JP2000273415A5 - - Google Patents

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Publication number
JP2000273415A5
JP2000273415A5 JP1999081078A JP8107899A JP2000273415A5 JP 2000273415 A5 JP2000273415 A5 JP 2000273415A5 JP 1999081078 A JP1999081078 A JP 1999081078A JP 8107899 A JP8107899 A JP 8107899A JP 2000273415 A5 JP2000273415 A5 JP 2000273415A5
Authority
JP
Japan
Prior art keywords
semiconductor device
layer
adhesive
compound
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999081078A
Other languages
English (en)
Japanese (ja)
Other versions
JP4359954B2 (ja
JP2000273415A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP08107899A priority Critical patent/JP4359954B2/ja
Priority claimed from JP08107899A external-priority patent/JP4359954B2/ja
Publication of JP2000273415A publication Critical patent/JP2000273415A/ja
Publication of JP2000273415A5 publication Critical patent/JP2000273415A5/ja
Application granted granted Critical
Publication of JP4359954B2 publication Critical patent/JP4359954B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP08107899A 1999-03-25 1999-03-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 Expired - Fee Related JP4359954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08107899A JP4359954B2 (ja) 1999-03-25 1999-03-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08107899A JP4359954B2 (ja) 1999-03-25 1999-03-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Publications (3)

Publication Number Publication Date
JP2000273415A JP2000273415A (ja) 2000-10-03
JP2000273415A5 true JP2000273415A5 (cg-RX-API-DMAC7.html) 2006-03-30
JP4359954B2 JP4359954B2 (ja) 2009-11-11

Family

ID=13736369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08107899A Expired - Fee Related JP4359954B2 (ja) 1999-03-25 1999-03-25 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置

Country Status (1)

Country Link
JP (1) JP4359954B2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002241469A (ja) * 2001-02-14 2002-08-28 Nitto Denko Corp 熱硬化性樹脂組成物および半導体装置
JP4721309B2 (ja) * 2001-02-14 2011-07-13 日東電工株式会社 熱硬化性樹脂組成物および半導体装置
JP2010006929A (ja) * 2008-06-26 2010-01-14 Shin-Etsu Chemical Co Ltd 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム
TW201305306A (zh) * 2011-07-25 2013-02-01 日東電工股份有限公司 接著片及其用途

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