JP2000345056A - Conductive resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide conductive resin compositions excellent in flexural modulus, strength, volume resistivity, moldability, surface smoothness of molded articles, and dimension stability. SOLUTION: Conductive resin compositions comprises 3-80 pts.wt. calcium silicate fibers having an average fiber diameter of 1-10 μm and an average fiber length of 8-70 μm, 100 pts.wt. sum of 70-99.8 pts.wt. thermoplastic resin, 3-30 pts.wt. electrically conductive filler and/or 0.2-20 pts.wt. surface active agent 3-80 pts.wt. and have a flexural modulus of not smaller than 1,500 MPa.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive resin composition and a molded article using the same, and more particularly, to a flexural modulus, strength, volume resistivity, moldability, molded article surface smoothness, and the like. The present invention relates to a conductive resin composition having excellent dimensional stability, and a molded product such as an IC tray or a carrier reel molded using the same.

[0002]

2. Description of the Related Art Conductive resin compositions have become widespread in the industrial world and are used for various purposes. As this conductive resin composition, for example, there is a conductive resin composition in which each resin is highly filled with a conductive filler such as carbon black, and because of its economical efficiency, it is widely used mainly in industry. Have been. In addition, antistatic conductive resin compositions obtained by polymerizing an antistatic conductive resin having a surfactant or a hydrophilic segment in its structure have been widely used, and have been applied to various uses.

In recent years, conductive polymer materials have been
With the spread of packaging related to C chips, the material variations are diversifying from general-purpose plastics to engineering plastics. In addition, the conductive filler used, in addition to carbon black, carbon fiber, graphite,
Metal coat fillers, metal fibers, and the like are widely used depending on the purpose and function. However, with the improvement in functionality, more economics have been pursued,
Furthermore, it has been required that the composition be environmentally friendly. For example, a conductive resin composition as a material for an IC tray or the like used for packaging an IC chip,
Changes in the form, weight reduction, thinning, and compactness of IC chips are being studied, and there is a tendency for strength and high rigidity to be required.

[0004] Physical properties generally required as a material include strength and flexural modulus. In order to satisfy these requirements, an example in which a relatively large amount of an inorganic filler is added is generally used ( JP-A-59-96142). However, when a fine powder of calcium silicate, which is widely used as an inorganic filler, is used, the flexural modulus and impact resistance of a molded product are reduced, and gloss unevenness occurs. Also,
In addition, mica powder having a scaly form used as an inorganic filler, plate-like talc, etc., have a flexural modulus,
The impact strength is reduced, and the smoothness of the appearance surface of the molded article is impaired. In addition, since it must be added in a relatively large amount, there is a problem of deterioration in workability.

[0005] On the other hand, in order to prevent the deterioration of these strength characteristics, there is an example in which chop fibers such as glass fiber and carbon fiber are used in combination. These chop fibers are effective for imparting rigidity and strength. The surface smoothness of the molded article such as uneven gloss, unevenness, weld marks, flash marks, and fluff is not satisfactory. Further, the antistatic conductive resin has a permanent antistatic conductive property by forming a hydrophilic polymer into a polymer alloy with respect to a thermoplastic resin, and has high industrial utility value. However, in many of these polymer alloy materials, the hydrophilic segment of the antistatic conductive resin to be alloyed has flexibility in many cases, and generally, the rigidity of the material is reduced and the molded product is deformed. These resins have also been modified by using inorganic fillers, glass fibers and the like in combination, but, like the conductive resin composition described above, have uneven gloss on the surface,
Molded product surface smoothness such as weld marks, flash marks, and fluff is not satisfactory.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional technical problems, and has an object to provide a flexural modulus, strength, volume resistivity, moldability, and surface smoothness of a molded article. It is intended to obtain a conductive resin composition having excellent dimensional stability.

[0007]

According to the present invention, there are provided a thermoplastic resin (a) of 70 to 99.8 parts by weight, a conductive filler (b) of 3 to 30 parts by weight and / or a surfactant (c).
0.2 to 20 parts by weight [however, (a) + (b) + (c)
= 100 parts by weight] and a flexural modulus of 3 to 80 parts by weight of calcium silicate fiber (d) having an average fiber diameter of 1 to 10 μm and an average fiber length of 8 to 70 μm with respect to 100 parts by weight of the total amount. It relates to a conductive resin composition of 1,500 MPa or more.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The thermoplastic resin (a) of the present invention comprises:
Specifically, low density polyethylene, medium density polyethylene, high density polyethylene, low pressure method low density polyethylene,
Poly-α-olefins such as polypropylene, polybutene-1, poly-4-methylpentene-1, etc .; α-olefins such as propylene-ethylene block copolymer and propylene-ethylene random copolymer, or α-olefin and other monomers Copolymer with: polyvinyl chloride,
Vinyl monomer polymers or copolymers such as polystyrene and acrylonitrile-butadiene-styrene terpolymer (ABS resin); polyamides such as nylon 6, nylon 66 and nylon 12; polyethylenes such as polyethylene terephthalate and polybutylene terephthalate;
Aromatic polyethers such as polyphenylene oxide;
Polycarbonate; sulfone polymers such as polyimide, polysulfone, and polyethersulfone. In the present invention, one or a mixture of two or more of the above thermoplastic resins is appropriately selected depending on the purpose. Among them, polypropylene, crystalline propylene-ethylene copolymer and crystalline propylene-
Crystalline propylene copolymers such as butene 1 copolymer, nylon, and polybutylene terephthalate are preferred,
Particularly, polypropylene, a crystalline propylene copolymer such as a crystalline propylene-ethylene copolymer and a crystalline propylene-butene 1 copolymer are preferable. In terms of heat resistance,
Aromatic polyimide, aromatic polyether and the like are preferable.

In the present invention, the mixing ratio of the thermoplastic resin (a) is 70 to 97 parts by weight, preferably 75 to 97 parts by weight in 100 parts by weight of the composition comprising the components (a) and (b). In the case of a composition comprising 95 parts by weight, component (a) and component (c), 80 to 9 in 100 parts by weight of the composition.
9.8 parts by weight, preferably 85 to 99 parts by weight, in the case of a composition comprising the components (a), (b) and (c), 70 to 99.8 parts by weight, preferably 100 to 100 parts by weight of the composition Is 70 to 96.8 parts by weight. If the blending ratio of the thermoplastic resin (a) is less than the minimum weight part in each of the above cases, the moldability and impact strength of the composition are significantly reduced. On the other hand, if the blending ratio of the thermoplastic resin (a) exceeds the maximum weight part in each of the above cases, sufficient conductivity cannot be obtained.

[0010] Examples of the conductive filler (b) used in the present invention include carbon black, carbon fiber, graphite, metal-coated filler, and metal fiber.
Among them, carbon black is practical. As carbon black, a carbon black manufactured by Nippon Steel Chemical Co., Ltd., manufactured by Nippon Steel Chemical Co., Ltd., trade name "Niteron", manufactured by Tokai Carbon Co., Ltd., trade name "Seast", manufactured by Columbia Carbon Co., trade name "CONDUC"
TEX "and the like, and acetylene black manufactured from acetylene gas manufactured by Denki Kagaku Co., Ltd., trade name" Denka Black "; Ketjen black manufactured by the Ketjen method manufactured by Lion Corporation, trade name" Ketjen " Black "and the like. The carbon black used as the conductive filler has a specific surface area of 40 m ² / g or more measured by an air permeation method, and more preferably has a specific surface area of 700 m ² / g or more, and particularly preferably has a specific surface area of 700 m ² / g or more. “Ketjen Black” (trade name, manufactured by AKZO Corporation) of 1,000 m ² / g can impart excellent conductivity with a relatively low addition amount.
In addition, acetylene black manufactured from acetylene gas, for example, “Denka Black” (trade name, manufactured by Denki Kagaku Co., Ltd.) has good dispersion stability in a resin, and therefore, molding is important for smoothness of a molded product surface. It is suitable for obtaining a product. Thus, carbon black can be appropriately selected according to the required performance and use of the molded article.

In the present invention, the compounding ratio of the conductive filler (b) is 3 to 30 parts by weight, preferably 5 to 25 parts by weight in the components (a) to (c). When the compounding ratio of the conductive filler (b) is less than 3 parts by weight, the conductive performance deteriorates. On the other hand, when the amount exceeds 30 parts by weight, the moldability and the appearance of the molded product deteriorate.

Further, the surfactant (c) used in the present invention is a general surfactant, which is an anionic surfactant which occupies most of all the surfactants, other cationic surfactants, They are classified into amphoteric surfactants and nonionic surfactants. Specifically, anionic surfactants such as carboxylate, sulfate ester, sulfonate, phosphate ester salt; primary amine salt, secondary amine salt, tertiary amine salt, quaternary amine salt Cationic surfactants such as ammonium salts; amphoteric surfactants such as amino acid-type amphoteric surfactants and betaine-type amphoteric surfactants; nonionics such as polyethylene glycol-type nonionic surfactants and polyhydric alcohol-type surfactants Surfactants and the like. Any of these can be used in the antistatic resin composition of the present invention. Examples of polyhydric alcohol surfactants that are generally used include glycol-based surfactants, which can exhibit an antistatic effect with a small amount of addition. In addition, the polyether type nonionic surfactant has hydrophilicity due to a hydrogen bond of a hydrogen atom of a water molecule with an oxygen atom of an ether bond in a polyether chain. Such a high-molecular nonionic surfactant having a polyether segment, for example, a polyetheresteramide represented by the following formula (I) is preferable because it has a permanent antistatic property. In the present invention, the mixing ratio of the surfactant (c) is
In the components (a) to (c), the amount is 0.2 to 20 parts by weight, preferably 1 to 15 parts by weight. If the compounding ratio of the surfactant (c) exceeds 20 parts by weight, the shrinkage is large, the dimensional stability is poor, and it is not suitable for precision molded products. On the other hand, when the compounding ratio is less than 0.2 parts by weight, the conductive performance is reduced.

Next, the calcium silicate used in the present invention will be described.
The lucium fiber (d) is CaSiO _ThreeCompound represented by
Manufactured from calcareous and siliceous raw materials
You. Its crystal structure is a tetrahedron connected in one dimension
A compound having a single-chain structure as a basic skeleton. Large fiber
The average fiber diameter is 1 to 10 μm and the average fiber length
Is 8 to 70 μm, preferably 10 to 70 μm, more preferably
More preferably, it is 20 to 50 μm. Average fiber length is 8
If it is less than μm, a sufficient physical reinforcing effect cannot be obtained,
On the other hand, when the average fiber length exceeds 70 μm,
Dimensional stability deteriorates.

The calcium silicate fiber (d) of the present invention comprises:
Those which have been subjected to surface treatment such as titanate coupling and silane coupling in order to enhance compatibility with the components (a) to (c) can also be used. The mixing ratio of the calcium silicate fiber (d) in the conductive resin composition of the present invention is 3 to 80 parts by weight, preferably 5 to 80 parts by weight, based on 100 parts by weight of the total amount of the components (a) to (c). 60 parts by weight. The mixing ratio of calcium silicate fiber (d) is 3
If the amount is less than the weight part, the shrinkage is large, the dimensional stability is poor, and it is not suitable for a precision molded product. On the other hand, when the amount exceeds 80 parts by weight, the moldability and the smoothness of the surface of the molded product are significantly reduced.

The conductive resin composition of the present invention contains a stabilizer, a coloring agent, a reinforcing rubber, an elastomer component, a plasticizer, a dispersant, an ultraviolet absorber, an antioxidant, and the like, as long as the object of the present invention is not impaired. Additives such as flame retardants, stabilizers, reinforcing agents, lubricants, foaming agents, weathering (light) agents, metal powders and the like can be added.

The conductive resin composition of the present invention has a flexural modulus of at least 1,500 MPa, preferably at least 1,800 MPa.
a or more. If the flexural modulus is less than 1,500 MPa, the rigidity is insufficient, and the molded product is deformed.

The conductive thermoplastic resin of the present invention can be produced without any problem using ordinary equipment and equipment used for mixing and kneading ordinary thermoplastic resins. Specifically, a thermoplastic resin (a), a conductive filler (b), a surfactant (c), a pre-mixer such as a tumbler or a Henschel mixer,
Charge calcium silicate fiber (d) and other ingredients,
Mix evenly. Thereafter, the mixture is supplied to an extruder, melt-kneaded, extruded from a die, and pelletized by a pelletizer. As the extruder, a vented single-screw, bi-screw different-direction, or bi-screw same-direction extruder is desirable. Further, instead of the extruder, a kneader such as a super mixer, a Banbury mixer, a kneader, a tumbler, a Buss kneader, or the like may be used. In addition, the method and order of charging each component can be appropriately selected. Preferably,
After the component (a) and the component (b) and / or the component (c) are in a molten state, when calcium silicate fiber (d) is blended and melt-mixed, the shear stress becomes low, the fiber breakage is small, and the material strength is reduced. To prevent a drop. The conductive resin composition of the present invention can be suitably used for OA equipment, home electric appliances, electric / electronics, vehicles, various other parts, housings, packages, and the like by utilizing its excellent characteristics.

[0018]

The present invention will be described below with reference to examples and comparative examples, but the present invention is not limited to these examples. In the examples, parts and percentages are by weight unless otherwise specified.

Various components used in Examples and Comparative Examples are as follows:
It is as follows. (A) Component (a-1): ABS resin (flexural modulus: 2,500 MP)
a), product name “TOYOLAC 250” manufactured by Toray Industries, Inc. (a-2): polyphenylene ether resin (PPE)
(Bending elastic modulus; 2,100 MPa), trade name “Zylon X9108” (a-3): rubber-modified styrene resin (HIPS) (bending elastic modulus; 2,000 MPa), manufactured by Asahi Kasei Corporation, Idemitsu Petrochemical Co., Ltd. Product name “Idemitsu Styrol IT41” (b) Component (b-1): acetylene black, manufactured by Electrochemical Co., Ltd.
Trade name “DENKA BLACK” (specific surface area; 60 m ² / g) (b-2): Ketchen Black, manufactured by Lion Corporation
Product name “Ketjen Black 600JD” (specific surface area;
( 1,270 m ² / g) (c) Component (c-1): Polyetheresteramide (polymer type surfactant), manufactured by Sanyo Chemical Industries, Ltd., trade name “Perestat 6321” (c-2): Glycerin Monostearate (glycol-based surfactant), manufactured by Riken Vitamin Co., Ltd., trade name "Riquemar S100"

(D) Component (d-1): calcium silicate fiber (average fiber diameter; 1 to 1)
10 μm, average fiber length: 20 to 40 μm), manufactured by Tsuchiya Kaolin Co., Ltd., trade name “Kemolit S-3” (d′-1): talc (average particle size: 7 μm), manufactured by Takehara Chemical Co., Ltd. Name “TALC TT” (d′-2): Mica (average particle size: 90 μm), Co., Ltd.
Kuraray, trade name "Szolite Mica 200KI"(d'-3): glass fiber (average fiber diameter; 13 µm, average fiber length; 3 mm), manufactured by Nitto Boseki Co., Ltd., trade name "Glass Fiber CS-3PE-" 291S ”(d′-4): pitch-based carbon fiber (average fiber diameter: 12 μm)
m, average fiber length; 3 mm), manufactured by Osaka Gas Co., Ltd., trade name “Zyrus GC-03J-415” (d′-5): calcium silicate fine powder (average particle size: 8)
μm), the above (d-1) pulverized with a ball mill

Preparation of Test Piece A test piece was formed from the sample pellet by an injection molding machine having a mold clamping pressure of 80 ton / cm ² . The molding conditions were as follows: The cylinder temperature was (a-1) or (a-3).
0 ° C, 320 ° C in the case of (a-2), and the mold temperature is (a-
In the case of 1) or (a-3), the temperature is 60 ° C, and in the case of (a-2), the temperature is 130 ° C. The physical properties were measured on the test piece at room temperature of 23 ± 2 ° C. and 50% relative humidity for 24 hours, and then the following physical properties were measured. (1) Flexural strength, flexural modulus, measured according to ASTM D760. The unit in the following table is MPa. (2) Izod (IZOD) impact strength Using a notched test piece with a thickness of 1/4 inch, A
It was measured according to STM D256. The unit in the following table is J / m. (3) Volume resistivity (conductivity) It was measured as follows according to SRIS 2301. Using an injection-molded test specimen having a width of 6 x length 6 x thickness of 0.3 (cm), a conductive paint was applied to both ends of the plate as electrodes at a width of 1 cm.
After the application, the volume resistance value between both electrodes was determined. The unit in the following table is Ωcm.

(4) Moldability The moldability (comprehensive judgment of fluidity, releasability, short, sprue break, etc.) of the molded product was evaluated according to the following criteria. ◎: Very good ：: Moldable △: Moldable but stable molding operation could not be performed. ×: molding impossible

(5) Appearance (smoothness) of molded article Smoothness of molded article [deformation (distortion, warpage, sink), uneven gloss,
Comprehensive Judgment of Weld Mark, Flash Mark, Fluff, etc.] was evaluated by the following judgment criteria by visually checking the molded product. ◎: Very good ○: Usable △: Usable for general-purpose parts but unsuitable for precision parts ×: Unusable

(6) Shrinkage ratio, warpage The sample pellets were subjected to an injection molding machine having a mold clamping pressure of 220 ton / cm ² to have a width of 13 × length of 32 × thickness of 0.5 (c).
The test piece of m) was molded. The molding conditions were as follows: the cylinder temperature was 220 ° C. in the case of (a-1) or (a-3);
The mold temperature is 320 ° C. for (a-1) or (a-3), and 130 ° C. for (a-2). Specimens were placed at room temperature 23 ± 2 ° C and 50% relative humidity for 2 hours.
After adjusting for 4 hours, the test piece was measured by a three-dimensional measuring machine (BHN506) manufactured by Mitutoyo Corporation, and the result was used as the measurement result of the fabric test piece. In the case of (a-2), 5
The test piece after the time annealing treatment was also measured.
The unit of the shrinkage in the table below is 1/1000, and the unit of the warpage is%.

Examples 1 to 6 and Comparative Examples 1 to 8 (Preparation of Sample Pellets) The components (a) and (c) were preliminarily dry-blended using a tumbler mixer at the mixing ratios shown in Tables 1 to 3.
The component (d-1) or the component (d ') was cut out and poured into the molten mixture from the center of the barrel of the extruder while melting and mixing at 220 ° C. using a 47 mm co-directional twin screw extruder. . After the charging, the string-like resin melt mixture coming out of the die was cooled in a water tank, and passed through a cutter to form pellets of the conductive resin composition.
Tables 1 to 3 show these measurement results.

Examples 7 to 11 and Comparative Examples 9 to 13 (Preparation of Sample Pellets) The components (a) to (c) were preliminarily dry-blended by a tumbler mixer at the mixing ratios shown in Tables 4 to 5, and 47 mm.
The component (d-1) or the component (d ') was cut out from the center of the barrel of the extruder using a fixed-rate feeder while melt-mixing the mixture at 220 ° C. with a coaxial twin-screw extruder. After the charging, the string-like resin melt mixture coming out of the die was cooled in a water tank, and passed through a cutter to form pellets of the conductive resin composition. Tables 4 and 5 show these measurement results.

Examples 12 to 18 and Comparative Examples 14 to 33 (Preparation of sample pellets) The components (a) to (c) were preliminarily dry-blended by a tumbler mixer at the mixing ratios shown in Tables 6 to 10 to obtain a mixture of 47 m.
(m) While melt-mixing at 320 ° C. with a biaxial extruder in the same direction, the component (d-1) or the component (d ′) was cut out from the center of the barrel of the extruder and fed into the molten mixture using a fixed-quantity feeder. . After the charging, the string-like resin melt mixture coming out of the die was cooled in a water tank, and passed through a cutter to form pellets of the conductive resin composition. Tables 6 to 10 show the measurement results.

[0028]

[Table 1]

[0029]

[Table 2]

[0030]

[Table 3]

[0031]

[Table 4]

[0032]

[Table 5]

[0033]

[Table 6]

[0034]

[Table 7]

[0035]

[Table 8]

[0036]

[Table 9]

[0037]

[Table 10]

As shown in Table 1, the surfactant (c) was added to the ABS resin.
And a calcium silicate fiber (d), the antistatic conductive resin composition has a flexural modulus of 2,300 MPa.
Above was good. Also, from the comparative example in Table 2, the surfactant (c) was added in an amount of 0.1 part [0.2 parts in 100 parts of the total amount of the components (a) and (c)] to 99.9 parts.
Parts) is inferior in conductivity. On the other hand, component (a) 75
When the amount is 25 parts per part (more than 20 parts in 100 parts in total of (a) component and (c) component), shrinkage is large, dimensional stability is inferior, and a precise molded product is required. Not suitable. On the other hand, if the total amount of the calcium silicate fiber (d) is less than 3 parts based on 100 parts, the shrinkage is large, the dimensional stability is poor, and it is not suitable for obtaining a precise molded product. On the other hand, when it is more than 80 parts, the moldability and the smoothness of the surface of the molded product are inferior. Furthermore, from the comparative example of Table 5, the resin composition containing talc instead of the calcium silicate fiber (d) has a large shrinkage ratio, poor dimensional stability, and is not suitable for obtaining a precise molded product. is there. Therefore, talc does not replace the calcium silicate fiber (d) of the present invention. Also, from the comparative examples in Table 3, when the rubber-modified styrene resin (a-3) is used as the component (a) instead of the ABS resin (a-1), the flexural modulus is out of the range of the present invention ( 1,300 MPa), the rigidity is insufficient,
The molded product is deformed.

As shown in Table 4, the conductive filler (b) was added to the PPE,
The conductive resin composition blended with the surfactant (c) and the calcium silicate fiber (d) was excellent in conductive performance and had a good flexural modulus of 2,500 MPa or more. Table 5
According to the comparative example, when the calcium silicate fiber (d) is less than 3 parts with respect to the total amount of 100 parts, the shrinkage ratio is large,
It has poor dimensional stability and is not suitable for obtaining precise molded products. On the other hand, if it is more than 80 parts, the smoothness of the molded product and the surface of the molded product is poor. The resin composition containing talc instead of the calcium silicate fiber (d) has a low flexural modulus,
The shrinkage is large, the dimensional stability is poor, and it is not suitable for obtaining a precise molded product.

As shown in Table 6, the conductive resin composition obtained by blending the conductive filler (b) and the calcium silicate fiber (d) with PPE had a good flexural modulus of 3,000 MPa or more. From the comparative example in Table 7, the conductive filler (b)
However, if 98 parts of the component (a) is 2 parts [less than 3 parts in 100 parts of the total amount of the components (a) and (b)], the conductivity is poor. On the other hand, if it is 35 parts (more than 30 parts in 100 parts of the total amount of the component (a) and the component (b)) with respect to 65 parts of the component (a), the impact strength and the moldability are inferior. Further, if the total amount of the calcium silicate fiber (d) is less than 3 parts with respect to the total amount of 100 parts, the shrinkage rate of the fabric and the shrinkage rate after annealing are large, the dimensional stability is inferior, and a precision molded product, especially It is not suitable for obtaining a precise molded product (such as an IC tray) to be heat-treated. On the other hand, if it is larger than 80 parts,
Poor smoothness of the molded product and the surface of the molded product. From the comparative examples in Table 8, the resin composition containing glass fiber instead of calcium silicate fiber (d) is inferior in surface smoothness and warpage of the molded article, and the glass fiber is the calcium silicate of the present invention. It does not replace fiber (d). The resin composition containing talc in place of the calcium silicate fiber (d) had low Izod impact strength and poor molded article surface smoothness. According to the comparative example in Table 9, the resin composition containing mica instead of the calcium silicate fiber (d) had low Izod impact strength and poor surface smoothness of a molded product. In addition, the resin composition containing fine calcium silicate powder instead of the calcium silicate fiber (d) had low Izod impact strength and poor surface smoothness of a molded product. From the comparative examples of Tables 9 to 10, the resin composition in which carbon fiber and talc were blended with PPE in place of the calcium silicate fiber (d) was 5% of the total resin composition (in 100 parts). % Or less, a volume specific resistance value was not obtained and the sample had no conductivity. On the other hand, when the amount exceeds 5 parts, the surface smoothness of the molded product was poor.

[0041]

The conductive resin composition of the present invention is excellent in flexural modulus, strength, volume resistivity, moldability, molded article surface smoothness, and dimensional stability, OA equipment, home appliances, electric / electronics. Field, vehicle field, other various parts, housing,
It can be suitably used for packages and the like.

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Claims (2)

[Claims] 1. A total of 70 to 99.8 parts by weight of a thermoplastic resin (a) and 3 to 30 parts by weight of a conductive filler (b) and / or 0.2 to 20 parts by weight of a surfactant (c). A bending modulus of elasticity of 1,500 MP is obtained by mixing 3 to 80 parts by weight of calcium silicate fiber (d) having an average fiber diameter of 1 to 10 μm and an average fiber length of 8 to 70 μm with respect to 100 parts by weight.
a or more conductive resin composition. 2. A molded article obtained by molding the conductive resin composition according to claim 1.