JP2001160434A - Electric connector and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric connector and its manufacturing method in which the damage to electric/electronic parts and circuit board is restrained and prevented, and the positioning is easily made so that the connecting reliability can be improved. SOLUTION: A molding frame 5 is disposed via a holder 6 between a circuit board 1 and an IC package 3 consisting of LGA, and an insulating elastomer layer 8 is built in the molding frame 5, and a plurality of conductive wires 9 are arranged and embedded in a row in the thickness direction of the elastomer layer 8, and respective conductive wires 9 are formed in nearly crank-arm shape. Then, the first contacts 10 to join to one end part of respective conductive wire 9 are plurally installed side by side respectively and the second contacts 13 to join to another end part of respective conductive wire 9 are plurally installed side by side respectively, and the material of conductive bonding agent 15 of each second contact 13 is decided as either soldering conductive resin that is prepared by adding a curing agent into a resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connector for electrically connecting a circuit board to electrical and electronic components such as a surface-mounted IC package and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a circuit board such as a printed circuit board or an inspection circuit board and a surface mount type IC package (for example,
(BGA, LGA, etc.), when electrically connecting the circuit board and the IC package, an IC package is compressed and pressed in the direction of the circuit board, and these are electrically connected. Mounting the IC package on the circuit board, or inspecting the electrical characteristics of the IC package,
I try to test. FIG. 7 shows a conventional electrical connector.
As shown in FIG. 2, a mold 5 interposed between a circuit board (not shown) and an IC package is provided. The mold 5 has a built-in insulating elastic elastomer layer 8 and a vertical thickness of the elastic elastomer layer 8. A plurality of conductive thin wires 9 are bent and arranged in the direction, buried side by side, and the thin ends of each conductive thin wire 9 are exposed from both upper and lower surfaces of the elastic elastomer layer 8 to form contacts.

[0003]

By the way, in the field of semiconductor mounting in recent years, the number of electrode terminals has been increased due to the high functionality of the IC package, and the size of the IC package and the contact area between the IC package and the electrical connector have each increased. There is a tendency. Therefore, when the circuit board and the IC package are electrically connected, it is necessary to increase the pressing force in order to stably conduct the electrode terminals. In addition to the lack of continuity, the package and electrode terminals of the IC package are bent and damaged. Also,
There are many possibilities that the circuit board will bend and fail to obtain reliable conduction. Further, since the area of the contact is very small, there is a problem that alignment is very difficult and connection reliability is lacking.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and can stably conduct a circuit board and a surface-mount type electric / electronic component to prevent damage to the electric / electronic component and the circuit board. An object of the present invention is to provide an electrical connector which can facilitate alignment and improve connection reliability and a method for manufacturing the same.

[0005]

According to the first aspect of the present invention, in order to achieve the above object, an insulating elastic elastomer layer is interposed between a circuit board and a surface mount type electric / electronic component. A plurality of conductive thin wires are embedded in the thickness direction of the elastic elastomer layer, and at least a part of each conductive thin wire is inclined in a direction intersecting with the thickness direction of the elastic elastomer layer. A first contact joined to one end of each conductive thin wire, a plurality of second contacts joined to the other end of each conductive thin wire are provided on the other surface of the elastic elastomer layer. It is characterized in that the material of the joining portion for joining the contact portion and the conductive fine wire is one of a conductive resin obtained by adding a curing agent to a resin and a solder.

[0006] Shore A of the elastic elastomer layer
The hardness is set to 10 to 70 ° Hs, at least a part of each of the conductive fine wires is inclined at an angle of 60 ° or less, and the surface size of the first and second contacts is set to a plurality in the circuit board or the electric / electronic component. 1/4 of the electrode terminal pitch of
It is good to be 3/5.

According to the third aspect of the present invention, in order to achieve the above object, a plating layer is formed on both surfaces of a first conductive plate, and a plurality of conductive fine wires are arranged and joined on the plating layer on one surface. At the same time, at least a part of each conductive fine wire is inclined in a direction intersecting the thickness direction of the first conductive plate, and a plating layer is formed on both surfaces of the second conductive plate, and the plating layer is formed on one surface of the plating layer. A plurality of conductive bonding materials are provided side by side, the first and second conductive plates are opposed to connect the plurality of conductive fine wires and the conductive bonding material, and an elastomer resin is filled between the first and second conductive plates. To form an insulating elastic elastomer layer containing the plurality of conductive wires, and thereafter, the first conductive plate is partially removed and the plurality of first contacts joined to one end of the conductive wires are formed. Along with the second It is characterized by providing arranging a plurality of second contacts joined to the other end portion of the conductive thin line collector plate is partially removed.

Here, the circuit boards in the claims include various circuit boards for mounting, such as printed circuit boards and high-density flexible circuit boards, and inspection circuit boards. In addition, BGA is used for surface-mounted electrical and electronic components.
(ball grid array) or LGA (land
surface mount type ICs (grid array) etc.
Package, semiconductor or CSP (chip size p)
Various types of surface-mounted electrical and electronic components used in the field of package are included.

According to the first or third aspect of the present invention, since the first and second contacts respectively protrude from the elastic elastomer layer of the electrical connector, stable conduction can be obtained. That is, since the area of the first and second contacts is larger than that of the thin conductive wire, the alignment can be performed easily. Further, since the contact area between the circuit board and the electric and electronic components and the first and second contacts is small and stress can be concentrated, it is possible to suppress or prevent bending of the circuit board and the like. Furthermore, when a conductive resin is used as a conductive bonding material, which is a bonding portion for forming the second contact, formation of an intermetallic compound between the conductive bonding material and the conductive fine wire does not occur, and solder is used as the conductive bonding material. In this case, an improvement in the bonding strength between the second conductive plate and the conductive fine wire and the conductive bonding material can be expected.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIG. And a mold frame 5 interposed therebetween via a holder 6. The mold frame 5 incorporates an insulating elastic elastomer layer 8, and a plurality of conductive thin wires 9 are formed in the vertical thickness direction of the elastic elastomer layer 8. The conductive thin wires 9 are arranged and buried so as to bend in a substantially crank shape, and a first contact 10 joined to one end of each conductive thin wire 9 on one surface of the elastic elastomer layer 8 is provided on the other surface of the elastic elastomer layer 8. Are arranged such that a plurality of second contacts 13 joined to the other end of each conductive thin wire 9 are arranged in parallel.

The circuit board 1 is made of, for example, an inspection circuit board, and has a plurality of electrode terminals 2 arranged on a surface thereof in a matrix. The IC package 3 is made of, for example, LGA,
Land electrodes 4 serving as electrode terminals are arranged in a lattice pattern on the back surface of the package. Further, the mold 5 is, for example, a general-purpose engineering plastic (polyetherimide or the like),
The spacer is formed using a ceramic material, a metal material, or the like. The holder 6 is formed into a frame shape using, for example, a general-purpose engineering plastic or ceramic material, and a support step 7 is cut out in the upper part of the inner peripheral surface in a thickness direction. 7, the package of the IC package 3 is stably positioned and fitted.

The insulating elastic elastomer layer 8 includes:
It is a liquid of about 10 to 500 poise before curing, and has a Shore A hardness of 10 to 70 ° Hs, preferably 20 to
An elastomer of ５０50 ° Hs is used. Specifically, silicone rubber, fluorine rubber, polybutadiene rubber, polyisoprene rubber, or the like is appropriately used, but considering the high frequency characteristics and the like, silicone rubber having a small dielectric constant is optimal. Shore A hardness of the elastic elastomer layer 8 is 1
The reason for the range of 0 to 70 ° Hs is that when the hardness becomes higher, the pressing force required for stable conduction increases. On the other hand, if it becomes softer than this, the pressing force necessary for stable conduction becomes smaller, and as a result, the necessary pressing force increases, the deformation amount of the conductive thin wire 9 increases, and the possibility of disconnection occurs.

As each conductive thin wire 9, a thin metal wire which is not corroded by the elastic elastomer layer 8 and has a small volume resistivity is used. Specifically, Cu, Au, Ni, Al, brass, gold-plated wires, and the like are used. Among them, an Au wire which is hardly corroded by the elastic elastomer layer 8 and has a small volume resistivity is preferable. The diameter of each conductive thin wire 9 is preferably about 10 to 100 μm. This is because if the thickness is smaller than this, the strength becomes insufficient and the conductive thin wire 9 is broken, and if the thickness is larger, the conductive thin wire 9 is hardly deformed, and the pressing force required for stable conduction increases. The bent portion of each conductive thin wire 9 is inclined at an angle of 30 to 60 °, preferably 45 °, with respect to the thickness direction (normal line) of the elastic elastomer layer 8 so as to reduce a necessary pressing force. I do.

Each first contact 10 includes a first conductive plate 11 made of a metal plate, and a pattern plating layer 12 covering both surfaces of the first conductive plate 11, and is formed in a disk shape. It comes into contact with the land electrode 4 of the IC package 3. Each of the second contacts 13 includes a second conductive plate 14 made of a metal plate, a conductive bonding material 15 which is a bonding portion bonded to the second conductive plate 14 and buried in the elastic elastomer layer 8, And a pattern plating layer 16 covering the surface of the second conductive plate 14, formed in a disk shape, and in contact with the electrode terminals 2 of the circuit board 1. These first and second contacts 10
The thickness of 13 is preferably about 100 to 500 μm. If the thickness is smaller than this, since the amount of protrusion from the elastic elastomer layer 8 is small, it is difficult to concentrate the pressure. Conversely, if it is thicker than this, it may fall down due to stress generated during compression.

When manufacturing the electrical connector having the above-described configuration, first, a plurality of pattern plating layers 12 are formed on both surfaces of the first conductive plate 11 so as to correspond to the plurality of land electrodes 4 of the IC package 3 (see FIG. 1). 2 (a)), the conductive thin wires 9 are sequentially erected on the plurality of pattern plating layers 12 on one surface, and each conductive thin wire 9 is bent and formed in a substantially crank shape (see FIG. 2 (b)). The first conductive plate 11 is an inexpensive substrate that can be easily etched, specifically, a copper plate or 42.
An alloy alloy plate or the like is used.

As the pattern plating layer 12, gold plating or the like which is not affected by an etching solution is used. In the case where gold plating is used, the material of the first conductive plate 11 may be deposited on the surface depending on the material of the first conductive plate 11, so that a base plating such as nickel or palladium is used as a protective layer in advance. Lamination is formed, and gold plating is laminated on the base plating. As a method of erecting the conductive thin wire 9, a metal bonding method, an ultrasonic method, a method of forming a hole in the first conductive plate 11 and inserting the first conductive plate 11, and the like can be adopted. However, among these, the metal bonding method is effective from the viewpoint of speed and accuracy.

Next, a plurality of pattern plating layers 16 are respectively formed on both surfaces of the second conductive plate 14 so as to correspond to the plurality of electrode terminals 2 of the circuit board 1, and a bonding portion is formed on the plurality of pattern plating layers 16 on one surface. Is supplied and applied (see FIG. 2C). The second conductive plate 14 and the pattern plating layer 16 are the same as the first conductive plate 11 and the pattern plating layer 12. As the conductive bonding material 15, either a creamy solder or a conductive resin obtained by adding a hardening agent to a thermosetting resin or a thermoplastic resin in a raw material state is used. As the solder, a known hard solder or soft solder is preferable, and Sn, Pb, Ag, Sb, In, B
Those containing two or more of i, Au, Cu, Ge, Si and the like are preferable. However, considering the heat generation of the IC package 3, a hard solder having a high melting point to some extent is optimal. As an example, (Sn96.5% -Ag3.5%) · (Au75
% -Sb 25%).

As the conductive resin, a thermosetting resin such as an epoxy resin, an acrylic resin, or a polyimide as a binder;
Alternatively, a hardening agent added to a thermoplastic resin such as polyester or the like, in a raw material state, a liquid state, a paste state, or a film state, and the hardness after curing is from pencil hardness 6B to 9
H, preferably 3H to 9H resin. The hardness after curing is in the above range, because when the hardness becomes higher, the conductive bonding material 1 becomes harder.
5 becomes brittle, and conversely, if it becomes softer, the required rigidity cannot be obtained.

The volume resistivity of the conductive resin after curing is 1
A good range is about 0 ^-7 to 10 ^-2 Ωm. As the conductive filler, gold powder, silver powder, nickel, aluminum powder, plating powder, carbon powder, or a combination of several kinds of graphite powder is used. The average particle diameter is preferably equal to or less than the diameter of the conductive thin wire 9 to be used in consideration of the contact probability of the conductive thin wire 9, and is optimally about 1/10 of the diameter.
For example, when the diameter of the conductive fine wire 9 is 50 μm, the average particle diameter of the conductive filler is preferably 50 μm or less, and most preferably about 5 μm. As a method of applying the conductive bonding material 15,
A method of dispensing only necessary portions, a method of performing metal masking, a printing method using a screen plate, a plating method, and a method of supplying a ball-shaped or film-shaped conductive bonding material 15 only to required portions can be used. Among them, the metal mask method is most suitable from the viewpoint of the batch processing and the application amount.

Next, the first and second conductive plates 11 and 14 are vertically arranged via the mold 5 to join the plurality of conductive thin wires 9 and the conductive bonding material 15 (see FIG. 2D). . At this time, when the conductive bonding material 15 is a solder, the solder is heated to a temperature at which the solder melts. When solder is used, an intermetallic compound between the solder and the conductive fine wire 9 may be formed.
Use below 25 ° C. When the conductive bonding material 15 is a conductive resin, the conductive resin is heated and cured after bonding the conductive fine wire 9 and the conductive resin, and the conductive fine wire 9 is completely bonded. When the plurality of conductive wires 9 and the conductive bonding material 15 are bonded in this manner, a liquid elastomer resin is filled between the first and second conductive plates 11 and 14 so as to incorporate the plurality of conductive fine wires 9. The elastomer layer 8 is cured (FIG. 2
(See (e)).

Then, unnecessary portions of the first conductive plate 11 are partially etched with an etchant, and the remaining portions are arranged in parallel with the plurality of first contacts 10 joined to one end of the conductive fine wire 9. Unnecessary portions of the second conductive plate 14 are partially etched with a liquid, and the remaining portions are juxtaposed to a plurality of second contacts 13 joined to the other end of the conductive fine wire 9 to manufacture an electrical connector. (Figure 2
(See (f) and (g)). As a method of removing unnecessary portions of the first and second conductive plates 11 and 14, a known method such as a chemical etching method or a blast method can be used. As the etchant, an etchant that does not attack the pattern plating layers 12 and 16 is used. For example, when the first and second conductive plates 11 and 14 are made of copper, it is preferable to use ferric chloride as an etchant.

At the time of etching, the surface size of the first and second contacts 10 and 13 is set to about １ ／ to ／ of the pitch P of the electrode terminals 2 of the circuit board 1 or the land electrodes 4 of the IC package 3. I do. First and second contact 1
If the surface size of 0.13 is larger than this, the circuit board 1
Alternatively, the contact area with the IC package 3 increases, and the pressing force required for stable conduction increases. Conversely, if it is small, the strength of the first and second contacts 10 and 13 will be insufficient, and they may be damaged. Therefore, the electrode terminal 2 of the circuit board 1 or the IC package 3
In the case where the pitch P of the land electrodes 4 is 1 mm, the surface size of the first and second contacts 10 and 13 is 0.1 mm.
It is preferably about 25 mm to 0.60 mm.

When using the manufactured electrical connector, as shown in FIG. 1, a mold frame 5 of the electrical connector is disposed on a circuit board 1 via a holder 6 so that a plurality of electrode terminals 2 of the circuit board 1 are connected to the form. The second contact 13 of the electrical connector is brought into positioning contact, the IC package 3 is fitted into the support step 7 of the holder 6, and the plurality of first contacts 10 and the land electrodes 4 are positioned and opposed to each other. When the IC package 3 is compressed and pressed, the circuit board 1 and the IC package 3
Can be conducted.

According to the above configuration, the elastic elastomer layer 8
Large first and second contacts 10 and 13
, Each of which has a plurality of protruding portions, so that extremely stable conduction can be obtained with a slight low pressing force, and the problem that the package of the large-sized and multi-pin IC package 3 or the land electrode 4 is bent and damaged is extremely effectively solved. can do. Also, since the contact area between the electrode terminal 2 and the second contact 13 and between the first contact 10 and the land electrode 4 is small and stress is concentrated, the circuit board 1 is prevented from being bent and reliable conduction is achieved. Obtainable. Also, since the area of the first and second contacts 10 and 13 is large,
Positioning is very easy, and connection reliability can be significantly improved.

When solder is used as the conductive bonding material 15, since the bonding strength is very high, stable conduction can be greatly expected even if the electrical connector is compressed to about 70% of the total thickness. Furthermore, when a conductive resin is used as the conductive bonding material 15, no intermetallic compound is formed between the conductive bonding material 15 and the conductive fine wire 9.
Even at 0 ° C., stable conduction can be obtained very easily. Furthermore, since the inspection time and the assembling time are short, efficient work can be expected, and since the conduction path is short, the high-frequency characteristics can be improved, and the electrical connector can be manufactured easily and with high yield.

In the above embodiment, the conductive thin wire 9 is bent substantially in a crank shape. However, as shown in FIG. 3, a straight conductive thin wire 9 is inclined or the conductive thin wire 9 is formed into a substantially S-shaped curve. Alternatively, the conductive fine wire 9 may be formed in a bent shape or the like. In this case, the bent portion of the conductive thin wire 9 may be inclined at an angle of 0 to 60 °, preferably 45 ° with respect to the thickness direction of the elastic elastomer layer 8. Furthermore, the shape of the first and second contacts 10 and 13 is not limited to a disk shape at all. For example, FIG.
The shape may be a truncated cone as shown in (b), a prism as shown in FIGS. 5 (a) and 5 (b), or a truncated pyramid as shown in FIGS. 6 (a) and 6 (b).

[0027]

EXAMPLE 1 First, a pattern plating layer 1 was formed on both surfaces of a first conductive plate 11 so as to correspond to a plurality of land electrodes 4 of an IC package 3.
Each of the conductive fine wires 9 was formed vertically, and the conductive fine wires 9 were erected vertically on the plurality of pattern plating layers 12 on one surface by a wire bonding method. The first conductive plate 11 has a thickness of 0.5
mm, a copper plate of 30 mm in length and width was used. The plurality of pattern plating layers 12 are formed by forming a nickel base plating having a thickness of 2 μmm, φ0.75 mm and a pitch of 26 mm in a range of 26 mm in length and width of the first conductive plate 11, and a thickness of 2 μmm and φ0.75 mm in the nickel base plating. The layers were laminated by forming gold plating having the same pitch. In addition, the conductive thin wire 9
Was a gold wire having a diameter of 50 μm, and was erected at a pitch of 2 mm and a height of 2.5 mm.

Next, a plurality of pattern plating layers 16 are respectively formed on both surfaces of the second conductive plate 14 so as to correspond to the plurality of electrode terminals 2 of the circuit board 1, and conductive bonding is performed on the plurality of pattern plating layers 16 on one surface. Material 15 is 0.1m thick
m and using a known metal mask printing method. The second conductive plate 14 and the pattern plating layer 16 are the same as the first conductive plate 11 and the pattern plating layer 12. As the conductive bonding material 15, cream solder (solder paste 96.5n / 3.5AgRMA9098T, trade name, manufactured by Alpha Metals Japan Co., Ltd.) was used.

Next, the first and second conductive plates 11 and 14 were vertically arranged via a mold frame 5 having a thickness of 2.5 mm to join the plurality of conductive thin wires 9 and the conductive bonding material 15. At this time, soldering was performed by heating under the conditions of one step / 140 ° C. to 170 ° C .: 120 sec and two steps / 200 ° C. to 240 ° C .: 60 sec. After the conductive fine wire 9 and the conductive bonding material 15 are bonded in this manner, a liquid elastomer resin is filled between the first and second conductive plates 11 and 14 to provide an insulating elastic elastomer layer containing a plurality of conductive fine wires 9 therein. 8 was cured.
The elastic elastomer layer 8 was filled with a two-component silicone rubber (a product name: KE-109A / B, manufactured by Shin-Etsu Chemical Co., Ltd.) as a liquid elastomer resin, and was cured and formed under the conditions of 120 ° C./2h.

Then, unnecessary portions of the first conductive plate 11 were partially etched with an etching solution composed of ferric chloride, and the remaining portions were juxtaposed with the disk-shaped first contacts 10. Similarly, unnecessary portions of the second conductive plate 14 were partially etched with an etchant, and the remaining portions were arranged side by side with the disc-shaped second contacts 13 to manufacture an electrical connector having a length and width of 30 mm.

The manufactured electrical connector is placed on a circuit board 1 comprising an inspection circuit board via a holder 6 so that the circuit board 1
The plurality of electrode terminals 2 and the second contacts 13 of the electrical connector are brought into positioning contact with each other, and the IC package 3 is fitted into the support step 7 of the holder 6 so that the plurality of first contacts 10 and the land electrodes 4 Are positioned and opposed, and then I
When the C package 3 is compressed and pressed by 15%, the conventional 1
Thus, the circuit board 1 and the IC package 3 were reliably conducted with a pressing force of / 2. In addition, although the IC package 3 was compressed and pressed by 30%, the circuit board 1 and the IC package 3 could be reliably conducted similarly.

Embodiment 2 First, the pattern plating layers 1 are formed on both surfaces of the first conductive plate 11 so as to correspond to the plurality of land electrodes 4 of the IC package 3.
Each of the conductive fine wires 9 was formed vertically, and the conductive fine wires 9 were erected vertically on the plurality of pattern plating layers 12 on one surface by a wire bonding method. The first conductive plate 11, the plurality of pattern plating layers 12, and the conductive fine wires 9 are the same as in the first embodiment.

Next, a plurality of pattern plating layers 16 are respectively formed on both surfaces of the second conductive plate 14 so as to correspond to the plurality of electrode terminals 2 of the circuit board 1, and conductive bonding is performed on the plurality of pattern plating layers 16 on one surface. The agent was supplied and applied by a known metal mask printing method using a 0.1 mm thick plate. The second conductive plate 14 and the pattern plating layer 16 are the same as the first conductive plate 11 and the pattern plating layer 12. 3301 (trade name, manufactured by Three Bond Co., Ltd.) was used as the conductive adhesive.

Next, the first and second conductive plates 11 and 14 are vertically arranged via a mold frame 5 having a thickness of 2.5 mm, and a plurality of conductive fine wires 9 and a conductive adhesive are joined. / 60mi
Heating was performed under the conditions of n and soldering was performed. Thus, the conductive thin wire 9
And the conductive adhesive, the first and second conductive plates 11
A liquid elastomer resin was filled between the layers 14 to form an insulating elastic elastomer layer 8 having a plurality of conductive fine wires 9 therein. The elastic elastomer layer 8 is the same as in the first embodiment.

Thereafter, unnecessary portions of the first conductive plate 11 were partially etched with an etching solution comprising ferric chloride, and the remaining portions were juxtaposed to the disk-shaped first contacts 10. Similarly, unnecessary portions of the second conductive plate 14 were partially etched with an etchant, and the remaining portions were arranged side by side with the disc-shaped second contacts 13 to manufacture an electrical connector having a length and width of 30 mm.

The electric connector is arranged on the circuit board 1 composed of the inspection circuit board via the holder 6, and the plurality of electrode terminals 2 of the circuit board 1 and the second contacts 13 of the electric connector are brought into positioning contact with each other. When the IC package 3 is fitted into the support step portion 7 and the plurality of first contacts 10 and the land electrodes 4 are positioned and opposed to each other, and then the IC package 3 is compressed and pressed by 15%. The circuit board 1 and the IC package 3 were reliably conducted by the pressing force. Under the condition of 150 ° C.,
Although the IC package 3 was compressed and pressed by 15%, a reliable conduction between the circuit board 1 and the IC package 3 was similarly obtained.

[0037]

As described above, according to the first or third aspect of the present invention, it is possible to stably connect a circuit board and a surface-mount type electric / electronic component, and to damage the electric / electronic component or the circuit board. Can be suppressed or prevented. Further, it is possible to facilitate the alignment and improve the connection reliability of the electrical connector.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing an embodiment of an electric connector according to the present invention.

FIG. 2 is an explanatory view showing an embodiment of a method for manufacturing an electrical connector according to the present invention, wherein FIG. 2 (a) is a cross-sectional view showing a state where pattern plating layers are formed on both surfaces of a first conductive plate, respectively. )
The figure is a cross-sectional view showing a state in which conductive fine wires are erected on a plurality of pattern plating layers on one surface, and (c) a diagram shows a state where a conductive bonding material is supplied and applied on the plurality of pattern plating layers on one surface of a second conductive plate. Sectional view showing the state, (d) is a cross-sectional view showing a state in which the first and second conductive plates are opposed to each other via a mold to join a plurality of conductive fine wires and a conductive bonding material, (e) Is a cross-sectional view showing a state in which an insulating elastic elastomer layer containing a plurality of conductive fine wires is formed between the first and second conductive plates by curing, (f) is a cross-sectional view showing a completed state of the electrical connector, (g) ) Is a plan view of FIG.

FIG. 3 is an explanatory view showing a standing state of a conductive thin wire in another embodiment of the electric connector according to the present invention.

FIG. 4 is an explanatory view showing first and second contacts in another embodiment of the electrical connector according to the present invention, wherein FIG. 4 (a) is a front view, and FIG. 4 (b) is a plan view of FIG. is there.

FIGS. 5A and 5B are explanatory views showing first and second contacts in another embodiment of the electrical connector according to the present invention, wherein FIG. 5A is a front view and FIG. 5B is a plan view of FIG. is there.

FIG. 6 is an explanatory view showing first and second contacts in another embodiment of the electrical connector according to the present invention, wherein FIG. 6 (a) is a front view, and FIG. 6 (b) is a plan view of FIG. is there.

FIG. 7 is an explanatory sectional view showing a conventional electric connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Electrode terminal 3 IC package (Surface mount type electric and electronic parts) 4 Land electrode 5 Form frame 6 Holder 7 Support step 8 Elastic elastomer layer 9 Conductive thin wire 10 First contact 11 First conductive plate 12 Pattern Plating layer (plating layer) 13 Second contact 14 Second conductive plate 15 Conductive joining material (joining part) 16 Pattern plating layer (plating layer) P Pitch

Claims (3)

[Claims] 1. An electric connector having an insulating elastic elastomer layer interposed between a circuit board and a surface-mount type electric / electronic component, wherein a plurality of conductive fine wires are embedded in a thickness direction of the elastic elastomer layer. At least a part of each conductive thin wire is inclined in a direction intersecting the thickness direction of the elastic elastomer layer, and a first contact joined to one end of each conductive thin wire on one surface of the elastic elastomer layer, On the other surface of the layer, a plurality of second contacts to be joined to the other end of each of the conductive fine wires are provided side by side, and the material of the joint to join each of the second contact portions and the conductive fine wire is cured to resin. An electrical connector characterized in that it is one of a conductive resin to which an agent is added and a solder. 2. The surface size of the first and second contacts, wherein the elastic elastomer layer has a Shore A hardness of 10 to 70 ° Hs and at least a part of each of the conductive fine wires is inclined at an angle of 60 ° or less. Is １ ／ to ／ of a plurality of electrode terminal pitches in the circuit board or the electric / electronic component.
The electrical connector according to claim 1, wherein 3. A plating layer is formed on both surfaces of a first conductive plate, a plurality of conductive thin wires are arranged and joined on one side of the plating layer, and at least a part of each conductive thin wire is connected to the first conductive plate. Incline in the direction intersecting the thickness direction of the plate, forming a plating layer on both sides of the second conductive plate and providing a plurality of conductive bonding materials on the plating layer on one side thereof, the first and second An insulating elastic elastomer layer that connects the plurality of conductive thin wires and the conductive bonding material with the conductive plate facing each other, fills the first and second conductive plates with an elastomer resin and incorporates the plurality of conductive thin wires. After curing, the first conductive plate is partially removed, and a plurality of first contacts joined to one end of the conductive fine wire are arranged side by side, and the second conductive plate is partially removed. And a plurality of first wires joined to the other end of the conductive thin wire. A method for manufacturing an electrical connector, comprising providing two contacts side by side.