JP2000332257A5 - - Google Patents

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Publication number
JP2000332257A5
JP2000332257A5 JP2000066074A JP2000066074A JP2000332257A5 JP 2000332257 A5 JP2000332257 A5 JP 2000332257A5 JP 2000066074 A JP2000066074 A JP 2000066074A JP 2000066074 A JP2000066074 A JP 2000066074A JP 2000332257 A5 JP2000332257 A5 JP 2000332257A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000066074A
Other versions
JP4641586B2 (ja
JP2000332257A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000066074A priority Critical patent/JP4641586B2/ja
Priority claimed from JP2000066074A external-priority patent/JP4641586B2/ja
Publication of JP2000332257A publication Critical patent/JP2000332257A/ja
Publication of JP2000332257A5 publication Critical patent/JP2000332257A5/ja
Application granted granted Critical
Publication of JP4641586B2 publication Critical patent/JP4641586B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000066074A 1999-03-12 2000-03-10 半導体装置の作製方法 Expired - Fee Related JP4641586B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000066074A JP4641586B2 (ja) 1999-03-12 2000-03-10 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-65737 1999-03-12
JP6573799 1999-03-12
JP2000066074A JP4641586B2 (ja) 1999-03-12 2000-03-10 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2000332257A JP2000332257A (ja) 2000-11-30
JP2000332257A5 true JP2000332257A5 (ja) 2007-05-24
JP4641586B2 JP4641586B2 (ja) 2011-03-02

Family

ID=26406884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000066074A Expired - Fee Related JP4641586B2 (ja) 1999-03-12 2000-03-10 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP4641586B2 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI288443B (en) * 2002-05-17 2007-10-11 Semiconductor Energy Lab SiN film, semiconductor device, and the manufacturing method thereof
JP2005311037A (ja) * 2004-04-21 2005-11-04 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP2005333107A (ja) * 2004-04-21 2005-12-02 Mitsubishi Electric Corp 半導体装置、画像表示装置および半導体装置の製造方法
JP4641741B2 (ja) * 2004-05-28 2011-03-02 三菱電機株式会社 半導体装置
JP5414712B2 (ja) * 2011-02-21 2014-02-12 三菱電機株式会社 半導体装置

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