JP2001284889A - Chip component feeder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cheaply form a chip component carrying passage high in degree of design freedom and facilitate picking of a chip component. SOLUTION: The chip component feeder for arranging many chip components loaded in bulk in line and feeding them to an automatic chip component mounting apparatus comprises a component carrying passage 12 which is connected at the tail end to a component arranging passage 10, has a component pickup hole 200 at the top end and consists of drawn pipe; component carrying means 60 for applying a suction pressure of negative pressure air (or exhaust pressure of compressed air) in the passage 12 to carry the chip components near a component pickup hole; shutter mechanisms 102, 222 for closing the component pickup hole and opening it when picking up the chip component; and component separating mechanism 100 for separating the top end chip component from following chip components near the pickup hole of the carrying passage. This mechanism 100 comprises a component stopper 202, component positioning means 106 and moving means 208.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component supply device, and more particularly, to a chip component supply device in which a large number of chip components in a pile are arranged in a line and supplied to an automatic chip component mounting device.

[0002]

2. Description of the Related Art An extremely wide variety of chip components are mounted on a printed circuit board. At this time, an automatic chip component mounting device (chip component) is required to transport and mount (mount) the chip components on the printed circuit board. Automatic mounting device) is used. In order to supply chip components to the chip component automatic mounting device, a chip component supply device is required. This chip component supply device firstly performs an alignment operation for aligning a large number of chip components in a bulk state in a line, and a second operation.
Thirdly, three important operations are carried out, that is, a transport operation of transporting the aligned chip components to the component outlet, and thirdly, a separating operation of separating the chip components one by one and facilitating the removal at the component outlet. There must be.

[0003] As the transport operation, the chip component is sucked and transported by the suction pressure of the negative pressure air, or the chip component is transported by using the discharge pressure of the compressed air. The transport path is made slightly larger than the external dimensions of the chip component so as to improve the air flow and to absorb the accuracy error of the external dimensions of the chip component. As the transfer passage, a groove that has been precision-cut is widely used. Also, when the components are transported by suction with the suction pressure of the negative pressure air, the airtightness is increased so that there is no air leakage at the tip of the transport path, and after the components are transported, the opening is provided to take out the chip components. It is necessary to provide. Therefore, the transport path is to improve the airtightness, and to provide an opening for taking out parts,
Two contradictory objectives must be achieved.

Further, a series of operations for aligning, transporting, separating, and taking out chip components must be completed in a very short time of several tens of milliseconds. As a result, it is necessary to provide a component outlet while improving the sealing performance, and the component separating mechanism becomes complicated. Further, in the prior art, the positioning at the pick-up position of the chip component is not performed, or even if the positioning is performed, only the positioning in the component transport (delivery) direction is performed.

[0005]

The conventional chip component supply apparatus has the following problems. First, as the above-described transport operation, in the chip component supply device that suctions and transports chip components by suction pressure of negative pressure air or transports chip components by using discharge pressure of compressed air, air is supplied to the chip component supply device. An air passage is required, and an error in the accuracy of the outer dimensions of the chip component must be taken into account. For this reason, the cross-sectional dimension of the transfer path is made slightly larger than the outer dimensions of the chip component. For this reason, the chip components are ramped up in the transport path, and it is difficult to obtain component positioning accuracy at the component removal position. The part transport path is formed by machining using an end mill or the like to form a groove, or by attaching two metal plates with the same thickness as the chip component to the base member and between the plates. A groove is formed.

[0006] The external dimensions of the chip component are different in thickness between the capacitor and the resistor (register), and the size is also one.
005 size chip resistor (1 mm × 0.5 mm × 0.
35mm), 1005 size chip capacitor (1mm
× 0.5 mm × 0.5 mm). The plane size of the chip component is also 1005 (1 mm x 0.5 m
m), 1608 (1.6 mx 0.8 mm), 2012
(2.0 mm x 1.25 mm), 3216 (3.2 m x
There are many types such as 1.6 mm), and it is necessary to form grooves in accordance with the dimensions of such chip components.

[0007] The chip component automatic mounting device (chip mounter) for mounting the chip component supply device, the length of the transport path of the chip component, the mounting position of the transport path, and the like are all different. In many cases, machining is performed, and such a groove forming method has a problem that mass production cannot be performed, the cost is high, and the cost cannot be reduced by standardization.

[0008] Chip components are being developed in a direction of becoming smaller, and the size of the latest micro chip components is as follows.
0603 size chip capacitor (0.6mm × 0.3
mm × 0.3 mm) and 0603 size chip resistors (0.6 mm × 0.3 mm × 0.25 mm), and it is becoming more difficult to form grooves in the component transport path for such extremely small chip components. I have.

Therefore, the present invention has been made to solve the above-mentioned problems of the prior art, and there is no need to form a component conveying passage for chip components by machining, and it is inexpensive and has a high degree of design flexibility. An object is to provide a chip component supply device capable of forming a chip component transport passage. Still another object of the present invention is to provide a chip component supply device that facilitates taking out of a chip component by accurately positioning and separating the chip component at a component taking out position.

[0010]

In order to achieve the above object, the present invention provides a chip component supply device which arranges a large number of chip components in a bulk state in a line and supplies the chip components to a chip component automatic mounting device. A component storage chamber for accommodating a large number of chip components in a bulk state, a component alignment passage provided in communication with the component storage chamber for aligning the chip components in a line, and a terminal end connected to the component alignment passage. A component conveying passage made of a drawn and formed pipe having a component outlet at the tip end and a suction pressure of negative pressure air or a discharge pressure of compressed air acting in the component conveying passage to remove the chip component from the component outlet. A component transport means for transporting the component to the vicinity, a shutter mechanism for closing the component outlet and opening the component outlet for chip component removal, and a front end near the component outlet in the component transport path. A component separation mechanism for separating the chip component from a subsequent chip component, the component separation mechanism stopping the tip chip component near the component outlet, and a component transport path for the tip chip component And a moving means for moving at least a component stopper to separate a tip chip component from a subsequent chip component.

According to the present invention having the above-described structure, since the pipe is formed from the pultruded pipe,
This eliminates the need for conventional machining, and enables the formation of an inexpensive chip component transfer passage with high design flexibility. Further, when separating the tip chip component from the subsequent chip component, first, the tip chip component is stopped near the component outlet by the component stopper, and the tip chip component is moved by the component positioning means into the component transport path. Since it is positioned on one side of the component outlet and at least the component stopper is moved by the moving means to separate the tip chip component from the subsequent chip component, the chip component is accurately positioned and separated. In addition, the chip component can be easily taken out at the component take-out position.

In a preferred embodiment of the present invention, the component positioning means is a magnet disposed on an outer side surface of the component transport passage near the component outlet, and the component separating mechanism moves the component stopper and the magnet. Thereby, the tip chip component is separated from the subsequent chip component.

In another preferred embodiment of the present invention,
The component positioning means is a suction means for sucking and positioning the chip component with negative pressure air, and the component separating mechanism moves the component stopper in a state where the suction means sucks the chip component, so that the tip chip component is moved. Separated from subsequent chip components.

In another preferred embodiment of the present invention, the component positioning means is a magnet fixedly arranged on an outer side surface of the component transport passage near the component outlet, and the component separating mechanism moves the component stopper. By doing so, the tip chip component is separated from the subsequent chip component.

In another preferred embodiment of the present invention, the component transport means transports the chip component to the component outlet by applying a suction pressure of negative pressure air to the component transport path. It has a shield component that covers the outer surface including the component outlet of the transport passage so as to prevent the leakage of negative pressure air and acts as a shutter, and the shield component is made of a pipe, a molded component, or a ceramic sintered body. I have.

[0016]

Embodiments of the present invention will be described below with reference to the accompanying drawings. First, a first embodiment of a chip component supply device of the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, reference numeral 1 denotes a chip component supply device according to a first embodiment of the present invention, and the chip component supply device 1 includes a housing 2. Above the inside of the housing 2, a first component storage chamber 4 for storing chip components A in a piled state in a three-dimensional space.
Are formed. An opening is formed on the upper end side of the first component storage chamber 4, and the opening is closed by the lid 6. In the first component storage chamber 4, a large number (generally thousands to tens of thousands) of chip components A are stored in advance from a component storage case (not shown) with the lid 6 opened. Here, the chip component A is a component having a generally rectangular parallelepiped shape, and as an example, a chip capacitor or a chip resistor (for example, length L
X width W x thickness T = 1.0mm x 0.5mm x 0.35mm). FIG.
Indicates this chip resistor (chip component A).

A plurality of chip components A are stored below the first component storage chamber 4 and along the front side of the housing 2 in a two-dimensional space where the components do not overlap each other in the component thickness direction. A two-part storage chamber 8 is formed. further,
A component for aligning the chip components A in a row in a space formed so as to match the cross-sectional shape of the component, and moving the chip component A downwardly below the second component storage chamber 8 and along the front side of the housing 2. An alignment passage 10 is formed. At the lower end of the component alignment path 10, a component transport path 12 for horizontally moving the chip component A to a predetermined position is connected and provided. More specifically, the second component storage chamber 8
Is a plane orthogonal to the component transport direction F (housing 2
Front side). The thickness G of the second component storage chamber 8 (see FIG. 4) is a thickness corresponding to the thickness T of the chip component A shown in FIG. Here, the thickness T of the chip component A is the length L, the width W, and the thickness T in FIG.
Means the minimum value. Further, the bottom surface portion 14 of the first component storage chamber 4 forming the three-dimensional component arrangement space is formed to be inclined to such an extent that the chip component A can slide down by its own weight.

As shown in FIGS. 4 and 5, the first component storage chamber 4, the second component storage chamber 8, and the component alignment passage 10 are formed along a plane orthogonal to the feeding direction F of the chip component A. An alignment plate 16 that reciprocates up and down is provided in the space defined. The alignment plate 16 includes a first alignment portion 18 and a second alignment portion 20. The first alignment portion 18 has two wall members 22 provided separately from each other via a predetermined space in the component delivery direction. As shown in FIG. 4, the tip of the left wall member 22 has an inclined surface 22.
a is formed, and an inclined surface 22b which is a concave portion having a predetermined angle is formed at the tip of the right wall member 22. The second alignment portion 20 has an inclined groove 24 formed between the two wall members 22 and inclined so that the component slides down by its own weight. The thickness I of the inclined groove 24 is the same as the thickness G of the second component storage chamber 8 and also functions as a part of the second component storage chamber 8. The imaginary line in FIG. 4 indicates the position where the alignment plate 16 has moved upward.

Next, as shown in FIGS. 2, 4, 5 and 6, on the right side (in FIG. 5) of the second component storage chamber 8, a first movable plate 30 is provided with a fulcrum. It is provided so as to be swingable about 32. An inclined surface 30a is formed in a portion of the first movable plate 30 facing the second component storage chamber 8 so that the component can be dropped by its own weight. Board 16
In addition, a straight portion 30b that forms a component passage is formed. A spring 34 is provided at the lower end of the first movable plate 30, and urges the first movable plate 30 in the clockwise direction in FIG. Reference numeral 36 denotes a stopper, and the stopper 36 keeps the first movable plate 30 at a predetermined position even when the first movable plate 30 is urged by the spring 34.

As shown in FIGS. 2, 5 and 6,
The lower part of the first component storage chamber 4 and the right side of the alignment plate 16 (FIG. 5)
And in FIG. 6), the second movable plate 4
0 is provided so as to be swingable about the fulcrum 42. A leaf spring 4 is provided on the right side surface of the second movable plate 40.
4, which urges the second movable plate 40 in the clockwise direction. This second movable plate 40
An inclined surface 40a is formed in a portion facing the first component storage chamber 4 so that the component can be dropped by its own weight.
A vertical surface 40b for forming a part of the second component storage chamber 8 is formed in a portion facing the second component storage chamber 8, and the left end 40c of the second movable plate 40 is aligned. The plate 16 is in contact with the plate 16 so that the alignment plate 16 functions as a stopper.

Further, as shown in FIGS. 2, 4 and 6, a third movable plate 50 is provided at the lower part of the first component storage chamber 4 and at the back of the alignment plate 16 (in FIGS. 4 and 6).
Are provided so as to be swingable about the fulcrum 52. A spring 54 is attached to the left side surface of the third movable plate 50, and urges the third movable plate 50 in a counterclockwise direction. An inclined surface 50a is formed in a portion of the third movable plate 50 facing the first component storage chamber 4 so that the component can be dropped by its own weight. The inclined surface 50a and the inclined surface of the left wall member 22 are formed. 22a are continuous when the alignment plate 16 is at the lowermost position. Further, the left end portion 50b of the third movable plate 50 is in contact with the alignment plate 16, whereby
The alignment plate 16 functions as a stopper.

Here, as shown in FIG. 1, the component alignment passage 10 is mounted in the housing 2 and the chip component A
Is moved downward by its own weight without being twisted in the chip component sending direction F, and is guided to the component transport path 12. It has become so. Further, the component conveying path 12 is made of a drawn-pipe, and a component outlet 200 for taking out a chip component A described later is formed at a tip end thereof. Here, as shown in FIG. 1, a chip component automatic mounting device (automatic mounting device) 74 is arranged on the chip component A supply side of the chip component supply device 1. A nozzle 76 for receiving the chip component A is provided below the main body of the automatic mounting device 74. An actuator arm 78 is provided at the lower part of the main body of the chip component automatic mounting device 74. This actuator arm 78
Is for driving the alignment plate 16 and the vacuum suction mechanism 60 described later in synchronization with the operation of the chip component automatic mounting device 74.

As shown in FIG. 1, below the actuator arm 78, an air cylinder lever 8 described later is provided.
0, and the air cylinder lever 80
Below, is provided an alignment plate lever 160 for moving the alignment plate 16 up and down. The alignment plate lever 160 rotates about a fulcrum 162. The lower end of a slide guide 164 that moves up and down is connected to the right end of the alignment plate lever 160. The upper end of the slide guide 164 is connected to the alignment plate 16. Thus, the actuator arm 78 also moves up and down in synchronization with the up and down movement of the nozzle 76 for receiving the chip component A,
From the vertical movement of the actuator arm 78, the alignment plate lever 160 rotates via the air cylinder lever 80,
Accordingly, the slide guide 164 moves up and down, and as a result, the alignment plate 16 moves up and down.

Next, a description will be given of the operation of aligning the chip components and moving the component from the first component storage chamber 4 to the component transport path 12 in the present embodiment having the above-described configuration. First, the chip components A are stored in the first component storage chamber 4 from the component storage case 4 in which a large number of chip components A are stored in bulk.
Supplied within. Next, the chip components A stored in the three-dimensional space of the first component storage chamber 4 in a bulk state are
The first component storage chamber 4 slides down by its own weight along the bottom surface portion 14 of the first component storage chamber 4, and the first alignment portion 18 of the alignment plate 16 (the wall member 2).
2) through the inclined surfaces 22a, 22b) and the inclined grooves 24 of the second alignment portion 20 (see FIGS. 4 and 5). At this time, some of the chip components A are smoothly directly transferred from the first component storage chamber 4 to the second component storage chamber 8.
To fall. However, at this time, in the first component storage chamber 4, the components that are aligned on the bottom surface portion 14 of the housing 2 and are likely to slide down by their own weight and slide from the inclined surfaces 22 a and 22 b of the first alignment portion 18 of the alignment plate 16. In some cases, the components to be dropped are too concentrated and bite into a wedge shape, so that the components aligned on the bottom surface portion 14 of the first component storage chamber 4 cannot be dropped into the second component storage chamber 8. However, in the present embodiment, the wall member 22 of the alignment plate 16 is raised to
By pushing up into the component storage room 4, the chip component A that has digged in a wedge shape is released upward. This allows
The wedge-shaped biting of the component is eliminated, and at this time, the chip component is smoothly guided into the inclined groove 24 between the two wall members 22 from the inclined surfaces 22 a and 22 b of the wall member 22 and the side of the wall member 22. Then, it slides down toward the second component storage chamber 8 by its own weight. In this way, the chip components A are stored in the two-dimensional space in the second component storage chamber 4 without overlapping each other in the thickness direction of the components. Thereafter, the alignment plate 16 moves downward. Such vertical movement of the alignment plate 16 is repeated at a predetermined timing.

As described above, when the chip component A moves from the first component storage chamber 4 to the second component storage chamber 8, the alignment plate 16 moves up and down, so that the first alignment portion 18 of the alignment plate 16 is moved. The chip component may be sandwiched between the side of the first component storage chamber 4 and the first component storage chamber 4 (when the alignment plate 16 is raised) or the chip component may be pulled in (when the alignment plate 16 is lowered). . If the component is pinched or pulled in this way, the chip component itself is damaged, and the alignment plate 16 and the second movable plate 40 are undesirably damaged. In the present embodiment, in such a case, the second movable plate 40 swings counterclockwise in FIG. 5 against the urging force of the spring about the fulcrum 42 so that the second movable plate 40 Retreat from the department. As a result, a larger space is formed between the side portion of the alignment plate 16 and the first component storage chamber 4, so that such chip components are reliably prevented from being pinched or pulled.

Similarly, when the chip component A moves from the first component storage chamber 4 to the second component storage chamber 8, the alignment plate 1
6 moves up and down, a chip component is sandwiched between the rear surface of the first alignment portion 18 of the alignment plate 16 and the second component storage chamber 8 (when the alignment plate 16 is raised), May be pulled in (during the lowering operation of the alignment plate 16). When the component is pinched or pulled in this way, the chip component itself is damaged, and the alignment plate 16 and the third movable plate 50 are undesirably damaged. In the present embodiment, in such a case, the third movable plate 50 swings clockwise in FIG. 4 against the urging force of the spring about the fulcrum 52, and the alignment plate 1
6 retreats from the back. As a result, a larger space is formed between the rear surface of the alignment plate 16 and the first component storage chamber 4, so that such chip components are reliably prevented from being inserted or pulled.

Next, the chip component A accommodated in the second component storage chamber 8 is moved by its own weight along the inclined groove 24 of the second aligning portion 20 and the inclined surface 30a of the first movable plate 30 by its own weight. Slide down towards. At this time, the part that is aligned on the inclined groove 24 of the second alignment part 20 and slides down by its own weight and the inclined surface 3 of the first movable plate 30
The parts that are aligned on the upper part 0a and are likely to slide down due to their own weight are too concentrated and bite into a wedge shape, and the parts are aligned in the part alignment passage 1.
It may not be possible to fall to zero. However, in the present embodiment, since the alignment plate 16 moves upward,
The inclined surface 24 of the alignment plate 16 moves upward, and the inclined surface 2
4, the wedge-shaped components that are too concentrated near the entrance of the component alignment passage 10 are released upward, thereby eliminating the wedge-shaped bite. At this time, the chip component A is again aligned on the inclined surface 30a of the first movable plate 30, and slides down smoothly toward the component alignment passage 10. Thereafter, the alignment plate 16 moves downward.

As described above, when the chip component A moves from the second component storage chamber 8 to the component alignment passage 10, the alignment plate 16 moves up and down, so that the straight line between the alignment plate 16 and the first movable plate 30 is formed. There is a case where the chip component is interposed between the portion 30b (when the alignment plate 16 moves up) and the chip component is pulled in (when the alignment plate 16 moves down). If the component is pinched or pulled in this way, the chip component itself may be damaged or the alignment plate 16 may be damaged.
In addition, the first movable plate 30 is undesirably damaged. In the present embodiment, in such a case, the first movable plate 30 swings around the fulcrum 32 in the counterclockwise direction in FIG.
Retreat from As a result, a larger space is formed between the alignment plate 16 and the linear portion 30b of the first movable plate 30, so that such chip components are reliably prevented from being pinched or pulled. Next, the chip component A guided to the component alignment path 10 falls in the component alignment path 10 by its own weight, and is transferred to the component transport path 12.

Next, referring to FIG. 1 and FIG.
The vacuum suction mechanism 60 for sending out the components from the component conveying path 12 to the component removal position by the vacuum suction force will be described. The vacuum suction mechanism 60 has an air cylinder 62. The air cylinder 62 includes a piston head 64, a piston rod 66 connected to the piston head 64, and a rod-side cylinder chamber 6 partitioned by the piston head 64.
8, head side cylinder chamber 70, piston rod 66
And a spring 72 for urging the cylinder to extend out of the cylinder chamber. The piston rod 66 has a distal end 66a at a distal end opposite to the head side.

Next, a substantially T-shaped air cylinder lever 80 is attached to the housing 2 via a fulcrum 82 below the actuator arm 78, and can be rotated about the fulcrum 82. I have. A spring 84 is attached to the lower side of the air cylinder lever 80, and urges it clockwise. A stopper 86 prevents the air cylinder lever 80 from rotating beyond a predetermined position due to the urging force of the spring 84. One end of a vacuum conduit 88 is connected to the rod-side cylinder chamber 68 of the air cylinder 62, and the other end of the vacuum conduit 88 is connected to a suction port 90 provided in the vicinity of the component take-out position of the component transfer passage 12. It is connected to the transport path 12.

As shown in FIGS. 8 and 11, the suction port 90 communicates with the component transport passage 12, and further, when vacuum suction is performed, connects to a component stopper 202 which will be described later inserted into the component transport passage 12. By communicating with a gap 204 (see FIG. 11) formed between the component conveying passage 12 and the gap 204, negative pressure air flows through the gap 204, whereby the chip component A in the component conveying passage 12 is sucked and conveyed. It has become. The vacuum conduit 88 branches on the way to form a branch conduit 92. On the part conveying passage 12 side from the branch of the vacuum conduit 88, air flows from the component conveying passage 12 to the rod-side cylinder chamber 68, and air flows through the part conveying passage 1.
A check valve 94 is provided to prevent the backflow to 2. The branch conduit 92 is provided with a check valve 96 for discharging air from the rod-side cylinder chamber 68 to the atmosphere and preventing the air from flowing in the opposite direction. Further, a conduit 98 is also connected to the head-side cylinder chamber 70, and this conduit 98 allows the head-side cylinder chamber 70 to be connected.
Air is introduced into the chamber and air is discharged to the atmosphere.

The vacuum suction mechanism 60 operates as follows. When the actuator arm 78 of the chip component automatic mounting device 74 descends from the position shown in FIGS. 1 and 7, the lower end of the actuator arm 78 contacts the upper end of the air cylinder lever 80 and is pushed down.
As a result, the lever 80 rotates counterclockwise and the lever 8
The lower end of 0 pushes the distal end 66a of the piston rod 66. As a result, the piston rod 66
2 and to the right in FIGS.
At this time, the air in the head side cylinder chamber 70 is
8 to the atmosphere. Rod side cylinder chamber 68
As the volume increases, the inside thereof becomes a vacuum (negative pressure), whereby the air in the component conveying passage 12 is sucked through the suction port 90 and passes through the vacuum conduit 88 and the check valve 94 to the rod side. It is introduced into the cylinder chamber 68. In this way, the air in the component transport passage 12 is sucked, and the flow of the air causes the chip component A in the component transport passage 12 to be sent out to near the take-out position. Thereafter, when the actuator arm 78 is raised, the air cylinder lever 80 is moved by the spring 8.
4 rotates clockwise by the urging force of
6 stops at a predetermined position (the position shown in FIGS. 1 and 7). When the lever 80 rotates clockwise and returns, the piston rod 66 moves to the left by the urging force of the spring 72. At this time, the air in the rod side cylinder chamber 68 is pressed by the piston head 64,
The air is discharged to the atmosphere via a check valve 96 and a branch conduit 92. A conduit 98 is provided inside the head side cylinder chamber 70.
Air is introduced from In this manner, when the actuator arm 78 of the chip component automatic mounting device 74 moves up and down, the chip component A in the component transport path 12 is continuously fed out to the vicinity of the pick-up position by the vacuum suction mechanism 60.

Next, at the tip end of the component transfer passage 12, a component take-out opening 200 is formed, which is a component take-out position. Nozzle 7 described above
6 to be taken out. Chip component A
In order to remove the chip component A1 from the component transport path 12 at the component removal position, the leading chip component A1 to be removed in the component transport path 12 is separated from the second chip component that is the subsequent chip component A2. Therefore, a component separation mechanism 100 for that purpose is provided. Further, when the chip component A in the component transport path 12 is taken out at the component take-out position, it is necessary to operate the shutter mechanism 102, and this shutter mechanism 102 will also be described.

The component separating mechanism 100 and the shutter mechanism 102 will be described below with reference to FIGS. First, the component separating mechanism 100 moves the tip chip component in the component transport path 12 to the component removal position (the component removal port 20).
0) A component stopper 202 for stopping near, a magnet 106 for adsorbing chip components provided on an outer side surface near a component take-out position of the component transport path 12, and a stopper lever for driving the component stopper 202 1
08, a driving lever 110 for driving the stopper lever 108, and the like. Here, the lower end of the driving lever 110 is connected to an actuator arm 112 that obtains a driving force from the chip component automatic mounting device 74 as shown in FIG. For this reason, the actuator arm 112 reciprocates in the left-right direction in synchronization with the vertical movement of the nozzle 76 for receiving the chip component A.

Here, as shown in FIGS. 8 to 10, a fixed block 206 fixed to the housing 2 so as to support the component conveying passage 12, and a side of the fixed block 206 adjacent to the component delivery direction. A movable shutter opening / closing block 208 and a stopper stopping block 210 fixed to the housing 2 on the side adjacent to the shutter opening / closing block 208 in the component delivery direction are provided. Inside the fixed block 206 and the stopper stop block 210, a vacuum conduit 88 is provided.
Are formed, respectively. An inner pipe 216 is provided at the end of the component transfer passage 12 formed by a pipe so as to communicate with the component transfer passage 12. One end of the inner pipe 216 has a shutter opening / closing block 208.
It is stuck to.

Next, the shutter mechanism 102 will be described. Outer pipes made to be substantially equal to the outer dimensions of the inner pipe 216 are arranged on the outer peripheral side of the component conveying passage 12 and the inner pipe 216, respectively, and have a double pipe structure. As shown in FIG. 15, the outer pipe on the right half is joined to the outer peripheral surface of the component transport passage 12, and a seal portion 218 is formed to function as a shutter shielding block 220. The outer pipe on the left half is shutter 2
22, which is the component take-out position
00, one end of which is a shutter opening / closing block 20.
8, it can be moved in the chip component sending direction. These shutter shielding blocks 2
A joint surface 224 between the shutter 20 and the shutter 222 is formed obliquely and is in close contact with the joint surface 224 so that a vacuum state can be maintained. Here, as shown in FIG. 15, the right end of the inner pipe 216 has a role as a lid 226 for preventing chip components from jumping out of a component outlet 200 formed at the tip of the component transport passage 12. I have.

Next, the tip end 202a of the component stopper 202 is incorporated in the inner pipe 216, and the main body 2
02b is supported in the shutter opening / closing block 208, and is movable in the component delivery direction. A spring 228 is attached between the main body 202b of the component stopper 202 and the shutter opening / closing block 208, and the spring 228 urges the component stopper 202 in the direction of the component outlet 200, which is a component extraction position. I have. For this reason, the component stopper 202 can be moved together with the shutter opening / closing block 208 (see FIGS. 8 and 9) or separately (see FIG. 10) along the component delivery direction. On the outer side surface of the shutter (outer pipe) 222 near the component take-out position, there is provided a magnet 10 for chip component suction.
6 is attached, and this tip component attracting magnet 1
At 06, the chip component A is drawn to one side surface of the component transport path 12, and is positioned at that position (see FIG. 12).

Next, the operation of the component separating mechanism 100 and the shutter mechanism 102 will be described. First, as shown in FIGS. 8, 12, and 13, the vacuum conduit 88 of the vacuum suction mechanism 60 is used.
As described above, when the inside of the component becomes a vacuum (negative pressure), the air in the component transport passage 12 is sucked, and the flow of the intake air causes the chip components in the component transport passage 12 to reach the vicinity of the component removal position. Conveyed. At this time, the tip chip component A1 to be taken out hits the tip of the component stopper 202 and stops at a predetermined position. At this time,
The chip part A1 is a chip part attracting magnet 106.
As a result, it is drawn to one side surface of the component transport path 12 and positioned at that position (see FIG. 12).

Next, the driving lever 110 is driven by the actuator arm 112, and the driving lever 11
As a result, the stopper lever 108 is driven, and as a result, the shutter opening / closing block 208 moves to the left in FIG. 9 as shown in FIG. At this time, the inner pipe 216, the shutter (outer pipe) 222, the component stopper 202, and the chip component attracting magnet 106 move integrally with the shutter opening / closing block 208. Once the shutter opening / closing block 208 starts moving to the left, the air passage 212 in the fixed block 206 forming the vacuum conduit 88 and the 214 in the stopper stopping block 210 are separated as shown in FIG. As a result, the vacuum (negative pressure) in the vacuum conduit 88 is broken down to the atmospheric pressure, and the component conveyance by the suction pressure of the negative pressure air is stopped.

When the shutter opening / closing block 208 moves, the chip component attracting magnet 106 also moves at the same time, so that the chip component A1 is attracted to the chip component attracting magnet 106 and the one side surface of the component carrying path 12. Move along. At this time, the subsequent second chip component A2 is not affected by the attraction force of the magnet 106 and does not move. afterwards,
The left end of the component stopper 202 abuts the stopper stop block 210 and stops at the position shown in FIG. In this way, the tip chip component A1 to be taken out moves while being drawn to the magnet 106 by the distance moved by the component stopper 202, and is separated from the subsequent second chip component A2. In this state, the chip components are separated, but the shutter 222 is not completely opened. Therefore, the chip components do not jump out of the component outlet 200 due to this separation operation.

Thereafter, as shown in FIG. 10, with the component stopper 202 stopped, the shutter opening / closing block 2 is stopped.
08, the inner pipe 216, the shutter 222, and the chip component attracting magnet 106 move integrally and further to the left side in the drawing. Thereby, the shutter 22
2 comes off from the component outlet 200 of the component transport path 12, and chip components can be taken out. In this state, the nozzle 76 descends, and the chip component A1 at the component removal position is taken out to the outside where it has been sucked. After this, shutter 2
Reference numeral 22 is closed again, the next chip component A2 is vacuum-suctioned by the vacuum suction mechanism 60, and the same operation is repeated.

In the first embodiment, as described above, the chip component attracting magnet 106 is driven by the stopper lever 108 to drive the shutter opening / closing block 208, the inner pipe 216, the outer pipe 222, and the component stopper 202. Although it is designed to move in synchronism with, a mechanism that does not synchronize may be adopted. In this embodiment, the magnet 106 and the outer pipe 222
Is to move the same distance and stop,
The distances do not have to be the same.

According to the first embodiment of the present invention configured as described above, since the component conveying passage 12 is formed from the drawn and formed pipe, machining such as cutting which has been conventionally required is performed. It is unnecessary, and since it is a pipe, it can be mass-produced, the cost is low, standardization is easy, and design flexibility is high. In addition, it is easy to deal with micro chip components to be developed in the future. In addition, since the chip components are positioned by the chip component attracting magnet 106, the suction pressure of the negative pressure suction is used, so that the component transfer path 12 is slightly larger than the chip components. The component positioning accuracy of the chip component can be improved. Further, as mentioned above,
With the component separation mechanism 100 and the shutter mechanism 102 having relatively simple structures, the chip components can be separated and taken out.

Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment,
Magnet 10 for adsorbing chip components of component separation mechanism 100
6, the following structure is employed instead. The configuration other than the configuration described below is the same as that of the first embodiment. In the second embodiment, a negative pressure suction means is provided on one side surface of the inner pipe 216 so as to flow the negative pressure air so that the tip component A1 at the tip is drawn. Specifically, the gap 2 in the inner pipe 216
A block block 230 is provided to block the other side (the upper side in FIG. 16) opposite to the side where the chip component A1 of FIG. 04 is drawn to prevent the negative pressure air from flowing. The first gap 232 formed on the side surface on one side that draws the chip component out of the gap formed between the first and second chip components is increased, and the first gap 232 formed on the opposite side surface (the side provided with the blocking block 230) is increased. By reducing the gap 234 in FIG. 2, the flow of the negative pressure intake becomes a flow of drawing the chip component A1 to one side surface and a flow along the moving direction of the component stopper 202 as indicated by an arrow 236. Due to the flow of the negative pressure air, the tip component A1 at the tip is drawn to one side surface of the component transfer passage 12 and also drawn in the moving direction of the component stopper 202.

The vacuum conduit 88 of the vacuum suction mechanism 60
Unlike the first embodiment, even if the shutter opening / closing block 208 is moved, the shutter 22 is not moved while the component stopper 202 is moved without introducing air.
While the opening 2 is opened, the tip component A1 at the tip is continuously sucked. The flow of the negative pressure suction suctions, positions, and separates the chip components.
At the moment when 6 descends and picks up chip components,
A mechanism (not shown) for breaking the vacuum is provided.

Referring to FIG. 20, a third embodiment of the present invention will be described. In this embodiment, the chip component suction magnet 238 is fixedly arranged near the component outlet 200, which is the component extraction position. The tip chip component A1 is attracted to one side surface of the component transport path 12 by the tip component attracting magnet 238, and is also attracted in the direction in which the component stopper 202 moves. As described above, when the component stopper 202 moves, only the tip chip component A1 moves, and the subsequent chip component A1 moves.
Separated from the second chip component A2, the component can be taken out. Therefore, the chip component attracting magnet 238 is used.
Is adjusted by the shape and weight of the chip component so that only the tip chip component A1 is drawn and the second chip component A2 is not drawn.

Referring to FIG. 21, a fourth embodiment of the present invention will be described. In the above-described embodiment, the inner pipe 216 and the shutter 222 are configured as a double pipe structure. However, in this embodiment, the inner pipe 216 and the shutter 222 are formed as a molded part 240 formed by molding a resin or metal integrally.
This makes component manufacturing simpler and cheaper. Further, the inner pipe 216 and the shutter 222 may be integrally formed as a ceramic sintered body.

The present invention is not limited to the above-described embodiment, but can take the following forms. That is, instead of using the suction pressure of the negative pressure air for the component conveyance in the component conveyance passage 12, the discharge pressure of the compressed air discharged from the conduit 98 of the vacuum suction mechanism 60 may be used. In this case, there is no need to provide the shutter mechanism 102 that requires airtightness as in the double pipe structure described above. However, it is desirable to provide a shutter mechanism having no airtightness in order to prevent the chip component from jumping out of the component outlet 200. Therefore, it is not necessary to provide the shutter 222 and the shutter shielding block 220, and a shutter mechanism may be used in which only the inner pipe 216 is opened and closed to prevent the chip component at the outlet 150. Further, in the above-described embodiment, the negative pressure air or the compressed air is generated by driving the air cylinder 62 incorporated in the chip component supply device using the driving of the chip component automatic mounting device. Negative pressure air or compressed air may be generated using a vacuum pump, a compressor, or the like.

[0049]

As described above, according to the chip supply device of the present invention, there is no need to perform machining when forming the groove of the chip component transfer passage, and the chip component transfer passage is inexpensive and has high design flexibility. Can be formed. further,
By accurately positioning and separating the chip components at the component extraction position, the chip components can be easily taken out.

[Brief description of the drawings]

FIG. 1 is a front view showing a first embodiment of a chip component supply device according to the present invention.

FIG. 2 is a partially developed perspective view showing the chip component supply device of FIG. 1;

FIG. 3 is a perspective view showing a chip component.

FIG. 4 is a partial front view as seen from a direction P in FIG. 2;

FIG. 5 is a partial cross-sectional side view seen from the Q direction in FIG. 2;

FIG. 6 is a sectional view taken along the line UU in FIG. 5;

FIG. 7 is a configuration diagram illustrating a vacuum suction mechanism of the chip component supply device of FIG. 1;

FIG. 8 is a partial front sectional view showing a component separating mechanism, a shutter mechanism, and the like of the chip component supply device of FIG. 1, showing a state where the chip component is stopped by a component stopper.

9 is a front partial cross-sectional view showing a component separation mechanism, a shutter mechanism, and the like of the chip component supply device in FIG. 1, showing a state in which a component stopper has moved and has hit a stopper stopping block and has been stopped.

10 is a partial front sectional view showing a component separation mechanism, a shutter mechanism, and the like of the chip component supply device of FIG. 1, showing a state in which the shutter mechanism is opened with the component stopper stopped.

FIG. 11 is a perspective view showing a part of a component separating mechanism of the chip component supply device of FIG. 1 taken out therefrom;

FIG. 12 is a partial sectional plan view of the component separation mechanism showing a state where the component stopper of the component separation mechanism stops the chip component.

FIG. 13 is a partial sectional front view of the component separation mechanism showing a state where the component stopper of the component separation mechanism stops the chip component.

FIG. 14 is a partial cross-sectional plan view of the component separation mechanism and the shutter mechanism, showing a state where the shutter mechanism is opened and a chip component can be taken out.

15 is a front sectional view (FIGS. 15A and 15B) showing the part separating mechanism and the shutter mechanism taken out, and a sectional side view (FIG. 15C) seen from the Q direction.

FIG. 16 is a partial cross-sectional plan view of the component separation mechanism showing a state where the component stopper of the component separation mechanism stops the chip component in the second embodiment of the chip component supply device of the present invention.

FIG. 17 is a front view of FIG. 16;

FIG. 18 is a sectional view taken along the line RR in FIG. 16;

FIG. 19 is a front partial cross-sectional view showing a component separation mechanism, a shutter mechanism, and the like of FIG. 1 of a second embodiment of the chip component supply device of the present invention.

FIG. 20 is a front sectional view (FIGS. 20A and 20B) showing the component separating mechanism and the shutter mechanism of the third embodiment of the chip component supply device of the present invention, and a sectional side view seen from the Q direction (FIG. 20C). ).

21 is a front sectional view showing a shutter mechanism of a chip component supply device according to a fourth embodiment of the present invention (FIGS. 21A and 2A).
1B).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip component supply device 4 1st component storage room 8 2nd component storage room 10 Component alignment passage 12 Component conveyance passage 16 Alignment plate 60 Vacuum suction mechanism 62 Air cylinder 74 Chip component automatic mounting device 76 Nozzle 78, 112 Actuator arm 80 Air Cylinder lever 88 Vacuum conduit 90 Suction port 100 Parts separation mechanism 102 Shutter mechanism 106, 238 Chip component suction magnet 108 Stopper lever 110 Driving lever 200 Component outlet 202 Component stopper 204 Gap 206 Fixed block 208 Shutter opening / closing block 210 Stopper Stop Block 220 Shutter Shielding Block 222 Shutter 226 Lid 228 Spring 230 Shielding Block 240 Mold Part

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E313 AA03 AA21 CC01 CC02 CC03 CD01 DD01 DD02 DD06 DD10 DD11 DD19 DD22 DD23 DD42 FF04 FF05 FF07

Claims (5)

[Claims] 1. A chip component supply device for arranging a large number of chip components in a bulk state in a line and supplying the chip components to an automatic chip component mounting apparatus, comprising: a component storage chamber for storing a large number of chip components in a bulk state; A component alignment passage is provided so as to communicate with the component storage chamber and aligns the chip components in a line. The pipe has a terminal portion connected to the component alignment passage, has a component outlet at the tip end, and is formed by drawing. A component conveying passage, a component conveying means for applying suction pressure of negative pressure air or discharging pressure of compressed air to the component conveying passage to convey the chip component to a vicinity of the component outlet, A shutter mechanism for opening a component outlet when removing a component, and a component for separating a leading tip component from a subsequent chip component in the vicinity of the component outlet in the component transport path. A component stopper for stopping the tip component at the vicinity of the component outlet, and a component stopper for moving the tip component at one of the component outlets of the component transport path. A chip component supply device comprising: component positioning means for positioning on a side surface; and moving means for moving at least the component stopper to separate the tip chip component from a subsequent chip component. 2. The component positioning device according to claim 1, wherein the component positioning means is a magnet arranged on an outer side surface of the component transport passage near the component outlet, and the component separating mechanism moves the component stopper and the magnet. 2. The chip component supply device according to claim 1, wherein the tip component is separated from a subsequent chip component. 3. The component positioning means is a suction means for suctioning and positioning a chip component with negative pressure air, and the component separating mechanism moves the component stopper in a state where the suction means suctions the chip component. The chip component supply device according to claim 1, wherein the tip component is separated from a subsequent chip component. 4. The component positioning means is a magnet fixedly arranged on an outer side surface of the component transport passage near the component outlet, and the component separating mechanism moves the component stopper by moving the component stopper. The chip component supply device according to claim 1, wherein the tip component is separated from a subsequent chip component. 5. The component transport means for transporting chip components to a component outlet by applying a suction pressure of negative pressure air to the component transport passage, and further, a component outlet of the component transport passage. 2. A shield part which covers an outer surface including the above so as to prevent leakage of negative pressure air and acts as a shutter, wherein the shield part is formed of a pipe, a molded part or a ceramic sintered body. Chip component supply device.