JPWO2007007518A1 - Conductive powder, conductive paste, and method for manufacturing multilayer ceramic electronic component - Google Patents

Abstract

In conductive paste, suppresses the rapid decomposition of organic binder using metal powder as a catalyst during degreasing, and structural defects such as cracks and delamination in sintered ceramics that make up multilayer ceramic electronic components after firing Is prevented from occurring. The conductive powder (11) contained in the conductive paste has a structure in which the surface of the metal powder (12) is covered with the organic compound (13). The organic compound (13) is an organic compound having 3 or more carbon atoms containing sulfur in the molecule, and the metal constituting the metal powder (12) and the sulfur in the organic compound (13) are covalently bonded. The ratio of the organic compound (13) to the metal powder (12) is 50 ppm by weight or more in terms of S.

Description

  The present invention relates to a conductive powder that has been subjected to a surface treatment, for example, a conductive powder used in a conductive paste for internal electrodes of a multilayer ceramic capacitor. The present invention also relates to a conductive paste using the conductive powder and a method for manufacturing a multilayer ceramic electronic component.

  In most cases, a multilayer ceramic electronic component such as a multilayer ceramic capacitor is manufactured as follows.

  First, a ceramic green sheet printed with a conductive paste for internal electrodes is laminated to produce an unfired ceramic laminate. Next, this unfired ceramic laminate is fired. Next, external electrodes are formed by baking on both ends of the sintered ceramic body obtained after firing.

  When firing an unfired ceramic laminate, it is technically necessary to bring the sintering shrinkage behavior of the metal powder contained in the conductive paste closer to the sintering shrinkage behavior of the ceramic powder contained in the ceramic green sheet. It becomes a problem. This is because if the behavior of both is greatly deviated, shrinkage stress tends to act on the interface between the conductive paste and the ceramic green sheet, which causes structural defects such as cracks and delamination in the ceramic sintered body. is there.

  Usually, the metal powder contained in the conductive paste starts sintering shrinkage earlier than the ceramic powder contained in the ceramic green sheet. Therefore, it is effective to suppress the sintering of the metal powder in order to bring both behaviors closer, and many countermeasures for this have been proposed.

  For example, Patent Document 1 proposes that a metal sulfide crystal phase is present at the contact interface between metal particles as the main component of the inner conductor, and that the metal sulfide crystal phase delays sintering of the metal particles. Yes. Specifically, nickel sulfate is added to the conductive paste.

  Patent Document 2 proposes to suppress the sintering of nickel powder by coating the surface of nickel powder with sulfur or a sulfur group. Patent Document 2 discloses a vapor phase method in which nickel powder is brought into contact with a gas containing a specific amount of sulfur. Finally, nickel powder is coated with nickel sulfide or nickel sulfate.

  By the way, in the firing step of firing the unfired ceramic laminate, in the initial stage (for example, a temperature range of 300 to 700 ° C.), the remaining organic components are burned out without being burned out in the previous degreasing step. At this stage, it has been confirmed that the organic binder rapidly decomposes inside the conductive paste using nickel powder as a catalyst. If the organic binder is rapidly decomposed in this way, voids are likely to be formed inside the conductive paste or at the interface between the conductive paste and the ceramic green sheet, causing structural defects such as cracks and delamination in the firing process. It becomes. In addition, it is estimated that this phenomenon of rapid decomposition of the organic binder can occur in metals other than nickel.

Although the measures disclosed in Patent Document 1 and Patent Document 2 can suppress the sintering of the metal powder, they cannot suppress the rapid decomposition of the organic binder in the initial stage of the firing process. This is presumably because the nickel component not bonded to other elements on the nickel powder surface promotes the combustion of the organic binder.
JP 2004-179182 A (in particular, “Claim 1”, paragraphs “0011” and “0047”) JP-A-2004-244654 (particularly, “claim 1”, paragraphs “0014”, “0016”, “0018”)

  Accordingly, an object of the present invention is to provide a conductive powder, a conductive paste using the conductive powder, and a method for manufacturing a multilayer ceramic electronic component that can solve the above-described problems.

  The present invention is first directed to a conductive powder. The conductive powder according to the present invention contains a metal powder and an organic compound having 3 or more carbon atoms containing sulfur in the molecule, and the surface of the metal powder is coated with the organic compound to constitute the metal powder. And sulfur in the organic compound are covalently bonded, and the ratio of the organic compound to the metal powder is 50 ppm by weight or more in terms of S.

  The organic compound preferably has 12 or less carbon atoms.

  Moreover, it is preferable that the ratio of the organic compound with respect to metal powder is 5000 weight ppm or less in conversion of S.

  The organic compound preferably has a mercapto group. Specifically, the organic compound is selected from the group consisting of 2-mercaptoimidazoline, mercaptobenzothiazole, mercaptobenzimidazole, mercaptobenzimidazoline, and 2-ethylhexyl β-mercaptopropionate. At least one selected from the above can be suitably used.

  The average particle size of the metal powder is preferably 0.03 to 0.5 μm.

  As the metal powder, nickel powder can be preferably used.

  The present invention is also directed to a conductive paste. The conductive paste according to the present invention includes the above-described conductive powder according to the present invention, a solvent, and an organic binder.

  The present invention is further directed to a method for manufacturing a multilayer ceramic electronic component. The method for producing a multilayer ceramic electronic component according to the present invention comprises preparing the conductive powder according to the present invention described above, and mixing the conductive powder, a solvent, and an organic binder to produce a conductive paste. A step of preparing a ceramic green sheet, a step of printing a conductive paste on the ceramic green sheet, a step of laminating the ceramic green sheets to produce a green ceramic laminate, and a green ceramic And a step of firing the laminate.

  When the conductive paste containing the conductive powder according to the present invention is used, rapid decomposition of the organic binder using the metal powder as a catalyst in the initial stage of the firing process can be suppressed. Although details of the action that brings about this effect are unknown, it is presumed that the activity on the surface of the metal powder is suppressed by the covalent bond between the metal powder and sulfur in the organic compound.

  Moreover, according to this invention, the oxidation of the metal powder during degreasing can also be suppressed. It is presumed that the organic compound layer containing sulfur formed by forming a covalent bond on the surface of the metal powder improves the resistance of the metal powder to oxidation. In addition, by suppressing oxidation of the metal powder during degreasing, it is possible to suppress oxidative expansion of the metal powder during degreasing and to reduce reduction shrinkage during firing. Structural defects such as lamination can be prevented.

  Furthermore, according to the present invention, sintering of the metal powder can be suppressed. This is presumed to be because the covalent bond between the metal powder and sulfur in the organic compound acts to prevent sintering shrinkage of the metal powder.

FIG. 1 is a cross-sectional view schematically showing a conductive powder according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing a multilayer ceramic capacitor which is an example of a multilayer ceramic electronic component configured using the conductive paste containing the conductive powder shown in FIG. FIG. 3 is a TG / DTA graph of Sample 6 produced in the experimental example. FIG. 4 is a TG / DTA graph of the sample 22 produced in the experimental example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Conductive powder 12 Metal powder 13 Organic compound 21 Multilayer ceramic capacitor 22 Ceramic layer 23, 24 Internal electrode 25 Sintered body 26, 27 External electrode

  Hereinafter, a conductive powder, a conductive paste, and a method for manufacturing a multilayer ceramic electronic component according to a preferred embodiment of the present invention will be described in detail.

1. Conductive Powder The conductive powder according to a preferred embodiment of the present invention includes a metal powder and an organic compound having 3 or more carbon atoms containing sulfur in the molecule. FIG. 1 is a cross-sectional view schematically showing a conductive powder according to a preferred embodiment of the present invention. As shown in FIG. 1, the conductive powder 11 includes a metal powder 12 and an organic compound 13 that covers the surface of the metal powder 12.

1) Metal powder As a metal which comprises metal powder, at least 1 sort (s) chosen from the group which consists of nickel, copper, silver, and palladium can be used, for example. Since base metals such as nickel and copper are easily oxidized, the effect of suppressing oxidation according to the present invention is remarkably exhibited.

  The average particle size of the metal powder is preferably 0.03 to 0.5 μm. By using such fine metal powder, the sintered state of the metal powder can be made uniform. In addition, an average particle diameter is an average value of a measured value when the particle diameter of 1000 metal powders is measured with a 10,000 times SEM photograph.

2) Organic compound The organic compound contains sulfur in the molecule and has 3 or more carbon atoms. When the number of carbon atoms is less than 3, the effect of the present invention cannot be obtained sufficiently. As will be described later, when the organic compound is coated on the surface of the metal powder, the organic compound is dissolved in the organic solvent. However, when the number of carbon atoms is less than 3, the polarity of the organic compound increases, It may be difficult to dissolve.

  Moreover, it is preferable that carbon number of an organic compound is 12 or less. When carbon number exceeds 12, when a metal powder is added to an electrically conductive paste, the fluidity | liquidity of an electrically conductive paste may fall. Moreover, when producing a multilayer ceramic electronic component using the conductive paste containing the conductive powder according to the present invention, if the carbon number exceeds 12, residual carbon tends to be generated, and the reliability of the component is reduced. There is.

  As the organic compound, an organic compound having a mercapto group, thioureas, a thiuram organic vulcanization accelerator, and the like can be used. In particular, since an organic compound having a mercapto group has an appropriate number of carbon atoms, the effect of the present invention is easily obtained.

  As the organic compound having a mercapto group, at least one selected from the group consisting of 2-mercaptoimidazoline, mercaptobenzothiazole, mercaptobenzimidazole, mercaptobenzimidazoline and β-mercaptopropionate 2-ethylhexyl can be used.

  As the thioureas, at least one selected from the group consisting of dibutylthiourea and dilaurylthiourea can be used.

  As the thiuram organic vulcanization accelerator, dipentamethylene thiuram tetrasulfide and the like can be used.

  The ratio of the organic compound to the metal powder is 50 ppm by weight or more in terms of S. The effect of this invention is not fully acquired as it is less than 50 weight ppm. Moreover, it is preferable that the ratio of the organic compound with respect to metal powder is 5000 weight ppm or less in conversion of S. If it exceeds 5000 ppm by weight, when metal powder is added to the conductive paste, the viscosity of the conductive paste increases with time, and the fluidity of the conductive paste may decrease.

  As a method for coating the surface of the metal powder with an organic compound, a method can be used in which an organic compound is dissolved in a solvent, a metal powder is added and dispersed therein to prepare a slurry, and the solvent is evaporated from the slurry. As the solvent, a solvent capable of dissolving the organic solvent to be used can be appropriately selected from alcohols such as ethanol and ketones such as acetone.

  When producing a multilayer ceramic electronic component using the conductive paste containing the conductive powder according to the present invention, carbon contained in the organic compound is burned off in the firing step. In order to maintain the effect of suppressing the rapid decomposition of the organic binder, the organic compound is preferably one that starts to burn out when the decomposition of the organic binder is finished, and specifically, one that burns out at 350 ° C. or higher is preferable. .

  Whether or not the metal powder and sulfur in the organic compound are covalently bonded can be examined by an analyzer such as XPS (X-ray photoelectron spectroscopy). When the metal powder is Ni powder, a peak appears in the vicinity of 162.2 ± 0.5 eV by XPS. This means the energy of S2p when a NiS bond is formed, and it can be seen that a NiS bond is formed.

2. Conductive paste The conductive paste according to the present invention contains the conductive powder, a solvent, and an organic binder. Moreover, other components, such as a ceramic powder, a viscosity stabilizer, a dispersing agent, may be contained as needed.

1) Solvent and organic binder As the solvent, terpene solvents such as terpineol, dihydroterpineol, α-pinene and p-cymene, and ester solvents such as butyl acetate can be used. As the organic binder, ethyl cellulose, acrylic resin, butyral resin, or the like can be used.

2) Ceramic powder When an internal electrode provided for a multilayer ceramic electronic component is formed using the conductive paste containing the conductive powder according to the present invention, a ceramic green for forming a ceramic layer of the multilayer ceramic electronic component It is preferable to add ceramic powder (so-called common material) having the same composition as the ceramic powder contained in the sheet to the conductive paste.

  Thus, by adding ceramic powder, the difference in shrinkage behavior between the inner conductor and the ceramic layer is reduced, and the occurrence of delamination can be reduced. The average particle size of the ceramic powder is preferably 5 nm to 0.5 μm. In addition, an average particle diameter is an average value of a measured value when the particle diameter of 1000 ceramic powders is measured with a 10,000 times SEM photograph.

3) Preferred Composition In the conductive paste, the conductive powder is preferably contained in a proportion of 30 to 60% by weight and the organic binder is contained in a proportion of 1 to 5% by weight. In addition, the weight ratio of electroconductive powder prescribed | regulated here is a ratio about the weight except the organic compound which exists in the electroconductive powder surface.

3. Multilayer Ceramic Electronic Component The conductive paste containing the conductive powder according to the present invention is a multilayer paste manufactured through a process of simultaneously firing a ceramic green sheet and a conductive paste, such as a multilayer ceramic capacitor or a ceramic multilayer substrate. It can be applied to ceramic electronic components. Hereinafter, a multilayer ceramic capacitor will be described as an example.

1) Configuration FIG. 2 is a cross-sectional view showing a multilayer ceramic capacitor which is an example of a multilayer ceramic electronic component. As shown in FIG. 2, the multilayer ceramic capacitor 21 includes a plurality of laminated ceramic layers 22 made of a dielectric ceramic, and internal electrodes 23 and 24 formed along a specific interface between the ceramic layers 22. A ceramic sintered body 25 having a laminated structure is provided. External electrodes 26 and 27 are formed at the respective end portions of the ceramic sintered body 25. The external electrodes 26 and 27 are electrically connected to the internal electrodes 23 and 24, and the internal electrode 23 electrically connected to one external electrode 26 and the internal electrode electrically connected to the other external electrode 27, respectively. The electrodes 24 are alternately arranged in the stacking direction. The internal electrodes 23 and 24 are obtained by firing a conductive paste containing the conductive powder according to the present invention.

2) Manufacturing Method Hereinafter, an example of a method for manufacturing the multilayer ceramic capacitor shown in FIG. 2 will be described.

  First, a conductive paste and a ceramic green sheet are prepared.

  The conductive paste constitutes the internal electrodes 23 and 24 after firing, and contains the conductive powder according to the present invention. The details are as described above.

  The ceramic green sheet constitutes the ceramic layer 22 after firing, and is formed by forming a slurry containing ceramic powder, a solvent, and an organic binder into a sheet shape. As the ceramic powder, barium titanate, calcium zirconate, barium of barium titanate partially substituted with calcium, calcium zirconate titanate, or the like can be used.

  As the solvent, a hydrocarbon solvent such as toluene or an alcohol solvent can be used.

  A butyral resin or the like can be used as the organic binder.

  Next, a conductive paste to be the internal electrodes 23 and 24 is printed on the ceramic green sheet by printing such as screen printing.

  Next, a plurality of ceramic green sheets are laminated, pressure-bonded, and cut into a predetermined size to produce an unfired ceramic laminate. Usually, when laminating ceramic green sheets, a predetermined number of ceramic green sheets on which conductive paste is printed are stacked, and a predetermined number of ceramic green sheets on which no conductive paste is printed are stacked.

  Next, the unfired ceramic laminate is fired to obtain a ceramic sintered body 25. The firing process includes a degreasing process and a subsequent firing process.

  The degreasing step is performed for about 1 to 10 hours at a temperature of 200 to 350 ° C. in air or in a neutral atmosphere. The main baking process is performed at a temperature of 300 to 1300 ° C. for about 1 to 5 hours. When using a metal powder that is easily oxidized, such as nickel, when firing is performed in a neutral atmosphere, a reducing atmosphere, or a mixed atmosphere such as nitrogen / water vapor / hydrogen, and using a metal powder that is not easily oxidized, such as silver, The firing can be performed in air.

  Next, the external electrodes 26 and 27 are formed by applying and baking an external electrode conductive paste on both ends of the ceramic sintered body 25. The conductive paste for external electrodes contains a metal powder, an organic binder, and a solvent. As the metal powder, silver, palladium, or the like can be used. An acrylic resin or the like can be used as the organic binder. As the solvent, terpineol or the like can be used.

  Below, the experiment example implemented in order to confirm the effect of this invention is demonstrated.

  First, the electroconductive powder which concerns on each of the samples 1-20 was produced as follows.

(Samples 1-15)
As the metal powder, nickel powder having an average particle size of 0.3 μm was prepared. In addition, as an organic compound containing sulfur in the molecule, mercaptobenzothiazole, mercaptobenzimidazole, mercaptobenzoimidazoline, β-mercaptopropionate 2-ethylhexyl, dipentamethylenethiuram tetrasulfide, dibutylthiourea, dilaurylthiourea, 2mercaptoimidazoline, And thiourea were prepared. Acetone was prepared as a solvent for dissolving the organic compound.

  Next, the various organic compounds described above were weighed and dissolved in 50 cc of acetone so that the amount of sulfur with respect to the nickel powder would be the ratio shown in Table 1 below. Next, 100 g of nickel powder was added to acetone in which the organic compound was dissolved, and the nickel powder was dispersed for 15 minutes with an ultrasonic disperser to prepare a slurry. Next, the slurry was put into a rotary evaporator and the pressure was reduced to evaporate acetone, thereby producing conductive powders according to samples 1 to 15 whose surfaces were coated with an organic compound.

(Sample 16)
In Sample 16, as shown in Table 1, the surface of nickel powder having an average particle size of 0.03 μm was coated with mercaptobenzothiazole so that the amount of sulfur with respect to the nickel powder was 2000 ppm by weight. About other conditions, it is the same as samples 1-15.

(Sample 17)
In Sample 17, as shown in Table 1, the surface of nickel powder having an average particle size of 0.5 μm was coated with mercaptobenzothiazole so that the amount of sulfur relative to the nickel powder was 500 ppm by weight. About other conditions, it is the same as samples 1-15.

(Sample 18)
In Sample 18, as shown in Table 2, a nickel powder having an average particle size of 0.3 μm was placed in an oven at 200 ° C. and left for 12 hours to prepare a nickel powder having an oxygen content of 3%. It was. Moreover, the coating process by an organic compound was not performed. About other conditions, it is the same as samples 1-15.

(Sample 19)
In Sample 19, as shown in Table 2, the surface of nickel powder having an average particle size of 0.3 μm was coated with linear alkylbenzene sulfonic acid. Linear alkylbenzene sulfonic acid is an organic compound containing sulfur. The coating method was the same as Samples 1 to 15, and the amount of sulfur relative to the nickel powder was 1000 ppm by weight. About other conditions, it is the same as samples 1-15.

(Sample 20)
In Sample 20, as shown in Table 2, a nickel powder having an average particle size of 0.3 μm was not coated with an organic compound. Instead, mercaptobenzothiazole was added to the conductive paste so that the amount of sulfur relative to the nickel powder was 1000 ppm by weight. About other conditions, it is the same as samples 1-15.

(Sample 21)
In Sample 21, as shown in Table 2, nickel powder having an average particle size of 0.3 μm was placed in a glass container, and H ₂ S gas was sealed in the glass container and left for 12 hours. Next, when the nickel powder was taken out and the amount of S was measured, it was 1200 ppm by weight with respect to the nickel powder.

(Sample 22)
In Sample 22, as shown in Table 2, no treatment was performed on nickel powder having an average particle size of 0.3 μm. About other conditions, it is the same as samples 1-15.

  Next, the conductive powder, dihydroterpineol, ethyl cellulose, dispersant, and barium titanate powder having an average particle size of 0.1 μm were mixed in a three-roll mill to prepare a conductive paste. . In the conductive paste, the nickel powder content was 40% by weight and the barium titanate content was 5% by weight. Moreover, the solvent, the organic binder, and the dispersant were adjusted to such a ratio that the viscosity was suitable for screen printing.

  Next, a ceramic green sheet mainly composed of barium titanate was prepared. This ceramic green sheet is adjusted to a thickness such that the thickness after firing is 2 μm.

  Next, a conductive paste is applied on the ceramic green sheet to form an internal electrode pattern, 400 layers of ceramic green sheets are laminated, pressed, cut into a predetermined size with a dicing saw, and an unfired ceramic laminate The body was made.

  Next, the unfired ceramic laminate was degreased at 260 ° C. in the atmosphere for 6 hours. Next, the following was investigated about the defatted unfired ceramic laminate.

  a) Using Quantum 2000 manufactured by PHYSICAL ELECTRONICS, the binding state of nickel and sulfur was analyzed by XPS (X-ray photoelectron spectroscopy) to examine the presence of NiS. The results are shown in Tables 1 and 2.

  b) Thermogravimetric analysis (TG) and differential thermal analysis (DTA) were performed using a TG8210 manufactured by Rigaku, and the presence or absence of rapid decomposition of the organic binder was examined. As the atmosphere during the heat treatment, a mixed atmosphere of nitrogen / water vapor / hydrogen was used. The results are shown in Tables 1 and 2. FIG. 3 is a TG / DTA graph of the sample 6, and FIG. 4 is a TG / DTA graph of the sample 22. As shown in FIG. 3, when there is no particularly large change in the slope of the graph curve, it is determined that there is no rapid decomposition of the organic binder, and as shown in FIG. 4, the slope of the curve of the graph becomes partly steep. It was judged that there was a rapid decomposition of the organic binder.

  c) The amount of nickel powder oxidized in each sample was measured using a saturation magnetometer. Specifically, using the property that nickel is magnetized and nickel oxide is not magnetized, degreasing is performed based on the difference between the magnetic moment in each sample after degreasing and the magnetic moment in each sample after heat treatment. The amount of oxidation of the later nickel powder was determined. The heat treatment was performed at 1000 ° C. for 5 hours in a hydrogen / nitrogen mixed atmosphere. The results are shown in Tables 1 and 2.

  In addition, separately, conductive pastes were similarly prepared using the conductive powder according to each sample, and changes in paste flowability and paste viscosity over time were examined with an E-type viscometer. The results are shown in Tables 1 and 2.

  Separately, a non-fired ceramic laminate is similarly prepared using the conductive powder according to each sample, degreased, and subsequently at a peak temperature of 1200 ° C. in a nitrogen / water vapor / hydrogen mixed atmosphere. Time baking was performed. The ceramic sintered body thus obtained was examined for the presence of structural defects such as cracks and delamination. The results are shown in Tables 1 and 2.

  As is clear from Table 1, good results were obtained for samples 1, 3 to 14, 16 and 17 in which the surface of the metal powder was coated with an organic compound having 3 or more carbon atoms and an S content of 50 ppm or more. It was.

  On the other hand, in sample 2, since the S amount was less than 50 ppm, a peak of binder rapid decomposition and a structural defect of the ceramic sintered body occurred. Since sample 15 had less than 3 carbon atoms, a peak of binder rapid decomposition and structural defects of the ceramic sintered body occurred.

  Sample 8 had no problem with regard to the binder rapid decomposition peak and structural defects, but because the S amount exceeded 5000 ppm, a change in paste viscosity with time occurred. Moreover, although the sample 14 had no problem about the binder rapid decomposition peak and the structural defect, since the carbon number exceeded 12, the fluidity of the paste was lowered.

  Samples 18 to 22 shown in Table 2 were obtained by a conventional metal powder processing method, and structural defects of the ceramic sintered body occurred in any of the samples.

Claims (9)

A metal powder and an organic compound having 3 or more carbon atoms containing sulfur in the molecule;
The surface of the metal powder is coated with the organic compound,
A metal constituting the metal powder and sulfur in the organic compound are covalently bonded,
The ratio of the said organic compound with respect to the said metal powder is 50 weight ppm or more in conversion of S, The electroconductive powder characterized by the above-mentioned.   The conductive powder according to claim 1, wherein the organic compound has 12 or less carbon atoms.   2. The conductive powder according to claim 1, wherein a ratio of the organic compound to the metal powder is 5000 ppm by weight or less in terms of S. 3.   The conductive powder according to claim 1, wherein the organic compound has a mercapto group.   The organic compound is at least one selected from the group consisting of 2-mercaptoimidazoline, mercaptobenzothiazole, mercaptobenzimidazole, mercaptobenzimidazoline, and 2-ethylhexyl β-mercaptopropionate. Conductive powder.   The conductive powder according to claim 1, wherein the metal powder has an average particle size of 0.03 to 0.5 μm.   The conductive powder according to claim 1, wherein the metal powder is nickel powder. The conductive powder according to any one of claims 1 to 7,
Solvent,
An electrically conductive paste containing an organic binder. Preparing the conductive powder according to claim 1;
Mixing the conductive powder, a solvent and an organic binder to produce a conductive paste;
Preparing a ceramic green sheet;
Printing the conductive paste on the ceramic green sheet;
Laminating the ceramic green sheets to produce an unfired ceramic laminate;
And a step of firing the unfired ceramic laminate. A method for producing a multilayer ceramic electronic component, comprising:

Images