JP2000286443A5 - - Google Patents

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JP2000286443A5
JP2000286443A5 JP1999089007A JP8900799A JP2000286443A5 JP 2000286443 A5 JP2000286443 A5 JP 2000286443A5 JP 1999089007 A JP1999089007 A JP 1999089007A JP 8900799 A JP8900799 A JP 8900799A JP 2000286443 A5 JP2000286443 A5 JP 2000286443A5
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semiconductor region
conductivity type
receiving element
light receiving
epitaxial
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JP1999089007A
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JP2000286443A (en
JP3919378B2 (en
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【0020】
【課題を解決するための手段】
上記の課題を解決するために、本発明は、図5に示すように、半導体基板517上に設けられた第1導電型の第1エピタキシャル半導体領域519と、上記第1エピタキシャル半導体領域519内に設けられた第2導電型の第2半導体領域501、502、503と、上記第2半導体領域501、502、503上に設けられた第1導電型の第3半導体領域520と、上記第2半導体領域501、502、503に直接接続され、該第2半導体領域の電位を制御する電極領域511と、を有することを特徴とする。
[0020]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, as shown in FIG. 5, according to the present invention, a first epitaxial semiconductor region 519 of the first conductivity type provided on a semiconductor substrate 517 and the first epitaxial semiconductor region 519 are provided. A second semiconductor region 501, 502, 503 of the second conductivity type, a third semiconductor region 520 of the first conductivity type provided on the second semiconductor region 501, 502, 503, and the second semiconductor And the electrode region 511 which is directly connected to the regions 501, 502, and 503 and controls the potential of the second semiconductor region.

【0025】
また、本発明は、受光素子と、上記受光素子をリセットするリセット手段と、上記受光素子に蓄積された電荷を電圧信号に変換する電荷−電圧変換手段と、を有する光電変換装置において、上記受光素子は、上記半導体基板上に設けられた第1導電型の第1エピタキシャル半導体領域と、上記第1エピタキシャル半導体領域内に設けられた第2導電型の第2半導体領域と、上記第2半導体領域上に設けられた第1導電型の第3半導体領域と、上記第2半導体領域に直接接続され、該第2半導体領域の電位を制御する電極領域と、を有し、上記光電変換装置の暗時、及び飽和出力時において、上記第1エピタキシャル半導体領域519と上記第3半導体領域520の間の上記第2半導体領域501、502、503が空乏化していることを特徴とする。
[0025]
Further, the present invention includes a light-receiving element, and a reset means for resetting the light-receiving element, a charge converting the electric charge accumulated in the light receiving element into a voltage signal - in the photoelectric conversion device having a voltage converting means, and the light-receiving The device includes a first epitaxial semiconductor region of a first conductivity type provided on the semiconductor substrate, a second semiconductor region of a second conductivity type provided in the first epitaxial semiconductor region, and the second semiconductor region. A third semiconductor region of the first conductivity type provided thereon, and an electrode region directly connected to the second semiconductor region and controlling a potential of the second semiconductor region; At the time of saturation output, the second semiconductor regions 501, 502, 503 between the first epitaxial semiconductor region 519 and the third semiconductor region 520 are depleted. To.

Claims (9)

半導体基板上に設けられた第1導電型の第1エピタキシャル半導体領域と、
上記第1エピタキシャル半導体領域内に設けられた第2導電型の第2半導体領域と、
上記第2半導体領域上に設けられた第1導電型の第3半導体領域と、
上記第2半導体領域に直接接続され、該第2半導体領域の電位を制御する電極領域と、を有することを特徴とする受光素子。
A first epitaxial semiconductor region of a first conductivity type provided on a semiconductor substrate;
A second semiconductor region of a second conductivity type provided in the first epitaxial semiconductor region ;
A third semiconductor region of the first conductivity type provided on the second semiconductor region;
And an electrode region directly connected to the second semiconductor region to control the potential of the second semiconductor region.
上記電極領域は、第2導電型の第4半導体領域であり、かつ該第4半導体領域と電気的に接続された配線手段を有することを特徴とする請求項1記載の受光素子。The light receiving element according to claim 1, wherein the electrode region is a fourth semiconductor region of the second conductivity type, and has a wiring means electrically connected to the fourth semiconductor region. 上記受光素子は、遮光層で規定される開口部を有し、
かつ上記第2半導体領域及び上記第3半導体領域の少なくとも一部は上記開口部内に設けられていることを特徴とする請求項1又は請求項2記載の受光素子。
The light receiving element has an opening defined by a light shielding layer,
The light receiving element according to claim 1 or 2, wherein at least a part of the second semiconductor region and the third semiconductor region is provided in the opening.
上記半導体基板は第2導電型であり、かつ上記第1エピタキシャル半導体領域の周囲に第2導電型の第5半導体領域を有することを特徴とする請求項1又は請求項2記載の受光素子。The light receiving element according to claim 1 or 2, wherein the semiconductor substrate is of a second conductivity type, and a fifth semiconductor region of a second conductivity type is provided around the first epitaxial semiconductor region. 上記半導体基板は第1導電型であり、かつ上記半導体基板と上記第1エピタキシャル半導体領域間に第1導電型の第6半導体領域を有し、該第6半導体領域の不純物濃度は上記半導体基板、及び上記第1エピタキシャル半導体領域よりも高いことを特徴とする請求項1又は請求項2記載の受光素子。The semiconductor substrate is of a first conductivity type, and has a sixth semiconductor region of a first conductivity type between the semiconductor substrate and the first epitaxial semiconductor region, and the impurity concentration of the sixth semiconductor region is the semiconductor substrate, The light receiving element according to claim 1, wherein the light receiving element is higher than the first epitaxial semiconductor region. 受光素子と、
上記受光素子をリセットするリセット手段と、
上記受光素子に蓄積された電荷を電圧信号に変換する電荷−電圧変換手段と、を有する光電変換装置において、
上記受光素子は、
上記半導体基板上に設けられた第1導電型の第1エピタキシャル半導体領域と、
上記第1エピタキシャル半導体領域内に設けられた第2導電型の第2半導体領域と、
上記第2半導体領域上に設けられた第1導電型の第3半導体領域と、
上記第2半導体領域に直接接続され、該2半導体領域の電位を制御する電極領域と、を有し、
上記光電変換装置の暗時、及び飽和出力時において、
上記第1エピタキシャル半導体領域と上記第3半導体領域の間の上記第2半導体領域が空乏化していることを特徴とする光電変換装置。
A light receiving element,
Reset means for resetting the light receiving element;
A photoelectric conversion device having charge-voltage conversion means for converting the charge accumulated in the light receiving element into a voltage signal;
The light receiving element is
A first epitaxial semiconductor region of a first conductivity type provided on the semiconductor substrate;
A second semiconductor region of a second conductivity type provided in the first epitaxial semiconductor region ;
A third semiconductor region of the first conductivity type provided on the second semiconductor region;
It is directly connected to the second semiconductor region having an electrode region for controlling the potential of said second semiconductor region, and
In the dark and saturated output of the photoelectric conversion device,
A photoelectric conversion device characterized in that the second semiconductor region between the first epitaxial semiconductor region and the third semiconductor region is depleted.
上記受光素子は遮光層で規定される開口部を有し、かつ上記第2半導体領域及び上記第3半導体領域の少なくとも一部は上記開口部内に設けられていることを特徴とする請求項6記載の光電変換装置。The light receiving element has an opening defined by a light shielding layer, and at least a part of the second semiconductor region and the third semiconductor region is provided in the opening. Photoelectric conversion device. 上記半導体基板は第2導電型であり、かつ上記第1エピタキシャル半導体領域の周囲に第2導電型の第5半導体領域を有することを特徴とする請求項6又は請求項7記載の光電変換装置。8. The photoelectric conversion device according to claim 6, wherein the semiconductor substrate is of a second conductivity type, and a fifth semiconductor region of a second conductivity type is provided around the first epitaxial semiconductor region. 上記半導体基板は第1導電型であり、かつ上記半導体基板と上記第1エピタキシャル半導体領域間に第1導電型の第6半導体領域を有し、上記第6半導体領域の不純物濃度は、上記半導体基板、及び上記第1エピタキシャル半導体領域よりも高いことを特徴とする請求項6又は請求項7記載の光電変換装置。The semiconductor substrate is of a first conductivity type, and has a sixth semiconductor region of a first conductivity type between the semiconductor substrate and the first epitaxial semiconductor region, and the impurity concentration of the sixth semiconductor region is the semiconductor substrate The photoelectric conversion device according to claim 6, wherein the photoelectric conversion device is higher than the first epitaxial semiconductor region.
JP08900799A 1999-03-30 1999-03-30 Light receiving element and photoelectric conversion device using the same Expired - Fee Related JP3919378B2 (en)

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JP2000286443A5 true JP2000286443A5 (en) 2004-12-16
JP3919378B2 JP3919378B2 (en) 2007-05-23

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US7633134B2 (en) * 2005-12-29 2009-12-15 Jaroslav Hynecek Stratified photodiode for high resolution CMOS image sensor implemented with STI technology
JP2013021014A (en) 2011-07-07 2013-01-31 Canon Inc Manufacturing method of energy ray detection apparatus
JP6025750B2 (en) * 2011-12-27 2016-11-16 キヤノン株式会社 Imaging device
JP2020123717A (en) * 2019-01-30 2020-08-13 シャープ株式会社 Solid-state imaging device

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