JP2000277961A - Device and method for cooling heat generating element - Google Patents
Device and method for cooling heat generating elementInfo
- Publication number
- JP2000277961A JP2000277961A JP11083000A JP8300099A JP2000277961A JP 2000277961 A JP2000277961 A JP 2000277961A JP 11083000 A JP11083000 A JP 11083000A JP 8300099 A JP8300099 A JP 8300099A JP 2000277961 A JP2000277961 A JP 2000277961A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- liquid
- heating element
- cooled
- switching element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、発熱素子の冷却装
置および発熱素子の冷却方法に関する。The present invention relates to a cooling device for a heating element and a method for cooling the heating element.
【０００２】[0002]
【従来の技術】従来、この種の発熱素子の冷却装置とし
ては、液冷ヒートシンクの開口部に発熱素子であるＩＧ
ＢＴ素子（スイッチング素子）により構成されるインバ
ータを取り付けてＩＧＢＴ素子を冷却するものが提案さ
れている（例えば、特開平９−１２１５５７号公報な
ど）。この装置では、ＩＧＢＴ素子により生じる熱を熱
伝導により液冷ヒートシンクに伝え、この熱を液冷ヒー
トシンクの開口部に形成される冷却媒体の流路に水等の
冷却媒体を流して除去することによりＩＧＢＴ素子を冷
却している。2. Description of the Related Art Conventionally, as a cooling device for a heating element of this type, an IG as a heating element is provided at an opening of a liquid cooling heat sink.
There has been proposed a device for cooling an IGBT device by attaching an inverter constituted by a BT device (switching device) (for example, Japanese Patent Application Laid-Open No. 9-121557). In this device, heat generated by the IGBT element is transmitted to the liquid cooling heat sink by heat conduction, and the heat is removed by flowing a cooling medium such as water through a cooling medium flow path formed in the opening of the liquid cooling heat sink. The IGBT element is being cooled.
【０００３】他の発熱素子の冷却装置としては、半導体
素子をフレオンで液封すると共に半導体素子間に隔壁を
設けてなるものが提案されている（例えば、特開昭５７
−１４１９４５号公報など）。この装置では、フレオン
が沸騰する際の気化熱を半導体素子から奪うことにより
半導体素子を冷却している。また、隔壁を設けることに
より半導体素子間に気泡の膜が生じて冷却効果を低下さ
せることを防止している。As another cooling device for a heating element, there has been proposed an apparatus in which a semiconductor element is liquid-sealed with Freon and a partition is provided between the semiconductor elements (for example, Japanese Patent Application Laid-Open No. 57-15757).
141945). In this apparatus, the semiconductor element is cooled by depriving the semiconductor element of heat of vaporization when freon boils. Further, the provision of the partition wall prevents a film of bubbles from being generated between the semiconductor elements, thereby preventing the cooling effect from being lowered.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、液冷ヒ
ートシンクを用いてＩＧＢＴ素子を冷却する装置では、
効果的で十分な冷却をすることができないといった問題
があった。近年、インバータ等を含むすべての機器は小
型化が要求されており、こうした小型化に伴いインバー
タのスイッチング素子も密集して配置される。したがっ
て、このスイッチング素子を十分に冷却する必要がある
が、熱伝導による冷却では十分に熱を除去することがで
きない。However, in an apparatus for cooling an IGBT element using a liquid-cooled heat sink,
There was a problem that effective and sufficient cooling could not be achieved. In recent years, all devices including an inverter and the like have been required to be miniaturized. With such miniaturization, switching elements of the inverter are also densely arranged. Therefore, although it is necessary to sufficiently cool the switching element, heat cannot be sufficiently removed by cooling by heat conduction.
【０００５】半導体素子をフレオンで液封する装置で
は、装置が傾いたときに半導体素子の一部がフレオンに
よる液封から解除され、半導体素子が十分に冷却されな
い場合を生じるという問題があった。また、半導体素子
を長時間使用すると、フレオンが沸騰温度となって気化
が激しくなり、半導体素子の周囲に沸騰膜が生じて半導
体素子が十分に冷却されないという問題もあった。[0005] In an apparatus for liquid-sealing a semiconductor element with freon, there is a problem that when the apparatus is tilted, a part of the semiconductor element is released from liquid-sealing by freon, and the semiconductor element may not be cooled sufficiently. In addition, when a semiconductor element is used for a long time, Freon reaches a boiling temperature and becomes highly vaporized, so that there is a problem that a boiling film is formed around the semiconductor element and the semiconductor element is not sufficiently cooled.
【０００６】本発明の発熱素子の冷却装置は、発熱素子
を効率よく十分に冷却することを目的の一つとする。ま
た、本発明の発熱素子の冷却装置は、装置が傾いた状態
でも発熱素子を十分に冷却することを目的とする。さら
に、本発明の発熱素子の冷却装置は、装置全体としての
小型化を目的の一つとする。本発明の発熱素子の冷却方
法は、発熱素子を効率よく十分に冷却する手法を提供す
ることを目的の一つとする。An object of the cooling device for a heating element of the present invention is to efficiently and sufficiently cool the heating element. It is another object of the present invention to provide a cooling device for a heating element that sufficiently cools the heating element even when the device is inclined. Further, another object of the present invention is to reduce the size of the entire heating device. An object of the method for cooling a heating element of the present invention is to provide a method for efficiently and sufficiently cooling the heating element.
【０００７】[0007]
【課題を解決するための手段およびその作用・効果】本
発明の発熱素子の冷却装置および発熱素子の冷却方法
は、上述の目的の少なくとも一部を達成するために以下
の手段を採った。Means for Solving the Problems and Actions and Effects Thereof The cooling device for the heating element and the method for cooling the heating element of the present invention employ the following means in order to at least partially achieve the above-mentioned object.
【０００８】本発明の発熱素子の冷却装置は、発熱素子
を冷却する冷却装置であって、前記発熱素子の許容動作
雰囲気温度より低い沸点を有する冷却液体を用いて該発
熱素子を液封する液封手段と、前記冷却液体を冷却する
冷却手段とを備えることを要旨とする。[0008] A cooling device for a heating element according to the present invention is a cooling device for cooling the heating element, wherein a liquid for sealing the heating element using a cooling liquid having a boiling point lower than an allowable operating ambient temperature of the heating element. The gist of the present invention is to include sealing means and cooling means for cooling the cooling liquid.
【０００９】この本発明の発熱素子の冷却装置では、発
熱素子の許容動作雰囲気温度より低い沸点を有する冷却
液体が気化する際の気化熱を発熱素子から直接または間
接に奪って発熱素子を冷却するから、冷却効率の高いも
のとすることができる。しかも、冷却手段により冷却液
体を冷却することにより、気化した冷却液体のガスを液
化して再び発熱素子の冷却に使用できるようにするか
ら、発熱素子の動作雰囲気温度をその許容温度範囲内と
することができる。In the cooling device for a heating element according to the present invention, the heating element is cooled by directly or indirectly taking off the heat of vaporization when the cooling liquid having a boiling point lower than the allowable operating ambient temperature of the heating element evaporates. Therefore, the cooling efficiency can be high. Moreover, since the cooling liquid is cooled by the cooling means, the vaporized cooling liquid gas is liquefied and can be used again for cooling the heating element. Therefore, the operating atmosphere temperature of the heating element is set within the allowable temperature range. be able to.
【００１０】こうした本発明の発熱素子の冷却装置にお
いて、前記液封手段は、前記冷却液体以外の流体を排除
すると共に該冷却液体を用いて前記発熱素子を液封する
手段であるものとすることもできる。こうすれば、装置
が傾いたときでも発熱素子が冷却液体から外部へ露出す
ることがないから、こういった場合でも発熱素子を冷却
することができる。In the cooling device for a heat generating element according to the present invention, the liquid sealing means is a means for removing a fluid other than the cooling liquid and liquid sealing the heat generating element using the cooling liquid. Can also. In this case, even when the apparatus is tilted, the heating element is not exposed to the outside from the cooling liquid, so that the heating element can be cooled even in such a case.
【００１１】また、本発明の発熱素子の冷却装置におい
て、前記液封手段は、前記冷却手段により用いられる冷
却媒体の流路を備える手段であるものとすることもでき
る。こうすれば、液封に用いた冷却液体を冷却媒体を用
いて冷却することができる。In the cooling device for a heating element according to the present invention, the liquid sealing means may be a means having a flow path for a cooling medium used by the cooling means. In this case, the cooling liquid used for liquid sealing can be cooled using the cooling medium.
【００１２】さらに、本発明の発熱素子の冷却装置にお
いて、前記発熱素子はスイッチング素子であり、前記冷
却液体は絶縁体であるものとすることもできる。こうす
れば、液封による電気的な短絡を防止することができ
る。この態様の本発明の発熱素子の冷却装置において、
前記冷却液体はパーフロロカーボンであるものとするこ
ともできる。Further, in the cooling device for a heating element according to the present invention, the heating element may be a switching element, and the cooling liquid may be an insulator. This can prevent an electrical short circuit due to liquid sealing. In the cooling device for a heating element of the present invention in this aspect,
The cooling liquid may be perfluorocarbon.
【００１３】本発明の発熱素子の冷却方法は、発熱素子
を冷却する冷却方法であって、前記発熱素子の許容動作
雰囲気温度より低い沸点を有する冷却液体を該発熱素子
の少なくとも一部と接触させ、該冷却液体が気化する際
の気化熱により該発熱素子を冷却し、前記冷却液体を該
冷却液体と異なる冷却媒体を用いて冷却することを要旨
とする。[0013] The method for cooling a heating element according to the present invention is a cooling method for cooling the heating element, wherein a cooling liquid having a boiling point lower than an allowable operating ambient temperature of the heating element is brought into contact with at least a part of the heating element. The gist of the invention is to cool the heating element by heat of vaporization when the cooling liquid is vaporized, and to cool the cooling liquid using a cooling medium different from the cooling liquid.
【００１４】この本発明の発熱素子の冷却方法では、発
熱素子の許容動作雰囲気温度より低い沸点を有する冷却
液体が気化する際の気化熱を発熱素子から直接または間
接に奪って発熱素子を冷却するから、冷却効率を高いも
のとすることができる。しかも、冷却液体をこの冷却液
体と異なる冷却媒体を用いて冷却することにより気化し
た冷却液体のガスを液化して再び発熱素子の冷却に使用
できるようにするから、発熱素子の動作雰囲気温度をそ
の許容温度範囲内とすることができる。In the method of cooling a heating element according to the present invention, the heating element is cooled by directly or indirectly removing heat of vaporization when a cooling liquid having a boiling point lower than the allowable operating ambient temperature of the heating element is vaporized. Therefore, the cooling efficiency can be increased. Moreover, since the cooling liquid is cooled using a cooling medium different from the cooling liquid, the vaporized cooling liquid gas is liquefied and can be used again for cooling the heating element. It can be within the allowable temperature range.
【００１５】[0015]
【発明の実施の形態】次に、本発明の実施の形態を実施
例を用いて説明する。図１は、本発明の一実施例である
発熱素子としてのスイッチング素子４２を冷却する冷却
装置２０の構成の概略を示す構成図である。図示するよ
うに、実施例の冷却装置２０は、複数のスイッチング素
子４２を収納部２３に収納する箱形のケース２２と、こ
のケース２２の収納部２３に充填された冷却液体２８
と、冷却液体２８を冷却する液体冷却装置５０とから構
成されている。Next, embodiments of the present invention will be described with reference to examples. FIG. 1 is a configuration diagram schematically illustrating a configuration of a cooling device 20 that cools a switching element 42 as a heating element according to an embodiment of the present invention. As shown in the figure, the cooling device 20 of the embodiment includes a box-shaped case 22 that stores a plurality of switching elements 42 in a storage portion 23, and a cooling liquid 28 that is filled in the storage portion 23 of the case 22.
And a liquid cooling device 50 that cools the cooling liquid 28.
【００１６】ケース２２は、その外周壁内に冷却媒体
（例えば、水など）の流路２６が形成されており、冷却
媒体の流入口２４と流出口２５は液体冷却装置５０の循
環管５２に接続されている。ケース２２の内部の収納部
２３は密閉構造とされており、その下面には、設置板４
０にワイヤボンデイング４４によりスイッチング素子４
２が設置されている。スイッチング素子４２としては、
実施例ではＩＧＢＴ（Insulated Gate Bipolar Tran
sister）を用いた。なお、スイッチング素子４２の取り
付け基板や電気的な接続配線などは本発明の要部を構成
しないから、その図示およびその説明は省略する。The case 22 has a cooling medium (for example, water) flow path 26 formed in its outer peripheral wall. The cooling medium inlet 24 and the cooling medium outlet 25 are connected to a circulation pipe 52 of a liquid cooling device 50. It is connected. The storage section 23 inside the case 22 has a sealed structure, and the lower surface thereof has
Switching element 4 by wire bonding 44 to 0
2 are installed. As the switching element 42,
In the embodiment, IGBT (Insulated Gate Bipolar Tran
sister). The mounting substrate of the switching element 42 and the electrical connection wiring do not constitute a main part of the present invention, so that illustration and description thereof are omitted.
【００１７】ケース２２の収納部２３に充填される冷却
液体２８は、スイッチング素子４２が良好に動作するこ
とができる許容動作雰囲気温度より低い沸点を有し、高
い絶縁性を示す液体である。実施例では、ＩＧＢＴの許
容動作雰囲気温度より低い沸点を有すると共に高い絶縁
性を示すパーフロロカーボン（例えば、住友スリーエム
製のフロリナートなど）を用いた。こうした冷却液体２
８は、スイッチング素子４２が生じる熱を奪って気化す
ることによりスイッチング素子４２を冷却する。The cooling liquid 28 filled in the accommodating portion 23 of the case 22 is a liquid having a boiling point lower than an allowable operating ambient temperature at which the switching element 42 can operate satisfactorily and exhibiting high insulating properties. In the examples, perfluorocarbon having a boiling point lower than the allowable operating atmosphere temperature of the IGBT and exhibiting high insulation properties (for example, Fluorinert manufactured by Sumitomo 3M Ltd.) was used. Such a cooling liquid 2
8 cools the switching element 42 by removing the heat generated by the switching element 42 and vaporizing it.
【００１８】液体冷却装置５０は、ケース２２の流入口
２４と流出口２５とに接続されケース２２の流路２６と
共に循環路を形成する循環管５２と、この循環管５２に
取り付けられ冷却媒体を循環管５２内で循環させる循環
ポンプ５４と、同じく循環管５２に取り付けられ冷却媒
体を外気で冷却するラジエータ５６とを備える。液体冷
却装置５０は、循環ポンプ５４により外気で冷却された
冷却媒体を循環管５２に循環させることにより、ケース
２２の収納部２３に充填された冷却液体２８を冷却す
る。したがって、スイッチング素子４２の熱により気化
した冷却液体２８は、液体冷却装置５０により冷却され
て液化する。The liquid cooling device 50 is connected to the inflow port 24 and the outflow port 25 of the case 22 and forms a circulation path together with the flow path 26 of the case 22. A circulation pump 54 that circulates in the circulation pipe 52 and a radiator 56 that is also attached to the circulation pipe 52 and cools a cooling medium with outside air are provided. The liquid cooling device 50 cools the cooling liquid 28 filled in the storage portion 23 of the case 22 by circulating the cooling medium cooled by the outside air by the circulation pump 54 through the circulation pipe 52. Therefore, the cooling liquid 28 vaporized by the heat of the switching element 42 is cooled and liquefied by the liquid cooling device 50.
【００１９】以上説明した実施例の発熱素子の冷却装置
２０によれば、スイッチング素子４２の許容動作雰囲気
温度より低い沸点を有する冷却液体２８が気化する際の
気化熱をスイッチング素子４２から直接または間接に奪
うことにより、スイッチング素子４２を冷却することが
できる。しかも、液体冷却装置５０により冷却液体２８
を冷却するから、気化した冷却液体２８を液化して再び
スイッチング素子４２の冷却に使用することができる。
この結果、冷却効率を向上させることができ、装置全体
を小型化することができる。また、冷却液体２８は高い
絶縁性を示すから、電気的な短絡を生じることもない。
もとより、スイッチング素子４２の動作雰囲気温度をそ
の許容温度範囲内とすることができる。According to the heating element cooling apparatus 20 of the embodiment described above, the heat of vaporization when the cooling liquid 28 having a boiling point lower than the allowable operating ambient temperature of the switching element 42 is vaporized is directly or indirectly transmitted from the switching element 42. Thus, the switching element 42 can be cooled. Moreover, the cooling liquid 28 is provided by the liquid cooling device 50.
, The vaporized cooling liquid 28 can be liquefied and used again for cooling the switching element 42.
As a result, the cooling efficiency can be improved, and the entire device can be downsized. Further, since the cooling liquid 28 has a high insulating property, no electrical short circuit occurs.
Of course, the operating atmosphere temperature of the switching element 42 can be set within the allowable temperature range.
【００２０】また、実施例の発熱素子の冷却装置２０に
よれば、ケース２２の収納部２３が密閉構造として形成
されており、この収納部２３に冷却液体２８が充填され
ているから、冷却装置２０が傾いたときでもスイッチン
グ素子４２が冷却液体２８から露出することがなく、こ
ういった場合でもスイッチング素子４２を効率よく冷却
することができる。Further, according to the cooling device 20 for the heat generating element of the embodiment, the storage portion 23 of the case 22 is formed as a closed structure, and the storage portion 23 is filled with the cooling liquid 28. Even when 20 is inclined, the switching element 42 is not exposed from the cooling liquid 28, and even in such a case, the switching element 42 can be efficiently cooled.
【００２１】実施例の発熱素子の冷却装置２０では、発
熱素子としてＩＧＢＴであるスイッチング素子４２を冷
却するものとして構成したが、ＩＧＢＴ以外のスイッチ
ング素子を冷却するものとして構成してもよく、スイッ
チング素子以外の発熱素子を冷却するものとして構成し
てもよい。In the cooling device 20 for the heating element of the embodiment, the switching element 42, which is an IGBT, is configured to be cooled as the heating element. However, the switching element other than the IGBT may be configured to be cooled. The heating elements other than the above may be configured to be cooled.
【００２２】実施例の発熱素子の冷却装置２０では、ケ
ース２２の収納部２３に充填する冷却液体２８としてパ
ーフロロカーボンを用いたが、他の液体を用いるものと
してもよい。この場合、液体としては、スイッチング素
子４２が良好に動作することができる許容動作雰囲気温
度より低い沸点を有し、高い絶縁性を示す液体であれば
よい。発熱体として電気的な短絡を考慮しなくてもよい
場合には、更に絶縁性を示す必要もない。In the cooling device 20 for the heating element of the embodiment, perfluorocarbon is used as the cooling liquid 28 to be filled in the storage portion 23 of the case 22, but another liquid may be used. In this case, the liquid may be any liquid having a boiling point lower than the allowable operating ambient temperature at which the switching element 42 can operate satisfactorily and exhibiting high insulating properties. When it is not necessary to consider an electrical short circuit as the heating element, it is not necessary to further show insulation.
【００２３】実施例の発熱素子の冷却装置２０では、ケ
ース２２の外周壁に冷却媒体の流路２６を形成したが、
収納部２３内に冷却媒体の流路を形成する管路を備える
ものとしてもよい。In the cooling device 20 for the heating element of the embodiment, the flow path 26 of the cooling medium is formed on the outer peripheral wall of the case 22.
The storage section 23 may be provided with a pipeline that forms a flow path for the cooling medium.
【００２４】以上、本発明の実施の形態について実施例
を用いて説明したが、本発明はこうした実施例に何等限
定されるものではなく、本発明の要旨を逸脱しない範囲
内において、種々なる形態で実施し得ることは勿論であ
る。Although the embodiments of the present invention have been described with reference to the embodiments, the present invention is not limited to these embodiments, and various embodiments may be made without departing from the scope of the present invention. Of course, it can be carried out.
【図１】 本発明の一実施例である発熱素子としてのス
イッチング素子４２を冷却する冷却装置２０の構成の概
略を示す構成図である。FIG. 1 is a configuration diagram schematically illustrating a configuration of a cooling device 20 that cools a switching element 42 as a heating element according to an embodiment of the present invention.
２０ 発熱素子の冷却装置、２２ ケース、２３ 収納
部、２４ 流入口、２５ 流出口、２６ 流路、２８
冷却液体、４０ 設置板、４２ スイッチング素子、４
４ ワイヤボンデイング、５０ 液体冷却装置、５２
循環管、５４循環ポンプ、５６ ラジエータ。Reference Signs List 20 Heating element cooling device, 22 case, 23 storage section, 24 inflow port, 25 outflow port, 26 flow path, 28
Cooling liquid, 40 installation plate, 42 switching elements, 4
4 wire bonding, 50 liquid cooling device, 52
Circulation pipe, 54 circulation pump, 56 radiator.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 石川 哲浩 愛知県豊田市トヨタ町１番地 トヨタ自動 車株式会社内 (72)発明者 大串 哲朗 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 (72)発明者 吉田 茂一 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 Ｆターム(参考） 5E322 AA07 AA09 AA10 DA01 DA03 DB07 DB12 FA01 5F036 AA01 BA07 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tetsuhiro Ishikawa 1 Toyota Town, Toyota City, Aichi Prefecture Inside Toyota Motor Corporation (72) Inventor Tetsuro Ogushi 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Co., Ltd. In-house (72) Inventor Shigeichi Yoshida 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation F-term (reference) 5E322 AA07 AA09 AA10 DA01 DA03 DB07 DB12 FA01 5F036 AA01 BA07
Claims (6)
る冷却液体を用いて該発熱素子を液封する液封手段と、 前記冷却液体を冷却する冷却手段とを備える冷却装置。1. A cooling device for cooling a heating element, comprising: a liquid sealing means for sealing the heating element with a cooling liquid having a boiling point lower than an allowable operating ambient temperature of the heating element; A cooling device comprising: cooling means for cooling.
体を排除すると共に該冷却液体を用いて前記発熱素子を
液封する手段である請求項１記載の冷却装置。2. The cooling apparatus according to claim 1, wherein said liquid sealing means is means for excluding a fluid other than said cooling liquid and liquid sealing said heating element using said cooling liquid.
いられる冷却媒体の流路を備える手段である請求項１ま
たは２記載の冷却装置。3. The cooling device according to claim 1, wherein said liquid sealing means is means having a flow path for a cooling medium used by said cooling means.
置であって、 前記発熱素子は、スイッチング素子であり、 前記冷却液体は、絶縁体である冷却装置。4. The cooling device according to claim 1, wherein the heating element is a switching element, and the cooling liquid is an insulator.
る請求項４記載の冷却装置。5. The cooling device according to claim 4, wherein said cooling liquid is perfluorocarbon.
る冷却液体を該発熱素子の少なくとも一部と接触させ、
該冷却液体が気化する際の気化熱により該発熱素子を冷
却し、 前記冷却液体を該冷却液体と異なる冷却媒体を用いて冷
却する冷却方法。6. A cooling method for cooling a heating element, comprising: bringing a cooling liquid having a boiling point lower than an allowable operating ambient temperature of the heating element into contact with at least a part of the heating element;
A cooling method, wherein the heating element is cooled by heat of vaporization when the cooling liquid is vaporized, and the cooling liquid is cooled using a cooling medium different from the cooling liquid.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11083000A JP2000277961A (en) | 1999-03-26 | 1999-03-26 | Device and method for cooling heat generating element |
| US09/531,568 US20020053420A1 (en) | 1999-03-26 | 2000-03-20 | Cooling apparatus and cooling method for heating elements |
| DE10014625A DE10014625A1 (en) | 1999-03-26 | 2000-03-24 | Method for cooling transistor switch elements uses an insulated liquid medium with a boiling point lower than the maximum permitted temperature of the element. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11083000A JP2000277961A (en) | 1999-03-26 | 1999-03-26 | Device and method for cooling heat generating element |
| US09/531,568 US20020053420A1 (en) | 1999-03-26 | 2000-03-20 | Cooling apparatus and cooling method for heating elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000277961A true JP2000277961A (en) | 2000-10-06 |
Family
ID=26424030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11083000A Pending JP2000277961A (en) | 1999-03-26 | 1999-03-26 | Device and method for cooling heat generating element |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20020053420A1 (en) |
| JP (1) | JP2000277961A (en) |
| DE (1) | DE10014625A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002158321A (en) * | 2000-11-17 | 2002-05-31 | Toyota Motor Corp | Cooling device for on-vehicle electrical component |
| CN103442541A (en) * | 2013-07-29 | 2013-12-11 | 江苏大学 | Micro cooling device of silicon-substrate capillary pump loop |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7556086B2 (en) * | 2001-04-06 | 2009-07-07 | University Of Maryland, College Park | Orientation-independent thermosyphon heat spreader |
| US7104782B2 (en) | 2003-06-05 | 2006-09-12 | Husky Injection Molding Systems Ltd. | Gate cooling structure in a molding stack |
| CN107407529A (en) * | 2015-03-25 | 2017-11-28 | 三菱电机株式会社 | Cooler, power inverter and cooling system |
| EP3279765A4 (en) * | 2015-03-30 | 2018-12-05 | Exascaler Inc. | Electronic-device cooling system |
-
1999
- 1999-03-26 JP JP11083000A patent/JP2000277961A/en active Pending
-
2000
- 2000-03-20 US US09/531,568 patent/US20020053420A1/en not_active Abandoned
- 2000-03-24 DE DE10014625A patent/DE10014625A1/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002158321A (en) * | 2000-11-17 | 2002-05-31 | Toyota Motor Corp | Cooling device for on-vehicle electrical component |
| CN103442541A (en) * | 2013-07-29 | 2013-12-11 | 江苏大学 | Micro cooling device of silicon-substrate capillary pump loop |
Also Published As
| Publication number | Publication date |
|---|---|
| US20020053420A1 (en) | 2002-05-09 |
| DE10014625A1 (en) | 2000-10-05 |
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