JPH11186771A - Circuit module and information processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve heat dissipation efficiency by mounting a processor in the state of a bare chip, in a cavity part of a printed board, bonding one surface of the bare chip to one surface of a heat pipe, and installing a heat dissipation part on the end portion of the heat pipe. SOLUTION: A cavity part is formed in a circuit module 2 and a circuit module substrate 101. A processor in a state of a bare chip 20 is mounted in the cavity part. The bare chip 20 is electrically connected with the circuit module substrate 101 through bonding wires 104. Further, main components such as a cache submodule 40, a system controller 30 and a connector 90 for interface are mounted on the circuit module substrate 101. One surface of the bare chip 20 mounted on the circuit module substrate 101 is bonded to one surface of a heat pipe 103, and a heat dissipation part is installed on the end portion of the heat pipe 103. Thereby heat dissipation efficiency can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure suitable for an information processing apparatus such as a personal computer, and more particularly to an information processing apparatus which achieves both improvement in heat radiation efficiency and miniaturization.

[0002]

2. Description of the Related Art Information processing apparatuses such as personal computers are required to have higher processing speeds and smaller housings. In order to satisfy these demands and to make it easier to upgrade the CPU, the CPU tends to be modularized. Large-scale semiconductor devices including a CPU have increased power consumption due to the increase in processing speed and the like, and accordingly the amount of heat generated has also increased. Even when a semiconductor element that generates a large amount of heat is modularized, it is required to radiate heat from the semiconductor element. Japanese Patent Application Laid-Open No. HEI 5-110277 (corresponding to US Pat. No. 5,315,15) discloses a heat radiation structure when a CPU is modularized.
No. 482).

[0003]

However, in the above-mentioned prior art, components are mounted on both sides of a circuit module, or heat radiating fins or a thick metal plate are attached. Inadequate consideration.

[0004] In addition, there is insufficient consideration for efficient heat dissipation when mounted on a personal computer.

As a technique for solving these problems, the applicant has previously filed Japanese Patent Application No. 9-10954, in which a component is mounted on only one side of a printed circuit board and a metal plate is mounted on a surface on which the component is not mounted. Have proposed a CPU module having a heat dissipation structure for cooling by bonding together.

The purpose of the present application is to further improve the technology disclosed in Japanese Patent Application No. 9-10954 filed earlier and to provide a metal plate.
It is an object of the present invention to provide a circuit module capable of sufficiently dispersing heat generated by a semiconductor element and dissipating heat on average even when the thickness of the (radiator) is reduced.

That is, an object of the present invention is to provide a circuit module which can further meet the demand for miniaturization.

It is another object of the present invention to provide a thin information processing device with good heat radiation efficiency, which is devised in mounting the circuit module.

[0009]

In order to solve the above-mentioned problems, for example, a processor, a connector electrically connected to the outside, and a system control circuit for controlling transmission and reception of signals between the processor and the connector are provided. ,
In a circuit module including the processor, the connector, and a printed circuit board on which the system control circuit is mounted, a heat pipe bonded to the printed circuit board on one surface and having the other surface substantially flat is provided.
A cavity is formed in the printed circuit board, the processor is mounted in the cavity in a bare chip state, one surface of the bare chip is joined to one surface of the heat pipe, and a heat radiating portion is provided at an end of the heat pipe. Provided.

[0010] Since the processor is connected to the heat pipe in a bare chip state, the heat generated by the processor is transferred to the heat pipe. Heat is transmitted through the heat pipe, and is released from the heat radiating portion of the heat pipe, whereby sufficient cooling is performed. When mounted on an information processing device such as a personal computer, heat can be conducted through other members in the housing, so that the heat radiation effect is increased when mounted on the information processing device as compared with a circuit module alone.

Further, heat is transferred from the heat pipe to the metal plate by bonding the integrally formed heat pipe and metal plate to a substrate and joining one surface of the bare chip to one surface of the front heat pipe. Thus, average heat radiation over a wide range from the heat radiating portion of the heat pipe and the metal plate becomes possible.

The heat pipe encloses a medium for conducting heat in a container, and has a heat receiving portion and a heat radiating portion at both ends of the container. The medium is rapidly vaporized in the heat receiving portion by heat generated from the heating element, and the heat receiving portion is rapidly cooled by latent heat of evaporation. The vapor moves to the radiator due to the pressure difference, and is condensed in the radiator to release latent heat. The condensed medium penetrates the wick on the inner wall of the container and returns to the heat receiving portion by capillary action.

[0013] Other solutions are listed as follows.

Average heat radiation over a wide range is performed by combining two or more heat pipes for heat radiation.

By using one or more heat pipes having better heat conductivity than the metal plate and easy to control the heat conduction destination, a thinner shape than the case where only the metal plate is attached to the printed board is used. And average heat dissipation over a wide area is possible.

Use a heat pipe having a large dimension in the longitudinal direction and the lateral direction, and perform average heat radiation over a wider range.

By using one or more heat pipes and a metal plate integrally formed with one or more heat pipes having a large size in the longitudinal direction and the transverse direction, it is possible to perform average and efficient heat radiation over a wide range. In addition, the thickness of the circuit module can be reduced as compared with a method in which a metal plate and a printed board are bonded.

By using a plate-like heat pipe,
Achieve a thin module.

By mounting the components of the circuit module on one side and making the other side substantially flat, the module can be made thinner. A very small circuit module becomes possible in combination with the bare chip mounting of the processor. Therefore, it is possible to reduce the size and thickness of the information processing device in which the information processing device is mounted.

If the cavity is sealed with a member having low thermal conductivity, heat can be prevented from going to the upper part, and the heat radiation rate from the heat pipe side can be increased. Since the heat radiation to the surface with the connector can be reduced,
The transmission of heat to the motherboard can be reduced.

A second-stage substrate may be mounted above the sealed cavity through a small gap, and electronic components may be mounted on the second-stage substrate. When the gap is small, air inside the gap does not cause convection, so that the gap itself has an adiabatic effect, so that the effects described in the preceding paragraph are increased. Further, since components can be mounted in multiple stages on a board on which the processor is mounted, the area of the module can be reduced.

Further, by using a cache memory and a cache memory control mechanism having a strong connection with the processor as the electronic components mounted on the second stage board, the length of the signal line between the processor and the processor can be shortened and the speed can be increased. Products that achieve high reliability.

Since the cache memory mounted on the second stage substrate is also mounted in a bare chip state, the height of the circuit module can be kept low and the area can be reduced.

Although the processor is mounted in a bare chip state, the bare chip can be mounted in a face-down manner in which the bare chip is connected to a substrate using metal bumps, or when mounted in a chip size package (CSP) state. Although the effect is slightly inferior to the above, the object of the present invention can be achieved to some extent.

Another object of the present invention is not to limit the height of the circuit module in designing a notebook personal computer.

Conventionally, the circuit module is one of the tallest among the components mounted on the motherboard of a notebook personal computer, so that the height of the notebook personal computer cannot be reduced.

In the present invention, the height of the circuit module up to the mounting surface is set to 10 mm or less. At present, a laptop personal computer is equipped with a PC card standardized by PCMCIA, and in most cases, a PC card slot in which two PC cards are vertically inserted is used as a general-purpose product. This height is 10.5 mm for convenience of the standard specification. According to the present invention, the height of the circuit module from the mounting surface is set to 10 mm mail or less, so that the circuit module is not restricted by the height design of the notebook personal computer. It is now possible to provide notebook personal computers.

In order to obtain a circuit module of 10 mm or less, a processor was mounted in the cavity portion, and all other components were mounted on the surface on which the connector, which is the tallest component, was mounted.

[0029]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of a circuit module according to the present invention;

FIG. 1 is a sectional view of an embodiment of the circuit module according to the present invention. In FIG. 1, a circuit module 2 is based on a heat pipe 103 that diffuses heat generated by a processor, and a CPU bare chip 20 that consumes most of the power of the circuit module and generates a large amount of heat.
01 are connected. The circuit module substrate 10 for forming the processor in contact with the heat pipe 103
1 has a cavity (through hole). The processor is joined at a heat receiving section of the heat pipe 103.

The CPU bare chip 20 and the circuit module substrate 101 are electrically connected by bonding wires 104 made of a material such as pure gold. The bare chip is a chip in which metal not packaged with resin or the like is exposed.
The gap formed between the circuit module 2 and the cavity portion of the circuit module substrate 101 and the bonding wire 104 fills the cavity of the circuit module substrate 101,
The board 101 is filled with the boarding resin 105 so that the circuit module board 101 becomes a rectangular parallelepiped. Boarding resin has lower thermal conductivity than heat pipe. Main components such as the cache submodule 40, the system controller 30, and the interface connector 90 are further mounted on the circuit module board 101 configured as described above. The connection portion of the system controller is a BGA (Ball Grid Array) in this embodiment.

The above-described LSI is characterized in that an LSI generating a large amount of heat is mounted in the cavity portion of the printed board in a bare chip state, and other electronic components are mounted on the printed board.
It is also possible to use an SI module.

Since the cache sub-module 40 is mounted on the portion where the processor is mounted, the size can be significantly reduced.

The connector for connecting to the motherboard is the component having the highest physical height, which is 3.25 mm in this example. In the present embodiment, since the structure is as described above, an ultra-thin circuit module having a height of 8.45 mm can be obtained by adding the height of the heat pipe 103 and the circuit module substrate 101 to 5.2 mm.

FIG. 2 is a top view of the embodiment of the present invention, and the same components as those in FIG. 1 are denoted by the same reference numerals. Similarly, in the following drawings, the same components are denoted by the same reference numerals.

The clock driver 60 in FIG. 2 may not be mounted on the circuit module 2 by the adaptive system, but may supply a clock from outside the motherboard or the like through the interface connector 90. The small chip component 91 is
Chip ceramic capacitor mounted as a noise countermeasure in relatively high frequency range, pull-up or pull-down for bus pull-up and initial setting strapping,
A chip resistor used for signal damping, a chip thermistor used as a temperature sensor, and the like. The large chip component 92 is used when the CPU bare chip 20 returns from the clock stop state and starts clock supply to transition to the normal operation state. For example, a chip tantalum capacitor having a large capacity for absorbing power supply noise in a relatively low frequency region, an intelligent temperature sensor for transmitting temperature information via a serial bus for temperature sensing, and a circuit module 2 are provided. DC / DC converters, coils, large-capacity capacitors, etc. necessary to create the required special power supply voltage.

As the cache submodule 40, an asynchronous or clock synchronous SRAM is used, and a cache SRAM 41 for storing data has a capacity of 1 MB if a capacity of, for example, 256 kB is required according to a required cache capacity. Two cache SRAMs 41 are mounted. If a capacity of 512 kB is required, four cache SRAMs 41 having a capacity of 1 MB are mounted. The cache submodule 40 has 4 mounting spaces, so 2M
If the cache SRAM 41 having the B configuration is used, a cache capacity of 1 MB can be secured. The TAG SRAM 4 that stores a part of the address of the data stored in the cache SRAM 41 is also stored in the cache submodule 40.
2 and, if necessary, a chip ceramic capacitor for decoupling, for example, a 1 MB cache SRAM
A jumper chip resistor is mounted for selecting whether to realize a cache capacity of 256 kB by using two 41 or a capacity of 512 kB by using four. The required capacity and bit configuration of the TAG SRAM 42 according to the cache capacity vary depending on the caching scheme, and will not be described here. Since the module configuration has four cache mounting patterns, the size mounted on the circuit module can be selected without changing its size, the cache capacity can be selected as it is in the standard configuration, and the design flexibility can be increased. it can.

Cache SRAM 41 and TAG SRA
When both M42 package forms are bare chips,
If both are molded with plastic or ceramic, some may be bare chips and some may be molded. However, the description of this embodiment uses a bare chip for the cache SRAM 41 and uses a TA chip.
TSO plastic molded on G SRAM42
This is the case where P is used. By using the bare chip, a smaller and thinner device can be realized.

FIGS. 3A to 3E show examples of various heat pipe dimensions and combinations. FIG. 3 (a)
(B) is obtained by bonding one heat pipe to a printed board, and (b) is obtained by bonding one heat pipe and a metal plate integrally to the printed board. (C) is obtained by laminating two heat pipes and a metal plate which are arranged in the same straight line in the longitudinal direction and integrally formed on a printed circuit board, and (d) shows two heat pipes which are orthogonal to each other.
The above-mentioned two sets of heat pipes and a metal plate are integrally formed and bonded to a printed circuit board.
(E) shows a structure in which a heat pipe having a large dimension in the longitudinal direction and the lateral direction and a metal plate are integrally formed and bonded to a printed circuit board.

The position of the heat pipe and the length in the lateral direction are set so as to cover the cavity of the printed circuit board in consideration of the cooling capacity of the heat pipe, fixing of the podging resin, electromagnetic shielding, and the like. Is optimal.

As described above, by providing a heat interface having a simple shape capable of efficiently dissipating heat, the heat dissipation structure of the information processing apparatus system can be easily designed. Also,
The structure is suitable for heat dissipation using the housing of the information processing device or the like, and the heat dissipation effect is enhanced.

FIGS. 4 (a) and 4 (b) show a-a of FIG. 3 (b).
It is sectional drawing at the time of cutting by a '. An embodiment in which a heat pipe and a metal plate are integrally formed is shown.

FIG. 5 shows an example of a component surface pattern of the cache submodule 40, and shows an example of a mounting pattern and a position of the cache SRAM 41 supplied in the form of a bare chip and the TAG SRAM 42 supplied in the form of TSOP. In FIG. 5, a chip component 46 is an example of a mounting pattern and a position of a chip ceramic capacitor for decoupling and a chip resistor for jumper.

FIG. 6 shows an example of a solder surface pattern of the cache sub-module 40. The cache sub-module 40 and the circuit module substrate 101 are electrically and mechanically connected by the solder balls 108. In this example, the array of round lands on which the solder balls 108 are mounted is separated on both sides in the short direction of the cache submodule 40 because the array is mounted across the cavity in which the CPU bare chip 20 is mounted. It is.

The 152 solder balls 108
Array of round lands for BG using solder balls
The mounting is not limited to the A (Ball Grid Array), and the LGA (Land) mounted by solder printing on both the lands on the cache sub-module 40 and the land on the circuit module substrate 101 side and reflow mounting is performed.
(Grid Array).
There is no BGA mounting method for the cache submodule 40
Although the present invention is not limited to a specific mounting mode such as LGA or LGA, it can be said that it is a preferable mounting mode in consideration of a reduction in thickness.

FIG. 7 is a system block diagram when the circuit module shown in FIG. 1 is mounted on an information processing apparatus.
1 shows an example of the entire system of the information processing apparatus 1.

There are a single processor system with only the circuit module 2 and a multiprocessor system with a plurality of modules such as the circuit module 2 and the circuit module 2 ′. The circuit module 2
Although the interface connector 90 shown in FIG. 1 and FIG. 2 is provided as a physical interface, it is logically mainly a DRAM interface 7 which is a main memory bus and a general-purpose system bus such as a PCI (Periphere).
ral Component Interconnect
In some cases, a dedicated graphic port 9 is provided as an interface with a system controller 8 having a system bus 8 such as t) as an interface and a graphic controller that needs to transfer data at a higher speed. As described above, the inside of the circuit module 2 includes a CPU bare chip 20, a system controller 30 which is a bridge having a CPU bus interface function, a cache control function, a DRAM interface function, a system bus interface function, and a dedicated port control function, and a cache sub. The module 40 is connected mainly via the CPU bus 50. With the circuit module 2 as the center, the DRAM module 3 via the DRAM interface 7 and the graphic module 4 via the graphic port 9
Is connected. The graphic module 4 has a graphic controller 401 connected to the graphic port 9, a frame buffer 402 connected via a frame buffer interface 403, and a display signal 404.
To drive the display. In a general system without an interface dedicated to graphics, a graphic module having the same function as the graphic module 4 is connected via the system bus 8 to display characters and graphics on a CRT or a liquid crystal display.

Various functional blocks such as a network controller and a SCSI controller can be connected to the system bus 8. For example, a communication PC card 23 connected to the PC card slot is connected. Further, for example, connection of I / O devices having a conventional interface is difficult and costs increase only with a relatively new standard such as PCI and a high-speed system bus alone.
The system bus 8 is a PCI to PCI that serves as a bridge with a conventional interface such as IDE10 or ISA12.
An I / O bridge 5 is connected. An inexpensive HDD / CD-ROM drive 6 is connected to the IDE 10, and the ISA 12 has a relatively low speed and does not cause any problem.

Further, a sound controller, a modem and the like are connected. In addition, a floppy disk device, a keyboard, a pointing device, and the like are connected to the I / O interface 11.

Next, referring to FIG.
The detailed functional structure of will be described. FIG. 12 is a circuit module block diagram.
U bear chip 20 and CPU bus interface function,
The general structure in which the system controller 30 and the cache submodule 40, which are bridges having a cache control function, a DRAM interface function, and a system bus interface function, are mainly connected via the CPU bus 50 has been described. Will be described in detail.

A temperature sensor 70 is mounted at a position close to the physical distance of the CPU bare chip 20, and outputs a temperature sense signal 71. The mode setting signal component 21 for specifying the mode in which the CPU bare chip 20 should operate after power-on and reset is set by the mode setting chip component 80.

The CPU bare chip 20 operates with a clock.
0 drives. The clock driver 60 also drives a system controller clock signal 62 and a motherboard clock signal 63. When the DRAM interface 7 also supports a synchronous DRAM that synchronizes with a clock, the clock driver 60 also supplies a clock to the DRAM interface 7.

There is also a system in which the clock driver 60 drives the motherboard clock signal 63 and supplies the clock signal to the CPU bare chip 20 and the system controller 30 by mounting the clock driver 60 on the motherboard. The CPU bare chip 20 has a diagnostic bus 22 as well as signals for normal operation,
The system controller 30 is also connected to the diagnostic bus 22 similarly.
It may be connected to.

A cache control signal 43 is connected to the cache SRAM 41 of the cache submodule 40 in addition to the CPU bus 50, and the TAG SRAM 42 is
The TAG data /
The connection is made by a write signal 44. The system controller 30 also has other control signals 31 such as a control signal for power management.

FIG. 8 shows the circuit module 2 described with reference to FIG.
FIG. 2 is an enlarged cross-sectional structure diagram for explaining a point portion of the cross-sectional view of FIG. FIG. 7 is described from below. A circuit module substrate 101 coated with an adhesive is connected to the heat pipe 103, and a silver paste 106, which is a conductive adhesive, is coated on the heat pipe 103 in the cavity of the circuit module substrate 101 to form the CPU bare chip 20. Mounted and the CPU bare chip 2 with the bonding wire 104
0 and the circuit module substrate 101 are electrically connected and filled with a podging resin. In this state, the heat resistance is low because the heat pipe is directly connected downward, and the heat resistance is high because the resin is filled upward.

Further, since the cache sub-module board 45 exists with the air gap 107 interposed therebetween, the upward thermal resistance is further increased, the heat is almost conducted downward, and the conduction to the cache sub-module board 45 is very low. Therefore, electronic components / circuits such as the cache SRAM 41 can be mounted. When the air layer is very thin, heat convection hardly occurs, and an effect of heat insulation is obtained. B of the present invention
In the case of GA, the gap is about 0.5 mm,
There is a sufficient insulation effect. With such a structure, the direction of heat radiation can be controlled.

FIG. 9 shows an example of application to a notebook personal computer.
The information processing apparatus 1 has the shape of a notebook personal computer, and has a structure having a liquid crystal display panel 1001, an adjustment volume 1002, and the like.

The circuit module 2 is connected to the motherboard 1004
By connecting the heat pipe 103 of the circuit module 2 to the lower housing 1005, heat is mainly conducted to the lower housing 1005 side and hardly conducted to the motherboard 1004, so that the heat is transmitted to the keyboard 1003. In addition, an information processing apparatus that does not cause discomfort to a user who operates the information processing apparatus 1 due to a hot keyboard can be realized. Further, according to the present invention, even when the notebook PC is used on the lap, the heat is dissipated on average, so that the user is not locally heated and does not give any discomfort to the user. In addition, 1 in FIG.
006 is a PC card socket. The PC card socket requires the highest physical height among components mounted on the motherboard of a notebook personal computer. The standardization body has set the standard dimensions,
It is a general purpose product with a two-stage configuration and requires a height of 10.5 mm. In this configuration, the height of the circuit module is set to 10 mm or less, and consideration of the restriction on the height by the circuit module can be reduced in designing the notebook personal computer.

In order to bring the heat pipe side of the circuit module 2 into close contact with the lower housing 1005, there are a method using a thin heat conductive sheet and a method of applying silicon grease.

FIG. 10 shows a second application example in a notebook personal computer. This example shows a method of mounting a motherboard on the lower housing 1005 side, and shows a structure of an information processing device based on a concept that the keyboard 1003 may be slightly warmed.

In this case, if the heat is locally transmitted to the keyboard 1003, the user will be uncomfortable. Therefore, it is necessary to diffuse the heat over a wide range on the average. There are problems such as thickening. According to the present invention, a thin information processing device that suppresses a rise in the temperature of a keyboard by dissipating heat over a wide range and does not cause discomfort to the user can be realized.

Up to this point, an example of connection by wire bonding in which the face on which the circuit and the pad of the bare chip are formed in the same direction as the face on which the CPU bare chip 20 is connected to the printed board is face-up will be described. In the following, the FCA (Flip Ch) is face-down, in which the surface on which the circuits and pads of the bare chip are formed and the surface on the side to which the printed circuit board is connected face each other.
A connection example using (IP Attach) will be described. FIG. 11 shows an example of a face-down type module. 46
Is a chip component mounted on the cache submodule 40, 109 is a gold bump, and the CPU bare chip 20 is directly connected to the circuit module substrate 101 after forming a solder bump or a gold bump 109 instead of a bonding wire.

In this example, the system controller 30 is also connected in the same manner as the CPU bare chip 20, and is connected to the metal plate 102 via the heat transfer buffer 110. Heat transfer buffer 1
10, a plurality of bare chip circuit module substrates 1
Absorbs the dimensional deviation in the height direction from
And heat can be efficiently transmitted to the two heat pipes 103.

By adopting such a structure, heat can be radiated directly from the chip even in a face-down type mounting.
Since the power supply and signal wiring patterns are shorter than those of wire bonding, the mounting density is high and high-speed operation is possible. FIG. 11 shows a cache submodule 4 using a two-stage substrate as a method for mounting a memory element for storing cached data and a memory element for storing a part of an address of the cached data in a main memory.
Although described in the form of 0, it is not always necessary to take the form of a sub-module, and there is also a method of mounting a memory element directly on the circuit module substrate 101.

A bare chip is a component having the smallest shape. In particular, in the case of face-down, since the wiring pitch of the substrate depends on the pad size of the bare silicon chip, it is necessary to form a substrate having a very fine pitch. However, there are problems that the cost becomes high and the production yield does not increase. In order to solve such a problem, in recent years, an IC package called CSP (Chip Size Package) having a projection area almost equal to that of a bare chip has been developed. FIG. 13 shows an example of a module using this CSP. In FIG. 13, 2001 is a CSP, 2002 is a CSP molded part, and 2003 is a QF
P (Quad Flat Package) is shown. By using the CSP in this manner, it is possible to configure a module similar to a bare chip mounted by FCA. FIG. 13 shows a CSP with the chip exposed, but a CSP in which the chip is covered with some material increases the thermal resistance to some extent but can be used unless it is critical.

FIG. 11 shows a cache submodule using a bare chip, and FIG.
Although the figure shows that the SOP is directly mounted, the circuit module can be configured by either a sub-module using a two-stage substrate or a method of directly mounting a package type IC directly, and the CPU and The mounting mode of the system controller can be realized by any of the modes shown in FIG. 1, FIG. 11, and FIG.
Any combination of PU implementations is possible.

According to the present invention, efficient cooling design of an information processing apparatus is facilitated. Further, a thin and lightweight cooling design that does not cause thermal discomfort to a person who uses the information processing device can be realized. Further, it is possible to provide a circuit module capable of easily configuring an electromagnetic shield.

According to the present invention, the bare chip CPU is directly connected to the heat pipe, and another electronic component is mounted only on the bare chip CPU connection side. By making the pipe substantially flat, there is an effect that the design of the heat radiation structure of the information processing device becomes easy.

By bonding a heat pipe and a metal plate integrally formed on a printed circuit board, it becomes possible to averagely radiate heat from the heat radiating portion of the heat pipe and the metal plate to a wide area, thereby giving the user unpleasant thermal discomfort. There is an effect that a thin information processing apparatus that does not provide the information can be provided.

Since electronic circuits and components are not mounted on one side of the printed circuit board, the use of metal for the heat diffusion plate makes it possible to use the heat diffusion plate as a part of the electromagnetic shield and to take measures against heat radiation noise. This has the effect of being easier.

Further, a bare chip CPU which generates a large amount of heat
Using a resin having a low thermal conductivity, for example, an acrylic resin (thermal conductivity (normal temperature): 0.17-0.25 W / mK) for encapsulation, and further forming a thin air layer with an upper circuit. A heat diffusion plate, for example, a copper plate (thermal conductivity (0 ° C.):
(403 W / mK) compared with the thermal resistance of 403 W / mK), the thermal resistance to the upper layer circuit can be sufficiently increased, so that heat can be isolated at a short distance, and another electronic circuit can be mounted close to the CPU. This has the effect of increasing the density and the effect of providing a thin information processing device that does not cause thermal discomfort to the user.

Further, by arranging one or more heat pipes having a large size in the longitudinal direction and the transverse direction, an average heat radiation over a wide range becomes possible, and a thin type which does not give a user thermal discomfort. There is an effect that the information processing apparatus can be provided.

Since the bare chip and the packaged electronic component are optimally selected for each component, high-density mounting is achieved, which is effective in reducing the size of the information processing apparatus. Since the signal and power supply wiring patterns are shortened by high-density mounting, the operating margin of the system is increased and high reliability can be secured.If the operating margin is determined based on a certain standard, the signal speed is increased and a high-performance information processing device is realized. There are effects that can be realized.

According to the present invention, the processor is mounted in the cavity, and all other components are mounted on the surface on which the connector, which is the physically highest component, is mounted, so that the height is reduced to 10 mm. As a result, when mounted on an information processing apparatus, P is a physically highest component among other components.
The height of the circuit module does not affect the entire housing when mounted on the motherboard, and the information processing apparatus can be made thinner.

[0075]

According to the present invention, a semiconductor element having a large amount of heat is directly connected to a heat pipe in a bare chip state, and another electronic component is mounted only on the bare chip connection side of a printed circuit board. Thus, there is an effect that heat radiation with high efficiency is achieved, and the heat radiation structure of the information processing apparatus is easily designed because the heat pipe is substantially flat.

According to the present invention, efficient cooling design of the information processing apparatus is facilitated. Further, a thin and lightweight cooling design that does not cause thermal discomfort to a person who uses the information processing device can be realized.

By bonding the heat pipe and the metal plate integrally formed on the printed circuit board, it becomes possible to averagely radiate heat from the heat radiating portion of the heat pipe and the metal plate to a wide area, thereby giving the user unpleasant thermal discomfort. There is an effect that a thin information processing apparatus that does not provide the information can be provided.

Further, by using a resin having a low thermal conductivity for encapsulating a semiconductor element generating a large amount of heat and forming a thin air layer between the resin and an upper circuit, the heat resistance can be compared with the thermal resistance of the heat diffusion plate. In addition, the thermal resistance to the upper layer circuit can be made sufficiently large, so that heat can be isolated over a short distance, and another electronic circuit can be mounted close to a semiconductor element that generates a large amount of heat, thereby increasing the mounting density. Thus, there is an effect that a thin information processing device that does not give a user thermal discomfort can be provided.

Further, by arranging one or more heat pipes having a large size in the longitudinal direction and the transverse direction, average heat radiation over a wide range becomes possible, and a thin type which does not give a user thermal discomfort. There is an effect that the information processing apparatus can be provided.

Since the bare chip and the packaged electronic component are optimally selected for each component, high-density mounting is achieved, which is effective in reducing the size of the information processing apparatus. Since the signal and power supply wiring patterns are shortened by high-density mounting, the operating margin of the system is increased and high reliability can be secured.If the operating margin is determined based on a certain standard, the signal speed is increased and a high-performance information processing device is realized. There are effects that can be realized.

According to the present invention, a semiconductor element having a large amount of heat is mounted in a cavity portion, and all other components are mounted on a surface on which a connector which is a physically highest component is mounted.
The height was reduced to 10 mm. As a result, when mounted on an information processing device, the other components can be kept below the PC card slot, which is the physically highest component, and when mounted on the motherboard, the height of the circuit module is reduced to the entire housing. There is no influence, and the information processing apparatus can be made thin.

[Brief description of the drawings]

FIG. 1 is a sectional view of an embodiment of the present invention.

FIG. 2 is a top view of the embodiment of the present invention.

FIG. 3 is a rear view of the embodiment of the present invention.

FIG. 4 is a sectional view of an embodiment of the present invention.

FIG. 5 is an example of a component surface pattern of a submodule.

FIG. 6 is an example of a solder surface pattern of a submodule.

FIG. 7 is a system block diagram of an embodiment of the present invention.

FIG. 8 is an enlarged cross-sectional view.

FIG. 9 is an example of application to a notebook computer.

FIG. 10 is a second application example of a notebook computer.

FIG. 11 is an example of a face-down type module.

FIG. 12 is a circuit module block diagram.

FIG. 13 is an example of a module using a CSP.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Information processing device, 2 ... Circuit module, 3 ... DRAM
Module, 4… Graphic module, 5… PCI to
i / o bridge, 6 HDD / CD-ROM drive, 7 DRAM interface, 8 system bus, 9 graphic port, 10 IDE, 11 other i / o interface, 12 ISA bus, 20 CPU bare chip , 21: Mode setting signal, 22: Diagnostic bus, 23: PC Card, 30
... system controller, 31 ... other control signals, 40
... Cache sub-module, 41 ... Cache SRAM,
42: TAG SRAM, 43: Cache control signal, 44: TA
G data / write control signal, 45: cache submodule board, 46: chip component, 50: CPU bus, 60:
Clock driver, 61 ... CPU clock signal, 62 ...
Clock signal for system controller 63 Clock signal for motherboard 70 Temperature sensor 71 Temperature sense signal 80 Chip component for mode setting 90 Interface connector 91 Small chip component 92
... Large chip parts, 101 ... Circuit module board, 10
2 Metal plate, 103 Heat pipe, 104 Bonding wire, 105 Podding resin, 106 Silver paste, 107 Air gap, 108 Solder ball, 109 Gold bump, 110 Heat transfer buffer, 101
Graphic controller, 402: frame buffer, 403: frame buffer interface, 40
4. Display signal, 1001 Liquid crystal display panel, 1002
Adjustable volume, 1003 ... keyboard, 1004 ... motherboard, 1005 ... lower housing, 1006 ... PC card socket, 1007 ... upper housing, 2001 ... CSP, 20
02 ... CSP mold part, 2003 ... QFP,

Continuing on the front page (72) Inventor Yasuhiro Uemura 810 Shimoimaizumi, Ebina-shi, Kanagawa In the Office Systems Division, Hitachi, Ltd.

Claims (27)

[Claims] 1. A circuit module comprising a plurality of semiconductor elements, an electric component, and a printed board on which the semiconductor element and the electric component are mounted, wherein one side is connected to the printed board, and the other side is connected to the printed board. A heat pipe having a substantially flat surface is provided, a cavity is provided in the printed circuit board, a semiconductor element having a large amount of heat is mounted in the cavity in a bare chip state, and one surface of the bare chip is connected to one surface of the heat pipe. A circuit module, which is joined and provided with a heat radiating portion at an end of the heat pipe. 2. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and the processor, the connector, and the system control circuit. A heat pipe connected to the printed circuit board on one side and having a substantially flat surface on the other side, a cavity is formed in the printed circuit board, and the processor is a bare chip in the cavity portion. A circuit module mounted in a state, wherein one surface of the bare chip is joined to one surface of a heat pipe, and a heat radiating portion is provided at an end of the heat pipe. 3. The circuit module according to claim 1, wherein the cavity is sealed with a member having low thermal conductivity. 4. The circuit module according to claim 3, wherein a second-stage substrate is mounted above the cavity via a small gap, and an electronic component is mounted on the second-stage substrate. Circuit module. 5. The circuit module according to claim 4, wherein said electronic component is a cache memory and a cache memory control circuit. 6. The circuit module according to claim 5, wherein the cache memory is mounted on the second-stage substrate in a bare chip state. 7. The circuit module according to claim 2, wherein the connector is connected to at least a memory bus connected to a main storage device and a system bus connected to an I / O device. 8. An information processing apparatus including a motherboard on which semiconductor components such as a storage device are mounted, and a housing on which the motherboard is mounted, wherein: a plurality of semiconductor elements and electrical components mounted on the motherboard; A daughter board for mounting the element and the electric component, wherein the daughter board is provided with a heat pipe that is joined to the daughter board on one surface and the other surface is substantially flat, and the daughter board has a cavity. A semiconductor element having a large amount of heat generated is mounted in the cavity portion in a bare chip state, one surface of the bare chip is joined to one surface of a heat pipe, and a heat radiating portion is provided at an end of the heat pipe, An information processing apparatus, wherein the inside of a housing and the heat radiating portion of the heat pipe are mounted so as to be in contact with each other. 9. An information processing apparatus including a motherboard on which a semiconductor component such as a storage device is mounted, and a housing on which the motherboard is mounted, a connector mounted on the motherboard, a processor, and a connector electrically connected to the outside. A system control circuit for controlling transmission and reception of signals between the processor and the connector, and a daughter board on which the processor, the connector, and the system control circuit are mounted. A heat pipe joined to the board and having the other surface substantially flat is provided, the daughter board is formed with a cavity, a processor is mounted in the cavity portion in a bare chip state, and one surface of the bare chip is connected to the heat pipe. Join with one side,
An information processing apparatus, wherein a heat radiator is provided at an end of the heat pipe, and the heat radiator of the heat pipe is in contact with the inside of the housing. 10. An information processing apparatus including a semiconductor component such as a storage device, a motherboard on which a PC card connector is mounted, and a housing on which the motherboard is mounted, the surface of the motherboard on which the PC card connector is mounted. A circuit module comprising a plurality of semiconductor elements, electric components, and a printed circuit board on which the semiconductor element and the electric parts are mounted, wherein the circuit module is joined to the printed circuit board on one surface and the other surface A heat pipe having a substantially flat surface is provided, a cavity is formed in the printed board, a semiconductor element having a large amount of heat is mounted in the cavity in a bare chip state, and one surface of the bare chip is connected to one side of the heat pipe. A heat radiating portion provided at an end of the heat pipe, wherein the heat radiating portion of the heat pipe and the inside of the housing are provided. The information processing apparatus, wherein the circuit module is mounted such that contact. 11. An information processing apparatus including a semiconductor component such as a storage device, a motherboard on which a PC card connector is mounted, and a housing on which the motherboard is mounted, a surface of the motherboard on which the PC card connector is mounted. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and a printed circuit board on which the processor, the connector, and the system control circuit are mounted. A circuit module comprising: a heat pipe having one surface adhered to the printed circuit board; and a heat pipe having the other surface substantially flat; a cavity formed in the printed circuit board; The processor is mounted in a bare chip state on the One surface of the chip is joined to one surface of the heat pipe, a heat radiating portion is provided at an end of the heat pipe, and the inside of the housing and the heat radiating portion of the heat pipe are connected by the connector portion so as to be in contact with each other. An information processing apparatus characterized in that: 12. A circuit module comprising a plurality of semiconductor elements, electric components, and a printed circuit board on which the semiconductor elements and the electric parts are mounted, wherein a cavity is provided in the printed circuit board, and the semiconductor having a large amount of heat generated in the cavity portion. A circuit module comprising: an element mounted in a bare chip state; and a maximum height of 10 mm or less by mounting the electric component, the semiconductor element, and other components on one side of the printed circuit board. 13. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and the processor, the connector, and the system control circuit. A circuit module comprising a printed circuit board, wherein a cavity is provided in the printed circuit board, the processor is mounted in the cavity portion in a bare chip state, and the connector, the system control circuit, and other components are mounted on one side of the printed circuit board. A circuit module having a maximum height of 10 mm or less. 14. An information processing apparatus including a semiconductor component such as a storage device, a motherboard on which a PC card connector is mounted, and a housing on which the motherboard is mounted, wherein the motherboard includes a plurality of semiconductor elements and electrical components. An information processing apparatus, comprising: a circuit module including the semiconductor element and a printed circuit board on which the electric component is mounted, the circuit module having a maximum height from a mounting surface of the motherboard of 10 mm or less. 15. An information processing apparatus including a semiconductor component such as a storage device, a motherboard on which a PC card connector is mounted, and a housing on which the motherboard is mounted, wherein the motherboard includes: a processor; A circuit module including a connector to be connected, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and a printed circuit board on which the processor, the connector, and the system control circuit are mounted; An information processing apparatus comprising a circuit module having a maximum height from a mounting surface of 10 mm or less. 16. A circuit module comprising a plurality of semiconductor elements, an electric component, and a printed circuit board on which the semiconductor element and the electric component are mounted, wherein a heat pipe and a metal plate are integrally formed on one surface of the printed circuit board. A cavity is formed in the printed circuit board, a semiconductor element having a large amount of heat is mounted in the cavity in a bare chip state, and one surface of the bare chip is connected to a heat pipe. A circuit module, wherein the heat pipe is joined to one surface and a heat radiating portion is provided at an end of the heat pipe. 17. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and the processor, the connector, and the system control circuit. In a circuit module comprising a printed circuit board, a heat pipe and a metal plate are integrally formed and provided such that one surface is bonded to the printed circuit board and the other surface is substantially flat, and a cavity is formed in the printed circuit board. A circuit module, wherein a processor is mounted in the cavity portion in a bare chip state, one surface of the bare chip is joined to one surface of the heat pipe, and a heat radiating portion is provided at an end of the heat pipe. 18. A circuit module comprising a plurality of semiconductor elements, electrical components, and a printed circuit board on which the semiconductor elements and the electrical components are mounted, wherein two heat pipes and a metal plate arranged on the same straight line in the longitudinal direction are provided. An integrally molded product is provided such that one surface is bonded to the printed circuit board and the other surface is substantially flat, a cavity is formed in the printed circuit board, and a semiconductor element having a large amount of heat is formed in the cavity in a bare chip state. A circuit module, comprising: mounting, bonding one surface of the bare chip to one surface of the two heat pipes, and providing a radiator at an end of the two heat pipes. 19. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and the processor, the connector, and the system control circuit. In a circuit module consisting of a printed circuit board, two heat pipes and a metal plate, which are arranged on the same straight line in the longitudinal direction, are integrally formed, and one surface is bonded to the printed circuit board, and the other surface is substantially flat. A cavity is formed in the printed circuit board, a processor is mounted in the cavity in a bare chip state, and one surface of the bare chip is joined to a heat receiving portion at one end of the two heat pipes, A circuit module, wherein a heat radiator is provided at opposite ends of two heat pipes. 20. A circuit module comprising a plurality of semiconductor elements, electrical components, and a printed circuit board on which the semiconductor elements and the electrical components are mounted, wherein a cross-shaped heat pipe and a metal plate are integrally formed with one another. The other surface is attached to the printed circuit board so that the other surface is substantially flat, a cavity is formed in the printed circuit board, and the semiconductor element having a large calorific value is mounted in the cavity portion in a bare chip state. A circuit module, wherein one surface is joined to one surface of the heat pipe, and a heat radiating portion is provided at an end of the heat pipe. 21. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and the processor, the connector, and the system control circuit. In a circuit module comprising a printed circuit board, a cross-shaped heat pipe and a metal plate integrally formed are provided such that one surface is bonded to the printed circuit board and the other surface is substantially flat, and a cavity is formed in the printed circuit board. And a processor is mounted in the cavity portion in a bare chip state, one surface of the bare chip is joined to one surface of the heat pipe, and a heat radiating portion is provided at an end of the heat pipe. Circuit module. 22. A circuit module comprising a plurality of semiconductor elements, electrical components, and a printed circuit board on which the semiconductor elements and the electrical components are mounted, wherein one or more heat modules having a large dimension in a longitudinal direction and a lateral direction are provided. A pipe and a metal plate integrally formed are provided such that one surface is bonded to the printed circuit board and the other surface is substantially flat, a cavity is formed in the printed circuit board, and a semiconductor that generates a large amount of heat is formed in the cavity portion. The element is mounted in a bare chip state, one surface of the bare chip is joined to one surface of the heat pipe, and a heat radiating portion is provided at an end of the heat pipe, so that heat is radiated evenly over a wide range. And a circuit module. 23. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and the processor, the connector, and the system control circuit. A circuit module consisting of a printed circuit board having one or two or more heat pipes and a metal plate integrally formed with one or more heat pipes having a large dimension in a longitudinal direction and a short direction is bonded to the printed circuit board on one surface and the other surface. A cavity is formed in the printed circuit board, a processor is mounted in the cavity portion in a bare chip state, one surface of the bare chip is joined to one surface of the heat pipe, and the heat By radiating heat at the end of the pipe, heat is radiated evenly over a wide area Circuit module for causing 24. A circuit module comprising a plurality of semiconductor elements, electric parts, and a printed circuit board on which the semiconductor elements and the electric parts are mounted, wherein the semiconductor element having a large amount of heat is mounted on the semiconductor element and the electric parts. The surface opposite to the surface was mounted by metal bumps in a bare chip state, the surface opposite to the mounting surface of the bare chip had elasticity, and the heat pipe and the metal plate were integrally formed via a buffer material having high thermal conductivity. A circuit module characterized by joining things. 25. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and the processor, the connector, and the system control circuit. In a circuit module comprising a printed circuit board, the processor is mounted by metal bumps in a bare chip state on a surface opposite to a surface on which the system control circuit and the connector are mounted, and on a surface opposite to a mounting surface of the bare chip. A circuit module in which a heat pipe and a metal plate are integrally formed via an elastic and highly heat-conductive cushioning material. 26. A circuit module comprising a plurality of semiconductor elements, electric parts, and a printed circuit board on which the semiconductor elements and the electric parts are mounted, wherein the semiconductor element having a large amount of heat is mounted on the semiconductor element and the electric parts. On the surface opposite to the surface, it is mounted by a metal bump in a package where only the surface of the silicon chip without pads is exposed, and the surface opposite to the mounting surface of the silicon chip is elastic and has a high thermal conductivity through a cushioning material. A circuit module characterized in that a heat pipe and a metal plate are integrally formed and joined together. 27. A processor, a connector electrically connected to the outside, a system control circuit for controlling transmission and reception of signals between the processor and the connector, and the processor, the connector, and the system control circuit. A circuit module comprising a printed circuit board, wherein the processor is mounted on a surface opposite to a surface on which the system control circuit and the connector are mounted by a metal bump in a package in which only a surface of the silicon chip without pads is exposed, and the silicon A circuit module comprising a heat pipe and a metal plate integrally formed through a cushioning material having elasticity and high thermal conductivity on a surface opposite to a chip mounting surface.