JP2000332257A5 - - Google Patents

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Publication number
JP2000332257A5
JP2000332257A5 JP2000066074A JP2000066074A JP2000332257A5 JP 2000332257 A5 JP2000332257 A5 JP 2000332257A5 JP 2000066074 A JP2000066074 A JP 2000066074A JP 2000066074 A JP2000066074 A JP 2000066074A JP 2000332257 A5 JP2000332257 A5 JP 2000332257A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000066074A
Other languages
Japanese (ja)
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JP2000332257A (ja
JP4641586B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000066074A priority Critical patent/JP4641586B2/ja
Priority claimed from JP2000066074A external-priority patent/JP4641586B2/ja
Publication of JP2000332257A publication Critical patent/JP2000332257A/ja
Publication of JP2000332257A5 publication Critical patent/JP2000332257A5/ja
Application granted granted Critical
Publication of JP4641586B2 publication Critical patent/JP4641586B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000066074A 1999-03-12 2000-03-10 半導体装置の作製方法 Expired - Fee Related JP4641586B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000066074A JP4641586B2 (ja) 1999-03-12 2000-03-10 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-65737 1999-03-12
JP6573799 1999-03-12
JP2000066074A JP4641586B2 (ja) 1999-03-12 2000-03-10 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2000332257A JP2000332257A (ja) 2000-11-30
JP2000332257A5 true JP2000332257A5 (cg-RX-API-DMAC7.html) 2007-05-24
JP4641586B2 JP4641586B2 (ja) 2011-03-02

Family

ID=26406884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000066074A Expired - Fee Related JP4641586B2 (ja) 1999-03-12 2000-03-10 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP4641586B2 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI288443B (en) * 2002-05-17 2007-10-11 Semiconductor Energy Lab SiN film, semiconductor device, and the manufacturing method thereof
JP2005333107A (ja) * 2004-04-21 2005-12-02 Mitsubishi Electric Corp 半導体装置、画像表示装置および半導体装置の製造方法
JP2005311037A (ja) * 2004-04-21 2005-11-04 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP4641741B2 (ja) * 2004-05-28 2011-03-02 三菱電機株式会社 半導体装置
JP5414712B2 (ja) * 2011-02-21 2014-02-12 三菱電機株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3599827B2 (ja) * 1994-05-20 2004-12-08 三菱電機株式会社 アクティブマトリクス液晶ディスプレイの製法
JP3326013B2 (ja) * 1994-07-14 2002-09-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
JPH10240164A (ja) * 1997-03-03 1998-09-11 Toshiba Corp 駆動回路一体型表示装置
JP4027465B2 (ja) * 1997-07-01 2007-12-26 株式会社半導体エネルギー研究所 アクティブマトリクス型表示装置およびその製造方法

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