JP2000348153A - Electronic circuit board and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily connect an antenna and an IC chip and to increase the number of turns of the antenna by constituting a coiled antenna by connecting antenna conductor films on the side of a base material and antenna conductor films on a chip side. SOLUTION: The antenna conductor films 20 are formed on the circuit base material 10 in a specific pattern by screen printing. The antenna conductor films 20 may be formed by etching copper foil. A semiconductor IC chip 30 is arranged across the antenna conductor films 20, whose start and end points are connected directly to connection terminals of the semiconductor IC chip 30. This constitution makes it easy to connect the antenna and IC chip through the facedown connection of the semiconductor IC chip 30 and can reduce the width of the antenna conductor films formed on the IC chip 30, so that the number of turns of the antenna can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board and a method of manufacturing the same, and more particularly, to an electronic circuit board suitable for application to an electronic circuit board having a coil antenna and a method of manufacturing the same.

[0002]

2. Description of the Related Art A non-contact type IC card includes a memory, a microcomputer, and a circuit base made of an organic polymer material.
It has a configuration in which a semiconductor IC chip having a function for wireless communication and a coiled antenna are connected and fixed, and are built in a card. Non-contact type IC cards have a much larger memory capacity than magnetic tapes, and do not require the transfer of card information via electrical contacts. It is becoming widely used as a highly portable recording medium. Non-contact type IC
In an electronic circuit board having a coiled antenna and a semiconductor IC chip like a card, it is necessary to connect the start point and the end point of the antenna to two connection terminals of the semiconductor IC chip. Since the coiled antenna is formed in a spiral shape, when the semiconductor IC chip is arranged on the outer peripheral side of the antenna, for example, even if the starting point of the antenna and one connection terminal of the IC chip are directly connected, When connecting the end point of the antenna to the other connection terminal of the IC chip, the connection line needs to be provided so as to cross over the antenna. Therefore, it is necessary to electrically insulate between the conductor antenna and the connection line, and there is a problem that the manufacturing process becomes complicated.

For example, as disclosed in Japanese Patent No. 2,814,477, a method of arranging an IC chip so as to straddle an antenna and directly connecting a starting point and an ending point of the antenna to a connection terminal of the IC chip is known. Are known. With this configuration, a connection line is not required, and the antenna and the IC chip can be easily connected.

[0004]

However, the method described in Japanese Patent No. 2,814,477 has a problem that the number of turns of the antenna is limited. That is, for example, when a coil-shaped antenna is formed by screen printing a conductive paste on a circuit board, the line width of the antenna is 200 mm in the current screen printing technology.
It is difficult to reduce it to μm or less. Therefore, for example, if the line width of the antenna is 200 μm, the width of the gap between adjacent antennas is 200 μm, and the distance between the connection terminals of the IC chip is 1.0 mm, the antenna that can be arranged between the connection terminals of the IC chip will be described. The number of coils is two, and the number of turns of the antenna is three. Further, when a coil-shaped antenna is formed by etching a copper foil formed on a circuit board, for example, it is difficult to reduce the line width of the antenna to 100 μm or less with the current technology. Therefore, for example, if the line width of the antenna is 100 μm, the width of the gap between adjacent antennas is 100 μm, and the distance between the connection terminals of the IC chip is 1.0 mm, the antenna that can be arranged between the connection terminals of the IC chip will be described. The number of coils is four, and the number of turns of the antenna is five.

An object of the present invention is to provide an electronic circuit board capable of easily connecting an antenna to an IC chip and increasing the number of turns of the antenna, and a method of manufacturing the same.

[0006]

In order to achieve the above object, the present invention provides a coil antenna, which is disposed so as to straddle the antenna, and which is connected to a start point and an end point of the antenna via connection terminals, respectively. In the electronic circuit board having the semiconductor IC chip formed, the coiled antenna is provided with a plurality of substrate-side antenna conductor films formed on the surface of a circuit substrate and the connection terminals of the semiconductor IC chip. A plurality of antenna conductor films on the chip side formed on a plurality of surfaces, and the plurality of antenna conductor films on the base material side and the plurality of antenna conductor films on the chip side are respectively connected to form a coiled antenna. Is constituted. With this configuration, the antenna and the IC chip can be easily connected by face-down connection of the semiconductor IC chip, and the width of the antenna conductor film formed on the semiconductor IC chip can be reduced, and the number of turns of the antenna can be increased. Becomes

According to another aspect of the present invention, there is provided a semiconductor integrated circuit device, comprising: forming a part of a coil-shaped antenna conductive film on a surface of an electrically insulating circuit substrate; Forming a part of the antenna conductor film corresponding to the cut portion of the coiled antenna formed on the surface of the circuit substrate on the surface of the chip where the connection terminals are formed, at the same time as the formation of the connection terminals by a semiconductor film formation step Then, the starting point and the ending point of the antenna conductor film formed on the circuit substrate are connected to the connection terminals of the semiconductor IC chip, and each end of the partially cut coil-shaped antenna conductor film is The above semiconductor IC
A coiled antenna is formed by connecting each end of an antenna conductor film formed on a chip.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic circuit board according to an embodiment of the present invention and a method for manufacturing the same will be described with reference to FIGS. First, the planar shape of the electronic circuit board according to the present embodiment will be explained with reference to FIG.

The electronic circuit board according to the present embodiment includes a circuit substrate 10, a conductor film 20 for an antenna, and a semiconductor IC chip 30. The conductor film 20 for the antenna
It is formed on the circuit substrate 10 by screen printing so as to have a predetermined pattern. The antenna conductor film 20 may be formed by etching a copper foil. The semiconductor IC chip 30 is disposed over the antenna conductor film 20, and a start point and an end point of the antenna conductor film 20 are connected to connection terminals of the semiconductor IC chip 30 as described later with reference to FIG. 7. Directly connected.

Here, the pattern of the antenna conductive film 20 in the electronic circuit board according to the present embodiment will be explained with reference to FIG. The conductor film for antenna 20 formed on the circuit substrate 10 includes conductor films 20A, 20B, 20C,
20D, 20E, and 20F. Conductive film 2
.., 20F are cut at the cutting portion 22 to form six independent conductive films.

One end of the conductor film 20A is
, And is formed as a starting point 20s of the antenna. The other end of the conductor film 20 </ b> A becomes the intermediate point 20 c 6 of the antenna at the cut portion 22. Both ends of the conductor film 20B become the intermediate points 20c1 and 20c7 of the antenna in the cut portion 22, respectively. Both ends of the conductor film 20C are cut at the cut portion 22, respectively.
The intermediate points 20c2 and 20c8 of the antenna are provided. Conductive film 2
Both ends of 0D are the intermediate points 20c3 and 20c9 of the antenna in the cutting section 22, respectively. Conductive film 20E
Are the midpoints 20c4 and 20c10 of the antenna in the cutting section 22, respectively. One end of the conductor film 20F is formed by being bent in the direction of the cut portion 22, and serves as an end point 20e of the antenna. Conductive film 2
The other end of OF becomes an intermediate point 20c5 of the antenna at the cutting section 22.

Then, as will be described later with reference to FIG. 3, by mounting a semiconductor IC chip on the cut portion 22, the intermediate points 20c1 and 20c6 are connected, and the intermediate points 20c2 and 20c7 are connected. Are connected to the intermediate point 20c.
3, the intermediate point 20c8 is connected, the intermediate point 20c4 and the intermediate point 20c9 are connected, and the intermediate point 20c5 and the intermediate point 20c are connected.
10 is connected. Thereby, the conductor film 2 for the antenna is formed.
.., 20F are continuous conductor films and are formed in a spiral shape.
It becomes a 6-turn antenna coil having 0e. The start point 20s and the end point 20e are respectively connected to connection terminals of a semiconductor IC chip described later with reference to FIG.

Here, a film made of an organic polymer material such as polyester, for example, a polyester film is used as the circuit substrate 10, and its thickness is 0.12 m.
m. The antenna conductor film 20 is formed by screen-printing a conductor paste made of silver (Ag) powder on the circuit substrate 10 and then drying it. The width of each of the conductor films 20A,.
If the gap between A,..., 20F is 200 μm, the width L from the outer peripheral end of the conductor film 20A to the inner peripheral end of the conductor film 20F is L.
1 is 2.2 mm. Also, the starting point 2 of the conductor film 20A
0s and the end point 20e of the conductive film 20F are 1
mm.

Next, the shape of the conductor film formed on the semiconductor IC chip used for the electronic circuit board according to the present embodiment will be explained with reference to FIG. FIG. 3 shows the shape of the conductor film formed on the surface on which the connection terminals of the semiconductor IC chip according to the present embodiment are formed.

The semiconductor IC chip 30 has a side length L3
Is a 2 mm square shape. Note that FIG. 3 is an enlarged view of FIGS. 1 and 2. Semiconductor IC
On the connection surface of the chip 30, two connection terminals 31S, 31
E and five antenna conductor films 32U, 32V, 32
W, 32X, and 32Y are formed.

The connection terminals 31S and 31E are 60 μm square, and the distance L4 between them is 1 mm. The conductor films 32U, 32V, 32W, 32X, 32Y for the antenna
32Y1, 32U1, 32U1,.
32Y2 has a width of 200 μm and is equal to the width of the antenna conductor films 20A,..., 20F shown in FIG. However, the width at the center between the connection terminals 31S and 31E is smaller than that at both ends, and is 50 μm. In the central part, the width of the gap between the conductor films 32U,.
μm. Therefore, the connection terminals 31S and 31E
, 32Y can be sufficiently arranged between the gaps (width 1 mm).
Connection terminals 31S, 31E and antenna conductive film 32U,
, 32Y are formed by gold (Au) plating in the same step in the semiconductor film forming step as described later. Further, by using the semiconductor film forming step, the line width of the conductor film 32 for the antenna can be reduced.

The surface on which the connection terminals 31S and 31E of the semiconductor IC chip 30 shown in FIG. 3 are formed faces downward, that is, faces down, and the cut portion 22 of the antenna conductive film 20 shown in FIG. Mount on top. At this time,
The connection is performed such that the connection terminal 31S of the semiconductor IC chip 30 matches the start point 20s of the antenna conductor film 20A, and the connection terminal 31E of the semiconductor IC chip 30 matches the end point 20e of the antenna conductor film 20F. At this time, both ends 32U1 and 32U2 of the antenna conductor film 32U of the semiconductor IC chip 30 are respectively connected to the antenna conductor film 2U.
0B and the middle point 20c6 of the antenna conductor film 20A. Similarly, both ends 32V1 and 32V2 of the conductor film 32V for the antenna are connected to the middle point 20c2 of the conductor film 20C for the antenna and the middle point 20c7 of the conductor film 20B for the antenna, respectively. Further, both ends 32W of the conductor film 32W for the antenna.
The intermediate point 20c3 of the antenna conductive film 20D and the intermediate point 20c3 of the antenna conductive film 20C are respectively denoted by 1, 32W2.
Connected in accordance with c8. Furthermore, both ends 32X1 and 32X2 of the conductor film 32X for the antenna are connected to coincide with the middle point 20c4 of the conductor film 20E for the antenna and the middle point 20c9 of the conductor film 20D for the antenna, respectively. Further, both ends 32Y of the conductor film 32Y for the antenna.
1, 32Y2 are the intermediate point 20c5 of the antenna conductive film 20F and the intermediate point 20c of the antenna conductive film 20E, respectively.
Connected in accordance with c10.

Thus, the antenna conductor film 20 is formed.
A, antenna conductor film 32U, antenna conductor film 20
B, antenna conductor film 32V, antenna conductor film 20
C, conductor film 32W for antenna, conductor film 20 for antenna
D, antenna conductor film 32X, antenna conductor film 20
E, antenna conductive film 32Y, antenna conductive film 20F
Are connected continuously, and a six-turn antenna coil is formed.

Next, the configuration of the connection terminals and the conductor film formed on the semiconductor IC chip used for the electronic circuit board according to the present embodiment will be explained with reference to FIG. Semiconductor IC
A circuit film 34 is formed on the base material 33 of the chip.
On the circuit film 34, an electrical insulating protection film 35 of a semiconductor IC chip is formed. A part of the protective film 35 is opened, and the circuit film 34 is opened via the pump forming conductor film 36.
Connected to connection terminal 31. On the protective film 35, the antenna conductor film 32 is formed by a semiconductor film formation process via the bump formation conductor film 36.

Next, the method for fabricating the electronic circuit board according to the present embodiment will be explained with reference to FIGS. FIG.
FIG. 6 is a process flow chart showing steps of a method of manufacturing an electronic circuit board according to one embodiment of the present invention. FIG. 6 is a cross-sectional view of a chip in each step of the method of manufacturing an electronic circuit board according to one embodiment of the present invention. is there.

As shown in FIG. 5, the method of manufacturing an electronic circuit board includes a semiconductor IC chip manufacturing step and an electronic circuit board manufacturing step. First, the semiconductor IC chip manufacturing step will be described. In a process P100 of FIG. 5, a circuit film of a semiconductor IC is formed. At this time, an inorganic protective film is formed on the circuit film, and a connection terminal portion used for connecting to the conductor film for the antenna includes:
Form an opening. That is, as shown in FIG. 6A, a circuit film 34 is formed on a circuit substrate 33 such as a silicon wafer. The details of the formation of the circuit film 34 are omitted.

Next, in process P110, FIG.
As shown in (B), an electric insulating protection film 35 is formed on the circuit film 34. As the electric insulating protection film 35, for example, a polyimide-based film is used. An opening 35A is formed in a connection terminal used for connection with the antenna conductor film. Next, in a process P122, as shown in FIG. 6C, a plating conductive film 36 for forming a connection terminal and an antenna conductor film by plating is formed on the entire surface of the electric insulating protective film 35 and the opening 35A thereof. Form. As the conductive film for plating 36, for example, Ti
A thin film having a thickness of about 0.5 μm such as / Pd is formed by sputtering.

Next, in process P124, FIG.
As shown in (C), a plating resist material is applied on the entire surface of the conductive film for plating 36 and is temporarily cured. And FIG.
The resist film is exposed and developed through a photomask having an opening for forming the connection terminal 31 and the conductive film 32 for the antenna shown in (1) to form a patterned plating resist film 41. The plating resist film 41 has an opening 41A for forming a connection terminal and an opening 41B for forming a conductive film for an antenna. The opening 41A for forming the connection terminal is formed in two places, and the opening 41B for forming the conductive film for the antenna is formed in five places.
Each is shown one by one.

Next, in process P130, FIG.
As shown in (D), the conductive films for plating 36 were used as electrodes to be immersed in an Au electroplating bath to form openings 41A and 41A.
B, Au plating films 31A and 32 having a thickness of about 20 μm.
A is electrodeposited and deposited on the conductive film 36 for plating. Next, in a process P140, the plating resist film 41 is dissolved and removed in the state shown in FIG.
As shown in (E), a connection terminal 31 and a conductive film 32 for an antenna are formed.

Next, in process P150, FIG.
In the state shown in (E), the conductive film for plating 36 is dissolved and removed, and as shown in FIG. 6 (F), portions other than the connection terminal 31 and the conductive film for antenna 32 are electrically insulated and protected.
To expose. Next, in process P160, the semiconductor wafer is cut to form the semiconductor IC chip shown in FIG.

Through the above steps, a semiconductor IC chip on which connection terminals and an antenna film are formed can be manufactured. Here, each of the steps of FIGS. 6A to 6F is a step that has been conventionally used for forming the connection terminal 31, and as in the present embodiment, the antenna film 32
Is formed on a semiconductor IC chip, there is no change in the process. The only difference is that the opening pattern of the photomask used in the step shown in FIG. 6C is changed from one in which only the connection terminal is formed to one in which the connection terminal and the antenna film are formed. Can be formed simultaneously with the formation of the antenna film.

The connection terminal 31 and the antenna film 32
Is formed by plating, so that the line width can be reduced as compared with the case where Cu foil is etched. Specifically, in the example shown in FIG. 4, the length L5 of one side of the connection terminal 31 is set to 60 μm, and the connection terminal 31 has a square shape. Although the width L7 of the antenna film 32 is set to 50 μm, in the case of forming a film by plating, the line width L7 can be reduced to 10 μm with the current technology. The distance of the gap between the films, for example, the distance between the connection terminals 31 is 50 μm, and the distance L6 between the connection terminals 31 and the antenna film 32 is 225 μm. It can be as narrow as 50 μm or less, for example up to 10 μm.

Next, processes P200 to P230 in FIG.
The steps of manufacturing the electronic circuit board according to the present embodiment will be explained with reference to FIGS. FIG. 7 is a partial cross-sectional view of the electronic circuit board according to the present embodiment. FIG. 7A shows an JJ enlarged cross section of FIG. 1, and FIG.
The -K enlargement cross section is shown.

First, in a process P200, a conductive paste made of Ag powder is printed on the circuit substrate 10 made of a polyester film by screen printing and dried, and the coiled antenna film shown in FIG. 2
A pattern of 0 is formed. The antenna film 20 has a cutting portion 2
2 and 6 independent linear conductive films. next,
In process P210, an anisotropic conductive adhesive film is applied so as to cover the mounting portion of the semiconductor IC chip, that is, the cut portion 22 of the antenna film 20 shown in FIG.

Next, in process P220, a semiconductor IC chip is mounted on the anisotropic conductive adhesive film. At this time, as shown in FIG.
, 20c5, via the anisotropic conductive adhesive film 50, the antenna conductor film 32 of the semiconductor IC chip 30.
U, 32V, 32W, 32X, 32Y end 32U1,
..., 32Y1 are positioned so as to be placed, and
As shown in FIG. 7B, the connection terminals 31S and 31E of the semiconductor IC chip 30 are mounted on the start point 20s and the end point 20e of the antenna film via the anisotropic conductive adhesive film 50. Positioned.

Next, in process P230, the circuit substrate 10 and the semiconductor IC chip 30 are heated and pressed to connect the connection terminals 31 of the semiconductor IC chip 30 to the starting point and the ending point of the antenna conductor film formed on the circuit substrate 10. Are electrically connected to each other, and the antenna conductor film 32 formed on the semiconductor IC chip 30 is electrically connected to the antenna conductor film 20 formed on the circuit substrate 10.

In this way, the antenna film formed on the surface of the circuit board material and the antenna conductor film formed on the surface of the semiconductor IC chip form the antenna film in a coil shape, and the start and end points of the antenna are determined. Are connected to circuit terminals of a semiconductor IC chip to form an electronic circuit.

The electronic circuit board manufactured as described above can be easily formed by forming a printed film on a circuit substrate once, manufacturing a semiconductor IC chip by a conventional process, and heat-pressing the semiconductor IC chip and a conductor printed film for an antenna. With this configuration, an electronic circuit board that is less expensive than the conventional one can be provided.

In the above description, the conductor film for the antenna on the surface of the circuit substrate is formed by a printed film of Ag paste. However, a printed film of a conductor paste made of a metal powder other than Ag powder, It may be formed by patterning a conductor film for an antenna by etching a metal foil such as Al, patterning by selective plating of a metal such as Cu or Ni, or patterning a thin metal film such as Al by a thin film forming step. Further, as a terminal formed on the surface of the semiconductor IC chip and a conductor film for the antenna,
Although the Au plating film is used, it may be formed by a metal film such as Ni, Al, Sn or solder. In the configuration of the antenna film according to the present embodiment, the distance between the start point and the end point of the antenna film formed on the circuit substrate is equal to or smaller than the chip size, more strictly, the start point and the end point of the antenna that can be formed on the surface of the semiconductor IC chip. The width, the interval, and the number of windings of the antenna conductive film can be designed in consideration of the requirements of the antenna characteristics so that the interval is equal to or less than the interval between the terminals connected to the semiconductor IC circuit to be connected.

As described above, according to the present embodiment, the connection between the antenna and the IC chip can be easily performed, and the number of turns of the antenna can be increased.

Next, the configuration of the non-contact type IC card using the electronic circuit board according to the present embodiment will be explained with reference to FIG. 1 to 4 indicate the same parts. FIG. 8 is a cross-sectional view showing a configuration of a non-contact type IC card using an electronic circuit board according to one embodiment of the present invention.

A coil-shaped antenna film 20 is formed on a circuit substrate 10 made of a polyester film having a thickness of 0.12 mm by the manufacturing method described with reference to FIGS. The semiconductor IC chip 30 is bonded via an anisotropic conductive adhesive film 50 on the antenna film 20 such that the antenna film 32 formed on the semiconductor IC chip 30 is connected to the intermediate point 20c of the antenna film 20. .

Next, a surface film 70 made of a polyester film having a thickness of 0.12 mm is formed on a circuit board provided with the antenna printed film 20 and the semiconductor IC chip 30 by using an intermediate material 60 made of a polyester-based adhesive. A non-contact type IC card having an attached thickness of 0.5 mm is formed.

As described above, by using the electronic circuit board according to the present embodiment, the antenna and the IC chip can be easily connected, the number of turns of the antenna can be increased, and the performance of the non-contact type IC card can be improved. Can be improved.

Next, an electronic circuit board and a method of manufacturing the same according to another embodiment of the present invention will be described with reference to FIGS. The same reference numerals as those in FIGS. 1 to 3 indicate the same parts. First, the planar shape of the electronic circuit board according to the present embodiment will be explained with reference to FIG.

The electronic circuit board according to the present embodiment includes a circuit substrate 10 ', a conductor film 20' for an antenna, and a semiconductor IC chip 30 '. The circuit substrate 10 ′
It is a 0.3 mm thick glass epoxy plate. The antenna conductor film 20 ′ has a thickness of 0.02 mm on the circuit substrate 10 ′.
It is formed so as to have a predetermined pattern by etching a 3 mm Cu foil. Semiconductor IC chip 30 '
Are disposed over the antenna conductor film 20 ′, and the start and end points of the antenna conductor film 20 ′ are
It is directly connected to the connection terminal of the C chip 30 '. The size of the semiconductor IC chip 30 'is a square having a side of 1.5 mm, and the distance between the connection terminals is 1.3 mm.

Here, the pattern of the antenna conductive film 20 'in the electronic circuit board according to the present embodiment will be explained with reference to FIG. The conductor film for antenna 20 ′ formed on the circuit substrate 10 ′ is made of a conductor film 20 A ′, 20.
B ', 20C', 20D ', 20E', and 20F '. The conductor films 20A ′,..., 20F ′ are cut at the cut portions 22 ′, and constitute six independent conductor films.

Here, the circuit substrate 10 has a thickness of 0.1 mm.
A 3 mm glass epoxy plate is used. The antenna conductor film 20 ′ has a thickness of 0.023 on the circuit substrate 10 ′.
It is formed so as to have a predetermined pattern by etching the Cu foil of mm. Each of the conductor films 20A ',..., 20
The width of F ′ is 100 μm, and the conductor films 20A ′,.
The gap between F ′ is 100 μm.

The starting point 20s' of the conductor film 20A 'is different from that shown in FIG. 2 in that the intermediate points 20c1',.
It has the same shape as 5 '. The end point 20e 'of the conductor film 20A' is located at the intermediate point 20c6 ', ..., 20c10'.
It has the same shape as. Other intermediate points 20c1 ',
, 20c10 'are the same as those shown in FIG. The distance between the connection terminals of the semiconductor IC chip 30 'is
When the entire width of the antenna conductor film 20 'is almost the same, it is not necessary to form a pattern in which the start point and the end point are bent toward the cut portion as shown in FIG.

Next, the shape of the conductor film formed on the semiconductor IC chip used for the electronic circuit board according to the present embodiment will be explained with reference to FIG. FIG. 11 shows the shape of the conductor film formed on the surface on which the connection terminals of the semiconductor IC chip according to the present embodiment are formed.

The semiconductor IC chip 30 'has a square shape with one side length of 1.5 mm. Semiconductor IC chip 30 '
The two connection terminals 31S 'and 31E'
Five antenna conductor films 32U ', 32V', 32
W ', 32X', and 32Y 'are formed.

The connection terminals 31S 'and 31E' are 60 μm
Is the corner. Antenna conductor films 32U ', 32V', 32
W ', 32X', 32Y 'are both ends 32U.
, 32Y1, 32Y2 have a width of 100
μm, and the antenna conductor film 20 shown in FIG.
A ', ..., 20F'. However, at the center, the width is smaller than at both ends,
It is 50 μm. In the central part, the conductive film 32
The width of the gap between U ′,..., 32Y ′ is 50 μm. The connection terminals 31S ', 31E' and the conductor films 32U ',..., 32Y' for the antenna are formed by gold (Au) plating in the same step as described above.

The surface on which the connection terminals 31S 'and 31E' of the semiconductor IC chip 30 'shown in FIG. 11 are formed faces downward, that is, faces down, so that the antenna conductor film 20' shown in FIG. Is mounted on the cutting portion 22 'of the above. At this time, the connection terminals 31 of the semiconductor IC chip 30 '
S ′ coincides with the starting point 20s ′ of the antenna conductor film 20A ′, and the connection terminal 31E ′ of the semiconductor IC chip 30 ′
The connection is made by an anisotropic conductive adhesive so as to coincide with the end point 20e 'of the antenna conductor film 20F'. Then, the antenna conductor film 32 of the semiconductor IC chip 30 '
Both ends 32U1 'and 32U2' of U 'are connected to and coincide with the middle point 20c1' of the antenna conductor film 20B 'and the middle point 20c6' of the antenna conductor film 20A ', respectively. Similarly, both ends 32V1 'and 32V2' of the antenna conductor film 32V 'are respectively located at the midpoint 20c2' of the antenna conductor film 20C 'and the antenna conductor film 20C'.
It is connected to the middle point 20c7 'of B'. Also,
Both ends 32W1 ', 32W of conductor film 32W' for antenna
2 ′ is an intermediate point 20c of the antenna conductive film 20D ′ and an intermediate point 20c of the antenna conductive film 20C ′, respectively.
8 'is connected. Furthermore, both ends 32X1 'and 32X2' of the conductor film 32X 'for the antenna are connected to coincide with the middle point 20c4' of the conductor film 20E 'and the middle point 20c9' of the conductor film 20D '. . Further, the antenna conductor film 32Y 'is further provided.
The ends 32Y1 'and 32Y2' of the antenna conductor film 20F 'are connected to the intermediate point 20c5' of the antenna conductor film 20F 'and the intermediate point 20c10' of the antenna conductor film 20E ', respectively.

Thus, the antenna conductive film 20
A ', conductor film 32U' for antenna, conductor film 2 for antenna
0B ', antenna conductor film 32V', antenna conductor film 20C ', antenna conductor film 32W', antenna conductor film 20D ', antenna conductor film 32X', antenna conductor film 20E ', antenna conductor film 32Y ', The antenna conductor film 20F' is continuously connected,
A turn antenna coil is formed.

When a non-contact type IC card is manufactured using the electronic circuit board shown in FIG. 9, a thin epoxy resin is applied to the surface of the electronic circuit board in the same manner as shown in FIG. A 0.05 mm polyester film is adhered to the back surface of the electronic circuit board and the surface of the epoxy material to form an intermediate material, and a coil antenna and a semiconductor IC chip having a thickness of 0.76 mm are incorporated. A contact type IC card is manufactured.

As described above, according to this embodiment, the antenna and the IC chip can be easily connected, and the manufacturing cost of the non-contact type IC card can be reduced.

[0052]

According to the present invention, the connection between the antenna and the IC chip can be easily performed, and the number of turns of the antenna can be increased.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic circuit board according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a pattern of a conductor film for an antenna in an electronic circuit board according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram of a shape of a conductive film formed on a semiconductor IC chip used for an electronic circuit board according to an embodiment of the present invention.

FIG. 4 is an explanatory diagram of a configuration of a connection terminal and a conductor film formed on a semiconductor IC chip used for an electronic circuit board according to an embodiment of the present invention.

FIG. 5 is a process flow chart showing steps of a method of manufacturing an electronic circuit board according to one embodiment of the present invention.

FIG. 6 is a cross-sectional view of a chip in each step of the method for manufacturing an electronic circuit board according to one embodiment of the present invention.

FIG. 7 is a partial cross-sectional view of an electronic circuit board according to an embodiment of the present invention.

FIG. 8 is a sectional view showing a configuration of a non-contact type IC card using an electronic circuit board according to an embodiment of the present invention.

FIG. 9 is a plan view of an electronic circuit board according to another embodiment of the present invention.

FIG. 10 is an explanatory diagram of a pattern of a conductor film for an antenna in an electronic circuit board according to another embodiment of the present invention.

FIG. 11 is an explanatory diagram of a shape of a conductor film formed on a semiconductor IC chip used for an electronic circuit board according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Circuit base material 20 ... Antenna conductor film 20s ... Start point 20e ... End point 20c ... Intermediate point 22 ... Cutting part 30 ... Semiconductor IC chip 31 ... Connection terminal 32 ... Antenna conductor film 33 ... Chip base material 34 ... Semiconductor IC circuit Film 35: Electrical insulating protective film 36: Plating conductive film 50: Anisotropic conductive adhesive 60: Intermediate material 70: Surface sheet

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/32 G06K 19/00 K (72) Inventor Ryuji Takenaka 1st Horiyamashita, Hadano-shi, Kanagawa Japan Co., Ltd. (72) Inventor Yoshiaki Hotta 1-Horiyamashita, Hadano-shi, Kanagawa F-term (in reference) 4E351 AA02 BB09 BB14 BB30 BB31 CC11 DD04 DD05 EE01 GG20 5B035 BA03 BB09 CA01 CA23 5E319 AA03 AB05 BB16 CC61 GG20 5E338 AA00 BB75 BB80 CC01 CD12 CD17 CD33 EE23 EE31 5F044 KK02 KK09 LL09 QQ00

Claims (2)

[Claims] 1. An electronic circuit board comprising: a coiled antenna; and a semiconductor IC chip disposed so as to straddle the antenna and connected to a start point and an end point of the antenna via connection terminals, respectively. A plurality of antenna conductor films on the substrate side formed on the surface of the circuit substrate, and a plurality of antenna conductor films on the chip side formed on the surface of the semiconductor IC chip where the connection terminals are provided. An electronic circuit board comprising: a plurality of antenna conductor films on the substrate side and a plurality of antenna conductor films on the chip side connected to each other to form a coiled antenna. 2. A partially cut coil-shaped antenna conductor film is formed on the surface of an electrically insulating circuit substrate, and the circuit is formed on a surface on which connection terminals of a semiconductor IC chip are formed. A part of the conductor film for the antenna corresponding to the cut portion of the coiled antenna formed on the surface of the substrate is formed at the same time as the formation of the connection terminal by a semiconductor film forming step, and the antenna for the antenna formed on the circuit substrate is formed. The starting point and the ending point of the conductive film are connected to the connection terminals of the semiconductor IC chip, and the ends of the partially cut coil-shaped antenna conductive film are connected to the antenna conductive film formed on the semiconductor IC chip. A method of manufacturing an electronic circuit board, comprising connecting each end of the electronic circuit board to a coiled antenna.