JP2000307035A - Reinforcing structure for semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reinforcing structure for a semiconductor which is hardly affected by an external stress, and also allows reducing in thickness. SOLUTION: A semiconductor 11 comprising a pin 12 annexed to a protective package for protecting the semiconductor 11, a panel 21 where a hole 22 for holding the semiconductor 11 is formed, and a thermo-plastic resin 32 which is applied to the outer perimeter of the panel 21 and semiconductor 11 for them to be secured each other, are provided. With this structure, the semiconductor 11 is held with the panel 21 and pin which become one body with the thermo-plastic resin 32. Thus, an external stress is conveyed from a case holding the panel 21 to it, so that the stress on an electric joint part at deformation of the panel 21 is prevented from being conveyed to the semiconductor 11. No other part is required to be fitted for reinforcing the electric joint part of the semiconductor 11 and the panel 21. So a reinforcing height can be lowered for a thinner device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor reinforcing structure suitable for mounting on a panel.

[0002]

2. Description of the Related Art Conventionally, a semiconductor reinforcement structure is a structure for reinforcing and reinforcing a semiconductor mounting structure on a panel constituting an electric circuit. The mounting of the semiconductor on the panel constituting the electric circuit generally has a structure in which the semiconductor and the panel are fixed by soldering or the like, and the surroundings are solidified with resin. FIG. 3 shows a partial cross-sectional view of an example of a semiconductor reinforcement structure according to Conventional Example 1.

Conventional example 1 is a CSP holding a semiconductor element.
A semiconductor 41 such as a / BGA (Ball Grid Array), a panel 51 forming an electric circuit, a solder 42 attached to the semiconductor 41 for electrically connecting the semiconductor 41 to the panel 51 forming an electric circuit, and a semiconductor 41 And a thermoplastic resin 61 for reinforcing the periphery of a panel 51 constituting an electric circuit, and a frame 71 for reinforcing the entire panel. The frame 71, which is a component of these components, is formed of a highly rigid resin molded product, a metal sheet metal or the like.

The "semiconductor device and manufacturing method" of Japanese Patent Application Laid-Open No. Hei 8-236575, which is similar to the prior art 2 and whose technical field is similar to the present invention, uses a sealing material having a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the pin material. In this case, the electrodes of the semiconductor chip and the insulating substrate are electrically connected to each other, and cracks are less likely to occur in the solder portion as the connection portion.

[0005]

However, the above prior art has the following problems. First, when the panel 51 is deformed by an external stress, the semiconductor 41 cannot follow the deformation of the panel 51. For this reason, external stress is transmitted to the electrical joint. If an accidental and continuous load is applied to the device, the electrical connection between the semiconductor 41 and the panel 51 may be damaged.

[0006] Second, the frame 71 intended to reinforce the electrical joint has a stacked composition arranged on the semiconductor 41 and the panel 51. This structure requires a large mounting height and hinders the reduction in thickness of the device.

An object of the present invention is to provide a semiconductor reinforcing structure which is hardly affected by external stress and which can be made thin.

[0008]

In order to achieve the above object, a semiconductor reinforcing structure according to the present invention provides a semiconductor having a pin formed along with a protection package for protecting the semiconductor, and holding the semiconductor. And a thermoplastic resin that is applied to the outer periphery of the panel and the semiconductor and fixes the semiconductor to the panel.

According to a second aspect of the present invention, in the semiconductor reinforcing structure according to the first aspect, it is preferable that the semiconductor reinforcing structure further includes a solder which is provided on a surface portion of the panel and establishes electrical connection between the semiconductor and the panel.

According to the third aspect of the present invention, in the semiconductor reinforcing structure according to the first or second aspect, it is preferable that a pin is pressed into the hole to hold the semiconductor.

According to the fourth aspect of the present invention, the first to third aspects are provided.
In the reinforcement structure for a semiconductor according to any one of the above, the application of the thermoplastic resin may be performed using a predetermined tool having a nozzle for filling the outer periphery of the semiconductor with the thermoplastic resin.

According to the fifth aspect of the present invention, the first to fourth aspects are provided.
In the semiconductor reinforcing structure according to any one of the above, the semiconductor may be mechanically connected to the panel and held by curing of a thermoplastic resin applied to an outer peripheral portion of the semiconductor.

According to the sixth aspect of the invention, the second to fifth aspects are provided.
In the semiconductor reinforcing structure according to any one of the above, external pressure is transmitted from the protective package to the panel, stress to the electrical junction, can be prevented from transmitting deformation, the electrical junction between the semiconductor and the panel Protect from external stress.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a semiconductor reinforcing structure according to an embodiment of the present invention; Referring to FIGS. 1 and 2, there is shown an embodiment of a semiconductor reinforcing structure according to the present invention. FIG. 1 is an exploded perspective view showing an embodiment of a semiconductor reinforcing structure according to the present invention.
FIG. 2 is a partial cross-sectional view of the semiconductor reinforcing structure of the present embodiment.

Referring to FIG. 1 and FIG. 2, a semiconductor reinforcing structure according to this embodiment includes a semiconductor 11, a pin 12, and a solder 1.
3, a panel 21, a hole 22, and a thermoplastic resin 32. The nozzle 31 is a tool used to form the configuration of the present embodiment.

The semiconductor 11 of these components is formed in a CSP / BGA or the like that holds a semiconductor element.

The pin 12 is a mechanical fixing part formed along with a package for protecting the semiconductor 11. Therefore, the semiconductor 11 and the pins 12 are mechanically connected to each other.

The panel 21 is a member on which the semiconductor 11 is mounted to form an electric circuit. The hole 22 is provided in the panel 21 and is a hole for press-fitting the pin 12 and mechanically holding and fixing the semiconductor 11.

The thermoplastic resin 32 is applied between the panel 21 and a package or housing that holds the semiconductor 11 with the pins 12 pressed into the holes 22, and the semiconductor 11 is cured by curing the thermoplastic resin. Hold and fix to

The nozzle 31 is the tip of a jig for filling and applying the thermoplastic resin 32 to the outer periphery of the semiconductor 11 in which the pins 12 are inserted.

(Operation) The operation of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a configuration example of the present invention. FIG. 2 is a partial cross-sectional view showing a structure according to one embodiment of the present invention.

Referring to FIG. 1 and FIG.
Corresponds to the semiconductor 11 with respect to the panel 21 forming the electric circuit.
The pin 12 attached to the panel 21 is fixed by press-fitting into a hole 22 provided in the panel 21. The semiconductor 11 and the panel 2
1 indicates that an electrical connection between the two is taken by the solder 13 attached to the semiconductor 11. The electrical connection here is based on, for example, the BGA method.

The semiconductor 11 is mounted on the panel 21, and the solder 13 previously set on the panel 21 and the semiconductor 11 are electrically joined. In a state where the panel 21 and the semiconductor 11 are electrically connected, a thermoplastic resin 32 is applied to the outer peripheral portion of the semiconductor 11 by a nozzle 31, and the semiconductor 1 is cured by the curing action of the thermoplastic resin 32.
1 is firmly integrated with the panel 21 and fixed.

According to the above-described embodiment, as shown in FIG. 1, the semiconductor reinforcing structure of the present invention uses a semiconductor 11 such as a CSP / BGA holding a semiconductor element for a panel 21 forming an electric circuit. A pin 12 integrated with a package attached to the semiconductor 11 is provided, and is pressed into a hole 22 provided in a panel 21 in advance and fixed. Further, a thermoplastic resin 32 is applied to an outer peripheral portion of the semiconductor 11.

Therefore, the external stress is transmitted from the casing holding the panel 21 to the panel 21, and when the panel 21 is deformed, the semiconductor 11 is held by the panel 21 and the pins 12. Further, since they are integrated through the thermoplastic resin 32, transmission of stress and deformation to the electric joint can be prevented. As a result, the electrical junction between the semiconductor 11 and the panel 21 can be protected from external stress. Further, the simple application of the thermoplastic resin 32 enables a simple sealing structure.

Further, it is not necessary to attach other parts for reinforcing the electrical connection between the semiconductor 11 and the panel 21. For this reason, the height of the reinforcing structure can be reduced, and the device can be made thinner.

The above embodiment is an example of a preferred embodiment of the present invention. However, it is not limited to this.
Various modifications can be made without departing from the spirit of the present invention.

[0028]

As is apparent from the above description, in the semiconductor reinforcing structure of the present invention, pins are formed in a protective package for protecting the semiconductor, and holes for holding the semiconductor are formed in the panel. Then, a thermoplastic resin is applied to the outer periphery of the panel and the semiconductor to fix the semiconductor to the panel.

According to this structure, the semiconductor is held by the panel and the pins, and is integrated via the thermoplastic resin.
Thus, external stress is transmitted from the housing holding the panel to the panel, and it is possible to prevent the stress applied to the electrical junction when the panel is deformed from being transmitted to the semiconductor. Furthermore, since it is not necessary to attach another component for the purpose of reinforcing the electrical junction between the semiconductor and the panel, the height of the reinforcement can be reduced, and the device can be made thinner.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of a semiconductor reinforcing structure according to the present invention.

FIG. 2 is a partial cross-sectional view of the semiconductor reinforcement structure of the present embodiment.

FIG. 3 is a partial cross-sectional view showing an example of a semiconductor reinforcement structure according to Conventional Example 1.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Semiconductor 12 Pin 13 Solder 21 Panel 22 Hole 31 Nozzle 32 Thermoplastic resin

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M109 AA01 BA03 CA05 DB16 DB17 EA12 5E336 AA04 AA09 AA16 BB01 BB02 BC01 BC34 CC31 CC43 DD02 EE03 EE20 GG16 5F061 AA01 BA03 CA05 CB02 DE03

Claims (6)

[Claims] 1. A semiconductor having pins formed in association with a protection package for protecting a semiconductor, a panel having holes formed therein for holding the semiconductor, and a panel applied to an outer peripheral portion of the panel and the semiconductor. And a thermoplastic resin for fixing the semiconductor to the panel. 2. The reinforcing structure for a semiconductor according to claim 1, further comprising a solder provided on a surface portion of said panel to establish an electrical connection between said semiconductor and said panel. . 3. The semiconductor reinforcing structure according to claim 1, wherein a pin is pressed into said hole to hold the semiconductor. 4. The semiconductor reinforcing structure according to claim 1, wherein the application of the thermoplastic resin includes a nozzle having a nozzle for filling the outer periphery of the semiconductor with the thermoplastic resin. A semiconductor reinforcement structure characterized by being performed using a jig. 5. The semiconductor reinforcing structure according to claim 1, wherein the semiconductor is mechanically connected to and held by the panel by curing a thermoplastic resin applied to an outer peripheral portion of the semiconductor. A semiconductor reinforcement structure, characterized in that: 6. The reinforcing structure for a semiconductor according to claim 2, wherein an external pressure is transmitted from the protective package to the panel, and prevents stress and deformation from being transmitted to an electrical junction. Wherein the electrical junction between the semiconductor and the panel is protected from external stress.