JP2000306760A - Ceramic electronic component, manufacture therefor, and conducive paste for inner conductor - Google Patents
Ceramic electronic component, manufacture therefor, and conducive paste for inner conductorInfo
- Publication number
- JP2000306760A JP2000306760A JP11114535A JP11453599A JP2000306760A JP 2000306760 A JP2000306760 A JP 2000306760A JP 11114535 A JP11114535 A JP 11114535A JP 11453599 A JP11453599 A JP 11453599A JP 2000306760 A JP2000306760 A JP 2000306760A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- conductive paste
- powder
- nickel powder
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 31
- 239000000919 ceramic Substances 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000001301 oxygen Substances 0.000 claims abstract description 9
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 9
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 6
- 239000011230 binding agent Substances 0.000 claims description 32
- 238000010304 firing Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000002131 composite material Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000007847 structural defect Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、セラミック電子
部品、その製造方法、および内部導体用導電性ペースト
に関するもので、特に、銅を主成分とする内部導体を備
えるセラミック電子部品およびその製造方法、ならびに
銅を主成分とする内部導体を形成するために用いられる
内部導体用導電性ペーストに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic electronic component, a method of manufacturing the same, and a conductive paste for an internal conductor, and more particularly, to a ceramic electronic component having an internal conductor containing copper as a main component and a method of manufacturing the same. Also, the present invention relates to a conductive paste for an internal conductor used for forming an internal conductor containing copper as a main component.
【０００２】[0002]
【従来の技術】たとえば積層セラミックコンデンサやＬ
Ｃ複合部品のような多層複合部品のように、セラミック
をもって構成される電子部品本体と、この電子部品本体
の内部に形成される内部導体とを備える、セラミック電
子部品を製造する場合、典型的には、セラミックグリー
ンシートを用意するとともに、内部導体を形成するため
の導電性ペーストを用意し、その後、形成しようとする
内部導体のパターンをもって導電性ペーストをセラミッ
クグリーンシート上に印刷し、これらセラミックグリー
ンシートを積み重ね、プレスし、カットすることによっ
て、生の電子部品本体を作製し、この生の電子部品本体
を、次いで、焼成することによって、電子部品本体を得
る、各工程が実施される。2. Description of the Related Art For example, multilayer ceramic capacitors and L
When manufacturing a ceramic electronic component including an electronic component main body made of ceramic and an internal conductor formed inside the electronic component main body, such as a multilayer composite component such as a C composite component, typically, Prepare a ceramic green sheet, prepare a conductive paste for forming the internal conductor, and then print a conductive paste on the ceramic green sheet with the pattern of the internal conductor to be formed. Each step of producing a raw electronic component body by stacking, pressing, and cutting the sheets, and then firing the raw electronic component body to obtain the electronic component body is performed.
【０００３】上述した焼成工程は、脱バインダ工程と本
焼成工程とを備えており、脱バインダ工程では、セラミ
ックグリーンシートすなわち生の電子部品本体中のバイ
ンダおよび導電性ペースト中のバインダを燃焼させるこ
とが行なわれ、次いで、本焼成工程では、生の電子部品
本体に含まれるセラミックを焼結させることが行なわれ
る。脱バインダ工程では、バインダを燃焼させて除去す
る必要があるため、たとえば、空気またはある程度の酸
化性雰囲気といった酸素含有雰囲気中において実施され
る。The above-described firing step includes a binder removing step and a main firing step. In the binder removing step, the ceramic green sheet, that is, the binder in the raw electronic component body and the binder in the conductive paste are burned. Then, in the firing step, the ceramic contained in the raw electronic component body is sintered. Since the binder needs to be burned and removed in the binder removal step, the binder removal step is performed in an oxygen-containing atmosphere such as air or a somewhat oxidizing atmosphere.
【０００４】他方、積層セラミックコンデンサやＬＣ複
合部品のような多層複合部品において、Ｑ特性を向上さ
せるため、内部導体として、導電性の良好な銅を使用す
ることが行なわれている。このように、銅を用いて内部
導体を形成する場合には、銅粉末を導電性成分として含
む導電性ペーストが用いられる。On the other hand, in a multilayer composite component such as a multilayer ceramic capacitor or an LC composite component, copper having good conductivity is used as an internal conductor in order to improve the Q characteristic. As described above, when the internal conductor is formed using copper, a conductive paste containing copper powder as a conductive component is used.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、銅は酸
化されやすいので、内部導体を形成するために銅粉末を
含む導電性ペーストを用いる場合、特に脱バインダ工程
での酸素含有雰囲気が問題となる。たとえば、銀粉末を
含む導電性ペーストを内部導体の形成のために用いる場
合と同様の酸素含有雰囲気中で脱バインダ処理を行なっ
た場合、約１５０℃の温度から生じる銅の酸化膨張が原
因となって、電子部品本体において、剥がれ、デラミネ
ーションあるいはクラック等の内部構造欠陥を招くこと
が知られている。However, since copper is easily oxidized, when a conductive paste containing copper powder is used to form an internal conductor, an oxygen-containing atmosphere in the binder removal step becomes a problem. For example, when a binder removal treatment is performed in an oxygen-containing atmosphere similar to the case where a conductive paste containing silver powder is used for forming an internal conductor, oxidative expansion of copper generated from a temperature of about 150 ° C. is a cause. Therefore, it is known that in the electronic component body, internal structural defects such as peeling, delamination, and cracks are caused.
【０００６】したがって、このような銅の不所望な酸化
を防止または抑制するため、脱バインダ工程では、雰囲
気中に窒素ガスのみを供給したりして、酸素濃度を厳し
く制限する必要がある。しかし、このように雰囲気中の
酸素濃度を厳しく制限すると、脱バインダ処理の本来の
目的であるバインダの燃焼が進みにくくなり、そのた
め、脱バインダ処理に、たとえば銀粉末を含む導電性ペ
ーストを用いた場合に比べて２倍以上の時間を費やして
しまうという問題に遭遇する。Therefore, in order to prevent or suppress such undesired oxidation of copper, in the binder removal step, it is necessary to strictly limit the oxygen concentration by supplying only nitrogen gas into the atmosphere. However, when the oxygen concentration in the atmosphere is strictly limited in this manner, the combustion of the binder, which is the original purpose of the binder removal treatment, becomes difficult to proceed, and therefore, for the binder removal treatment, for example, a conductive paste containing silver powder is used. You will encounter the problem of spending more than twice as much time as in the case.
【０００７】そこで、この発明の目的は、上述したよう
な問題を解決し得る、セラミック電子部品およびその製
造方法、ならびに内部導体用導電性ペーストを提供しよ
うとすることである。An object of the present invention is to provide a ceramic electronic component and a method for manufacturing the same, and a conductive paste for an internal conductor, which can solve the above-mentioned problems.
【０００８】[0008]
【課題を解決するための手段】この発明は、セラミック
をもって構成される電子部品本体と、この電子部品本体
の内部に形成される内部導体とを備え、内部導体が電子
部品本体を得るための焼成と同時に導電性ペーストを焼
成することによって形成されたものである、セラミック
電子部品にまず向けられ、上述した技術的課題を解決す
るため、内部導体が、銅を主成分としながら、ニッケル
の酸化物を含むことを特徴としている。SUMMARY OF THE INVENTION The present invention comprises an electronic component body made of ceramic and an internal conductor formed inside the electronic component body, and the internal conductor is fired to obtain the electronic component main body. At the same time, firstly directed to ceramic electronic components, which are formed by sintering a conductive paste, in order to solve the above-mentioned technical problems, the inner conductor is made of nickel oxide while being mainly composed of copper. It is characterized by including.
【０００９】この発明は、上述したように、セラミック
をもって構成される電子部品本体と、この電子部品本体
の内部に形成される内部導体とを備える、セラミック電
子部品の製造方法にも向けられる。この製造方法におい
ては、導電性成分として、銅粉末およびニッケル粉末を
含み、ニッケル粉末の含有量が、銅粉末およびニッケル
粉末の合計量に対して２重量％以上５０重量％未満とな
るように選ばれた、導電性ペーストを用意する工程と、
内部導体が形成されるべき部分にこの導電性ペーストを
位置させた、生の電子部品本体を用意する工程と、生の
電子部品本体を酸素含有雰囲気中で脱バインダ処理し、
それによって、導電性ペーストに含まれるニッケル粉末
を酸化させることによって銅粉末の酸化を抑制しなが
ら、生の電子部品本体中のバインダおよび導電性ペース
ト中のバインダを燃焼させる工程と、次いで、脱バイン
ダ処理された電子部品本体および導電性ペーストを本焼
成する工程とが実施される。The present invention is also directed to a method for manufacturing a ceramic electronic component, comprising an electronic component main body made of ceramic and an internal conductor formed inside the electronic component main body, as described above. In this production method, copper powder and nickel powder are contained as conductive components, and the content of nickel powder is selected so as to be 2% by weight or more and less than 50% by weight based on the total amount of copper powder and nickel powder. Preparing a conductive paste,
A step of preparing a raw electronic component body in which the conductive paste is located in a portion where an internal conductor is to be formed, and performing a binder removal process on the raw electronic component body in an oxygen-containing atmosphere,
Thereby, the step of burning the binder in the raw electronic component body and the binder in the conductive paste while suppressing the oxidation of the copper powder by oxidizing the nickel powder contained in the conductive paste, and then removing the binder. And baking the processed electronic component body and the conductive paste.
【００１０】この発明は、さらに、セラミックをもって
構成される電子部品本体の内部に形成される内部導体を
形成するため、電子部品本体を得るための焼成と同時に
焼成される、導電性ペーストにも向けられる。この導電
性ペーストは、導電性成分として、銅粉末およびニッケ
ル粉末を含み、ニッケル粉末の含有量が、銅粉末および
ニッケル粉末の合計量に対して２重量％以上５０重量％
未満となるように選ばれることを特徴としている。The present invention is further directed to a conductive paste which is fired at the same time as firing for obtaining the electronic component body, in order to form an internal conductor formed inside the electronic component body made of ceramic. Can be This conductive paste contains copper powder and nickel powder as conductive components, and the content of nickel powder is 2% by weight or more and 50% by weight with respect to the total amount of copper powder and nickel powder.
It is characterized by being selected to be less than.
【００１１】[0011]
【実施例】この発明は、内部導体を備えるセラミック電
子部品であれば、前述したような積層セラミックコンデ
ンサやＬＣ複合部品のような多層複合部品などに限ら
ず、種々のセラミック電子部品に適用することができ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is applicable not only to multilayer ceramic capacitors and multilayer composite components such as LC composite components as described above, but also to various ceramic electronic components as long as they are ceramic electronic components having internal conductors. Can be.
【００１２】以下の実施例では、この発明に係るセラミ
ック電子部品として、積層セラミックコンデンサを作製
した。In the following examples, a multilayer ceramic capacitor was manufactured as a ceramic electronic component according to the present invention.
【００１３】まず、ＣａＺｒＯ3 を主成分とするセラミ
ックを用いて、厚み１３μｍのセラミックグリーンシー
トを用意した。First, a ceramic green sheet having a thickness of 13 μm was prepared using a ceramic containing CaZrO 3 as a main component.
【００１４】他方、内部導体を形成するための導電性ペ
ーストとして、導電性成分、バインダおよび溶剤を含
み、導電性成分において、銅粉末およびニッケル粉末を
含み、銅粉末およびニッケル粉末の合計量に対するニッ
ケル粉末の含有量を、表１の「Ｎｉ／Ｃｕ＋Ｎｉの割
合」で示すように、０〜５０重量％の範囲内で種々に変
えた試料１〜６を用意した。ここで、銅粉末およびニッ
ケル粉末として、走査型電子顕微鏡による測定で平均粒
径０．３μｍのものをそれぞれ使用した。On the other hand, the conductive paste for forming the internal conductor contains a conductive component, a binder and a solvent. The conductive component contains a copper powder and a nickel powder. Samples 1 to 6 were prepared in which the content of the powder was variously changed within the range of 0 to 50% by weight as shown by “Ratio of Ni / Cu + Ni” in Table 1. Here, as the copper powder and the nickel powder, those having an average particle diameter of 0.3 μm as measured by a scanning electron microscope were used.
【００１５】次に、各試料に係る導電性ペーストをスク
リーン印刷によってセラミックグリーンシート上に印刷
し、これらセラミックグリーンシートを積み重ねかつプ
レスした後、カット工程を実施し、生の電子部品本体を
作製した。Next, the conductive paste of each sample was printed on the ceramic green sheets by screen printing, and after stacking and pressing these ceramic green sheets, a cutting process was performed to produce a raw electronic component body. .
【００１６】次に、各試料に係る生の電子部品本体を、
３００℃の温度で５時間保持する条件で脱バインダ処理
した。ここで、焼成炉において、窒素ガスおよび空気を
容量比で３５：５となるように供給した。Next, the raw electronic component body relating to each sample is
The binder was removed under the condition of maintaining the temperature at 300 ° C. for 5 hours. Here, in the firing furnace, nitrogen gas and air were supplied at a volume ratio of 35: 5.
【００１７】このような脱バインダ後の残留炭素量は、
すべての試料について、０．２重量％であった。また、
脱バインダ後において、各試料の外観を観察し、剥がれ
などの外観不良の有無を評価した。表１の「脱バインダ
後の外観不良率」は、全試料数に対する外観不良が生じ
た試料数の割合を示している。The amount of residual carbon after the removal of the binder is as follows:
0.2% by weight for all samples. Also,
After removing the binder, the appearance of each sample was observed, and the presence or absence of appearance defects such as peeling was evaluated. “Appearance defect rate after binder removal” in Table 1 shows the ratio of the number of samples having appearance defects to the total number of samples.
【００１８】次に、上述のように脱バインダ処理された
各試料に係る電子部品本体および導電性ペーストを本焼
成した。この本焼成工程では、焼成炉において、主とし
て窒素ガスと少量の水素ガスを供給し、９５０℃の温度
で２時間保持するようにした。Next, the electronic component body and the conductive paste of each sample subjected to the binder removal processing as described above were main-baked. In the main firing step, a nitrogen gas and a small amount of hydrogen gas were mainly supplied to the firing furnace, and the temperature was maintained at 950 ° C. for 2 hours.
【００１９】このようにして得られた焼成後の電子部品
本体について、超音波探傷によって構造欠陥の有無を評
価した。表１の「超音波探傷による不良率」は、超音波
探傷によって不良と判定された試料数の全試料数に対す
る比率を示している。The electronic component body after firing obtained as described above was evaluated for the presence or absence of structural defects by ultrasonic flaw detection. “Defective rate by ultrasonic inspection” in Table 1 indicates a ratio of the number of samples determined to be defective by ultrasonic inspection to the total number of samples.
【００２０】次いで、各試料に係る電子部品本体に外部
電極を形成することによって、積層セラミックコンデン
サを得、これら積層セラミックコンデンサについて、１
ｋＨｚでの静電容量、ならびに１ｋＨｚおよび１ＧＨｚ
の各々におけるＱ値を測定した。これらの結果も、表１
に示されている。Next, a multilayer ceramic capacitor was obtained by forming external electrodes on the electronic component body of each sample.
Capacitance in kHz, and 1 kHz and 1 GHz
The Q value in each of the samples was measured. These results are also shown in Table 1.
Is shown in
【００２１】[0021]
【表１】 [Table 1]
【００２２】表１からわかるように、内部導体の形成の
ために用いる導電性ペーストにおいて、ニッケル粉末の
含有量を銅粉末およびニッケル粉末の合計量に対して２
重量％以上とすることにより、脱バインダ後の外観不良
を生じなくすることができる。As can be seen from Table 1, in the conductive paste used for forming the inner conductor, the content of the nickel powder was 2 to the total amount of the copper powder and the nickel powder.
When the content is not less than the weight%, appearance failure after binder removal can be prevented.
【００２３】しかしながら、このニッケル粉末の含有量
が５０重量％以上となると、Ｑ値の低下、特に１ＧＨｚ
でのＱ値の顕著な低下が生じる。However, when the content of the nickel powder is 50% by weight or more, the Q value is reduced, especially 1 GHz.
The Q value significantly decreases in the above.
【００２４】このことから、ニッケル粉末の含有量は、
銅粉末およびニッケル粉末の合計量に対して２重量％以
上５０重量％未満であることが好ましいことがわかる。From this, the content of the nickel powder is
It is understood that the content is preferably 2% by weight or more and less than 50% by weight based on the total amount of the copper powder and the nickel powder.
【００２５】[0025]
【発明の効果】以上のように、この発明によれば、内部
導体を形成するため、銅粉末およびニッケル粉末を含む
導電性ペーストが用いられるので、内部導体が形成され
るべき部分に導電性ペーストを位置させた、生の電子部
品本体を脱バインダ処理するとき、酸素含有雰囲気中で
これを行なっても、ニッケル粉末が酸化されることによ
って銅粉末の酸化を抑制することができる。As described above, according to the present invention, a conductive paste containing copper powder and nickel powder is used to form an internal conductor. When the binder processing is performed on the raw electronic component body in which is located, the nickel powder is oxidized even if this is performed in an oxygen-containing atmosphere, so that the oxidation of the copper powder can be suppressed.
【００２６】したがって、内部導体に含まれる銅の酸化
膨張を生じにくくすることができるとともに、ニッケル
によって銅の焼結を抑制できるので、剥がれ、デラミネ
ーション、クラック等の内部構造欠陥が電子部品本体に
生じにくくすることができる。Therefore, copper contained in the internal conductor can be hardly oxidized and expanded, and sintering of copper can be suppressed by nickel, so that internal structural defects such as peeling, delamination, and cracks occur in the electronic component body. It can be made hard to occur.
【００２７】また、脱バインダ処理を酸化含有雰囲気中
で行なうことができるので、脱バインダ工程に要する時
間を、窒素のみを供給する雰囲気中で脱バインダ処理を
行なう場合に比べて、１／２以下に短縮することができ
る。Further, since the binder removal treatment can be performed in an oxidizing atmosphere, the time required for the binder removal step is 1/2 or less of the case where the binder removal treatment is performed in an atmosphere in which only nitrogen is supplied. Can be shortened.
【００２８】上述したようなこの発明による効果をより
確実に達成するためには、ニッケル粉末の含有量が、銅
粉末およびニッケル粉末の合計量に対して２重量％以上
に選ばれることが好ましい。また、Ｑ値の低下を防ぐた
めには、このニッケル粉末の含有量が、銅粉末およびニ
ッケル粉末の合計量に対して５０重量％未満であること
が好ましい。In order to more reliably achieve the effects of the present invention as described above, the content of the nickel powder is preferably selected to be 2% by weight or more based on the total amount of the copper powder and the nickel powder. In order to prevent a decrease in the Q value, the content of the nickel powder is preferably less than 50% by weight based on the total amount of the copper powder and the nickel powder.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 広瀬 日出夫 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 Ｆターム(参考） 5E001 AC09 AE00 AH01 AH05 AH06 AH08 AH09 AJ01 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hideo Hirose 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. (Reference) 5E001 AC09 AE00 AH01 AH05 AH06 AH08 AH09 AJ01
Claims (4)
本体と、前記電子部品本体の内部に形成される内部導体
とを備え、前記内部導体が前記電子部品本体を得るため
の焼成と同時に導電性ペーストを焼成することによって
形成されたものである、セラミック電子部品であって、 前記内部導体は、銅を主成分としながら、ニッケルの酸
化物を含むことを特徴とする、セラミック電子部品。An electronic component main body made of ceramic, and an internal conductor formed inside the electronic component main body, wherein the internal conductor is baked to obtain the electronic component main body and simultaneously with the conductive paste. A ceramic electronic component formed by sintering, wherein the internal conductor contains nickel oxide while containing copper as a main component.
ーストは、導電性成分として、銅粉末およびニッケル粉
末を含み、ニッケル粉末の含有量が、銅粉末およびニッ
ケル粉末の合計量に対して２重量％以上５０重量％未満
である、請求項１に記載のセラミック電子部品。2. The conductive paste for forming the internal conductor includes a copper powder and a nickel powder as conductive components, and the content of the nickel powder is 2 to the total amount of the copper powder and the nickel powder. The ceramic electronic component according to claim 1, wherein the content is not less than 50% by weight and not less than 50% by weight.
本体と、前記電子部品本体の内部に形成される内部導体
とを備える、セラミック電子部品の製造方法であって、 導電性成分として、銅粉末およびニッケル粉末を含み、
ニッケル粉末の含有量が、銅粉末およびニッケル粉末の
合計量に対して２重量％以上５０重量％未満となるよう
に選ばれた、導電性ペーストを用意し、 前記内部導体が形成されるべき部分に前記導電性ペース
トを位置させた、生の前記電子部品本体を用意し、 生の前記電子部品本体を酸素含有雰囲気中で脱バインダ
処理し、それによって、前記導電性ペーストに含まれる
ニッケル粉末を酸化させることによって銅粉末の酸化を
抑制しながら、生の前記電子部品本体中のバインダおよ
び前記導電性ペースト中のバインダを燃焼させ、次い
で、 脱バインダ処理された前記電子部品本体および前記導電
性ペーストを本焼成する、各工程を備える、セラミック
電子部品の製造方法。3. A method for manufacturing a ceramic electronic component, comprising: an electronic component body made of ceramic; and an internal conductor formed inside the electronic component body, wherein copper powder and nickel are used as conductive components. Including powder,
Preparing a conductive paste selected such that the content of the nickel powder is 2% by weight or more and less than 50% by weight based on the total amount of the copper powder and the nickel powder; Preparing the raw electronic component main body in which the conductive paste is located, performing a binder removal process on the raw electronic component main body in an oxygen-containing atmosphere, and thereby removing the nickel powder contained in the conductive paste. The binder in the raw electronic component body and the binder in the conductive paste are burned while suppressing oxidation of the copper powder by oxidizing, and then the electronic component body and the conductive paste subjected to the binder removal processing A method for manufacturing a ceramic electronic component, comprising:
本体の内部に形成される内部導体を形成するため、前記
電子部品本体を得るための焼成と同時に焼成される、導
電性ペーストであって、 導電性成分として、銅粉末およびニッケル粉末を含み、
ニッケル粉末の含有量が、銅粉末およびニッケル粉末の
合計量に対して２重量％以上５０重量％未満となるよう
に選ばれた、導電性ペースト。4. A conductive paste which is fired at the same time as firing for obtaining said electronic component main body so as to form an internal conductor formed inside said electronic component main body made of ceramic, As a component, including copper powder and nickel powder,
A conductive paste selected such that the content of the nickel powder is 2% by weight or more and less than 50% by weight based on the total amount of the copper powder and the nickel powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11453599A JP3548818B2 (en) | 1999-04-22 | 1999-04-22 | Manufacturing method of multilayer ceramic capacitor and multilayer ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11453599A JP3548818B2 (en) | 1999-04-22 | 1999-04-22 | Manufacturing method of multilayer ceramic capacitor and multilayer ceramic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000306760A true JP2000306760A (en) | 2000-11-02 |
| JP3548818B2 JP3548818B2 (en) | 2004-07-28 |
Family
ID=14640200
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11453599A Expired - Lifetime JP3548818B2 (en) | 1999-04-22 | 1999-04-22 | Manufacturing method of multilayer ceramic capacitor and multilayer ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3548818B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103137327A (en) * | 2011-11-25 | 2013-06-05 | 三星电机株式会社 | Multilayer ceramic electronic component and method of manufacturing the same |
| JP2020178114A (en) * | 2019-04-22 | 2020-10-29 | 太陽誘電株式会社 | Ceramic electronic component, circuit board and manufacturing method of ceramic electronic component |
-
1999
- 1999-04-22 JP JP11453599A patent/JP3548818B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103137327A (en) * | 2011-11-25 | 2013-06-05 | 三星电机株式会社 | Multilayer ceramic electronic component and method of manufacturing the same |
| JP2013115424A (en) * | 2011-11-25 | 2013-06-10 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic electronic component and manufacturing method for the same |
| JP2020178114A (en) * | 2019-04-22 | 2020-10-29 | 太陽誘電株式会社 | Ceramic electronic component, circuit board and manufacturing method of ceramic electronic component |
| JP7427460B2 (en) | 2019-04-22 | 2024-02-05 | 太陽誘電株式会社 | Ceramic electronic components, circuit boards, and methods of manufacturing ceramic electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3548818B2 (en) | 2004-07-28 |
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