JP2000299502A - Led lamp - Google Patents
Led lampInfo
- Publication number
- JP2000299502A JP2000299502A JP11104787A JP10478799A JP2000299502A JP 2000299502 A JP2000299502 A JP 2000299502A JP 11104787 A JP11104787 A JP 11104787A JP 10478799 A JP10478799 A JP 10478799A JP 2000299502 A JP2000299502 A JP 2000299502A
- Authority
- JP
- Japan
- Prior art keywords
- light
- led lamp
- led
- unit
- shielding film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は映像表示装置などに
用いられるＬＥＤランプに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED lamp used for an image display device or the like.
【０００２】[0002]
【従来の技術】映像表示装置（フルカラー方式）として
は、図４及び図５に例示するように、ＲＧＢの各色のＬ
ＥＤランプ１１Ｒ、１１Ｇ、１１Ｂをマトリクス状に配
列してユニット化をはかり、更にそのＬＥＤユニットを
マトリクス状に配列して大画面の表示部を構成し、その
表示部に制御部から表示データを送出して、表示部の多
数個のＬＥＤランプを点灯あるいは点滅することによっ
て、所望の映像をカラー表示する構造のものがある。2. Description of the Related Art As a video display device (full color system), as shown in FIGS.
The ED lamps 11R, 11G, and 11B are arranged in a matrix to form a unit, and the LED units are arranged in a matrix to form a large-screen display unit, and display data is sent from the control unit to the display unit. Then, there is a structure in which a desired image is displayed in color by turning on or blinking a large number of LED lamps of the display unit.
【０００３】この種の映像表示装置に使用されるＬＥＤ
ユニットにおいて、ＬＥＤランプに太陽光が直接当たる
と、ＬＥＤチップ周囲の反射皿が光るため、ＬＥＤラン
プが点灯状態あるのか、不点灯状態であるのかを視認す
るのが難しくなる。その対策として、従来、図４及び図
５に示すように、ランプ配列の各列ごとに庇１０を設
け、ＬＥＤランプ１１Ｒ、１１Ｇ、１１Ｂに太陽光が直
接当たらないようにするという方法が採られている。[0003] LED used in this type of video display device
In the unit, when sunlight directly hits the LED lamp, the reflection plate around the LED chip shines, making it difficult to visually recognize whether the LED lamp is in a lighting state or a non-lighting state. As a countermeasure, conventionally, as shown in FIGS. 4 and 5, a method has been adopted in which eaves 10 are provided for each row of the lamp array so that sunlight does not directly hit the LED lamps 11R, 11G, and 11B. ing.
【０００４】[0004]
【発明が解決しようとする課題】ところで、ＬＥＤユニ
ットに庇を設けた場合、庇の突出量（長さ）がユニット
下方からの仰角に影響を与える。When an LED unit is provided with an eaves, the protruding amount (length) of the eaves affects the elevation angle from below the unit.
【０００５】すなわち、図６に示すように、庇１０の長
さを短くすると（Ａ）、ユニット下方からの仰角は大き
くなるものの、ＬＥＤランプ１１に太陽光が直接当たる
角度θ1 が大きくなり、逆に、庇１０の長さを長くする
と（Ｂ）、ＬＥＤランプ１１に太陽光が直接当たる角度
θ2 を小さくできるが、ユニット下方からの仰角が小さ
くなってしまい、映像が見にくくなる。That is, as shown in FIG. 6, when the length of the eaves 10 is shortened (A), the angle θ1 at which sunlight directly hits the LED lamp 11 increases, although the elevation angle from below the unit increases. If the length of the eaves 10 is increased (B), the angle θ2 at which sunlight directly hits the LED lamp 11 can be reduced, but the elevation angle from below the unit is reduced, making it difficult to see the image.
【０００６】このように、庇を設けた構造では、太陽光
の遮光と下方からの仰角とが相反する関係となり、しか
も庇の適切な突出量は、ＬＥＤユニット内の場所（ラン
プ列）ごとに異なるので、庇の突出量を決定するのが難
しい。また、適切な突出量を設定しても、庇が存在する
限り、仰角を大きくすることには限界がある。As described above, in the structure in which the eaves are provided, the light shielding of sunlight and the elevation angle from below are in an opposite relationship, and the appropriate projection amount of the eaves is different for each location (lamp row) in the LED unit. Since it is different, it is difficult to determine the protruding amount of the eaves. Even if an appropriate amount of protrusion is set, there is a limit to increasing the elevation angle as long as the eaves are present.
【０００７】本発明はそのような実情に鑑みてなされた
もので、ＬＥＤユニットを構成するにあたり、太陽光の
影響を軽減でき、かつ仰角を大きくすることが可能なＬ
ＥＤランプの提供を目的とする。The present invention has been made in view of such circumstances, and when configuring an LED unit, it is possible to reduce the influence of sunlight and increase the elevation angle.
The purpose is to provide ED lamps.
【０００８】[0008]
【課題を解決するための手段】上記の目的を達成するた
め、本発明は、ＬＥＤチップが透光性樹脂でモールドさ
れたＬＥＤランプにおいて、透光性樹脂の一部に遮光膜
が形成されていることを特徴としており、より具体的に
は、透光性樹脂の上側部分に遮光膜が形成されているこ
とによって特徴づけられる。According to the present invention, there is provided an LED lamp in which an LED chip is molded with a light-transmitting resin, wherein a light-shielding film is formed on a part of the light-transmitting resin. More specifically, it is characterized in that a light-shielding film is formed on an upper portion of the translucent resin.
【０００９】本発明のＬＥＤランプによれば、透光性樹
脂に形成した遮光膜が、庇の役目を果たすので、ＬＥＤ
ユニットを構成する際に、ユニット前方側に突出する庇
を設けなくても、ＬＥＤランプの反射皿に太陽光が直接
当たることを防止することができる。また、庇が不要に
なることから、ユニット下方からの仰角が大きくなり、
見やすい映像を提供できる。According to the LED lamp of the present invention, the light-shielding film formed on the light-transmitting resin functions as an eaves.
When the unit is configured, it is possible to prevent sunlight from directly hitting the reflection plate of the LED lamp without providing an eaves projecting forward of the unit. In addition, since the eaves are not required, the elevation angle from below the unit increases,
Provide easy-to-view images.
【００１０】本発明のＬＥＤランプにおいて、遮光膜が
透光性樹脂に接触する面（遮光膜の内側面）に反射層を
形成するとともに、透光性樹脂の外側面を黒色に着色し
ておけば、ＬＥＤチップから無駄な方向（上側）に出射
する光を、必要な方向に向けて反射することができるの
で、光の利用効率が高くなって、映像のコントラストを
更に高めることが可能になる。また、太陽光による影響
をより軽減できる。In the LED lamp of the present invention, a reflective layer is formed on the surface where the light-shielding film contacts the light-transmitting resin (the inner surface of the light-shielding film), and the outer surface of the light-transmitting resin is colored black. In this case, light emitted from the LED chip in a useless direction (upward) can be reflected in a required direction, so that the light use efficiency is increased and the contrast of an image can be further increased. . Further, the influence of sunlight can be further reduced.
【００１１】本発明のＬＥＤランプにおいて、遮光膜形
成部と非形成部との境界（ＬＥＤチップ前方側の境界）
は、適用するＬＥＤユニットの用途等の条件によって決
定されるが、ＬＥＤランプの中心から上角度で０〜１５
°の範囲（図１参照）が適当である。In the LED lamp of the present invention, the boundary between the light-shielding film forming part and the non-forming part (the boundary on the front side of the LED chip)
Is determined depending on conditions such as the application of the LED unit to be applied.
The range of ° (see FIG. 1) is appropriate.
【００１２】本発明のＬＥＤランプに用いる遮光膜の材
質は、特に限定されないが、耐熱性・耐候性などに優
れ、封止樹脂（エポキシ樹脂）との密着性が良好な材
料、例えばウレタン系樹脂などを挙げることができる。
また、遮光膜を透光性樹脂に形成する方法としては、塗
装法、スタンプやインクジェットなどの印刷法、あるい
は蒸着等の各種コーティング法などを挙げることができ
る。The material of the light-shielding film used for the LED lamp of the present invention is not particularly limited, but is a material having excellent heat resistance and weather resistance and having good adhesion to a sealing resin (epoxy resin), for example, a urethane resin. And the like.
Examples of the method for forming the light-shielding film on the light-transmitting resin include a coating method, a printing method such as stamping and inkjet printing, and various coating methods such as vapor deposition.
【００１３】[0013]
【発明の実施の形態】図１及び図２はそれぞれ本発明の
ＬＥＤランプの実施形態を模式的に示す側面図及び平面
図である。図３はその実施形態を模式的に示す正面図で
ある。1 and 2 are a side view and a plan view, respectively, schematically showing an embodiment of an LED lamp according to the present invention. FIG. 3 is a front view schematically showing the embodiment.
【００１４】まず、本実施形態のＬＥＤランプは、リー
ドフレーム３の先端に反射皿２が設けられており、この
反射皿２の底面にＬＥＤチップ１が導電性接着剤（図示
せず）によりダイボンディングされている。ＬＥＤチッ
プ１の反対側の電極は、もう一方のリードフレーム４の
先端に導電性ワイヤ７を介して接続されている。そし
て、以上のＬＥＤチップ１、反射皿２、導電性ワイヤ７
及びリードフレーム３、４の先端部がエポキシ樹脂５
（透光性樹脂）によってモールド（樹脂封止）されてい
る。なお、エポキシ樹脂５はＬＥＤチップ１等の保護
と、集光レンズなどの役目を果たす。First, in the LED lamp of the present embodiment, a reflection plate 2 is provided at the tip of a lead frame 3, and an LED chip 1 is mounted on the bottom surface of the reflection plate 2 by a conductive adhesive (not shown). Bonded. The electrode on the opposite side of the LED chip 1 is connected to the tip of the other lead frame 4 via a conductive wire 7. Then, the above LED chip 1, reflection dish 2, conductive wire 7
And the ends of the lead frames 3 and 4 are epoxy resin 5
(Translucent resin). The epoxy resin 5 plays a role of protecting the LED chip 1 and the like and a role of a condenser lens.
【００１５】さて、本実施形態では、エポキシ樹脂５の
上側の部分に、庇として機能する黒色塗膜６（遮光膜）
を形成したところに特徴があり、このような黒色塗膜６
を形成しておくことにより、ＬＥＤランプの反射皿２に
太陽光が直接当たることを防止することができる。その
結果として、映像のコントラストが向上し、ＬＥＤラン
プの点灯・不点灯を視認しやすくなる。In this embodiment, a black coating film 6 (light shielding film) functioning as an eave is provided on the upper portion of the epoxy resin 5.
The characteristic feature is that the black coating film 6 is formed.
Is formed, it is possible to prevent sunlight from directly hitting the reflection plate 2 of the LED lamp. As a result, the contrast of the image is improved, and the lighting / non-lighting of the LED lamp is easily recognized.
【００１６】なお、以上の実施形態では、エポキシ樹脂
５に黒色塗装を施して遮光膜を形成しているが、これに
限られることなく、遮光膜は、スタンプあるいはインク
ジェット等の印刷法によって形成してもよい。また、遮
光膜は、蒸着等の公知の方法によるコーティング膜であ
ってもよい。In the above embodiment, the light-shielding film is formed by applying a black coating to the epoxy resin 5. However, the invention is not limited to this, and the light-shielding film may be formed by a printing method such as stamping or ink-jet printing. You may. Further, the light shielding film may be a coating film formed by a known method such as vapor deposition.
【００１７】以上の実施形態では、エポキシ樹脂５に単
なる黒色塗膜６を形成した例を示したが、遮光膜として
は様々なバリエーションが考えれられる。その１つとし
て、透光性樹脂に接触する面（遮光膜の内側面）に、拡
散反射または正反射を行う反射層を形成し、外側面に黒
色塗装を施した遮光膜を挙げることができる。In the above embodiment, an example is shown in which a simple black coating film 6 is formed on the epoxy resin 5, but various variations can be considered as the light shielding film. As one of them, a light-shielding film in which a reflection layer that performs diffuse reflection or regular reflection is formed on the surface (the inner side surface of the light-shielding film) that comes into contact with the light-transmitting resin, and the outer surface is painted black. .
【００１８】本発明のＬＥＤランプは、ＬＥＤユニット
のほか、目的とする以外の場所に出射されること（例え
ば光害）を防止するという用途にも使用可能であり、例
えば屋外・屋内用の表示装置あるいは照明装置にも適用
できる。The LED lamp of the present invention can be used not only for the LED unit but also for the purpose of preventing emission (for example, light pollution) to a place other than the intended place. It can also be applied to devices or lighting devices.
【００１９】[0019]
【発明の効果】以上説明したように、本発明のＬＥＤラ
ンプによれば、透光性樹脂の一部（上側部分）に、庇の
役目を果たす遮光膜を形成しているので、ＬＥＤユニッ
トを構成する際に、ユニット前方側に突出する庇を設け
なくても、ＬＥＤランプの反射皿に太陽光が直接当たる
ことを防止することができる。これにより、映像のコン
トラストが向上する結果、ＬＥＤランプの点灯・不点灯
を視認しやすくなる。また、庇が不要になることから、
ＬＥＤユニット下方からの仰角が大きくなり、見やすい
映像を提供できる。さらに、ＬＥＤユニットに庇を設置
するスペースを確保する必要がなくなるので、ユニット
内のＬＥＤランプの配列の自由度が高くなるという利点
もある。As described above, according to the LED lamp of the present invention, a light shielding film serving as an eave is formed on a part (upper part) of the translucent resin. In the configuration, it is possible to prevent sunlight from directly hitting the reflecting plate of the LED lamp without providing an eaves projecting forward of the unit. Thereby, as a result of improving the contrast of the image, the lighting / non-lighting of the LED lamp can be easily recognized. Also, because the eaves are no longer needed,
The angle of elevation from below the LED unit is increased, and an easy-to-view image can be provided. Furthermore, since there is no need to secure a space for installing the eaves in the LED unit, there is an advantage that the degree of freedom in the arrangement of the LED lamps in the unit is increased.
【図１】本発明のＬＥＤランプの実施形態を模式的に示
す側面図である。FIG. 1 is a side view schematically showing an embodiment of an LED lamp of the present invention.
【図２】同じく実施形態を模式的に示す平面図である。FIG. 2 is a plan view schematically showing the embodiment.
【図３】同じく実施形態を模式的に示す正面図である。FIG. 3 is a front view schematically showing the embodiment.
【図４】ＬＥＤユニットの一例を示す正面図である。FIG. 4 is a front view illustrating an example of an LED unit.
【図５】同じくＬＥＤユニットの側面図である。FIG. 5 is a side view of the LED unit.
【図６】ＬＥＤユニットに設ける庇の問題点の説明図で
ある。FIG. 6 is an explanatory diagram of a problem of an eave provided in an LED unit.
１ ＬＥＤチップ ２ 反射皿 ３，４ リードフレーム ５ エポキシ樹脂（透光性樹脂） ６ 黒色塗膜（遮光膜） ７ 導電性ワイヤ DESCRIPTION OF SYMBOLS 1 LED chip 2 Reflection dish 3, 4 Lead frame 5 Epoxy resin (light-transmitting resin) 6 Black coating film (light shielding film) 7 Conductive wire
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5C094 AA06 AA11 AA12 BA23 CA18 ED01 ED15 FA01 FA02 HA01 5F041 AA14 DA02 DA07 DA18 DA26 DA44 DA55 DB01 DC83 EE24 FF06 FF11 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5C094 AA06 AA11 AA12 BA23 CA18 ED01 ED15 FA01 FA02 HA01 5F041 AA14 DA02 DA07 DA18 DA26 DA44 DA55 DB01 DC83 EE24 FF06 FF11
Claims (3)
れたＬＥＤランプにおいて、透光性樹脂の一部に遮光膜
が形成されていることを特徴とするＬＥＤランプ。1. An LED lamp in which an LED chip is molded with a translucent resin, wherein a light-shielding film is formed on a part of the translucent resin.
れていることを特徴とする請求項１記載のＬＥＤラン
プ。2. The LED lamp according to claim 1, wherein a light shielding film is formed on an upper portion of the translucent resin.
に反射層が形成されており、外側面が黒色に着色されて
いることを特徴とする請求項１または２記載のＬＥＤラ
ンプ。3. The LED lamp according to claim 1, wherein the light-shielding film has a reflective layer formed on an inner surface in contact with the light-transmitting resin, and an outer surface is colored black. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11104787A JP2000299502A (en) | 1999-04-13 | 1999-04-13 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11104787A JP2000299502A (en) | 1999-04-13 | 1999-04-13 | Led lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000299502A true JP2000299502A (en) | 2000-10-24 |
Family
ID=14390187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11104787A Pending JP2000299502A (en) | 1999-04-13 | 1999-04-13 | Led lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000299502A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141560A (en) * | 2000-10-31 | 2002-05-17 | Seiwa Electric Mfg Co Ltd | Led lamp and its manufacturing method |
| EP1276157A3 (en) * | 2001-06-27 | 2005-02-09 | Toyoda Gosei Co., Ltd. | Shielded reflective light-emitting device |
| US6939188B2 (en) | 2001-08-01 | 2005-09-06 | Sharp Kabushiki Kaisha | LED lamp configured to minimize image contrast |
| WO2010034281A1 (en) * | 2008-09-25 | 2010-04-01 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| WO2016194120A1 (en) * | 2015-06-01 | 2016-12-08 | 三菱電機株式会社 | Light emitting device, display unit, and image display device |
-
1999
- 1999-04-13 JP JP11104787A patent/JP2000299502A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002141560A (en) * | 2000-10-31 | 2002-05-17 | Seiwa Electric Mfg Co Ltd | Led lamp and its manufacturing method |
| EP1276157A3 (en) * | 2001-06-27 | 2005-02-09 | Toyoda Gosei Co., Ltd. | Shielded reflective light-emitting device |
| US6886962B2 (en) | 2001-06-27 | 2005-05-03 | Toyoda Gosei Co., Ltd. | Shielded reflective light-emitting diode |
| US6939188B2 (en) | 2001-08-01 | 2005-09-06 | Sharp Kabushiki Kaisha | LED lamp configured to minimize image contrast |
| WO2010034281A1 (en) * | 2008-09-25 | 2010-04-01 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| CN102165502A (en) * | 2008-09-25 | 2011-08-24 | 奥斯兰姆奥普托半导体有限责任公司 | Optoelectronic component |
| US8668365B2 (en) | 2008-09-25 | 2014-03-11 | Osram Opto Semiconductors Gmbh | Optoelectronic device |
| CN102165502B (en) * | 2008-09-25 | 2016-03-02 | 奥斯兰姆奥普托半导体有限责任公司 | Opto-electronic device |
| WO2016194120A1 (en) * | 2015-06-01 | 2016-12-08 | 三菱電機株式会社 | Light emitting device, display unit, and image display device |
| JPWO2016194120A1 (en) * | 2015-06-01 | 2017-08-24 | 三菱電機株式会社 | Light emitting device, display unit, and video display device |
| US10256383B2 (en) | 2015-06-01 | 2019-04-09 | Mitsubishi Electric Corporation | Light emitting device with dark area and greater reflectance light area, display unit, and image display device |
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