JP2000348607A - Thick-film pattern forming method, thick-film pattern forming jig, and thick-film pattern - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thick-film pattern having an accurate configuration by pressing a jig using a filament having a cross section shape formed with curves or straight lines onto a thick-film pattern forming material previously applied to a predetermined substrate. SOLUTION: A thick-film pattern forming material 50 is previously applied to a predetermined substrate 10, and a filament 60 is pressed onto it. As the thick-film pattern forming material 50, for forming a plasma display rib, a material which is formed by mixing inorganic oxide such as titanium oxide and lead oxide with a resin and a solvent, has flexibility before baking, and is hardened after molding is used. This is applied by a means such as screen- printing, roll coat, or die coat. As the filament 60, a metal wire of iron or copper, or nylon or polyester is used. The filament 60 is pressed onto the thick- film pattern forming material 50, and then the filament 60 is removed to provide a thick-film pattern having a space corresponding to the cross section of the filament 60.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a thick film pattern, a jig for forming a thick film pattern, and a thick film pattern formed thereby.

[0002]

2. Description of the Related Art A so-called thick film pattern is widely used in electronic circuits and the like.
For the production, a thick film forming technique such as screen printing is frequently used.

For example, as shown in FIG. 1, a rib, which is an important thick film pattern for forming a discharge space of a PDP, includes an electrode 20 and a dielectric 30 formed on a predetermined substrate 10.
Is formed on the rib.

The ribs generally used have a structure in which inorganic oxides are connected by lead glass to be integrated. In a specific manufacturing method, first, fine powder of a rib-forming material, that is, an inorganic oxide and lead glass is kneaded with an appropriate resin and a solvent to form a paste.
In general, the paste is processed into a rib shape by a predetermined forming method, and then fired to melt the lead glass powder, thereby joining and integrating the inorganic oxides. The resin and the solvent are removed by evaporation or combustion by the heat applied up to this step.

[0005] There are several methods for forming the rib, but at present, the sand blast method is mainly used (for known examples, see Kameya Monthly L
CDIntelligence August 1997 Issue 5
See page 7). This method is a method in which a rib is formed by applying a rib-forming material to a predetermined thickness on a substrate, masking a necessary portion, and blowing sand onto the portion to remove unnecessary rib-forming material. .

[0006] Recently, as an alternative method, as in the invention described in Japanese Patent Application Laid-Open No. 10-326571, a metal mold, that is, a metal mold is pressed against a thick film pattern forming material previously applied on a substrate. Accordingly, a method of forming a pattern (hereinafter, referred to as a press method) has been disclosed.

[0007]

The problems of these methods will be described. When producing ribs by the sandblasting method, in order to produce ribs by so-called shaving,
Most of the rib-forming material is wasted, resulting in high rib material costs.

[0008] On the other hand, the pressing method is an excellent method that hardly generates waste, but a die as a molding die is very expensive. Also, if the mold is damaged during use,
It becomes a defect in the formed pattern. And in this case, repair of the mold defect is practically impossible.

Therefore, an inexpensive and high-precision mold is required as a mold.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and it is an object of the present invention to reduce the amount of waste associated with the formation of a thick film pattern, and at the same time, it is inexpensive and obtains the thickness. It is an object of the present invention to provide a method for forming a thick film pattern having an accurate film pattern, a jig used for forming the thick film pattern, and a thick film pattern having a specific shape obtained by the method.

[0011]

Means for Solving the Problems A first invention of the present invention is:
By pressing a jig using a filament having a cross-sectional shape constituted by a curve or a straight line or both or a multifilament obtained by twisting a plurality of filaments against a thick film pattern forming material previously applied to a predetermined substrate, This is a method of forming a thick film pattern, characterized by obtaining a thick film pattern having a space corresponding to a cross-sectional shape.

[0012] A second invention of the present invention is to provide a multi-filament in which a plurality of filaments having a cross-sectional shape constituted by a curved line or a straight line or both are densely arranged on the same plane. This is a characteristic jig for forming a thick film pattern.

A third invention of the present invention is characterized in that a filament having a cross-sectional shape constituted by a curved line or a straight line or both or a multifilament obtained by twisting a plurality of filaments is densely wound around a cylinder. This is a jig for forming a film pattern.

According to a fourth aspect of the present invention, there is provided a thick film pattern formed by the thick film pattern forming method according to claim 1, wherein the height of the thick film pattern is H and the pitch is D. , And the relationship between the two is D ≧ 2H.

According to a fifth aspect of the present invention, there is provided a thick film pattern formed by the method for forming a thick film pattern according to the first aspect, wherein fine irregularities are formed on the surface by a multifilament obtained by twisting a plurality of filaments. It is a thick film pattern characterized by being formed.

[0016]

FIG. 2 is a block diagram showing an embodiment of the present invention.
This will be described in detail with reference to FIG. However, the cross-sectional shape of the filament according to claims 1 to 3 is not necessarily limited to a circular shape, and may be a straight line such as a convex shape, but for convenience, the drawing has a circular cross-sectional shape. Filament was used.

First, as shown in FIG. 2, a thick film pattern forming material 50 is applied on a predetermined substrate 10 in advance, and a filament 60 is pressed thereon.

The material for the thick film pattern forming material 50 is not particularly limited. For example, when forming the rib of the PDP, an inorganic oxide such as titanium oxide or lead oxide is kneaded with a resin and a solvent. It is possible to use a material that has flexibility before firing and hardens after molding.
This may be applied by a known means such as screen printing, roll coating, and die coating.

As the filament 60, a metal wire such as iron or copper, or a synthetic resin fiber such as nylon or polyester can be used. When forming a rib of a PDP, its diameter is suitably 150 μm to 400 μm. It is.

After the filament 60 is pressed against the thick film pattern forming material 50, the thick film pattern having a space corresponding to the cross section of the filament can be obtained by removing the filament 60.

By arranging a plurality of filaments, a pattern having the same shape can be regularly arranged as shown in FIG. Thus, for example, P
DP ribs can be formed.

By the way, as shown in FIG. 3, in order to regularly arrange patterns of the same shape, a jig in which a plurality of filaments are densely arranged on the same plane as shown in FIG. 4 may be manufactured.

In this case, as a means for pressing the jig against the thick film pattern forming material, known means such as a flat press by a hydrostatic pressure and a roll press can be used.

As another means for regularly arranging patterns of the same shape, as shown in FIG. 5, a jig in which a filament is wound around a predetermined cylinder is used, and a thick film pattern is formed while rotating the jig. Can be pressed against the material.

When the filament cross section is circular, the thick film pattern obtained by these means has a structure shown in FIG.
As shown in the figure, the pitch, that is, the distance D between the tops of the patterns is equal to the diameter D of the filament used, and the height H from the bottom to the top has a relationship of D ≧ 2H.

Here, D ≧ 2H instead of D = 2H means that, for example, when a firing process is performed like a rib of a PDP, the resin component is removed, so that the height may be reduced accordingly. Because there is.

When the filament is composed of a single fiber (monofilament), a smooth surface can be obtained, but a filament (multi-filament) having a substantially circular cross-sectional shape obtained by twisting a plurality of filaments, which are often found in synthetic resin fibers, is obtained. When a filament is used, a surface having minute irregularities unique to the filament as shown in FIG. 7 is obtained.

Therefore, by selecting a filament to be used, a thick film pattern having a surface roughness suitable for the intended use can be obtained. For example, by providing minute irregularities on the surface of the rib of the above-described PDP, effects such as increasing the adhesion of the phosphor adhered to the rib surface can be obtained.

As described above, according to the present invention, a method for forming a thick film pattern which can reduce wastes involved in forming a thick film pattern, is inexpensive, and the obtained thick film pattern has an accurate shape, A jig and a thick film pattern having a specific shape obtained by the jig can be formed.

[0030]

EXAMPLES <Example 1> (1) Preparation of Thick Film Pattern Forming Material 70 parts of copper-manganese-cobalt-based composite oxide (black inorganic pigment # 3247 manufactured by Asahi Sun Sangyo), lead borosilicate glass (manufactured by Nippon Electric Glass) 20 parts of GA-9) were added with 5 parts of ethyl cellulose (manufactured by Kanto Kagaku) and 15 parts of butyl carbitol (manufactured by Kanto Kagaku) and kneaded well with a roll mill to form a paste.

(2) Coating of Thick Film Pattern Forming Material on Substrate Soda lime glass (made by Asahi Glass) as a substrate is 300 m
Using a screen plate on which an m-square solid pattern was formed, printing and drying were repeated by screen printing to form a layer, and the layer was coated to a thickness of 200 μm.

(3) Preparation of a jig for forming a thick film pattern As a filament, nylon tex (No. 5, diameter 36)
8 μm), cut this into 400 mm in length,
A 1000-layer thick film pattern forming jig was densely arranged on a double-sided tape (manufactured by Nitto Denko).

(4) Formation of Thick Film Pattern The jig for forming a thick film pattern is placed on a substrate on which a material for forming a thick film pattern is applied, and the jig for forming a thick film pattern is formed using a hand roller (manufactured by Kakuta Brush). By pressing against the substrate, a pitch 36
Asperities having a thickness of 8 μm and a height of 180 μm were formed.

Further, this was heated at 580 ° C.
By firing for 0 minutes, pitch 368 μm, height 1
A thick film pattern of 50 μm lead borosilicate glass and a copper-manganese-cobalt composite oxide was obtained.

<Example 2> A thick film pattern forming material was prepared in the same manner as in Example 1, and was applied to a substrate.

(1) Preparation of a jig for forming a thick film pattern A double-sided tape (manufactured by Nitto Denko) is applied to an aluminum pipe having an outer diameter of 100 mm, a thickness of 10 mm, and a width of 400 mm, and a nylon tex (5 (Diameter 368 μm) was tightly wound to form a jig for forming a thick film pattern.

(2) Formation of a Thick Film Pattern By rolling the jig for forming a thick film pattern on a substrate coated with a thick film pattern forming material,
Pitch 368 μm, height 18 on thick film pattern forming material
The unevenness of 0 μm was formed.

Further, it is heated at 580 ° C.
By firing for 0 minutes, pitch 368 μm, height 1
A thick film pattern of 50 μm lead borosilicate glass and a copper-manganese-cobalt composite oxide was obtained.

<Example 3> A multifilament obtained by twisting 21 pieces of nylon fibers having a diameter of 75 μm and having a height of about 150 μm and irregularities of about 30 μm on the surface was determined using a jig used in place of the filament in Example 2. Was obtained.

[0040]

According to the method of forming a thick film pattern according to the first aspect of the present invention, the amount of waste can be reduced and the process can be simplified as compared with the conventional method.

According to the jig for forming a thick film pattern according to the second and third aspects, it is possible to form a thick film pattern of an accurate shape having a fixed relation between pitch and height, and to select a filament to be used. An inexpensive jig for forming a thick film pattern having a surface roughness according to the application can be created.

According to the thick film patterns of the fourth and fifth aspects, the fine irregularities on the surface of the rib of the PDP have the effect of increasing the adhesion of the phosphor adhered to the rib surface. can get.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a general plasma display substrate.

FIG. 2 is a sectional view of a method of forming a thick film pattern according to the present invention.

FIG. 3 is a cross-sectional view of a method of forming a thick film pattern according to the present invention.

FIG. 4 is a schematic view of a jig for forming a thick film pattern according to the present invention.

FIG. 5 is a schematic view of a jig for forming a thick film pattern according to the present invention.

FIG. 6 is a sectional view of a thick film pattern and a filament according to the present invention.

FIG. 7 is a sectional view of a thick film pattern and a filament according to the present invention.

[Explanation of symbols]

10. Substrate 20 Electrode 30 Dielectric 40
・ Rib 50 ・ ・ Thick film pattern forming material 60 ・ ・ Filament 70 ・ ・ Thick film pattern forming jig 80 ・ ・ Cylinder 90 ・ ・ Thick film pattern

Claims (5)

[Claims] A jig using a filament having a cross-sectional shape constituted by a curved line or a straight line or both or a multifilament obtained by twisting a plurality of filaments is pressed against a thick film pattern forming material previously applied to a predetermined substrate. Thereby obtaining a thick film pattern having a space corresponding to the cross-sectional shape of the filament. 2. A thick film pattern forming method, wherein filaments having a cross-sectional shape constituted by a curve or a straight line or both or a multifilament obtained by twisting a plurality of filaments are densely and plurally arranged on the same plane. Jig. 3. A jig for forming a thick film pattern, wherein a filament having a cross-sectional shape constituted by a curve or a straight line or both or a multifilament obtained by twisting a plurality of filaments is densely wound around a cylinder. 4. A thick film pattern formed by the method for forming a thick film pattern according to claim 1, wherein when the height of the thick film pattern is H and the pitch is D, the relationship between the two is: A thick film pattern, wherein D ≧ 2H. 5. A thick film pattern formed by the method for forming a thick film pattern according to claim 1, wherein fine irregularities are formed on the surface by a multifilament obtained by twisting a plurality of filaments. Thick film pattern.