JP2001136756A - Motor drive device and semiconductor element cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely cool semiconductor elements using a simple structure and to improve the reliability of a motor drive apparatus and a semiconductor element cooling apparatus. SOLUTION: In a motor drive apparatus and a semiconductor element cooling apparatus, power-converting elements 101 that control a motor 3 and their control elements 102 are stored inside a box 111, in such a way that the control elements 102 are position above the power converting elements 101. The cooling flow channels of a cooler, to which the power converting elements 101 are thermally connected, are provided at a position below the control elements 102, a vaporizing part 203 of a heat pipe is thermally connected to the control elements 102, and its condensing part 205 is provided extending upwardly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a motor driving device and a semiconductor device cooling device, and more particularly, to a motor driving device for an electric vehicle, a hybrid electric vehicle, and the like, and a semiconductor cooling device.

[0002]

2. Description of the Related Art A conventional inverter device for controlling the number of revolutions of a motor as a power source of an electric vehicle is disclosed in Japanese Patent Application Laid-Open No. 9-233847.
The main circuit and other circuit elements are arranged in the inverter device, a heat sink is provided on the upper surface of the inverter device, and the main circuit is directly mounted on the heat sink, while the other circuit elements are in the inverter device and the heat sink and the main circuit are provided. The other circuit element is connected to the heat sink by a heat pipe that is disposed below and away from the top and that cannot conduct heat from top to bottom, and the heat pipe transfers heat of the other circuit element to the heat sink. Such a configuration is used to cool the main circuit and other circuit elements.

[0003]

However, in the conventional inverter device, since the heat sink is arranged on the upper surface of the housing so as to transfer heat of another circuit element to the heat sink by the heat pipe, the heat sink is cooled. Since the cooling flow path of the cooler is located at the upper part of the housing, it is necessary to cope with leakage of the cooling fluid from the cooling flow path into the housing.
The document does not disclose that the heat pipe can be operated even when the heat sink is disposed on the lower side.

Further, a heat pipe for transmitting heat of a control element mounted on a printed circuit board is attached to a lower surface of a heat sink disposed on an upper surface of a housing by being thermally connected together with a main circuit. The mounting structure of the pipe is restricted, and securing a thermal connection area with the heat sink is restricted.

Further, there is no description about preventing thermal influence on other circuit elements due to heat generated by the main circuit. In particular, when an inverter device is used in a hybrid electric vehicle, since the housing is subjected to severe thermal conditions, a printed circuit board on which other circuit elements are mounted is strongly heated by a main circuit that generates a large amount of heat. There was a problem.

Another object of the present invention is to increase the effective heat transfer area of the heat transfer means by absorbing unevenness of solder or the like on a printed circuit board on which other circuit elements are mounted, and to cope with vibrations during running of an automobile. Was not described.

In addition, the motor drive device for a vehicle has not been considered in relation to a radiator used for cooling an engine of a hybrid electric vehicle, that is, for improving the installation of the radiator.

SUMMARY OF THE INVENTION An object of the present invention is to provide a motor drive device and a semiconductor device cooling device which can reliably cool a semiconductor device with a simple structure and have high reliability.

[0009]

A first feature of the present invention to achieve the above object is to provide a motor, a plurality of semiconductor elements for controlling the motor, a housing accommodating the semiconductor element, and a cooling device. A cooler having a cooling flow path through which a fluid flows,
A heat pipe device that stores a refrigerant inside the heat transport pipe to form a heat pipe evaporator and a heat pipe condenser, wherein the semiconductor element is an electric power conversion element that constitutes an inverter that drives the motor; A control element for controlling an inverter element, wherein the power conversion element is thermally connected to the cooler, the control element is disposed above the power conversion element, and the cooler has a cooling passage. Is provided below the semiconductor element, and the heat pipe device thermally connects the heat pipe evaporating section to the control element, and positions the heat pipe condensing section above the heat pipe evaporating section. And thermally connected to the cooler.

Preferably, the motor drives an automobile, the housing encloses the semiconductor element in a hermetically sealed manner, and the cooler forms part of the bottom and side surfaces of the housing. Using the cooling fluid as water, the heat pipe device inserts one side of a heat transport pipe into an evaporator block formed of a good conductor to form the heat pipe evaporator, Side is inserted into a condenser block formed of a good heat conductor to form the heat pipe condensing part, the control element is mounted on a printed circuit board, and the power conversion element is in direct contact with the bottom part of the cooler. The heat pipe evaporator and the control element are thermally connected to each other by disposing the evaporator block and the control element on the surface of the printed circuit board opposite to the control element mounting surface with a slight gap. as well as Serial printing through the substrate and thermally connected is to the condensing unit block was thermally connected to the condenser the heat pipe condensing unit by direct contact with the cooler.

A second feature of the present invention is that a motor, a plurality of semiconductor elements for controlling the motor, a housing containing the semiconductor elements, a cooler, and a heat transport pipe containing a refrigerant therein. A heat pipe device, a part of which is inserted into a plate-shaped evaporator block formed of a good conductor to form a heat pipe evaporator, and the other part is a heat pipe condenser. And a control element for controlling the inverter element, the power conversion element is thermally connected to the cooler, and the heat pipe device is A pipe evaporator is disposed between the control element and the power conversion element, the heat pipe evaporator is thermally connected to the control element, and the heat pipe condenser is connected to the heat pipe. Positioned above the evaporator unit lies in the thermally coupled to the condenser.

A third feature of the present invention resides in that a motor, a plurality of semiconductor elements for controlling the motor, a housing accommodating the semiconductor elements, and a part of a heat transport pipe accommodating a refrigerant therein. A heat pipe device that is inserted into a plate-shaped evaporator block formed of a good conductor to form a heat pipe evaporator and uses the other part as a heat pipe condenser, wherein the semiconductor element is an inverter that drives the motor. And a control element for controlling the inverter element, wherein the control element is mounted on a printed circuit board, and the heat pipe device is provided on a back surface of the printed circuit board on which the control element is mounted. The evaporator block is disposed substantially in parallel with a slight gap on the side, and the heat pipe evaporator is thermally connected to the control element via the gap and the printed circuit board. Together, lies in extending the heat pipe condenser section above said heat pipe evaporator unit.

Preferably, in the heat pipe device, a part of a heat transport pipe containing a refrigerant therein is inserted into a plate-shaped evaporator block formed of a good conductor to form a heat pipe evaporator. The part is a heat pipe condensing part, the control element is mounted on a printed board, the printed board is formed by bonding a metal core having a hole on the back side, the heat pipe device is mounted with the control element The evaporator block is disposed substantially in parallel with a slight gap corresponding to the hole on the back side of the printed circuit board, and the heat pipe evaporator is heated by the control element via the gap and the printed circuit board. Have been connected.

[0014] Preferably, the control element is divided and mounted on a printed circuit board including a microcomputer and a printed circuit board including a gate circuit.

A fourth feature of the present invention is that a plurality of semiconductor elements for controlling the motor, a housing accommodating the semiconductor elements, a cooler having a cooling channel for flowing a cooling fluid,
A heat pipe device that stores a refrigerant inside the heat transport pipe to form a heat pipe evaporator and a heat pipe condenser, wherein the semiconductor element is an electric power conversion element that constitutes an inverter that drives the motor; A control element for controlling an inverter element, wherein the power conversion element is thermally connected to the cooler, the control element is disposed above the power conversion element, and the cooler has a cooling passage. Is provided below the semiconductor element, and the heat pipe device thermally connects the heat pipe evaporating section to the control element, and positions the heat pipe condensing section above the heat pipe evaporating section. And thermally connected to the cooler.

A fifth feature of the present invention is that a plurality of semiconductor elements for controlling the equipment, a housing containing the semiconductor elements, and a part of a heat transport pipe containing a refrigerant therein are formed of a good heat conductor. A heat pipe device that is inserted into the formed plate-shaped evaporator block to form a heat pipe evaporator, and the other part is a heat pipe condenser. The semiconductor device is mounted on a printed circuit board, and the heat pipe The apparatus has a slight gap on the back side of the printed circuit board on which the semiconductor element is mounted, disposes the evaporator block substantially in parallel, and places the heat pipe evaporator through the gap and the printed board. In addition to being thermally connected to the control element, the heat pipe condensing section extends above the heat pipe evaporating section.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. In addition, in the second and subsequent embodiments, configurations common to the first embodiment are partially omitted, and the same reference numerals in the drawings of the respective embodiments indicate the same or corresponding components.

A first embodiment of the present invention will be described with reference to FIGS. 1 is a longitudinal sectional perspective view of a first embodiment of a motor drive device for a vehicle of the present invention, FIG. 2 is a perspective schematic view of an engine room of a hybrid electric vehicle equipped with the present invention, and FIG. FIG. 4 is an electric circuit diagram of the first embodiment of the motor drive device for a vehicle, and FIG. 4 is a cross-sectional view of a cooler in the first embodiment of the motor drive device for an automobile of the present invention.

First, the configuration of the engine room of the hybrid electric vehicle according to the present invention will be described with reference to FIG.
In the engine room, a motor control device 1, an engine 2, a motor 3, a generator 4, a radiator 5, a cooling water pump 6, a pipe 6a, a power transmission mechanism 7, and an axle 8 are arranged. Wheels 9 are attached to both ends of the axle 8.

The motor control device 1 for driving the motor 3 includes:
Since it is arranged in the vicinity of the engine 2 and the motor 3, that is, immediately above the motor 3 and adjacent to the side of the engine 2, it is affected by the heat generated by the engine 2 and the motor 3.
The temperature in the engine room can reach 90 ° C. or higher. The generator 4 is attached to the side of the engine 2, generates power by the rotation of the engine 2, and charges the battery 502. The motor control device 1 is supplied with power from the battery 502.

The motor control device 1 has a power conversion element 101 and a control element 102 arranged in a closed casing 111 so as to be vertically stacked. The bottom of the housing 111 is formed by a cooler 110.

Power conversion element 101 and control element 102
Causes loss due to energization and generates heat. Control element 1
The reference numeral 02 is omitted in FIG. 2 but is actually composed of two or more stages as shown in FIG. It is desirable that the sealed housing 111 be completely sealed in order to prevent rainwater and dust from entering.

The radiator 5, the cooling water pump 6, the cooler 110, and the motor 3 are connected in this order by a pipe 6a to form a cooling water circulation path. As the cooling water, water or an antifreeze such as ethylene glycol is used. The cooling water cools the cooler 110 and the motor 3 from the radiator 5 by operating the cooling water pump 6 to take heat and rises in temperature. Return. The engine 2 is cooled by a system (not shown) different from the cooling water circulation system of the cooler 110, but may be configured to share the cooling water pump 6.

Next, an electric circuit of the motor drive device for a vehicle according to the present invention will be described with reference to FIG.

The power conversion circuit 509 constitutes an inverter having a power conversion element 501 including an IGBT switching element 501a and a diode 501b. The IGBT switching element 501a and the diode 501b are connected such that the + side and the − side of the U phase, V phase and W phase form a bridge. The power conversion circuit 509 has a filter capacitor 503 on the input side.
Is connected to the battery 502 via the
It is connected to the. Control circuit 5 including gate circuit 507
Reference numeral 08 is connected to receive the detection signals of the current sensor 504 and the encoder 506 and control the power conversion element 101. Power conversion circuit 509 and control circuit 50
The motor 8 is driven while controlling the rotation speed of the motor 3.

Next, the specific structure of the motor drive device for an automobile according to the present invention will be described with reference to FIGS.

The housing 111 is formed of a cooler 110 on the bottom, a side wall 131, and a cover 130 on the top. The cooler 110 and the casing side wall 131 are formed of a good thermal conductor such as aluminum or copper, and both are thermally connected. A cover 130 formed of a good thermal conductor is detachably attached so as to close the upper surface opening of the casing side wall 131 so as to be in thermal contact with the cover 130. The cooler 110 and the casing side wall 131 may be formed integrally. Cooler 11
0 is provided with a cooling water inlet 150 and a cooling water outlet 151, and the cooling water flows as shown by the arrows to cool the cooler 110. Specifically, as shown in FIG.
The cooling water flowing in from zero passes through the space between the partition plates 110a in the longitudinal direction of the cooler 110 to efficiently exchange heat, and then flows out of the cooling water outlet 151.

A large number of power conversion elements 101 are provided in thermal contact with the upper surface of the cooler 110 and housed in a housing 111. Many control elements 103 of the control circuit 508 are mounted on the upper surface of the printed circuit board 120 at a high density. The control element 104 of the gate circuit 507 is
Are mounted at a high density on the top surface. On the lower surface of each printed circuit board 120, a heat pipe device 200 is installed along the printed circuit board 120. Each printed circuit board 120 is mounted and supported on a shelf receiving portion 111b fixed to both side surfaces of the housing 111. Note that the shelf receiving portion 111b may be integrally formed with the housing 111.

The heat pipe device 200 includes the heat transport pipe 20
1 and a plurality of heat pipes, and a heat pipe evaporator 20 in which one end of a heat transport tube 201 is inserted into a plate-shaped evaporator block 202 made of a heat conductive material such as aluminum or copper.
3 and a heat pipe condensing section 205 which is inserted into a condensing section block 204 also made of a heat conductive material at the other end of the heat transport pipe 201. Evaporator block 2
02, through the printed circuit board 120 and the air layer, so that the heat transport tube 201 is substantially parallel to the printed circuit board 120,
It is installed so as to have a small gap 206. on the other hand,
The condenser block 204 is installed on the housing 111 such that the heat transport pipe 201 is substantially parallel to the inner wall of the housing 111. Therefore, the heat transport pipe 201 is bent at a substantially right angle between the heat pipe evaporator 203 and the heat pipe condenser 205 so that the heat pipe condenser 205 is located above the heat pipe evaporator 203. The evaporator block 202 is fixed to the printed circuit board 12 by a fixing jig 207.
Fixed to 0. The dimension of the gap 206 is desirably about 1 mm.

The power conversion element 101 and the control elements 103, 1
04 are independently stacked so as to form different stages, and both ends are fixed in advance with screws or the like, so that wiring between the control elements 103 and 104 is easy and assembly is easy. Each power conversion element of the power conversion circuit 508 generates several hundred watts of heat, and its allowable temperature is 150 ° C.
However, the control element of the control circuit 508 has one
Each unit generates about 1 W, and its allowable temperature is about 100 ° C. Therefore, the temperature conditions of control elements 103 and 104 are more severe than those of power conversion element 101. Control element 10
The printed circuit board 120 on which the control element 104 is mounted and the printed circuit board 120 on which the control element 104 is mounted are independently stacked one above another and housed in the housing 111.

Next, the cooling state of the motor driving device when the hybrid electric vehicle is driven will be described. The operations of the engine 2 and the motor 3 are switched and operated. Although the engine 2 and the motor 3 are cooled by the cooling water, the temperature inside the engine room may still rise to 90 ° C. or more due to the heat generated from them. Motor 3 and cooling water pump 6
Are driven simultaneously. When the cooling water pump 6 is operated, the cooling water cooled to a temperature of about 60 ° C. by the radiator 5 first cools the cooler 110, then cools the motor 3 and returns to the radiator 5. Thereby, the temperature of the housing 111 becomes about 70 ° C.

When the motor 3 is operated, the power conversion element 101 and the control elements 103 and 104 of the motor drive device 1 are operated.
Generates heat. Most of the heat generated by the power conversion element 101 is directly transmitted to the cooler 110 and is radiated to the cooling water.
Part of the heat is radiated into the space inside the housing 111. This suppresses a temperature rise of the power conversion element 101 itself.

Most of the heat generated by the control element 103 is transmitted from the lower surface of the printed circuit board 120 to the evaporator block 202.
To the heat transport tube 201 via the Heat transport pipe 201
Is made of heat conductive material such as copper, and the size is 3-5mm
It is about the diameter. A refrigerant represented by water is sealed inside. When heated, the refrigerant liquid boils and evaporates and becomes a refrigerant gas and moves upward, that is, toward the heat pipe condensing unit 205 side. Subsequently, the heat is transmitted to both side walls 131 of the housing 111 via the condensing block 204, and is transmitted from the housing side walls 131 to the cooler 110 to be radiated into the cooling water.

In this manner, the refrigerant gas in the heat pipe condensing section 205 of the heat transport pipe 201 is cooled, condensed and liquefied, and returns to the heat pipe evaporating section 203 again.
A part of the heat generated by the control element 103 is
Heat is radiated into the space of No. 1. On the other hand, similarly to the case of the control element 103, most of the heat generated by the control element 104 is radiated from the both side walls 131 of the housing 111 into the cooling water and partly into the space of the housing 111.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a vertical sectional perspective view of a second embodiment of the motor drive device for a vehicle according to the present invention.

In the second embodiment, the printed circuit board 1
A heat conductive sheet 301 is inserted between the evaporator 20 and an evaporator block 202 constituting the heat pipe evaporator 203. In this embodiment, an example is shown in which the heat conductive sheet 301 is inserted for cooling on the control element 103 side, but may be inserted on the control element 104 side.

In the second embodiment, the control element 10
The heat generated in 3 is first transmitted to the printed circuit board 120, and then transmitted to the evaporator block 202 via the heat conductive sheet 301. In this case, the cooling performance is improved as compared with the case where the gap 206, which is an air layer, is provided between the printed board 120 and the evaporator block 202.

Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 6 is a vertical sectional perspective view of a third embodiment of the motor drive device for a vehicle according to the present invention.

In the third embodiment, the printed circuit board 1
20 and a metal core 302 is laminated on the lower side of the metal core 3.
In this structure, the printed circuit board 120 is attached to the shelf receiving portion 111b via the second through-hole 02. In this case, the printed circuit board 120
In the portion where the evaporator block 202 is installed, a hole 303 is provided.
The evaporating block 202 through the gap 206.
Can be installed. The metal core 302 serves as a reinforcing material, so that when the car runs on the road and the housing 111 vibrates, the influence of the vibration on the printed circuit board 120 can be reduced, and the mounting portions of the control elements 103 and 104 are broken. Can be prevented. In this case, metal core 3
02 is provided with a hole 303 so that the heat pipe device 20
There is no exclusion for using the cooling method with zero.

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a vertical sectional perspective view of a fourth embodiment of the motor drive device for a vehicle according to the present invention.

In the fourth embodiment, the power conversion element 1
A cooling water hole 304 is provided at a location where the device 01 is installed. This allows the cooling water to come into direct contact with the power conversion element 101, so that the cooling efficiency of the power conversion element 101 can be increased. The portion where the cooler 110 and the power conversion element 101 are in contact forms a seal portion 305 for sealing the cooling water with an O-ring, packing, or the like.
In the fourth embodiment, even if the power conversion element 101 is arranged on the lower side, the heat pipe condenser 205 constituting the heat pipe device 200 can be arranged above the heat pipe evaporator 203. Even if the cooling water leaks in the seal portion 305, the leaked cooling water does not reach the electronic components of the control elements 103 and 104 because the seal portion 305 is on the lower side. Even with such a structure, the operation of the heat pipe device 200 can be enabled.

According to the embodiment of the present invention, the control element 10
The heat pipe evaporator 203 is installed via the printed circuit board 120 on which the heat pipes 3 and 104 are mounted. Heat pipe condenser 2
05, and the heat pipe evaporating section 203 and the heat pipe condensing section 205 are connected by the heat transport pipe 201, so that the control elements 103 and 104 that generate heat can be efficiently cooled.

Further, according to the embodiment of the present invention, the evaporator block 202 constituting the heat pipe device 200 for cooling the control elements 103 and 104 includes
Printed circuit board 120 mounted with power supply device 04 and power conversion element 10
1, even if the power conversion element 101 generating a large amount of heat is heated during operation, the heat does not heat the control elements 103 and 104 via the printed circuit board 120, thereby further controlling the power conversion element 101. The cooling efficiency of the elements 103 and 104 can be increased.

Further, according to the embodiment of the present invention, the heat pipe evaporator 203 and the heat transport pipe 201 are arranged in parallel with the printed circuit board 120, and the heat pipe condenser 205 is attached to the inner wall of the housing 111. Control element 10
It becomes possible to arrange a plurality of printed circuit boards 120 on which 3, 104 are mounted.

In this way, the control elements 103, 104
When the mounting density is increased or when the ambient temperature of the housing 111 is high, the device can be made small and reliable.

Moreover, according to the embodiment of the present invention, the power conversion element 101 and the control elements 103 and 104
Since the control elements 103 and 104 are housed so as to be stacked independently in the housing 1, the length of the wiring connecting the power conversion element 101 and the control elements 103 and 104 is shorter than that in which the control elements 103 and 104 are installed outside the housing 111. This makes it less susceptible to noise.

According to the embodiment of the present invention, the control elements 103 and 104 are mounted on the upper surface of the printed circuit board 120,
Since the evaporator block 202 is arranged on the lower surface side of the printed circuit board 120 via the gap 206, vibration transmitted to the printed circuit board 120 during traveling of the automobile can be reduced.
Further, instead of the gap 206, the heat conductive sheet 30
By inserting 1, the cooling efficiency can be further increased while reducing this vibration.

Further, according to the embodiment of the present invention, cooling water is supplied from the radiator 5 to the cooler 110,
The power conversion element 101 connected to the power supply device is disposed on the lower side, and the printed circuit board 120 on which the control elements 103 and 104 are mounted is disposed on the upper side. 11
0, so that the radiator 5 and the motor drive device 1 in the engine room can be easily installed.

Further, according to the embodiment of the present invention, the printed circuit board 120 is set on the shelf receiving portion 111b attached to the inner wall of the housing 111 via the metal core 302 below the printed circuit board 120. Moreover, a hole 303 is provided in the metal core 302 so that the evaporator block 202
Alternatively, the printed circuit board 12 may be
Touch 0. Therefore, the printed circuit board 120 can be reinforced by the metal core 302 while maintaining the cooling function of the heat pipe device 200.

Further, according to the embodiment of the present invention, the cooling water hole 304 is provided in the cooler 110 so that the cooling water can be brought into contact with the power conversion element 101 to further improve the cooling efficiency, and the sealing portion can be lowered. Side, it is possible to avoid adversely affecting the electric components such as the control elements 103 and 104 even if the cooling water leaks. Since it is above the heat pipe evaporator 203, the heat pipe device 200 is operable.

[0051]

According to the present invention, the semiconductor device can be reliably cooled with a simple structure, and a highly reliable motor drive device and semiconductor device cooling device can be obtained.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional perspective view of a first embodiment of a motor drive device for an automobile of the present invention.

FIG. 2 is a schematic perspective perspective view of an engine room portion of a hybrid electric vehicle equipped with the present invention.

FIG. 3 is an electric circuit diagram of a first embodiment of the motor drive device for a vehicle according to the present invention.

FIG. 4 is a cross-sectional view of a cooler in the first embodiment of the motor drive device for a vehicle according to the present invention.

FIG. 5 is a longitudinal sectional perspective view of a second embodiment of the motor drive device for a vehicle according to the present invention.

FIG. 6 is a vertical sectional perspective view of a third embodiment of the motor drive device for a vehicle according to the present invention.

FIG. 7 is a vertical sectional perspective view of a fourth embodiment of the motor drive device for a vehicle according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Motor control device, 2 ... Engine, 3 ... Motor, 4 ...
Generator, 5 ... Radiator, 6 ... Cooling water pump, 6a ...
Piping, 7: power transmission mechanism, 8: axle, 9: wheels, 502
... Battery, 111 ... Housing, 111b ... Shelf receiving part, 11
0: cooler, 102: control element, 101: power conversion element, 110a: partition plate, 103: control element, 104: control element, 120: printed circuit board, 130: cover, 13
DESCRIPTION OF SYMBOLS 1 ... Housing side wall part, 150 ... Cooling water inlet, 151 ... Cooling water outlet, 200 ... Heat pipe, 201 ... Heat transport pipe, 20
2 ... Evaporation block, 203 ... Heat pipe evaporator, 2
04: condensing section block, 205: heat pipe condensing section,
Reference numeral 206: gap, 207: fixing jig, 301: heat conductive sheet, 302: metal core, 303: hole, 304: cooling water hole, 305: seal portion, 509: power conversion circuit, 50
1a IGBT switching element, 501b diode, 503 filter capacitor, 507 gate circuit, 508 control circuit, 504 current sensor, 506
Encoder.

Continued on the front page (72) Inventor Atsushi Suzuki 502 Kandachicho, Tsuchiura-shi, Ibaraki Pref.Mechanical Research Laboratories, Hitachi, Ltd. Within the Group (72) Mitsuyuki Honbu Headquarters, Hitachinaka-shi, Ibaraki 2520 Oita, Japan F-term within the Automotive Equipment Group, Hitachi, Ltd. 5H007 AA06 BB06 CA01 CB00 CB05 CC23 DC08 HA03 HA04 HA06 HA07 5H115 PA15 PG04 PI16 PI21 PU01 PV09 PV23 UI30 UI36

Claims (8)

[Claims] 1. A motor, a plurality of semiconductor elements for controlling the motor, a housing accommodating the semiconductor elements, a cooler having a cooling flow path for flowing a cooling fluid, and a refrigerant in a heat transport pipe. And a heat pipe device that forms a heat pipe evaporator and a heat pipe condenser, wherein the semiconductor element is a power conversion element that constitutes an inverter that drives the motor, and a control element that controls the inverter element. And the power conversion element is thermally connected to the cooler, the control element is disposed above the power conversion element, and the cooler has a cooling flow path below the semiconductor element. The heat pipe device is provided with the heat pipe evaporating section thermally connected to the control element, and the heat pipe condensing section is positioned above the heat pipe evaporating section. Motor drive device characterized by being thermally connected to the condenser. 2. The vehicle according to claim 1, wherein the motor drives an automobile, the housing encloses the semiconductor element, and the cooler forms part of a bottom surface and side surfaces of the housing. The cooling fluid is water, and the heat pipe device includes:
Inserting one side of the heat transport pipe into an evaporator block formed of a good heat conductor to form the heat pipe evaporator,
The other side of the heat transport pipe is inserted into a condenser block formed of a good heat conductor to form the heat pipe condensing section, the control element is mounted on a printed circuit board, and the power conversion element is a bottom part of the cooler. The heat pipe evaporator is connected to the heat pipe evaporator by directly contacting and thermally connecting the evaporator block and disposing the evaporator block on the surface of the printed circuit board opposite to the mounting surface of the control element with a slight gap. A control element is thermally connected through the gap and the printed circuit board, and the heat pipe condenser is thermally connected to a cooler by directly contacting the condenser block with the cooler. The motor drive device according to claim 1. 3. A motor, a plurality of semiconductor elements for controlling the motor, a housing accommodating the semiconductor elements, a cooler, and a part of a heat transport pipe accommodating a refrigerant inside are formed of a good heat conductor. A heat pipe condensing unit while forming a heat pipe evaporating unit by inserting the heat pipe evaporating unit into the plate-shaped evaporating unit block, wherein the semiconductor element constitutes an inverter unit for driving the motor. And a control element for controlling the inverter element, wherein the power conversion element is thermally connected to the cooler,
The heat pipe device includes: a heat pipe evaporator disposed between the control element and the power conversion element; and a heat pipe evaporator thermally connected to the control element. A motor drive device which is located above the heat pipe evaporator and is thermally connected to the cooler. 4. A motor comprising: a motor; a plurality of semiconductor elements for controlling the motor; a housing containing the semiconductor elements; and a heat transfer pipe containing a refrigerant therein. A heat pipe device that forms a heat pipe evaporator portion by inserting the heat pipe evaporator portion into the evaporator portion block and uses the other portion as a heat pipe condensing portion, wherein the semiconductor element is an inverter section that drives the motor. And a control element for controlling the inverter element, wherein the control element is mounted on a printed circuit board, and the heat pipe device has a slight gap on the back side of the printed circuit board on which the control element is mounted. The heat pipe evaporator is thermally connected to the control element via the gap and the printed circuit board, and the heat pipe is connected to the heat pipe evaporator. A motor drive device characterized by the flop condensing section extending upward from the heat pipe evaporator unit. 5. The heat pipe device according to claim 1, wherein a part of the heat transport pipe containing a refrigerant therein is inserted into a plate-shaped evaporator block formed of a good heat conductor to form a heat pipe evaporator and to form a heat pipe evaporator. A heat pipe condensing section, the control element is mounted on a printed board, the printed board is formed by bonding a metal core having a hole on the back side, the heat pipe device is mounted with the control element The evaporator block is disposed substantially in parallel with a slight gap corresponding to the hole on the back side of the printed board, and the heat pipe evaporator is thermally connected to the control element via the gap and the printed board. The motor drive device according to any one of claims 1 to 4, wherein the motor drive device is connected to a motor. 6. The motor driving device according to claim 1, wherein the control element is mounted on a printed circuit board including a microcomputer and a printed circuit board including a gate circuit. . 7. A plurality of semiconductor elements for controlling the motor, a housing containing the semiconductor elements, a cooler having a cooling flow path through which a cooling fluid flows, and a refrigerant housed inside a heat transport pipe. A heat pipe device that forms a heat pipe evaporator and a heat pipe condenser; wherein the semiconductor element has a power conversion element that forms an inverter that drives the motor, and a control element that controls the inverter. The power conversion element is thermally connected to the cooler, the control element is disposed above the power conversion element,
The cooler is provided with its cooling flow path located below the semiconductor element, and the heat pipe device thermally connects the heat pipe evaporator to the control element,
The semiconductor element cooling device, wherein the heat pipe condensing section is located above the heat pipe evaporating section and is thermally connected to the cooler. 8. A plurality of semiconductor devices for controlling the device,
A housing containing the semiconductor element and a part of a heat transport pipe containing a refrigerant therein are inserted into a plate-shaped evaporator block formed of a good heat conductor to form a heat pipe evaporator and the other parts are formed. A heat pipe condensing section and a heat pipe device, wherein the semiconductor element is mounted on a printed circuit board,
In the heat pipe device, the evaporator block is disposed substantially in parallel with a slight gap on the back surface side of the printed circuit board on which the semiconductor element is mounted, and the heat pipe evaporator is disposed between the gap and the printed board. And a heat pipe condensing section extending above the heat pipe evaporating section while being thermally connected to the control element via a heat pipe.