JPH11186790A - Chip component supplying equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the sending-out of a chip component smooth by attracting a chip component on the outer peripheral surface of a rotary disk means, moving the chip component from a component aligning path to a component sending path by rotating the disk, and sending the chip component in the sending path as far as a predetermined position by a component carrying belt. SOLUTION: A coin-shaped fixed type permanent magnet 80 as a fixed magnet means is fixed and arranged on a base 82. A rotary disk 84 is installed surrounding the permanent magnet 80. A chip component is attracted on the outer peripheral surface of the disk 84 by the magnetic force of the magnet 80 and rotated. The chip component is transferred from a component aligning path 10 to a component sending path 11. A component carrying belt 60c is installed below the component sending path 11. The chip component in the sending path 11 is sent as far as a predetermined position. Thereby attitude of the chip component is not violently changed from the vertical direction to the horizontal direction, but smoothly sent to the predetermined position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component supply device, and more particularly, to a chip component supply system of a bulk supply type.
The present invention relates to a component supply device that supplies a component in a line.

[0002]

2. Description of the Related Art An extremely wide variety of chip components are mounted on a printed circuit board. At this time, an automatic mounting device is used to transport and mount the chip components on the printed circuit board. In order to supply chip components to the automatic mounting device, a chip component supply device is required. Japanese Patent Application Laid-Open No. 8-48 discloses this chip component supply device.
No. 419 is known. The chip component supply device described in this publication arranges a large number of chip components in a bulk state in a line by a fixed pipe provided substantially vertically, and then communicates with the fixed pipe to guide grooves extending in the horizontal direction. It is transferred onto a component transport belt provided therein and is sent out to a predetermined position.
In this apparatus, a stopper is provided at the front end of the guide groove, and when the chip component on the belt moves forward together with the belt, the stopper is brought into contact with the front end of the guide groove to stop the leading chip component at a predetermined position. When the leading chip part comes into contact with the stopper and the movement of the whole part is stopped, the stopper is released forward by releasing the stopper forward while pressing the second chip part against the inner wall by the part holding pin and holding it at that position. To move forward while being attracted by the permanent magnet, thereby forcibly forming an interval with the second chip component so that the leading chip component can be taken out favorably.

[0003]

The conventional chip component supply device configured as described above has the following problems. First, since the chip component is transferred from the fixed pipe provided in the substantially vertical direction onto the component transport belt in the guide groove extending in the horizontal direction, the posture of the chip component is sharply changed from the vertical direction to the horizontal direction. Therefore, there is a problem that the chip component does not smoothly move onto the component transport belt due to the change of the chip component and the inclination of the chip component with respect to the moving direction.

Next, since the pickup nozzle of the automatic mounting device sucks and removes the component while the leading chip component is held by the permanent magnet, the magnetic force of the permanent magnet acts in the direction opposite to the component removal direction, causing a pickup error. It is easy to occur. Further, although the chip components are sent out by the component conveying belt, it is difficult to maintain the flatness of the belt, and therefore, the height of the inner wall of the guide groove cannot be precisely maintained. As a result, the positional accuracy of the chip component cannot be maintained in the guide groove, and it is easy to cause standing of the components and overlapping of the components, which is not preferable. In particular, extremely small chip components, for example, 1 mm (length) × 0.5 mm (width) × 0.35 mm
In the case of extremely thin chip components such as (thickness), such a problem is likely to occur.

Therefore, the present invention has been made to solve the above-mentioned problems of the prior art, and after the chip components are aligned in a line, the posture of the chip components changes rapidly from the vertical direction to the horizontal direction. It is an object of the present invention to provide a chip component supply device that can smoothly send a chip component to a predetermined position without changing the chip component. Another object of the present invention is to provide a chip component supply device capable of reliably removing a chip component. It is another object of the present invention to provide a chip component supply device that does not require the use of a component transport belt.

[0006]

According to a first aspect of the present invention, there is provided a chip component supply apparatus for supplying a large number of chip components in a bulk state in a line and supplying the chip parts in a bulk state. A component storage chamber for accommodating a large number of chip components, a component alignment passage provided below the component storage chamber for aligning chip components in a line and moving downward, and a component storage passage connected to the component alignment passage. A component delivery path,
Fixed magnet means fixedly disposed near the connection between the component alignment passage and the component delivery passage; and rotating plate means provided to surround the magnet means, and fixed to the outer peripheral surface of the rotating plate means. Rotating plate means for attracting and rotating the chip component by the magnet means to move the chip component from the component alignment passage to the component delivery passage, and to move the chip component provided below the component delivery passage in the component delivery passage to a predetermined position. It features a component conveyor belt to be sent out.

According to the first aspect of the present invention, a large number of chip components in a bulk state are moved downward from the component storage chamber in a line in the component alignment passage. The chip component near the connecting portion between the component alignment passage and the component delivery passage is attracted to the outer peripheral surface of the rotating plate means by the first magnet means and is transferred from the component alignment passage to the component delivery path by rotation of the rotating plate means. . Thereafter, the chip components in the component delivery path are sent out to a predetermined position by the component transport belt.

According to a second aspect of the present invention, there is provided a chip component supply apparatus for supplying a large number of chip components in a bulk state in a line, and a component storage chamber for storing a large number of chip components in a bulk state. A component alignment passage provided below the component storage chamber for aligning and moving chip components in a line, and a component delivery passage connected to the component alignment passage via a connection having a predetermined radius of curvature. A transport plate provided so as to form a part of the inner surface of the component delivery path and transporting the chip component in the component delivery direction by reciprocating in the component delivery direction and the opposite direction; When moving in the direction, the chip moves closer to the transport plate, attracts the chip component onto the transport plate by its magnetic force, and moves the chip component together with the transport plate in the component delivery direction. It is characterized by having a magnet unit for delivering products, and a means for stopping chip components for stopping the movement of chip components in the component delivery path in the reverse direction when the transport plate moves in the direction opposite to the component delivery direction. .

In the present invention configured as described above,
A large number of chip components in a bulk state move downward from the component storage chamber in a row in the component alignment passage. The chip component in the component alignment passage moves to the component delivery passage by moving the transport plate in the component delivery direction through the connection portion of the component delivery passage. When the transport plate moves in the component delivery direction, the chip components in the component delivery path are attracted to the transport plate by the magnetic force of the chip component delivery magnet means approaching the transport plate, and the transport plate moves in the component delivery direction. Will be sent out. On the other hand, when the transport plate moves in the direction opposite to the component delivery direction, the movement of the chip component in the component delivery path in the reverse direction is stopped by the chip component stopping means. Such reciprocating motion of the transport plate is repeated, and the chip components in the component delivery passage are sequentially delivered in the component delivery direction.

In the second aspect of the present invention, preferably, the chip component stopping means approaches the component delivery passage when the transport plate moves in a direction opposite to the component delivery direction, and moves the chip component into the component delivery passage by its magnetic force. And a magnet means for holding and stopping the chip component and stopping the movement in the opposite direction. in this case,
Further, there are fixed magnet means fixedly disposed near a connection between the component alignment passage and the component delivery passage, and rotary plate means provided to surround the fixed magnet means, and an outer peripheral surface of the rotary plate means. Rotating plate means for attracting and rotating the chip component by the fixed magnet means and moving the chip component from the component alignment passage to the component delivery passage. In the second aspect of the present invention, preferably, furthermore, a fixed magnet means fixedly disposed near a connection between the component alignment passage and the component delivery passage, and a rotating plate provided so as to surround the fixed magnet means Rotating plate means for adsorbing and rotating the chip component on the outer peripheral surface of the rotating plate means by the fixed magnet means and moving the chip component from the component alignment passage to the component delivery passage. The fixed magnet means and the rotating plate means also function as the chip component stopping means.

Further, in the first and second aspects of the present invention, preferably, the apparatus further includes a component separating mechanism provided at a tip of the component delivery passage, and the component separating mechanism is provided at a tip of the component delivery passage. A stopper member for receiving only one chip component and moving the tip chip component in a predetermined direction to separate it from the second chip component; and a tip of the component delivery passage when the tip chip component is separated by the stopper member. Interval forming means for forming an interval for separation between the chip component and the second chip component, and the interval forming means is disposed near the stopper member and adsorbs the tip chip component. The tip tip magnet means to be moved, and the second tip component is held at a position located near the second tip component and spaced from the tip tip component. It has a second chip holding unit that, the.

Further, in the first and second aspects of the present invention,
Preferably, when the tip chip component is taken out, the tip tip magnet means is movable to a position where the tip tip component is stably held and a magnetic force is applied to the extent that the tip component is not affected. .

[0013]

An embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIGS. 1 and 2,
Reference numeral 1 denotes a chip component supply device according to an embodiment of the present invention, and the chip component supply device 1 includes a housing 2. Reference numeral 4 denotes a component storage case, in which a large number (generally thousands to tens of thousands) of chip components A are stored in advance in a bulk state.
Here, the chip component A is a generally rectangular parallelepiped component, and as an example, a chip capacitor or a chip resistor (for example, length L × width W × thickness T = 1.0 mm × 0.5 mm × 0.
35mm). FIG. 3 shows this chip resistor (chip component A).

As shown in FIG. 1 and FIG.
A component storage case 4 is attached to the upper opening. Above the inside of the housing 2, a first component storage chamber 6 for storing chip components A in a three-dimensional space in a three-dimensional space is formed, and below the first component storage chamber 6 and the housing. Along the front surface of the second component 2, a second component storage chamber 8 for storing a large number of chip components A is formed in a two-dimensional space in which components do not overlap each other in the component thickness direction. Further, the chip components A are arranged in a line below the second component storage chamber 8 and along the front side of the housing 2 in a space formed so as to match the cross-sectional shape of the component, and are moved downward. A component alignment passage 10 to be formed is formed. At the lower end of the component alignment passage 10, a component delivery passage 11 for horizontally moving the chip component A to a predetermined position is connected and provided.

More specifically, the second component storage chamber 6
Are formed along a plane (the front side of the housing 2) orthogonal to a component delivery direction F described later. The thickness G of the second component storage chamber 6 (see FIG. 4) corresponds to the thickness T of the chip component A shown in FIG. Here, the thickness T of the chip component A means the minimum value among the length L, the width W, and the thickness T in FIG. Here, the component storage case 4 is mounted on the upper opening 12 of the first component storage chamber 6 of the housing 2, whereby a large number of chip components A stored in the component storage case 4 are stored in the first component storage case 4. It is supplied into the chamber 6. The bottom surface portion 14 of the first component storage chamber 6 forming the three-dimensional component arrangement space is formed to be inclined to such an extent that the chip component A can slide down by its own weight.

The space which communicates with the first component storage chamber 6, the second component storage chamber 8, and the component alignment passage 10 and is formed along a plane orthogonal to the component delivery direction F has a vertical direction. A reciprocating alignment plate 16 is provided.
The alignment plate 16 includes a first alignment portion 18 and a second alignment portion 20. The first alignment portion 18 has two wall members 22 provided separately from each other via a predetermined space in the component delivery direction. As shown in FIG.
An inclined surface 22a is formed at the tip of the right side wall member 22, and an inclined surface 22b, which is an arc-shaped concave portion, is formed at the end of the right wall member 22.
Are formed. The second alignment portion 20 has an inclined groove 24 formed between the two wall members 22 and inclined so that the component slides down by its own weight. The thickness I of the inclined groove 24 is the same as the thickness G of the second component storage chamber 8 and also functions as a part of the second component storage chamber 8. The imaginary line in FIG. 4 indicates the position where the alignment plate 16 has moved upward.

Next, as shown in FIGS. 2, 4, 5 and 6, on the right side (in FIG. 5) of the second component storage chamber 8, a first movable plate 30 is provided with a fulcrum. It is provided so as to be swingable about 32. An inclined surface 30a is formed in a portion of the first movable plate 30 facing the second component storage chamber 8 so that the component can be dropped by its own weight. Board 16
In addition, a straight portion 30b that forms a component passage is formed. A spring 34 is provided at the lower end of the first movable plate 30, and urges the first movable plate 30 in the clockwise direction in FIG. Reference numeral 36 denotes a stopper, and the stopper 36 keeps the first movable plate 30 at a predetermined position even when the first movable plate 30 is urged by the spring 34.

As shown in FIGS. 2, 5 and 6,
The lower part of the first component storage chamber 6 and the right side of the alignment plate 16 (FIG. 5)
And in FIG. 6), the second movable plate 4
0 is provided so as to be swingable about the fulcrum 42. A leaf spring 4 is provided on the right side surface of the second movable plate 40.
4, which urges the second movable plate 40 in the clockwise direction. This second movable plate 40
The part facing the first parts storage chamber 6 is formed with an inclined surface 40a that is inclined so that the parts can be dropped by its own weight.
A vertical surface 40b for forming a part of the second component storage chamber 8 is formed in a portion facing the second component storage chamber 8, and the left end 40c of the second movable plate 40 is aligned. The plate 16 is in contact with the plate 16 so that the alignment plate 16 functions as a stopper.

Further, as shown in FIGS. 2, 4 and 6, a third movable plate 50 is provided at a lower portion of the first component storage chamber 6 and on a back surface of the alignment plate 16 (FIG. 4 and FIG. 6).
Are provided so as to be swingable about the fulcrum 52. A spring 54 is attached to the left side surface of the third movable plate 50, and urges the third movable plate 50 in a counterclockwise direction. An inclined surface 50a is formed at a portion of the third movable plate 50 facing the first component storage chamber 6 so that the component can be dropped by its own weight. The inclined surface 50a and the inclined surface of the left wall member 22 are formed. 22a are continuous when the alignment plate 16 is at the lowermost position. Further, the left end portion 50b of the third movable plate 50 is in contact with the alignment plate 16, whereby
The alignment plate 16 functions as a stopper.

Next, as shown in FIGS. 1 and 7 to 9, a coin-shaped fixed permanent magnet 80 as a fixed magnet means is provided near the connection between the component alignment passage 10 and the component delivery passage 11. It is fixed to the base 82. Further, a rotating disk 84 is provided so as to surround the fixed permanent magnet 80. The rotating disk 84 is made of a non-magnetized material (such as SUS). This rotating disk 8
4 is rotatable clockwise (see FIGS. 1 and 7) about a rotation shaft 84a, and a magnet 8 is provided on its outer peripheral surface 84a.
The chip component A is attracted and rotated by the magnetic force of 0 to smoothly transfer the chip component A from the component alignment passage 10 to the component delivery passage 11. Here, as shown in FIG. 1 and FIG.
The chip component A is mounted in the housing 2 so that the posture of the chip component A is moved downward by its own weight without being twisted in the chip component sending direction F.

Further, as shown in FIG. 7, a connecting portion 10a of the component aligning passage 10 with the component delivery passage 11 is formed with a predetermined radius of curvature along the outer peripheral surface of the rotating disk 84. Therefore, the angle α ₁ between the connecting portion 10a of the component alignment passage 10 and the component delivery passage 11 can be set to a preferable small angle.

Next, as shown in FIG.
A roller device 60 for feeding the chip component A in the feeding direction F is provided below 1. The roller device 60 includes a driven roller 60a provided on the right side in FIG. 1, a driving roller 60b provided on the left side, and a connection between the driven roller 60a and the driving roller 60b. Is constituted by a component conveying belt 60c.

Further, as shown in FIGS. 10 to 12,
A component separation mechanism 62 that separates the chip components A one by one and sends the chip components A to the outside at a predetermined timing is provided at a tip end of the component delivery passage 11. This component separating mechanism 62
The chip component A1 at the front end in the component delivery path 11 sent by the component transport belt 60c is stopped at the position of the front end, and the component is moved in a direction perpendicular to the component delivery direction, and the subsequent 2
Stopper member 64 separated from the second chip component A2
An upper cover member 66 that prevents the chip component A from jumping out of the component delivery passage 11; and a tip component at the tip of the component delivery passage 11 when the tip chip component A1 is separated from the second chip component A2 by the stopper member 64. And a space forming mechanism 86 for forming a space K between A1 and the second chip component A2.

The gap forming mechanism 86 is arranged behind a groove 64a, which will be described later, of the stopper member 64, sucks the tip chip component A1 and moves the tip component A1 by a predetermined distance in the component delivery path 11, thereby moving the second chip component A2. A movable permanent magnet 88, which is a magnet means for a tip chip, which forms a gap K between the tip chip component A1 and a position which is arranged below the component transport belt 60c of the second chip component and forms a gap with the tip chip component A1. 2 to hold the second chip component A2
And a rotary permanent magnet 90 as a chip holding means. The movable permanent magnet 88 is movable between a solid line position and a virtual line position shown in FIGS. In the rotary permanent magnet 90, four permanent magnets 90c are embedded at 90 ° intervals around the outer periphery of a disk 90b rotated by a rotation shaft 90a. The rotary permanent magnet 90 is stationary and holds the second chip component A2 by suction by means of the permanent magnet 90c, and rotates by 90 degrees in the component delivery direction (counterclockwise) so that the subsequent chip component A2 is attracted by the magnet. Send out chip components one by one.

2 holding the second chip component A2
The rotary permanent magnet 90 as the chip holding means is not limited to such a rotary type. When holding the chip component A2, it approaches the chip component, and when sending it out, moves in the vertical or horizontal direction. A movable permanent magnet that operates to move away from the chip component may be used. Further, as the second chip holding means, a type that does not use a magnet, for example, the second chip component A2 is
Alternatively, a mechanical holding mechanism that is fixed within 1 may be used. Note that the movable permanent magnet 88 is
It is configured so that a larger suction force is generated. For this reason, when the rotary permanent magnet 90 rotates and sends out the subsequent chip component forward, the attractive force by the movable permanent magnet 88 is larger than the attractive force by the rotary permanent magnet 90.
The chip component is sent forward without being pulled backward by the magnet following the rotary permanent magnet 90.

Further, the stopper member 64 is formed with a groove 64a large enough to receive just one chip component A. The stopper member 64 is movable in a horizontal direction J orthogonal to the component sending direction F. The upper cover member 66 includes a stopper member 6.
A window 66a large enough to take out the chip component A is formed at the position where the chip 4 is moved horizontally (the position shown in FIG. 11), and the chip component A can be taken out from the window 66a. It has become. Here, FIG.
0 and FIG. 12 show a position where the stopper member 64 receives the chip component A, and FIG. 11 shows a position where the chip component A is taken out.

As shown in FIG. 1, a chip component supply device 1
An automatic mounting device 70 is arranged on the supply side of the chip component A. A nozzle 72 for receiving the chip component A is provided at a lower portion of the main body of the automatic mounting device 70. An actuator arm 74 is provided below the automatic mounting device 70, and a lever member 76 is provided below the actuator arm 74. The lever member 76 is provided with a drive member 78 connected thereto, and one end of the drive member 78 is connected to the alignment plate 1.
6 and the lower end thereof is connected to the rotating shaft 84a of the rotating disk 84, the driving roller 60b of the roller device 60, the stopper member 64, the movable permanent magnet 86 and the rotating shaft 90a of the rotating permanent magnet 90. I have. In this way, the alignment plate 16, the rotating shaft 84 of the rotating disk 84, the driving roller 60b of the roller device 60, the stopper member 64, The rotating shaft 90a of the movable permanent magnet 86 and the rotating permanent magnet 90 is driven, and the chip component A is sent out at this timing.

The rotating shaft 84a of the rotating disk 84, the driving roller 60b of the roller device 60, the stopper member 64,
Rotating shaft 9 of movable permanent magnet 86 and rotating permanent magnet 90
Oa may be driven by an internal drive (for example, a motor, an air cylinder, or the like) built in the housing 2.

Next, the operation of the present embodiment configured as described above will be described. First, the chip components A are supplied into the first component storage chamber 6 from the component storage case 4 in which a large number of chip components A are stored in bulk. Next, the chip components A stored in the three-dimensional space of the first component storage chamber 6 in a state of being piled up in bulk are placed on the bottom portion 14 of the first component storage chamber 6.
Slides down by its own weight along the
The inclined surfaces 22a and 22b of the alignment portion 18 (wall member 22)
And the inclined groove 24 of the second alignment portion 20 (see FIGS. 4 and 5)
, And falls into the second component storage chamber 8. At this time,
Some of the chip components A drop smoothly and directly from the first component storage chamber 6 to the second component storage chamber 8. However, at this time, in the first component storage chamber 6, the components that are aligned on the bottom surface portion 14 of the housing 2 and are likely to slide down by their own weight and the inclined surfaces 22 a and 22 of the first alignment portion 18 of the alignment plate 16.
In some cases, components that are slid down from b may be too concentrated and bite into a wedge shape, so that components aligned on the bottom portion 14 of the first component storage chamber 6 may not be able to fall into the second component storage chamber 8. However, in the present embodiment, by raising the wall member 22 of the alignment plate 16 and pushing it up into the first component storage chamber 6, the chip component A biting into a wedge shape is released upward. As a result, the wedge-shaped biting of the component is eliminated, and at this time, the chip component is smoothly inserted into the inclined groove 24 between the two wall members 22 from the inclined surfaces 22 a and 22 b of the wall member 22 and the side of the wall member 22. And slides down toward the second component storage chamber 8 by its own weight. In this manner, the chip components A are stored in the two-dimensional space in the second component storage chamber 6 without overlapping each other in the thickness direction of the components.

Thereafter, the alignment plate 16 moves downward.
Such vertical movement of the alignment plate 16 is repeated at a predetermined timing.

As described above, when the chip component A moves from the first component storage chamber 6 to the second component storage chamber 8, the alignment plate 16 moves up and down, so that the first alignment portion 18 of the alignment plate 16 is moved. The chip component may be sandwiched between the side of the first component storage chamber 6 and the first component storage chamber 6 (when the alignment plate 16 is raised) or the chip component may be pulled in (when the alignment plate 16 is lowered). . If the component is pinched or pulled in this way, the chip component itself is damaged, and the alignment plate 16 and the second movable plate 40 are undesirably damaged. In the present embodiment, in such a case, the second movable plate 40 swings counterclockwise in FIG. 5 against the urging force of the spring about the fulcrum 42 so that the second movable plate 40 Retreat from the department. As a result, a larger space is formed between the side portion of the alignment plate 16 and the first component storage chamber 6, so that such a chip component is reliably prevented from being pinched or pulled.

Similarly, when the chip component A moves from the first component storage chamber 6 to the second component storage chamber 8,
6 moves up and down, a chip component is sandwiched between the rear surface of the first alignment portion 18 of the alignment plate 16 and the second component storage chamber 8 (when the alignment plate 16 is raised), May be pulled in (during the lowering operation of the alignment plate 16). When the component is pinched or pulled in this way, the chip component itself is damaged, and the alignment plate 16 and the third movable plate 50 are undesirably damaged. In the present embodiment, in such a case, the third movable plate 50 swings clockwise in FIG. 4 against the urging force of the spring about the fulcrum 52, and the alignment plate 1
6 retreats from the back. As a result, a larger space is formed between the rear surface of the alignment plate 16 and the first component storage chamber 6, so that such chip components are reliably prevented from being inserted or pulled.

Next, the chip component A accommodated in the second component storage chamber 8 is moved by its own weight along the inclined groove 24 of the second aligning portion 20 and the inclined surface 30a of the first movable plate 30 by its own weight. Slide down towards. At this time, the part that is aligned on the inclined groove 24 of the second alignment part 20 and slides down by its own weight and the inclined surface 3 of the first movable plate 30
The parts that are aligned on the upper part 0a and are likely to slide down due to their own weight are too concentrated and bite into a wedge shape, and the parts are aligned in the part alignment passage 1.
It may not be possible to fall to zero. However, in the present embodiment, since the alignment plate 16 moves upward,
The inclined surface 24 of the alignment plate 16 moves upward, and the inclined surface 2
4, the wedge-shaped components that are too concentrated near the entrance of the component alignment passage 10 are released upward, thereby eliminating the wedge-shaped bite. At this time, the chip component A is again aligned on the inclined surface 30a of the first movable plate 30, and slides down smoothly toward the component alignment passage 10. Thereafter, the alignment plate 16 moves downward.

As described above, when the chip component A moves from the second component storage chamber 8 to the component alignment passage 10, the alignment plate 16 moves up and down, so that the straight line between the alignment plate 16 and the first movable plate 30 is formed. There is a case where the chip component is interposed between the portion 30b (when the alignment plate 16 moves up) and the chip component is pulled in (when the alignment plate 16 moves down). If the component is pinched or pulled in this way, the chip component itself may be damaged or the alignment plate 16 may be damaged.
In addition, the first movable plate 30 is undesirably damaged. In the present embodiment, in such a case, the first movable plate 30 swings around the fulcrum 32 in the counterclockwise direction in FIG.
Retreat from As a result, a larger space is formed between the alignment plate 16 and the linear portion 30b of the first movable plate 30, so that such chip components are reliably prevented from being pinched or pulled.

Next, the chip component A guided to the component alignment passage 10 falls in the component alignment passage 10 by its own weight, and is transferred to the component delivery passage 11. When the chip component A moves from the component alignment passage 10 to the component delivery passage 11, the chip component A is attracted to the outer peripheral surface 84 b of the rotating disk 84 by the magnetic force of the permanent magnet 80. As described above, the rotating disk 84 rotates by a predetermined angle at a predetermined timing, so that the sucked chip component A moves in the sending direction with the rotation of the rotating disk 84. At this time, since the angle α ₁ between the connection portion 10a of the component alignment passage 10 and the component delivery passage 11 is a small angle, the chip component does not become oblique to the moving direction, A can smoothly move from the component alignment passage 10 to the component delivery passage 11.

Next, the chip component is placed on the component transport belt 60c of the roller device 60, is transported in the component delivery direction F, and stops in contact with the groove 64a of the stopper member 64 (see FIGS. 10 and 12). . At this time, the movable permanent magnet 88 is located at the position shown by the solid line in FIGS. 10 and 12, and attracts the tip component A1 at the tip to the groove 64a of the stopper member 64 by the magnetic force. As a result, the tip chip component A1 is inserted into the groove 64a of the stopper member 64.
At a speed higher than the conveying speed of the belt, and furthermore, in the groove of the tip chip component A1.
Intrusion into 4a is ensured. At the same time, the rotary permanent magnet 90 is stopped at the position shown in FIG. Thereby, the second chip component A2 in the component delivery passage 11 is attracted by the permanent magnet 90c embedded in the rotary permanent magnet 90 and moves backward. Thereby, the tip chip component A1 and the second chip component A2
A gap K required for separation is formed between the two.

In this manner, the groove 64a of the stopper member 64 is quickly and surely formed.
1 and a gap K required for separation between the second chip component A1 and the second chip component A1, the stopper member 64, as shown in FIG.
It horizontally moves by a predetermined distance in a direction orthogonal to the component sending direction F of 0c. The horizontal movement of the stopper member 64 separates the tip chip component A1 from the second chip component A2. At this time, since the interval K is formed between the first chip component A1 and the second chip component A2, the tip chip component A1 is not pressed against the subsequent second and subsequent chip components. Thus, the stopper member 64 can easily move horizontally.
Simultaneously with the horizontal movement of the stopper member 64 to the component take-out position, the movable permanent magnet 88 is moved to the position shown by the solid line in FIG. 11 (the position shown by the phantom line in FIGS. 10 and 12), that is, the tip chip component A1 at the tip. It is stably held and retracted to a position where a magnetic force acts so as not to affect the removal of the chip component. Thereby, the automatic mounting device 7
When the zero nozzle 72 takes out the tip chip component A1 to the outside, the automatic mounting device 70 can reliably take out the component.

Further, since the upper cover member 66 is provided, the chip component A is prevented from jumping out. Then, from the window 66a formed in the upper cover member 66,
The leading chip component A1 is taken out to the outside by the nozzle 72 of the automatic mounting device 70. After the leading chip component A1 is thus taken out, the stopper member 6
4 and the movable permanent magnet 88 return to their original positions shown in FIGS. After this, the rotating permanent magnet 9
12 is rotated 90 degrees counterclockwise as shown in FIG. 12, and the second tip A2 is sent out toward the inside 64a of the stopper member 64 by the magnetic force of the permanent magnet 90c. At this time, since the movable permanent magnet 88 is configured to generate a larger attractive force than the rotary permanent magnet 90, the chip component A2 is connected to the permanent magnet 90 next to the rotary permanent magnet 90.
It is sent forward without being pulled back by c. Further, the movable permanent magnet 88 is
As described above, the second chip component A2 sent out at 0 is brought into contact with the inside 64a of the groove of the stopper member 64 at a high speed as described above.

Thereafter, the same operation is repeated, and the second and subsequent chip components A are taken out one by one.

In this embodiment, as described above, in order to separate the tip chip component A1 from the second chip component A2, the stopper member 64 is moved in the direction J orthogonal to the component delivery direction F. (Figures 10 and 1
1). However, in the present embodiment, FIG.
As shown in FIG. 3, the stopper member may be moved in the same direction as the component delivery direction F. That is, FIG.
As shown in (a), the tip chip component A <b> 1 that has moved in the component delivery passage 11 is stored in the groove of the stopper member 92. At this time, the movable permanent magnet 94 is located behind the stopper member 92 so as to increase the speed of moving the tip component A1 into the groove. Next, as shown in FIG. 13B, in order to separate the tip chip component A1 from the second chip component A2, the stopper member 92 and the movable permanent magnet 94 are moved in the same direction as the component delivery direction F. Let it. Next, as shown in FIG. 13 (c), only the movable permanent magnet 94 is moved backward to a position where a magnetic force acts so as not to affect the removal of the chip component while stably holding the tip component. Let it. Thereafter, the tip chip component A1 housed in the groove of the stopper member 92 at this position is taken out to the outside by the nozzle 72 of the automatic mounting device 70.

Next, another embodiment of the present invention will be described with reference to FIGS. This embodiment is a chip component supply device that does not use a component transport belt.
Structures other than those shown in FIG. 14 and FIG. 15 are the same as those of the embodiment shown in FIG. 1 to FIG. 13, and the description thereof will be omitted. FIG. 14 is a side sectional view of a main part showing another embodiment of the present invention when the transport plate moves in the component delivery direction. FIG. 15 shows the present invention when the transport plate moves in the direction opposite to the component delivery direction. It is a principal part side sectional drawing which shows other embodiment. As shown in FIGS. 14 and 15, the lower portion of the component alignment passage 10 is connected to the component delivery passage 11 via a connection portion 10a having a predetermined radius of curvature.
A fixed permanent magnet 80 is arranged near the connection portion 10a, and a rotating disk 84 is provided so as to surround the fixed permanent magnet 80.

Next, a transport plate 100 is provided on the lower surface of the component delivery passage 11 so as to be in contact with the chip component A. In this embodiment, the transport plate 100 is provided on the lower surface of the component delivery passage 11, but is not limited thereto, and may be provided on another surface such as a side surface of the component delivery passage 100. That is, the transport plate 100 may be provided so as to form a part of the inner surface of the component delivery passage 11. The transport plate 100 is made of a non-magnetic material such as stainless steel, and can reciprocate between the component delivery direction and the opposite direction.
An L-shaped actuator member 102 is attached to the right end of the transport plate 100. The actuator member 102 is a driving member for reciprocating the transport plate 100, and a magnet elevating rod 104 is attached to a lower left portion thereof via a spring 106. This spring 106 allows the magnet lifting rod 104
Is urged leftward in the figure.

Further, a magnet mounting block 108 is fixedly arranged so as to surround the component delivery passage 11. The component delivery passage 11 of the magnet mounting block 108
Below, a delivery magnet 110 and a tapered member 112 are attached. The sending magnet 110 and the tapered member 112 can be integrally moved up and down in the magnet mounting block 108. Magnet mounting block 1
08, the holding and stopping magnet 1
14 are attached. Further, the holding / stopping magnet 11
4 and a magnet mounting block 108, a spring 116
Is attached to urge the holding / stopping magnet 114 downward. The holding / stopping magnet 114 can also be moved up and down in the magnet mounting block 108. When the magnet 114 is moved up, it rises integrally with the sending magnet 110, and when it descends, it descends quickly by the urging force of the spring 116. ing.

Next, the operation of this embodiment will be described. The actuator member 102 is provided with the automatic mounting device 7 described above.
A reciprocating motion is performed in the component sending direction and the opposite direction at the timing synchronized with the vertical movement of 0. At this time, the transport plate 100 reciprocates integrally with the actuator member 102. When the transfer plate 100 is moved in the component delivery direction by the actuator member 102, as shown in FIG. 14, the tip of the magnet lifting rod 104 of the actuator member 102 comes into contact with the tapered lower surface of the tapered member 112. As a result, the delivery magnet 110 and the tapered member 112 rise in the magnet mounting block 108. At the same time, the holding / stopping magnet 114 is also moved to the magnet mounting block 108.
And moves away from the component delivery passage 11. Delivery magnet 1
When the component 10 is moved up to a position close to the transport plate 100, the chip component A on the transport plate 100 is attracted to the transport plate 100. As a result, the chip component A is placed on the transport plate 100 together with the component. Move in the sending direction.

Next, when the transport plate 100 is moved by the actuator member 102 in the direction opposite to the component delivery direction, as shown in FIG.
The tip of the magnet elevating rod 104 also moves in the opposite direction,
The delivery magnet 110 and the tapered member 112 that come into contact with this
Descends. At the same time, the holding / stopping magnet 114 is lowered by the urging force of the spring 116 to a position close to the component delivery passage 11. In this state, the chip component A is attracted in the component delivery passage 11 by the magnetic force of the holding / stopping magnet 114 without being affected by the magnetic force of the delivery magnet 110. As a result, even if the transport plate 100 moves in the direction opposite to the component sending direction, the chip component A is held at the sucked position, and the movement in the reverse direction is stopped. At this time, the chip component A is in a state of sliding on the transport plate 100.

In this manner, the reciprocating motion of the transport plate 100 is repeated, and the chip components A in the component delivery path 11 are sequentially delivered to a predetermined position. As described above, in this embodiment, since the transport plate is used instead of the component transport belt, the chip components in the component delivery path 111 can be more smoothly sent out toward the distal end. Furthermore, in this embodiment, since the component transport belt is not used, the standing of the chip component A and the overlapping of the components do not occur in the component delivery path 111 described above. In this embodiment, the transport plate 100
Is moved in the direction opposite to the component delivery direction, the chip component A in the component delivery path 11 is held by the holding / stopping magnet 114.
And stops the movement in the opposite direction. However, although it is preferable to provide the holding / stopping magnet 114, it may be omitted if necessary. In this case, the above-mentioned fixed permanent magnet 80 and rotating disk 84 exhibit similar functions. That is,
Since the chip component A is attracted to the outer peripheral surface 84a of the rotating disk 84 and rotated by the magnetic force of the fixed permanent magnet 80, the movement of the chip component A in the component delivery passage 11 in the reverse direction is stopped. Can be.

Further, in this embodiment, as described above, it is preferable to provide the fixed permanent magnet 80 and the rotating disk 84, but these can be omitted if necessary. However, in this case, it is necessary to provide the holding / stopping magnet 114.

Next, another embodiment of the present invention will be described with reference to FIG. The embodiment shown in FIG.
4 and FIG. 15, this type of chip component supply device does not use a component transport belt. FIG.
The configuration other than that shown in FIG. 6 is the same as that of the embodiment shown in FIGS. 1 to 13, and a description thereof will be omitted. FIG. 16 is a main part plan view showing another embodiment of the present invention when the transport plate moves in the direction opposite to the component delivery direction F. In this embodiment, on the upstream side of the component delivery passage 11,
A fixed permanent magnet 80 and a rotating disk 84 (see FIG. 7) are provided, and a chip is provided on the lower surface of the component delivery passage 11 on the downstream side of the permanent magnet 80 and the rotating disk 84, as shown in FIG. The transfer plate 200 is brought into contact with the part A.
Is provided. The transfer plate 200 is made of a non-magnetic material such as stainless steel, and is capable of reciprocating between the component sending direction F and the opposite direction. Below the transfer plate 200, the transfer plate 2
There is provided a base 202 for supporting 00 in a reciprocating manner. At a position below the transport plate 200 of the base 202, a plurality of chip sending magnets 204 are fixedly provided. Note that these chip sending magnets 20
Reference numeral 4 is provided at a position other than the vicinity of a chip stop groove 208 described later.

On both sides of the component delivery passage 11, a chip guide plate 2 made of a non-magnetic material such as stainless steel is provided.
06,207 are fixedly provided. On one chip guide plate 206, for example, two chip stopping grooves 208 for holding and stopping chip components are formed. These chip stopping grooves 208 include a chip housing surface 208a formed obliquely toward the upstream side and a chip engagement surface 208b formed in a direction perpendicular to the feeding direction. Furthermore, this tip guide plate 2
In the vicinity of the two chip stop grooves 208, a chip side attracting magnet 210 is embedded.

Next, the operation of this embodiment will be described. The transport plate 200 reciprocates in the component delivery direction F and in the opposite direction at a timing synchronized with the vertical movement of the automatic mounting device 70 described above. When the transport plate 200 moves in the component delivery direction F, the chip component A on the transport plate 200 is attracted to the transport plate 200 by the magnetic force of the chip delivery magnet 204, and as a result, the chip component A is placed on the transport plate 200. In the state of being moved, it moves together with the transport plate 200 in the component delivery direction F. Next, when the transport plate 200 moves in the direction opposite to the component delivery direction F, the chip components A on the transport plate 200 are attracted to the transport plate 200 by the magnetic force of the chip delivery magnet 204, The component A also moves in the direction opposite to the component delivery direction F. At this time, as shown in FIG. 16, the chip component A in the component delivery passage 11 is moved by the magnetic force of the chip side attracting magnet 210 to the chip housing surface 208.
a, and comes into contact with the chip engaging surface 208b, is held in the chip stopping groove 208, and stops. At this time,
Since the chip sending magnet 204 is not provided in the vicinity of the chip stopping groove 208, the chip component A smoothly moves toward the chip stopping groove 208 by the magnetic force of the chip side attracting magnet 210. be able to.
As a result, all the chip components downstream of the stopped chip components A are replaced with the stopped chip components A.
Thus, movement in the direction opposite to the sending direction is restricted. At this time, these stopped chip components A are transferred to the transport plate 2
00 is in a state of sliding.

In this way, the reciprocating motion of the transport plate 200 is repeated, and the chip components A in the component delivery passage 11 are sequentially delivered to a predetermined position.

As described above, in this embodiment, since the transport plate 200 is used instead of the component transport belt, the chip components in the component delivery passage 111 can be more smoothly sent out toward the distal end. Further, in this embodiment, since the component conveying belt is not used, the standing of the chip components A and the overlapping of the components do not occur in the component delivery passage 11 described above. Also in this embodiment, as described above, it is preferable to provide the fixed permanent magnet 80 and the rotating disk 84, but these can be omitted as necessary.

Next, another embodiment of the present invention will be described with reference to FIG. The embodiment of the present invention shown in FIG. 17 is a modified example of the embodiment shown in FIG. Therefore, the same components as those shown in FIG. 16 are denoted by the same reference numerals, and description thereof will be omitted. FIG. 17 is a plan view of a principal part showing another embodiment of the present invention when the transport plate moves in the direction opposite to the component delivery direction F. As shown in FIG. 17, one of the chip guide plates provided on both sides of the component delivery passage 11 is divided into an upstream chip guide plate 216 and a downstream chip guide plate 218. These upstream chip guide plates 216
In the space between and the downstream chip guide plate 218,
An L-shaped swing plate 220 is provided. The swing plate 220 is supported by a fulcrum 2 provided on the right side thereof.
It can swing (rotate) about 20a. A tip engaging portion 220b is formed at the left end of the swing plate 220 facing the component delivery passage 11 for a predetermined distance into the component delivery passage 11. A stopper 222 is provided on the side of the swing plate 220 of the upstream side tip guide plate 216.
Further, a leaf spring 224 having one end attached at an attachment point 226 is provided on the upstream side outside the swing plate 220.
Are provided so as to urge the swing plate 220 toward the component delivery passage 11 side.

As shown in FIG. 17, when there is no chip component in the portion of the swing plate 220 where the chip engaging portion 220b is located in the component delivery passage 11, the leaf spring 224 is used.
Of the swing plate 220 by the urging force of the stopper 222
And the chip engaging portion 220b of the swing plate 220
Enters the inside of the component delivery passage 11 by a predetermined distance, and at this time, the width of the other chip guide plate 207 and the chip engaging portion 220b of the swing plate 220 is the width W of the chip component A (see FIG. 3). ) Is slightly smaller. On the other hand, when the chip component is present in the portion of the swing plate 220 where the chip locking portion 220b is located in the component delivery passage 11, the chip locking portion 220b of the swing plate 220 is A side is lightly pressed.

Further, the downstream tip guide plate 21
8, a chip storage surface 228 formed obliquely toward the upstream side is formed at a downstream end portion facing the component delivery passage 11, and a pivot plate 220 is provided immediately upstream of the chip storage surface 228. The stop 220b is located. In the vicinity of the chip storage surface 228, a chip side attracting magnet 210 is provided.

Next, the operation of this embodiment will be described. As described above, the transport plate 200 reciprocates in the component delivery direction F and the opposite direction at a timing synchronized with the vertical movement of the automatic mounting device 70. Transport plate 20
When 0 moves in the component sending direction F, the chip component A on the transfer plate 200 is attracted to the transfer plate 200 by the magnetic force of the chip sending magnet 204, and as a result, the chip component A is placed on the transfer plate 200. Moves in the component delivery direction F together with the transport plate 200. At this time, the tip guide plate 207 and the swing plate 22
Chip part A between the chip engaging part 220b
The side surface of the chip engaging portion 22 of the swing plate 220
Although the chip component A is pressed by 0b, the pressing force (biasing force) is not so large, and the chip component A overcomes the pressing force and moves in the component delivery direction F together with the transport plate 200.

Next, when the transport plate 200 moves in the direction opposite to the component delivery direction F, the chip components A on the transport plate 200 are attracted to the transport plate 200 by the magnetic force of the chip delivery magnet 204. Therefore, the chip component A similarly moves in the direction opposite to the component delivery direction F. At this time, the tip guide plate 207 and the swing plate 2
Since the chip component A existing between the chip engaging portion 220b and the chip engaging portion 220b has a weak pressing force of the chip engaging portion 220b, the chip component A moves in the direction opposite to the component sending direction F together with the transport plate 200. Accordingly, the tip locking portions 22 of the tip guide plate 207 and the swing plate 220
0b, the chip component A no longer exists. As a result, the chip engaging portion 220b of the swing plate 220 enters the component delivery passage 11. At this time, as described above, the tip guide plate 207 and the swing plate 220
Of the chip part A is the width W of the chip part A.
Since the chip component A is slightly smaller, the chip component A downstream of the chip engaging portion 220b is moved in the reverse direction by the transfer plate 200, and is moved by the magnetic force of the chip-side attracting magnet 210. 22
8 and the chip engaging portion 2 of the swing plate 220
20b, and this chip component A is held and stopped at this position. As a result, this stopped chip component A
All the chip components on the downstream side are restricted by the stopped chip component A from moving in the direction opposite to the sending direction. At this time, these stopped chip components A are in a state of sliding on the transport plate 200.

As described above, the reciprocating motion of the transport plate 200 is repeated, and the chip components A in the component delivery passage 11 are sequentially delivered to a predetermined position. In this embodiment, since the swing plate 220 is used, FIG.
As compared with the embodiment shown in FIG. 6, the width of the component delivery passage 11 can be made smaller. Accordingly, it is possible to more reliably prevent the standing of the chip component A, the overlapping of the components, and the like in the component delivery path 11 as compared with those in FIG.

[0059]

As described above, according to the chip supply apparatus of the present invention, after the chip components are aligned in a line, the posture of the chip components is smoothly changed without abrupt change from the vertical direction to the horizontal direction. Can be sent to a location. Further, according to the present invention, when separating the first chip component and the second chip component, the second chip component is not damaged. Further, according to the present invention, it is possible to reliably take out the chip component. Furthermore, according to the present invention, there is no need to use a component conveying belt,
It is possible to prevent parts standing or parts from overlapping in the parts delivery path.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing an embodiment of a chip component supply device according to the present invention.

FIG. 2 is a partially developed perspective view showing the chip component supply device of FIG. 1;

FIG. 3 is a perspective view showing a chip component.

FIG. 4 is a partial cross-sectional view as viewed from a direction P in FIG. 2;

FIG. 5 is a partial side view seen from the Q direction in FIG. 2;

FIG. 6 is a sectional view taken along line RR in FIG. 5;

FIG. 7 is a partial side sectional view showing a fixed permanent magnet and a rotating disk of the chip component supply device of FIG. 1;

8 is a partial front view of the fixed permanent magnet and the rotating disk shown in FIG. 7 as viewed from a direction opposite to a component sending direction.

FIG. 9 is a perspective view showing a fixed permanent magnet.

FIG. 10 is a partial plan view showing the operation (part receiving position) of the part separating mechanism at the end of the roller device.

FIG. 11 is a partial plan view showing the operation (part take-out position) of the part separating mechanism at the end of the roller device.

FIG. 12 is a sectional view taken along line CC of FIG. 10;

FIG. 13 is a partial plan view showing a component separation mechanism configured to separate a chip component in a component delivery direction.

FIG. 14 is a side sectional view of a main part showing another embodiment of the present invention when the transport plate moves in the component delivery direction.

FIG. 15 is a side sectional view of a main part showing another embodiment of the present invention when the transport plate moves in the direction opposite to the component delivery direction.

FIG. 16 is a main part plan view showing another embodiment of the present invention when the transport plate moves in a direction opposite to the component delivery direction.

FIG. 17 is a main part plan view showing another embodiment of the present invention when the transport plate moves in the direction opposite to the component delivery direction.

[Explanation of symbols]

Reference Signs List 1 chip component supply device 6 first component storage chamber 8 second component storage chamber 10, 110 component alignment passage 11, 111 component delivery passage 16 alignment plate 60 roller device 60c component transport belt 62 component separation mechanism 64, 92 stopper member 66 upper part Cover member 70 Automatic mounting device 80 Fixed permanent magnet (fixed magnet means) 82 Base 84 Rotating disk 86 Spacing mechanism 88, 94 Movable permanent magnet (magnet means for tip chip) 90 Rotary permanent magnet (for second chip) 100, 200 Transfer plate 102 Actuator member 108 Magnet mounting block 110 Sending magnet 114 Holding / holding magnet 204 Chip sending magnet 206, 207 Chip guide plate 208 Chip stopping groove 210 Chip side attracting magnet 216 Upstream side Tip guide plate 218 Downstream tip guide plate 220 Swing plate 228 Chip storage surface 224 Leaf spring

────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] January 29, 1998

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006]

According to a first aspect of the present invention, there is provided a chip component supply apparatus for supplying a large number of chip components in a bulk state in a line and supplying the chip parts in a bulk state. A component storage chamber for accommodating a large number of chip components, a component alignment passage provided below the component storage chamber for aligning chip components in a line and moving downward, and a component storage passage connected to the component alignment passage. A component delivery path,
Fixed magnet means fixedly disposed in the vicinity of the connection between the component alignment passage and the component delivery passage, and rotating plate means provided to surround the fixed magnet means,
Rotating plate means for adsorbing and rotating the chip component on the outer peripheral surface of the rotating plate means by the fixed magnet means to move the chip component from the component alignment passage to the component delivery passage, and a component delivery device provided below the component delivery passage. And a component conveying belt for feeding chip components in the passage to a predetermined position.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

According to the first aspect of the present invention, a large number of chip components in a bulk state are moved downward from the component storage chamber in a line in the component alignment passage. The chip component near the connection between the component alignment passage and the component delivery passage is attracted to the outer peripheral surface of the rotating plate means by the fixed magnet means, and is transferred from the component alignment passage to the component delivery path by rotation of the rotating plate means. Thereafter, the chip components in the component delivery path are sent out to a predetermined position by the component transport belt.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction contents]

According to a second aspect of the present invention, there is provided a chip component supply apparatus for supplying a large number of chip components in a bulk state in a line, and a component storage chamber for storing a large number of chip components in a bulk state. A component alignment passage provided below the component storage chamber for aligning and moving chip components in a line, and a component delivery passage connected to the component alignment passage via a connection having a predetermined radius of curvature. A transport plate provided so as to form a part of the inner surface of the component delivery path and transporting the chip component in the component delivery direction by reciprocating in the component delivery direction and the opposite direction; When moving in the direction, the magnetic force attracts the chip component onto the transport plate and moves the chip component together with the transport plate in the component delivery direction. A stage, and a chip component stopping means for stopping the movement in the opposite direction of the chip component parts delivery passage when the carrier plate is moved in the opposite direction of the component feed direction,
It is characterized by having.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

In the second aspect of the present invention, a large number of chip components in a bulk state move downward from the component storage chamber in a row in the component alignment passage. The chip component in the component alignment passage moves to the component delivery passage by moving the transport plate in the component delivery direction through the connection portion of the component delivery passage. Chip components in the component delivery path
When the carrier plate moves in the component delivery direction, it is attracted onto the carrier plate by the magnetic force of the chip component delivery magnet means, and is delivered by the movement of the carrier plate in the component delivery direction. On the other hand, when the transport plate moves in the direction opposite to the component delivery direction, the movement of the chip component in the component delivery path in the reverse direction is stopped by the chip component stopping means. Such reciprocating motion of the transport plate is repeated,
Chip components in the component delivery path are sequentially delivered in the component delivery direction.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction contents]

In the second aspect of the present invention, preferably, the chip component stopping means absorbs the chip component in the component delivery passage by the magnetic force when the transport plate moves in a direction opposite to the component delivery direction. This is a chip component stopping magnet means for stopping the movement in the reverse direction. In this case, there are further provided fixed magnet means fixedly disposed in the vicinity of a connection portion between the component alignment passage and the component delivery passage, and rotating plate means provided so as to surround the fixed magnet means. And rotating plate means for adsorbing and rotating the chip component by the fixed magnet means on the outer peripheral surface thereof to move the chip component from the component alignment passage to the component delivery passage. In the second aspect of the present invention, preferably, furthermore, a fixed magnet means fixedly disposed near a connection between the component alignment passage and the component delivery passage, and a rotating plate provided so as to surround the fixed magnet means Rotating plate means for adsorbing and rotating the chip component on the outer peripheral surface of the rotating plate means by the fixed magnet means and moving the chip component from the component alignment passage to the component delivery passage. The fixed magnet means and the rotating plate means also function as the chip component stopping means.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI B65G 47/14 B65G 47/14 M (72) Inventor Hiroomi Kobayashi 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric (72) Inventor Masao Okado 2-5-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd.

Claims (9)

[Claims] 1. A chip component supply device for supplying a large number of chip components in a bulk state in a line, comprising: a component storage chamber for storing a large number of chip components in a bulk state; A component alignment passage for aligning the chip components in a line and moving the component components downward; a component delivery passage connected to the component alignment passage; and a vicinity of a connection between the component alignment passage and the component delivery passage. Fixed magnet means fixedly disposed; and rotating plate means provided so as to surround the magnet means. The chip components are attracted to the outer peripheral surface of the rotating plate means by the fixed magnet means and rotated to rotate the chip parts. A rotating plate means for moving from the component alignment passage to the component delivery passage; and a chip component provided below the component delivery passage for feeding the chip component in the component delivery passage to a predetermined position. A chip component supply device, comprising: a component conveying belt; 2. The apparatus according to claim 1, further comprising a component separating mechanism provided at a distal end of said component delivery passage, wherein said component separating mechanism receives only one chip component at the distal end of said component delivery passage and at the same time, receives said tip component. Is moved in a predetermined direction to separate the chip component from the second chip component. When the tip component is separated by the stopper member, the stopper member is located between the tip chip component and the second chip component in the component delivery passage. A gap forming means for forming a gap for separation, wherein the gap forming means is disposed near the stopper member and attracts and moves the tip component at the tip; And a second chip holding means which is arranged near the component and holds the second chip component at a position where an interval is formed with the tip chip component. The chip component supply device according to claim 1. 3. The tip tip magnet means, when the tip chip component is taken out, can stably hold the tip chip component and can be moved to a position where a magnetic force acts so as not to affect the chip component removal. The chip component supply device according to claim 2, wherein: 4. A chip component supply device for supplying a large number of chip components in a piled state in a line, comprising: a component storage chamber for accommodating a large number of chip components in a piled state; A component alignment passage for aligning the chip components in a row and moving the component components downward; a component delivery passage connected to the component alignment passage via a connection portion having a predetermined radius of curvature; A transport plate provided to form a part of the inner surface and transporting the chip component in the component delivery direction by reciprocating in the component delivery direction and the opposite direction, and transporting when the transport plate moves in the component delivery direction A chip component delivery mug that approaches the plate and attracts the chip component onto the carrier plate by its magnetic force to move the chip component together with the carrier plate in the component delivery direction. And a chip component stopping means for stopping movement of the chip component in the component delivery path in the reverse direction when the transport plate moves in the direction opposite to the component delivery direction. Parts supply equipment. 5. The chip component stopping means holds the chip component by adsorbing the chip component in the component delivery passage by the magnetic force when the transport plate moves in a direction opposite to the component delivery direction and by the magnetic force. 5. The chip component supply device according to claim 4, wherein the device is a chip component holding / stopping magnet means for stopping the movement in the opposite direction. 6. A fixed magnet means fixedly disposed in the vicinity of a connection portion between the component alignment passage and the component delivery passage, and a rotating plate means provided to surround the fixed magnet means, Rotating plate means for adsorbing and rotating the chip component by the fixed magnet means on the outer peripheral surface of the plate means to move the chip component from the component alignment passage to the component delivery passage; and these fixed magnet means and rotary plate means 5. The chip component supply device according to claim 4, wherein said device also functions as said chip component stopping means. 7. A fixed magnet means fixedly disposed in the vicinity of a connection portion between the component alignment passage and the component delivery passage, and a rotating plate means provided so as to surround the fixed magnet means. 6. The chip according to claim 5, further comprising: rotating plate means for adsorbing and rotating the chip component by the fixed magnet means on the outer peripheral surface of the plate means to move the chip component from the component alignment passage to the component delivery passage. Parts supply equipment. 8. A component separation mechanism provided at a tip of the component delivery passage, the component separation mechanism accepting only one tip component at the tip of the component delivery passage and providing a tip component at the tip. Is moved in a predetermined direction to separate the chip component from the second chip component. When the tip component is separated by the stopper member, the stopper member is located between the tip chip component and the second chip component in the component delivery passage. A gap forming means for forming a gap for separation, wherein the gap forming means is disposed near the stopper member and attracts and moves the tip component at the tip; And a second chip holding means which is arranged near the component and holds the second chip component at a position where an interval is formed with the tip chip component. The chip component supply device according to claim 4, wherein 9. The tip tip magnet means, when the tip tip component is taken out, can stably hold the tip tip component and can be moved to a position where a magnetic force acts so as not to affect the tip component take-out. 9. The chip component supply device according to claim 8, wherein: