliminate the deviation state. Heat treatment can be performed in the region.

According to the temperature management apparatus of the present invention, since the above-described method is executed, it is possible to obtain temperature data for a surface area on the surface of the printed circuit board with high reliability. Sufficient temperature control can be performed for the surface area of the substrate.

[Brief description of the drawings]

FIG. 1 is an explanatory perspective view showing a schematic configuration of an example of a sensor unit constituting a temperature management device of the present invention in a used state.

FIG. 2 is a block diagram showing an electrical configuration of the sensor unit together with a circuit board to be heated.

FIG. 3 is a block diagram showing a functional configuration of an example of a data processing unit constituting the temperature management device of the present invention.

FIG. 4 is an explanatory plan view showing a specific arrangement example of a contact-type temperature measuring unit provided on a circuit board to be heated;

FIG. 5 is an explanatory perspective view showing a method of inputting measured temperature data recorded in a sensor unit to a data processing unit.

FIG. 6 is an explanatory diagram showing a distribution state of measured temperature data at a measured position on a temperature measurement line whose coordinate position is specified;

FIG. 7 is an explanatory diagram showing points on an orthogonal coordinate system for setting an interpolation function equation in an interpolation function equation setting step.

FIG. 8 is an explanatory diagram showing an interpolation curve set in an interpolation function formula setting step.

FIG. 9 is a plan view for explaining a predicted position on a temperature measurement line in a temperature prediction step.

FIG. 10 is a temperature curve diagram on a specific temperature measurement line of a circuit board to be heated, for explaining a temperature management method.

FIG. 11 is a plan view showing another example of a specific arrangement example of the contact-type temperature measuring means arranged on the circuit board to be heated.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Sensor unit 10A Outer casing 10B Measured temperature recording circuit 11 A / D converter 12 Memory unit 13 Clock generation unit 14 Temperature data output unit 15 Power supply unit 20 Heated circuit board 21 Contact temperature measurement means 22 Connector unit 30 Data processing unit 30A Sensor unit insertion unit 31 Measured temperature data input unit 32 Grid processing unit 33 Applicable interpolation function formula setting unit 34 Predicted temperature data acquisition unit 35 Image display processing unit 40 Monitor L11 to L14 Temperature measurement line L21 to L24 Temperature measurement line d Separation Distance R1 to R4 Measured location a1 to a5 Predicted location P Temperature curve Tmax Upper limit set temperature Tmin Lower limit set temperature Tc Upper limit set temperature

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/00 H05K 3/00 V

Claims (8)

[Claims] 1. A basal temperature for acquiring basal temperature data of at least three specified locations spaced apart from each other and selected in a linear temperature measurement line on a surface of a circuit board to be heated heated by a heating means. A data acquisition step, an interpolation function equation setting step that satisfies the relationship in the base temperature data, and sets an interpolation function equation to be applied in the next temperature prediction step. Any one on the temperature measurement line located between two adjacent
Temperature information obtaining operation including a temperature prediction step of obtaining predicted temperature data for one or more predicted locations, and the temperature of the circuit board to be heated is calculated based on the base temperature data and the predicted temperature data obtained by the temperature information obtaining operation. A method for managing the temperature of a circuit board to be heated, characterized by performing management. 2. The method according to claim 1, wherein the basic temperature data used in the interpolation function formula setting step is actually measured temperature data obtained by a contact type temperature measuring unit that is in contact with the surface of the circuit board to be heated. Item 2. The temperature control method for a circuit board to be heated according to Item 1. 3. Performing the temperature information acquisition operation according to claim 1, further using predicted temperature data obtained in a temperature prediction step in the temperature information acquisition operation as basic data,
A temperature management method for a circuit board to be heated, comprising performing an interpolation function formula setting step and a temperature prediction step. 4. A plurality of temperature measurement lines different from each other are selected, the temperature information obtaining operation according to claim 1 is performed for each temperature measurement line, and the basic temperature data and the predicted temperature obtained by the temperature information obtaining operation are obtained. A temperature management method for a circuit board to be heated, wherein the temperature of the circuit board to be heated is controlled by data. 5. The temperature control of the circuit board to be heated includes an operation of confirming that all measured temperature data and predicted temperature data are within a target heating temperature range set for the circuit board to be heated. The temperature management method for a circuit board to be heated according to any one of claims 1 to 4. 6. The temperature control of the circuit board to be heated is performed when at least one of the measured temperature data and the predicted temperature data deviates from a target heating temperature range set for the circuit board to be heated. The method for controlling the temperature of a circuit board to be heated according to any one of claims 1 to 4, further comprising an operation of controlling the heating means so that the temperature is corrected. 7. A heating circuit board which is conveyed along with a circuit board to be conveyed so as to pass through a heating area of the heating means, and which is separated from each other and selected on a linear temperature measurement line on a surface of the circuit board to be heated. A measured temperature recording circuit for recording measured temperature data from a contact-type temperature measuring means in contact with at least three designated locations arranged in a line; a sensor unit provided in a heat-insulating outer casing; A data processing unit for processing the measured data recorded in the measured temperature recording circuit, the data processing unit using the measured temperature data as basic data, and setting an interpolation function to be applied based on the basic data; A temperature measurement line located between two adjacent ones of the actually measured points by the interpolation function formula setting function and the interpolation function formula. Any of the one or more prediction point, temperature control device of the heated circuit board and having a temperature prediction function of acquiring predicted temperature data. 8. The apparatus for controlling the temperature of a circuit board to be heated according to claim 7, wherein the apparatus is used for controlling the temperature of the surface of a printed circuit board heated by a reflow furnace for soldering.