JP2000332374A - Substrate shearing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shear a substrate with a number of shearing parts by pressure being smaller than that of a conventional device by performing first shearing by the operation of an elevation part, and by rotating the substrate to a preset angle by a rotation part for carrying out second shearing. SOLUTION: A substrate 2 is carried to a substrate-fixing part 2 by an automatic carrier mechanism or the like, moves an upper or a lower type or both of them, and carries out the first shearing of a shearing part 10. After that, a rotation part is rotated by a preset angle, and the direction of the substrate is changed. For example, the rotation part is rotated by 180 degrees. After that, the upper or lower type or both of them are moved, and the second shearing of the shearing part 11 is performed. Also, for the design of a part to be sheared, the angle to be rotated can be arbitrarily changed to 90 or 45 degrees or the like. Furthermore, the angle of rotation is changed, thus furthermore distributing force required for one-time shearing by a plurality of shearing without limiting to two shearing times for reducing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate shearing device for shearing a substrate used in electronic equipment or the like into a predetermined shape, and more particularly to a substrate shearing device for rotating a substrate to shear it.

[0002]

2. Description of the Related Art Conventional substrate shearing will be described.
Conventionally, as shown in FIG. 3, a substrate 2 to be sheared is placed between an upper die 1 in which a shear blade 4 is embedded and a lower die 3 in which a shear blade 5 is embedded, as shown in FIG. To
The shear portions 12 at two locations on the long side and one location on the short side of the substrate 2 are sheared by the shear blades 4 and 5 in one process.

Next, the pressure required for shearing a substrate in a substrate shearing apparatus will be described. As shown in FIG. 5, the shear blades 4 and the shear blades 5 embedded in the upper die 1 and the lower die 3 of the substrate shearing device have the same height at the tip,
At the time of division, the shear blade 4 and the shear blade 5 simultaneously start shearing the substrate. The number of shearing portions to be sheared by the substrate shearing device shown in FIG.
To 5 and the serial number of the shearing part 12
The force required to shear the p1
And the required force is p2, p3, p
4, p5. Assuming that the maximum pressure required for the shearing of the substrate shearing apparatus in FIG. 5 is W, the condition for shearing is as follows. Greater than the sum of the forces needed to

(Equation 1)

[0004]

However, when the number of the shearing portions 12 increases by n locations, the force required for shearing the substrate also increases by the number of n locations. It may fall below the condition for being possible. Therefore, in order to shear a substrate having many shear portions, a problem has arisen that a larger pressure cannot be applied unless the apparatus is larger than a conventional apparatus.

(Equation 2)

SUMMARY OF THE INVENTION An object of the present invention is to solve the problem that a substrate having a large number of substrate shearing portions cannot be sheared by a pressure according to the scale of a conventional substrate shearing device. Another object of the present invention is to provide a substrate shearing device capable of shearing a substrate having many shearing portions with a smaller pressure than a conventional device by shearing another shearing portion.

[0006]

In order to achieve the above object, a substrate shearing apparatus according to the present invention comprises an upper die having a shear blade embedded therein for shearing a substrate, a lower die, and a substrate to be sheared. A substrate fixing portion for fixing the, a rotating portion having an elevating portion and a motor, and after the first shearing by the operation of the elevating portion, the substrate is rotated by the rotating portion at a preset angle to perform the second shearing. By doing so, the shearing point n
Is reduced to n / 2 places, whereby the force p required for shearing is distributed to p / 2.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a substrate shearing apparatus according to the present invention will be described with reference to the drawings. The same components as those in the related art are denoted by the same reference numerals. FIG. 1 is a side view showing the configuration of the substrate shearing device of the present invention. The substrate shearing apparatus according to the present embodiment includes an upper mold 1 in which a shear blade 4 is embedded to shear the substrate 2.
And a lower die 3 in which a shear blade 5 is embedded, a substrate fixing portion 6 for fixing the substrate 2, and a rotating portion 7 including an elevating portion 9 for vertically moving the substrate 2 and a motor 8. ing.

The operation of the apparatus will be described with reference to FIG.
FIG. 2 is a diagram showing a substrate shearing portion in the substrate shearing device of the present invention. First, the substrate 2 is transported to the substrate fixing unit 2 by means such as an automatic transport mechanism or manual operation. Next, the upper mold and / or the lower mold is moved, and the first shearing of the shearing section 10 shown in FIG. 2 is performed. Thereafter, the rotating unit is rotated by a preset angle to change the direction of the substrate. For the shearing of the substrate shown in FIG.
Rotate 180 degrees. Thereafter, the upper mold and / or the lower mold is moved to perform the second shearing of the shearing portion 11.

In this embodiment, the rotation angle of the substrate is set to 180 degrees. However, the rotation angle can be arbitrarily changed, such as 90 degrees or 45 degrees, depending on the design of the location to be sheared. Furthermore, by changing the rotation angle, the force required for one shear can be further reduced by dispersion by a plurality of shears without being limited to the two times of shear described in the present embodiment. .

[0010]

As described above, in the substrate shearing apparatus of the present invention, after the first shearing, the substrate is rotated at a preset angle to perform the second shearing, so that the pressure required for shearing is reduced by half. Can be In the substrate shearing apparatus of the present invention, the case where the shear blade is embedded in the lower die has been described. However, it is needless to say that the same effect can be obtained by the substrate shearing apparatus in which the shear blade is not embedded.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a substrate shearing device of the present invention.

FIG. 2 is a view showing a substrate shearing portion in the substrate shearing device of the present invention.

FIG. 3 is a diagram showing substrate shearing of a conventional substrate shearing device.

FIG. 4 is a view showing a substrate shearing portion in a conventional substrate shearing device.

FIG. 5 is a diagram showing pressure applied to a conventional shear blade.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper die 2 Substrate 3 Lower die 4 Shear blade 5 Shear blade 6 Substrate fixing part 7 Rotating part 8 Motor 9 Elevating part 10 Shear part 11 Shear part 12 Shear part

Claims (1)

[Claims] An upper die having a shear blade embedded therein for shearing a substrate, a lower die, a substrate fixing portion for fixing a substrate to be sheared, and a rotating portion having an elevating portion and a motor. A first shearing operation performed by the elevating unit, wherein the rotating unit rotates the substrate at a preset angle to perform a second shearing operation.