JP2000331726A - Electrical connector - Google Patents

Electrical connector

Info

Publication number
JP2000331726A
JP2000331726A JP13774499A JP13774499A JP2000331726A JP 2000331726 A JP2000331726 A JP 2000331726A JP 13774499 A JP13774499 A JP 13774499A JP 13774499 A JP13774499 A JP 13774499A JP 2000331726 A JP2000331726 A JP 2000331726A
Authority
JP
Japan
Prior art keywords
insulating sheet
elastic insulating
electrical connector
wire
electrode terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13774499A
Other languages
Japanese (ja)
Inventor
Susumu Iwama
進 岩間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP13774499A priority Critical patent/JP2000331726A/en
Publication of JP2000331726A publication Critical patent/JP2000331726A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide an electric connector, capable of improving in connection reliability by simplifying positioning and providing good conductivity by preventing bending and breakage of an electrically joining object, even when pressing force is increased. SOLUTION: This electrical connector comprises an elastic insulating sheet 4 of Shore A hardness of 10-70 deg. H interposed between a circuit substrate 6 and a surface type LSI 8, a plurality of wires 2 buried in the vertical directions of the elastic insulating sheet 4 and mutually separated with a certain pitch, and a contact 5 of a thickness of 50-500 μm attached on front and rear surfaces of the elastic insulating sheet 4, by using conductive polymer material formed by dispersing conductive filler to a polymer elastic body, connected with upper and lower end parts of each of the wires 2 exposed from the front and rear surfaces of the elastic insulating sheet 4, and contacting with each of a plurality of electrode terminals 7, 9 of the circuit substrate 6 and the surface mounting type LSI 8. Because the of the contact 5 of the wire 2 is large, positioning is facilitated, even when the electrode terminal 9 is small like a ball electrode and the like, so that improvement in connection reliability can be expected.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、回路基板と表面実
装型LSI等の電極端子を電気的に接続する電気コネク
タに関するものである。
[0001] 1. Field of the Invention [0002] The present invention relates to an electrical connector for electrically connecting a circuit board to an electrode terminal of a surface-mounted LSI or the like.

【0002】[0002]

【従来の技術】従来、表面実装型LSIを検査、使用す
る場合には、検査用、実用の回路基板の電極端子に表面
実装型LSIの電極端子を接続するため、両電極端子間
に押さえ治具である電気コネクタを挟んで圧下押圧して
いる。この種の最も一般的な電気コネクタは、図6に示
すように、回路基板と表面実装型LSIの間に介在され
る弾性絶縁シート4を備え、この弾性絶縁シート4の厚
さ方向に一定ピッチで相互に離隔する複数のワイヤ2が
埋設されており、この複数のワイヤ2の上下両端部が弾
性絶縁シート4の表裏面からそれぞれ僅かに露出して小
さなコンタクト5として機能する。
2. Description of the Related Art Conventionally, in the case of inspecting and using a surface-mounted LSI, in order to connect the electrode terminal of the surface-mounted LSI to the electrode terminal of a circuit board for inspection and practical use, it is necessary to hold down between the two electrode terminals. Is pressed down across the electrical connector which is a tool. As shown in FIG. 6, the most common electrical connector of this type includes an elastic insulating sheet 4 interposed between a circuit board and a surface-mounted LSI, and has a constant pitch in the thickness direction of the elastic insulating sheet 4. The upper and lower ends of the plurality of wires 2 are slightly exposed from the front and back surfaces of the elastic insulating sheet 4 to function as small contacts 5.

【0003】上記構成において、図示しない回路基板と
表面実装型LSIとを電気的に導通させる場合、回路基
板と表面実装型LSIとに電気コネクタを挟持させ、回
路基板の複数の電極端子にワイヤ2の下端のコンタクト
5を、表面実装型LSIの複数の電極端子にワイヤ2の
上端のコンタクト5をそれぞれ接触させる。そして、表
面実装型LSIを圧下押圧すれば、回路基板と表面実装
型LSIとを電気コネクタを介し電気的に導通させるこ
とができる。
In the above configuration, when a circuit board (not shown) is electrically connected to a surface-mount LSI, an electric connector is sandwiched between the circuit board and the surface-mount LSI, and wires 2 are connected to a plurality of electrode terminals of the circuit board. The contact 5 at the lower end of the wire 2 is brought into contact with the plurality of electrode terminals of the surface mount type LSI, respectively. Then, when the surface-mount LSI is pressed down, the circuit board and the surface-mount LSI can be electrically connected via the electric connector.

【0004】なお、この種の関連先行技術文献として、
特開平9−115577号、9−35789号、8−3
35486号、又は特許2796872号等があげられ
る。
As related prior art documents of this kind,
JP-A-9-115577, 9-35789, 8-3
No. 35486 and Japanese Patent No. 2796872.

【0005】[0005]

【発明が解決しようとする課題】従来の電気コネクタ
は、以上のように各ワイヤ2のコンタクト5の面積が実
に小さいので、回路基板の電極端子あるいは表面実装型
LSIの電極端子がボール電極のように小さい場合や三
次元形状に形成されている場合には、位置合わせがきわ
めて困難であり、接続の信頼性に欠けるという問題があ
った。さらに近年、表面実装型LSIが高機能化してい
るが、表面実装型LSIが高機能化してその電極端子が
増加すると、表面実装型LSIのサイズあるいは表面実
装型LSIと電気コネクタとの接触面積が拡大すること
となる。このため、安定した電極端子間の導通を得るの
に必要な押圧力が増大し、この結果、従来の電気コネク
タをそのまま使用したのでは、回路基板が撓んだり、表
面実装型LSIの電極端子やパッケージが撓んで破損
し、確実な導通を得ることができないおそれがある。
In the conventional electrical connector, since the area of the contact 5 of each wire 2 is very small as described above, the electrode terminal of the circuit board or the electrode terminal of the surface mount type LSI is like a ball electrode. In the case of a very small size or a three-dimensional shape, alignment is extremely difficult, and there is a problem that the reliability of the connection is lacking. In recent years, surface-mounted LSIs have become more sophisticated. However, as surface-mounted LSIs become more sophisticated and their electrode terminals increase, the size of the surface-mounted LSI or the contact area between the surface-mounted LSI and the electrical connector increases. It will expand. For this reason, the pressing force necessary for obtaining stable conduction between the electrode terminals is increased. As a result, if the conventional electrical connector is used as it is, the circuit board may be bent or the electrode terminals of the surface mount type LSI may not be used. And the package may be bent and damaged, so that reliable conduction may not be obtained.

【0006】本発明は、上記問題に鑑みなされたもの
で、位置合わせを容易にして接続の信頼性を向上させる
ことができるとともに、押圧力が増大しても、電気的接
合物の撓みや破損等を防止して良好な導通を得ることの
できる電気コネクタを提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and can improve the reliability of connection by facilitating the alignment, and can prevent the electrical joint from being bent or damaged even if the pressing force increases. It is an object of the present invention to provide an electrical connector that can prevent the occurrence of such problems and obtain good conduction.

【0007】[0007]

【課題を解決するための手段】請求項1記載の発明にお
いては、上記課題を達成するため、第一、第二の電気的
接合物の間に挟まれてこれらを電気的に導通させるもの
であって、上記第一、第二の電気的接合物の間に介在さ
れるショアA硬度10°〜70°の弾性絶縁シートと、
この弾性絶縁シートの厚さ方向に埋設され、一定ピッチ
で相互に離隔する複数の導電線条と、該弾性絶縁シート
の表裏面に導電性の高分子物質を用い厚さ50μm〜5
00μmにそれぞれ形成されるとともに、弾性絶縁シー
トの表裏面から露出した上記複数の導電線条の両端部に
接続され、上記第一、第二の電気的接合物の複数の電極
端子に接触する複数のコンタクトとを含んでなることを
特徴としている。
According to the first aspect of the present invention, in order to achieve the above object, the first and second electrical joints are sandwiched between and electrically connected to each other. An elastic insulating sheet having a Shore A hardness of 10 ° to 70 ° interposed between the first and second electrical joints;
A plurality of conductive strips buried in the thickness direction of the elastic insulating sheet and separated from each other at a constant pitch, and a conductive polymer material on the front and back surfaces of the elastic insulating sheet having a thickness of 50 μm to 5 μm.
Each of the plurality of conductive wires is formed to have a thickness of 00 μm, is connected to both ends of the plurality of conductive wires exposed from the front and back surfaces of the elastic insulating sheet, and contacts the plurality of electrode terminals of the first and second electrical joints. And a contact.

【0008】なお、上記高分子物質を、高分子の弾性体
に導電性フィラーを分散させた物質とし、上記各コンタ
クトを、上記第一、第二の電気的接合物の複数の電極端
子の配列ピッチに対して1/4〜3/4の大きさに形成
することができる。また、上記高分子物質を、導電性フ
ィラーが配合された熱硬化性樹脂又は熱可塑性樹脂に硬
化剤を添加した物質とし、上記各コンタクトを、上記第
一、第二の電気的接合物の複数の電極端子の配列ピッチ
に対して1/4〜3/5の大きさに形成することも可能
である。
The above-mentioned polymer substance is a substance in which a conductive filler is dispersed in a polymer elastic body, and each of the above-mentioned contacts is an array of a plurality of electrode terminals of the above-mentioned first and second electric joints. It can be formed in a size of 1 / to / of the pitch. In addition, the high-molecular substance is a thermosetting resin or a resin obtained by adding a curing agent to a thermoplastic resin mixed with a conductive filler, and each of the contacts is formed of a plurality of the first and second electrical joints. It is also possible to form them in a size of 1/4 to 3/5 with respect to the arrangement pitch of the electrode terminals.

【0009】ここで、特許請求の範囲における第一、第
二の電気的接合物としては、検査用回路基板、実用回路
基板、ビルドアップ配線板、BGA、LGA、FBG
A、PBGA等からなる表面実装型LSI、又は表面実
装型の電気電子部品等があげられる。導電線条として
は、弾性絶縁シートに腐食されず、体積抵抗率の小さい
線条が良い。具体的には、Cu、Au、Ni、Al、黄
銅、又は金メッキされた金属線等があげられる。この導
電線条を設ける方法としては、ウェッジボンディング
法、金属ボンディング法、超音波ワイヤボンディング
法、又は金属板に孔を開けて挿着する方法等がある。こ
の中でも、精度とスピードに優れる金属ボンディング法
が望ましい。金属板は、特に限定されるものではない
が、エッチング除去し易く、安価な板が良い。具体的に
は、最も手軽にエッチング可能な鉄系合金、例えば42
アロイ合金等が好ましい。
Here, the first and second electrical joints in the claims include a circuit board for inspection, a practical circuit board, a build-up wiring board, a BGA, an LGA, and an FBG.
A, a surface-mounted LSI composed of PBGA, etc., or a surface-mounted electric / electronic component. As the conductive wire, a wire which is not corroded by the elastic insulating sheet and has a small volume resistivity is preferable. Specifically, a metal wire plated with Cu, Au, Ni, Al, brass, or gold is used. Examples of a method for providing the conductive wire include a wedge bonding method, a metal bonding method, an ultrasonic wire bonding method, and a method of forming a hole in a metal plate and inserting the metal plate. Among them, a metal bonding method excellent in accuracy and speed is preferable. The metal plate is not particularly limited, but is preferably an inexpensive plate that can be easily removed by etching. Specifically, an iron-based alloy that can be etched most easily, for example, 42
Alloy alloys and the like are preferred.

【0010】請求項1記載の発明によれば、第一の電気
的接合物と第二の電気的接合物との間に電気コネクタを
挟み、第一の電気的接合物の電極端子に導電線条の一方
のコンタクトを、第二の電気的接合物の電極端子に導電
線条の他方のコンタクトをそれぞれ接触させる。そし
て、第二の電気的接合物に必要に応じて圧力を第一の電
気的接合物方向に向けて加えれば、第一、第二の電気的
接合物を電気コネクタを介し電気的に導通させることが
できる。各導電線条の端部に面積の大きいコンタクトを
別に設けるので、第一、第二の電気的接合物の電極端子
がボール電極のように小さい場合や三次元形状に形成さ
れている場合等でも、位置合わせが簡単になる。また、
弾性絶縁シートから各コンタクトが突出しているので、
第一、第二の電気的接合物の電極端子に対する追従性が
向上する。
According to the first aspect of the present invention, an electric connector is sandwiched between the first electric joint and the second electric joint, and the conductive wire is connected to the electrode terminal of the first electric joint. One contact of the strip is brought into contact with the electrode terminal of the second electrical joint with the other contact of the conductive strip. Then, if pressure is applied to the second electrical joint as needed in the direction of the first electrical joint, the first and second electrical joints are electrically conducted through the electric connector. be able to. Since a contact having a large area is separately provided at the end of each conductive wire, even when the electrode terminals of the first and second electrical joints are small like a ball electrode or formed in a three-dimensional shape, etc. Alignment is simplified. Also,
Since each contact protrudes from the elastic insulating sheet,
Followability of the first and second electrical joints to the electrode terminals is improved.

【0011】また、請求項2記載の発明によれば、各コ
ンタクトが弾性体なので、安定した電極端子間の導通を
得るのに必要な圧力を軽減することができる。したがっ
て、第一、第二の電気的接合物が撓んだり、損傷するこ
とがなく、良好な導通が期待できる。さらに、請求項3
記載の発明によれば、所定の剛性を有する樹脂製のコン
タクトが弾性絶縁シートから突出しているので、コンタ
クトに押圧力を集中させることができる。よって、比較
的小さな押圧力でも安定した電極端子間の導通を得るこ
とができる。
Further, according to the second aspect of the present invention, since each contact is an elastic body, it is possible to reduce the pressure required for obtaining stable conduction between the electrode terminals. Therefore, good conduction can be expected without the first and second electrical joints being bent or damaged. Further, claim 3
According to the described invention, since the resin contact having a predetermined rigidity protrudes from the elastic insulating sheet, the pressing force can be concentrated on the contact. Therefore, stable conduction between the electrode terminals can be obtained even with a relatively small pressing force.

【0012】[0012]

【発明の実施の形態】以下、図面を参照して本発明の好
ましい実施形態を説明するが、本発明は以下の実施形態
になんら限定されるものではない。本実施形態における
電気コネクタは、図1(a)、(b)、(c)、(d)、(e)や図2に示
すように、下方の回路基板6と上方の表面実装型LSI
8の間に介在される弾性絶縁シート4と、この弾性絶縁
シート4の厚さ方向、換言すれば、上下方向に埋設成形
される複数のワイヤ2と、エラストマーのような弾性体
に導電性フィラーを分散させた高分子物質を用いて弾性
絶縁シート4の表裏面にそれぞれ付着形成されるととも
に、弾性絶縁シート4の表裏面から僅かに露出した各ワ
イヤ2の上下両端部に接続される複数のコンタクト5と
を備え、回路基板6と表面実装型LSI8の複数の電極
端子7・9に複数のコンタクト5をそれぞれ接触させる
ようにしている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to the following embodiments. As shown in FIGS. 1 (a), 1 (b), 1 (c), 1 (d) and 1 (e) and FIG. 2, the electrical connector according to the present embodiment includes a lower circuit board 6 and an upper surface mount type LSI.
An elastic insulating sheet 4 interposed between the elastic insulating sheets 8, a plurality of wires 2 embedded and formed in the thickness direction of the elastic insulating sheet 4, in other words, a vertical direction, and a conductive filler formed on an elastic body such as an elastomer. Are formed on the front and back surfaces of the elastic insulating sheet 4 by using a polymer material in which a plurality of wires 2 are dispersed, and are connected to the upper and lower ends of each wire 2 slightly exposed from the front and back surfaces of the elastic insulating sheet 4. A contact 5 is provided, and the plurality of contacts 5 are respectively brought into contact with the circuit board 6 and the plurality of electrode terminals 7 and 9 of the surface-mounted LSI 8.

【0013】弾性絶縁シート4は、原料時に10〜50
0P程度の液状の物で、硬化後にはショアA硬度が10
〜70°H、好ましくは20〜50°Hのシート材料か
ら断面板形に成形される。具体的なシート材料として
は、高周波特性を考慮し、導電率の小さいシリコーンゴ
ムが使用される。
The elastic insulating sheet 4 has a thickness of 10 to 50 at the time of raw material.
It is a liquid substance of about 0P and has a Shore A hardness of 10 after curing.
It is formed into a plate-shaped cross section from a sheet material of 7070 ° H, preferably 20-50 ° H. As a specific sheet material, silicone rubber having a small conductivity is used in consideration of high-frequency characteristics.

【0014】複数のワイヤ2は、体積固有抵抗が小さ
く、腐食されにくいAuからなり、弾性絶縁シート4の
XY方向に一定ピッチで配列されて相互に離隔する。各
ワイヤ2は、直径10μm〜100μm程度に形成され、
略クランク形に屈曲して埋設されている。ワイヤ2の直
径を係る範囲としたのは、係る範囲の数値以下だと強度
が低下し、圧縮時にワイヤ2の破断するおそれがあるか
らである。逆に係る範囲の数値以上だと、押圧時にワイ
ヤ2が変形しにくくなって押圧に対する反発力が増大
し、結果的に安定な電極端子7・9間の導通を得るのに
必要な押圧力が増大するからである。各ワイヤ2の屈曲
部の傾斜角度は、0〜60°、好ましくは45°に設定
され、必要な押圧力の軽減が期待できる。
The plurality of wires 2 are made of Au having a small volume resistivity and hard to corrode, and are arranged at a constant pitch in the XY directions of the elastic insulating sheet 4 and are separated from each other. Each wire 2 is formed to have a diameter of about 10 μm to 100 μm,
It is bent and buried in a substantially crank shape. The reason why the diameter of the wire 2 is set to the range is that if the diameter is below the range, the strength is reduced and the wire 2 may be broken at the time of compression. On the other hand, if the value is not less than the numerical value in the range, the wire 2 is hardly deformed at the time of pressing, the repulsive force against the pressing increases, and as a result, the pressing force necessary to obtain stable conduction between the electrode terminals 7 and 9 is reduced. Because it increases. The inclination angle of the bent portion of each wire 2 is set to 0 to 60 °, preferably 45 °, and a reduction in necessary pressing force can be expected.

【0015】各コンタクト5を形成する導電性の高分子
物質としては、バインダーに柔軟なシリコーンやウレタ
ン等のエラストマーのような高分子の弾性体が使用され
る。導電性フィラーとしては、金粉、銀粉、ニッケル、
アルミ粉、メッキ粉、カーボン粉、又はグラファイト粉
を単体あるいは複数種組み合わせたフィラーが用いられ
る。この導電性フィラーの平均粒子径は、ワイヤ2の露
出部との接触確率を考慮し、使用されるワイヤ2の直径
以下、特に直径の1/10程度が最も好ましい。例え
ば、直径50μmのワイヤ2が使用される場合、導電性
フィラーの平均粒子径は50μm以下、5μm程度が最適
である。高分子物質は、原料状態では液状あるいはペー
スト状でその硬度が硬化後ショアA硬度10〜70°
H、好ましくは40〜60°Hが良い。硬化後の体積固
有抵抗は、5%程度圧縮された場合に10-7〜10-2Ω
m程度であることが望ましい。
As the conductive polymer material forming each contact 5, a polymer elastic material such as a flexible elastomer such as silicone or urethane is used as a binder. As the conductive filler, gold powder, silver powder, nickel,
A filler made of aluminum powder, plating powder, carbon powder, or graphite powder alone or in combination of two or more kinds is used. The average particle diameter of the conductive filler is most preferably not more than the diameter of the wire 2 used, particularly about 1/10 of the diameter, in consideration of the probability of contact with the exposed portion of the wire 2. For example, when a wire 2 having a diameter of 50 μm is used, the average particle diameter of the conductive filler is optimally 50 μm or less and about 5 μm. The polymer material is in a liquid state or a paste state in a raw material state and has a hardness of 10 to 70 ° Shore A hardness after curing.
H, preferably 40-60 ° H. The volume resistivity after curing is 10 -7 to 10 -2 Ω when compressed by about 5%.
m is desirable.

【0016】各コンタクト5は、図2に示すように、回
路基板6の電極端子7あるいは表面実装型LSI8の電
極端子9のピッチP1に対し1/4〜3/4程度の大き
さの円形、四角形等に形成される。例えば、電極端子7
・9のピッチP1が1mmピッチの場合、0.25mmから
0.75mmの大きさの円形、四角形等に形成される。各
コンタクト5は、50μmから500μm程度の厚さを有
する断面板形に形成される。これ以上薄いとコンタクト
5としての強度に欠け、これ以上厚いと高周波特性が悪
化するからである。
[0016] Each contact 5, as shown in FIG. 2, with respect to the electrode pitch P 1 of the terminal 9 of the electrode terminals 7 or a surface mount type LSI8 of the circuit board 6 of about 1 / 4-3 / 4 size circular , Square, etc. For example, the electrode terminal 7
If the pitch P 1 of-9 is 1mm pitch, circular size of 0.75mm from 0.25 mm, is formed in a rectangular shape or the like. Each contact 5 is formed in a plate shape in cross section having a thickness of about 50 μm to 500 μm. If the thickness is smaller than this, the strength of the contact 5 is lacking, and if the thickness is larger than this, the high frequency characteristics deteriorate.

【0017】次に、図1(a)、(b)、(c)、(d)、(e)に基づい
て本実施形態における電気コネクタの製造方法を詳説す
る。先ず、簡単にエッチングが可能な金属板である銅板
1を用意し、この銅板1上に図示しないワイヤボンダを
用いて低温接合が可能な超音波併用熱圧着ワイヤボンデ
ィングする。このワイヤボンディングにより、複数のワ
イヤ2は、略クランク形にボンディングされるととも
に、回路基板6や表面実装型LSI8の電極端子7・9
と同一の一定ピッチP1でXY方向に相互に離隔する(図
1(a)参照)。
Next, a method for manufacturing an electrical connector according to the present embodiment will be described in detail with reference to FIGS. 1 (a), 1 (b), 1 (c), 1 (d) and 1 (e). First, a copper plate 1 that is a metal plate that can be easily etched is prepared, and thermocompression bonding wire bonding with ultrasonic waves capable of low-temperature bonding is performed on the copper plate 1 using a wire bonder (not shown). By this wire bonding, the plurality of wires 2 are bonded in a substantially crank shape, and the electrode terminals 7.9 of the circuit board 6 and the surface mount type LSI 8 are formed.
Mutually spaced apart in the XY direction at the same predetermined pitch P 1 (see Figure 1 (a)).

【0018】次いで、銅板1上に複数のワイヤ2を包囲
する合成樹脂製の型枠3を設置し、この型枠3内にエラ
ストマー樹脂である注型樹脂を充填硬化させて弾性絶縁
シート4を成形し、この弾性絶縁シート4の平坦な表面
から各ワイヤ2の上端部を僅かに露出させる(図1(b)参
照)。各ワイヤ2の上端部を露出させたら、ケミカルエ
ッチングやブラスト法等の手段で銅板1を除去し、弾性
絶縁シート4の裏面から各ワイヤ2の下端部を僅かに露
出させる(図1(c)参照)。なお、ケミカルエッチングで
銅板1をエッチングする場合、エッチング液として塩化
第二鉄を使用すると良い。
Next, a synthetic resin mold 3 surrounding the plurality of wires 2 is placed on the copper plate 1, and a casting resin as an elastomer resin is filled and cured in the mold 3 to form the elastic insulating sheet 4. The upper end of each wire 2 is slightly exposed from the flat surface of the elastic insulating sheet 4 (see FIG. 1B). After the upper end of each wire 2 is exposed, the copper plate 1 is removed by means such as chemical etching or blasting, and the lower end of each wire 2 is slightly exposed from the back surface of the elastic insulating sheet 4 (FIG. 1 (c)). reference). When the copper plate 1 is etched by chemical etching, ferric chloride is preferably used as an etchant.

【0019】そして、弾性絶縁シート4の表裏両面に導
電性の高分子物質をそれぞれ付着させて複数のコンタク
ト5を配設し、各ワイヤ2の上下両端部のみに円形のコ
ンタクト5をそれぞれ接続して上下方向のみに導通する
ようにすれば、電気コネクタを製造することができる
(図1(d)、(e)参照)。コンタクト5を接続する手段とし
ては、スクリーン印刷法、メタルマスク法、ポッティン
グ法、又は転写法等を適宜採用すれば良い。
Then, a plurality of contacts 5 are provided by attaching a conductive polymer substance to both sides of the elastic insulating sheet 4, and circular contacts 5 are connected only to the upper and lower ends of each wire 2. Electrical connector can be manufactured by conducting only in the vertical direction.
(See FIGS. 1 (d) and 1 (e)). As a means for connecting the contact 5, a screen printing method, a metal mask method, a potting method, a transfer method, or the like may be appropriately employed.

【0020】上記構成において、回路基板6と表面実装
型LSI8とを電気的に導通させて検査する場合には、
回路基板6と表面実装型LSI8とに電気コネクタを挟
持させ、回路基板6の複数の電極端子7上にワイヤ2の
下端のコンタクト5を、表面実装型LSI8のボール形
を呈した複数の電極端子9にワイヤ2の上端のコンタク
ト5をそれぞれ位置決め接触させる。そして、表面実装
型LSI8を圧下押圧すれば、弾性絶縁シート4が変形
し、回路基板6と表面実装型LSI8とを電気コネクタ
を介し電気的に導通させて検査することができる。
In the above configuration, when the circuit board 6 and the surface-mount type LSI 8 are electrically connected for inspection,
An electrical connector is sandwiched between the circuit board 6 and the surface-mounted LSI 8, and the contact 5 at the lower end of the wire 2 is provided on the plurality of electrode terminals 7 of the circuit board 6, and the ball-shaped electrode terminals of the surface-mounted LSI 8 are provided. The contacts 5 on the upper end of the wire 2 are brought into position contact with the wires 9 respectively. Then, when the surface-mount type LSI 8 is pressed down, the elastic insulating sheet 4 is deformed, and the circuit board 6 and the surface-mount type LSI 8 can be electrically connected to each other via an electrical connector for inspection.

【0021】上記構成によれば、各ワイヤ2のコンタク
ト5の面積が大きいので、回路基板6の電極端子7ある
いは表面実装型LSI8の電極端子9がボール電極のよ
うに小さい場合や三次元形状に形成されている場合で
も、位置合わせや調整が実に容易であり、接続の信頼性
を著しく向上させることができる。また、ワイヤ2が略
クランク形にボンディングされ、コンタクト5が柔軟性
を有する弾性体なので、安定した電極端子7・9間の導
通を得るのに必要な押圧力を大幅に軽減することができ
る。したがって、回路基板6が撓んだり、表面実装型L
SI8の電極端子9やパッケージが撓んで破損すること
がなく、確実な導通を得ることが可能となる。
According to the above configuration, since the area of the contact 5 of each wire 2 is large, the electrode terminal 7 of the circuit board 6 or the electrode terminal 9 of the surface mount type LSI 8 is small like a ball electrode, or has a three-dimensional shape. Even if it is formed, positioning and adjustment are very easy, and the reliability of the connection can be significantly improved. Further, since the wire 2 is bonded in a substantially crank shape and the contact 5 is an elastic body having flexibility, the pressing force required for obtaining stable conduction between the electrode terminals 7 and 9 can be greatly reduced. Therefore, the circuit board 6 is bent or the surface mount type L
The electrode terminals 9 of the SI 8 and the package are not bent and damaged, so that reliable conduction can be obtained.

【0022】また、弾性絶縁シート4から複数のコンタ
クト5が突出配備されているので、回路基板6の電極端
子7や表面実装型LSI8の電極端子9に対する追従性
を著しく向上させて接触面積を広くすることができる。
この追従性の向上は、表面実装型LSI8の電極端子9
がボールの場合や回路基板6の電極端子7が突起形の場
合、換言すれば、電極端子7・9が三次元形状の場合、
特に有益である。また、スクリーン印刷法、メタルマス
ク法、ポッティング法、又は転写法等により弾性絶縁シ
ート4の表裏両面に導電性の高分子物質をそれぞれ付着
させるので、コンタクト5の厚さや形状の制御の容易化
が大いに期待できる。
Further, since the plurality of contacts 5 are provided so as to protrude from the elastic insulating sheet 4, the ability to follow the electrode terminals 7 of the circuit board 6 and the electrode terminals 9 of the surface mount type LSI 8 is remarkably improved, and the contact area is widened. can do.
This improvement in the followability is achieved by the electrode terminals 9 of the surface-mounted LSI 8.
Is a ball or when the electrode terminals 7 of the circuit board 6 are in a projection shape, in other words, when the electrode terminals 7 and 9 have a three-dimensional shape,
Particularly useful. In addition, since conductive polymer substances are respectively attached to the front and back surfaces of the elastic insulating sheet 4 by a screen printing method, a metal mask method, a potting method, a transfer method, or the like, the thickness and shape of the contact 5 can be easily controlled. We can expect much.

【0023】以上のことから、大型あるいは多ピンのL
GAやBGA等のような表面実装型LSI8でも、検査
用実用の回路基板6に対して僅かな押圧力で確実な接続
が期待でき、表面実装型LSI8のパッケージや電極端
子9を損なうことがない。さらに、検査時間や組み込み
時間を短縮し、効率的な接続作業が大いに期待できる。
さらにまた、導通路が短いので高周波特性に優れ、しか
も、電気コネクタを容易かつ歩留まり良く製造すること
が可能となる。
From the above, the large or multi-pin L
Even with a surface-mounted LSI 8 such as a GA or BGA, a reliable connection can be expected with a small pressing force to the practical circuit board 6 for inspection, and the package and the electrode terminals 9 of the surface-mounted LSI 8 are not damaged. . In addition, inspection time and installation time can be reduced, and efficient connection work can be greatly expected.
Furthermore, since the conduction path is short, the high frequency characteristics are excellent, and the electrical connector can be manufactured easily and with good yield.

【0024】次に、図3(a)、(b)、(c)及び図4は本発明
の第2の実施形態を示すもので、この場合には、導電性
の高分子物質を、導電性フィラーが配合された熱硬化性
樹脂又は熱可塑性樹脂に硬化剤を添加した導電性シート
10とし、各コンタクト5を、回路基板6Aや表面実装
型LSI8Aの複数の電極端子7A・9Aの配列ピッチ
2に対して所定の大きさに形成するようにしている。
Next, FIGS. 3 (a), 3 (b), 3 (c) and 4 show a second embodiment of the present invention. A conductive sheet 10 obtained by adding a curing agent to a thermosetting resin or a thermoplastic resin containing a conductive filler, and each contact 5 is arranged at a pitch of a plurality of electrode terminals 7A and 9A of a circuit board 6A or a surface mount LSI 8A. and so as to form a predetermined size with respect to P 2.

【0025】熱硬化性樹脂としては、エポキシ樹脂、ア
クリル樹脂、又はポリイミド等を使用することができ
る。熱可塑性樹脂としては、ポリエステル等を用いるこ
とが可能である。高分子物質は、原料状態では液状、ペ
ースト状、又はフィルム状であることが好ましい。この
高分子物質は、硬化後の硬度が鉛筆硬度6B〜9H、好
ましくは3H〜9H、硬化後の体積固有抵抗が10-7
10-2Ωm程度であることが望ましい。
As the thermosetting resin, epoxy resin, acrylic resin, polyimide or the like can be used. As the thermoplastic resin, polyester or the like can be used. The polymer substance is preferably in a liquid state, a paste state, or a film state in a raw material state. This polymer substance has a pencil hardness of 6B to 9H after curing, preferably 3H to 9H, and a volume resistivity after curing of 10 −7 to 10 −7 .
It is desirable to be about 10 -2 Ωm.

【0026】各コンタクト5は、回路基板6Aや表面実
装型LSI8Aの複数の電極端子7A・9Aの配列ピッ
チP2に対して1/4〜3/4程度の大きさの円形、四
角形等に形成される。例えば、電極端子7A・9Aの配
列ピッチP2が1mmピッチの場合、0.25mm〜0.7
5mmの円形、四角形等に形成される。各コンタクト5
は、100μmから500μm程度の厚さを有する断面板
形に形成される。これ以上薄いと弾性絶縁シート4から
コンタクト5の突出量が少ないため、押圧を集中させる
効力が得にくいからである。また、上記数値よりも厚い
と、高周波特性が悪化するからである。
[0026] formed in each contact 5 is circular circuit board 6A and relative arrangement pitch P 2 of the plurality of electrode terminals 7A · 9A of the surface mount LSI8A 1 / 4~3 / 4 about the size, square, etc. Is done. For example, if the arrangement pitch P 2 of the electrode terminal 7A · 9A is 1mm pitch, 0.25Mm~0.7
It is formed in a 5 mm circular or square shape. Each contact 5
Is formed in a plate shape in cross section having a thickness of about 100 μm to 500 μm. If the thickness is smaller than this, the amount of protrusion of the contact 5 from the elastic insulating sheet 4 is small, so that it is difficult to obtain the effect of concentrating the pressing. On the other hand, if the thickness is larger than the above value, the high frequency characteristics deteriorate.

【0027】次に、図3(a)、(b)、(c)等に基づいて本実
施形態における電気コネクタの製造方法を説明する。先
ず、第一の導電性シート10Aを用意し、この第一の導
電性シート10A上に図示しないワイヤボンダを用いて
低温接合が可能な超音波併用熱圧着ワイヤボンディング
する。このワイヤボンディングにより、複数のワイヤ2
は、略クランク形にボンディングされるとともに、回路
基板6Aや表面実装型LSI8Aの電極端子7A・9A
と同一の一定ピッチP2でXY方向に相互に離隔する。
Next, a method of manufacturing the electrical connector according to the present embodiment will be described with reference to FIGS. 3 (a), 3 (b), 3 (c) and the like. First, a first conductive sheet 10A is prepared, and ultrasonic combined thermocompression wire bonding capable of low-temperature bonding is performed on the first conductive sheet 10A using a wire bonder (not shown). By this wire bonding, a plurality of wires 2
Are bonded to the circuit board 6A and the electrode terminals 7A and 9A of the surface mount type LSI 8A.
Mutually spaced apart in the XY directions at the same constant pitch P 2 and.

【0028】次いで、第一の導電性シート10A上に複
数のワイヤ2を包囲する合成樹脂製の型枠3を設置し、
この型枠3内にエラストマー樹脂である注型樹脂を充填
硬化させて弾性絶縁シート4を成形する。そして、この
弾性絶縁シート4の表面から各ワイヤ2の上端部を僅か
に露出させ、弾性絶縁シート4の表面に第二の導電性シ
ート10Bを積層貼着して各ワイヤ2の上端部と第二の
導電性シート10Bとを接続する(図3(a)参照)。
Next, a synthetic resin form 3 surrounding the plurality of wires 2 is set on the first conductive sheet 10A.
The mold frame 3 is filled with a casting resin, which is an elastomer resin, and cured to form the elastic insulating sheet 4. Then, the upper end of each wire 2 is slightly exposed from the surface of the elastic insulating sheet 4, and the second conductive sheet 10B is laminated and adhered to the surface of the elastic insulating sheet 4, and the upper end of each wire 2 is The two conductive sheets 10B are connected (see FIG. 3A).

【0029】各ワイヤ2の上端部と第二の導電性シート
10Bとを接続したら、第一、第二の導電性シート10
A・10Bをレーザ光、カッタ、水、又はサンドブラス
ト等を用いてそれぞれ部分的に、具体的には格子形にカ
ットし、第一、第二の導電性シート10A・10Bの残
部を複数のコンタクト5として電気コネクタを製造する
(図3(b)、(c)参照)。なお、第一、第二の導電性シート
10A・10Bが熱可塑性樹脂の場合、熱による融解法
等でカットすることが可能である。
After the upper end of each wire 2 is connected to the second conductive sheet 10B, the first and second conductive sheets 10B are connected.
A · 10B is partially cut, specifically, into a lattice shape using a laser beam, a cutter, water, sandblast, or the like, and the remaining portions of the first and second conductive sheets 10A and 10B are contacted with a plurality of contacts. Manufacturing electrical connector as 5
(See FIGS. 3B and 3C). When the first and second conductive sheets 10A and 10B are made of a thermoplastic resin, they can be cut by a melting method using heat or the like.

【0030】上記構成において、回路基板6Aと表面実
装型LSI8Aとを電気的に導通させて検査する場合、
回路基板6Aと表面実装型LSI8Aとに電気コネクタ
を挟持させ、回路基板6Aの面状を呈した複数の電極端
子7A上にワイヤ2の下端のコンタクト5を、表面実装
型LSI8Aの面状を呈した複数の電極端子9Aにワイ
ヤ2の上端のコンタクト5をそれぞれ位置決め接触させ
る。そして、表面実装型LSI8Aを圧下押圧すれば、
弾性絶縁シート4が変形し、回路基板6Aと表面実装型
LSI8Aとを電気コネクタを介し電気的に導通させて
検査することができる。その他の部分については、上記
実施形態と同様であるので説明を省略する。
In the above configuration, when the circuit board 6A and the surface-mount type LSI 8A are electrically connected for inspection,
An electrical connector is sandwiched between the circuit board 6A and the surface-mounted LSI 8A, and the contacts 5 at the lower end of the wire 2 are provided on the plurality of electrode terminals 7A having the surface of the circuit board 6A, and the surface of the surface-mounted LSI 8A is provided. The contacts 5 at the upper ends of the wires 2 are brought into positioning contact with the plurality of electrode terminals 9A, respectively. Then, if the surface mount type LSI 8A is pressed down,
The elastic insulating sheet 4 is deformed, and the circuit board 6A and the surface-mounted LSI 8A can be electrically connected to each other via an electrical connector for inspection. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

【0031】本実施形態においても上記実施形態と同様
の作用効果が期待でき、しかも、ある程度の剛性を有す
る樹脂製のコンタクト5が弾性絶縁シート4から突出し
ているので、コンタクト5に押圧力をきわめて容易に集
中させることができる。したがって、僅かな押圧力でも
安定した電極端子7A・9A間の導通を得ることができ
る。この安定した導通は、表面実装型LSI8Aのサイ
ズや回路基板6Aと表面実装型LSI8Aの接触面積が
増加した場合、あるいは電極端子7A・9Aが面状の場
合に実に有益である。
In this embodiment, the same operation and effect as those of the above embodiment can be expected. Further, since the resin contact 5 having a certain degree of rigidity protrudes from the elastic insulating sheet 4, the pressing force on the contact 5 is extremely high. It can be easily focused. Accordingly, stable conduction between the electrode terminals 7A and 9A can be obtained even with a small pressing force. This stable conduction is really useful when the size of the surface mount LSI 8A or the contact area between the circuit board 6A and the surface mount LSI 8A increases, or when the electrode terminals 7A and 9A are planar.

【0032】なお、上記実施形態では略クランク形にワ
イヤボンディングしたものを示したが、押圧力を軽減可
能なものであれば、なんらこれに限定されるものではな
い。例えば、図5に示すように、弾性絶縁シート4の厚
さ方向(法線)に直線のワイヤ2を30〜60°、好まし
くは45°傾斜させて押圧力を軽減させても良い。ま
た、ワイヤ2を略S字や略く字形等に屈曲形成しても良
い。この場合、ワイヤ2の屈曲部の傾斜角度を0〜60
°、好ましくは45°とすると、必要な押圧力の軽減に
有効である。さらに、表面実装型LSI8、8Aを圧下
押圧して回路基板6、6Aと表面実装型LSI8、8A
とを導通させるのではなく、回路基板6、6Aと表面実
装型LSI8、8Aとの間に電気コネクタを単に介在さ
せて導通させることも可能である。
In the above embodiment, the wire bonding is performed in a substantially crank shape. However, the wire bonding is not limited to this as long as the pressing force can be reduced. For example, as shown in FIG. 5, the pressing force may be reduced by inclining the linear wire 2 in the thickness direction (normal line) of the elastic insulating sheet 4 by 30 to 60 °, preferably 45 °. Further, the wire 2 may be formed to be bent into a substantially S-shape or a substantially U-shape. In this case, the inclination angle of the bent portion of the wire 2 is set to 0 to 60.
The angle, preferably 45 °, is effective in reducing the necessary pressing force. Further, the circuit boards 6, 6A and the surface-mounted LSIs 8, 8A are pressed down by pressing the surface-mounted LSIs 8, 8A.
It is also possible to conduct the electric current by simply interposing an electrical connector between the circuit boards 6 and 6A and the surface-mount LSIs 8 and 8A instead of conducting the electric current.

【0033】[0033]

【実施例】実施例1 厚さ0.5mm、縦横それぞれ30mmの銅板1上に直径5
0μmのワイヤ2を公知のワイヤボンディング法によ
り、2.0mmのピッチで縦横26mmの範囲に垂直にボン
ディングした。次いで、複数のワイヤ2のボンディング
範囲に2液性シリコーンゴムKE−109A/B[信越
化学工業(株)製、商品名]を型枠3を介し充填して12
0℃/2hの条件で硬化させ、弾性絶縁シート4を成形
した。この弾性絶縁シート成形の際、弾性絶縁シート4
の厚みを2.5mmとし、この弾性絶縁シート4の表面か
ら各ワイヤ2の上端部を露出させた。各ワイヤ2の上端
部を露出させたら、銅板1を塩化第二鉄でエッチングし
て除去し、弾性絶縁シート4の裏面から複数のワイヤ2
の下端部をそれぞれ露出させた。
EXAMPLE 1 A copper sheet 1 having a thickness of 0.5 mm and a length and width of 30 mm was placed on a copper plate 1 having a diameter of 5 mm.
A wire 2 of 0 μm was vertically bonded at a pitch of 2.0 mm in a range of 26 mm in length and width by a known wire bonding method. Next, the two-component silicone rubber KE-109A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., trade name) is filled into the bonding area of the plurality of wires 2 via the mold 3 and
The composition was cured under the condition of 0 ° C./2 h to form the elastic insulating sheet 4. When forming the elastic insulating sheet, the elastic insulating sheet 4
Was made 2.5 mm thick, and the upper end of each wire 2 was exposed from the surface of the elastic insulating sheet 4. When the upper end of each wire 2 is exposed, the copper plate 1 is removed by etching with ferric chloride, and a plurality of wires 2
Were exposed at their lower ends.

【0034】そして、弾性絶縁シート4から露出した各
ワイヤ2の両端部のみに弾性体の導電性物質3303
[(株)スリーボンド製、商品名]をメタルマスク法により
φ1.0mm、高さ100μmに形成して加熱硬化し、外
形が縦30mm、横30mmの電気コネクタを製造した。こ
の電気コネクタを、検査用の回路基板6Aの電極端子7
Aと表面実装型LSI8Aの面状の電極端子9Aとに挟
持させ、15%圧縮したところ、電極端子7A・9A間
に確実な導通を得たが、この場合の押圧力は従来の1/
2に低減することができた。また、従来の電気コネクタ
は、位置調整が困難で、安定して接続することができな
かった。これに対し、本実施例の電気コネクタは、電極
端子7がボール形の表面実装型LSI8の場合において
も、同様に15%圧縮したところ、電極端子7・9間に
確実な導通を確認することができた。
The elastic conductive material 3303 is applied only to both ends of each wire 2 exposed from the elastic insulating sheet 4.
[Trade name, manufactured by Three Bond Co., Ltd.] was formed to have a diameter of 1.0 mm and a height of 100 μm by a metal mask method, and was heat-cured to produce an electrical connector having an outer shape of 30 mm long and 30 mm wide. This electrical connector is connected to the electrode terminals 7 of the inspection circuit board 6A.
A and the surface electrode 9A of the surface-mount type LSI 8A were sandwiched and compressed by 15%. As a result, reliable conduction was obtained between the electrode terminals 7A and 9A.
2 could be reduced. In addition, the position adjustment of the conventional electrical connector is difficult, and the conventional electrical connector cannot be connected stably. On the other hand, in the electrical connector of the present embodiment, when the electrode terminals 7 were similarly compressed by 15% even when the ball-shaped surface-mounted LSI 8 was used, it was confirmed that reliable conduction was established between the electrode terminals 7 and 9. Was completed.

【0035】実施例2 厚さ0.5mm、縦横それぞれ30mmの銅板1上に直径5
0μmのワイヤ2を公知のワイヤボンディング法によ
り、2.0mmのピッチで縦横26mmの範囲に垂直にボン
ディングした。次いで、複数のワイヤ2のボンディング
範囲に2液性シリコーンゴムKE−109A/B[信越
化学工業(株)製、商品名]を型枠3を介し充填して12
0℃/2hの条件で硬化させ、弾性絶縁シート4を成形
した。この弾性絶縁シート成形の際、弾性絶縁シート4
の厚みを2.5mmとし、この弾性絶縁シート4の表面か
ら各ワイヤ2の上端部を露出させた。複数のワイヤ2の
上端部を露出させたら、銅板1を塩化第二鉄でエッチン
グして除去し、弾性絶縁シート4の裏面から複数のワイ
ヤ2の下端部をそれぞれ露出させた。
Example 2 A copper sheet 1 having a thickness of 0.5 mm and a length and width of 30 mm was placed on a copper plate 1 having a diameter of 5 mm.
A wire 2 of 0 μm was vertically bonded at a pitch of 2.0 mm in a range of 26 mm in length and width by a known wire bonding method. Next, the two-component silicone rubber KE-109A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., trade name) is filled into the bonding area of the plurality of wires 2 via the mold 3 and
The composition was cured under the condition of 0 ° C./2 h to form the elastic insulating sheet 4. When forming the elastic insulating sheet, the elastic insulating sheet 4
Was made 2.5 mm thick, and the upper end of each wire 2 was exposed from the surface of the elastic insulating sheet 4. After the upper ends of the wires 2 were exposed, the copper plate 1 was removed by etching with ferric chloride, and the lower ends of the wires 2 were exposed from the back surface of the elastic insulating sheet 4.

【0036】そして、弾性絶縁シート4から露出した各
ワイヤ2の両端部のみに熱硬化性の導電性接着剤330
1[(株)スリーボンド製]をメタルマスク法によりφ0.
8mm、厚さ100μmに形成して加熱硬化し、外形が縦
30mm、横30mmの電気コネクタを製造した。この電気
コネクタを、検査用の回路基板6Aの電極端子7Aと表
面実装型LSI8Aの面状の電極端子9Aとに挟持さ
せ、15%圧縮したところ、電極端子7A・9A間に確
実な導通を得た。この場合の押圧力も従来の1/3に抑
制することができた。
The thermosetting conductive adhesive 330 is applied only to both ends of each wire 2 exposed from the elastic insulating sheet 4.
1 [Made by Three Bond Co., Ltd.]
An electrical connector having an outer shape of 30 mm in length and 30 mm in width was manufactured by heating and hardening to form a connector having a thickness of 8 mm and a thickness of 100 μm. When this electrical connector is sandwiched between the electrode terminals 7A of the inspection circuit board 6A and the planar electrode terminals 9A of the surface mount LSI 8A and compressed by 15%, reliable conduction between the electrode terminals 7A and 9A is obtained. Was. The pressing force in this case was also reduced to 1/3 of the conventional one.

【0037】実施例3 厚さ0.5mm、縦横それぞれ30mmの銅板1上に直径5
0μmのワイヤ2を公知のワイヤボンディング法によ
り、2.0mmのピッチで縦横26mmの範囲に垂直にボン
ディングした。次いで、複数のワイヤ2のボンディング
範囲に2液性シリコーンゴムKE−109A/B[信越
化学工業(株)製、商品名]を型枠3を介し充填して12
0℃/2hの条件で硬化させ、弾性絶縁シート4を成形
した。この弾性絶縁シート成形の際、弾性絶縁シート4
の厚みを2.5mmとし、この弾性絶縁シート4の表面か
ら各ワイヤ2の上端部を露出させた。各ワイヤ2の上端
部を露出させたら、銅板1を塩化第二鉄でエッチングし
て除去し、弾性絶縁シート4の裏面から複数のワイヤ2
の下端部をそれぞれ露出させた。
Example 3 A copper plate 1 having a thickness of 0.5 mm and a length and width of 30 mm was placed on a copper plate 1 having a diameter of 5 mm.
A wire 2 of 0 μm was vertically bonded at a pitch of 2.0 mm in a range of 26 mm in length and width by a known wire bonding method. Next, the two-component silicone rubber KE-109A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd., trade name) is filled into the bonding area of the plurality of wires 2 via the mold 3 and
The composition was cured under the condition of 0 ° C./2 h to form the elastic insulating sheet 4. When forming the elastic insulating sheet, the elastic insulating sheet 4
Was made 2.5 mm thick, and the upper end of each wire 2 was exposed from the surface of the elastic insulating sheet 4. When the upper end of each wire 2 is exposed, the copper plate 1 is removed by etching with ferric chloride, and a plurality of wires 2
Were exposed at their lower ends.

【0038】そして、弾性絶縁シート4から露出した各
ワイヤ2の両端部のみに熱可塑性樹脂を使用した導電性
接着剤DX−152H−1[東洋紡(株)製、商品名]をメ
タルマスク法によりφ0.8mm、厚さ100μmに形成
して加熱硬化し、外形が縦30mm、横30mmの電気コネ
クタを製造した。この電気コネクタを、検査用の回路基
板6Aの電極端子7Aと表面実装型LSI8Aの面状の
電極端子9Aとに挟持させ、15%圧縮したところ、電
極端子7A・9A間に確実な導通を得た。この場合の押
圧力も従来の1/3に低減することができた。
Then, a conductive adhesive DX-152H-1 [trade name, manufactured by Toyobo Co., Ltd.] using a thermoplastic resin only at both end portions of each wire 2 exposed from the elastic insulating sheet 4 by a metal mask method. An electrical connector having an outer shape of 30 mm in length and 30 mm in width was manufactured by forming into a diameter of 0.8 mm and a thickness of 100 μm and curing by heating. When this electrical connector is sandwiched between the electrode terminals 7A of the inspection circuit board 6A and the planar electrode terminals 9A of the surface mount LSI 8A and compressed by 15%, reliable conduction between the electrode terminals 7A and 9A is obtained. Was. The pressing force in this case was also reduced to 1/3 of the conventional one.

【0039】[0039]

【発明の効果】以上のように本発明によれば、電気的接
合物の位置合わせを容易にして接続の信頼性を向上させ
ることができるという効果がある。また、電気的接合物
の高機能化に伴い押圧力が増大しても、電気的接合物の
撓みや破損等を防止して良好な導通を得ることが可能に
なる。
As described above, according to the present invention, there is an effect that the alignment of the electrical joint can be easily performed and the reliability of the connection can be improved. In addition, even if the pressing force is increased in accordance with the sophistication of the electrical joint, it is possible to prevent the electrical joint from being bent or damaged, and to obtain good conduction.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る電気コネクタの実施形態を示す説
明図で、(a)図は銅板上にワイヤボンディングした状態
を示す断面説明図、(b)図は型枠内に注型樹脂を充填硬化
させて弾性絶縁シートを成形した状態を示す断面説明
図、(c)図は銅板を除去し、弾性絶縁シートの裏面から各
ワイヤの下端部を僅かに露出させた状態を示す断面説明
図、(d)図は弾性絶縁シートの表裏両面に導電性の高分子
物質をそれぞれ設け、各ワイヤの上下両端部にコンタク
トを接続した状態を示す断面説明図、(e)図は(d)図の平
面図である。
FIG. 1 is an explanatory view showing an embodiment of an electrical connector according to the present invention, wherein FIG. 1 (a) is a cross-sectional explanatory view showing a state of wire bonding on a copper plate, and FIG. Sectional explanatory view showing a state in which the elastic insulating sheet is molded by filling and curing, and (c) is a sectional explanatory view showing a state in which the copper plate is removed and the lower ends of the respective wires are slightly exposed from the back surface of the elastic insulating sheet. (D) is a cross-sectional explanatory view showing a state in which conductive polymer substances are provided on both front and back surfaces of the elastic insulating sheet, and contacts are connected to upper and lower ends of each wire, and (e) is (d) FIG. FIG.

【図2】本発明に係る電気コネクタの実施形態における
使用状態を示す断面説明図である。
FIG. 2 is an explanatory sectional view showing a use state of the electric connector according to the embodiment of the present invention.

【図3】本発明に係る電気コネクタの第2の実施形態を
示す説明図で、(a)図は弾性絶縁シートの表面から各ワ
イヤの上端部を僅かに露出させ、弾性絶縁シートの表面
に第二の導電性シートを積層貼着して各ワイヤの上端部
と第二の導電性シートとを接続した状態を示す断面説明
図、(b)図は第一、第二の導電性シートを格子形にカット
した状態を示す断面説明図、(c)図は(b)図の平面図であ
る。
FIG. 3 is an explanatory view showing a second embodiment of the electric connector according to the present invention, in which FIG. 3 (a) shows the upper end of each wire slightly exposed from the surface of the elastic insulating sheet, and Cross-sectional explanatory view showing a state where the second conductive sheet is laminated and attached and the upper end of each wire and the second conductive sheet are connected, (b) diagram is a first, the second conductive sheet FIG. 4 is a cross-sectional explanatory view showing a state of being cut into a lattice shape, and FIG. 4C is a plan view of FIG.

【図4】本発明に係る電気コネクタの第2の実施形態に
おける使用状態を示す断面説明図である。
FIG. 4 is an explanatory sectional view showing a use state of an electric connector according to a second embodiment of the present invention.

【図5】本発明に係る電気コネクタの他の実施形態を示
す断面説明図である。
FIG. 5 is an explanatory sectional view showing another embodiment of the electric connector according to the present invention.

【図6】従来の電気コネクタを示す断面説明図である。FIG. 6 is an explanatory sectional view showing a conventional electrical connector.

【符号の説明】[Explanation of symbols]

1 銅板 2 ワイヤ(導電線条) 3 型枠 4 弾性絶縁シート 5 コンタクト 6 回路基板(第一の電気的接合物) 6A 回路基板(第一の電気的接合物) 7 電極端子 7A 電極端子 8 表面実装型LSI(第二の電気的接合物) 8A 表面実装型LSI(第二の電気的接合物) 9 電極端子 9A 電極端子 10 導電性シート 10A 第一の導電性シート 10B 第二の導電性シート DESCRIPTION OF SYMBOLS 1 Copper plate 2 Wire (conductive wire) 3 Formwork 4 Elastic insulating sheet 5 Contact 6 Circuit board (1st electrical connection) 6A Circuit board (1st electrical connection) 7 Electrode terminal 7A Electrode terminal 8 Surface Mounting type LSI (second electrical connection) 8A Surface mounting type LSI (second electrical connection) 9 Electrode terminal 9A Electrode terminal 10 Conductive sheet 10A First conductive sheet 10B Second conductive sheet

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 第一、第二の電気的接合物の間に挟まれ
てこれらを電気的に導通させる電気コネクタであって、 上記第一、第二の電気的接合物の間に介在されるショア
A硬度10°〜70°の弾性絶縁シートと、この弾性絶
縁シートの厚さ方向に埋設され、一定ピッチで相互に離
隔する複数の導電線条と、該弾性絶縁シートの表裏面に
導電性の高分子物質を用い厚さ50μm〜500μmにそ
れぞれ形成されるとともに、弾性絶縁シートの表裏面か
ら露出した上記複数の導電線条の両端部に接続され、上
記第一、第二の電気的接合物の複数の電極端子に接触す
る複数のコンタクトとを含んでなることを特徴とする電
気コネクタ。
1. An electrical connector sandwiched between first and second electrical joints to electrically connect them, said electrical connector being interposed between said first and second electrical joints. An elastic insulating sheet having a Shore A hardness of 10 ° to 70 °, a plurality of conductive strips embedded in the thickness direction of the elastic insulating sheet and separated from each other at a constant pitch, Each having a thickness of 50 μm to 500 μm using a conductive polymer material, connected to both ends of the plurality of conductive wires exposed from the front and back surfaces of the elastic insulating sheet, and forming the first and second electric wires. An electrical connector comprising: a plurality of contacts in contact with a plurality of electrode terminals of a joined object.
【請求項2】 上記高分子物質を、高分子の弾性体に導
電性フィラーを分散させた物質とし、上記各コンタクト
を、上記第一、第二の電気的接合物の複数の電極端子の
配列ピッチに対して1/4〜3/4の大きさに形成した
請求項1記載の電気コネクタ。
2. The method according to claim 1, wherein the polymer material is a material in which a conductive filler is dispersed in a polymer elastic material, and each of the contacts is an array of a plurality of electrode terminals of the first and second electrical joints. The electrical connector according to claim 1, wherein the electrical connector is formed to have a size of 1/4 to 3/4 of the pitch.
【請求項3】 上記高分子物質を、導電性フィラーが配
合された熱硬化性樹脂又は熱可塑性樹脂に硬化剤を添加
した物質とし、上記各コンタクトを、上記第一、第二の
電気的接合物の複数の電極端子の配列ピッチに対して1
/4〜3/5の大きさに形成した請求項1記載の電気コ
ネクタ。
3. The method according to claim 1, wherein the polymer substance is a thermosetting resin containing a conductive filler or a substance obtained by adding a curing agent to a thermoplastic resin. 1 for the arrangement pitch of a plurality of electrode terminals
2. The electrical connector according to claim 1, wherein the electrical connector is formed in a size of to 3.
JP13774499A 1999-05-18 1999-05-18 Electrical connector Pending JP2000331726A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13774499A JP2000331726A (en) 1999-05-18 1999-05-18 Electrical connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13774499A JP2000331726A (en) 1999-05-18 1999-05-18 Electrical connector

Publications (1)

Publication Number Publication Date
JP2000331726A true JP2000331726A (en) 2000-11-30

Family

ID=15205825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13774499A Pending JP2000331726A (en) 1999-05-18 1999-05-18 Electrical connector

Country Status (1)

Country Link
JP (1) JP2000331726A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002324601A (en) * 2001-04-25 2002-11-08 Nbc Inc Connector
JP2011522356A (en) * 2008-05-01 2011-07-28 スリーエム イノベイティブ プロパティズ カンパニー Elastic conductive connector
WO2019244948A1 (en) * 2018-06-19 2019-12-26 積水ポリマテック株式会社 Conductive rubber connector and method for manufacturing conductive rubber connector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002324601A (en) * 2001-04-25 2002-11-08 Nbc Inc Connector
JP2011522356A (en) * 2008-05-01 2011-07-28 スリーエム イノベイティブ プロパティズ カンパニー Elastic conductive connector
WO2019244948A1 (en) * 2018-06-19 2019-12-26 積水ポリマテック株式会社 Conductive rubber connector and method for manufacturing conductive rubber connector

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