JP2000248151A - Semiconductor-sealing resin composition and resin-sealed type semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor-sealing resin composition which can improve curing properties without deteriorating various characteristics, such as mechanical characteristic, low water absorption and the like being characteristics of a thermocurable resin bearing a dihydrobenzoxazine ring, can clear a problem involved in a conventional epoxy resin sealing material such that the amount of a flame- retardant should be reduced from the view point of environmental protection and has excellent storage stability, and also to provide a semiconductor device sealed with the composition. SOLUTION: A semiconductor device is prepared by sealing a semiconductor element with a semiconductor-sealing resin composition comprising 100 pts.wt. of a thermocurable resin composition, as an essential component, which comprises a thermocurable resin bearing a dihydrobenzoxazine ring synthesized from a phenol, formaldehyde and an aromatic diamine, an epoxy resin and a phenol resin and has a melt viscosity of a mixture of these three components at 150 deg.C of not higher than 2P, 0.01-35 pts.wt. of an additive comprising at least one selected among curing accelerators, releasing agents, adhesion-imparting agents, colorants and flame-retardants and 200-1,200 pts.wt. of an inorganic filler.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for semiconductor encapsulation and a resin-encapsulated semiconductor device, and more particularly to a conventional epoxy resin encapsulant which is used for flame retardancy, electrical characteristics, and reflow resistance. The present invention relates to a resin composition for semiconductor encapsulation of a dihydrobenzoxazine-based resin which comprehensively excels in storage stability and the like, and a resin-encapsulated semiconductor device.

[0002]

2. Description of the Related Art Conventionally, epoxy resins have been widely used in resin-encapsulated semiconductor devices because of their well-balanced mechanical properties, heat resistance, and moldability with high productivity. But,
As semiconductor devices have become thinner and denser, and surface mounting methods have become more widespread, the characteristics required for semiconductor devices have become more stringent, and accordingly, the above-mentioned characteristics and more functions have been required for epoxy resins. Was. Modification methods of epoxy resins that have been taken to meet such requirements include, specifically, lowering the modulus of elasticity by denaturation and alloying with a flexibilizing agent, increasing the density of functional groups, and the like. However, reforming by these methods is approaching its limit. Further, in recent years, from the viewpoint of environmental protection, reductions in the addition amounts of halides and antimony, which have been indispensable for maintaining flame retardancy, have been promoted. From this point of view, new resin compositions have been developed. It has been demanded.

Some attempts have been made to achieve the above-mentioned requirements. For example, in JP-A-2-3445, a composition using a polyimide resin is exemplified as a resin composition for semiconductor encapsulation. However, polyimide resins have disadvantages in that, in addition to insufficient flexibility and adhesiveness, they are extremely expensive and have poor moldability. Therefore,
Dihydrobenzoxazine compounds have been proposed as new resin systems (see JP-A-49-47387 and US Pat. No. 5,152,939). Since the curing reaction of this compound utilizes a ring-opening polymerization reaction of a dihydrobenzoxazine ring similar to that of an epoxy resin, it has a feature that almost no volatile components are generated. On the other hand, a cured product of a dihydrobenzoxazine compound utilizing a ring-opening polymerization reaction has good heat resistance, high strength and excellent flexibility as compared with conventionally known thermosetting resins. However, conventionally known dihydrobenzoxazine compounds require a long time for curing, have a low cross-linking density of the cured product, have low hardness of a molded product immediately after molding, and are difficult to remove from the mold, so that it is difficult to use as a semiconductor sealing application. Was something.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is an object of the present invention to reduce various characteristics such as a mechanical characteristic and a low water absorption characteristic of a thermosetting resin having a dihydrobenzoxazine ring. Provided is a resin composition for semiconductor encapsulation, which has improved curability, is excellent in reducing flame retardants and is excellent in storage safety, which are problems of general epoxy resin encapsulants, and a semiconductor device encapsulated with the composition. The purpose is to do.

[0005]

Means for Solving the Problems The present inventors have conducted intensive studies to achieve the above object, and as a result, have found that a thermosetting resin having a dihydrobenzoxazine ring derived from an aromatic diamine in one molecule By mixing an epoxy resin and a phenolic resin having two or more epoxy groups with a specific amount of an inorganic filler, a combination of a thermosetting resin having a dihydrobenzoxazine ring with a phenolic resin or an epoxy resin could not be achieved. It has been found that the curability, that is, the curing speed, and the hardness of a molded product immediately after molding can be remarkably improved, and that the semiconductor device sealed with the insert has excellent adhesive strength to the insert and has excellent reflow resistance. That is, the present invention relates to phenols,
Formaldehydes, and a thermosetting resin having a dihydrobenzoxazine ring synthesized from an aromatic diamine,
A thermosetting resin composition comprising an epoxy resin and a phenolic resin and having a melt viscosity of 2 P or less at 150 ° C. of a mixture of these three components is contained as an essential component, based on 100 parts by weight of the thermosetting resin composition. A semiconductor encapsulant comprising 0.01 to 35 parts by weight of an additive comprising at least one selected from the group consisting of a curing accelerator, a release agent, an adhesion-imparting agent, a colorant and a flame retardant, and 200 to 1200 parts by weight of an inorganic filler. The present invention relates to a resin composition for stopping and a semiconductor device sealed with the composition.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The thermosetting resin having a dihydrobenzoxazine ring used in the present invention is synthesized from a compound having a phenolic hydroxyl group, formaldehyde and aromatic diamines. Examples of the compound having a phenolic hydroxyl group include monovalent phenols such as phenol, o, m, p-cresol, xylenol, nonylphenol, pt-butylphenol, octylphenol, and one or more of these compounds are used in combination. It can also be used. As a formaldehyde source, a product containing 80% or more of formaldehyde, particularly paraform having a concentration of 92% or more is preferable. As aromatic diamines, m-phenylenediamine, p-phenylenediamine, 4,4′-diaminodiphenylmethane,
4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylsulfone, 2,2-bis [(4-aminophenoxy) phenyl] propane, and the like. These diamines can be used alone or in combination of two or more. In particular, it is preferable to use 4,4′-diaminodiphenylmethane in terms of workability and characteristics.

The solvents used for the reaction include methanol,
Ethanol, propanol, butanol and the like can be mentioned. Particularly, methanol is preferable from the viewpoint of price and affinity with paraform. In the synthesis of the thermosetting resin having a dihydrobenzoxazine ring, phenols and paraform are suspended in a solvent, and then heated to 50 to 70 ° C., and aromatic diamines are added over 15 to 30 minutes. Is preferred. 5
If the temperature is lower than 0 ° C., the reaction proceeds without dissolving the aromatic diamines and paraform, and unreacted paraforms and aromatic diamines remain in the reaction system, which is not preferable as a resin.
If the temperature exceeds 70 ° C., the reaction partially proceeds, and a homogeneous resin cannot be obtained. After the addition of the aromatic diamines, the reaction temperature is raised to the reflux temperature (about 80 ° C.), and the mixture is allowed to react for 2 hours after emulsification. After completion of the reaction, the solvent and water are removed under reduced pressure to obtain a thermosetting resin having a dihydrobenzoxazine ring. In the above reaction, the amount of the solvent used is 0.1% of the amount of paraform.
5 times to 2 times, particularly preferably 1.0 times to 1.5 times. 0.
If the ratio is less than 5 times, the undissolved portion of paraform is large and does not react uniformly, so that unreacted raw materials remain in the resin, and a resin having excellent properties cannot be obtained. On the other hand, if it is more than twice, it is not preferable because it takes too much time to remove water produced as a by-product in the reaction. The above-mentioned thermosetting resin having a dihydrobenzoxazine ring can be cured by heating to 150 ° C. or higher, preferably 170 to 220 ° C., without using a catalyst or a curing agent, without generating by-products.

The thermosetting resin having a dihydrobenzoxazine ring used in the present invention has a melt viscosity at 150 ° C. of 3 P or less, preferably 2 P or less, and two or more kinds can be used in combination. As the epoxy resin used in the present invention, an epoxy resin having a melt viscosity at 150 ° C. of 6P or less, preferably 3P or less is used. Particularly preferably, an epoxy resin having two epoxy groups in one molecule is used, and examples thereof include a biphenyl epoxy resin and a bisphenol A epoxy resin. If necessary, a halogenated epoxy is used. From the viewpoint of flame retardancy, a brominated epoxy resin having a bromine content of 30 to 50% by weight is used, and a brominated novolak epoxy resin and a tetrabromobisphenol A epoxy resin are particularly preferably used. The mixing ratio of the epoxy resin is 3 to 67% by weight, more preferably 5 to 58% by weight of the whole resin. If it is less than 3% by weight, the crosslink density is low, and a molded product immediately after molding cannot have sufficient hardness, and if it is 67% by weight or more, the water absorption increases. The proportion of the halogenated epoxy resin is suitably 15 parts by weight or less with respect to 100 parts by weight of the resin component. Not only the amount of halogen is smaller than that of a general epoxy resin sealing material, but also antimony trioxide is used. Good flame retardancy can be obtained without using.
In the present invention, the phenolic resin blended with the thermosetting resin has a melt viscosity at 150 ° C. of 3P or less,
Particularly preferably, a novolak type phenol resin or a xylylene type phenol resin having 2P or less is used. Examples of the novolak type phenol resin include a phenol novolak resin, a bisphenol novolak resin, a phenol-modified xylene resin, and an alkylphenol resin.
These may be used in combination of two or more.

A thermosetting resin having a dihydrobenzoxazine ring is self-curing, but has a slow curing reaction. Therefore, the phenolic resin is used in an amount of 10 to 31
By blending by weight, preferably 13 to 25% by weight, curability can be improved without lowering mechanical properties. If the phenolic resin content is less than 10% by weight, sufficient curability cannot be obtained. If the phenolic resin content exceeds 31% by weight, the curability is improved, but the water absorption increases, and the mechanical properties may decrease. In the present invention, the thermosetting resin having a dihydrobenzoxazine ring, an epoxy resin, and a phenol resin are each mixed in a predetermined amount, and the thermosetting resin is melted at 150 ° C. Viscosity 2
It is important that the content be P or less in order to obtain good curability and moldability. If the melt viscosity exceeds 2P, it becomes difficult to fill with the inorganic filler, resulting in poor molding. Examples of the inorganic filler used in the present invention include fusible silicon dioxide powder, zinc borate, and aluminum hydroxide. These are used as one kind or a mixture of two or more kinds. As the fusible silicon dioxide powder, either spherical or crushed silicon dioxide powder can be used, or both can be used in combination. Its particle size is 0.
A thickness of 5 to 30 μm is appropriate. If the thickness is out of this range, a reduction in strength or poor molding occurs. In addition, an inorganic filler that has been surface-treated with a predetermined coupling agent in advance can also be used. The compounding amount of the inorganic filler is the thermosetting resin 1
200 to 1200 parts by weight, more preferably 300 to 800 parts by weight, per 100 parts by weight is suitable. If the amount is less than 200 parts by weight, the strength and the effect of reducing the coefficient of thermal expansion decrease, and if it exceeds 1200 parts by weight, molding becomes difficult.

[0010] The resin composition for semiconductor encapsulation of the present invention may optionally contain a curing accelerator, a release agent, an adhesion-imparting agent, a coloring agent,
Additives such as flame retardants can be blended. Examples of the curing accelerator include polyfunctional phenol compounds such as catechol and bisphenol A; sulfonic acids such as p-toluenesulfonic acid and p-phenolsulfonic acid; carboxylic acids such as benzoic acid, salicylic acid, oxalic acid and adipic acid; II) metal complexes such as acetyl acetate, aluminum (III) acetyl acetate, zirconium (IV) acetyl acetonate, metal oxides such as calcium oxide, cobalt oxide, magnesium oxide and iron oxide, calcium hydroxide, particularly preferably imidazole and Derivatives, tertiary amines such as diazabicycloundecene, diazabicyclononene and salts thereof, triphenylphosphine, triphenylphosphine / benzoquinone derivatives, triphenylphosphine / triphenylboron salts, tetraphenylphosphonate And phosphorus-based compounds such as um-tetraphenylborate and derivatives thereof. These are used alone or as a mixture of two or more. The compounding amount of the curing accelerator is 5 parts by weight or less, more preferably 3 parts by weight or less with respect to 100 parts by weight of the thermosetting resin composition. When the amount exceeds 5 parts by weight, the increase in water absorption and the storage stability are reduced. Getting worse.

As the releasing agent, polyester wax, montanic acid ester wax, carnauba wax and the like can be used, and as the coloring agent, carbon black and the like can be used. Examples of the adhesion-imparting agent include silane coupling agents such as aminosilane, diaminosilane, triaminosilane, ureido-modified aminosilane, vinylsilane, vinylbenzylaminosilane, benzylaminosilane, cationic silane, epoxy silane, and anilinosilane. These are used alone or as a mixture of two or more. In addition, a commonly used antimony compound can be blended as a flame retardant, if necessary.

In the present invention, an elastomer can be blended if necessary. By blending the elastomer, the adhesive force between the resin and the metal is further improved. The elastomer to be used is not particularly limited, but is formed by opening an elastomer in which a part of the main chain structural units are crosslinked by structural units, a thermosetting resin having a dihydrobenzoxazine ring, and a dihydrobenzoxazine ring. A liquid elastomer having a functional group capable of reacting with a phenolic hydroxyl group is preferably used. In the case of an elastomer in which a part of the main chain structural units are cross-linked with each other,
Particularly preferably, a silicone gel synthesized from an acrylonitrile-butadiene copolymer elastomer or a monomer having a siloxane bond as a starting material (for example, a mixture of an epoxy- and amino-modified silicone disclosed in JP-A-63-241020, and a phenol novolak) Is gelled after dispersion as a dispersion medium and a catalyst). Further, a thermosetting resin having a dihydrobenzoxazine ring in the elastomer and a phenolic hydroxyl group generated by opening of the dihydrobenzoxazine ring can react with, for example, a functional group such as an epoxy group, a hydroxyl group or a carboxyl group. Those having a functional group having a high solubility parameter are particularly preferable. The particle size of these elastomers is preferably 0.2 mm or less.

These crosslinked elastomers are:
When mixed with a thermosetting resin having a dihydrobenzoxazine ring and cured, as long as the particles do not agglomerate, a sea-island type dispersion structure that maintains the selected particle size can be easily obtained, and the toughness of the cured product is improved. improves. In contrast, in a method of depositing and dispersing an elastomer in a thermosetting resin composition such as spinodal decomposition when an elastomer having no crosslinked structure is used, it is difficult to control the particle size of the elastomer, and a uniform sea-island structure cannot be obtained. Sometimes. Examples of the functional group of the liquid elastomer having a functional group capable of reacting with a thermosetting resin having a dihydrobenzoxazine ring and a phenolic hydroxyl group generated by opening the dihydrobenzoxazine ring include an amino group, an epoxy group, a carboxyl group, Phenolic hydroxyl groups are mentioned. The proportion of the elastomer is preferably 1 to 50 parts by weight, more preferably 2 to 40 parts by weight, based on 100 parts by weight of the thermosetting resin composition. If the amount is less than 1 part by weight, it is difficult to improve the toughness, and if it exceeds 50 parts by weight, the mechanical properties may be deteriorated.

The present invention also provides a resin-sealed semiconductor device in which a semiconductor element is sealed with the above resin composition. The method for manufacturing the resin-encapsulated semiconductor device described above includes:
Although it is not particularly limited, it is 60 to 12 by a heating roll or the like.
The resin composition was adjusted by kneading at 0 ° C., and then the semiconductor element was placed in a mold.
0-220 ° C, molding pressure 20-120kgf / cm ² at 1
By curing by compression molding or transfer molding for 10 minutes to 10 minutes, and further by post-curing at 160 to 220 ° C. for 1 to 6 hours, a resin-sealed semiconductor device having better characteristics can be obtained.

[0015]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples of the present invention and comparative examples thereof, but the present invention is not limited to these examples. Examples 1 to 11, Comparative Examples 1 to 7 [1] Synthesis of thermosetting resin having dihydrobenzoxazine ring (I) Phenol 0.94 kg (corresponding to 10 mol), methanol 900 ml, 95% paraform 0.63 kg (20 m
ol) and heat to reflux to suspend paraform in phenol. When the suspension is heated to 50 ° C,
0.99 kg of 4,4'-diaminodiphenylmethane (5
(equivalent to 1 mol) are added in portions. After the addition is completed, the reaction temperature is raised and refluxed. The reaction solution is emulsified. After emulsification, the reaction is continued for 2 hours. After completion of the reaction, the solvent and by-produced water were distilled off under reduced pressure to obtain a thermosetting resin having a dihydrobenzoxazine ring (melt viscosity: 1.2 P /
150 ° C). [2] Synthesis of thermosetting resin having dihydrobenzoxazine ring (II) 1.0 kg (equivalent to 5 mol) of bisphenol F and 0.93 kg (equivalent to 10 mol) of aniline are mixed in 0.5 kg of methyl ethyl ketone, and the mixture is heated at 80 ° C. for 5 hours. The mixture was stirred to prepare a uniform mixed solution. 1.62 kg of formalin was charged into a 5 liter flask, heated to 90 ° C., and a mixed solution of bisphenol F / aniline / methyl ethyl ketone was gradually added thereto over 30 minutes. 30 after completion of addition
For 2 minutes at reflux temperature, then at 100 ° C. for 2 hours 66
The pressure was reduced to 66.1 Pa or less to remove the condensed water, thereby obtaining a thermosetting resin in which 75% of the reactive hydroxyl groups were converted to dihydrobenzoxazine (melt viscosity: 0.8 P / 1).
50 ° C).

[3] Synthesis of novolak-type phenol resin (A) 2.4 kg of phenol, formalin (37% aqueous solution)
0.13 kg, 0.5 kg of paraform and 3 g of oxalic acid were charged into a 5-liter flask and reacted at a reflux temperature for 4 hours. Subsequently, the internal pressure was reduced to 6666.1 Pa or less to remove unreacted phenol and water. (Melt viscosity:
2P / 150 ° C). [4] Synthesis of novolak type phenol resin (B) Phenol 2.8 kg, formalin (37% aqueous solution)
0.25 kg, paraform 0.8 kg, 8% hydrochloric acid 11
g and 8 g of oxalic acid were charged into a 5-liter flask and reacted at reflux temperature for 6 hours. Then, the inside is set to 6666.
The pressure was reduced to 1 Pa or less to remove unreacted phenol and water. (Melt viscosity: 10P / 150 ° C). [5] Epoxy resin Biphenyl type epoxy resin (YX-4000H manufactured by Yuka Shell Epoxy Co., Ltd. Epoxy equivalent: 192 g
/ Eq Melt viscosity: 0.1P) Brominated novolak type epoxy resin (trade name: ESB-400T, manufactured by Sumitomo Chemical Co., Ltd. Epoxy equivalent: 400 g / e)
q Melt viscosity: 1.4P Bromine content: 50%)

[6] Other Compounds A triphenylphosphine / benzoquinone derivative (manufactured by Hokuko Chemical Co., Ltd.) was used as a curing accelerator. As the elastomer, a crosslinked acrylonitrile-butadiene copolymer having a particle diameter of 70 nm (trade name XE manufactured by Nippon Synthetic Rubber Co., Ltd.)
R-91, liquid acrylonitrile-polybutadiene copolymer (ATBN1300X manufactured by Ube Industries, Ltd.)
16, AN amount 1.65% by weight, amino group content, amine equivalent 900). As a silicone gel, amino silicone (trade name KF- manufactured by Shin-Etsu Chemical Co., Ltd.)
86 amine equivalent 2000) 25g and epoxy silicone (trade name X-22-163B manufactured by Shin-Etsu Chemical Co., Ltd.)
45 g of an epoxy equivalent (1800) were mixed at a temperature of 120.
The mixture was added to 210 g of the novolak-type phenol resin (A) melted at a temperature of 100 ° C., and the mixture was stirred until the mixture became uniformly turbid. . As a silane coupling agent, a mixture of γ-glyoxypropyltrimethoxysilane and methyltrimethoxysilane was used. As the filler, spherical fused silica having an average particle size of 25 μm (trade name: S-COX-3 manufactured by Micron Corporation)
1), spherical fused silica having an average particle size of 10 μm (Tatsumori Co., Ltd.)
FB-301 (trade name, manufactured by Sharp Corporation) and spherical fused silica having an average particle diameter of 0.7 μm (trade name: SO-2, manufactured by Admatex Co., Ltd.)
5R) at a ratio of 7: 2: 1.

[Curing] The raw materials were mixed according to the composition shown in Tables 1 and 2, and the mixture was heated at 90 ° C. using a biaxial heating roll.
After kneading for 5 minutes, the mixture was pulverized to prepare a powdery resin composition. The filling amount of the fusible silicon dioxide powder in the resin composition was 80% by volume. Next, the semiconductor element is placed in the mold cavity of the transfer molding machine,
Each resin composition was transferred and molded in the above mold under the conditions of gf / cm ² and 90 seconds, and a QFP 54 pin (external size 20 mm
× 14mm × 2mm, 42 alloy of lead frame material,
A semiconductor device having a semiconductor element size of 8 mm × 10 mm) was obtained. Post-curing was performed at 175 ° C. for 6 hours.

[Evaluation of Properties] In order to know the general properties of the resin composition, such as mechanical properties, heat resistance, flame retardancy and adhesiveness, a plate-shaped cured product was prepared under the same conditions as above. The properties of the cured product are JIS K69 for mechanical and electrical properties.
According to No. 11, the flame retardancy was measured according to UL-94. The melt viscosity was measured at 150 ° C. using a cone plate viscometer. For hot hardness,
The hardness of the molded product immediately after being molded at 175 ° C. for 90 seconds was measured. Regarding the storage stability, the thermosetting resin composition was left in a high-temperature bath at 40 ° C., and the change in gelation time after 30 days was examined. The flexibility of the molded article was determined by
A heat cycle test in which the temperature was maintained at 5 ° C. and 150 ° C. for 30 minutes each was performed, and the crack occurrence rate (the number of cracked test pieces per 10 test pieces) in each predetermined cycle was determined and evaluated. Further, the molded semiconductor device is heated at 85 ° C. for 8 hours.
After moisture absorption under the condition of 5% RH, heat treatment is performed at 215 ° C. for 90 seconds (reflow crack test) to determine the rate of occurrence of package cracks (the number of semiconductor devices having package cracks per 10 semiconductor devices). The humidity resistance of the semiconductor device was evaluated. Tables 1 to 4 show the composition and the measurement results in each of Examples and Comparative Examples. In addition, all the compounding compositions were shown in parts by weight.

[0020]

[Table 1]

[0021]

[Table 2]

[0022]

[Table 3]

[0023]

[Table 4]

[0024]

EFFECTS OF THE INVENTION By using the resin composition for encapsulating a semiconductor of the present invention, it has low water absorption, good mechanical properties and good adhesion, and cannot be achieved with the conventional epoxy resin-based resin composition for encapsulating a semiconductor. The reduced flame retardant and long-term storage stability were realized.

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Teruki Aizawa 1500 Oji Ogawa, Shimodate City, Ibaraki Prefecture Inside the Shimodate Plant of Hitachi Chemical Co., Ltd. Inside the Shimodate Plant (72) Inventor Nori Nanami 1500, Oji Ogawa, Shimodate City, Ibaraki Prefecture Inside the Shimodate Plant, Hitachi Chemical Co., Ltd. Term (reference) 4J002 AC075 AE034 CC043 CC053 CC063 CC123 CC27W CD05X CD12X CP035 DA037 DE076 DE086 DE096 EE046 EF066 EF096 EJ036 EJ066 EL096 EU136 EV236 EW146 EX018 EX068 EX078 EY016 FD018 EB156 EB EB EB EB EB 164 EB 156 EC01 EC03 EC09

Claims (8)

[Claims] 1. A thermosetting resin having a dihydrobenzoxazine ring synthesized from phenols, formaldehydes and aromatic diamines, an epoxy resin and a phenol resin, and a mixture of these three components at 150 ° C.
Containing a thermosetting resin composition having a melt viscosity of 2 P or less as an essential component, and comprising the thermosetting resin composition 10
0 parts by weight, a curing accelerator, a release agent, an adhesion-imparting agent,
0.01 to 35 parts by weight of an additive composed of at least one selected from a coloring agent and a flame retardant, and an inorganic filler 200
A resin composition for encapsulating a semiconductor, comprising -1200 parts by weight. 2. The resin composition for semiconductor encapsulation according to claim 1, wherein the formaldehyde is obtained using paraform having a formaldehyde content of 92% or more. 3. The resin composition for encapsulating a semiconductor according to claim 1, wherein the aromatic diamine is 4,4′-diaminodiphenylmethane. 4. The epoxy resin according to claim 1, wherein the epoxy resin has two epoxy groups in one molecule, or an epoxy resin having three or more epoxy groups in one molecule. 3. The resin composition for semiconductor encapsulation according to item 1. 5. The method according to claim 1, wherein 100 parts by weight of the thermosetting resin composition is
5. The resin composition for semiconductor encapsulation according to claim 4, comprising 15 parts by weight or less of a halogenated epoxy resin. 6. The resin composition for semiconductor encapsulation according to claim 1, further comprising 1 to 50 parts by weight of an elastomer based on 100 parts by weight of the thermosetting resin. 7. A cured resin obtained by curing the resin composition for semiconductor encapsulation according to claim 1. 8. A resin-sealed semiconductor device sealed with the resin composition for semiconductor encapsulation according to claim 1.