JP2000330120A - Manufacture of fine particle-mounted substrate, device therefor and manufacture of liquid crystal display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make easily manufacturable a liquid crystal display panel without generating a critical flaw of a defective display due to the presence of flocculating particles (including foreign matter) larger than spacer particles and without scrapping in the liquid crystal display panel comprising a thin film transistor(TFT) substrate and a color filter substrate between which a liquid crystal is enclosed. SOLUTION: The manufacturing method comprises a mounting step to scatter and mount numerous spacer particles 1 at least on either a TFT substrate 31 or a color filter substrate 32, a removing step to remove flocculating particles from the numerous spacer particles mounted on the substrate in the mounting step in a state most of the numerous spacer particles are left on the substrate by sucking, overlapping and sticking the TFT substrate 31 and the color filter substrate 32, on at least either of which the numerous spacer particles, from which the flocculating particles are removed at the removing step, are mounted and the gap is determined, together and a liquid crystal enclosing step to enclose a liquid crystal 36 between the stuck TFT substrate and the color filter substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a fine particle mounting substrate for manufacturing a substrate on which a large number of fine particles from which agglomerated particles (including foreign substances) have been removed are mounted. And a method for manufacturing a liquid crystal display panel including a TFT substrate and a color filter substrate.

[0002]

2. Description of the Related Art Japanese Unexamined Patent Publication No. 7-60211 (Prior Art 1) is known as a prior art of a dust removing device for removing dust adhering to a work. In the prior art 1, a first ejection nozzle and a second ejection nozzle for ejecting ultrasonic air E ₁ and E ₂ in directions approaching each other are provided, and between the first ejection nozzle and the second ejection nozzle. And a dust removing device provided with a suction nozzle. Further, as a prior art relating to a substrate processing apparatus applied to the manufacture of various substrates such as a semiconductor wafer, a glass substrate of a liquid crystal display, a PDP (plasma display), and an EL (electroluminescence), Japanese Patent Application Laid-Open No. 10-12710 ( Conventional technology 2)
Is known. The prior art 2 includes a cleaning apparatus for removing a foreign substance attached to a work table in a substrate processing apparatus which performs a predetermined process while holding a substrate to be processed carried in on a work table surface and carries out a predetermined process. Drive means for moving the cleaning device between a work position facing the work table surface and a retreat position outside the work table; and moving the cleaning device from the retreat position to the work position to move the cleaning device on the work table. There is described a substrate processing apparatus provided with a control unit for controlling the cleaning device and the driving unit in order to remove foreign matter.

[0003]

By the way, for example, in a liquid crystal display panel, fine spacer particles are scattered over the entire surface of the substrate in order to maintain a high precision and uniformity between opposing substrates. In the step of dispersing the spacer particles, when an aggregate of the spacer particles or a foreign substance is attached, a fatal defect such as a display defect occurs.
As a means for finding this defect, there are a method of inspecting a gap in a state where the substrates are superimposed, and a method of inspecting in a lit state after sealing the liquid crystal. However,
In this case, it is difficult to remove agglomerates and foreign substances from this state because the liquid crystal has already been superimposed or after the liquid crystal has been sealed, and it has to be discarded, resulting in a large loss in production. In addition, in order to regenerate even if aggregates or foreign substances are found after superposition, there is a problem that the superposed substrates must be peeled off, cleaned, and re-input to the production line with special specifications. It was not a good idea considering the cost. In addition, the above prior arts 1 and 2 do not consider, for example, that after the spacer particle dispersing step of the liquid crystal display panel, aggregates and foreign substances can be removed while leaving the spacer particles normally dispersed. .

[0004] An object of the present invention is to solve the above problems.
It is an object of the present invention to provide a method and an apparatus for manufacturing a microparticle-mounted substrate that can manufacture a substrate mounted with a large number of microparticles from which agglomerated particles (including foreign substances) larger than the microparticles have been removed. Another object of the present invention is to provide a liquid crystal display panel composed of a TFT substrate in which liquid crystal is sealed and a color filter substrate, a display failure due to the presence of aggregated particles (including foreign substances) larger than the spacer particles. It is an object of the present invention to provide a method of manufacturing a liquid crystal display panel which can be easily manufactured without discarding so as not to cause a general defect.

[0005]

In order to achieve the above object, the present invention provides a mounting step of dispersing and mounting a large number of fine particles on a substrate, and a method of mounting a large number of fine particles mounted on the substrate in the mounting step. Among the fine particles, the suction force based on the laminar air flow acting on the large agglomerated particles (including foreign matters) was made larger than the fixing force of the fine particles to the substrate, and most of the large number of fine particles were left on the substrate. Removing the aggregated particles (including foreign substances) by suction in a state, and manufacturing a substrate on which a large number of fine particles from which the aggregated particles have been removed by the removal step are mounted. This is a method for manufacturing a mounting substrate. Further, the present invention provides a mounting step of dispersing and mounting a large number of spacer particles on at least one of the TFT substrate and the color filter substrate, and a method of mounting the large number of spacer particles on the substrate in the mounting step. Aggregated particles (including foreign matter) with most of the spacer particles remaining on the substrate
A color filter substrate and a TFT substrate having a gap determined by mounting a large number of spacer particles from which agglomerated particles have been removed by at least one of them, and bonding them. TF
A liquid crystal sealing step of sealing liquid crystal between the T substrate and the color filter substrate, and manufacturing a liquid crystal display panel including a TFT substrate and a color filter substrate in which liquid crystal is sealed in the liquid crystal sealing step. A method for manufacturing a liquid crystal display panel. Further, the present invention is characterized in that, in the removing step of the method for manufacturing a liquid crystal display panel, agglomerated particles (including foreign substances) are removed by using a suction force.

Further, the present invention provides a mounting step of dispersing and mounting a large number of spacer particles on at least one of a TFT substrate and a color filter substrate, and providing a large number of spacers mounted on the substrate in the mounting step. A state in which the suction force based on the laminar air flow acting on the large agglomerated particles (including foreign substances) is larger than the adhesion force of the spacer particles to the substrate, and most of the large number of spacer particles are left on the substrate. A removing step of sucking and removing the aggregated particles (including foreign matter), and a TFT substrate and a color filter substrate each having a gap determined by mounting at least one of a plurality of spacer particles from which the aggregated particles have been removed by the removing step. A liquid crystal sealing step of sealing liquid crystal between the TFT substrate and the color filter substrate bonded to each other. It is a manufacturing method of a liquid crystal display panel, characterized in that to produce the configured liquid crystal display panel in the encapsulated TFT substrate and the color filter substrate. Also,
The present invention provides a mounting step of dispersing and mounting a large number of spacer particles on at least one of a TFT substrate and a color filter substrate, and among the many spacer particles mounted on the substrate in the mounting step, The suction force based on the laminar air flow acting on the large agglomerated particles (including foreign matter) is made larger than the fixing force of the spacer particles to the substrate, and the agglomerated particles ( A removing step of sucking and removing foreign substances), a coating step of applying a sealing material on at least one of the TFT substrate and the color filter substrate so as to surround the display surface, and a step of removing the aggregated particles (including foreign substances) by the removing step. ) Is mounted on at least one of the plurality of spacer particles, the gap is determined, and the TFT substrate is surrounded by the sealing material applied in the application step. A liquid crystal encapsulation step of enclosing liquid crystal between the color filter substrate and a liquid crystal display panel including a color filter substrate and a TFT substrate enclosing liquid crystal in the liquid crystal encapsulation step. This is a method for manufacturing a liquid crystal display panel. Further, in the present invention, in the removing step of the method for manufacturing a liquid crystal display panel, the residual rate of the spacer particles from the initial dispersion state is about 90% or more, and the removal rate from the number of generated aggregated particles (including foreign substances) is increased. Is about 80% or more.

Further, according to the present invention, there is provided a mounting means for dispersing and mounting a large number of fine particles on a substrate, and, among the large number of fine particles mounted on the substrate by the mounting means, large agglomerated particles (including foreign matter). Suction force based on the laminar air flow acting on the fine particles is larger than the adhesion force of the fine particles to the substrate, and the agglomerated particles (including foreign substances) are sucked while most of the large number of fine particles remain on the substrate. A fine particle-mounted substrate manufacturing apparatus comprising: a substrate on which a large number of fine particles from which agglomerated particles and foreign matter have been removed are provided. . Further, the present invention provides a substrate stage for adsorbing and mounting a substrate loaded with a large number of fine particles, a suction nozzle for sucking agglomerated particles, and any one of the substrate stage and the suction nozzle. A traveling mechanism for traveling both of them, and the traveling mechanism relatively moves a substrate on which a large number of fine particles are scattered and mounted, and a suction nozzle, so that large aggregated particles (including foreign matter) at the tip of the suction nozzle. The suction force based on the laminar air flow acting on the substrate is made larger than the adhesion force of the fine particles to the substrate, and the agglomerated particles (including foreign substances) are suctioned and removed while most of the large number of fine particles remain on the substrate. An agglomerated particle removing device (removing means) characterized by having such a configuration.

Further, the present invention is characterized in that the agglomerated particle removing device (removing means) is configured to have a slit-shaped opening as a suction nozzle. Also,
According to the present invention, in the apparatus for removing aggregated particles (removing means), the slit-shaped opening of the suction nozzle has a length equal to or greater than the width of the substrate, and a light-transmitting sensor is provided near the opening. It is characterized by the following. Further, the invention is characterized in that the agglomerated particle removing device (removing means) is provided with a sensor for detecting the height of the surface of the substrate placed on the substrate stage. Further, the present invention is characterized in that in the agglomerated particle removing apparatus (removing means), a control means for controlling a gap between the tip of the suction nozzle and the surface of the substrate is provided.

As described above, according to the above configuration,
It is possible to manufacture a substrate on which a large number of fine particles from which agglomerated particles (including foreign substances) larger than the fine particles are removed are mounted. Further, according to the above configuration, the liquid crystal is sealed in the T
In a liquid crystal display panel composed of an FT substrate and a color filter substrate, it is easily manufactured without discarding so as not to cause a fatal defect of display failure due to the presence of agglomerated particles (including foreign matter) larger than the spacer particles. can do. Further, it is possible to manufacture a liquid crystal display panel in which the residual ratio of the spacer particles from the initial dispersion state is about 90% or more, and the removal rate from the number of generated aggregated particles (including foreign substances) is about 80% or more. .

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a liquid crystal display panel according to the present invention, a method for manufacturing the same, a method for removing aggregated particles and foreign matter, and an apparatus therefor will be described with reference to the drawings.
One embodiment of a liquid crystal display panel according to the present invention is configured as shown in FIG. That is, the liquid crystal display panel according to the present invention has a TFT (Thin F) in which a transistor is formed.
ilm Transistor) substrate 31 and red, green,
A color filter substrate 32 having a blue color, an alignment film 33 formed on the TFT substrate 31 and the color filter substrate 32, and after forming the alignment film 33, the TFT substrate 31 or the color filter substrate 32 Alternatively, the spacer particles 1 which determine the gap between the TFT substrate 31 in which the liquid crystal 36 is filled and the liquid crystal 36 is sealed and the color filter substrate 32, and the TFT substrate 31 or the color filter substrate 32 It is composed of a sealing material 33 applied so as to surround the display surface, a liquid crystal 36 injected into the sealing material 33, and an illumination light source (not shown) provided on the TFT substrate 31.

In the above-mentioned liquid crystal display panel, the gap between the opposing surfaces of the TFT substrate 31 and the color filter substrate 32 is required to have a high accuracy of the order of ± 0.1 μm. The spacer particles (fine particles) 1 are uniformly dispersed on the substrate surface. Here, if the gap is not uniform, display defects such as uneven brightness will occur, and the performance as a liquid crystal display device will not be satisfied. There are several factors that make the gap non-uniform, one of which is shown in FIG.
The TFT substrate 31 and the color filter substrate 32 are assembled in a state where the spacer particles 1 are fixed to each other to form the aggregated particles 15 on the alignment film 33 of the substrate 31 or 32. Further, as shown in FIG. 3, a similar state occurs when any foreign matter 16 is present.

The size of the spacer particles 1 should be slightly larger than the actual gap,
When the color filter substrate 32 is assembled (the TFT substrate 31 and the color filter substrate 32 are positioned and overlapped with each other, and are assembled by bonding with the sealing material 33 or the like), pressure is applied to the actual desired gap. Become. Here, although it depends on the type and shape of the agglomerated particles 15 or the foreign matter 16, the desired gap 10
The doubled one is often crushed when the TFT substrate 31 and the color filter substrate 32 are assembled, and does not often become defective. Therefore, aggregated particles 1 having a size of several tens μm or more
If the particles 5 and the foreign matter 16 can be removed, display defects can be prevented. In view of the above, the present invention is to prevent the display failure from occurring by removing the aggregated particles 15 and foreign substances 16 having a size of about several tens of μm or more without removing the spacer particles 1 scattered on the substrate.

Next, an embodiment of a method of manufacturing a liquid crystal display panel according to the present invention will be described. That is, the method of manufacturing a liquid crystal display panel according to the present invention includes an alignment film forming step of forming an alignment film 33 on a TFT substrate 31 and a color filter substrate 32, and a TFT having the alignment film 33 formed in the alignment film forming step. Means for dispersing spacer particles on one or both of the substrate 31 and the color filter substrate 32 (mounting means)
(Not shown), a mounting step of dispersing and mounting the spacer particles 1, and a large number of aggregated particles (foreign matter) by the suction nozzles 4 and 19 from among a large number of spacer particles mounted on the substrate in the mounting step. The suction force based on the laminar air flow acting on the particles 15 and 16 is made larger than the adhesion force of the spacer particles to the substrate, and the agglomerated particles 15 and A removing step of sucking and removing 16; and a color filter substrate 32 and a TFT substrate 31 having a gap determined by mounting a large number of spacer particles from which agglomerated particles 15 and 16 have been removed by the removing step. And a liquid crystal encapsulating step of enclosing the liquid crystal 36 between the TFT substrate 31 and the color filter substrate 32 which are adhered to each other. It is intended to produce a configured liquid crystal display panel with a TFT substrate 31 and the color filter substrate 32 that is.

Further, the method of manufacturing a liquid crystal display panel according to the present invention comprises a TFT substrate 31 and a color filter substrate 32.
An alignment film forming step of forming an alignment film 33 thereon, and spacer particle dispersing means (mounting means) on one or both of the TFT substrate 31 and the color filter substrate 32 on which the alignment film 33 is formed in the alignment film forming step (Not shown), a mounting step of dispersing and mounting the spacer particles 1, and a large number of aggregated particles (foreign matter) by the suction nozzles 4 and 19 from among a large number of spacer particles mounted on the substrate in the mounting step. Also included)
Removal by suctioning the aggregated particles while leaving most of the large number of spacer particles 1 on the substrate by making the suction force based on the laminar air flow acting on the substrates 15 and 16 larger than the adhesion force of the spacer particles to the substrate. Process and at least the TFT substrate 31
And a coating step of applying a sealing material 33 to some of the substrates of the color filter substrate 32 so as to surround the display surface, and at least one of the large number of spacer particles 1 from which the aggregated particles 15 and 16 have been removed by the removing step. A liquid crystal encapsulation step of enclosing a liquid crystal 36 between the TFT substrate 31 and the color filter substrate 32 surrounded by the sealing material 33 applied in the application step, wherein the liquid crystal 36 is provided. A liquid crystal display panel including a TFT substrate 31 and a color filter substrate 32 in which a liquid crystal 36 is sealed in a sealing process is manufactured.

Next, an embodiment of a method and an apparatus for removing agglomerated particles 15 and foreign matters 16 of several tens μm or more without removing spacer particles (fine particles) 1 scattered on a substrate will be described with reference to the drawings. It will be described using FIG.
FIGS. 4 and 5 are a perspective view and a front view, respectively, showing an embodiment of an apparatus for removing aggregated particles 15 and foreign matter 16 used after dispersing spacer particles in a liquid crystal display panel. The apparatus for removing the agglomerated particles 15 and the foreign matter 16 includes a substrate stage 3 (31 or 32) on which the spacer particles (fine particles) 1 are dispersed by vacuum suction, and a substrate stage 3 traveling uniaxially; Substrate 2 during running
And a suction nozzle 4 installed above with a certain gap from the upper surface of the nozzle. Here, the substrate stage 3
Is connected to a suction device (2) 11 for sucking and fixing the substrate 2 (31 or 32), and a pressure sensor for measuring a vacuum pressure sucked by the suction device (2) 11 therebetween. 2) 13 is provided. In particular, the reason why the substrate 2 (31 or 32) is adsorbed on the substrate stage 3 is that the tip of the suction nozzle 4 and the surface of the substrate 2 are moved by following the substrate stage 3 even if the substrate 2 is warped. This is to maintain a constant gap between them. Further, on both sides during the movement of the substrate stage 3, light transmitting sensors (1) 5 that can detect, for example, those having a height of about 0.5 mm or more at a position slightly above the surface of the substrate 2 are provided. Provided.

Next, an embodiment of the suction nozzle 4 for sucking and removing aggregated particles and foreign matter will be described with reference to FIG.
The suction nozzle 4 has, for example, an elongated slit-shaped opening 4 a having a width of about 0.5 mm to 2 mm and longer than one side of the substrate 2.
As shown in FIG. 5, it is connected to a suction device (1) 10 through a pipe 9, and a pressure sensor (1) 12 is provided in the middle thereof. The reason why the length of the elongated slit-shaped opening 4a in the longitudinal direction is longer than one side of the substrate 2 is to efficiently remove the aggregated particles and foreign substances on the substrate 2 by one run of the substrate stage 3. Because he did. Therefore, in the case where the aggregated particles and foreign matter on the substrate 2 are to be suctioned and removed by a plurality of runs of the substrate stage 3, the longitudinal dimension of the elongated slit-shaped opening 4 a is shorter than one side of the substrate 2. It is clear that this may be done. The main body of the suction nozzle 4 drives and controls the gap between the tip of the suction nozzle 4 and the surface of the substrate 2 on a column 7 that straddles the part where the substrate stage 3 travels as shown in FIGS. And fixed via a linear motion actuator (vertical drive mechanism) 8 such as a linear motion cylinder. An optical sensor (2) 6 configured to project and receive light in the longitudinal direction of the slit is provided at a position slightly ahead of the opening of the suction nozzle 4.
Is provided. The optical sensor (2) 6 can detect, for example, that an object having a size of about 0.3 mm or more is attached to the tip of the opening. FIG. 7 shows a state in which the spacer particles 1 and the aggregated particles 15 and the foreign matter (1) 16 adhere to the substrate 2 on which the spacer particles 1 are dispersed.
This shows a state where only the aggregated particles 15 are removed by the suction nozzle 4.

An operation flow for sucking and removing the aggregated particles 15 of the spacer particles 1 and the foreign matter (1) 16 in the above-described configuration will be described with reference to FIG. First, in step S81, the suction device (1) 10 of the suction nozzle 4 is operated (ON) based on a command from the control device 41. At this time, in step S82, the suction pressure measured by the pressure sensor (1) 12 is input to the control device 41, and the control device 41 determines whether the suction pressure measured by the pressure sensor (1) 12 is other than the set value. If the suction pressure indicates the set value, in step S86, the output means 42 such as the display means has an alarm indicating that the pipe 9 is clogged and the suction state is not normal. Is output. The operator stops the suction device (1) 10 based on the alarm output, takes measures such as clearing the clogging of the pipe 9, and restarts the operation.

Next, the control device 41 controls the optical sensor (2) disposed at the tip of the suction nozzle 3 in step S83.
6 is ON (light-shielded state), the suction nozzle 4
It is determined that the foreign matter (2) 17 has been caught in the tip of the nozzle as shown in FIG. 9, and in step S85, the linear motion actuator (vertical drive mechanism) 8 is driven to raise the suction nozzle 4. In this case as well, in step S86, the control device 41 outputs an alarm or the like to the output means 42 such as a display means. The operator can use this alarm output to
By removing the foreign matter (2) 17, the suction nozzle 4 can maintain a normal state. This is because when the substrate stage 3 is run with the foreign matter (2) 17 biting at the tip of the suction nozzle 4, the foreign matter (2) 17 comes into contact with the substrate 2 and damages the surface of the substrate 2. This is done to prevent this. When the optical sensor (2) 6 disposed at the tip of the suction nozzle 3 is OFF (in a state where light is not blocked) in step S83, the control device 41 keeps the suction nozzle 4 as it is in step S84. .

On the other hand, the substrate 2 on which the spacer particles 1 have been sprayed in the preceding step (not shown) in step S87 is put into the apparatus, and in step S88, the substrate stage 3
Mounted on top. At this time, the substrate 2 is suctioned by the suction device (2) 11 to fix the substrate 2 to the substrate stage 3. For example, as shown in FIG. 3) If 18 is sandwiched, the controller 41 causes a suction leak in step S89, the suction pressure measured by the pressure sensor (2) 13 does not reach the set value, and the substrate 2 rises above the substrate stage 3. It is determined that the contact has occurred, and the suction nozzle 4 is raised in step S85, thereby avoiding contact between the two. This is the substrate stage 3
This is the case where the substrate 2 is suction-adsorbed. For example, it cannot be applied to the case where electromagnetic adsorption is performed. Next, step S
If the pressure sensor (2) 13 is within the set value in 89, the control device 41 drives the actuator 45 for moving the substrate stage 3 to move the substrate stage 3 in step S90. At this time, FIG.
As shown in (a) and (b), when the substrate 2 is floating or when the foreign matter (3) 18 is placed on the substrate 2, the substrate stage 3 is running in step S91. The optical sensor (1) 5 installed in the device operates to be turned ON (light shielding state). Also in this case, similarly, the control device 41 can avoid contact between the two by raising the suction nozzle 4.

When the substrate stage 3 on which the substrate 2 is sucked as described above is run, and the pressure sensor (2) 13 indicates the set value and the optical sensor (1) 5 does not operate, the suction nozzle 4 is moved to the lower end. The aggregated particles 15 and the foreign matter (1) 16 on the substrate 2 as shown in FIG. 7 are removed by suction. Then, when the substrate stage 3 reaches the end position in step S92, the substrate 2 is taken out of the substrate stage 3 in step S93 and sent to the next step (not shown). Thereafter, in step S94, the substrate stage 3 returns to the original position, receives the substrate 2 again from the previous process, and repeats the same operation. Here, the control device 41 resets the pressure sensor (1) 12, the pressure sensor (2) 13, and the optical sensor (1) 5 for each substrate, and even when the suction nozzle 4 is raised, the substrate 2 Is passed, the linear actuator 8 is driven to control the suction nozzle 4 to return to the lower end position which is the origin position. Note that the optical sensor (2) 6 is not reset for each substrate, and the control is performed in a state where the foreign matter (2) 17 at the tip of the suction nozzle 4 is removed and turned off (transparent state). The device 41 lowers the suction nozzle 4.

The above-described sequence shows an example of how to operate the integrated line, and is based on the premise that the line is not stopped. If the state where the suction nozzle 4 is raised is continued, the aggregated particles 15 and the foreign matter (1)
There is a possibility that it will flow to the subsequent process without removing 16.
Therefore, in order to eliminate such a state, the optical sensor (1) 5, the optical sensor (2) 6, the pressure sensor (1) 12,
When the pressure sensor (2) detects an abnormality, the line may be stopped, the malfunction may be corrected, and the line may be restarted. Whether the line is continuously operated to allow a slight oversight of a defect or the line operation rate is reduced, but the line is stopped so that the defect is not completely flowed to the post-process, comparison of effects, etc. You just need to be able to choose.

Next, the principle of leaving the spacer particles 1 in a single state according to the present invention on the substrate 2 and removing the agglomerated particles 15 and foreign matters 16 of about several tens μm or more will be described with reference to FIG. That is, the flow velocity distribution between the tip 4b of the suction nozzle 4 and the surface 2a of the substrate 2 is substantially axially symmetric with respect to the center axis of the elongated slit-shaped opening 4a. Therefore, the vertical distribution of the flow velocity immediately below the tip 4b of the suction nozzle 4 has the relationship of the following (Equation 1). U = 6u [(r / H)-(r / H) ² ] (Equation 1) where u is the average flow velocity. R is the height from the surface 2a of the substrate 2. H is the height of the gap between the tip 4b of the suction nozzle 4 and the surface 2a of the substrate 2.

According to the vertical distribution U of the flow velocity, for the sake of simplicity, for example, a force F (a) received by a particle (including a foreign substance) which is a cube having one side a is represented by the following equation (2). It becomes the relationship.

[0024]

(Equation 2)

[0025] However, C _D is the drag coefficient. Also, γ
Is the specific weight, and g is the gravitational acceleration.

The force F (a) received by the particles formed of, for example, a cube having a side a according to the flow velocity can be calculated by substituting the equation (1) into the equation (2). ) Expression. F (a) = ((36u 2 γC D) / g) [(a 6 / 5H 4) - (a 5 / 2H 3) + (a 4 / 3H 2)] ( Equation 3) The equation (3) As can be seen from the figure, the force F (a) that the aggregated particles 15 and the foreign matter 16 on the substrate 2 receive by the flow velocity
Is proportional to the square of the average flow velocity u, almost proportional to the sixth power of the size a, and almost equal to the fourth power of the gap H between the tip 4b of the suction nozzle 4 and the surface 2a of the substrate 2. It will be inversely proportional.

On the other hand, the adhesion force P (a) of the particles to the substrate 2
Is considered to be proportional to the contact area, so that the following equation (4) is obtained. P (a) = C _E a ² (Equation 4) where C _E is a drag coefficient. Therefore, the conditions for removing the aggregates (aggregated particles) 15 and the foreign substances 16 from the substrate 2 (removal conditions) are expressed by the following equation (5). F (a) −P (a)> 0 (Equation 5) Thus, the wind pressure F received by the aggregated particles 15 and the foreign matter 16
(a) shows that the aggregated particles 15 and the foreign matter 1
6 is proportional to the sixth power of the size, whereas the adhesion force P (a) to the substrate 2 is expressed by the following equation (4).
Is proportional to the square of the magnitude of Therefore, naturally, an object having a large height is more easily sucked.

The suction force for the aggregated particles 15 and the foreign matter 16 is determined by the flow speed (average flow velocity u) of the air layer as shown by the following equation (3). Capacity of suction machine (1) 10 and suction nozzle 4
The gap amount H between the substrate and the substrate 2 is involved. Therefore, a single spacer particle 1 is left on the substrate 2 and
The suction device (1) 10 is controlled so as to remove the agglomerated particles 15 and foreign substances 16 having a size of about 0 μm or more, and the speed (average flow velocity u) of the air layer and the gap amount between the suction nozzle 4 and the substrate 2 H needs to be optimized. In FIG.
The relationship between the residual rate of the spacer particles 1 and the removal rate of the aggregated particles 15 and the foreign matter (1) 16 with respect to the suction gap (gap amount between the suction nozzle 4 and the substrate 2) H (μm) based on an experiment is shown. The gap H (μm) from the tip 4b of the suction nozzle 4 to the surface 2a of the substrate 2 is used as a parameter. If the gap H is large, a single spacer particle 1 remains on the substrate 2, but the gap H As it narrows, it is gradually sucked. In this experimental example, the gap H
, Up to 500 μm, almost 100% remains, but when the gap becomes smaller than that, the residual ratio sharply decreases. In the liquid crystal display panel, the spacer particles 1 account for 90% of the specified value.
Since there is no problem if it exists, the gap H is set to 35.
What is necessary is just to set it to about 0 μm or more.

On the other hand, the aggregated particles 15 and the foreign matter (1) 16
The removal rate is higher as the gap H is smaller, and it can be almost removed if the gap is 300 μm or less. However, if the gap is larger than that, the removal rate decreases. That is, the residual rate of the single spacer particles 1 and the removal rate of the aggregated particles 15 and the foreign matter (1) 16 are:
Since it is in a trade-off state, it is necessary to set a region that satisfies both, but the aggregated particles 15 and the foreign matter (1) 1
Since the probability that 6 is generated or adhered is low, the gap H may be determined by giving priority to the remaining rate of the single spacer particles 1. In this experimental example, for example, the gap H is set to 35
By setting the thickness to 0 μm to 400 μm, the removal rate of the agglomerated particles 15 and the foreign matter (1) 16 can be secured to approximately 90%. The above experimental example shows the relationship between the remaining rate of the spacer particles 1 and the removal rate of the aggregated particles 15 and the foreign matter (1) 16 when the flow rate is fixed and the gap H is used as a parameter.

Next, considering the case where the flow velocity is changed, the value of F (a) changes according to the above equation (3), but the shape (size) of the aggregated particles 15 and the foreign matter (1) 16 changes. If not, the fixing force P (a) to the substrate 2 does not change.
Therefore, the value of F (a) -P (a) in equation (5) fluctuates. FIG. 13 shows the relationship between the residual rate of the spacer particles 1 and the removal rate of the aggregated particles 15 and the foreign matter (1) 16 when the flow velocity is changed. In contrast to the conditions shown in FIG. 12, when the flow rate is reduced, the overall speed shifts to the left side, and at a narrow gap, the remaining rate of the predetermined spacer particles 1 and the removal rate of the aggregated particles 15 and the foreign matter (1) 16 Is obtained. On the other hand, when the flow velocity is increased, it shifts to the right as a whole,
Where the gap is wide, a predetermined residual ratio of the spacer particles 1 and a removal ratio of the aggregated particles 15 and the foreign matter (1) 16 can be obtained. Here, the flow rate depends on the capacity of the suction device (1) 10. The higher the capacity, the higher the price. On the other hand, the lower the capacity, the narrower the gap, the lower the tip 4b of the suction nozzle 4 and the substrate. 2 may come into contact with the surface 2a and cause a defect. Therefore, when the flow velocity is set to the minimum value at which there is no possibility that the tip 4b of the suction nozzle 4 and the surface 2a of the substrate 2 come into contact with each other, the predetermined spacer particles 1
It is necessary to set the value to a value that can obtain the residual ratio of the particles and the removal ratio of the aggregated particles 15 and the foreign matter (1) 16.

As described above, the residual ratio of the single spacer particle 1 to the flow velocity in the gap between the suction nozzle 4 and the substrate 2 and the gap amount H between the suction nozzle 4 and the substrate 2 determined by experiments and the like. The storage device 44 stores a relational database of the relationship between the removal rate of the aggregated particles 15 and the foreign matter 16 and a past history database corresponding to the database. Therefore, the control device 41 controls the suction device (1) 10 and the linear motion actuator 8 based on the database stored in the storage device 44 to control the flow rate of the air layer flowing in the gap between the suction nozzle 4 and the substrate 2. By optimizing the gap amount H between the suction nozzle 4 and the substrate 2, a single spacer particle 1 is left on the substrate 2 at a high residual ratio of about 90% or more, and several tens μm having a low probability of generation or adhesion. Aggregated particles 15 or more
In addition, the foreign matter 16 can be removed at a removal rate of about 90% or more. By the way, in the embodiment described above,
Although the suction nozzle 4 is fixed and the substrate 2 is moved, the suction nozzle 4 may be moved while the substrate 2 is fixed, or the suction nozzle 4 and the substrate 2 may be relatively moved. The same effect can be obtained. Although the suction nozzle 4 has an elongated slit-shaped opening 4a as shown in FIG. 6, for example, even if a large number of cylindrical nozzles 19 are arranged in parallel as shown in FIG. A similar effect (a single spacer particle 1 remains on the substrate 2 at a high residual ratio of about 90% or more, and is generated or adhered by suction force based on the flow rate of the air layer between the tip of the substrate 19 and the surface 2a of the substrate 2) (The removal of the aggregated particles 15 and the foreign substances 16 of several tens μm or more, which is less likely to be performed, at a removal rate of about 90% or more). Also in this case, the purpose can be achieved by moving one or both of the suction nozzle 4 and the glass substrate 2.

Further, in the above embodiment, after the step of dispersing the spacer particles (fine particles) 1,
Is removed to remove the aggregated particles 15 and foreign substances 16 having a size of about several tens μm or more. However, the present invention can also be applied to simply removing the foreign substances (1) 16 adhering to the substrate 2. The device configuration is the same as that of the above-described embodiment, but if only the foreign matter (1) 16 is used, the suction nozzle 4
It is possible to make the gap between the substrate and the substrate 2 smaller than the value shown in FIG. 12, thereby improving the removal rate of the foreign matter (1) 16. In the embodiment described above, the optical sensors 5, 6 and the pressure sensor 12, etc., are inserted to detect the occurrence of a defect, and the system can perform an appropriate operation automatically, thereby contributing to an improvement in productivity. be able to. Further, according to the embodiment, in the step of dispersing the fine particles on the substrate, it is possible to discriminate the dispersed fine particles from the aggregation and the foreign matter, and to remove only the aggregated particles and the foreign matter. For example, when used after the step of dispersing the spacer particles of the liquid crystal display panel, normal spacer particles 1 can be left on the substrate 2 and only the aggregates 15 and the foreign substances 16 of the spacer particles can be removed. As a result, it is possible to improve the product yield and the production direct rate without producing a product that has been disposed of or recycled.

[0033]

According to the present invention, it is possible to easily and inexpensively manufacture a substrate on which a large number of fine particles from which agglomerated particles (including foreign substances) larger than the fine particles are removed are mounted. Play. Further, according to the present invention, in a liquid crystal display panel composed of a TFT substrate in which liquid crystal is sealed and a color filter substrate, a fatal display failure due to the presence of aggregated particles (including foreign substances) larger than the spacer particles is fatal. There is an effect that it can be easily and inexpensively manufactured without discarding so as not to cause defects.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a liquid crystal display panel according to the present invention.

FIG. 2 is a cross-sectional view showing a state where large aggregated particles exist between a TFT substrate and a color filter substrate.

FIG. 3 is a cross-sectional view showing a state where a large foreign substance exists between a TFT substrate and a color filter substrate.

FIG. 4 is a schematic perspective view showing one embodiment of an apparatus for removing aggregated particles and foreign matter according to the present invention.

FIG. 5 is a configuration diagram showing an embodiment of an apparatus for removing aggregated particles and foreign matter according to the present invention.

FIG. 6 is a front cross-sectional view and a side cross-sectional view illustrating a configuration of an embodiment of a suction nozzle.

FIG. 7 is a view for explaining the concept of sucking aggregated particles using the suction nozzle according to the present invention.

FIG. 8 is a diagram showing an embodiment of an operation flow for sucking and removing agglomerated particles and foreign matter from a substrate in the apparatus shown in FIGS. 4 and 5;

FIG. 9 is a view for explaining that a state in which a foreign substance is caught in the suction nozzle is detected by the optical sensor (2).

FIG. 10 is a diagram for explaining that the optical sensor (1) detects a case where the substrate floats and a case where a large foreign substance exists on the substrate.

FIG. 11 is a diagram for explaining the principle of removing aggregated particles while leaving normal spacer particles (fine particles) using the suction nozzle according to the present invention.

FIG. 12 is a characteristic diagram showing a relationship between a removal rate (%) of agglomerated particles and a residual ratio (%) of spacer particles with respect to a suction gap (μm) at a desired air layer flow velocity.

FIG. 13 is a characteristic diagram showing the relationship between the removal rate (%) of the aggregated particles and the residual rate (%) of the spacer particles with respect to the suction gap (μm) when the flow rate of the air layer is increased and decreased.

FIG. 14 is a perspective view showing a schematic configuration of an embodiment when a large number of cylindrical nozzles are used as suction nozzles.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Spacer particle (fine particle), 2 ... Substrate, 3 ... Substrate stage, 4 ... Suction nozzle, 5 ... Optical sensor (1), 6 ...
Optical sensor (2), 7: support column, 8: linear actuator (vertical drive mechanism), 9: piping, 10: suction device (1), 1
DESCRIPTION OF SYMBOLS 1 ... Suction machine (2), 12 ... Pressure sensor (1), 13 ... Pressure sensor (2), 15 ... Agglomerated particles, 16 ... Foreign material (1),
17 foreign matter (2), 18 foreign matter (3), 19 cylindrical nozzle, 31 TFT substrate, 32 color filter substrate
33: alignment film, 34: sealing material, 36: liquid crystal.

Continued on the front page (72) Inventor Nobuaki Nakasu 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd.Production Technology Laboratory (72) Inventor Ryoji Iwamura 3300 Hayano, Mobara-shi, Chiba Display Group, Hitachi, Ltd. (72) Inventor Hito Higashi 3300 Hayano, Mobara City, Chiba Prefecture Within Hitachi, Ltd. Display Group (72) Mitsutoshi Abe 3681 Hayano, Mobara City, Chiba Prefecture F-term in Hitachi Device Engineering Co., Ltd. 2H089 NA05 NA39 NA60 QA08 QA12 QA14 QA15 TA09 TA12 5C094 AA42 AA43 AA44 BA03 BA43 CA19 CA24 DA12 EB02 EC03 ED02 FB15 GB10 5G435 AA00 AA17 BB12 EE33 FF00 FF01 GG12 HH14 KK05 KK10

Claims (5)

[Claims] 1. A mounting step of dispersing and mounting a large number of microparticles on a substrate, and from a number of the microparticles mounted on the substrate in the mounting step, forming an air laminar flow acting on large aggregated particles. And removing the agglomerated particles by suction while removing most of the large number of fine particles on the substrate by increasing the suction force based on the adhesion force of the fine particles to the substrate. A method for manufacturing a substrate having microparticles thereon, comprising manufacturing a substrate on which a large number of microparticles from which particles have been removed are mounted. 2. A mounting step of dispersing and mounting a large number of spacer particles on at least one of a TFT substrate and a color filter substrate, and selecting from among the large number of spacer particles mounted on the substrate in the mounting step. A removing step of removing aggregated particles while leaving most of the large number of spacer particles on the substrate; and a gap being determined by mounting at least one of the multiple spacer particles from which the aggregated particles have been removed by the removing step. A TFT substrate and a color filter substrate are superimposed and bonded, and a liquid crystal sealing step of sealing liquid crystal between the bonded TFT substrate and the color filter substrate is provided. A method for manufacturing a liquid crystal display panel, comprising manufacturing a liquid crystal display panel including a TFT substrate and a color filter substrate. 3. A mounting step of dispersing and mounting a large number of spacer particles on at least one of a TFT substrate and a color filter substrate, and selecting from among the multiple spacer particles mounted on the substrate in the mounting step. Removing the suction particles based on the laminar air flow acting on the large agglomerated particles from the adhesion force of the spacer particles to the substrate so as to remove the agglomerated particles by suction while leaving most of the large number of spacer particles on the substrate. A color filter substrate and a TFT substrate having a gap determined by mounting a large number of spacer particles from which agglomerated particles have been removed by the removing step, and bonding the laminated TFT particles. And a color filter substrate between the TFT substrate and the color filter substrate. Method of manufacturing a liquid crystal display panel, characterized in that to produce the configured liquid crystal display panel in. 4. A mounting step of dispersing and mounting a large number of spacer particles on at least one of a TFT substrate and a color filter substrate, and selecting from among the large number of spacer particles mounted on the substrate in the mounting step. Removing the suction particles based on the laminar air flow acting on the large agglomerated particles from the adhesion force of the spacer particles to the substrate so as to remove the agglomerated particles by suction while leaving most of the large number of spacer particles on the substrate. A coating step of coating a sealing material on at least one of the TFT substrate and the color filter substrate so as to surround the display surface; and at least one of the plurality of spacer particles from which the aggregated particles have been removed by the removing step. The liquid crystal is sealed between the TFT substrate and the color filter substrate surrounded by the sealing material applied by the application process with the gap determined. Crystal sealing and a method of manufacturing an LCD panel in which liquid crystal in the liquid crystal sealing process is characterized by producing configured liquid crystal display panel with a TFT substrate and a color filter substrate that is enclosed that. 5. A mounting means for dispersing and mounting a large number of fine particles on a substrate, and from a large number of fine particles mounted on the substrate by said mounting means, to a laminar air flow acting on large aggregated particles. Removing means for sucking and removing the agglomerated particles in a state where the suction force based on the fine particles is larger than the fixing force of the fine particles to the substrate and most of the fine particles are left on the substrate. An apparatus for manufacturing a substrate mounted with fine particles, characterized in that the substrate is configured to manufacture a substrate on which a large number of fine particles from which are removed are mounted.