JP5750101B2 - connector - Google Patents

Description

  The present invention provides an electrical connection between circuit boards used in an electronic device, between a circuit board and an electronic component, or between a circuit board and a casing of a conductive electronic device. The present invention relates to a connector that is used and suitable for mounting in a reflow furnace.

  It is made of a rubber-like elastic body as a connector for electrical connection between circuit boards or between a circuit board and electronic components, or for grounding between a circuit board and a casing of a conductive electronic device. A connector sheet having a configuration in which an insulating elastic sheet is provided with a conductive portion penetrating in the thickness direction is known.

  Electronic components such as resistors, capacitors, ICs, and LSIs built in the electronic device together with the connector sheet are mounted on the circuit board using a reflow furnace. In this solder reflow process, an electronic component is placed on a paste-like solder applied to a circuit pattern on a circuit board, and the solder is melted in a reflow furnace to electrically connect and fix the circuit pattern and the electronic component. It is a mounting process. However, the connector sheet could not be fixed at the same time as other electronic devices in the solder reflow process, so the connector sheet was fixed by providing a fitting part on the circuit board, or fixed using double-sided tape or adhesive. Was. Since these fixing methods are performed in a separate mounting process from other electronic components, from the viewpoint of reducing the number of processes, it is desirable that the connector sheet can be mounted simultaneously with mounting of other electronic elements in the solder reflow process. ing.

  In view of this, for example, Japanese Patent Application Laid-Open No. 2001-266975 discloses a connector sheet in which a thermal fusion powder capable of thermal fusion with a metal foil of a circuit board is exposed on at least one side of an elastic sheet. Japanese Patent Application Laid-Open No. 2000-149665 discloses a connector sheet having a metal member on the surface of an electrode serving as a contact point with a circuit board.

JP 2001-266975 A JP 2000-149665 A

  However, the connector sheet disclosed in Japanese Patent Laid-Open No. 2001-266975 (Patent Document 1) is fixed by electrically connecting the connector sheet by fusing the heat-bonding powder to the electrode of the circuit board in the solder reflow process. Although it is possible, the insulating elastic body of the connector sheet may be detached while the heat fusion powder is fixed to the circuit board because the conductive part and the heat fusion powder are easily peeled off. Moreover, since the connector sheet disclosed in Japanese Patent Application Laid-Open No. 2000-149665 (Patent Document 2) is oriented by injecting a resin serving as a conductive part into a hole provided in the resin film, the conductive part is fine. There is a problem that air easily accumulates in the hole and easily causes poor conduction.

  The present invention has been made against the background of the above technique. That is, an object of the present invention is to provide a connector that can be fixed to a circuit board in a solder reflow process, and that the electrode is difficult to peel off and has high electrical connection reliability.

In order to achieve the above object, the following configuration is provided.
In other words, a conductive path that penetrates the thickness of the base member is provided in an insulating base member composed of a base rubber made of a rubber-like elastic body and a base film made of a resin film, and the members to be connected are electrically connected to each other. The base rubber has a particle conductive portion that is energized with conductive particles contained in the rubber-like elastic body, and the base film is formed on the periphery of the through-hole that penetrates the base film. Solder side surface metal part spreading in a bowl shape along one surface, rubber side surface metal part spreading in a bowl shape along the other surface of the base film at the periphery of the through hole, solder side surface metal part and rubber side surface And a metal conductive part that connects the metal part through the through-hole, and the conductive particle part of the base rubber and the metal conductive part of the base film communicate with each other. A connector to form.

A base member composed of a base rubber and a base film, and a conductive path penetrating through the thickness of the base member. The conductive path communicates with the particle conductive part of the base rubber and the metal conductive part of the base film. Is formed. Since the particle conductive portion of the base rubber is energized by the conductive particles contained in the rubber-like elastic body, it has rubber-like elasticity and can be conductively connected in a compressed state. Therefore, it is possible to realize a connector that can be compressed and clamped between members to be connected.
The metal conductive portion of the base film has a solder side surface metal portion, a rubber side surface metal portion, and a connecting metal portion. And the solder side surface metal part spreads out in the shape of an eaves along the one surface of the base film around the periphery of the through hole in the base film. Since the metal part spreads in a bowl shape along the surface of the base film, the connector can be easily fixed with solder via the solder side surface metal part, and a connector that can be fixed to the circuit board in the solder reflow process is realized. Can do. Furthermore, since the solder-side surface metal part and the rubber-side surface metal part spread in a bowl shape along the respective surfaces of the base film, the solder-side surface metal part and the rubber-side surface metal part can have a sufficient fixing area with respect to the base film. It's difficult.

Furthermore, since the metal conductive portion is configured such that the solder-side surface metal portion and the rubber-side surface metal portion are connected by the connecting metal portion and sandwich the base film, the base film is engaged with the concave portion of the H-shaped metal conductive portion. As a result, it is possible to make it difficult to remove the metal conductive portion from the base film. Moreover, the solder side surface metal part and the rubber side surface metal part can be electrically connected by the connecting metal part, and the particle conductive part of the rubber side surface metal part and the solder side surface metal part can be reliably conducted. Can do. And a connector with high connection reliability is realizable.
The particle rubber conductive portion of the base rubber is formed by adding conductive particles to a rubber-like elastic body, as well as a structure in which conductive particles are uniformly dispersed in an insulating rubber-like elastic body, or a part of an insulating rubber-like elastic body. It can be set as the structure etc. which connected the conductive particle to the part in the thickness direction.

  The rubber-side surface metal part can be formed wider in the plane direction of the base film than the particle conductive part. Since the rubber side surface metal part is wider than the particle conductive part, the end of the particle conductive part can be reliably brought into contact with the rubber side surface metal part. Even if there is a slight misalignment between the base film and the base rubber, there will be no portion where the end of the particle conductive part cannot contact the metal part on the rubber side surface, thus preventing the conductive path of the particle conductive part from becoming narrow. Thus, it is possible to secure a sufficiently wide conductive path in the particle conductive part which is inferior in conductivity compared to the conductive path made of the metal part. In addition, since the rubber-side surface metal part is wider than the particle conductive part, the fixing area of the rubber-side surface metal part with respect to the base film can be made larger than the end surface of the particle conductive part and peel off from the base film. Can be difficult.

The particle conductive part can be formed wider than the connecting metal part in the plane direction of the base film. Since the particle conductive part is wider than the connecting metal part, a sufficiently wide conductive path can be secured for the particle conductive part whose conductivity is likely to be inferior to that of the connecting metal part made of metal.
Further, the contact area between the particle conductive portion and the connection target member can be made wider than the end portion of the connecting metal portion, and the conductive connection can be reliably established with the connection target member on the base rubber side.

  The connecting metal part has a cylindrical shape, and a part of the particle conductive part can be formed so as to fill the cylinder of the connecting metal part. The connecting metal part is formed in a cylindrical shape in the through hole of the base film, and if the inside of this cylinder is filled with the particle conductive part, the fixing area between the base rubber and the metal conductive part can be increased, and the base The adhesion force between the rubber and the metal conductive portion can be increased. Further, since the inside of the cylinder of the connecting metal part also becomes a contact surface between the particle conductive part and the metal conductive part, the contact area between the particle conductive part and the metal conductive part can be increased, and the particle conductive part and the metal conductive part Can be securely connected.

An elastic film made of an insulating rubber-like elastic body covering the base film can be provided on the surface of the base film having the rubber-side surface metal part. Since the base film is covered with the elastic film, the elastic film is integrated with the base rubber, and the fixing strength between the base rubber and the base film can be increased.
Such an elastic film is preferably formed thin. In the solder reflow process, after placing the connector on the circuit board, the connector is fixed to the circuit board by solidifying the solder melted at a high temperature through a cooling process. During this cooling process, the temperature at which the solder solidifies is as high as 200 ° C. to 250 ° C. When placed in such a high-temperature atmosphere with an elastic film made of a rubber-like elastic layer laminated on the surface of the base film made of a resin film, the base film is warped due to the difference in thermal expansion between the base film and the elastic film. become. Then, the connector may be fixed to the circuit board in this warped state. Therefore, by forming the elastic film thin, it is possible to reduce the stress of the elastic film in a high-temperature atmosphere and make it difficult to warp the base film.

An elastic film made of an insulating rubber-like elastic body covering the base film can be provided on the surface of the base film having the solder side surface metal part. Since the elastic film is provided on the base film on the side having the solder-side surface metal portion, the base film can be hardly warped in a high-temperature atmosphere in the solder reflow process.
Furthermore, if an elastic film is provided on both surfaces of the base film, it is possible to balance the thermal expansion stress on the upper surface side and the lower surface side of the base film, so that the base film can be further prevented from warping.

  According to the connector of the present invention, the solder side surface metal part can be fixed with solder, and can be fixed to the circuit board in the solder reflow process. Moreover, it is a connector from which a metal electroconductive part does not fall easily from a base film. Furthermore, it is a connector with high connection reliability in which the metal part on the base film side and the particle conductive part of the base rubber are securely connected in a large area.

The top view which shows the connector of 1st Embodiment. FIG. 3 is a sectional view taken along line SA-SA in FIG. 1. The expanded sectional view which shows the modification of the connector of 1st Embodiment. The expanded sectional view which shows another modification of the connector of 1st Embodiment. FIG. 2 is a cross-sectional view corresponding to FIG. 2 illustrating a connector according to a second embodiment. The bottom view which shows the connector of 2nd Embodiment. The bottom view which shows the modification of the connector of 2nd Embodiment. Sectional drawing equivalent to FIG. 2 which shows the connector of 3rd Embodiment. Sectional drawing equivalent to FIG. 2 which shows the connector of 4th Embodiment. Sectional drawing equivalent to FIG. 2 which shows the modification of the connector of 4th Embodiment. Sectional drawing equivalent to FIG. 2 which shows another modification of the connector of 4th Embodiment. The top view which shows the connector of 5th Embodiment. SB-SB sectional view taken on the line of FIG. FIG. 3 is a cross-sectional view corresponding to FIG. 2 showing still another modification of the connector.

  The present invention will be described in more detail with reference to the drawings. In each of the following embodiments, a duplicate description is omitted for common structures, materials, manufacturing methods, and the like. Further, in the present specification, for convenience of explanation, the upper and lower sides of the connector are defined corresponding to the upper and lower sides of the drawing. However, in the actual usage, the upper and lower sides may be reversed or half-turned.

First Embodiment (FIGS. 1 and 2) :
A connector 11 of the first embodiment is shown in FIGS. 1 is a plan view of the connector 11, and FIG. 2 is a cross-sectional view of the connector 11 taken along the line SA-SA. The connector 11 is used when a plurality of conductive paths 13 penetrate the insulating base member 12 in the vertical direction and conductively connect connection target members (not shown) provided on the upper and lower sides of the connector 11.

  The base member 12 constituting the connector 11 is a base rubber 15 that is a rubber-like elastic body and a base film 16 that is a resin film. Of these, the base rubber 15 imparts cushioning properties to the connector 11, and the base film 16 imparts shape retention to the connector 11.

The base film 16 is made of an insulating resin film, and a metal conductive portion 17 penetrates through a through hole 16c formed in a direction penetrating the thickness.
Further, the base rubber 15 forms a protruding portion 14 that protrudes in a substantially cylindrical shape in the thickness direction of the base film 16 and an elastic film 15 c that covers the lower surface (the other surface) 16 b of the base film 16. The protruding portion 14 includes a particle conductive portion 15a that is energized by conductive particles, and a protective portion 15b that covers and protects the side surface of the particle conductive portion 15a. The metal conductive portion 17 and the particle conductive portion 15a communicate with each other to form a conductive path 13.

The metal conductive portion 17 and the particle conductive portion 15a that form the conductive path 13 will be described in more detail.
The metal conductive portion 17 provided in the base film 16 has a solder side surface metal portion 17a that spreads in a bowl shape along the upper surface 16a of the base film 16 and a periphery of the through hole 16c. A rubber-side surface metal portion 17b that spreads in a bowl shape along the lower surface 16b of the base film 16, and a connecting metal portion 17c that connects the solder-side surface metal portion 17a and the rubber-side surface metal portion 17b through the through-hole 16c. doing. That is, the metal conductive portion 17 is formed so as to sandwich the base film 16 from the upper and lower surfaces.

The solder side surface metal part 17a is a part to which the solder is fixed, and the rubber side surface metal part 17b is a part to which the particle conductive part 15a of the base rubber 15 is fixed. Such solder-side surface metal portion 17a and rubber-side surface metal portion 17b are each “metal foil” fixed to the upper surface 16a and lower surface 16b of the base film 16, and “plating layer” fixed to each outer surface of these metal foils. And a laminated structure.
The connecting metal portion 17 c is a portion that electrically connects the upper surface 16 a side and the lower surface 16 b side of the base film 16. The connecting metal portion 17c of the present embodiment has a cylindrical shape along the wall surface of the through hole 16c, is connected to the solder side surface metal portion 17a on the upper surface 16a side of the base film 16, and is on the rubber side on the lower surface 16b side of the base film 16 It is connected to the surface metal part 17b. Such a connecting metal portion 17c is a “plating layer” formed by plating.
The “plating layer” of the connecting metal portion 17c constituting the metal conductive portion 17 and the “plating layer” of the solder-side surface metal portion 17a and the rubber-side surface metal portion 17b are integrated, and the “plating layer” serves as a base film. The upper surface 16a side and the lower surface 16b side of 16 are electrically connected.

  As the material of the metal conductive portion 17, a metal that is excellent in conductivity and to which solder can be easily fixed can be used. Examples thereof include gold, silver, copper, iron, nickel, and alloys thereof. Among these, it is preferable to use copper from the viewpoint of solder adhesion, workability, conductivity, and the like. It is also preferable to use gold having a high weather resistance for the plating layer, which is difficult to corrode.

  The thickness of the solder side surface metal part 17a and the rubber side surface metal part 17b is preferably 5 μm to 100 μm. If the thickness is less than 5 μm, the solder-side surface metal part 17a and the rubber-side surface metal part 17b are liable to break and there is a risk of poor conduction. When the thickness is larger than 100 μm, there is no problem in electrical characteristics, but when the solder side surface metal portion 17a and the rubber side surface metal portion 17b are formed in the etching process, the thick solder side surface metal portion 17a and the rubber side surface metal portion 17b are formed. There is a problem that the cost is high because it is necessary to etch the film, and that a fine shape is difficult to etch when the thickness is large.

On the other hand, the particle conductive portion 15 a provided in the base rubber 15 penetrates the base rubber 15, and a part of the particle conductive portion 15 a fills the cylinder of the connecting metal portion 17 c in the metal conductive portion 17, and an end portion thereof is the base film 16. Is exposed on the upper surface (one surface) 16a side.
The particle conductive portion 15a is formed by adding conductive particles to an insulating rubber-like elastic body, and a configuration in which conductive particles are connected to a part of the insulating rubber-like elastic body in the thickness direction. The conductive particles can be uniformly dispersed in the elastic rubber-like elastic body.

  Carbon black or metal particles can be used as the material of the conductive particles in the particle conductive portion 15. In a configuration in which conductive particles are connected to a part of an insulating rubber-like elastic body in the thickness direction, the particle conductive portion 15a is formed by magnetic field orientation using a magnetic conductor as the conductive particles. In the configuration in which the conductive particles are uniformly dispersed in the insulating rubber-like elastic body, the particle conductive portion 15a and the protective portion 15b are formed of the same material, and the particle conductive portion 15a and the protective portion 15b are easily integrated. be able to.

  Examples of the material of the magnetic conductor used for the conductive particles include nickel, cobalt, iron, ferrite, or an alloy thereof. Examples of these shapes include particles, fibers, strips, and fine wires. Can be mentioned. Further, a material having a good electrical property, a resin, a ceramic coated with a magnetic conductor, or a material in which a magnetic conductor is coated with a electrically conductive metal can also be used. Examples of the electroconductive metal include gold, silver, platinum, aluminum, copper, iron, palladium, chromium, and stainless steel. When the average particle diameter of the magnetic conductor is 1 μm to 200 μm, it is possible to easily form a chain state by magnetic field orientation, and the particle conductive portion 15a can be efficiently formed.

Liquid rubber is used for the rubber-like elastic body when the particle conductive portion 15a is formed by magnetic field orientation. By orienting the liquid rubber in which the magnetic conductor is dispersed in a magnetic field, the particle conductive portion 15a in which the magnetic conductors are connected in a daisy chain can be formed. In this case, the viscosity of the liquid rubber is preferably 1 Pa · s to 250 Pa · s, more preferably 10 Pa · s to 50 Pa · s. When the viscosity is lower than 1 Pa · s, the magnetic conductor is precipitated at a high rate, and the magnetic conductor may be biased downward of the elastic portion. If the viscosity is higher than 250 Pa · s, the movement resistance of the magnetic conductor in the liquid rubber increases, and the alignment time becomes longer. Examples of the material of the liquid rubber include silicone rubber, natural rubber, isoprene rubber, butadiene rubber, 1,2-polybutadiene, styrene / butadiene rubber, nitrile rubber, butyl rubber, ethylene / propylene rubber, and urethane rubber. .
Liquid rubber is used as the rubber-like elastic body, magnetic conductor is used as the conductive particles, and the particle conductive portion 15a formed by magnetic field orientation can lower the conduction resistance even if the blending amount of the magnetic conductor is small. In other words, the particle conductive portion 15a having a low hardness can be obtained. Therefore, the connector 11 that can be compressed with a low load can be realized.

Next, the base member 12 will be described.
The thickness of the base film 16 is preferably 10 μm to 200 μm. Within this range, the shape retention of the connector 11 is enhanced by the rigidity of the base film 16, and the handling is easy. If the thickness is less than 10 μm, the base film 16 is not stiff and sufficient shape retention cannot be exhibited. On the other hand, when the thickness is larger than 200 μm, the thickness of the connector is increased as a whole, which is not preferable as the connector 11 that is required to be thin.
The diameter of the through hole 16c in the base film 16 is preferably 0.05 mm to 0.3 mm. If it is smaller than 0.05 mm, in the plating process for forming the metal conductive portion 17, the plating solution may not easily enter the through-hole 16 c and a “plating layer” may not be formed, which tends to cause poor conduction. If it is larger than 0.3 mm, the fixing area of the metal conductive portion 17 to the base film 16 becomes small, so that the fixing strength may be reduced, and the metal conductive portion 17 is likely to be detached. Such through holes 16c can be formed by laser processing or drilling.

  As the material of the base film 16, a resin film having heat resistance that is difficult to be deformed in the solder reflow process is used. Specifically, a resin film that does not deform even when placed in an atmosphere of 220 ° C. to 290 ° C. for 20 to 30 seconds is preferable. Examples thereof include a polyimide film, a polyethylene naphthalate film, a polyphenylene sulfide film, and an epoxy resin film. Among these, a polyimide film is preferable from the viewpoint of flexibility, heat resistance, availability, and the like.

  As the material of the base rubber 15, a rubber-like elastic body having heat resistance that can withstand the solder reflow process can be used. Specifically, a thermosetting rubber that is not easily deformed or deteriorated even when exposed to an atmosphere of 220 ° C. to 290 ° C. for 20 seconds to 30 seconds is preferable. For example, silicone rubber, natural rubber, isoprene rubber, butadiene rubber, acrylonitrile butadiene rubber, 1,2-polybutadiene, styrene / butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, ethylene / propylene rubber, chlorosulfone rubber, chlorosulfonated polyethylene Examples thereof include polyethylene rubber such as rubber, acrylic rubber, epichlorohydrin rubber, fluorine rubber, and urethane rubber. Of these, silicone rubber is preferred because of its excellent moldability, electrical insulation, weather resistance, and the like.

A method for manufacturing the connector 11 will be described.
First, a resin film having metal foil on both surfaces (upper and lower surfaces) is prepared. A through hole penetrating the thickness of the metal foil is formed in the resin film. And the electroless-plating process is performed to this resin film, and the electroless-plating layer is formed in the surface of metal foil and the wall surface of a through-hole. Further, an electroplating process is performed on the surface of the electroless plating layer to form an electrolytic plating layer. Thereafter, a resist layer is provided on the plating layer that forms the metal conductive portion, and after etching to remove unnecessary metal foil and the plating layer, the resist layer is also peeled off. In this way, the base film 16 provided with the metal conductive part 17 is obtained.

  Next, a mold for forming the base rubber 15 is prepared. The molding die is made of a non-magnetic material, and an orientation pin made of a ferromagnetic material is embedded in order to form the particle conductive portion 15a. One end of the orientation pin is exposed on the cavity surface where the particle conductive portion 15a is to be formed. A base film 16 having a metal conductive portion 17 is set in the molding die. At this time, the base film 16 is set so that the position of the orientation pin of the mold and the position of the metal conductive portion 17 overlap. Thereafter, liquid rubber containing conductive particles of a magnetic conductor is injected into the mold, and a magnetic field is applied. At this time, the magnetic conductor is attracted to the portion sandwiched between the orientation pins, and the magnetic conductors are aligned in a chain between the orientation pins. Then, the liquid rubber is cured to integrally form the protective portion 15b, the elastic film 15c, and the particle conductive portion 15a to obtain the connector 11. In addition, when setting the base film 16 to a metal mold | die, a primer can be apply | coated to the base film 16 and the adhesive force of the base film 16 and the elastic film 15c can be raised.

According to the connector 11 thus obtained, the following operations and effects can be achieved.
The particle conductive portion 15a provided on the base rubber 15 has rubber-like elasticity, and can electrically connect the connection target members in a compressed state. The particle conductive portion 15a communicates with the solder side surface metal portion 17a, and the solder side surface metal portion 17a extends on the surface 16a of the base film 16 wider than the particle conductive portion 15a. Can be fixed with solder. That is, it is possible to realize the connector 11 that can be fixed to the circuit board in the solder reflow process even if the narrow particle conductive portion 15a is provided.

  Further, the solder side surface metal portion 17a and the rubber side surface metal portion 17b formed on the base film 16 spread in a bowl shape on the surface of the base film 16, and further communicate with the connecting metal portion 17c to form an H-shaped metal conductive portion 17. Thus, both the surface metal parts 17a and 17b realize a sufficient fixing area with respect to the base film 16, and the base film 16 is joined to the metal conductive part 17 so as to be fitted. It is possible to increase the adhesion between the metal 16 and the metal conductive portion 17. Therefore, it is possible to realize the connector 11 in which the metal conductive portion 17 is not easily detached from the base film 16 and is not easily detached from the connection target member.

Furthermore, since the rubber-side surface metal portion 17b provided on the base film 16 is wider than the particle conductive portion 15a provided on the base rubber 15, the contact surface between the base rubber 15 and the base film 16 is larger. The conductive path 13 can be formed wide, and the connector 11 with high connection reliability can be realized.
Since the base rubber 15 has the elastic film 15c that covers the lower surface 16b of the base film 16, the connector 11 having a large fixing force between the base film 16 and the base rubber 15 can be realized.
Further, since a part of the particle conductive portion 15a provided on the base rubber 15 is fitted in the cylinder of the connecting metal portion 17c, the adhesion between the base rubber 15 and the metal conductive portion 17 is also increased. be able to. Since the inside of the cylinder of the connecting metal portion 17c also becomes a contact surface between the particle conductive portion 15a and the metal conductive portion 17, the contact area between the particle conductive portion 15a and the metal conductive portion 17 can be increased, and the particle conductive portion 15a The metal conductive part 17 can be reliably connected to the conductive part.

Modification 1 of the first embodiment (FIG. 3) :
In the connector 11 exemplified above, a part of the particle conductive portion 15a fills the cylinder of the connecting metal portion 17c, but the inside of the connecting metal portion 17c can be made hollow. Such a connector 11a is shown in FIG.
Even if the inside of the through hole 16c provided in the base film 16 is hollow, the solder-side surface metal part 17a and the rubber-side surface metal part 17b can be electrically connected by the connecting metal part 17c. And even if the inside of the through-hole 16c is hollow, since the particle | grain conductive part 15a can be made to contact the rubber | gum side surface metal part 17b, the conductive path 13 can be formed in the connector 11a.
The connector 11a in which the inside of the through hole 16c is hollow can be lightened by the amount of the hollow, and is preferable when manufacturing a large connector 11a in which a large through hole 16c is formed.

Modification 2 of the first embodiment (FIG. 4) :
In the connector 11 exemplified above, an example in which a part of the particle conductive portion 15a fills the cylinder of the connecting metal portion 17c has been shown. However, the connecting metal portion 17c can be made of solid metal. Such a connector 11b is shown in FIG.
In the connector 11b, when the connecting metal portion 17c is formed by plating, it can be formed solid by filling the through hole 16c of the base film 16 with a plating layer.
Even if the connecting metal part 17c in which the inside of the through hole 16c is filled with metal is provided, the conductive path 13 can be formed in the connector 11a.
The connector 11b in which the inside of the through hole 16c is solid with metal can increase the contact area between the solder side surface metal portion 17a and the connection metal portion 17c, and between the rubber side surface metal portion 17b and the connection metal portion 17c. The solder-side surface metal portion 17a, the rubber-side surface metal portion 17b, and the connecting metal portion 17c can be more firmly integrated.

Second Embodiment [FIGS. 5 to 7] :
The connector 21 of 2nd Embodiment is shown in FIGS. FIG. 5 is a sectional view of the connector 21, and FIGS. 6 and 7 are bottom views of the connector 21.
In the connector 21, an elastic film 25 c made of a rubber-like elastic body that covers the base film 16 is formed thin except for an outer edge portion thereof.

The elastic film 25c is fixed to the lower surface 16b of the base film 16 in the same manner as the elastic film 15c shown in the previous embodiment. However, the periphery of the protruding portion 14 is formed as a thin portion 25d having a small thickness, and the outer edge portion of the connector 21 is formed as a thick portion 25e having a large thickness.
As shown in FIG. 6, the thin portion 25d can be formed in a lattice shape as shown in FIG. 7, in addition to being formed in accordance with the shape of the protruding portion 14, as shown in FIG.
The thin portion 25d is preferably formed thinner than the base film 16 and more preferably 5 μm or less.

According to the connector 21, since the thin portion 25d is formed, the stress in the bending direction applied to the elastic film 25c in a high temperature atmosphere can be reduced, and the warp of the base film 16 can be suppressed.
Moreover, since the thick part 25e is formed, the outer edge of the base film 16 can be made difficult to bend and the connector 21 can be easily handled.

Third Embodiment (FIG. 8) :
A connector 31 of the third embodiment is shown in FIG. FIG. 8 is a cross-sectional view of the connector 31.
In the connector 31, no elastic film is formed on the base rubber 15, and the base film 16 is exposed on the lower surface 16 b side of the base film 16.
Further, on the lower surface 16b of the base film 16, an outer peripheral rib 37 that holds the shape of the outer edge thereof is formed in a ring shape with a rubber-like elastic body.

According to the connector 31, since there is no elastic film laminated | stacked on the base film 16, when the elastic film exists, the curvature of the base film 16 which arises at a solder reflow process can be eliminated.
Further, the outer peripheral rib 37 makes it difficult for the outer edge of the base film 16 to be drawn, and the connector 31 can be easily handled.

Fourth Embodiment (FIG. 9) :
A connector 41 of the fourth embodiment is shown in FIG. FIG. 9 is a cross-sectional view of the connector 41. In the connector 41, an elastic film 45 c is also provided on the upper surface 16 a side of the base film 16.
The elastic film 45 c covers and adheres to the upper surface 16 a side of the base film 16 around the solder side surface metal portion 17 a in the metal conductive portion 17.

  In the manufacture of the connector 41, after the connector 11 is manufactured, the connector 41 can be manufactured by fixing the elastic film 45c later using a mold for forming the elastic film 45c. That is, after the connector 11 is set in a mold, an insulating liquid rubber is injected and cured to form the elastic film 45c to obtain the connector 41.

According to the connector 41, since the lower surface 16b and the upper surface 16a of the base film 16 are laminated with the elastic film 15c or the elastic film 45c, the lower surface 16b side and the upper surface 16a side of the base film 16 are used in the high temperature atmosphere of the solder reflow process. The stress of the elastic films 15c and 44 can be received, and the base film 16 can be made difficult to warp.
If the thickness of the elastic film 45c is made thinner than the thickness of the elastic film 15c, a rubber-like elastic body having a thermal expansion larger than that of the elastic film 15c is used as the material of the elastic film 45c, whereby the lower surface 16b side and the upper surface 16a of the base film 16 are used. It is preferable to balance the stress on the side.

Modification 1 of the fourth embodiment (FIG. 10) :
In the connector 41 of the fourth embodiment, an example in which the thickness of the elastic film 45c is thinner than the thickness of the elastic film 15c has been shown. However, in the connector 41a of the first modification, as shown in FIG. An elastic film 25c having a thin portion 25d having a thickness equivalent to that of the elastic film 45c can be provided.
If it does in this way, the stress balance of the thermal expansion in the upper surface 16a side and the lower surface 16b side of the base film 16 can be taken, and the base film 16 can be made difficult to warp.

Modification 2 of the fourth embodiment (FIG. 11) :
In the connector 41 of the fourth embodiment, an example in which the elastic film 15c and the elastic film 45c are separately provided has been shown. However, in the connector 41b of the second modification example, the through-hole 16a and the base film 16 are provided as shown in FIG. A through hole 16d is provided in the elastic film 15c, and the elastic film 15c and the elastic film 45c can be integrally formed through the through hole 16d.
If the elastic film 15c and the elastic film 45c are integrally formed in this way, the fixing force of the base rubber 15 to the base film 16 is increased, and it can be made difficult to peel from the base film 16. Further, in the manufacture of the connector 41, the liquid rubber can be injected into the upper surface 16a side and the lower surface 16b side of the base film 16 through the through holes 16d, so that the connector 41 can be easily manufactured.

Fifth embodiment (FIGS. 12 and 13) :
A connector 51 of the fifth embodiment is shown in FIGS. 12 is a plan view of the connector 51, and FIG. 13 is a cross-sectional view of the connector 51 taken along line SB-SB.
In the connector 51, a reinforcing frame 57 made of metal is provided near the outer edge of the base film 16.

The reinforcing frame 57 is a member for suppressing warpage of the base film 16 and is fixed to the upper surface 16a and the lower surface 16b of the base film 16 so as to surround the conduction path 13 in an annular shape. This reinforcing frame 57 is similar to the solder side surface metal portion 17a and the rubber side surface metal portion 17b of the metal conductive portion 17, and "metal foil" fixed to the upper surface 16a and the lower surface 16b of the base film 16, respectively. It is a laminated structure of “plating layer” that is fixed to each outer surface.
When such a reinforcing frame 57 is provided, the thickness of the rubber-side surface metal portion 17b is more preferably 25 μm to 100 μm. If thickness is 25 micrometers or more, rigidity can be improved and the curvature of the connector 51 can be reduced greatly in a solder reflow process.

  In the manufacture of the connector 51, unlike the manufacture of the connector 11, the base film 16 including the metal conductive portion 17 and the reinforcing frame 57 is set in a mold for forming the elastic film 15c and the base rubber 15. That is, for the resin film having a metal foil on which a plating layer is formed, a resist layer is provided on the plating layer that forms the metal conductive portion 17 and the reinforcing frame 57, and an etching process is performed. Are formed at the same time. Thus, the connector 51 is obtained by forming the elastic film 15 c and the base rubber 15 on the base film 16 including the metal conductive portion 17 and the reinforcing frame 57.

  According to the connector 51, since the warp of the base film 16 is suppressed by the rigidity of the reinforcing frame 57, the base film 16 is warped even if stress is applied to the base film 16 from the elastic film 15c in the solder reflow process. Can be difficult.

The reinforcing frame 57 is preferably provided on the upper surface 16 a and the lower surface 16 b of the base film 16, but may be provided only on one surface of the base film 16.
When the reinforcing frame 57 is provided on the upper surface 16c of the base film 16, the reinforcing frame 57 can be used as a portion for fixing the solder.
When the reinforcing frame 57 is provided on the lower surface 16 b of the base film 16, the reinforcing frame 57 made of metal is not exposed on the upper surface 16 a side of the base film 16, thereby preventing contact between the circuit board to be soldered and the reinforcing frame 57. It is possible to prevent a short circuit between the circuit on the circuit board and the reinforcing frame 57. Therefore, the vicinity of the electrodes on the circuit board can be highly integrated.

Modification common to each embodiment :
As shown in FIG. 14, the base rubber 15 can be provided with a protruding portion 14 a having no corresponding particle conductive portion 15 a with respect to a part of the metal conductive portion 17.
The metal conductive portion 17 that does not form the conductive path 13 can be used for fixing the solder to the circuit board. Moreover, the protrusion part 14a without the particle | grain conductive part 15a can hold | maintain the connection object members elastically stably.

  Each connector 11, 21, 31, 41, 51 can be provided with an arbitrary number of conductive paths 13. For example, only one conductive path 13 can be provided, or a large number of conductive paths 13 can be provided such as m rows and n columns. Further, the conductive path 13 can be provided in a scattered manner at an arbitrary position.

  To the elastic films 15c, 24, and 44 covering the base film 16, inorganic particles having a linear expansion coefficient smaller than that of the rubber-like elastic body can be added. By adding inorganic particles, the linear expansion coefficient of the elastic films 15c, 24, and 44 can be reduced, and the warpage of the base film 16 in the solder reflow process can be reduced by approaching the linear expansion coefficient of the base film 16. For the inorganic particles having a linear expansion coefficient smaller than that of the rubber-like elastic body, for example, silica, aluminum oxide, aluminum nitride, silicon nitride, graphite, glass fiber, carbon fiber, mica, boehmite, talc, or a mixture thereof may be used. it can. Among these, it is preferable to use silica having a small linear expansion coefficient, excellent electrical insulation, and thermally and chemically stable.

  Each said embodiment is an illustration of this invention, and in the limit which does not produce contradiction, the component shown by each said embodiment can be suitably changed into the component shown by other embodiment.

  A double-sided copper foil polyimide film (16) in which both sides of a polyimide film having a thickness of 50 μm are coated with a copper foil having a thickness of 35 μm is prepared. The double-sided copper foil polyimide film (16) is formed with a through hole (16c) having a diameter of 0.1 mm that penetrates the copper foil and the polyimide film. Next, the double-sided copper foil polyimide film (16) is subjected to an electroless copper plating process to form an electroless copper plating layer on the surface of the copper foil and the wall surface of the through hole (16c). Furthermore, an electrolytic copper plating process is performed on the surface of the electroless copper plating layer to form a copper plating layer having a thickness of 10 μm.

  About the double-sided copper foil polyimide film (16) which performed the plating process, a resist layer is formed in the part left as a solder side surface metal part (17a) or a rubber side surface metal part (17b). The solder-side surface metal part (17a) and the rubber-side surface metal part (17b) were formed in a circular shape with a diameter of 0.6 mm so as to overlap the front and back surfaces of the polyimide film (16). And after removing the copper foil and copper plating layer of the part which has not provided the resist layer by etching, the resist layer was peeled. Further, a gold plating layer having a thickness of 0.5 μm was formed on the copper surface to obtain a base film (16) having a metal conductive portion (17).

  Next, a mold for forming the base rubber (15) is prepared. This mold is made of a non-magnetic material, and an orientation pin made of a ferromagnetic material is embedded in order to form the particle conductive portion (15a). One end of the orientation pin is exposed on the cavity surface where the particle conductive portion (15a) is to be formed. A base film (16) having a metal conductive part (17) is set in this mold. Here, the base film (16) is set so that the position of the orientation pin of the mold and the position of the metal conductive portion (17) overlap. And liquid silicone rubber which mix | blended silver plating nickel particle | grains with a particle size of 40 micrometers as a magnetic conductor is inject | poured in a metal mold | die, and a magnetic field is applied. At this time, the magnetic material is attracted to the portion sandwiched between the orientation pins of the ferromagnetic material to form the particle conductive portion (15a) in which the magnetic conductor is oriented in the thickness direction of the connector. Thereafter, the liquid silicone rubber was cured and integrated with the base film (16) provided with the metal conductive portion (17) to manufacture the connector (11) of the first embodiment having the conductive path (13).

11 Connector (first embodiment)
11a Connector (Modification 1 of the first embodiment)
11b Connector (Modification 2 of the first embodiment)
12 Base member 13 Conductive path 14 Protruding portion 14a Protruding portion 15 Base rubber 15a Particle conducting portion 15b Protective portion 15c Elastic film 16 Base film 16a Upper surface (one surface)
16b Lower surface (the other surface)
16c Through-hole 16d Through-hole 17 Metal conductive portion 17a Solder side surface metal portion 17b Rubber side surface metal portion 17c Connection metal portion 21 Connector (second embodiment)
21a connector (modified example of the second embodiment)
25c Elastic membrane 25d Thin part 25e Thick part 31 Connector (3rd Embodiment)
37 outer peripheral rib 41 connector (fourth embodiment)
41a Connector (Modification 1 of 4th Embodiment)
41b Connector (Modification 2 of 4th Embodiment)
45c Elastic membrane 51 connector (fifth embodiment)
57 Reinforcing frame 61 Connector (Modification 3 of the first embodiment)

Claims (8)

A connector for providing a conductive path that penetrates the thickness of the base member on an insulating base member made of a base rubber made of a rubber-like elastic body and a base film made of a resin film, thereby electrically connecting the connection target members to each other. Because
The base rubber has a particle conductive portion that is energized with conductive particles contained in the rubber-like elastic body,
The base film has a solder-side surface metal portion extending in a bowl shape along one surface of the base film at the periphery of the through hole penetrating the base film, and a bowl shape along the other surface of the base film at the periphery of the through hole. A metal conductive portion comprising: a rubber-side surface metal portion that spreads through; and a connecting metal portion that connects the solder-side surface metal portion and the rubber-side surface metal portion through the through hole;
The conductive conductive path is formed by communicating the particle conductive portion of the base rubber and the metal conductive portion of the base film ,
A connector comprising an elastic film made of an insulating rubber-like elastic body covering a base film on the surface of a base film having a rubber-side surface metal part . The connector according to claim 1 , further comprising an elastic film made of an insulating rubber-like elastic body covering the base film on a surface of the base film having the solder side surface metal part. An elastic film made of an insulating rubber-like elastic body covering the surface of a base film having a rubber-side surface metal part, and an elastic film made of an insulating rubber-like elastic body covering the surface of the base film having a solder-side surface metal part The connector according to claim 2, which has a thickness equivalent to that of the connector. A connector for providing a conductive path that penetrates the thickness of the base member on an insulating base member made of a base rubber made of a rubber-like elastic body and a base film made of a resin film, thereby electrically connecting the connection target members to each other. Because
The base rubber has a particle conductive portion that is energized with conductive particles contained in the rubber-like elastic body,
The base film has a solder-side surface metal portion extending in a bowl shape along one surface of the base film at the periphery of the through hole penetrating the base film, and a bowl shape along the other surface of the base film at the periphery of the through hole. A metal conductive portion comprising: a rubber-side surface metal portion that spreads through; and a connecting metal portion that connects the solder-side surface metal portion and the rubber-side surface metal portion through the through hole;
The conductive conductive path is formed by communicating the particle conductive portion of the base rubber and the metal conductive portion of the base film ,
A connector comprising an elastic film made of an insulating rubber-like elastic body covering a base film on the surface of a base film having a solder side surface metal part . The connector according to any one of claims 1 to 4, wherein the rubber-side surface metal part is formed wider in the planar direction of the base film than the particle conductive part. The connector according to any one of claims 1 to 5, wherein the particle conductive portion is formed wider in the plane direction of the base film than the connecting metal portion. The connecting metal part is cylindrical,
The connector according to any one of claims 1 to 6, wherein a part of the particle conductive part is formed so as to fill a cylinder of the connecting metal part. The connector according to claim 1, wherein a reinforcing frame made of metal is provided on an outer edge of the base film.

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