JP2000269258A - Device and method for conductive ball mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a conductive ball mounting device and mounting method with which conductive balls can be mounted efficiently and stably on the electrode of a plurality of electronic parts formed on a substrate. SOLUTION: In this conductive ball mounting method wherein conductive balls are mounted on the electrodes of a plurality of electronic parts formed on a substrate using a chucking tool 12 corresponding to each split division of substrate, a chucking part 14, which is the aggregate of conductive ball chucking holes 12a, is provided on the position corresponding to the electrode formed interfacing to the arrangement of the electronic parts, and the conductive balls are collectively mounted on each split division by the suction tool 12 corresponding to each split division. Accordingly, the conductive balls can be mounted in a highly efficient and stable manner on the substrate where a plurality of electronic parts are irregularly arranged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball mounting apparatus and method for mounting conductive balls on electrodes of a plurality of electronic components (semiconductor elements) formed on a substrate.

[0002]

2. Description of the Related Art In a process of forming a bump as a protruding electrode on an electronic component, a conductive ball such as a solder ball is mounted on an electrode of the electronic component. In recent years, as a method of mounting the conductive ball, a method of mounting the conductive ball in a state of a wafer before electronic components are cut into individual pieces, that is, a state in which a large number of semiconductor elements as electronic components are formed in a grid-like arrangement. Is used.

[0003]

However, when conductive balls are directly mounted on a wafer, there have been the following problems in the prior art. Since the wafer has a circular shape and rectangular individual electronic components are cut out from the circular wafer, the cutout line does not coincide with the outer periphery of the wafer. Therefore, the cutting line has an irregular step shape near the outer periphery of the wafer. As a result, when the conductive balls are mounted on each electronic component of the wafer, a plurality of electronic components cannot be bundled as a well-formed rectangular block, and may be mounted individually or as a whole. I had no choice but to choose either. For this reason, when mounting in individual pieces, it is necessary to perform mounting many times, reducing productivity,
Conventionally, it was difficult to efficiently and stably mount conductive balls directly on a wafer. .

Accordingly, an object of the present invention is to provide a conductive ball mounting apparatus and a mounting method capable of efficiently and stably mounting conductive balls on electrodes of a plurality of electronic components formed on a substrate. I do.

[0005]

According to a first aspect of the present invention, there is provided a conductive ball mounting apparatus for mounting a conductive ball on an electrode of a plurality of electronic components formed on a substrate by a suction tool. A plurality of suction tools individually corresponding to the divided sections obtained by dividing the substrate into a plurality of sections; and positions formed on the suction surfaces of these suction tools corresponding to the arrangement of the electronic components and corresponding to the electrodes. And a suction portion provided with a suction hole for vacuum-suctioning the conductive ball.

According to a second aspect of the present invention, there is provided a method for mounting a conductive ball on an electrode of a plurality of electronic components formed on a substrate, the conductive ball being mounted on the electrode by a suction tool. A suction portion provided with a suction hole for vacuum-suctioning the conductive ball at a corresponding position corresponds to a suction tool formed corresponding to the arrangement of the electronic components individually to each divided section obtained by dividing the substrate into a plurality of sections. When a plurality of conductive balls are mounted on the substrate, conductive balls are collectively mounted on each of the divided sections by a suction tool corresponding to each of the divided sections.

According to the present invention, a plurality of conductive balls are collectively mounted on each of the divided sections by a suction tool individually corresponding to the divided sections obtained by dividing the conductive ball mounting area into a plurality of sections. The conductive balls can be efficiently and stably mounted on a substrate on which electronic components are irregularly arranged.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of a conductive ball mounting apparatus according to an embodiment of the present invention. FIG. 2A is a sectional view of a pickup head of the conductive ball mounting apparatus.
3B is a plan view of the lower surface of the pickup head of the conductive ball mounting apparatus, FIGS. 3A and 3C are plan views of the same wafer, FIG. 3B is a partial plan view of the same wafer, and FIG. FIG. 5 is a plan view of a suction tool mounting portion of the conductive ball mounting device, and FIG.
(A), (b), (c), (d), and (e) are process explanatory views of the method of mounting the conductive ball.

First, the structure of the conductive ball mounting device will be described with reference to FIG. In FIG. 1, a transport path 2 is provided at the center of a base 1. The transfer path 2 transfers and positions the plate 3 holding the wafer 4. The wafer 4 is a substantially circular substrate, and a plurality of semiconductor elements are formed in a lattice shape as described later. Two Y-axis tables 5 are arranged at both ends of the upper surface of the base 1. An X-axis table 6 is installed on the two Y-axis tables 5,
A mounting head 7 is mounted on the X-axis table 6.

A pickup head 8 is provided below the mounting head 7. X axis table 6 and Y axis table 5
, The mounting head 7 moves horizontally. A ball supply unit 9 is provided in front of the transport path 2, and a large number of conductive balls 10 are stored in the ball supply unit 9. The pickup head 8 picks up the conductive balls 10 by moving the pickup head 8 up and down with the mounting head 7 positioned above the ball supply unit 9. Then, by positioning the mounting head 7 on the positioned wafer 4 and moving the pickup head 8 up and down again, the conductive balls 10 held by the pickup head 8 are mounted on the wafer 4.

On the side of the ball supply section 9, there is provided a suction tool mounting section 11 on which a suction tool 12 mounted on the pickup head 8 is mounted. Suction tool mounting part 1
By moving the pickup head 8 up and down with respect to 1, the suction tool 12 is attached to and detached from the pickup head 8.
Can be exchanged.

Here, the wafer 4 will be described with reference to FIG. As shown in FIG. 3A, the wafer 4 is a substantially circular substrate, and a large number of semiconductor elements 4a, which are rectangular electronic components, are formed on the wafer 4 in a lattice shape. FIG. 3 (a)
In the figure, the bold line indicates the ball mounting area of the wafer 4, and its outer shape is stepped. As shown in FIG. 3B, a large number of electrodes 4b on which conductive balls 10 are mounted are formed in a predetermined electrode arrangement pattern on each semiconductor element 4a, and these electrodes 4b form an electrode group 4c. ing.

Next, referring to FIG. 2, a pickup head 8 provided on the mounting head 7 and the pickup head 8
The suction tool 12 detachably mounted on the lower surface of the device will be described. As shown in FIG. 2A, a suction tool 12 is mounted on the lower surface of the pickup head 8. The suction tool 12 is positioned with respect to the pickup head 8 by the positioning pin 13, and is held by vacuum suction from the suction hole 8b. A large number of suction holes 12a are provided on the lower surface of the suction tool 12, and the conductive balls 10 are sucked and held in the suction holes 12a by vacuum suction from the suction holes 8a.

The suction tool 12 has a rectangular suction surface (rectangular section having dimensions WX and WY) covering a divided section (indicated by hatching) obtained by dividing the wafer 4 into a plurality of four sections. FIG. 3A). As shown in FIG. 2B, on the suction surface of the suction tool 12, a suction portion 14, which is a collection of a plurality of suction holes 12a for sucking and holding the conductive ball 10, is formed. The arrangement of the plurality of suction holes 12a in each suction portion 14 is based on the electrode 4 of one semiconductor element 4a.
The sequence matches b. The arrangement of the suction parts 14 is the wafer 4
, And are formed in a lattice pattern only at a predetermined range A (hatched portion) at an arrangement pitch similar to the arrangement pitch of the semiconductor elements 4a. The suction unit 14 suctions the conductive ball 10 to a position corresponding to the electrode arrangement pattern of the electrode group 4c of the semiconductor element 4a.

As shown in FIG. 3 (c), the ball mounting area of the conductive ball 10 on the wafer 4 has four divided sections [1], [2], [3], [3] which are point-symmetric with respect to the center. 4], and each of the divided sections [1], [2], [3],
An individual suction tool 12 is provided according to [4]. That is, the suction tool 12A used when mounting the conductive ball in the divided section [1] has the arrangement of the suction portions 14 as shown in FIG. Range A for semiconductor element 4a belonging to
The conductive balls 10 are adsorbed only when the conductive balls 10 are sucked. Conductive ball 1 in divided sections [2], [3], [4]
0 suction tools 12B, 12 used when mounting
Similarly, the conductive balls 10 are attracted to the semiconductor elements 4a belonging to the respective divided sections only in a predetermined range for C and 12D.

These four kinds of suction tools 12A, 12A
B, 12C, and 12D are mounted on the suction tool mounting portion 11 as shown in FIG. 4, and the pick-up head 8 is moved up and down with respect to the suction tool mounting portion 11, so that the already mounted suction tool 12 is mounted. Can be released and placed on the suction tool mounting portion 11, and another arbitrary suction tool 12 can be newly mounted.

The conductive ball mounting apparatus is configured as described above, and a method for mounting the conductive balls will be described below with reference to FIG. In FIG. 5A, a suction tool 12A is mounted on the pickup head 8, and the pickup head 8 is lowered with respect to the conductive balls 10 in the ball supply unit 9, and the suction tools 12A are used by the suction tools 12A. Is vacuum-adsorbed.

At this time, the wafer 4 is attached to the suction tool 12A.
Suction section 14 only in a predetermined range corresponding to the divided section [1] of FIG.
Is provided, the conductive ball 1 is located only in that range.
0 is adsorbed. Next, the pickup head 8 is raised and moved onto the wafer 4, and is positioned with respect to a predetermined portion of the wafer 4, and the pickup head 8 is lowered, as shown in FIGS. 5 (b) and 5 (c). The conductive ball 10 is mounted on each electrode 4b (see FIG. 3) of each semiconductor element 4a belonging to the divided section [1].

Thereafter, the pickup head 8 is raised,
Next, it is moved onto the suction tool mounting portion 11. Then, the pickup head 8 is lowered to release the suction holding of the suction tool 12A as shown in FIG.
2A is placed at a predetermined position. Next, the pickup head 8 is moved to the next use suction tool 12B and lowered, whereby the suction tool 12B is newly mounted on the lower surface of the pickup head 8.

Next, the pick-up head 8 is moved again onto the ball supply section 9 and is moved up and down to thereby move the wafer 4 in a predetermined range on the lower surface of the suction tool 12B.
The conductive ball 10 is sucked in a range corresponding to the divided section [2]. Similarly, the conductive balls 10 are mounted on the respective electrodes of the semiconductor element 4a belonging to the division [2] of the wafer 4. The above operation is performed while replacing the suction tool 12.
By repeating the process twice, the conductive balls 10 can be mounted on each electrode of all the semiconductor elements 4a of the wafer 4.

In the above mounting operation, the number of reciprocations of the mounting head 7 only needs to be four times, and the number of reciprocations is much smaller than the conventional method of mounting the individual heads. Can be improved. In addition, since the size of the divided section is set within an appropriate range that does not become excessive in view of the conventional results, stable mounting of the conductive ball with less mounting failure is ensured. That is,
It is possible to achieve both good mounting efficiency and stable mounting quality, which were difficult to achieve with the conventional method.

In this embodiment, a wafer on which semiconductor elements are formed is shown as an example of a substrate on which conductive balls are mounted. However, the present invention is not limited to this. The substrate may be formed in a shape. In this case, conductive balls are mounted on the electrodes of the electronic component. Further, in the present embodiment, an example is shown in which the divided sections [1], [2], [3], and [4] are set to point-symmetric shapes, but each divided section may have a different shape. Good. In this case, suction tools having different shapes are used depending on each divided section.

[0023]

According to the present invention, the conductive balls are collectively mounted on each of the divided sections by the suction tools individually corresponding to the divided sections obtained by dividing the conductive ball mounting area into a plurality of sections. Therefore, the conductive balls can be efficiently and stably mounted on a substrate on which a plurality of electronic components are irregularly arranged.

[Brief description of the drawings]

FIG. 1 is a perspective view of a conductive ball mounting device according to an embodiment of the present invention.

FIG. 2A is a cross-sectional view of a pickup head of a conductive ball mounting apparatus according to an embodiment of the present invention. FIG. 2B is a plan view of a lower surface of the pickup head of the conductive ball mounting apparatus of one embodiment of the present invention. Figure

3A is a plan view of a wafer according to an embodiment of the present invention. FIG. 3B is a partial plan view of a wafer according to an embodiment of the present invention. FIG.

FIG. 4 is a plan view of a suction tool mounting portion of the conductive ball mounting device according to one embodiment of the present invention;

FIG. 5A is a process explanatory view of a conductive ball mounting method according to an embodiment of the present invention. FIG. 5B is a process explanatory view of a conductive ball mounting method according to an embodiment of the present invention. Process description diagram of a method for mounting a conductive ball according to an embodiment of the present invention (d) Process description diagram of a method for mounting a conductive ball according to an embodiment of the present invention (e) Conductivity of an embodiment of the present invention Explanatory drawing of the process of mounting the conductive ball

[Explanation of symbols]

 Reference Signs List 4 wafer 4a semiconductor element 4b electrode 8 pickup head 10 conductive ball 12, 12A, 12B, 12C, 12D suction tool 12a suction hole

Claims (2)

[Claims] 1. A conductive ball mounting apparatus for mounting conductive balls on electrodes of a plurality of electronic components formed on a substrate by means of a suction tool, wherein the substrate is divided into a plurality of divided sections. A plurality of suction tools corresponding to the suction tool, and a suction portion formed on the suction surface of these suction tools corresponding to the arrangement of the electronic components and provided with suction holes for vacuum-sucking conductive balls at positions corresponding to the electrodes; A conductive ball suction device comprising: 2. A method for mounting conductive balls on electrodes of a plurality of electronic components formed on a substrate by means of a suction tool, wherein the conductive balls are vacuum-sucked at positions corresponding to the electrodes. A plurality of suction tools provided with suction holes provided corresponding to the arrangement of the electronic components are prepared by individually corresponding to each of the divided sections obtained by dividing the substrate into a plurality of sections. A method of mounting conductive balls, wherein when mounting on a substrate, conductive balls are collectively mounted on each of the divided sections by a suction tool corresponding to each of the divided sections.