JP2000286585A - High-frequency module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency module that can be soldered by reflow as in other packaging parts, without positional deviation of a shield cover in the high-frequency module with the shield cover for covering a local oscillator which is arranged on a substrate. SOLUTION: In this high-frequency module, a VCO block 2a including a local oscillator (voltage-controlled oscillator(VCO)) that is not illustrated is arranged on a substrate 2, and a shield cover 1 is arranged so that it covers the VCO block 2a. Then, on the substrate 2, a through-hole 2c that is a hole part for inserting a lead part 1c for positioning the shield cover 1 and a land part 2b that is soldered to a bending part 1b of the shield cover 1 are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high-frequency module suitable for a mobile communication module, a high-frequency module for terrestrial or satellite broadcasting such as a television receiver and a VTR.

[0002]

2. Description of the Related Art Generally, a high frequency module used for a mobile communication module, a high frequency module for terrestrial or satellite broadcasting such as a television receiver and a VTR, and the like, is a substrate (motherboard) of an electric device of a main body due to its nature. And for mounting, you need an interface. Conventionally, as the interface, a pin-shaped interface, a flexible board, or a female connector and a paired pin have been used.

One example is shown in FIG. In the example shown in FIG. 4, the high-frequency module 10
1 is connected to the motherboard 20. And
The entire high-frequency module 10 is covered by a shield case 21, and the shield case 21 is connected by ground pins or terminals 22. Further, each connection part is soldered by a soldering part 23.

[0004] In the configuration shown in FIG. 4, the ground for high frequency grounding is to manually solder the grounding pin or terminal 22 of the shield case 21 to the motherboard 20. Sex was impaired.

Further, as shown in FIG. 4, the high-frequency module 10 includes a board, various circuit components, a shield case 11
High-frequency module 1
There is also a problem that the thickness is inevitably increased due to the thickness X of the zero itself and the clearance Y required for the interface. In the configuration shown in FIG. 4, since the whole is shielded, unnecessary parts are also shielded.
Parts requiring shielding (for example, local oscillator (VCO)
Etc.) is degraded.

In the high-frequency module 10, a local oscillator (voltage-controlled oscillator:
VCO), as shown in FIG.
VCO block 10a which is a circuit block including a VCO
In some cases, a VCO shield cover 11 made of metal or the like is provided around the device to shield unnecessary radiation signals to external devices and components.

In FIG. 5, a lead portion is provided on the VCO shield cover 11, which is inserted into the through hole 12c of the high-frequency module substrate 12 and soldered. Further, as shown in FIG. 6, there is a type in which a land portion 12b is provided on a high-frequency module substrate 12, and a VCO shield cover 11 is disposed thereon and soldered. In any case, VCO shield cover 1
The soldering of 1 also involves manual soldering.

[0008] In order to solve the above thickness problem,
Although it is conceivable that only the VCO block 10a is shielded, a manual soldering step is required at the time of mounting on the motherboard 20.
It was common to cover the whole with a metal shield case 21.

[0009] Japanese Patent Application Laid-Open No. 7-14749 discloses that
As shown in FIGS. 7 and 8, when a circuit part 30 a of a part of the substrate 32 on which the mounting parts 30 are mounted is covered with the shield case 31 and the cover 31 ′, the circuit part 30 a faces the shield case 31 on the mounting surface of the substrate 32. There is disclosed one provided with a bent portion 31a that comes into contact with the other. In FIG. 8, 3
3 is a soldering part. According to this, the shield case 31 can be reflow-soldered similarly to the other mounted components 30.

[0010]

However, the shield case 31 is not positioned in the structure described in Japanese Patent Application Laid-Open No. H07-14749. Therefore,
If surface mounting is performed by reflow soldering, the shield case 31 may be displaced from a correct position on the substrate, and mounting at a uniform position during mass production becomes difficult.

On the other hand, in the conventional high-frequency module,
Since the VOC shield cover 21 is manually soldered, a metal plate having a thickness of, for example, 0.4 mm is used so that the VOC shield cover 21 does not change due to the stress at the time of manual mounting, and the material cost is high. In addition, there was a problem of the thickness as described above.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and in a high-frequency module having a shield cover for covering a local oscillator disposed on a substrate, the shield cover may be displaced. It is another object of the present invention to provide a high-frequency module that can be soldered by reflow, similarly to other mounted components.

[0013]

According to the first aspect of the present invention, there is provided a high-frequency module including a shield cover for covering a local oscillator disposed on a substrate. It has a bent portion facing the mounting surface and is in contact with the mounting surface, and the bent portion has a positioning projection inserted into the hole of the substrate.

According to the first aspect of the present invention, the shield cover has the bent portion facing the mounting surface of the substrate and the positioning projection inserted into the hole of the substrate is provided on the bent portion. With this configuration, the shield cover soldering step, which has been conventionally performed manually, can be performed by reflow soldering similarly to other mounted components without displacing the shield cover. Therefore,
By eliminating the manual soldering of the shield cover, the manufacturing process can be greatly improved and the manufacturing cost can be reduced.

Furthermore, in the invention according to claim 2, in the high-frequency module, the shield cover is made of a metal plate having a thickness of about 0.2 mm.

According to the second aspect of the present invention, the shield cover is made of a metal plate having a thickness of about 0.2 mm. The weight can be reduced. In addition, as a metal plate used for the shield cover, a tin plate, a copper plate, or the like can be used, or a turn sheet in which the surface of a steel plate is subjected to hot-dip plating to form a plated layer may be used.

According to the third aspect of the present invention, in the high-frequency module, an end face through-hole substrate is used as a substrate.

According to the third aspect of the present invention, since an end face through-hole substrate is used as the substrate,
The high-frequency module can be directly surface-mounted on a substrate for electronic equipment without using an interface as in the related art, and the thickness can be reduced. Furthermore, it is also possible to perform soldering simultaneously with reflow soldering of the electronic device substrate itself.

According to the fourth aspect of the present invention, in the high-frequency module, the length of the portion of the positioning projection inserted into the substrate is shorter than the thickness of the substrate.

According to the fourth aspect of the present invention, since the length of the portion of the positioning projection inserted into the substrate is shorter than the thickness of the substrate, the positioning projection protrudes from the rear surface of the substrate. Thus, surface mounting can be performed without the need to provide a mounting hole in the electronic device substrate, and the size of the electronic device using the same can be reduced.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a shield cover used in the high-frequency module according to the present embodiment. The shield cover 1 has a rectangular shape, and has a bent portion 1a on each of its four sides facing the mounting surface of the substrate, and a lead portion 1c as a positioning projection inserted into a hole of the substrate. It is provided at the end of each bent portion 1b.

FIG. 2 shows a state in which the shield cover 1 shown in FIG. 1 is arranged on a substrate. In FIG. 2,
(A) is a sectional side view of a main part, (b) is a top view, and (c) is an enlarged view of a portion A of (a). As shown in FIG. 2, in the high-frequency module according to this embodiment, a VCO block 2a including a local oscillator (not shown) (hereinafter, referred to as a VCO) is arranged on a substrate 2, and a shield is provided so as to cover the VCO block 2a. A cover 1 is arranged. The positioning lead 1c of the shield cover 1 is provided on the substrate 2.
Is inserted into the through hole 2c, and the land 2 is soldered to the bent portion 1b of the shield cover 1.
b is formed.

The hole into which the positioning lead 1c of the shield cover 1 is inserted may not be a through-hole but may be formed by NC processing. In FIG. 2B, the portions of the land portions 2b and the through holes 2c that are hidden by the shield cover 1 and are not actually visible are drawn with solid lines for easy understanding.

Further, in this embodiment, as shown in FIG. 2C, the positioning lead 1c of the shield cover 1 is used.
The length of the part to be inserted into the substrate 2 is shorter than the thickness of the substrate 2. That is, in the present embodiment, as the substrate,
Use a 1.2 mm thick positioning lead 1c
Is 0.6 mm in length. Thus, the positioning lead 1c does not protrude from the back surface of the substrate 2. In FIG. 2C, reference numeral 3 denotes a soldering portion.

In the present embodiment, the shield cover 1
Used is a metal plate having a thickness of about 0.2 mm. In addition, a tin plate, a turn sheet, a copper plate, or the like can be used as the metal plate.

According to the present embodiment, in the above-described configuration, the wiring assembly can be completed by a single reflow soldering process for all the mounted components including the shield cover 1, and the conventional reflow and flow processes can be performed a plurality of times. And the manual soldering process was greatly simplified. Further, at this time, there was no displacement of the shield cover.

FIG. 3 is a perspective view showing how the shield cover 1 of the present embodiment is soldered to a substrate. As shown in FIG. 3, in this embodiment, the bent portions 1b provided on the four sides of the shield cover 1 have a large area, come into contact with the mounting surface of the board, and are soldered by the soldering portions 3 '. , A sufficient contact area can be obtained, and a good grounding effect can be obtained. Such soldering can be surface-mounted by reflow similarly to other mounted components. Further, the fixing strength of the shield cover 1 becomes strong. Note that the substrate is not shown in FIG.

According to this embodiment, since the shield cover can be surface-mounted as described above, the amount of solder in the soldered portion is uniform, and variations in high-frequency characteristics sensitive to ground performance can be reduced. Further, since the contact portion between the shield cover and the substrate can be made large, a strong grounding performance can be achieved in terms of high frequency.

Although not shown, an end face through-hole substrate may be used as the substrate 2. The end-face through-hole board is a board in which the through-holes are arranged on the end face of the board.
It can be directly surface-mounted on an electronic device substrate (motherboard) without using an interface as in the related art, and can be reduced in thickness. Furthermore, it is also possible to perform soldering simultaneously with reflow soldering of the electronic device substrate (motherboard) itself.

Then, in soldering to the electronic device substrate (motherboard), it is possible to perform surface mounting by reflow once for all mounted components including the high-frequency module.

[0032]

As described above, according to the first aspect of the present invention, the shield cover has the bent portion that is opposed to and contacts the mounting surface of the substrate, and the positioning protrusion is inserted into the hole of the substrate. Part is provided at the end of the bent part, so the shield cover soldering process, which was conventionally performed manually, can be performed by reflow soldering like other mounted parts without displacing the shield cover. It is possible to do. Therefore, the manual soldering of the shield cover is eliminated, and the manufacturing process can be greatly improved, and the manufacturing cost can be reduced. That is, VC
All parts, including the O-shield case, can be surface-mounted, and the cost can be reduced by high-efficiency production by mounting all parts by machine.

Further, in the invention according to claim 2, in the high-frequency module, the shield cover is made of a metal plate having a thickness of about 0.2 mm.

According to the second aspect of the present invention, the shield cover is made of a metal plate having a thickness of about 0.2 mm. The weight can be reduced. In addition, as a metal plate used for the shield cover, a tin plate, a copper plate, or the like can be used, or a turn sheet in which the surface of a steel plate is subjected to hot-dip plating to form a plated layer may be used.

According to the third aspect of the present invention, in the high-frequency module, an end face through-hole substrate is used as a substrate.

According to the third aspect of the present invention, since the end face through-hole board is used as the board,
The high-frequency module can be directly surface-mounted on a substrate for electronic equipment without using an interface as in the related art, and the thickness can be reduced. Furthermore, it is also possible to perform soldering simultaneously with reflow soldering of the electronic device substrate itself. Therefore, when components are mounted on the electronic device substrate, the high-frequency module can also be soldered by reflow at the same time, and the cost can be reduced by high-efficiency production by mounting all components by a machine.

According to the fourth aspect of the present invention, in the high-frequency module, the length of a portion of the positioning projection inserted into the substrate is shorter than the thickness of the substrate.

According to the fourth aspect of the present invention, since the length of the portion of the positioning projection inserted into the substrate is shorter than the thickness of the substrate, the positioning projection protrudes from the rear surface of the substrate. Thus, surface mounting can be performed without the need to provide a mounting hole in the electronic device substrate, and the size of the electronic device using the same can be reduced. That is, for example, if a mobile phone is configured using a high-frequency module to which the present invention is applied, the thickness can be reduced. In addition, since it is not necessary to provide a mounting hole in the electronic device substrate, it is possible to arrange button keys, a liquid crystal display, and the like on the back surface of the high frequency module mounting surface of the electronic device substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a shield cover according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a high-frequency module according to an embodiment;
(A) is a side cross-sectional view of a main part thereof, (b) is a top view thereof,
(C) is an enlarged view of the part A of (a).

FIG. 3 is a perspective view showing a state where the shield cover shown in FIG. 1 is soldered.

FIG. 4 is a side sectional view of a main part showing a state where a conventional high-frequency module is arranged on a motherboard (substrate for electronic equipment).

FIG. 5 is a side sectional view of a main part of a conventional high-frequency module.

FIG. 6 is a side sectional view of a main part of a conventional high-frequency module.

FIG. 7 is a perspective view showing a conventional shield case.

FIG. 8 is a partially enlarged side sectional view of the shield case shown in FIG. 7;

[Explanation of symbols]

 Reference Signs List 1 shield cover 1b bent portion 1c positioning lead portion 2 substrate 2a VCO block 2b through hole 2c land portion

Claims (4)

[Claims] 1. A high-frequency module comprising a shield cover for covering a local oscillator disposed on a substrate, wherein the shield cover has a bent portion facing and in contact with a mounting surface of the substrate, and a hole in the substrate. A high-frequency module, wherein a positioning projection to be inserted is provided on the bent portion. 2. The shield cover has a thickness of about 0.2 m.
The high-frequency module according to claim 1, wherein the high-frequency module is made of a metal plate having a thickness of m. 3. The high-frequency module according to claim 1, wherein an end face through-hole substrate is used as said substrate. 4. The high-frequency module according to claim 1, wherein a length of a portion of the positioning projection inserted into the substrate is shorter than a thickness of the substrate.