JP2000280126A - Part feeder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain large suction force even if the capacity of a cylinder serving as a driving source for part feed is small. SOLUTION: When a lever 80 for an air cylinder oscillates in an anti-clockwise direction and a piston rod 66 is forced into an air cylinder 62, the capacity of a rod side cylinder chamber 68 increases and the air in a chute 12 flows into the cylinder chamber 68 through a part suction conduit 22, a check valve 26 for vacuum suction, and a vacuum suction conduit 20 for forward movement. When the rod 66 is protruded from the air cylinder 62, the capacity of a cylinder chamber 70 on a head side increases and the air in the chute 12 flow into the cylinder chamber 70 through the part suction conduit 22, a check valve 33 for vacuum suction, and a vacuum suction pipe 29 for back ward movement to feed a part 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply apparatus for sucking components arranged in a chute by a negative pressure generated in a cylinder by moving a piston rod and transferring the components to a component pick-up position.

[0002]

2. Description of the Related Art An extremely wide variety of chip components are mounted on a printed circuit board. At this time, an automatic chip component mounting device (chip component) is required to transport and mount (mount) the chip components on the printed circuit board. Automatic mounting device) is used. In order to supply chip components to the chip component automatic mounting device, a component supply device is required.

[0003] Japanese Patent Application Laid-Open No. 8-48 discloses this component supply device.
No. 419 is known. The component supply device described in this publication arranges a large number of chip components in a bulk state in a line, and then sends the chip components to a predetermined position by a component transport belt provided in a guide groove extending in a horizontal direction. . In this device,
A stopper is provided at the front end of the guide groove, and when the chip component on the belt moves forward together with the belt, the stopper is brought into contact with the front end of the guide groove to stop the leading chip component at a predetermined position, and the leading chip component stops at the stopper. When the movement of the whole component is stopped by contact, the second chip component is moved forward while being held by the permanent magnet of the stopper while the second chip component is pressed against the inner wall by the component holding pin and held at that position. A space is forcibly formed between the first chip component and the first chip component so that the leading chip component can be taken out favorably.

[0004]

The conventional component feeder configured as described above has the following problems.

[0005] First, Japanese Patent Application Laid-Open No. Hei 8
In JP-A-48419, it is difficult to maintain the flatness of the belt, and therefore it is difficult to precisely maintain the height of the inner wall of the guide groove. As a result, it becomes impossible to accurately maintain the chip component in the guide groove,
There arises a problem that parts standing, parts overlapping and the like are likely to occur. In particular, in the case of transporting extremely thin chip components such as extremely small chip components, for example, 1 mm (length) × 0.5 mm (width) × 0.35 mm (thickness) chip components (so-called 1005 size). Such a problem is likely to occur.

Further, dust, dust, solder debris and the like easily adhere to the component transport belt, so that the chip component cannot be transported stably, and there is a problem in maintenance and maintenance.

If a delay occurs in the alignment speed of chip components in the guide groove, the component transport belt is moving at a predetermined constant speed. Cannot be regained. For this reason, this type is not suitable for speeding up.

For this reason, a technique has been conceived in which a conduit for sucking parts is connected to the cylinder, and the parts arranged on the chute are sucked and conveyed by the negative pressure generated in the cylinder. However, in order to obtain a predetermined suction force, a certain capacity of the cylinder is required, and it is necessary to use a considerably large cylinder depending on the size of the component to be suctioned. Accordingly, an object of the present invention is to provide a large suction force even when the capacity of a cylinder, which is a driving source for supplying components, is small.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to a piston rod that moves and sucks a part aligned in a chute by a negative pressure generated in a cylinder to move the part to a part removal position. In the parts supply device to be transported,
A forward vacuum suction conduit communicating with the cylinder so that components in the chute can be supplied to a component pick-up position by a negative pressure generated during the forward movement of the piston rod; and a negative pressure generated in the cylinder when the rod returns. A return vacuum suction conduit communicating with the cylinder is provided so that components in the chute can be supplied by pressure.

[0010] Because of this, the parts can be sucked even when the rod is double-acted.

In the present invention, preferably, a check valve for vacuum suction is connected to each of the vacuum suction pipe at the time of forward movement and the vacuum suction pipe at the time of backward movement, and a cylinder side of the vacuum suction check valve of each vacuum suction pipe. And an air release conduit connected to the air release check valve.

Further, in the present invention, preferably, the forward-moving vacuum suction conduit and the backward-moving vacuum suction conduit are connected to each other to be opened as a single component suction conduit near a component take-out position of the chute.

With this configuration, only one suction port for the component can be provided, and the component can be transported stably.

[0014]

Embodiments of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, reference numeral 1 denotes a component supply device according to an embodiment of the present invention, and the component supply device 1 includes a housing 2. Above the inside of the housing 2, a first component storage chamber 4 for storing chip components 5 in a bulk state in a three-dimensional space is formed. An opening is formed on the upper end side of the first component storage chamber 4, and the opening is closed by the lid 6. In the first component storage chamber 4, a large number (typically thousands to tens of thousands) of chip-shaped electronic components 5 are placed from a component storage case (not shown) in a lid 6.
Opened and stored in advance. Here, the chip component 5
Is a generally rectangular parallelepiped component, for example, a chip capacitor or a chip resistor (for example, length L × width W
× thickness T = 1.0 mm × 0.5 mm × 0.35 mm).

A plurality of chip components 5 are stored below the first component storage chamber 4 and along the front side of the housing 2 in a two-dimensional space where the components do not overlap each other in the component thickness direction. A two-part storage chamber 8 is formed. further,
A chute for aligning chip components 5 in a line in a space formed so as to conform to the cross-sectional shape of the components and moving the chip components 5 downwardly below the second component storage chamber 8 and along the front side of the housing 2. 10 are formed. This shoot 1
At the lower end of 0, a chute 12 for moving the chip component 5 to a predetermined position in the horizontal direction is connected and provided.

The bottom surface portion 14 of the first component storage chamber 4 forming the three-dimensional component arrangement space is formed to be inclined to such an extent that the chip component 5 can slide down by its own weight.

A reciprocating motion in a vertical direction is provided in a space which communicates with the first component storage chamber 4, the second component storage chamber 8, and the chute 10 and is formed along a plane perpendicular to the feeding direction of the chip component 5. An alignment plate 16 is provided.

Here, as shown in FIG.
Is mounted in the housing 2 so that the posture of the chip component 5 is moved downward by its own weight without twisting in the chip component sending direction, and is guided to the chute 12.

Further, the chute 12 is connected to the upper block 5.
6 and the lower block 58. At the time of vacuum suction to be described later, it is sealed so that air does not leak to the outside.

Here, as shown in FIG. 2, on the supply side of the chip component 5 of the component supply device 1, an automatic chip component mounting device (automatic mounting device) 74 is arranged. A nozzle 76 for receiving the chip component 5 is provided below the main body of the automatic mounting device 74. An actuator arm 78 is provided at the lower part of the main body of the chip component automatic mounting device 74. The actuator arm 78 synchronizes with the operation of the chip component automatic mounting device 74 and synchronizes with the alignment plate 16 and the vacuum suction mechanism 60 described later.
Is to be driven.

As shown in FIG. 2, below the actuator arm 78, an air cylinder lever 8 described later is provided.
0, and the air cylinder lever 80
Below, is provided an alignment plate lever 160 for moving the alignment plate 16 up and down. The alignment plate lever 160 rotates about a fulcrum 162. The lower end of a slide guide 164 that moves up and down is connected to the right end of the alignment plate lever 160. The upper end of the slide guide 164 is connected to the alignment plate 16.

As described above, the actuator arm 78 also moves up and down in synchronism with the up and down movement of the nozzle 76 for receiving the chip component 5, and from the up and down movement of this actuator arm 78 via the air cylinder lever 80, the lever for the alignment plate is used. 160 rotates, whereby the slide guide 164 moves up and down, and as a result, the alignment plate 16 moves up and down.

Next, a vacuum suction mechanism 60 for feeding the chip component 5 from the chute 12 to a component pick-up position by a vacuum suction force will be described with reference to FIGS.

The vacuum suction mechanism 60 includes an air cylinder 6
2 is provided. The air cylinder 62 includes a piston head 64, a piston rod 66 connected to the piston head 64, a rod-side cylinder chamber 68 partitioned by the piston head 64, and a head-side cylinder chamber 70.
And a spring 72 for urging the piston rod 66 to extend out of the cylinder chamber. The piston rod 66 has a distal end 66a at a distal end opposite to the head side.

Next, a substantially T-shaped air cylinder lever 80 is attached to the housing 2 via a fulcrum 82 below the actuator arm 78, and can rotate about the fulcrum 82. I have. A spring 84 is attached to the lower side of the air cylinder lever 80, and urges it clockwise. A stopper 86 prevents the air cylinder lever 80 from rotating beyond a predetermined position due to the urging force of the spring 84.

The rod-side cylinder chamber 6 of the air cylinder 62
8 is connected to one end of a forward-moving vacuum suction conduit 20, and the other end of the forward-moving vacuum suction conduit 20 is connected to the chute 12 by a suction port 21 provided in the vicinity of a component take-out position of the chute 12. The component is connected to the component suction conduit 22.

The forward-moving vacuum suction conduit 20 branches off on the way to form an open-to-atmosphere conduit 24. A vacuum suction check valve 26 is provided on the chute 12 side of this branch of the vacuum suction conduit 20 at the time of forward movement to flow air from the chute 12 to the rod side cylinder chamber 68 and prevent air from flowing back to the chute 12. Have been. Open air conduit 2
A check valve 27 for releasing air from the rod-side cylinder chamber 68 to the atmosphere and preventing the air from flowing in the opposite direction is provided in the cylinder 4. The head-side cylinder chamber 70 is connected to the return-time vacuum suction conduit 30.
Air is introduced into the chamber and air is discharged to the atmosphere. The other end of the vacuum suction conduit 29 at the time of return is also connected to the suction port 21 provided near the part taking-out position of the chute 12.
Component suction conduit 22 connected to chute 12 by
Is in communication with

The return-time vacuum suction conduit 29 branches off on the way to form an open-to-atmosphere conduit 31. A vacuum suction check valve 33 for flowing air from the chute 12 to the head-side cylinder chamber 70 and preventing the air from flowing back to the chute 12 is provided on the chute 12 side of the branch of the vacuum suction conduit 29 at the time of the backward movement. Have been. Open air conduit 3
1 is provided with a check valve 34 for releasing the air from the head side cylinder chamber 70 to the atmosphere side so as not to flow in the opposite direction.

Next, the operation of the present embodiment configured as described above will be described.

The vertical movement of the actuator arm 78 causes the alignment plate 16 to move up and down via the alignment plate lever 160 and the slide guide, aligning the chip components 5, and setting the first position.
It is moved from the component storage chamber 4 to the chute 10.

Next, the chip component 5 guided to the chute 10 falls in the chute 10 by its own weight, and
Move on to 2.

On the other hand, the vacuum suction mechanism 60 operates as follows.

That is, when the actuator arm 78 of the automatic chip component mounting device 74 is lowered from the position shown in FIG. 2, the lower end of the actuator arm 78 contacts the upper end of the air cylinder lever 80 and is pushed downward.
As a result, the lever 80 rotates counterclockwise, and the lever 8
The lower end of 0 pushes the tip 66a of the piston rod 66. As a result, the piston rod 66
2 to the right in FIG. At this time, the air in the head-side cylinder chamber 70 is exhausted from the conduit 29 to the atmosphere through the atmospheric release check valve 34 of the conduit 31. As the volume of the rod-side cylinder chamber 68 increases, the inside thereof becomes vacuum (negative pressure), whereby the air in the chute 12 is sucked through the suction port 21 and the component suction conduit 22, the check valve 26 and At the time of forward movement, it is introduced into the rod side cylinder chamber 68 via the vacuum suction conduit 20. In this way, the air in the chute 12 is sucked, and the chute 12
The chip component 5 is sent out to the vicinity of the take-out position.
Thereafter, when the actuator arm 78 is raised, the air cylinder lever 80 is rotated clockwise by the urging force of the spring 84 and stopped at a predetermined position by the stopper 86. When the lever 80 rotates clockwise and returns, the piston rod 66 moves to the left by the urging force of the spring 72. At this time, the air in the rod-side cylinder chamber 68 is pressed by the piston head 64 and discharged to the atmosphere via the check valve 27 and the conduit 24. On the other hand, the head side cylinder chamber 70
As the volume increases, the inside of the chute 12 becomes vacuum (negative pressure), whereby the air in the chute 12 is sucked through the suction port 21 and the component suction conduit 22, the check valve 33 and the vacuum suction at the time of return operation. It is introduced into the head side cylinder chamber 70 via the conduit 29. In this way, shoot 1
When the air in the chute 2 is sucked, the chip components 5 in the chute 12 are sent out to near the take-out position by the flow of the air.

That is, the vertical movement of the actuator arm 78 causes the air cylinder lever 80 to swing counterclockwise and further swings clockwise to a position regulated by the stopper 86, while the air cylinder lever 80 remains in the chute 12. The aligned chip components 5 continue to be sucked.

As described above, when the actuator arm 78 of the automatic chip component mounting device 74 moves up and down, the chip component 5 in the chute 12 is continuously fed out to the vicinity of the pick-up position by the vacuum suction mechanism 60.

Therefore, it is possible to transport the component 5 twice as long as the case where the component 5 is transported by vacuum suction of only the vacuum suction conduit 20 at the time of forward movement, and it is possible to cope with suction of a large component 5. . Alternatively, the capacity of the cylinder chambers 68 and 70 can be reduced if the suction is performed for the same time.

Next, the tip chip component 5 conveyed to the component removal position is taken out by lowering the nozzle 76, and the component 5 is mounted at a desired position on a printed board (not shown).

[0039]

As described above, according to the chip supply apparatus of the present invention, chip parts can be optimally and quickly conveyed and supplied to the chip part automatic mounting apparatus, and maintenance and maintenance are easy and cost is reduced. . Further, chip components can be supplied by utilizing the operation of the chip component automatic mounting device without using an additional drive source.

Further, a large suction force can be obtained without increasing the size of a cylinder serving as a drive source for conveying components.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a vacuum suction mechanism of a component supply device to which the present invention is applied.

FIG. 2 is a front view showing a component supply device to which the present invention is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component supply apparatus 10 Chute 12 Chute 20 Vacuum suction conduit at the time of forward movement 22 Parts suction conduit 24 Atmospheric release conduit 26 Check valve for vacuum suction 27 Check valve for atmospheric release 29 Vacuum suction conduit at the time of return 31 Atmospheric release conduit 33 For vacuum suction Check valve 34 Check valve for opening to atmosphere 60 Vacuum suction mechanism 62 Air cylinder 66 Piston rod

Continued on the front page F term (reference) 3C030 AA01 AA11 5E313 AA03 AA21 CC02 CC09 DD01 DD02 DD06 DD10 DD11 DD22 DD23 DD42 EE24 FF04 FF07

Claims (3)

[Claims] 1. A component supply device for sucking components arranged in a chute by a negative pressure generated in a cylinder by moving a piston rod and transporting the components to a component pick-up position. A forward vacuum suction conduit communicating with the cylinder so that the components in the chute can be supplied to the component pick-up position by pressure, and a component in the chute can be supplied by a negative pressure generated in the cylinder when the rod moves back. And a return-time vacuum suction conduit communicating with the cylinder. 2. A check valve for vacuum suction is connected to each of the vacuum suction pipe at the time of forward movement and the vacuum suction pipe at the time of backward movement, and a check for opening the atmosphere to the cylinder side from the vacuum suction check valve of each vacuum suction pipe. 2. The valve according to claim 1, wherein the valve is connected to an atmosphere opening conduit.
The component supply device according to any one of the above. 3. The vacuum suction conduit at the time of forward movement and the vacuum suction conduit at the time of backward movement are connected so as to open as a single component suction conduit in the vicinity of a component take-out position of the chute. Item 4. The component supply device according to item 1 or 2.