JP2000321325A - Contact board for ic test device and positioning method of robot for contacting and operating the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact board used in calibration of an IC test device and a positioning method of a robot capable of successively electrically contacting with a number of electric pads formed on the contact board, and measuring a transmission delay time of a signal path of each pin of each IC socket. SOLUTION: In this contact board consisting of an insulating board 34A, contacts formed on one surface of the insulating board 34A with the arrangement same as that of the pins of the IC to be tested, and contacting with the pins of an IC socket for mounting the IC to be test, and the electric pads 35 electrically connected with the contacts and formed on the other surface of the insulating board, a read start mark 36 and a read finish mark 37 respectively indicating the start and the finish of the arrangement of the electric pads 35 are formed, and a coordinate position of each electric pad is calculated on the basis of an image of the electric pad 35 read out by a scanner for positioning a robot.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact board used for calibrating an IC tester for testing an IC, also called an LSI or the like, and a plurality of electrical pads formed on the contact board, which are electrically contacted in sequence. The present invention relates to a positioning method of a robot for measuring each propagation delay time of a signal path of each pin of each IC socket.

[0002]

2. Description of the Related Art In an IC test apparatus, when assembly is completed, timing calibration is performed so that the apparatus operates normally. This timing calibration means that the propagation delay time of each signal path for providing a test pattern signal to each pin of the IC under test is set to a constant value, and the test pattern signals output from the test pattern generator at the same timing have the same phase. It refers to a calibration operation for calibrating the IC under test so as to be input to each pin and a calibration operation for calibrating the response signal output from the IC under test at a predetermined timing.

A timing calibration method used in a conventional IC test apparatus will be described with reference to FIG. In the figure, 10 is a timing generation and waveform generator, 20 is pin electronics, 30 is a test head, 40 is a robot for driving a probe used for timing calibration, 50 is an oscilloscope, and 60 is a reference signal generator. The pin electronics 20 includes a driver DR for sending a test pattern signal to the test head 30 and a response signal sent from the test head 30 to determine whether or not the level has a normal L logic level and H logic level. And a voltage comparator CP that takes in the data while judging whether the voltage is high or low. Driver DR
And voltage comparators CP are provided at least as many as the number of terminals of the IC under test. Driver DR and voltage comparator C
Except when P is provided as a pair, only the driver DR is used for the input-only pin, and the voltage comparator C is used for the output-only pin.
In some signal paths, only P is used.

The test head 30 includes a motherboard 31 and
Socket board 32 mounted on this motherboard 31
It is constituted by and. The socket board 32 has a number corresponding to the number of ICs to be tested simultaneously (for example, 12
24 or 48) IC sockets 33 are mounted,
A test is performed by mounting an IC under test (not shown) in the IC socket 33.

At the time of timing calibration with the socket board 32 mounted, a contact board 34 is mounted on the IC socket 33 instead of the IC under test, and the probe 41 is brought into contact with an electric pad 35 mounted on the surface of the contact board 34. , Timing generation and waveform generator 10
Is input to the oscilloscope 50 through a signal path provided for each pin to perform timing calibration.

That is, the calibration pulse output from the driver DR is sent to the test head 30 through the cable 36, and the mother board 31 of the test head 30-socket board 32-IC socket 33-contact board 34-
Input to the probe 41 from the electric pad 35 and the probe 4
1 to the oscilloscope 50 to execute timing calibration.

A reference signal having a reference timing is input to the oscilloscope 50 from a reference signal generator 60 provided separately. A time difference between the reference signal and a calibration pulse taken from the electric pad 35 is measured by the oscilloscope 50, and the measurement is performed. The result is fed back to the timing calibrator 11 provided in the timing generation and waveform generator 10, and the variable delay element PAVD provided on each driver DR side of the timing calibrator 11
The delay time of 1, PAVD2, PAVD3,... Is set, the timing of signals at each electric pad 35 is aligned, and calibration on the driver DR side is performed.

When the timing calibration on the driver DR side is completed over all the pin paths, the phases of the signals sent to the electric pads 35 of all the pins are aligned at the position of the IC socket 33. Next, the timing of capturing the signal on the voltage comparator CP side, that is, the strobe pulse ST
The application timing of B is calibrated. Strobe pulse S
Calibration of TB application timing is performed by calibrated driver DR
Sends a calibration pulse to the electric pad 35,
The variable delay elements STDV1 and STDV are set so that the arrival timing of the reflected wave from No. 5 (timing of a portion of about 50% of the rising edge) is just punched out by the strobe pulse STB.
2, STDV3... Are set, and the processing ends.

[0009]

As described above, in the conventional timing calibration method, particularly in the calibration on the driver DR side, the probe 41 is brought into contact with the electric pad 35 and the timing calibration is executed for each pin. Calibration of the pin timing requires a lot of trouble.

For this reason, the operation of bringing the probe 41 into contact with the electric pad 35 has been conventionally automated by the robot 40. However, the arrangement interval of the electric pads 35 arranged on the contact board 34 is 0.1 mm. Since it is on the order of several millimeters, positioning when the robot 40 that drives the probe 41 is mounted on the test head 30 requires much labor and time.

An object of the present invention is to provide an IC having a function of easily mounting a robot on an IC test apparatus.
An object of the present invention is to propose a contact board of a test apparatus and a method of positioning the contact board and the robot.

[0012]

According to the present invention, the position of an electric pad on a contact board is read by an optical scanner, the coordinate position of the electric pad is calculated and stored from the image data, and this position information is used. And a positioning method for controlling the position of the probe.
Therefore, a reading start mark indicating the start of the arrangement of the electric pads and a reading end mark indicating the end of the arrangement of the electric pads are formed on the surface of the contact board on which the electric pads are formed.

Therefore, according to the present invention, there is no need to align the relationship between the calibration contact board and the robot to a specific relationship, and there is an advantage that the installation of the robot can be simplified.

[0014]

1 and 2 show an embodiment of the present invention.
1 shows an example of a contact board of a C test apparatus. FIG. 1 is a plan view showing the structure on the front side on which the electric pad 35 is formed, and FIG. 2 is a side view for explaining the structure on the front side and the back side. The contact board 34 includes an insulating plate 34A and an insulating plate 3
An electric pad 35 is formed on the front surface of 4A, and a contact 34B that contacts each pin of the IC socket 33 (see FIG. 7) is formed on the back surface. The example shown in FIG. 2 shows a case of a BGA (ball grid array) type contact. The contact 34B and the electric pad 35 are electrically connected to each other, for example, by a through hole 34C formed in the insulating plate 34A, and each pin of the IC socket 33 is equivalently led out to the front side of the contact board 34.

In the present invention, a reading start mark 36 indicating the starting position of the arrangement of the electric pads 35 and a reading end mark 37 indicating the ending position of the arrangement are formed on the surface on which the electric pads 35 are formed. 38 indicates an information mark. This information mark 38 is constituted by, for example, a bar code,
The model number of the socket 33 (see FIG. 7), this IC socket 3
The type of the IC mounted and tested on the IC 3 is written as information. Each of the electric pads 35, the read start mark 36, and the read end mark 37 are formed by, for example, depositing gold on the plate surface of the insulating plate 34A. The surface of the insulating plate 34A and the electric pads 35 and the marks 36 and 37 formed of gold are made to have optically different reflection coefficients.

As shown in FIGS. 3 and 4, for example, the robot 40 has a screw shaft 42 erected in the Y-axis direction.
And a probe 41 is mounted on the movable body 43 so as to be movable in the Z-axis direction. The probe 41 is, for example, an air cylinder 4 supported by a movable body 43.
4 and the air cylinder 44
Drives the movable rod 44A, the probe 41 is moved in the Z-axis direction. Although not shown, both ends of the screw shaft 42 are supported by a screw shaft and a guide extending in the X-axis direction. Therefore, the movable body 43 moves in the X-axis direction and the Y-axis direction, and can transport the probe 41 to an arbitrary position on the contact board 34. In addition, 47 shown in FIG. 3 indicates the screw shaft 4 when the movable body 43 is screw-fed by the screw shaft 42.
2 is a guide shaft for preventing rotation with the shaft 2.

On the bottom surface of the probe 41, a scanner 45 in which photoelectric conversion elements such as CCDs are linearly arranged and optical components such as lenses are formed as necessary, and three spring contacts 46A, 46B, 46C are provided. Is arranged. Three spring contacts 46A, 46B, 46
The spring contact 46B located at the center of C contacts the signal line and performs an operation of receiving a signal from the contact board 34. Also, spring contacts 46 on both sides
A and 46C are contacts for connecting a ground line. Accordingly, in this example, the electric pads 35 formed on the contact board 34 have the signal lines and the ground lines one by one, and simultaneously contact the signal lines and the ground lines.
A case is shown in which a signal can be taken in a state where impedance matching has been taken in portions A to 46C.

In such a state, the robot 40 moves the probe 41 in the X-axis direction in the example of FIG. 1 while supporting the probe 41 on the upper end side of the Z-axis. At this time, the scanner 45 takes in the position of the electric pad 35 from the reading start mark 36 as a binary image. The start and end of image data capture are controlled by a read start mark 36 and a read end mark 37. The central position of each electric pad 35 is calculated from the captured binary image, the coordinate position of each electric pad 35 is stored in a memory or the like, and when timing calibration is actually performed, the coordinate position of each electric pad 35 is calculated. The probe 41 is read from the memory and the position of the probe 41 (spring contact 4
6A to 46B), and the spring contacts 36A to 36C are brought into contact with the respective electric pads 35.

Therefore, even if the X axis of the robot 40 is inclined at an angle of θ with respect to the X axis on the contact board 34 as shown in FIG. Of each electric pad 35 from the image of
Is calculated, the robot 40 can correctly contact the spring contacts 46A to 46C with the electric pad 35 regardless of the position between the robot 40 and the contact board 34.

That is, even when a plurality of IC sockets 33 are mounted on the socket board 32 as shown in FIG. 5, the contact board 34 according to the present invention is mounted on each IC socket 33 and formed on each contact board 34. The position of the electric pad 35 thus obtained is read by the scanner 45, so that the electric pad 3 for each IC socket 33 is read.
Since the position 5 is calculated, the robot 40 can correctly contact the spring contacts 46A to 46C of the probe 41 with the IC socket 33 at any position on the socket board 32.

As a result, when the robot 40 is mounted on the socket board 32, the robot 40 and the socket board 3
There is no need to specially adjust the positional relationship with the device 2, and the advantage that the preparation for timing calibration can be completed in a short time can be obtained. FIG. 6 shows another embodiment of the contact board according to the present invention. This embodiment shows a case where marks 39A and 39B indicating the arrangement pitch and arrangement direction of the electric pads 35 are provided in addition to the reading start mark 37. That is, the mark 39A indicates a mark indicating the arrangement pitch of the electric pads 35, and the mark 39B indicates a mark indicating the arrangement direction of the electric pads 35.

Therefore, if the reading is performed in the X-axis direction by the scanner 45, the arrangement pitch of the electric pads 35 can be known at the intervals of the marks 39A, and the marks 39B
(The amount of displacement of the mark 39B with respect to the movement of the scanner 45), the inclination of the arrangement of the electric pads 35 can be known. From the arrangement pitch of the electric pads 35 and the inclination of the arrangement, the position of each electric pad 35 can be calculated.

[0023]

As described above, according to the present invention, when a probe is brought into contact with each pin of an IC socket using a robot to perform timing calibration of an IC test apparatus,
The advantage that the working time for mounting the robot on the IC test apparatus can be greatly reduced is obtained, and the effect is extremely large in practical use.

[Brief description of the drawings]

FIG. 1 is a plan view illustrating an example of a contact board according to the present invention.

FIG. 2 is a side view of FIG. 1;

FIG. 3 is a side view for explaining a structure of a main part of a robot that moves a probe used in the present invention.

FIG. 4 is a bottom view of FIG. 3;

FIG. 5 is a plan view for explaining effects when the present invention is applied.

FIG. 6 is a plan view for explaining a modified embodiment of the contact board according to the present invention.

FIG. 7 is a block diagram for explaining a conventional technique.

[Explanation of symbols]

 32 Socket Board 33 IC Socket 34 Contact Board 34A Insulating Plate 34B Contact 34C Through Hole 35 Electric Pad 36 Read Start Mark 37 Read End Mark 38 Information Mark

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AA07 AB19 AE06 AF03 AG01 AG03 AG08 AG11 AG20 AH06 2G011 AA03 AA16 AB01 AC21 AE01 AF06 AF07 2G032 AD06 AE04 AE09 AF04 AF10 AG01 AG07 AH04 AK03 AK16 DJ05A04 DJ05 A04 DJ05 DJ34 9A001 BB01 BB03 BB04 BB05 HH19 KK16 KK31 KK37 LL05

Claims (5)

[Claims] 1. An insulating plate and an array formed on one surface of the insulating plate and having an arrangement equal to an arrangement of pins of an IC under test,
A contact board comprising: a contact that contacts each pin of an IC socket for mounting an IC under test; and a conductive pad formed on the other surface of the insulating plate and electrically connected to the contact. A contact board for an IC test apparatus, wherein a reading start mark for causing a scanner to read the arrangement of the electric pads and a reading end mark indicating the end of reading are formed on a surface on which the electric pads are formed. 2. The contact of an IC test apparatus according to claim 1, wherein a mark indicating an arrangement position of the electric pad is added to a surface on which the electric pad is formed. board. 3. The information on an IC to be tested by being mounted on the IC socket on a surface of the insulating plate on which the electric pad is formed, in any one of the contact boards of the IC testing apparatus according to claim 1. A contact board for an IC test device, wherein the contact board has an information mark having a structure. 4. An X-Y direction along a surface on which the IC socket is arranged in a state where one of the contact boards of the IC test apparatus according to claim 1 is mounted on an IC socket of the IC test apparatus. And a robot that moves in the Z direction. The robot carries the probe, and the probe is mounted on the probe in a timing calibration mode in which the probe is sequentially brought into contact with the electric pad to calibrate the timing of each signal path of the IC test apparatus. The position of the electric pad formed on the contact board is read by a scanner, the coordinate position of each electric pad is calculated based on the read data, and the position of the probe is moved according to the coordinate position to control the contact position of the probe. A method of positioning a robot, comprising: 5. An X-Y direction along a surface on which the IC socket is arranged in a state where one of the contact boards of the IC test apparatus according to claim 1 is mounted on the IC socket of the IC test apparatus. And a robot that moves in the Z direction. The robot carries the probe, and the probe is mounted on the probe in a timing calibration mode in which the probe is sequentially brought into contact with the electric pad to calibrate the timing of each signal path of the IC test apparatus. A mark indicating the position of the electric pad formed on the contact board is read by a scanner, the coordinate position of each electric pad is calculated based on the read mark position, and the position of the probe is moved according to the coordinate position to move the position of the probe. A robot positioning method, comprising controlling a contact position.