JP2000252304A - Device for manufacturing semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce risk of cracking and chipping on a semiconductor chip when the semiconductor chip is pushed up by a needle pin and is taken out by an adsorbing collet. SOLUTION: From a wafer 37 which is divided into a plurality of parts and has a dicing sheet 38 on the back, divided semiconductor chips 39 are pushed up from a side of the dicing sheet 38 by a needle pin 36, which is provided on a pushing-up rod 26, and the semiconductor chips 39 are taken out by a chucking collet 40. In this case, the needle pin 36 is mounted on the pushing-up rod 26 via a retreating mechanism 31, which comprises a slide push unit 34 and a holding spring 32. The holding spring 32 moves backward when a load of pushing impact, that is detected by an impact load detecting section 41 provided on the chucking collet 40, is a predetermined value or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus used for picking up a semiconductor chip from a diced wafer and mounting it on a lead frame or the like, for example, in a process of assembling a semiconductor device.

[0002]

2. Description of the Related Art The prior art will be described with reference to FIG.
FIG. 3 is a longitudinal sectional view of a main part, in which 1 is a holder main body, 2 is a backup holder provided on an upper part of the holder main body 1, and a suction hole 3 is formed at an upper end thereof, and a suction is formed at a lower part. A mouth 4 is provided. 5 is the holder body 1
And a push-up rod provided in the backup holder 2 so as to be able to move up and down as shown by an arrow A. The push-up rod is made to move forward and backward by a predetermined stroke by a cam mechanism (not shown). 6 assists the operation. In addition, 7
Is a needle pin fixed to the upper end of the push-up rod 5, which moves forward and backward together with the push-up rod 5, so that the tip end of the needle pin 7 projects from the upper end surface of the backup holder 2 during the upward advance operation. .

[0003] On the other hand, reference numeral 8 denotes a wafer having a back surface to which a dicing sheet 9 is adhered, which is divided into a plurality of semiconductor chips 10 by dicing, and each semiconductor chip 10 is adhered to the dicing sheet 9 even after being divided. It is still standing. Reference numeral 11 denotes a suction collet of a bonding tool provided on a mount head (not shown).
The semiconductor chip 10 is moved to a position immediately above the position where the needle pin 7 protrudes, and sucks and holds the semiconductor chip 10 at the lower end by a suction action accompanying operation of a connected vacuum pump (not shown).

[0004] Then, in such a configuration,
The semiconductor chip 10 is mounted on the dicing sheet 9 as follows.
From the suction collet 11 and transferred to, for example, a lead frame (not shown). That is, first, the wafer 8 on which the dicing sheet 9 is stuck is held just above the upper end surface of the backup holder 2 from which the tip of the needle pin 7 protrudes so that the semiconductor chip 10 to be picked up is located, and is connected to the suction port 4. The dicing sheet 9 on the rear surface side of the semiconductor chip 10 to be picked up is sucked and held by the suction action of the suction hole 3 accompanying the operation of the decompression device which is not used.

Next, the push-up rod 5 is advanced upward by the operation of the cam mechanism, and is pushed up from the back surface side of the dicing sheet 9 held by the suction hole 3 by suction at the tip end of the needle pin 7, and the dicing sheet 9 is moved. And the semiconductor chip 10 is pushed up. At the same time, the needle pin 7 is moved to a position immediately above the position where the needle pin 7 protrudes and is lowered to a predetermined position.
Holds the semiconductor chip 10 pushed up by the tip of the semiconductor chip.

Thereafter, the suction collet 11 is moved upward, the semiconductor chip 10 held by suction is peeled off from the dicing sheet 9, and is transferred to, for example, a predetermined position of a lead frame. In addition, the needle pin 7 causes the push-up rod 5 to advance by a predetermined stroke by a cam mechanism,
When the operation shifts to the retreating operation, it moves downward from the maximum projecting position, and the tip retreats below the upper end surface of the backup holder 2. At this time, the retracting operation of the push-up rod 5 is smoothly performed by the assisting operation of the pull-down spring 6.

However, in the above prior art,
At the moment when the suction collet 11 descends, the semiconductor chip 10 is sucked and held, and the dicing sheet 9 sinks and comes into contact with the needle pins 7, the needle pins 7 advance to move up and the dicing sheet 9 breaks through the semiconductor chips 10. The maximum impact load is applied to the semiconductor chip 10 at the moment when the semiconductor chip 10 is hit. When the impact load is applied, the semiconductor chip 10 may be cracked or chipped.

Further, the suction collet 11 is used for the semiconductor chip 1.
Although the pushing up operation by the cam mechanism is not completed, the semiconductor chip 11 before moving upward is pushed up by the needle pin 7 despite the suction holding of the semiconductor chip 10 by the suction collet 11. As a result, there is a case where a timing shift occurs in the pick-up operation of pushing up the needle pin 7, a large impact load is applied to the semiconductor chip 10, and a crack or a chip may occur. For this reason, it is difficult to match the timing of the pickup operation, and it takes time to perform the adjustment. Furthermore, there is an overshoot in the vertical movement of the mount head holding the suction collet 11, and the needle pin 7 hits the semiconductor chip 10 due to the overshoot, and a large impact load is applied to the semiconductor chip 10;
Similarly, cracks, chipping, and the like may occur.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above situation, and has as its object to push up a semiconductor chip with a needle pin and pick it up with a suction collet. An object of the present invention is to provide a semiconductor manufacturing apparatus in which a large impact load is not applied to a semiconductor chip, a crack or a chip is less likely to occur, and an adjustment time for adjusting a timing of a pickup operation is short.

[0010]

According to the semiconductor manufacturing apparatus of the present invention, a divided semiconductor chip is provided on a rod which is pushed up from a dicing sheet side from a wafer having a dicing sheet attached to a back surface and divided into a plurality of pieces. In a semiconductor manufacturing apparatus in which a needle pin pushes up and is taken up by a collet, the needle pin is attached to a push-up rod via a retraction mechanism that performs a retraction operation when an impact load exceeds a predetermined value. Wherein the retraction mechanism comprises a holding spring and a slide push unit.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. 1 is a longitudinal sectional view of a main part, and FIG. 2 is a partially enlarged longitudinal sectional view.

1 and 2, reference numeral 21 denotes a holder main body, and reference numeral 22 denotes a cylindrical backup holder provided at an upper portion of the holder main body 21. Is formed with a suction port 25, and a suction port 25 is formed at a lower portion thereof so as to communicate with the suction path 24.
Is provided. Reference numeral 26 denotes a push-up rod, the lower part of which is provided with an airtight member 27 at an intermediate portion and penetrates the holder body 21 in an airtight manner, and the upper cylindrical part 29 whose upper end opening is closed by a lid 28 is a backup. It is located in the suction passage 24 of the holder 22 and is provided so as to be able to move up and down as shown by the arrow B. The push-up rod 26 moves forward and backward with a predetermined stroke by a cam mechanism (not shown), and the downward retreat operation is assisted by a pull-down spring 30.

Further, a holding spring 32 constituting a retraction mechanism 31 and a detent pin 33 on the holding spring 32 are provided in a cylindrical portion 29 above the push-up rod 26.
To provide the slide push unit 34 and the variable rod 3
5 are provided. In addition, the variable rod 35 is
A needle 28 is fixed to the upper end of the cover 28 that can move up and down. Then, the needle pin 36 is
Perform an advancing and retreating operation, and when the advancing operation is performed upward, the tip protrudes upward from the upper end surface of the backup holder 22.

On the other hand, reference numeral 37 denotes a dicing sheet 38 on the back surface.
Is divided into a plurality of semiconductor chips 39 by dicing, and each semiconductor chip 3
9 remains attached to the dicing sheet 38 even after the division. The wafer 37 is mounted on a wafer ring (not shown) such that the outer peripheral portion of the dicing sheet 38 is pulled outward, and is disposed above the backup holder 22 with a gap provided between the semiconductor chips 39.

Reference numeral 40 denotes a suction collet of a bonding tool provided on a mount head (not shown). The needle collet 36 moves right above a position where the needle pin 36 protrudes from the upper end surface of the backup holder 22, and is lowered and connected. The semiconductor chip 39 is sucked and held at the lower end by the suction effect accompanying the operation of the vacuum pump. Reference numeral 41 denotes an impact load detection unit which detects an impact load from the load and acceleration applied to the suction collet 40, and outputs a release signal to the slide push unit 34 of the retraction mechanism 31 if the detected load is an impact load equal to or more than a predetermined value. It is supposed to.

The slide push unit 34 is
In the set state, the apparatus is set to the set release state in response to the release signal, and the state is changed from the set release state to the set state by performing a reset operation. Then, in the set state, when the push-up rod 26 performs the upward movement by the cam mechanism, the movement is transmitted to the variable rod 35 in the coupled state, and the movement is performed so as to push the variable rod 35 upward. I do. Accordingly, the needle pin 36 fixed to the variable rod 35 also advances.

On the other hand, the slide push unit 34
In the set release state in which the release signal is received from the impact load detecting unit 41, the connection with the variable rod 35 is released, and the variable rod is first released by the holding spring 32 disposed on the inner bottom surface of the cylindrical portion 29 of the push-up rod 26. 35 is lowered and retreats. After that, even if the push-up rod 26 continues to advance upward, the advance operation is not directly transmitted to the variable rod 35. When the push-up rod 26 advances in the set release state, the variable spring 35 is pushed upward by compressing the holding spring 32, and the pushing force is increased by the holding spring 32 in the compressed state. And the force is set to a value smaller than the impact load that causes the slide push unit 34 to release the set state.

Further, the slide push unit 34 completes the advance operation by the cam mechanism, and
When the push-up rod 26 moves backward, the same movement is made, and the rod 26 is pulled down to a predetermined position, thereby performing a reset operation and returning from the set release state to the set state. When the retraction operation of the push-up rod 26 is performed, the cylindrical portion 29 is simultaneously held by the holding spring 32.
The variable rod 35 held inside also performs the retreat operation,
The needle pin 36 is also pulled down.

And, with the above-mentioned structure,
The semiconductor chip 39 is mounted on the dicing sheet 3 as follows.
8 and picked up by the suction collet 40 and transferred to, for example, a lead frame (not shown). That is, first, the semiconductor chip 39 to be picked up is placed just above the upper end surface of the backup holder 22 from which the tip of the needle pin 36 projects.
The operation of the pressure reducing device (not shown) connected to the suction port 25 while the wafer 37 on which the dicing sheet 38 is stuck is held so that is positioned, and the upper end surface of the backup holder 22 is in contact with the back surface of the dicing sheet 38 As a result, the dicing sheet 38 on the back surface side of the semiconductor chip 39 to be picked up is suction-held by the suction action of the suction hole 23 via the suction passage 24.

Next, the push-up rod 26 is caused to advance upward by the operation of the cam mechanism, and the variable rod 35 connected to the set slide push unit 34 is set.
To rise. Then, the tip of the needle pin 36 fixed to the variable rod 35 is pushed up from the back surface side of the dicing sheet 38 held by the suction hole 23 by suction, and the semiconductor chip 39 is pushed up while breaking through the dicing sheet 38. At the same time, the semiconductor chip 39 pushed up by the tip of the needle pin 36 is sucked and held at the lower end of the suction collet 40 which has moved just above the position where the needle pin 36 protrudes and has been lowered to the predetermined position.

The suction collet 40 is connected to the needle pin 36.
Moment when the semiconductor chip 39 held by suction is lifted up,
An impact load of a predetermined value or more is applied to the suction collet 40, and the impact load is detected by an impact load detection unit 41 provided on the suction collet 40. Then, in response to a release signal from the impact load detecting unit 41, the slide push unit 34 is released from the set state, the needle pin 36 fixed to the variable rod 35 is pulled down by the holding spring 32, and from the position where the semiconductor chip 39 is pushed up. fall back.

Thereafter, the suction collet 40 is moved upward, the semiconductor chip 39 held by suction is peeled off from the dicing sheet 38, and is transferred to, for example, a predetermined position of a lead frame. Further, when the push-up rod 26 moves forward by a predetermined stroke by the cam mechanism and shifts to the retreating operation under the assisting operation by the pull-down spring 30, the needle pin 36 moves downward from the maximum protrusion position accordingly, The tip retreats below the upper end surface of the backup holder 22, and the suction collet 40 of one semiconductor chip 39.
The pick-up process by is completed. Then, by repeating the above process, the semiconductor chips 39 are transferred from the wafer 37 to, for example, a lead frame.

As described above, in the above process, the rear end of the dicing sheet 38 is pushed up by the tip of the needle pin 36 to pierce the dicing sheet 38, and the tip of the needle pin 36 is sucked and held by the suction collet 40. If the impact load generated at the moment when it hits the semiconductor chip 39 is a large value equal to or more than a predetermined value, the impact load is applied to the suction collet 40, and the impact load detected by the impact load detection unit 41 is equal to or greater than the predetermined value. It is detected that there is. Then, based on the detected load being equal to or greater than the predetermined value, a release signal is output from the impact load detecting unit 41 to the slide push unit 34 of the retraction mechanism 31. Similarly, at the moment when the suction collet 40 is lowered, the semiconductor chip 39 is sucked and held, and the dicing sheet 38 sinks and comes into contact with the needle pins 36, etc., even when an impact load exceeding a predetermined value occurs, the slide push unit 34 , A release signal is output.

Then, in the slide push unit 34 to which the release signal is inputted, the set state is changed from the set state to the set release state, and the connection with the variable rod 35 is released. As a result, even if the push-up rod 26 continues the upward operation by the cam mechanism, the advance operation is not directly transmitted to the variable rod 35 and the variable rod 3
5 is fixed to the holding spring 3.
2 is compressed by the biasing force obtained by compressing the semiconductor chip 39.
And the load by which the needle pin 36 pushes up the semiconductor chip 39 is reduced.

Thereafter, the push-up rod 2 by the cam mechanism is used.
6, the push-up rod 26 retreats by the pull-down spring 30, and the variable rod 35 held in the tubular portion 29 by the holding spring 32 also retreats, and the slide push unit 3
4. The needle pin 36 is similarly pulled down. Then, when the slide push unit 34 is lowered to a predetermined position, the slide push unit 34 is reset, and returns from the set release state to the set state.

With the above configuration, when the needle pin 36 comes into contact with or hits the semiconductor chip 39 held by the suction collet 40, a large impact load may be applied. Pushing up or the like by the needle pin 36 is instantaneously released. For this reason,
The impact load applied to the semiconductor chip 39 is reduced, and the possibility that the semiconductor chip 39 is cracked or chipped is significantly reduced.

Further, a timing shift occurs between the suction holding of the semiconductor chip 39 by the suction collet 40 and the pick-up operation of pushing up the needle pin 36, and a large impact load is applied to the semiconductor chip 39, which may cause cracks or chipping. Therefore, it is easy to adjust the timing of the pickup operation, and the adjustment does not require much time. Furthermore, even if the vertical movement of the mount head holding the suction collet 40 has an overshoot and the needle pin 36 hits the semiconductor chip 39, a large impact load may be applied to the semiconductor chip 39. And the occurrence of cracks, chips and the like is significantly reduced.

The retraction mechanism 31 uses the holding spring 32 in the above embodiment, but is not limited to this, and may be an electromagnetic mechanism using a solenoid coil, in which the excitation voltage of the solenoid coil is reduced. The retreat speed of the needle pin 36 can be changed by appropriately adjusting the value to an appropriate value. With such a configuration, the transfer cycle of the semiconductor chip 39 can be further increased.

[0029]

As is apparent from the above description, according to the present invention, a large impact load is not applied to the semiconductor chip picked up by the suction collet when pushed up by the needle pin, and the possibility of cracking or chipping is reduced. In addition, there is an effect that the adjustment time for adjusting the timing of the pick-up operation when picking up by the suction collet is short.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view showing a main part of one embodiment of the present invention.

FIG. 2 is a partially enlarged longitudinal sectional view of one embodiment of the present invention.

FIG. 3 is a longitudinal sectional view showing a main part of a conventional technique.

[Explanation of symbols]

 26 ... Push-up rod 31 ... Retraction mechanism 32 ... Holding spring 34 ... Slide push unit 35 ... Variable rod 36 ... Needle pin 37 ... Wafer 38 ... Dicing sheet 39 ... Semiconductor chip 40 ... Suction collet 41 ... Impact load detector

Claims (2)

[Claims] 1. A wafer having a dicing sheet attached to a back surface and divided into a plurality of wafers, a divided semiconductor chip is pushed up from the dicing sheet side by a needle pin provided on a pushing rod and taken up by a collet. The semiconductor manufacturing apparatus according to the present invention, wherein the needle pin is attached to the push-up rod via a retreat mechanism that performs a retreat operation when a push-up impact load exceeds a predetermined value. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the retreat mechanism comprises a holding spring and a slide push unit.