JP2000340735A - Packaging structure of mpu - Google Patents

Packaging structure of mpu

Info

Publication number
JP2000340735A
JP2000340735A JP11147429A JP14742999A JP2000340735A JP 2000340735 A JP2000340735 A JP 2000340735A JP 11147429 A JP11147429 A JP 11147429A JP 14742999 A JP14742999 A JP 14742999A JP 2000340735 A JP2000340735 A JP 2000340735A
Authority
JP
Japan
Prior art keywords
mpu
metal housing
connector
fixed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11147429A
Other languages
Japanese (ja)
Other versions
JP3661489B2 (en
Inventor
Fumio Miyagawa
文雄 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP14742999A priority Critical patent/JP3661489B2/en
Publication of JP2000340735A publication Critical patent/JP2000340735A/en
Application granted granted Critical
Publication of JP3661489B2 publication Critical patent/JP3661489B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Abstract

PROBLEM TO BE SOLVED: To obtain the packaging structure of an MPU(microprocessing unit), which is used for low packaging the MPU in a compact size on the inner side of the metal case body of an electronic device. SOLUTION: An MPU 10, mounted on the lower surface of a flexible substrate 20 through a penetrated hole 60 provided in a printed board 40, which is arranged almost in parallel with the substrate 20 and, in such a way that the substrate 40 ia made to counterpose the substrate 20 under the lower part of the substrate 20 and is mounted with a semiconductor chip 90 on the its upper surface, is fixed on the part of a metal case body 70 of an electronic device. The substrate 20 and the board 40 are electrically connected with each other via connectors 30 and 50. The part, which is positioned between the MPU 10 and the connector 30 of the substrate 20, is bent in the vertical directions, according to the difference in height between the upper surface of the MPU 10 and the upper surface of the connector 30. A low-heat conductor 80 is embedded in the part, positioned on a side opposite to the side of the part, which is fixed with the MPU 10, of the case body 70 and on the outside of the case body 70.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、ＭＰＵ（Ｍｉｃｒ
ｏ Ｐｒｏｃｅｓｓｏｒ Ｕｉｎｔの略）を電子装置の
金属筐体内側に実装するための、ＭＰＵの実装構造に関
する。TECHNICAL FIELD The present invention relates to an MPU (Micr
o Processor abbreviated as "Processor Uint") inside the metal housing of the electronic device.

【０００２】[0002]

【従来の技術】ＭＰＵには、高集積化された電子回路が
高密度に形成されていて、その動作時の発熱量が、メモ
リチップ等と比べて、数段に大きい。そのため、電子装
置においては、そのＭＰＵが発する熱をＭＰＵ外部に効
率良く放散させる必要がある。そして、ＭＰＵが、自己
の発する熱により高熱に晒されて、誤動作したり動作不
能に陥ったりするのを防ぐ必要がある。2. Description of the Related Art A highly integrated electronic circuit is formed in an MPU at a high density, and the amount of heat generated during its operation is several steps larger than that of a memory chip or the like. Therefore, in the electronic device, it is necessary to efficiently dissipate the heat generated by the MPU to the outside of the MPU. Then, it is necessary to prevent the MPU from being exposed to high heat due to the heat generated by the MPU and malfunctioning or becoming inoperable.

【０００３】このＭＰＵが発する熱をＭＰＵ外部に効率
良く放散させる手段としては、従来より、大別して、Ｍ
ＰＵの近くに設けた冷却ファンにより、ＭＰＵ周囲に冷
却用の空気を強制循環させる方式のものと、ＭＰＵに高
熱伝導性の金属からなるヒートスプレッダを装着して、
そのヒートスプレッダにＭＰＵが発する熱を放散させる
自然対流方式のものと、さらには、ＭＰＵに装着したヒ
ートスプレッダにヒートパイプを付設して、そのヒート
パイプ中を循環する冷媒の蒸発潜熱によりヒートスプレ
ッダを介してＭＰＵを強制冷却する方式のものとがあ
る。[0003] Means for efficiently dissipating the heat generated by the MPU to the outside of the MPU are generally classified into M
With a cooling fan provided near the PU, a system for forcibly circulating cooling air around the MPU, and a heat spreader made of metal with high thermal conductivity attached to the MPU,
A natural convection type in which heat generated by the MPU is dissipated to the heat spreader; There is a type of forcible cooling.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、上記の
ＭＰＵ冷却用の、冷却ファン、ヒートスプレッダ、又は
それに加えてヒートパイプを電子装置の筐体内側に備え
た場合には、その分、それを収容した筐体の容積が増し
て、ＭＰＵが内蔵された電子装置の小型化、薄型化、軽
量化を図れなかった。このことは、特に、その薄型化、
小型化、軽量化が要求されるノート型のパソコン等の電
子装置において顕著であった。However, when the cooling fan, the heat spreader, or the heat pipe in addition to the above-mentioned MPU for cooling the MPU is provided inside the housing of the electronic apparatus, the heat pipe is accommodated accordingly. Since the volume of the housing has increased, it has not been possible to reduce the size, thickness, and weight of the electronic device incorporating the MPU. This is especially true for its thinner,
It was remarkable in electronic devices such as notebook personal computers that required reduction in size and weight.

【０００５】そこで、本発明者は、鋭意研究の結果、近
時のノート型のパソコン等の電子装置の筐体には、その
リサイクル化を図るために、樹脂と金属との組み合わせ
からなるハイブリッド筐体が用いられており、そのハイ
ブリッド筐体のＡｌ、Ａｌ合金、Ｍｇ又はＭｇ合金等か
らなる高熱伝導性の金属筐体を、上記のＭＰＵが発する
熱を放散させるヒートスプレッダに代用できることを、
発見した。また、その金属筐体をヒートスプレッダに用
いれば、筐体内側に備えるＭＰＵ冷却用のヒートスプレ
ッダや冷却ファン等を排除でき、その分、電子装置の小
型化、薄型化、軽量化を図れることを発見した。そし
て、そのハイブリッド筐体等の金属筐体をヒートスプレ
ッダに用いた、新たなＭＰＵの実装構造を開発した。Therefore, as a result of diligent research, the present inventor has recently proposed a hybrid housing made of a combination of resin and metal in order to recycle the housing of an electronic device such as a notebook-type personal computer. Body is used, the hybrid housing Al, Al alloy, a high thermal conductivity metal housing made of Mg or Mg alloy, etc., can be substituted for the heat spreader that dissipates the heat generated by the MPU,
discovered. Also, if the metal housing is used for a heat spreader, it is possible to eliminate a heat spreader for cooling the MPU provided inside the housing, a cooling fan, and the like, and thereby find that the electronic device can be reduced in size, thickness, and weight. . Then, a new MPU mounting structure using a metal housing such as the hybrid housing as a heat spreader has been developed.

【０００６】即ち、本発明は、電子装置の金属筐体をヒ
ートスプレッダに用いた、ＭＰＵの実装構造を提供する
ことを目的としている。That is, an object of the present invention is to provide an MPU mounting structure using a metal housing of an electronic device as a heat spreader.

【０００７】[0007]

【課題を解決するための手段】上記の目的を達成するた
めに、本発明の第１のＭＰＵの実装構造は、ＭＰＵが下
面に実装されたフレキシブル基板の下方に、半導体チッ
プが上面に実装されたプリント基板であって、透孔が設
けられたプリント基板が、フレキシブル基板とほぼ平行
に対向させて配置され、そのフレキシブル基板の下面と
プリント基板の上面とには、コネクタが備えられて、そ
のコネクタを介して前記フレキシブル基板とプリント基
板とが電気的に接続され、前記ＭＰＵが、前記プリント
基板の透孔を通して、その下方の電子装置の金属筐体部
分に固定されると共に、ＭＰＵとコネクタとの間に位置
する前記フレキシブル基板部分が、前記金属筐体に固定
されたＭＰＵの上面と前記プリント基板の上面側に備え
られたコネクタの上面との高低差に合わせて、上下方向
に折曲され、前記ＭＰＵが固定された金属筐体部分側と
は反対側の金属筐体部分には、低熱伝導体が埋設されて
なることを特徴としている。In order to achieve the above object, a first MPU mounting structure of the present invention comprises a semiconductor chip mounted on an upper surface below a flexible substrate on which an MPU is mounted on a lower surface. A printed circuit board provided with a through-hole, disposed substantially parallel to and opposed to the flexible board, a connector is provided on the lower surface of the flexible substrate and the upper surface of the printed circuit board, the connector is provided. The flexible board and the printed board are electrically connected via a connector, the MPU is fixed to a metal housing portion of the electronic device below the through-hole of the printed board, and the MPU and the connector are connected to each other. The flexible substrate portion located between the upper surface of the MPU fixed to the metal housing and the connector provided on the upper surface side of the printed circuit board A low heat conductor is buried in a metal housing portion opposite to the metal housing portion side to which the MPU is fixed, which is bent in the vertical direction in accordance with a height difference with respect to a surface. And

【０００８】また、上記の目的を達成するために、本発
明の第２のＭＰＵの実装構造は、半導体チップが下面に
実装されたプリント基板の下方に、ＭＰＵが下面に実装
されたフレキシブル基板が、プリント基板とほぼ平行に
対向させて配置され、そのフレキシブル基板の上面とプ
リント基板の下面とには、コネクタが備えられて、その
コネクタを介して前記プリント基板とフレキシブル基板
とが電気的に接続され、前記ＭＰＵが、その下方の電子
装置の金属筐体部分に固定されると共に、ＭＰＵとコネ
クタとの間に位置する前記フレキシブル基板部分が、前
記金属筐体に固定されたＭＰＵの上面と前記プリント基
板の下面側に備えられたコネクタの下面との高低差に合
わせて、上下方向に折曲され、前記ＭＰＵが固定された
金属筐体部分側とは反対側の金属筐体外側部分には、低
熱伝導体が埋設されてなることを特徴としている。In order to achieve the above object, a second MPU mounting structure of the present invention comprises a flexible substrate having an MPU mounted on a lower surface below a printed circuit board having a semiconductor chip mounted on the lower surface. The upper surface of the flexible substrate and the lower surface of the printed circuit board are provided with connectors, and the printed circuit board and the flexible substrate are electrically connected via the connectors. The MPU is fixed to a metal housing portion of the electronic device below the MPU, and the flexible substrate portion located between the MPU and the connector has an upper surface of the MPU fixed to the metal housing and the upper surface of the MPU. A metal housing part side is bent in the vertical direction in accordance with the height difference with the lower surface of the connector provided on the lower surface side of the printed circuit board, and the MPU is fixed. The metal housing outer portion of the opposite side, is characterized by low thermal conductor is formed by burying.

【０００９】この第１又は第２のＭＰＵの実装構造にお
いては、ＭＰＵが固定された高熱伝導性の金属筐体に、
ＭＰＵが発する熱を効率良く放散させることができる。In the mounting structure of the first or second MPU, a high thermal conductive metal housing to which the MPU is fixed is provided with:
The heat generated by the MPU can be efficiently dissipated.

【００１０】また、ＭＰＵが固定された金属筐体部分側
とは反対側の金属筐体外側部分には、低熱伝導体が埋設
されているため、ＭＰＵが発する熱を、該ＭＰＵが固定
された金属筐体部分であって、ＭＰＵと低熱伝導体との
間に挟まれた金属筐体部分を通して、その金属筐体部分
に連なる金属筐体に広く分散させて放散させることがで
きる。そして、ＭＰＵが接合された金属筐体部分に、Ｍ
ＰＵが発する熱が集中するのを防ぐことができる。それ
と共に、ＭＰＵが固定された金属筐体部分であって、Ｍ
ＰＵが発する熱で加熱された金属筐体部分の熱が、その
金属筐体部分側とは反対側の金属筐体外側部分に埋設さ
れた低熱伝導体に伝わり難くできる。そして、その低熱
伝導体が埋設された筐体外側部分が高温となるのを防い
で、その筐体外側部分に手を触れた者が火傷等を負うの
を防ぐことができる。In addition, since the low heat conductor is embedded in the outer portion of the metal housing opposite to the metal housing portion to which the MPU is fixed, heat generated by the MPU is fixed. Through the metal housing portion, which is sandwiched between the MPU and the low thermal conductor, the metal housing portion can be widely dispersed and radiated to the metal housing connected to the metal housing portion. Then, M is attached to the metal housing portion to which the MPU is joined.
The heat generated by the PU can be prevented from being concentrated. At the same time, the MPU is a fixed metal housing part,
The heat of the metal housing portion heated by the heat generated by the PU can be less likely to be transmitted to the low thermal conductor embedded in the outer portion of the metal housing opposite to the metal housing portion. Then, it is possible to prevent the outside portion of the housing in which the low thermal conductor is embedded from becoming high in temperature, thereby preventing a person who touches the outside portion of the housing from being burned.

【００１１】第１のＭＰＵの実装構造にあっては、ＭＰ
Ｕが、プリント基板に設けられた透孔を通して、その下
方の金属筐体部分に固定されているため、そのプリント
基板に設けられた透孔の内側空間を有効利用して、プリ
ント基板の厚さ分、ＭＰＵを金属筐体内側にコンパクト
に丈低く収容できる。In the mounting structure of the first MPU, the MP
Since U is fixed to the metal housing portion below through the through hole provided in the printed circuit board, the inside space of the through hole provided in the printed circuit board is effectively used, and the thickness of the printed circuit board is reduced. Therefore, the MPU can be housed compactly and low inside the metal housing.

【００１２】また、金属筐体に固定されたＭＰＵの上面
とコネクタの上面との高低差に合わせて、そのＭＰＵと
コネクタとの間に位置するフレキシブル基板部分を上下
方向に折曲させることができる。そして、そのフレキシ
ブル基板とコネクタとを介して、ＭＰＵをプリント基板
に容易かつ的確に電気的に接続できる。Further, the flexible board portion located between the MPU and the connector can be vertically bent in accordance with the height difference between the upper surface of the MPU fixed to the metal housing and the upper surface of the connector. . Then, the MPU can be easily and accurately electrically connected to the printed board via the flexible board and the connector.

【００１３】第２のＭＰＵの実装構造にあっては、プリ
ント基板とフレキシブル基板とを電気的に接続するコネ
クタが備えられたプリント基板と金属筐体との間の内側
空間を有効利用して、その内側空間にＭＰＵをコンパク
トに丈低く収容できる。[0013] In the mounting structure of the second MPU, the inner space between the printed circuit board provided with a connector for electrically connecting the printed circuit board and the flexible board and the metal housing is effectively used. The MPU can be stored compactly and low in the inner space.

【００１４】また、金属筐体に固定されたＭＰＵの上面
とコネクタの下面との高低差に合わせて、そのＭＰＵと
コネクタとの間に位置するフレキシブル基板部分を上下
方向に折曲させることができる。そして、そのフレキシ
ブル基板とコネクタとを介して、ＭＰＵをプリント基板
に容易かつ的確に電気的に接続できる。Further, the flexible board portion located between the MPU and the connector can be vertically bent in accordance with the height difference between the upper surface of the MPU fixed to the metal housing and the lower surface of the connector. . Then, the MPU can be easily and accurately electrically connected to the printed board via the flexible board and the connector.

【００１５】本発明の第１又は第２のＭＰＵの実装構造
においては、前記フレキシブル基板が、ポリイミド樹脂
からなることを好適としている。In the first or second MPU mounting structure of the present invention, it is preferable that the flexible substrate is made of a polyimide resin.

【００１６】この第１又は第２のＭＰＵの実装構造にあ
っては、柔軟性のあるポリイミド樹脂を用いて、上下方
向に容易に折曲可能なフレキシブル基板を形成できる。In the mounting structure of the first or second MPU, a flexible substrate which can be easily bent in the vertical direction can be formed by using a flexible polyimide resin.

【００１７】また、本発明の第１又は第２のＭＰＵの実
装構造においては、前記ＭＰＵが固定された金属筐体
が、Ａｌ、Ａｌ合金、Ｍｇ又はＭｇ合金からなることを
好適としている。In the first or second MPU mounting structure of the present invention, it is preferable that the metal housing to which the MPU is fixed is made of Al, Al alloy, Mg or Mg alloy.

【００１８】この第１又は第２のＭＰＵの実装構造にあ
っては、そのＡｌ、Ａｌ合金、Ｍｇ又はＭｇ合金からな
る高熱伝導性の金属筐体に、ＭＰＵが発する熱を効率良
く放散させることができる。また、そのＡｌ、Ａｌ合
金、Ｍｇ又はＭｇ合金からなる金属筐体を再溶融させる
等して、他の電子装置の筐体に再利用できる。In the mounting structure of the first or second MPU, the heat generated by the MPU is efficiently dissipated into the highly thermally conductive metal housing made of Al, Al alloy, Mg or Mg alloy. Can be. Further, the metal casing made of Al, Al alloy, Mg or Mg alloy can be reused for the casing of another electronic device by re-melting the casing.

【００１９】[0019]

【発明の実施の形態】次に、本発明の実施の形態を図面
に従い説明する。図１は本発明の第１のＭＰＵの実装構
造の好適な実施の形態を示し、図１はその構造説明図で
ある。以下に、この第１のＭＰＵの実装構造を説明す
る。Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a preferred embodiment of the mounting structure of the first MPU of the present invention, and FIG. 1 is an explanatory view of the structure. Hereinafter, a mounting structure of the first MPU will be described.

【００２０】図の第１のＭＰＵの実装構造では、ＭＰＵ
１０が、Ｃｕ等からなる配線回路（図示せず）が備えら
れたフレキシブル基板２０の一方の端部の下面にフリッ
プチップボンディング法等により実装されている。フレ
キシブル基板２０の他方の端部の下面には、該フレキシ
ブル基板の配線回路に接続された雄又は雌のコネクタ３
０が備えられている。フレキシブル基板２０は、柔軟な
ポリイミド樹脂等から形成されていて、上下方向に容易
に折曲可能な構造をしている。In the first MPU mounting structure shown in FIG.
10 is mounted on the lower surface of one end of a flexible substrate 20 provided with a wiring circuit (not shown) made of Cu or the like by a flip chip bonding method or the like. On the lower surface of the other end of the flexible substrate 20, a male or female connector 3 connected to a wiring circuit of the flexible substrate is provided.
0 is provided. The flexible substrate 20 is formed of a flexible polyimide resin or the like, and has a structure that can be easily bent in the vertical direction.

【００２１】フレキシブル基板２０の下方には、メモリ
やＭＰＵのチップセット等を構成する半導体チップ９０
が上面に実装されたＣｕ等からなる配線回路が備えられ
たプリント基板４０が、フレキシブル基板２０とほぼ平
行に対向させて配置されている。プリント基板４０に
は、ＭＰＵ１０を挿通可能な透孔６０が設けられてい
る。プリント基板４０は、樹脂から形成されていて、リ
ジッドな構造をしている。フレキシブル基板２０に備え
られた上記のコネクタ３０に対向するプリント基板４０
の上面部分には、上記のコネクタ３０に継合可能な雌又
は雄のコネクタ５０であって、プリント基板４０の配線
回路に接続されたコネクタ５０が備えられている。そし
て、その雌雄のコネクタ３０、５０を介して、フレキシ
ブル基板２０とプリント基板４０とが電気的に接続され
ている。A semiconductor chip 90 constituting a memory, an MPU chip set, or the like is provided below the flexible substrate 20.
A printed circuit board 40 provided with a wiring circuit made of Cu or the like, which is mounted on the upper surface, is arranged substantially parallel to and opposed to the flexible substrate 20. The printed board 40 is provided with a through hole 60 through which the MPU 10 can be inserted. The printed circuit board 40 is formed from a resin and has a rigid structure. Printed circuit board 40 facing the connector 30 provided on the flexible board 20
On the upper surface portion, there is provided a female or male connector 50 connectable to the connector 30 and connected to a wiring circuit of the printed circuit board 40. The flexible board 20 and the printed board 40 are electrically connected via the male and female connectors 30 and 50.

【００２２】フレキシブル基板２０の一方の端部の下面
に実装されたＭＰＵ１０は、プリント基板４０に設けら
れた透孔６０を通して、その下方の電子装置の金属筐体
７０部分に接着剤等を用いて固定されている。金属筐体
７０は、Ａｌ、Ａｌ合金、Ｍｇ又はＭｇ合金等から形成
されていて、他の電子装置の筐体に再利用可能な構造を
している。The MPU 10 mounted on the lower surface of one end of the flexible substrate 20 passes through a through hole 60 provided in the printed circuit board 40, and is attached to the metal housing 70 of the electronic device below it using an adhesive or the like. Fixed. The metal housing 70 is formed of Al, an Al alloy, Mg, or an Mg alloy, and has a structure that can be reused for housings of other electronic devices.

【００２３】ＭＰＵ１０とコネクタ３０との間に位置す
るフレキシブル基板２０部分は、金属筐体７０に固定さ
れたＭＰＵ１０の上面とプリント基板４０の上面側に備
えられた継合された状態の雌雄のコネクタ３０、５０の
上面との高低差に合わせて、図１に２点鎖線で示したよ
うな、平面状態から、図１に実線で示したように、緩や
かな段差を持たせて上下方向に折曲されている。そし
て、そのフレキシブル基板２０と雌雄のコネクタ３０、
５０とを介して、ＭＰＵ１０がプリント基板４０に電気
的に接続されている。A portion of the flexible board 20 located between the MPU 10 and the connector 30 is provided with a spliced male and female connector provided on the upper surface of the MPU 10 fixed to the metal housing 70 and the upper surface of the printed circuit board 40. In accordance with the height difference between the upper and lower surfaces 30 and 50, from the planar state as shown by the two-dot chain line in FIG. 1, as shown by the solid line in FIG. Has been tuned. Then, the flexible board 20 and the male and female connectors 30,
The MPU 10 is electrically connected to the printed circuit board 40 through the connection 50.

【００２４】ＭＰＵ１０が固定された金属筐体７０部分
とは反対側の金属筐体７０外側部分には、低熱伝導性の
樹脂等からなる低熱伝導体８０が埋設されている。そし
て、ＭＰＵ１０が発する熱が、金属筐体７０を通して、
低熱伝導体８０が埋設された筐体外側部分に伝わりにく
いように構成されている。A low heat conductor 80 made of a low heat conductive resin or the like is embedded in an outer portion of the metal housing 70 opposite to the metal housing 70 to which the MPU 10 is fixed. Then, the heat generated by the MPU 10 passes through the metal housing 70,
It is configured such that the low thermal conductor 80 is not easily transmitted to the outer portion of the housing in which the low thermal conductor 80 is embedded.

【００２５】図１に示した第１のＭＰＵの実装構造は、
以上のように構成されていて、この第１のＭＰＵの実装
構造においては、ＭＰＵ１０が固定された高熱伝導性の
金属筐体７０に、ＭＰＵ１０が発する熱を効率良く放散
させることができる。The mounting structure of the first MPU shown in FIG.
With the configuration as described above, in the first MPU mounting structure, the heat generated by the MPU 10 can be efficiently dissipated to the highly thermally conductive metal housing 70 to which the MPU 10 is fixed.

【００２６】また、ＭＰＵ１０が発する熱を、ＭＰＵ１
０と低熱伝導体８０との間に挟まれた金属筐体７０部分
を通して、金属筐体７０に広く分散させて放散させるこ
とができる。そして、ＭＰＵ１０が固定された金属筐体
７０部分に、ＭＰＵ１０が発する熱が集中するのを防ぐ
ことができる。それと共に、ＭＰＵ１０が固定された金
属筐体７０部分であって、ＭＰＵ１０が発する熱で加熱
された金属筐体７０部分の熱が、その金属筐体７０部分
側とは反対側の低熱伝導体８０が埋設された筐体外側部
分に伝わり難くできる。そして、その低熱伝導体８０が
埋設された筐体外側部分が高熱となるのを防ぐことがで
きる。The heat generated by the MPU 10 is transferred to the MPU 1
Through the portion of the metal housing 70 sandwiched between the zero and the low thermal conductor 80, the metal housing 70 can be widely dispersed and diffused. Then, it is possible to prevent the heat generated by the MPU 10 from being concentrated on the portion of the metal housing 70 to which the MPU 10 is fixed. At the same time, the heat of the metal housing 70 portion to which the MPU 10 is fixed and which is heated by the heat generated by the MPU 10 is applied to the low heat conductor 80 on the side opposite to the metal housing 70 portion side. Can be hardly transmitted to the outer part of the buried housing. Then, it is possible to prevent the outside portion of the housing in which the low thermal conductor 80 is buried from becoming hot.

【００２７】また、プリント基板４０に設けられた透孔
６０の内側空間を有効利用して、プリント基板４０の厚
さ分、ＭＰＵ１０を金属筐体７０内側にコンパクトに丈
低く収容できる。Further, by effectively utilizing the space inside the through hole 60 provided in the printed board 40, the MPU 10 can be compactly housed inside the metal housing 70 by the thickness of the printed board 40.

【００２８】また、金属筐体７０に固定されたＭＰＵ１
０の上面と継合された状態の雌雄のコネクタ３０、５０
の上面との高低差に合わせて、そのＭＰＵ１０と雌雄の
コネクタ３０、５０との間に位置するフレキシブル基板
２０部分を、上下方向に折曲させることができる。そし
て、そのフレキシブル基板２０と雌雄のコネクタ３０、
５０とを介して、ＭＰＵ１０をプリント基板４０に容易
かつ的確に電気的に接続できる。The MPU 1 fixed to the metal housing 70
0 and male and female connectors 30 and 50 joined to the upper surface
The portion of the flexible board 20 located between the MPU 10 and the male and female connectors 30 and 50 can be bent in the vertical direction according to the height difference from the upper surface of the MPU 10. Then, the flexible board 20 and the male and female connectors 30,
The MPU 10 can be easily and accurately electrically connected to the printed circuit board 40 through the connection 50.

【００２９】図２は本発明の第２のＭＰＵの実装構造の
好適な実施の形態を示し、図２はその構造説明図であ
る。以下に、この第２のＭＰＵの実装構造を説明する。FIG. 2 shows a preferred embodiment of the mounting structure of the second MPU of the present invention, and FIG. 2 is an explanatory view of the structure. Hereinafter, the mounting structure of the second MPU will be described.

【００３０】図の第２のＭＰＵの実装構造では、メモリ
やＭＰＵのチップセット等を構成する半導体チップ９０
が、Ｃｕ等からなる配線回路（図示せず）が備えられた
樹脂等からなるプリント基板４０の下面に実装されてい
る。プリント基板４０は、リジッドな構造をしている。In the second MPU mounting structure shown in the figure, a semiconductor chip 90 constituting a memory, an MPU chip set, or the like is used.
Are mounted on the lower surface of a printed circuit board 40 made of resin or the like provided with a wiring circuit (not shown) made of Cu or the like. The printed board 40 has a rigid structure.

【００３１】プリント基板４０の下方には、Ｃｕ等から
なる配線回路（図示せず）が備えられたポリイミド樹脂
等からなるフレキシブル基板２０が、プリント基板４０
とほぼ平行に対向させて配置されている。フレキシブル
基板２０の一方の端部の下面には、ＭＰＵ１０が実装さ
れている。フレキシブル基板２０の他方の端部の上面に
は、該フレキシブル基板の配線回路に接続された雄又は
雌のコネクタ３０が備えられている。Below the printed board 40, a flexible board 20 made of polyimide resin or the like provided with a wiring circuit (not shown) made of Cu or the like is provided.
And are arranged substantially parallel to each other. The MPU 10 is mounted on the lower surface of one end of the flexible substrate 20. On the upper surface of the other end of the flexible board 20, a male or female connector 30 connected to a wiring circuit of the flexible board is provided.

【００３２】フレキシブル基板２０の他方の端部の上面
に備えられた雄又は雌のコネクタ３０に対向するプリン
ト基板４０の下面部分には、そのコネクタ３０に継合可
能な雌又は雄のコネクタ５０であって、プリント基板４
０の配線回路に接続されたコネクタ５０が備えられてい
る。そして、その雌雄のコネクタ３０、５０を介して、
フレキシブル基板２０とプリント基板４０とが電気的に
接続されている。On the lower surface of the printed circuit board 40 facing the male or female connector 30 provided on the upper surface of the other end of the flexible substrate 20, a female or male connector 50 connectable to the connector 30 is provided. Oh, printed circuit board 4
0 is provided with a connector 50 connected to the wiring circuit. Then, through the male and female connectors 30, 50,
The flexible board 20 and the printed board 40 are electrically connected.

【００３３】フレキシブル基板２０に実装されたＭＰＵ
１０は、その下方の金属筐体７０部分に接着剤等を用い
て固定されている。そして、ＭＰＵ１０が発する熱を、
金属筐体７０に効率良く放散させることができるように
構成されている。金属筐体７０は、Ａｌ、Ａｌ合金、Ｍ
ｇ又はＭｇ合金等から形成されていて、他の電子装置の
筐体に再利用可能な構造をしている。MPU mounted on flexible substrate 20
Numeral 10 is fixed to the metal housing 70 below it using an adhesive or the like. And the heat generated by the MPU 10
It is configured so that it can be efficiently radiated to the metal housing 70. The metal housing 70 is made of Al, Al alloy, M
It is made of a g or Mg alloy or the like, and has a structure that can be reused for the housing of another electronic device.

【００３４】ＭＰＵ１０とコネクタ３０との間に位置す
るフレキシブル基板２０部分は、金属筐体７０に固定さ
れたＭＰＵ１０の上面とプリント基板２０の下面側に備
えられた継合された状態の雌雄のコネクタ３０、５０の
下面との高低差に合わせて、緩やかな段差を持たせて上
下方向に折曲されている。そして、ＭＰＵ１０とプリン
ト基板４０とが、フレキシブル基板２０と雌雄のコネク
タ３０、５０とを介して、プリント基板４０に電気的に
接続されている。A portion of the flexible substrate 20 located between the MPU 10 and the connector 30 is provided with a male and female connector in a joined state provided on the upper surface of the MPU 10 fixed to the metal housing 70 and the lower surface of the printed circuit board 20. It is bent up and down with a gentle step in accordance with the height difference between the lower surfaces of the panels 30 and 50. The MPU 10 and the printed board 40 are electrically connected to the printed board 40 via the flexible board 20 and the male and female connectors 30 and 50.

【００３５】ＭＰＵ１０が固定された金属筐体７０部分
側とは反対側の金属筐体７０外側部分には、低熱伝導性
の樹脂等からなる低熱伝導体８０が埋設されている。そ
して、ＭＰＵ１０が発する熱が、金属筐体７０を通し
て、低熱伝導体８０が埋設された筐体外側部分に伝わり
にくいように構成されている。A low heat conductor 80 made of a low heat conductive resin or the like is embedded in an outer portion of the metal housing 70 opposite to the metal housing 70 to which the MPU 10 is fixed. The heat generated by the MPU 10 is configured to be hardly transmitted through the metal housing 70 to the outer portion of the housing in which the low thermal conductor 80 is embedded.

【００３６】図２に示した第２のＭＰＵの実装構造は、
以上のように構成されていて、この第２のＭＰＵの実装
構造においては、ＭＰＵ１０が発する熱を、ＭＰＵ１０
が固定された高熱伝導性の金属筐体７０に効率良く放散
させることができる。The mounting structure of the second MPU shown in FIG.
With the configuration as described above, in the second MPU mounting structure, the heat generated by the MPU 10 is
Can be efficiently dissipated to the metal case 70 with high thermal conductivity to which is fixed.

【００３７】また、ＭＰＵ１０が発する熱を、ＭＰＵ１
０と低熱伝導体８０との間に挟まれた金属筐体７０部分
を通して、その金属筐体７０部分に連なる金属筐体７０
に広く分散させて放散させることができる。そして、Ｍ
ＰＵ１０が固定された金属筐体７０部分に、ＭＰＵ１０
が発する熱が集中するのを防ぐことができる。それと共
に、ＭＰＵ１０が固定された金属筐体７０部分であっ
て、ＭＰＵ１０が発する熱で加熱された金属筐体７０部
分の熱が、その金属筐体７０部分側とは反対側の低熱伝
導体８０が埋設された筐体外側部分に伝わり難くでき
る。そして、その筐体外側部分が高熱となるのを防ぐこ
とができる。The heat generated by the MPU 10 is transferred to the MPU 1
0 through the metal housing 70 sandwiched between the low heat conductor 80 and the metal housing 70 connected to the metal housing 70
Can be widely dispersed and diffused. And M
The MPU 10 is fixed to the metal housing 70 to which the PU 10 is fixed.
Can be prevented from being concentrated. At the same time, the heat of the metal housing 70 portion to which the MPU 10 is fixed and which is heated by the heat generated by the MPU 10 is applied to the low heat conductor 80 on the side opposite to the metal housing 70 portion side. Can be hardly transmitted to the outer part of the buried housing. Then, it is possible to prevent the outside portion of the housing from becoming hot.

【００３８】また、フレキシブル基板２０とプリント基
板４０とを電気的に接続する雌雄のコネクタ３０、５０
が備えられたプリント基板４０と金属筐体７０との間の
内側空間を有効利用して、その内側空間にＭＰＵ１０を
コンパクトに丈低く収容できる。Further, male and female connectors 30 and 50 for electrically connecting the flexible board 20 and the printed board 40 are provided.
The MPU 10 can be housed compactly and low in the inner space by effectively utilizing the inner space between the printed board 40 and the metal housing 70 provided with.

【００３９】また、金属筐体７０に固定されたＭＰＵ１
０の上面とフレキシブル基板２０の上面側に備えられた
継合された状態の雌雄のコネクタ３０、５０の下面との
高低差に合わせて、ＭＰＵ１０と雌雄のコネクタ３０、
５０との間に位置するフレキシブル基板２０部分を、上
下方向に折曲させることができる。そして、そのフレキ
シブル基板２０と雌雄のコネクタ３０、５０とを介し
て、ＭＰＵ１０をプリント基板４０に容易かつ的確に電
気的に接続できる。The MPU 1 fixed to the metal housing 70
0, and the MPU 10 and the male and female connectors 30, according to the height difference between the upper and lower surfaces of the spliced male and female connectors 30 and 50 provided on the upper surface side of the flexible substrate 20.
The portion of the flexible substrate 20 located between the first and second flexible substrates 50 can be bent in the vertical direction. The MPU 10 can be easily and accurately electrically connected to the printed circuit board 40 via the flexible board 20 and the male and female connectors 30 and 50.

【００４０】図１又は図２に示した第１又は第２のＭＰ
Ｕの実装構造では、ＭＰＵ１０がベア状態でフレキシブ
ル基板２０に実装されているが、本発明の第１又は第２
のＭＰＵの実装構造においては、フレキシブル基板２０
にＭＰＵ１０をパッケージに収納した状態で実装しても
良い。その場合も、図１又は図２に示した第１又は第２
のＭＰＵの実装構造とほぼ同様な作用を持つＭＰＵの実
装構造を提供できる。The first or second MP shown in FIG. 1 or FIG.
In the U mounting structure, the MPU 10 is mounted on the flexible substrate 20 in a bare state.
In the mounting structure of the MPU, the flexible substrate 20
The MPU 10 may be mounted in a state where it is housed in a package. Also in that case, the first or second shown in FIG. 1 or FIG.
The MPU mounting structure having substantially the same operation as the MPU mounting structure can be provided.

【００４１】また、図１又は図２に示した第１又は第２
のＭＰＵの実装構造は、筐体全体が高熱伝導性の金属か
ら形成された電子装置にも利用可能である。その場合
も、図１又は図２に示した第１又は第２のＭＰＵの実装
構造とほぼ同様な作用を持つＭＰＵの実装構造を提供で
きる。Further, the first or second shown in FIG. 1 or FIG.
The MPU mounting structure described above can also be used for an electronic device in which the entire housing is formed of a metal having high thermal conductivity. Also in this case, it is possible to provide an MPU mounting structure having substantially the same operation as the first or second MPU mounting structure shown in FIG. 1 or FIG.

【００４２】[0042]

【発明の効果】以上説明したように、本発明の第１又は
第２のＭＰＵの実装構造によれば、電子装置の外側を覆
うハイブリッド筐体等の高熱伝導性の金属筐体を、ＭＰ
Ｕが発する熱を放散させるヒートスプレッダに用いて、
その金属筐体にＭＰＵが発する熱を効率良く放散させる
ことができる。As described above, according to the mounting structure of the first or second MPU of the present invention, a metal housing having high thermal conductivity such as a hybrid housing that covers the outside of the electronic device can be mounted on the MPM.
Using the heat spreader to dissipate the heat generated by U,
The heat generated by the MPU can be efficiently dissipated in the metal housing.

【００４３】また、ＭＰＵが発する熱を放散させるヒー
トスプレッダを、電子装置の金属筐体で代用して、ヒー
トスプレッダや放熱ファン等を電子装置のハイブリッド
筐体等の金属筐体の内側空間に備える必要をなくすこと
ができる。そして、その金属筐体の内側空間にヒートス
プレッダや放熱ファン等を備えない分、電子装置の小型
化、薄型化、軽量化を図れる。Also, it is necessary to provide a heat spreader for dissipating the heat generated by the MPU in a space inside a metal housing such as a hybrid housing of the electronic device, instead of a metal housing of the electronic device. Can be eliminated. Since the heat spreader, the heat radiating fan, and the like are not provided in the space inside the metal housing, the electronic device can be reduced in size, thickness, and weight.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１のＭＰＵの実装構造の概略構造説
明図である。FIG. 1 is a schematic structural explanatory view of a mounting structure of a first MPU of the present invention.

【図２】本発明の第２のＭＰＵの実装構造の概略構造説
明図である。FIG. 2 is a schematic structural explanatory view of a mounting structure of a second MPU of the present invention.

【符号の説明】[Explanation of symbols]

１０ ＭＰＵ ２０ フレキシブル基板 ３０ 雄又は雌のコネクタ ４０ プリント基板 ５０ 雌又は雄のコネクタ ６０ プリント基板に設けられた透孔 ７０ 金属筐体 ８０ 低熱伝導体 ９０ 半導体チップ DESCRIPTION OF SYMBOLS 10 MPU 20 Flexible board 30 Male or female connector 40 Printed board 50 Female or male connector 60 Through-hole provided in printed board 70 Metal housing 80 Low thermal conductor 90 Semiconductor chip

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 ＭＰＵが下面に実装されたフレキシブル
基板の下方に、半導体チップが上面に実装されたプリン
ト基板であって、透孔が設けられたプリント基板が、フ
レキシブル基板とほぼ平行に対向させて配置され、その
フレキシブル基板の下面とプリント基板の上面とには、
コネクタが備えられて、そのコネクタを介して前記フレ
キシブル基板とプリント基板とが電気的に接続され、前
記ＭＰＵが、前記プリント基板の透孔を通して、その下
方の電子装置の金属筐体部分に固定されると共に、ＭＰ
Ｕとコネクタとの間に位置する前記フレキシブル基板部
分が、前記金属筐体に固定されたＭＰＵの上面と前記プ
リント基板の上面側に備えられたコネクタの上面との高
低差に合わせて、上下方向に折曲され、前記ＭＰＵが固
定された金属筐体部分側とは反対側の金属筐体外側部分
には、低熱伝導体が埋設されてなることを特徴とするＭ
ＰＵの実装構造。1. A printed circuit board on which a semiconductor chip is mounted on an upper surface, wherein a printed circuit board provided with a through hole is disposed substantially parallel to the flexible substrate below a flexible substrate on which an MPU is mounted on a lower surface. And the lower surface of the flexible substrate and the upper surface of the printed circuit board,
A connector is provided, the flexible board and the printed board are electrically connected via the connector, and the MPU is fixed to a metal housing portion of the electronic device below the through-hole of the printed board. And MP
The flexible board portion located between the U and the connector is vertically oriented in accordance with the height difference between the upper surface of the MPU fixed to the metal housing and the upper surface of the connector provided on the upper surface side of the printed circuit board. And a low heat conductor is embedded in an outer portion of the metal housing opposite to the side of the metal housing to which the MPU is fixed.
PU mounting structure. 【請求項２】 半導体チップが下面に実装されたプリン
ト基板の下方に、ＭＰＵが下面に実装されたフレキシブ
ル基板が、プリント基板とほぼ平行に対向させて配置さ
れ、そのフレキシブル基板の上面とプリント基板の下面
とには、コネクタが備えられて、そのコネクタを介して
前記プリント基板とフレキシブル基板とが電気的に接続
され、前記ＭＰＵが、その下方の電子装置の金属筐体部
分に固定されると共に、ＭＰＵとコネクタとの間に位置
する前記フレキシブル基板部分が、前記金属筐体に固定
されたＭＰＵの上面と前記プリント基板の下面側に備え
られたコネクタの下面との高低差に合わせて、上下方向
に折曲され、前記ＭＰＵが固定された金属筐体部分側と
は反対側の金属筐体外側部分には、低熱伝導体が埋設さ
れてなることを特徴とするＭＰＵの実装構造。2. A flexible substrate having an MPU mounted on a lower surface thereof is disposed substantially below a printed substrate on which a semiconductor chip is mounted on a lower surface so as to be substantially parallel to and opposed to the printed substrate. A connector is provided on the lower surface of the electronic device, and the printed circuit board and the flexible substrate are electrically connected via the connector. The MPU is fixed to a metal housing portion of the electronic device below the printed circuit board. The flexible substrate portion located between the MPU and the connector is vertically moved in accordance with the height difference between the upper surface of the MPU fixed to the metal housing and the lower surface of the connector provided on the lower surface side of the printed circuit board. The low heat conductor is buried in an outer portion of the metal housing opposite to the metal housing portion side to which the MPU is fixed in a bent direction. MPU mounting structure. 【請求項３】 前記フレキシブル基板が、ポリイミド樹
脂からなる請求項１又は２記載のＭＰＵの実装構造。3. The MPU mounting structure according to claim 1, wherein said flexible substrate is made of a polyimide resin. 【請求項４】 前記ＭＰＵが固定された金属筐体が、Ａ
ｌ、Ａｌ合金、Ｍｇ又はＭｇ合金からなる請求項１、２
又は３記載のＭＰＵの実装構造。4. A metal housing to which the MPU is fixed,
1, 1 or 2, made of Al alloy, Mg or Mg alloy.
Or the mounting structure of the MPU according to 3.
JP14742999A 1999-05-27 1999-05-27 MPU mounting structure Expired - Fee Related JP3661489B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14742999A JP3661489B2 (en) 1999-05-27 1999-05-27 MPU mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14742999A JP3661489B2 (en) 1999-05-27 1999-05-27 MPU mounting structure

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Publication Number Publication Date
JP2000340735A true JP2000340735A (en) 2000-12-08
JP3661489B2 JP3661489B2 (en) 2005-06-15

Family

ID=15430128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14742999A Expired - Fee Related JP3661489B2 (en) 1999-05-27 1999-05-27 MPU mounting structure

Country Status (1)

Country Link
JP (1) JP3661489B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109688724A (en) * 2017-10-18 2019-04-26 美光科技公司 Semiconductor device assemblies and the method for forming the semiconductor device assemblies

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109688724A (en) * 2017-10-18 2019-04-26 美光科技公司 Semiconductor device assemblies and the method for forming the semiconductor device assemblies

Also Published As

Publication number Publication date
JP3661489B2 (en) 2005-06-15

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