JP2000260858A - Wafer transfer hand and wafer transfer method using the same - Google Patents
Wafer transfer hand and wafer transfer method using the sameInfo
- Publication number
- JP2000260858A JP2000260858A JP6590699A JP6590699A JP2000260858A JP 2000260858 A JP2000260858 A JP 2000260858A JP 6590699 A JP6590699 A JP 6590699A JP 6590699 A JP6590699 A JP 6590699A JP 2000260858 A JP2000260858 A JP 2000260858A
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- Japan
- Prior art keywords
- wafer
- transfer
- wafer transfer
- hand
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ウェハ搬送用ハン
ド、及び、これを用いたウェハ搬送方法に係り、特に、
半導体を製造するためのクリーンルームに用いるのに好
適な、ウェハの大口径化による搬送装置の設置面積の増
加を最小限に抑えることが可能な、ウェハ搬送用ハン
ド、及び、これを用いたウェハ搬送方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer hand and a wafer transfer method using the same.
A wafer transfer hand suitable for use in a clean room for manufacturing semiconductors and capable of minimizing an increase in the installation area of a transfer device due to a large diameter wafer, and a wafer transfer using the same. About the method.
【0002】[0002]
【従来の技術】通常のウェハ大気搬送では、ウェハ裏面
を下向きにし、搬送用ハンドとの接触部分の一部を真空
吸引することでウェハを固定している。この方法で、ウ
ェハ裏面を上にする反転動作等を行なっている事例も見
掛けるが、ウェハ縦姿勢で動作させると、ウェハ落下の
危険性が大きくなる。又、真空中での搬送では、真空吸
引ができないので、搬送用ハンドとの接触部分に乗って
いるだけとなり、摩擦力でウェハがハンドに対して動か
ない程度の加減速範囲内の動作を行なっており、水平姿
勢以外は不可能であった。2. Description of the Related Art In normal wafer transfer in the atmosphere, a wafer is fixed by vacuum-suctioning a part of a contact portion with a transfer hand with the back surface of the wafer facing downward. In this method, an inversion operation or the like in which the back surface of the wafer is turned upward can be seen, but when the wafer is operated in the vertical posture, the risk of the wafer dropping increases. Also, since vacuum suction cannot be performed during transfer in a vacuum, the device only rides on the contact portion with the transfer hand and performs operations within the acceleration / deceleration range where the wafer does not move with respect to the hand due to frictional force. And it was impossible to do anything other than a horizontal posture.
【0003】従って、素材となるウェハは、前面開放型
の、いわゆるFOUP等のSEMIで規格化されたウェ
ハ横置きカセットに水平姿勢で収められており、半導体
製造に用いられるクリーンルーム等において、ウェハ両
面を例えばアルゴン微粒子を含む流体により洗浄する工
程のように、ウェハが縦姿勢である方が良い処理工程に
おいても、主に円筒座標系ロボットを用いて、そのまま
水平姿勢でウェハの搬送を行なわざるを得ない。[0003] Therefore, a wafer as a raw material is housed in a horizontal attitude in a wafer-fronting cassette having an open front, which is standardized by SEMI such as a so-called FOUP or the like, and is placed in a clean room or the like used for semiconductor manufacturing. For example, in a process in which the wafer should be in a vertical position, such as in a process of cleaning with a fluid containing argon fine particles, the wafer must be transferred in a horizontal position as it is, mainly by using a cylindrical coordinate system robot. I can't get it.
【0004】なお、減圧容器内で、ほぼ等間隔に配列さ
れたノズルより、水平姿勢のウェハの上面に、アルゴン
微粒子を含む流体を吹き付けて、ウェハをノズルの配列
方向及びその直角方向に移動させながらウェハ表面を洗
浄する方法は、出願人が既に、特開平6−25211
4、特開平6−283488、特開平6−28348
9、特開平6−295894、特開平6−29589
5、特開平7−8929、特開平7−45571、特開
平9−45647、特開平9−323072、特開平1
0−189516等で提案し、実用化している。In a decompression container, a fluid containing fine argon particles is sprayed onto the upper surface of a wafer in a horizontal posture from nozzles arranged at substantially equal intervals to move the wafer in the nozzle arrangement direction and a direction perpendicular thereto. The applicant has already disclosed a method of cleaning the wafer surface while applying the method described in Japanese Patent Application Laid-Open No. 6-25211.
4, JP-A-6-283488, JP-A-6-28348
9, JP-A-6-295894, JP-A-6-29589
5, JP-A-7-8929, JP-A-7-45571, JP-A-9-45647, JP-A-9-323072, JP-A-1
It has been proposed and practically used in 0-189516.
【0005】[0005]
【発明が解決しようとする課題】従来は、ウェハが水平
姿勢で搬送されているため、ウェハ径が1.5倍になれ
ば、搬送距離は1.5倍以上、搬送経路の占有面積は、
2.25倍以上必要になる。そのため、製造装置や装置
を設置するクリーンルームが大型化し、コストアップし
て、ウェハ大口径化の主目的である半導体のコストダウ
ンの大きな阻害要因となっている。Conventionally, since a wafer is transported in a horizontal posture, if the wafer diameter is increased by 1.5 times, the transport distance is 1.5 times or more and the occupied area of the transport path is:
2.25 times or more is required. Therefore, the size of a manufacturing apparatus and a clean room in which the apparatus is installed are increased, the cost is increased, and this is a major hindrance to the cost reduction of semiconductors, which is the main purpose of increasing the diameter of a wafer.
【0006】本発明は、前記従来の問題点を解消するべ
くなされたもので、ウェハの大口径化による製造装置の
設置面積の増加を最小限に抑えると共に、ウェハ搬送姿
勢の制限を無くして、ウェハ縦姿勢での搬送を可能とす
ることを課題とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and minimizes an increase in an installation area of a manufacturing apparatus due to an increase in the diameter of a wafer, and eliminates a limitation on a wafer transfer posture. It is an object of the present invention to enable transfer in a wafer vertical posture.
【0007】[0007]
【課題を解決するための手段】本発明は、縦姿勢のウェ
ハの円周下方のエッジ部を支持する、複数のV字状溝を
備えたウェハ搬送用ハンドを用いて、ウェハを縦姿勢に
保持したり、縦姿勢のまま水平方向に移動させるように
して、前記課題を解決したものである。SUMMARY OF THE INVENTION According to the present invention, a wafer is held in a vertical position by using a wafer transfer hand provided with a plurality of V-shaped grooves, which supports a peripheral lower edge portion of the wafer in a vertical position. This problem has been solved by holding or moving in a horizontal direction while maintaining a vertical posture.
【0008】又、前記V字状溝の一部を可動とし、ウェ
ハ上部も把持可能として、ウェハを確実に把持できるよ
うにしたものである。The V-shaped groove may be partially movable, and the upper part of the wafer may be gripped so that the wafer can be gripped reliably.
【0009】又、前記ウェハ搬送用ハンドを複数組、ウ
ェハ処理装置に近接配置して、処理前ウェハと処理済み
ウェハの入れ替えが、確実に行なえるようにしたもので
ある。In addition, a plurality of sets of the wafer transfer hands are arranged in proximity to the wafer processing apparatus so that the pre-processed wafer and the processed wafer can be exchanged reliably.
【0010】又、前記ウェハ搬送用ハンドを用いて、真
空中のウェハの保持搬送を行なうようにして、真空吸引
できない真空中での搬送も可能としたものである。[0010] The wafer transfer hand is used to hold and transfer a wafer in a vacuum, thereby enabling transfer in a vacuum where vacuum suction is not possible.
【0011】又、固定されたV字状溝のみによりウェハ
の下部を保持するウェハ搬送用ハンドと、前記V字状溝
の一部が可動とされ、ウェハの上部も把持可能なウェハ
搬送用ハンドとの組合せにより、ウェハの受け渡しが確
実に行なえるようにしたものである。Also, a wafer transfer hand for holding the lower part of the wafer only by the fixed V-shaped groove, and a wafer transfer hand in which a part of the V-shaped groove is movable and the upper part of the wafer can be gripped. In this case, the wafer can be reliably transferred.
【0012】既に説明したように、従来の如く、搬送用
ハンドとの接触部分の一部を真空吸引する方法では、大
気中の搬送であっても、ウェハを縦姿勢で動作させる
と、ウェハ落下の危険性が大きくなる。又、真空吸引が
できない真空中での搬送では、水平姿勢以外は不可能で
ある。そこで本発明では、複数のV字状溝を備えたウェ
ハ搬送用ハンドにより、縦姿勢のウェハの円周下方のエ
ッジ部を支持するようにして、縦姿勢での保持や搬送を
可能としている。As described above, in the conventional method of vacuum-suctioning a part of the contact portion with the transfer hand, even if the wafer is operated in the vertical position even when the wafer is transferred in the atmosphere, the wafer is dropped. The danger increases. In addition, transporting in a vacuum where vacuum suction is not possible is impossible except for a horizontal posture. Therefore, in the present invention, a wafer transfer hand having a plurality of V-shaped grooves supports an edge portion of a wafer in a vertical position below a circumference, thereby enabling holding and transfer in a vertical position.
【0013】[0013]
【発明の実施の形態】以下、図面を参照して、本発明の
実施形態を詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【0014】本発明の第1実施形態は、図1に示す如
く、ウェハ10の真下で板状のフレーム22に固定され
た、ウェハ10と略同半径のV字状溝を有する1つの固
定爪24と、ウェハ10の上方2箇所で把持アクチュエ
ータ28を介してフレーム22に配設された、ウェハ1
0と略同半径のV字状溝を有する2つの可動爪26を備
えた搬送ハンド20の計3個の爪により、図2に把持状
態の断面を示す如く、ウェハ10を把持して、縦姿勢の
まま水平方向に移動させる。In the first embodiment of the present invention, as shown in FIG. 1, one fixed claw having a V-shaped groove having substantially the same radius as the wafer 10 is fixed to a plate-like frame 22 directly below the wafer 10. 24 and the wafer 1 disposed on the frame 22 via the gripping actuator 28 at two places above the wafer 10.
The wafer 10 is gripped by a total of three claws of the transfer hand 20 provided with two movable claws 26 having a V-shaped groove having substantially the same radius as 0, as shown in a gripped state in FIG. Move horizontally in the same posture.
【0015】本発明の第2実施形態は、図3に示す如
く、ウェハ両面洗浄時にウェハ表裏面全面への洗浄流体
の吹き付けを可能にするべく、ウェハ裏面を覆わない枠
状のフレーム32に、ウェハ10の下方2箇所で固定さ
れた、ウェハ10と略同半径のV字状溝を有する2つの
固定爪34と、前記フレーム32に対して把持ロッド4
0により相対移動可能とされた可動プレート36に固定
された、ウェハ10と略同半径のV字状溝を有する2つ
の可動爪38を備えたプロセスハンド30の計4個の爪
により、図4に示す如く、ウェハ10の上下を把んで、
ウェハ10を縦姿勢のままXY方向に走査させる。In the second embodiment of the present invention, as shown in FIG. 3, in order to enable a cleaning fluid to be sprayed on the entire front and back surfaces of the wafer when cleaning both surfaces of the wafer, a frame-like frame 32 not covering the back surface of the wafer is provided. Two fixing claws 34 having V-shaped grooves having substantially the same radius as the wafer 10 and fixed at two places below the wafer 10,
The process hand 30 includes two movable claws 38 each having a V-shaped groove having substantially the same radius as the wafer 10 and fixed to a movable plate 36 which can be relatively moved by zero. As shown in FIG.
The wafer 10 is scanned in the XY directions while maintaining the vertical posture.
【0016】第1及び第2実施形態のウェハ搬送用ハン
ド20、30によれば、可動爪26、38を用いてウェ
ハ10を上下から把持するので、ウェハ10を確実に把
持することができ、特にウェハ10の移動、走査や、洗
浄流体による力が加わる洗浄作業等に用いるのに適して
いる。According to the wafer transfer hands 20, 30 of the first and second embodiments, the wafer 10 is gripped from above and below using the movable claws 26, 38, so that the wafer 10 can be gripped reliably. In particular, it is suitable for use in the movement and scanning of the wafer 10 and in a cleaning operation in which a force is applied by a cleaning fluid.
【0017】本発明の第3実施形態は、図5に示す如
く、略C字状のフレーム52に、円周状のV字状溝を外
周面に有する4つのスタッド54が設けられた支持ハン
ド50により、ウェハ10を縦姿勢に保持するようにし
たものである。As shown in FIG. 5, a third embodiment of the present invention relates to a supporting hand in which a substantially C-shaped frame 52 is provided with four studs 54 having a circumferential V-shaped groove on the outer peripheral surface. Reference numeral 50 indicates that the wafer 10 is held in a vertical position.
【0018】第1及び第2実施形態のウェハ搬送用ハン
ド20、30間のように、ウェハ10を可動爪により把
持する方式のハンド同士の受け渡しでは、位置ずれ等に
よる互いの把持力のずれにより、ウェハ10の破損の危
険性があるが、第3実施形態の支持ハンド50との組合
せでは、その危険性がなくなる。又、第3実施形態で
は、把持アクチュエータが不要であるため、大気中、真
空中のいずれでも使用でき、又、周囲の圧力変化の影響
も受けない。As in the first and second embodiments, when hands are transferred between hands of a type in which the wafer 10 is gripped by a movable claw, as in the case of the wafer transfer hands 20 and 30, the gripping force is shifted due to a positional shift or the like. There is a risk of damage to the wafer 10, but in combination with the support hand 50 of the third embodiment, the risk is eliminated. Further, in the third embodiment, since a gripping actuator is not required, the gripping actuator can be used in the atmosphere or in a vacuum, and is not affected by a change in ambient pressure.
【0019】前記第1乃至第3実施形態のハンドを組合
せて実際の搬送を行なうようにしたウェハ洗浄装置の搬
送機構の構成例を図6及び図7に示す。FIGS. 6 and 7 show examples of the structure of a transfer mechanism of a wafer cleaning apparatus in which the hands of the first to third embodiments are combined for actual transfer.
【0020】このウェハ洗浄装置においては、図6に示
す如く、真空中でウェハ10の表裏面を縦姿勢のまま洗
浄するためのプロセスチャンバ60の入側に、大気中を
搬送されてきたウェハ10を導入するための導入チャン
バ70が設けられており、前記プロセスチャンバ60の
側方の入口、及び、導入チャンバ64の上方の入口に
は、それぞれ、チヤンバ内外を仕切り、ウェハ10の装
入時のみ開かれるゲートバルブ62、72が設けられて
いる。In this wafer cleaning apparatus, as shown in FIG. 6, the wafer 10 transported in the atmosphere is introduced into the process chamber 60 for cleaning the front and back surfaces of the wafer 10 in a vacuum while keeping the front and back surfaces in a vertical position. An introduction chamber 70 for introducing the wafer is provided. An entrance on the side of the process chamber 60 and an entrance above the introduction chamber 64 are partitioned from inside and outside of the chamber, respectively, and only when the wafer 10 is loaded. Gate valves 62 and 72 that are opened are provided.
【0021】更に、前記導入チャンバ70の上方には、
軸81(図8乃至図10参照)の先に取付けられた2本
のアーム82、83及びリスト84を介して、先端部材
86を半径(R軸)方向、軸(Z軸)方向、軸回転(θ
軸)方向、リスト回転(W軸)方向の4軸方向に移動可
能な、大気搬送用の4軸円筒型ロボット(大気搬送ロボ
ットと称する)80が、胴部が上、アーム82部が下と
なる姿勢で配設され、該大気搬送ロボット80の先端部
材86には、第1実施形態の搬送ハンド20が取付けら
れている。この大気搬送ロボット80は、図8乃至図1
0に示す如く、リスト84をW軸方向に回転することに
よって、搬送ハンド20の姿勢を、水平姿勢から縦姿勢
に変換する機能も有する。Further, above the introduction chamber 70,
The tip member 86 is rotated in the radius (R-axis) direction, the axis (Z-axis) direction, and the axis rotation via two arms 82 and 83 and a wrist 84 attached to the end of the shaft 81 (see FIGS. 8 to 10). (Θ
A four-axis cylindrical robot for atmospheric transfer (referred to as an atmospheric transfer robot) 80 that can move in four axial directions, i.e., axle) direction and wrist rotation (W-axis) direction, has a body upper part and an arm 82 part lower. The transfer hand 20 according to the first embodiment is attached to the distal end member 86 of the atmospheric transfer robot 80. This atmosphere transfer robot 80 is shown in FIGS.
As shown in FIG. 0, by rotating the wrist 84 in the W-axis direction, there is also a function of converting the posture of the transport hand 20 from a horizontal posture to a vertical posture.
【0022】前記導入チャンバ70の側面には、図11
乃至図14に示す如く、軸91の先に取付けられた2本
のアーム92、93を介して、先端部材94を半径
(R)方向と軸(Z)方向に移動可能な、ウェハをプロ
セスチャンバに導入するための円筒座標系ロボット(真
空ロボットと称する)90が、胴部が水平となるように
取り付けられている。この真空ロボット90には、第3
実施形態の支持ハンド50が、2組対向して取り付けら
れている。FIG. 11 shows a side view of the introduction chamber 70.
As shown in FIGS. 14 to 14, a wafer in which a tip member 94 can be moved in a radius (R) direction and an axis (Z) direction via two arms 92 and 93 attached to the tip of a shaft 91 is provided. A cylindrical coordinate system robot (referred to as a vacuum robot) 90 for introducing the robot is mounted such that the trunk is horizontal. The vacuum robot 90 has a third
Two sets of the support hands 50 of the embodiment are attached to face each other.
【0023】前記プロセスチャンバ60の内部には、第
2実施形態のプロセスハンド30が配設されている。Inside the process chamber 60, the process hand 30 of the second embodiment is provided.
【0024】以下、搬送動作を説明する。Hereinafter, the transport operation will be described.
【0025】まず、大気搬送ロボット80が、図15に
示す如く、そのZ軸方向移動及びR軸方向移動動作で、
搬送ハンド20を、可動爪26を開いた状態でウェハ横
置きカセット8の未処理ウェハのスロットに進入させ、
可動爪26を閉じてウェハ10を把持した後、カセット
8から水平方向に引き出し、リスト84を回転して縦姿
勢に変換する。図15において、100は、プロセスハ
ンド30の可動爪26を駆動する機構、および、ウェハ
10を洗浄する際に、ウェハ表裏面全体に洗浄流体が吹
き付けられるように、プロセスハンド30をXY両方向
に走査するためのウェハ駆動機構である。First, as shown in FIG. 15, the atmosphere transfer robot 80 moves in the Z-axis direction and the R-axis direction,
The transfer hand 20 is caused to enter the unprocessed wafer slot of the horizontal wafer cassette 8 with the movable claw 26 opened,
After the movable claw 26 is closed and the wafer 10 is grasped, the wafer 10 is pulled out from the cassette 8 in the horizontal direction, and the wrist 84 is rotated to change the posture to the vertical posture. In FIG. 15, reference numeral 100 denotes a mechanism for driving the movable claw 26 of the process hand 30, and the process hand 30 scans in both the X and Y directions so that a cleaning fluid is sprayed on the entire front and back surfaces of the wafer when the wafer 10 is cleaned. This is a wafer drive mechanism for performing
【0026】ウェハ10を縦姿勢で把持した搬送ハンド
20は、図16に示す如く、ゲートバルブ72上で待機
する。一方、導入チャンバ70内の支持ハンド50の一
方は、図17に示す如く、処理済ウェハを支持して、ゲ
ート下で待機している。The transfer hand 20 holding the wafer 10 in the vertical position stands by on the gate valve 72 as shown in FIG. On the other hand, as shown in FIG. 17, one of the support hands 50 in the introduction chamber 70 supports the processed wafer and stands by under the gate.
【0027】図16において、4はカセットステーショ
ン、5は、ウェハ取出中のカセット8の前面を開くため
のポットオープナ、6はコントローラ、9は交換用のカ
セットである。In FIG. 16, reference numeral 4 denotes a cassette station, 5 denotes a pot opener for opening the front surface of the cassette 8 from which a wafer is being taken out, 6 denotes a controller, and 9 denotes a replacement cassette.
【0028】前記大気搬送ロボット80は、図18に示
すような複数のカセット8、9に対応できるように、走
行装置110に搭載され、フレーム112に支持されて
いる。The atmospheric transfer robot 80 is mounted on a traveling device 110 and supported by a frame 112 so as to support a plurality of cassettes 8 and 9 as shown in FIG.
【0029】図17の状態でゲートバルブ72が開く
と、真空ロボット90に保持された支持ハンド50は動
かず、大気搬送ロボット80のZ軸方向下降動作で、処
理前ウェハ10が導入チャンバ70内に搬入され、空い
ている方の支持ハンド50に渡され、可動爪26が開か
れてウェハ10の把持が解除される。When the gate valve 72 is opened in the state shown in FIG. 17, the supporting hand 50 held by the vacuum robot 90 does not move, and the unprocessed wafer 10 is moved into the introduction chamber 70 by the downward movement of the atmospheric transfer robot 80 in the Z-axis direction. The movable claw 26 is opened and the grip of the wafer 10 is released.
【0030】大気搬送ロボット80は、次いでZ軸方向
上下動作とR軸方向動作で、反対の支持ハンド50の処
理済ウェハ位置に移動し、可動爪26を閉じて処理済ウ
ェハを受取り、Z軸方向上昇動作で、上方の導入チャン
バ70外へ退避して、ゲートバルブ72が閉じられる。Next, the atmosphere transfer robot 80 moves to the processed wafer position of the opposite supporting hand 50 by the vertical movement in the Z-axis direction and the movement in the R-axis direction, and closes the movable claw 26 to receive the processed wafer. The gate valve 72 is closed by retracting to the outside of the upper introduction chamber 70 by the upward movement.
【0031】導入チャンバ70上へ取り出された処理済
ウェハは、リスト84の回転で縦姿勢から水平姿勢に変
換され、Z軸方向移動とR軸方向移動動作の組合せで、
カセット8の返却スロット前へ移動し、R軸方向移動動
作で、ポットオープナ5により前面が開かれたカセット
8の返却スロット内に進入する。次いで処理済ウェハの
把持が解除され、Z軸方向下降動作で返却後、R軸方向
移動動作で、搬送ハンド20がカセット8外へ退避す
る。The processed wafer taken out into the introduction chamber 70 is converted from a vertical position to a horizontal position by the rotation of the wrist 84, and combined with the Z-axis movement and the R-axis movement,
The cassette 8 moves to the front of the return slot, and enters the return slot of the cassette 8 whose front face is opened by the pot opener 5 by the movement in the R-axis direction. Next, the gripping of the processed wafer is released, and after the wafer is returned by the downward movement in the Z-axis direction, the transfer hand 20 is retracted out of the cassette 8 by the movement operation in the R-axis direction.
【0032】一方、導入チャンバ20で真空排気および
洗浄室との均圧を行った後、処理前ウェハを受取った支
持ハンド50は、真空ロボット90のR軸方向動作で、
図15に示した如く、処理前ウェハをゲートバルブ62
を通してプロセスチャンバ60内に装入する、すると、
ウェハが支持ハンド50からプロセスハンドに渡され、
プロセスハンド30の把持ロッド40が下降して、可動
爪38によりウェハが把持される。次いで、真空ロボッ
ト90のR軸方向動作で、支持ハンド50がプロセスチ
ャンバ60外に退避され、ゲートバルブ62が閉じられ
る。次いで、ウェハ駆動機構100によりウェハがXY
方向に走査されつつ、両面が洗浄される。On the other hand, after the evacuation in the introduction chamber 20 and the pressure equalization with the cleaning chamber, the supporting hand 50 that has received the unprocessed wafer is moved by the vacuum robot 90 in the R-axis direction.
As shown in FIG.
Into the process chamber 60 through
The wafer is passed from the support hand 50 to the process hand,
The gripping rod 40 of the process hand 30 descends, and the movable claw 38 grips the wafer. Next, with the operation of the vacuum robot 90 in the R-axis direction, the support hand 50 is retracted outside the process chamber 60, and the gate valve 62 is closed. Next, the wafer is driven by the wafer drive mechanism 100 to move the wafer to XY.
Both sides are cleaned while being scanned in the direction.
【0033】洗浄中に前述の搬送工程が行われ、洗浄終
了前には次処理ウェハが導入チャンバ内にて待機してい
る。During the cleaning, the above-described transfer step is performed, and the next processing wafer is waiting in the introduction chamber before the cleaning is completed.
【0034】プロセスチャンバ60内での洗浄処理が終
了すると、処理済ウェハを把持したプロセスハンド30
が、プロセスチャンバ60の受け渡し位置に移動し、ゲ
ートバルブ62が開く。すると、水平取付の真空ロボッ
ト90のR軸方向動作で、支持ハンド50及び処理前ウ
ェハが、プロセスチャンバ60内の受け渡し位置に移動
する。When the cleaning process in the process chamber 60 is completed, the process hand 30 holding the processed wafer
Moves to the transfer position of the process chamber 60, and the gate valve 62 is opened. Then, the support hand 50 and the unprocessed wafer are moved to the transfer position in the process chamber 60 by the operation of the horizontally mounted vacuum robot 90 in the R-axis direction.
【0035】次いで、処理済ウェハが、プロセスハンド
30から支持ハンド50の一方に渡されると共に、処理
前ウェハが、支持ハンド50の他方からプロセスハンド
30に渡される。Next, the processed wafer is transferred from the process hand 30 to one of the support hands 50, and the unprocessed wafer is transferred from the other of the support hands 50 to the process hand 30.
【0036】次いで、支持ハンド50及び処理済ウェハ
が導入チャンバ70に退避し、ゲートバルブ72が閉じ
られて、次処理ウェハの洗浄処理が開始される。Next, the supporting hand 50 and the processed wafer are retreated to the introduction chamber 70, the gate valve 72 is closed, and the cleaning processing of the next processing wafer is started.
【0037】上記の一連の処理の繰り返しで、ウェハが
次々洗浄され、一つのカセットが終了すると、次のカセ
ットに移る。By repeating the above series of processes, the wafers are washed one after another, and when one cassette is completed, the process proceeds to the next cassette.
【0038】本実施形態においては、本発明によるウェ
ハ支持を、プロセス導入部に使用しているので、導入チ
ャンバの圧力変化に対応でき、真空でも把持できる。In the present embodiment, since the wafer support according to the present invention is used in the process introduction section, it can cope with pressure changes in the introduction chamber and can be held even in vacuum.
【0039】なお、前記実施形態においては、本発明
が、ウェハの洗浄装置におけるウェハの保持及び搬送に
適用されていたが、本発明の適用対象はこれに限定され
ない。In the above embodiment, the present invention is applied to holding and transporting a wafer in a wafer cleaning apparatus, but the present invention is not limited to this.
【0040】又、本発明は、真空中におけるウェハの搬
送や保持に好適なものであるが、本発明の適用対象はこ
れに限定されず、大気中の搬送や保持にも同様に適用で
きることは明らかである。Although the present invention is suitable for carrying and holding a wafer in a vacuum, the present invention is not limited to this, and it is equally applicable to carrying and holding in the atmosphere. it is obvious.
【0041】[0041]
【発明の効果】本発明によれば、ロボット間の受け渡し
を含む縦姿勢でのウェハ搬送が、真空中であっても可能
になる。従って、ウェハの大口径化に伴う製造装置の設
置面積の増加を最小限に抑えることが可能となる。According to the present invention, wafer transfer in a vertical posture including transfer between robots can be performed even in a vacuum. Therefore, it is possible to minimize the increase in the installation area of the manufacturing apparatus due to the increase in the diameter of the wafer.
【0042】又、例えばアルゴン微粒子を含む流体によ
る両面洗浄工程のように、ウェハ縦姿勢の方がより良い
工程における、搬送姿勢による制限を無くすことができ
る。In addition, it is possible to eliminate the restriction due to the transfer posture in a process in which the vertical posture of the wafer is better, such as a double-side cleaning process using a fluid containing argon fine particles.
【図1】本発明に係るウェハ搬送用ハンドの第1実施形
態の構成を示す斜視図FIG. 1 is a perspective view showing a configuration of a first embodiment of a wafer transfer hand according to the present invention.
【図2】第1実施形態でウェハを把持している状態を示
す断面図FIG. 2 is a cross-sectional view showing a state in which the wafer is gripped in the first embodiment.
【図3】本発明の第2実施形態によりウェハを把む前の
状態を示す斜視図FIG. 3 is a perspective view showing a state before grasping a wafer according to a second embodiment of the present invention;
【図4】同じくウェハを把んだ状態を示す斜視図FIG. 4 is a perspective view showing a state in which the wafer is similarly grasped.
【図5】同じく第3実施形態の構成を示す斜視図FIG. 5 is a perspective view showing the configuration of the third embodiment.
【図6】前記ウェハ搬送用ハンドの各実施形態を組合せ
て用いたウェハ洗浄装置の搬送機構の構成例を示す斜視
図FIG. 6 is a perspective view showing a configuration example of a transfer mechanism of a wafer cleaning apparatus using a combination of the respective embodiments of the wafer transfer hand.
【図7】同じく内部構成を示す斜視図FIG. 7 is a perspective view showing the same internal configuration.
【図8】前記搬送機構で用いられている大気搬送ロボッ
トの構成及び動作を説明するための正面図FIG. 8 is a front view for explaining the configuration and operation of an atmospheric transfer robot used in the transfer mechanism.
【図9】同じくリスト回転前の側面図FIG. 9 is a side view of the wrist before rotation.
【図10】同じくリスト回転後の側面図FIG. 10 is also a side view after rotation of the wrist.
【図11】前記搬送機構で用いられている真空ロボット
の構成及び動作を説明するための正面図FIG. 11 is a front view illustrating the configuration and operation of a vacuum robot used in the transfer mechanism.
【図12】同じくアームを縮めた状態の側面図FIG. 12 is a side view of the same arm in a contracted state.
【図13】同じくアームを伸ばした状態の側面図FIG. 13 is a side view showing a state where the arm is extended.
【図14】同じくアーム部分の正面図FIG. 14 is a front view of the arm portion.
【図15】前記搬送機構の大気搬送ロボットが、ウェハ
横置カセットからウェハを引出している状態を示す斜視
図FIG. 15 is a perspective view showing a state where the atmospheric transfer robot of the transfer mechanism is pulling out a wafer from the wafer horizontal cassette.
【図16】同じく導入チャンバ上で待機している状態を
示す斜視図FIG. 16 is a perspective view showing a state of waiting on the introduction chamber.
【図17】同じく導入チャンバ内で待機している状態を
示す斜視図FIG. 17 is a perspective view showing a state of waiting in the introduction chamber.
【図18】前記搬送機構を図16の反対側から見た斜視
図FIG. 18 is a perspective view of the transport mechanism as viewed from the opposite side of FIG.
8…ウェハ横置カセット 10…ウェハ 20、30、50…ハンド 22、32、52…フレーム 24、34…固定爪 26、38…可動爪 28…把持アクチュエータ 36…可動プレート 40…把持ロッド 54…スタッド 80…大気搬送ロボット 96…真空ロボット 8 Wafer horizontal cassette 10 Wafer 20, 30, 50 ... Hand 22, 32, 52 ... Frame 24, 34 ... Fixed claw 26, 38 ... Movable claw 28 ... Grip actuator 36 ... Movable plate 40 ... Grip rod 54 ... Stud 80: Atmospheric transfer robot 96: Vacuum robot
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 5F031 CA02 DA01 FA01 FA07 FA11 FA12 FA14 FA18 FA21 GA06 GA10 GA13 GA14 GA15 GA45 GA47 GA48 GA49 LA15 MA23 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5F031 CA02 DA01 FA01 FA07 FA11 FA12 FA14 FA18 FA21 GA06 GA10 GA13 GA14 GA15 GA45 GA47 GA48 GA49 LA15 MA23
Claims (6)
持する、複数のV字状溝を備えたことを特徴とするウェ
ハ搬送用ハンド。1. A wafer transfer hand comprising a plurality of V-shaped grooves for supporting a peripheral lower edge portion of a wafer in a vertical position.
可動とされ、ウェハ上部も把持可能とされていることを
特徴とするウェハ搬送用ハンド。2. The wafer transfer hand according to claim 1, wherein a part of the V-shaped groove is movable and an upper portion of the wafer is also grippable.
ドを用いて、ウェハを縦姿勢に保持したり、縦姿勢のま
ま水平方向に移動させることを特徴とするウェハ搬送方
法。3. A wafer transfer method using the wafer transfer hand according to claim 1 or 2, wherein the wafer is held in a vertical position or moved in a horizontal direction while maintaining the vertical position.
ドを複数組、ウェハ処理装置に近接配置して、処理前ウ
ェハと処理済みウェハの入れ替えを行なうことを特徴と
するウェハ搬送方法。4. A wafer transfer method, wherein a plurality of sets of the wafer transfer hands according to claim 1 or 2 are arranged in proximity to a wafer processing apparatus to exchange a pre-processed wafer and a processed wafer.
ドを用いて、真空中のウェハの保持や搬送を行なうこと
を特徴とするウェハ搬送方法。5. A wafer transfer method, wherein a wafer is held or transferred in a vacuum using the wafer transfer hand according to claim 1.
部を保持するウェハ搬送用ハンドと、請求項2に記載の
ウェハ搬送用ハンドとの組合せにより、ウェハの受け渡
しを行なうことを特徴とするウェハ搬送方法。6. A wafer transfer is performed by a combination of a wafer transfer hand holding a lower portion of a wafer only by a fixed V-shaped groove and the wafer transfer hand according to claim 2. Wafer transfer method.
Priority Applications (1)
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JP6590699A JP2000260858A (en) | 1999-03-12 | 1999-03-12 | Wafer transfer hand and wafer transfer method using the same |
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Application Number | Priority Date | Filing Date | Title |
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JP6590699A JP2000260858A (en) | 1999-03-12 | 1999-03-12 | Wafer transfer hand and wafer transfer method using the same |
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Family
ID=13300485
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