JP2000307218A - Manufacture of printed wiring board and its device and printed wiring board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a printed wiring board for realizing the mass production of a wiring conductor with high density close to a rectangular cross-section with satisfactory yield, and a printed wiring board constituted of a wiring conductor with high density close to the rectangular cross-section manufactured by using the method and device. SOLUTION: This method for manufacturing a printed wiring board comprises a process for manufacturing a master substrate in which a pattern electrode in a prescribed shape is formed on an insulating substrate; a fine pattern forming process for forming a fine pattern film made of electrodeposited resin by an electrodeposition process on the pattern electrode layer a peeling and transferring process for adhering the fine pattern film on the master substrate on the copper foil of the surface of an insulating substrate 10 with the copper foil, for peeling the fine pattern film form the master substrate, and for transferring the fine pattern film to the copper foil; and an etching process for etching- removing a copper foil 12 at not less than the softening temperature of the electrodeposited resin constituting the fine pattern film 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high-density printed wiring board, a multilayer printed wiring board, a flexible printed wiring board, a thin motor and the like which are incorporated in semiconductor packaging such as IC card terminals and electronic equipment such as portable information terminals. The present invention relates to a method and an apparatus for manufacturing a printed wiring board that can be used when forming various wiring boards such as a coiled wiring board incorporated in various magnetic sensors and a printed wiring board manufactured using the same.

[0002]

2. Description of the Related Art As a conventional method of manufacturing a printed wiring board, a predetermined insulating circuit pattern is formed on a copper foil on the surface of an insulating substrate with a copper foil, and this is used as an etching mask to form a copper foil. A subtractive method of forming a wiring conductor by removing an exposed portion by wet etching is widely used.

The drawback of the subtractive method is that, in the wet etching process, the dissolution of copper is caused not only in the vertical direction of the copper foil but also in the horizontal direction due to the etching liquid entering the interface between the insulating circuit pattern and the copper foil. As the process proceeds, the cross section of the wiring conductor becomes narrow on the copper foil surface and becomes wide and trapezoidal on the bottom surface (hereinafter, "etching in the horizontal direction" is referred to as "side etching").

In recent years, with the increase in the frequency of semiconductor devices and the miniaturization and high integration of electronic devices, the density of printed wiring boards has been increasing.
Although reduction of high-frequency signal noise is required, the conventional subtractive method has a limit in increasing the density of a printed wiring board due to a decrease in the width of a wiring conductor due to side etching. In addition, since the wiring conductor has a trapezoidal shape, the impedance of the wiring pattern deviates from the value estimated at the time of design, and the waveform of the high-frequency signal is distorted.

On the other hand, as a method of forming an insulating circuit pattern on a copper foil surface, there is a photolithography method of exposing and developing a photosensitive resist, which is widely used in a semiconductor process. Examples of the photosensitive resist include a dry film in which a film-shaped photosensitive resist is thermocompression-bonded to a copper foil surface by a hot roll, and a liquid resist in which a liquid photosensitive resist is coated by a roll coating method or the like. However, these photosensitive resists have insufficient followability to copper foil,
The etching solution easily enters the interface between the photosensitive resist and the copper foil, and the side etching proceeds.

In order to increase the density of a printed wiring board and reduce the noise of high-frequency signals, a dry film or liquid resist is used to make the cross-sectional shape of the etched wiring conductor closer to an ideal rectangular shape. As a photosensitive resist having improved ability to follow a copper foil, an electrodeposition type photoresist, which is generally used in the field of paints and has been given a photosensitive property, has been developed.

Electrodeposited photoresists are obtained by dispersing a positively or negatively charged photosensitive polymer as a colloid in water, and migrate to a positive or negative electrode depending on the polarity of the polymer.
By performing electrolytic deposition on the surface of the copper foil, a photosensitive resist film can be formed on the surface of the copper foil with good followability. The thickness of the coating film can be adjusted by the electrolysis conditions, and a thin and uniform photosensitive resist film can be formed.

As described above, the electrodeposition type photoresist is
Since the photosensitive resist film has a good ability to follow the copper foil and is thin and uniform, reduction of side etching can be expected.

However, the electrodeposited photoresist has a very large number of functions, such as an electrodeposition function and a function as a photosensitive resist, as a photosensitive resist material. Need control,
There is a possibility that the yield may be reduced during repeated mass production. Also, it was difficult to satisfy all functions as a photosensitive resist.

[0010] In particular, since the electrodeposited photoresist is hardened when it is completely cured, it is difficult to remove the resist, and the resist remains. Therefore, it is used as an etching resist in an uncured state. Therefore, some tackiness remains on the resist surface.

For this reason, in the case of a flexible wiring board of a roll-to-roll production system which requires winding after forming a resist, or a thin printed wiring board which is stacked and stocked, a resist film adheres to the back surface of the wiring board, It is difficult to mass-produce the electrodeposited photoresist because it causes defects such as adhesion of dust and contamination of the photomask.

On the other hand, the present inventors have developed a method of manufacturing a fine pattern capable of easily and reliably mass-producing a high-precision, high-density fine pattern to be an etching resist on a copper foil without using a complicated photolithography method. Has already been proposed and filed as Japanese Patent Application No. 9-272345.
This involves using a master substrate having a pattern electrode layer of a predetermined shape on an insulating substrate, forming a release layer of a water-repellent thin film on the master substrate, forming a fine pattern by an electrodeposition method, Temperature of 40 for fine pattern made of resin
By impregnating with warm water of not less than 90 ° C. and not more than 90 ° C., the inside of the fine pattern can contain water and the adhesive force can be reduced by the water repellency of the release layer on the surface of the master substrate, and the surface of the fine pattern is heated to reduce the viscosity. In this state, the fine pattern is brought into close contact with the substrate to be transferred, peeled off from the master substrate, and completely transferred to the substrate to be transferred (hereinafter, this fine pattern film is referred to as an “electrodeposition transfer resist”). .

However, when this electrodeposited transfer type resist is used as an etching mask, it is not an electrodeposited resin film directly electrolytically deposited on a copper foil, so that it follows the copper foil more than an electrodeposited photoresist. Not enough, the etchant easily penetrates into the interface between the electrodeposition transfer type resist and the copper foil,
Side etching proceeds.

[0014]

As described above, a photosensitive resist such as a dry film or a liquid resist widely used in a conventional method for manufacturing a printed wiring board has a poor ability to follow a copper foil and has a problem of side etching. Remarkably progressed, and the wiring conductor had a trapezoidal cross section.

Although the electrodeposition type photoresist has good followability to the copper foil, processing conditions such as drying, heating and exposure and development are severe, and a rectangular wiring conductor with little side etching and a rectangular shape is repeatedly produced with good yield. There was a problem in doing so.

Furthermore, since the electrodeposited photoresist is used as an etching resist in an uncured state, the resist film surface has some tackiness. For this reason, in the mass production process, there is a possibility that a resist film adheres to the back surface of the wiring board, dust adheres to the resist film, and causes a defect such as contamination of a photomask. It was complicated and had a problem in mass productivity.

Further, the electrodeposition transfer type resist proposed by the present inventors can easily form a resist film on a copper foil without using a complicated photolithography method required for the above-mentioned electrodeposition type photoresist or the like. Can be formed. Moreover, after this resist film is formed, the wiring board can be directly etched without being wound up or stocked in the middle, so that a very reliable mass production method is achieved. However, since the electrodeposition transfer type resist has insufficient followability on the copper foil, side etching progresses remarkably, and the wiring conductor has a trapezoidal cross section.

In view of the above, there has been a demand for a method and apparatus for manufacturing a printed wiring board capable of mass-producing high-density wiring conductors having a rectangular cross section with good yield.

The present invention comprises a method and an apparatus for manufacturing a printed wiring board capable of mass-producing high-density wiring conductors having a rectangular cross section with good yield, and high-density wiring conductors having a rectangular cross section manufactured using the same. It is an object to provide a printed wiring board.

[0020]

In order to solve the above-mentioned problems, a method of manufacturing a printed wiring board according to the present invention comprises the steps of: forming a master substrate for forming a pattern electrode layer having a predetermined shape on an insulating substrate; A fine pattern forming step of forming a fine pattern film made of an electrodeposition resin on the electrode layer by an electrodeposition method, and forming the fine pattern film on the master substrate on the copper foil on the surface of the insulating substrate with the copper foil; A peeling transfer step of peeling off from the master substrate in close contact with the copper foil and transferring the copper foil onto the copper foil, and using the fine pattern film as an etching mask, at or above the softening temperature of the electrodeposition resin constituting the fine pattern film. Is provided with an etching step of etching away.

According to this structure, after the fine pattern film is formed on the pattern electrode layer on the surface of the master substrate by the electrodeposition method, the fine pattern film is transferred onto the copper foil, so that the etching mask is extremely simple. In addition, since the etching process can be performed continuously after the formation of the etching mask, there is no need to temporarily wind or stock the printed circuit board during the production, and the printed wiring board can be mass-produced with extremely high reliability.

Further, by heating the fine pattern film above the softening temperature of the electrodeposited resin constituting the fine pattern film and performing the etching treatment, the fine pattern film on the copper foil is heated to the softening temperature or higher during etching, and Etching is performed in a state in which the copper foil is adhered to the copper foil with good responsiveness and adherence to the copper foil. For this reason, the infiltration of the etching solution between the fine pattern film and the copper foil is eliminated, side etching can be reduced, and a printed wiring board composed of a high-density wiring conductor having a substantially rectangular cross-sectional shape can be manufactured with high yield.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 is a step of manufacturing a master substrate for forming a pattern electrode layer having a predetermined shape on an insulating substrate, and forming an electrode on the pattern electrode layer by an electrodeposition method. A fine pattern forming step of forming a fine pattern film made of an adhesive resin, the fine pattern film on the master substrate is brought into close contact with the copper foil on the surface of the insulating substrate with a copper foil and peeled off from the master substrate. A printed wiring comprising a separation transfer step of transferring onto a copper foil, and an etching step of etching and removing the copper foil at a temperature equal to or higher than a softening temperature of an electrodeposition resin constituting the fine pattern film using the fine pattern film as an etching mask. A method of manufacturing a plate, after forming a fine pattern film by an electrodeposition method on a pattern electrode layer on the surface of the master substrate, by transferring the fine pattern film onto a copper foil, Tchingumasuku be very easily formed, and further has an effect that it is etched in succession etching mask formation. Also, by heating and etching the fine pattern film above the softening temperature of the electrodeposition resin constituting the fine pattern film, the fine pattern film on the copper foil is warmed to the softening temperature or more during etching, and tackiness occurs. It has the effect of closely adhering to the copper foil with good followability and strengthening the adhesion to the copper foil.

According to a second aspect of the present invention, there is provided a master substrate forming step of forming a pattern electrode layer of a predetermined shape on an insulating substrate, and a peeling step of forming a release layer of a water-repellent thin film on the master substrate. A layer forming step, a fine pattern forming step of forming a fine pattern film made of an electrodeposited resin on the surface of the release layer on the pattern electrode layer by an electrodeposition method, Water impregnation step of impregnating with hot water of not more than ℃, the fine pattern film on the master substrate is in close contact with the copper foil on the surface of the insulating substrate with a copper foil and peeled off from the master substrate, and on the copper foil A separation transfer step of transferring, and an etching step of etching and removing the copper foil at a temperature equal to or higher than the softening temperature of the electrodeposition resin constituting the fine pattern film using the fine pattern film as an etching mask. A method for manufacturing a printed wiring board,
The inside of the fine pattern film formed by the electrodeposition method is impregnated with moisture, and the adhesive force can be weakened by the water repellency of the release layer on the surface of the master substrate, and the surface of the fine pattern has an effect of being heated to generate viscosity. . Furthermore, since an etching mask can be formed very simply, an etching process can be performed continuously to the formation of the etching mask. Also, by heating and etching the fine pattern film above the softening temperature of the electrodeposition resin constituting the fine pattern film, the fine pattern film on the copper foil is warmed to the softening temperature or more during etching, and tackiness occurs. It has the effect of closely adhering to the copper foil with good followability and strengthening the adhesion to the copper foil.

According to a third aspect of the present invention, there is provided a master substrate forming means for forming a pattern electrode layer having a predetermined shape on an insulating substrate, and comprising an electrodeposition resin on the pattern electrode layer by an electrodeposition method. A fine pattern forming means for forming a fine pattern film, and the fine pattern film on the master substrate is brought into close contact with the copper foil on the surface of the insulating substrate with a copper foil and peeled off from the master substrate to form the fine pattern film on the copper foil. Peeling transfer means for transferring, heating means for heating the fine pattern film above the softening temperature of the electrodeposition resin constituting the fine pattern film, and etching for etching and removing the copper foil using the fine pattern film as an etching mask A device for manufacturing a printed wiring board comprising means for heating the fine pattern film at a temperature equal to or higher than the softening temperature of the electrodeposition resin constituting the fine pattern film by the heating means. Fine pattern film has an effect of close contact with the track with good copper foil produced reliably tackiness, and adhesion to the copper foil becomes firmly.

According to a fourth aspect of the present invention, there is provided a master substrate producing means for forming a pattern electrode layer having a predetermined shape on an insulating substrate, and a peeling method for forming a release layer comprising a water-repellent thin film on the master substrate. A layer forming means, a fine pattern forming means for forming a fine pattern film made of an electrodeposition resin on the surface of the release layer on the pattern electrode layer by an electrodeposition method, Water impregnating means for impregnating hot water at a temperature of not more than ℃, and the fine pattern film on the master substrate is brought into close contact with the copper foil on the surface of the insulating substrate with copper foil and peeled off from the master substrate to form a film on the copper foil Peeling transfer means for transferring, heating means for heating the fine pattern film above the softening temperature of the electrodeposition resin constituting the fine pattern film, and the copper foil using the fine pattern film as an etching mask An apparatus for manufacturing a printed wiring board having an etching means for etching and removing the fine pattern film by heating the fine pattern film to a softening temperature or higher of the electrodeposition resin constituting the fine pattern film by the heating means. It has the effect that it gives good adhesion and adheres to the copper foil with good followability, and that the adhesion to the copper foil becomes strong.

According to a fifth aspect of the present invention, in the printed wiring board according to the third or fourth aspect, the heating means is an etching solution heated to a temperature higher than a softening temperature of the electrodeposition resin. It is a manufacturing apparatus, and by heating the fine pattern film above the softening temperature of the electrodeposited resin constituting the fine pattern film with the etching solution heated above the softening temperature, the fine pattern film on the copper foil is heated above the softening temperature The fine pattern film has a function of reliably forming an adhesive layer with good adhesion, being closely adhered to the copper foil, and having a strong adhesive force to the copper foil.

According to a sixth aspect of the present invention, in the printed wiring board according to the third or fourth aspect, the heating means is provided in proximity to the insulating substrate with copper foil. By providing a heating means close to the insulating substrate with copper foil, it is possible to reliably warm the fine pattern film on the copper foil above the softening temperature, the fine pattern film with high reliability It has the effect of producing adhesiveness, closely adhering to the copper foil with good followability, and strengthening the adhesive force to the copper foil.

According to a seventh aspect of the present invention, in the apparatus for manufacturing a printed wiring board according to the third or fourth aspect, the heating means uses hot air. From this, it is possible to reliably and uniformly warm the fine pattern film on the copper foil above the softening temperature,
The fine pattern film has a function of reliably forming an adhesive property, closely adhering to the copper foil with good followability, and strengthening the adhesive force to the copper foil.

[0030] The invention according to claim 8 is characterized in that after the peeling and transferring step, there is provided a preheating means for preheating the insulating substrate with copper foil to a temperature higher than a softening temperature of the electrodeposition resin. Item 5. The printed wiring board manufacturing apparatus according to Item 3 or 4, wherein the preheating means heats the fine pattern film to a temperature equal to or higher than the softening temperature of the electrodeposition resin constituting the fine pattern film, thereby forming a fine pattern on the copper foil. The film is also heated to a temperature higher than the softening temperature, has an adhesive property, adheres to the copper foil with good followability, has a strong adhesive force to the copper foil, and has a function of shortening the time until the etching process.

According to a ninth aspect of the present invention, there is provided a printed wiring board provided with a wiring conductor having a substantially rectangular cross section manufactured by the method for manufacturing a printed wiring board according to the first or second aspect. In the method for manufacturing a printed wiring board according to item 2, the fine pattern film serving as an etching mask has good followability to the copper foil, and the etching treatment is performed in a state where the adhesion to the copper foil is strong. And has the effect that a wiring conductor having a substantially rectangular cross-sectional shape can be formed.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG.

(Embodiment 1) First, a master substrate manufacturing process for obtaining a master substrate will be described. FIG. 1 (a)
FIG. 2 is a sectional view of a main part showing a step of forming a pattern electrode layer on the conductive substrate according to the first embodiment of the present invention. FIG. 1 (b) shows the conductive substrate and the back plate according to the first embodiment of the present invention. FIG. 1C is a cross-sectional view of a main part showing a step of etching and removing the conductive substrate according to the first embodiment of the present invention, and FIG. FIG. 3 is a perspective sectional view of a master substrate according to the embodiment.

1 (a), 1 (b), 1 (c) and 1 (d), 1 is a master substrate, 2 is a back plate, 3 is an insulating layer, 4 is a pattern electrode layer, 5 Is a conductive substrate, and 6 is a resist layer.

First, as shown in FIG. 1A, a positive photoresist is applied to a thickness of 10 μm on a conductive substrate 5 made of a copper plate or the like by a spin coating method, and this is exposed using a photomask. Then, the resist layer 6 corresponding to the negative shape of the pattern electrode layer 4 is developed with an aqueous solution of sodium carbonate.
To form Next, the non-formed portion of the resist layer 6 has a thickness of 5 μm.
A nickel thin film having a thickness of 5 m is formed by electroforming, a copper thin film having a thickness of 5 μm is formed in order by electroforming, and finally, the surface of the pattern electrode layer 4 is subjected to copper roughening plating. By performing roughening plating of copper on the surface of the pattern electrode layer 4,
The adhesive strength at the interface between the pattern electrode layer 4 and the insulating layer 3 described later is improved, and the durability of the pattern electrode layer 4 is improved.

Next, in FIG. 1B, the resist layer 6
Is removed with an aqueous solution of sodium hydroxide or the like to remove the conductive substrate 5
The pattern electrode layer 4 having a fine shape is formed on the surface of the substrate. The resist layer 6 may be left without being dissolved and removed. Next, an epoxy-based adhesive is applied to the surface of the pattern electrode layer 4 by a roll coating method to a thickness of 15 μm to form an insulating adhesive layer. The insulating adhesive layer is heat-bonded to the back plate 2 whose surface is roughened with copper, and then solidified to form the insulating layer 3. By performing the rough plating of copper on the surface of the back plate 2, the adhesive strength at the interface between the back plate 2 and the insulating layer 3 is improved, and the durability of the master substrate 1 is improved.

Next, in FIG. 1C, the conductive substrate 5
By peeling, the master substrate 1 with the transfer peeled surface of the pattern electrode layer 4 exposed as shown in FIG. 1D can be obtained. On the other hand, the master substrate 1 in which the separation surface of the pattern electrode layer 4 from the conductive substrate 5 is exposed can be obtained by etching and removing the conductive substrate 5 with an iron chloride aqueous solution or the like instead of peeling. By doing so, unevenness does not occur on the surface of the pattern electrode layer 4 formed on the master substrate 1 and the surface of the insulating layer 3, and the surfaces are substantially the same. become.
Further, since the pattern electrode layer 4 of the master substrate 1 is formed not by an etching method but by an electroforming method, the pattern accuracy is extremely good. As described above, the master substrate 1 according to the first embodiment can have high pattern accuracy and excellent transferability.

Next, a fine pattern forming step for forming a fine pattern film on the transfer peeled surface of the pattern electrode layer 4 by an electrodeposition method will be described with reference to FIGS. 2 (a) and 2 (b).

FIG. 2A is a cross-sectional view of a master substrate in which a release layer is provided on the pattern electrode layer according to the first embodiment of the present invention, and FIG. FIG. 3 is a cross-sectional view of a master substrate having a fine pattern film provided on the surface of a release layer. 1 (a), (b),
Elements having the same reference numerals as (c) and (d) are basically the same in the present embodiment, and therefore description thereof is omitted here.

In FIGS. 2A and 2B, reference numeral 7 denotes a release layer formed on the surface of the master substrate 1, which is made of a material having water repellency and conductivity in a liquid. Reference numeral 8 denotes a fine pattern film, which is formed on the surface of the release layer 7 on the pattern electrode layer 4. The fine pattern film 8 is obtained by electrodeposition in a resin bath filled with an acrylic anionic resin to which a phthalocyanine blue-based blue pigment is added at a concentration of 30 ml / l, and has a thickness of 3 μm.

Next, a peeling transfer step of transferring the fine pattern film 8 to an insulating substrate with copper foil as a substrate to be transferred will be described with reference to FIGS. 3 (a), 3 (b) and 3 (c). I do.

FIG. 3A is a water impregnation process diagram in which the fine pattern film on the release layer is impregnated with warm water according to the first embodiment of the present invention, and FIG. 3 (c) is a cross-sectional view of the insulating substrate with copper foil obtained by peeling and transferring the fine pattern film according to Embodiment 1 of the present invention. . Here, the same reference numerals as those in FIGS. 2A and 2B are basically the same in the present embodiment, and the description is omitted.

3 (a) to 3 (c), 9 is a hot water bath, 10 is an insulating substrate provided with a copper foil, and a copper foil 12 having a thickness of 18 μm is formed on the surface of a flexible polyimide film 11.
Is formed. Reference numeral 13 denotes a heater for heating the master substrate 1. Reference numeral 14 denotes a fine pattern film transferred to the surface of the copper foil 12 on the insulating substrate 10 with a copper foil.

First, as shown in FIG.
The master substrate 1 on which the fine pattern film 8 is formed
The substrate is immersed in a warm water bath 9 at 1 ° C. for 1 minute to sufficiently impregnate the fine pattern film 8 with warm water and heat the fine pattern film 8. Here, when the master substrate 1 is immersed in a warm water bath 9, the inside of the fine pattern film 8 contains moisture and the adhesive force becomes extremely weak due to the water repellency of the release layer 7, and at the same time, the fine pattern film 8 When heated, the surface becomes viscous.

Next, as shown in FIG. 3B, the master substrate 1 is taken out of the hot water bath 9 and the fine pattern film 8 on the master substrate 1 is brought into close contact with the insulating substrate 10 with copper foil. Insulating substrate 1 with copper foil to which pattern film 8 is adhered
0 is heated to 70 ° C. by the heater 13. As a result, the inside of the fine pattern film 8 on the master substrate 1 contains moisture, and the adhesion of the release layer 7 on the surface of the master substrate 1 is extremely weak due to the water repellency of the surface. Is obtained. When the insulating substrate with copper foil 10 is peeled off in this state, the fine pattern film 8 on the master substrate 1 can be easily completely and completely transferred onto the insulating substrate 10 with copper foil with good pattern accuracy. Obtainable.

The fine pattern film 8 is again formed on the master substrate 1 after the peeling transfer by the electrodeposition method.
(A) Insulating substrate 1 with copper foil of fine pattern film 8 shown in FIG.
It can be used repeatedly for release transfer to zero. In this way, a high-density fine pattern can be obtained with high pattern accuracy.

As described above, since the etching mask can be formed extremely easily, the etching process can be performed continuously to the formation of the etching mask, and there is no need to temporarily wind or stock the printed circuit board during the production, and the printed wiring can be formed. Plates can be mass-produced with extremely high reliability.

Next, an etching step of etching and removing the copper foil 12 using the fine pattern film 14 transferred onto the insulating substrate with copper foil 10 as an etching mask will be described with reference to FIGS. Description will be made based on b).

FIG. 4 is a configuration diagram of an etching apparatus for etching and removing a copper foil using the fine pattern film as an etching mask according to the first embodiment of the present invention. FIG. FIG. 5B is a cross-sectional view of the insulated substrate with copper foil after the foil has been removed by etching, and FIG. 5B is manufactured by etching and removing the copper foil using the fine pattern film in Embodiment 1 of the present invention as an etching mask. It is sectional drawing of a printed wiring board. In addition, FIG.
The components having the same reference numerals as (b) and (c) are basically the same in the present embodiment, and therefore description thereof is omitted here.

4, 5 (a) and 5 (b), 15 is an etching operation space for etching and removing the copper foil 12, 16 is an etching solution tank, 17 is an etching solution heater, and 18 is an etching solution heating. A temperature controller for controlling the heater 17, a pump 19 for pumping the etching liquid in the etching liquid tank 16, a nozzle 20, and an etching liquid 21 jetted from the nozzle 20.

First, the polyimide film 11 and the copper foil 12
The preliminarily heating the fine pattern film 14 transferred to the insulating substrate 10 with copper foil 10 at 60 ° C. for 2 minutes to improve the followability of the surface of the insulating substrate 10 with copper foil to the copper foil 12.

Next, referring to FIG. 4, the exposed portion of the copper foil 12 is removed by etching with an etching solution such as an aqueous solution of iron chloride using the pre-heated fine pattern film 14 as an etching mask. The steps to be performed will be described.

First, the etching solution 21 is heated in the etching solution tank 16 to 60 ° C., which is higher than the softening temperature of the electrodeposition resin constituting the fine pattern film 14 by the control of the temperature controller 18 by the etching solution heater 17. You.
The heated etchant 21 is pumped by a pump 19 and jetted from a nozzle 20 to be a shower-like etchant 21 and supplied onto the copper foil 12 on which the fine pattern film 14 is formed. Then, the copper foil 12 in the portion where the fine pattern film 14 is not formed is subjected to an etching process using an etching solution 21 heated to a temperature higher than the softening temperature of the electrodeposition resin constituting the fine pattern film 14. As a result, the fine pattern film 14 on the copper foil 12 is heated to a temperature equal to or higher than the softening temperature at the time of etching, and adheres to the copper foil with good adherence and adheres to the copper foil, and the adhesive force to the copper foil becomes strong. It is processed.
Therefore, penetration of the etching solution 21 between the fine pattern film 14 and the copper foil 12 is eliminated, side etching can be reduced, and the high-density wiring conductor 30 having a substantially rectangular cross-sectional shape as shown in FIG. The printed wiring board 31 can be manufactured with high yield.

Thereafter, as shown in FIG. 5B, the fine pattern film 14 is removed with an aqueous solution of sodium hydroxide heated to 70 ° C., whereby the fine pattern wiring conductor 30 is formed on the polyimide film 11. You. Since the etching process can be performed while the fine pattern film 14 is well adhered to the copper foil 12 and firmly adhered thereto, the printed wiring board 31 including the high-density wiring conductor 30 having a substantially rectangular cross-sectional shape with little side etching. Is obtained.

In the present embodiment, before the etching step, the insulating substrate with copper foil 10 is preheated at 60 ° C., which is higher than the softening temperature of the electrodeposition resin constituting the fine pattern film 14. By such preliminary heating, the copper foil 1
2, the fine pattern film 14 is also heated above the softening temperature,
Adhesiveness is generated and adheres to the copper foil with good followability, and the adhesion to the copper foil is strengthened, and the time until the etching process can be shortened, contributing to mass productivity.

(Embodiment 2) Here, Embodiment 1
The other etching steps other than those shown in FIG. 4 will be described with reference to FIGS. 6, 7, and 8, respectively. FIGS. 6, 7, and 8 are each a configuration diagram of an etching apparatus for etching and removing a copper foil using the fine pattern film as an etching mask according to the second embodiment of the present invention. 4 and 5
5A and FIG. 5B are basically the same in the present embodiment and will not be described.

In FIG. 6, reference numeral 22 denotes a substrate heater for heating the insulating substrate with copper foil 10 from the back surface during etching, and reference numeral 23 denotes a temperature controller for controlling the substrate heater 22. In FIG. 7, reference numeral 24 denotes a heater for heating the etching operation space 15, and reference numeral 25 denotes a temperature controller for controlling the heater 24. In FIG. 8, 26 is a fan for supplying hot air into the etching operation space 15, 27 is a hot air heater for heating the supplied gas, 28 is a temperature controller for controlling the hot air heater 27, and 29 is hot air. It is a supply port for supplying into the etching operation space 15.

First, the fine pattern film 14 is peeled and transferred onto the insulating substrate 10 with copper foil in the same manner as in the first embodiment, and then the fine pattern film 14 is preheated at 60 ° C. for 2 minutes to obtain a copper foil. The ability of the surface of the attached insulating substrate 10 to follow the copper foil 12 is improved.

Next, referring to FIG. 6, using the preheated fine pattern film 14 as an etching mask, the exposed portion of the copper foil 12 is etched with an etching solution 21 composed of an aqueous solution of iron chloride or the like. A description will be given of another etching step other than that shown in Embodiment 1 for removing.

First, the insulating substrate 10 with the copper foil transferred into the etching operation space 15 is controlled by a temperature controller 23 by a substrate heater 22 arranged on the back surface to form an electrodeposited resin forming the fine pattern film 14. Becomes above softening temperature 6
Heat to 0 ° C. As a result, the fine pattern film 14 on the copper foil 12 is warmed to a softening temperature or higher, adheres to the copper foil with good adherence, and adheres firmly to the copper foil. By performing the etching treatment with the etching solution 21 heated to a temperature equal to or higher than the softening temperature of the electrodeposition resin constituting the fine pattern film 14, the adhesive is generated, adheres to the copper foil with good followability, and the adhesion to the copper foil is reduced. Etching is performed in an extremely strong state. Therefore, penetration of the etching solution 21 between the fine pattern film 14 and the copper foil 12 is eliminated, side etching can be reduced, and a printed wiring board composed of a high-density wiring conductor having a substantially rectangular cross-sectional shape can be manufactured with high yield. Further, the fine pattern film 1
4 can follow the copper foil 12 with good followability and can be etched in a firmly adhered state, so that a printed wiring board made of a high-density wiring conductor having a substantially rectangular cross-sectional shape with little side etching can be obtained.

As described above, by directly heating the insulating substrate 10 with copper foil, the etching liquid 21 is jetted in a shower shape, thereby compensating for a decrease in the temperature of the etching liquid 21 due to generation of heat of vaporization. Therefore, the fine pattern film 14 on the copper foil 12 can be reliably heated to a softening temperature or higher, and a high-density wiring conductor having a substantially rectangular cross-sectional shape with less side etching can be reliably mass-produced.

Next, another method for compensating for a decrease in the temperature of the etching solution 21 caused by the generation of heat of vaporization or the like by spraying the etching solution 21 in a shower shape will be described with reference to FIG.

First, under the control of the temperature controller 25, the insulating substrate 10 with copper foil forms the electrodeposited resin forming the fine pattern film 14 by the heater 24 arranged to heat the entire etching operation space 15. 60 ° C which is higher than the softening temperature
Heated. The etching operation space 15 is heated to a temperature equal to or higher than the softening temperature of the fine pattern film 14, and the etching liquid 21 is sprayed in a shower shape, thereby compensating for a decrease in the temperature of the etching liquid 21 due to generation of heat of vaporization. For this reason, the fine pattern film 14 on the copper foil 12 can be reliably heated to the softening temperature or higher, and it is possible to mass-produce the high-density wiring conductor having a substantially rectangular cross-sectional shape with less side etching. Become.

Next, another method for injecting the etching liquid 21 in a shower shape to compensate for a decrease in the temperature of the etching liquid 21 due to generation of heat of vaporization will be described with reference to FIG.

First, the air supplied into the etching operation space 15 by the fan 26 is heated by the hot air heater 27 controlled by the temperature controller 28. The heating temperature of the air at this time is about 60 ° C. so as to be equal to or higher than the softening temperature of the electrodeposition resin constituting the fine pattern film 14. The hot air warms the etching operation space 15 to a temperature equal to or higher than the softening temperature of the fine pattern film 14 and sprays the etching liquid 21 in a shower shape, thereby compensating for a decrease in the temperature of the etching liquid 21 due to generation of heat of vaporization. For this reason, the fine pattern film 14 on the copper foil 12 can be reliably heated to the softening temperature or higher, and a high-density wiring conductor having a substantially rectangular cross-sectional shape with less side etching can be reliably mass-produced.

[0066]

According to the method for manufacturing a printed wiring board according to the first and second aspects of the present invention, a fine pattern film serving as an etching mask can be formed extremely easily and with high reliability, and continuous etching can be performed. Printed wiring boards can be mass-produced with high yield. In addition, since the fine pattern film adheres to the copper foil with good followability, and the etching process is performed in a state where the adhesive force to the copper foil is strong, a printed wiring board including a wiring conductor having a substantially rectangular cross-sectional shape with little side etching is used. There is an effect that it can be manufactured with a high yield.

According to the printed wiring board manufacturing apparatus of the present invention, a fine pattern film serving as an etching mask can be formed extremely easily and with high reliability, and continuous etching can be performed. There is an effect that printed wiring boards can be mass-produced with high yield. In addition, since the fine pattern film adheres to the copper foil with good followability, and the etching process is performed in a state where the adhesive force to the copper foil is strong, a printed wiring board including a wiring conductor having a substantially rectangular cross-sectional shape with little side etching is used. Can be manufactured with good yield.

According to the printed wiring board manufacturing apparatus of the present invention, the fine pattern film is heated by a heating means other than the etching solution to a temperature higher than the softening temperature of the electrodeposition resin constituting the fine pattern film. Therefore, the change in the temperature of the etching solution can be compensated, and the fine pattern film is adhered to the copper foil with good followability and the etching process is performed in a state where the adhesion to the copper foil is strong. Printed wiring boards comprising a small number of wiring conductors having a substantially rectangular cross-sectional shape can be mass-produced with high yield.

According to the printed wiring board manufacturing apparatus of the eighth aspect, since the fine pattern film adheres to the copper foil with good followability and is etched in a state in which the adhesion to the copper foil is strong, A wiring conductor having a substantially rectangular cross-sectional shape with less side etching can be obtained, and by preheating,
The time required for the etching process can be shortened, and the printed wiring board can be mass-produced with high yield.

According to the printed wiring board of the ninth aspect, the etching process is performed in a state where the fine pattern film serving as the etching mask has good followability to the copper foil and has strong adhesion to the copper foil. In addition, there is an effect that a printed wiring board composed of high-density wiring conductors having a rectangular cross section is obtained.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view of a main part showing a step of forming a pattern electrode layer on a conductive substrate according to a first embodiment of the present invention. FIG. (C) Principal cross-sectional view showing a step of etching and removing a conductive substrate according to the first embodiment of the present invention. (D) Master substrate according to the first embodiment of the present invention. Perspective sectional view

FIG. 2A is a cross-sectional view of a master substrate in which a release layer is provided on a pattern electrode layer according to the first embodiment of the present invention. FIG. Sectional view of the master substrate provided with the pattern film

FIG. 3A is a schematic view of impregnating a fine pattern film on a release layer with warm water according to the first embodiment of the present invention. Cross-sectional view of main part of heating and adhesion to insulating substrate with copper (c) Cross-sectional view of insulating substrate with copper foil obtained by peeling and transferring the fine pattern film in Embodiment 1 of the present invention

FIG. 4 is a configuration diagram of an etching apparatus for etching and removing a copper foil using the fine pattern film as an etching mask according to the first embodiment of the present invention;

FIG. 5A is a cross-sectional view of the insulated substrate with copper foil after the copper foil in Embodiment 1 of the present invention is removed by etching. FIG. Section of a printed wiring board manufactured by etching and removing copper foil

FIG. 6 is a configuration diagram of an etching apparatus for etching and removing a copper foil using a fine pattern film as an etching mask according to a second embodiment of the present invention.

FIG. 7 is a configuration diagram of another etching apparatus according to the second embodiment of the present invention.

FIG. 8 is a configuration diagram of another etching apparatus according to the second embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 master substrate 2 back plate 3 insulating layer 4 pattern electrode layer 5 conductive substrate 6 resist layer 7 release layer 8 fine pattern film 9 hot water bath 10 insulating substrate with copper foil 11 polyimide film 12 copper foil 13 heater 14 fine pattern film 15 Etching operation space 16 Etching solution tank 17 Etching solution heater 18 Temperature regulator 19 Pump 20 Nozzle 21 Etching solution 22 Substrate heater 23 Temperature regulator 24 Heater 25 Temperature regulator 26 Fan 27 Hot air heater 28 Temperature regulator 29 Supply port 30 Wiring Conductor 31 Printed wiring board

Claims (9)

[Claims] 1. A master substrate forming step of forming a pattern electrode layer of a predetermined shape on an insulating substrate, and a fine pattern film of an electrodeposition resin formed on the pattern electrode layer by an electrodeposition method. A pattern forming step, a peeling transfer step of bringing the fine pattern film on the master substrate into close contact with the copper foil on the surface of the insulating substrate with copper foil, peeling the master pattern from the master substrate, and transferring the film onto the copper foil; A method for manufacturing a printed wiring board, comprising: an etching step of etching and removing the copper foil at a temperature equal to or higher than a softening temperature of an electrodeposition resin constituting the fine pattern film using the fine pattern film as an etching mask. A step of forming a pattern electrode layer having a predetermined shape on an insulating substrate; a step of forming a release layer formed of a water-repellent thin film on the master substrate; A fine pattern forming step of forming a fine pattern film made of an electrodeposited resin on the surface of the release layer on the electrode layer by an electrodeposition method;
A water impregnating step of impregnating hot water at a temperature of 90 ° C. or more to 90 ° C. or more, and bringing the fine pattern film on the master substrate into close contact with a copper foil on the surface of an insulating substrate with a copper foil to peel off the copper from the master substrate; A printed wiring board comprising: a peeling transfer step of transferring onto a foil; and an etching step of etching and removing the copper foil at a temperature equal to or higher than a softening temperature of an electrodeposition resin constituting the fine pattern film using the fine pattern film as an etching mask. Manufacturing method. 3. A master substrate forming means for forming a pattern electrode layer of a predetermined shape on an insulating substrate, and a fine pattern forming a fine pattern film made of an electrodeposition resin on the pattern electrode layer by an electrodeposition method. Pattern forming means, peeling transfer means for bringing the fine pattern film on the master substrate into close contact with the copper foil on the surface of the insulating substrate with copper foil, peeling off the master substrate, and transferring it onto the copper foil, A printed wiring board comprising: heating means for heating the fine pattern film above the softening temperature of the electrodeposition resin constituting the fine pattern film, and etching means for etching and removing the copper foil using the fine pattern film as an etching mask. Manufacturing equipment. 4. A master substrate forming means for forming a pattern electrode layer of a predetermined shape on an insulating substrate, a release layer forming means for forming a release layer made of a water-repellent thin film on the master substrate, A fine pattern forming means for forming a fine pattern film made of an electrodeposited resin on the surface of the release layer on the electrode layer by an electrodeposition method;
A water impregnating means for impregnating hot water of 90 ° C. or higher and 90 ° C. or lower, and the fine pattern film on the master substrate is brought into close contact with the copper foil on the surface of the insulating substrate with copper foil to be peeled off from the master substrate and the copper Peeling transfer means for transferring onto the foil, heating means for heating the fine pattern film at a temperature equal to or higher than the softening temperature of the electrodeposition resin constituting the fine pattern film, and using the fine pattern film as an etching mask, the copper foil An apparatus for manufacturing a printed wiring board having an etching means for removing by etching. 5. The apparatus for manufacturing a printed wiring board according to claim 3, wherein said heating means is an etching solution heated to a temperature higher than a softening temperature of said electrodeposited resin. 6. The apparatus for manufacturing a printed wiring board according to claim 3, wherein said heating means is provided in proximity to said insulating substrate with copper foil. 7. The apparatus for manufacturing a printed wiring board according to claim 3, wherein said heating means uses hot air. 8. The method according to claim 3, further comprising a preheating means for preheating the insulating substrate with copper foil to a temperature equal to or higher than a softening temperature of the electrodeposition resin after the peeling and transferring step. Manufacturing equipment for printed wiring boards. 9. A printed wiring board provided with a wiring conductor having a substantially rectangular cross section manufactured by the method for manufacturing a printed wiring board according to claim 1.