JP2000236151A - Combination substrate and method of bonding substrate together - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a combination substrate which is large in area out easily manufactured. SOLUTION: Substrates are combined and bonded together into a combination substrate. Substrates A to D are possessed of sides, which are so processed as to enable the substrates A to D to come into contact with each other or approach each other and be combined together. The side is possessed of one or more terminals C. The terminals C are electrically connected to the other terminals C which are provided to the other substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a combined substrate for providing a large-area substrate by combining a plurality of substrates, and a method for bonding the same.

[0002]

2. Description of the Related Art In an ordinary electronic circuit, a substrate is formed for each of a plurality of modules. At the time of manufacturing an electric product, the plurality of substrates are connected to each other by a connector or the like, and are operated as a finished product that performs a collective operation. Assembling such functionally separated substrates has a greater manufacturing advantage than producing a large substrate.

[0003]

However, recently, a demand for a large-sized display device has been increased, and it has become necessary to arrange a display element on a two-dimensional plane having a large area. However, it is not applicable to make the outer shape of the substrate larger than a certain outer shape due to manufacturing restrictions. It is uneconomical to use a connector to connect a plurality of substrates in a display device or the like that does not need to be removed again once connected, and the area of the connector is wasted. Until now, there has been no suitable method for obtaining a large area two-dimensional plane using a substrate.

[0004] Therefore, an object of the present invention is to provide a combined substrate in a form that can be easily combined and a bonding method thereof, thereby making it possible to easily manufacture a large-sized substrate.

[0005]

In order to combine and connect large-area substrates, the inventor of the present invention uses the prior art of the present inventor (see JP-A-10-125930) suitable for combination of substrates. With this in mind, the inventors have invented a form of a combined substrate and a bonding method that can use the technology.

That is, the present invention relates to a combined substrate to be joined in combination with another substrate, the end of which is formed so as to be able to be combined in contact with or close to another substrate to be joined, and The combination substrate includes one or more terminals at the end portion, and the terminals are arranged so as to be directly electrically connectable to terminals provided on the other substrate.

In the above invention, the terminals are arranged at one or more ends of the substrate.

[0008] As an example, there is a combination board in which terminals of another board to be joined and terminals of the combination board to be joined corresponding to the terminals are provided in different shapes.

As an example, a combination board in which an identifier indicating that the terminals are to be joined to the terminals of the other board to be joined and the terminals of the combination board corresponding to the terminals is attached. is there. In the present invention, "identifier" means not only the same numeral and code ("C1", "10", etc.) but also symbols such as "O" and "△", and common colors such as red and green. Including those that clearly indicate the connection relationship between which terminals are connected to which terminals.

[0010] For example, it is conceivable that the terminals are arranged so that their bonding surfaces face in the same direction and can be bonded when combined with another substrate. Further, it is also conceivable that the terminal is arranged so that the bonding surfaces thereof can be bonded to face each other when combined with another substrate. In that case,
The end provided with the terminal is configured to be overlapped with another substrate and to be joined.

The combined substrate of the present invention, before being combined, has a light-transmitting transparent base, a peeling layer formed on the transparent base, which is peeled off by the supply of energy, and a terminal having an end portion. And a wiring layer configured to be arranged in the same manner.

According to the method for bonding combined substrates of the present invention, the combined substrates to be bonded are brought into contact with or brought close to each other so that the terminals correspond to each other; Electrically connecting, a step of bonding a transfer base via an adhesive layer on a wiring layer having electrically connected terminals, and supplying energy to the release layer from the transparent base side, Peeling off the release layer and peeling off the transparent base.

However, even after supplying energy to the release layer from the transparent base side, the transfer base is adhered, and then the processing is performed in such an order that the transparent base is separated from the release layer by applying a force. Good.

[0014] Alternatively, the method of bonding a combined board according to the present invention includes the steps of combining the combined boards to be joined by contacting or approaching each other so that their terminals correspond to each other; Bonding the first transfer base through the medium, supplying energy to the release layer from the transparent base side to cause the release layer to peel, and peeling the transparent base; Bonding the second transfer base to the surface on the side from which the base was peeled off, and peeling the first transfer base on the adhesive layer on the wiring layer;
Electrically connecting terminals corresponding to each other on the exposed wiring layer.

However, after supplying energy to the peeling layer from the transparent base side, the first transfer base is bonded, and then the transparent base is peeled from the peeling layer by applying a force. The processing may be performed in such an order as to bond the two transfer bases.

Here, in the step of electrically connecting the terminals, a connecting metal can be provided between the terminals by any one of a laser CVD method, an ink jet method, electroless plating, lift-off or plating. is there. The adhesive layer is made of a resin that is cured by supplying energy.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a preferred embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1) Embodiment 1 of the present invention relates to a combined substrate which is two-dimensionally spreadable and capable of being combined, and a bonding method therefor. FIG. 1 shows a plan view when the combination substrates of the first embodiment are combined.
FIG. 1 shows a case in which a substrate D is newly combined in a state where the substrates A to C have already been combined.
Arrows in the drawing indicate connection directions when the substrates D are combined.

As shown in FIG. 1, the substrates A to D according to the first embodiment are combined substrates which are joined in combination with another substrate, and whose ends are in contact with another substrate to be joined. It is formed so that it can be combined with or close to. Each end is provided with one or more terminals Cxx (xx is a predetermined number). Each terminal Cxx is arranged so as to be directly electrically connectable to a terminal provided on another substrate. These terminals are arranged at one or more ends of the combination board. Each terminal Cxx is arranged such that when combined with another substrate, the joining surface faces in the same direction and can be joined. That is, the terminals are provided on the same surface in each substrate. Terminals forming a set to be connected to each other are denoted by the same reference numerals indicating the corresponding relationship. For example, it means that the terminal C11 of the substrate A is connected to the terminal C11 of the substrate D. In addition to the codes, numbers, symbols, colors, and the like may indicate that there is a relationship between the two terminals. It is preferable to print or imprint a code that can easily understand the connection relation in this way, in order to prevent a manufacturing error and to facilitate the combination.

In FIG. 1, for easy understanding,
Although the planar shape of the substrate is drawn in a square shape and three terminals are arranged at two ends of the substrate, the present invention is not limited to this. The substrate may have another shape. For example, the end portion may have a shape that can be fitted, such as a hook shape. The end where the terminal is provided is not limited to two sides, and may be one side or three or more sides. The number of terminals can be arranged as long as they can be physically arranged according to the number of terminals required for the circuit.

FIG. 2 is a cross-sectional view of a joint portion in the combination substrate according to the first embodiment. FIG. 2 illustrates a cross-sectional view of a joint between the substrate A and the substrate D, but the same applies to other substrates. The combination board of the first embodiment is shown in FIG.
In the state where the bonding is completed as shown in FIG.
1, an adhesive layer 105 and a transfer base 106 are provided.
The terminals C are electrically directly connected to each other by the welding metal 104. The wiring layer 101 is a layer on which an electric circuit is provided, and is formed by a known semiconductor integrated technology, a hybrid technology, or an assembly of discrete components. The wiring layer 101 has a terminal C for input or output.
Is provided at the end. The transfer base 106 is a reinforcing substrate provided commonly over a plurality of substrates. Adhesive layer 1
05 is for bonding the two.

Next, a method of bonding the combined substrates according to the first embodiment will be described with reference to FIG. As shown in FIG. 3A, each of the combined substrates before bonding has a transparent base 103, a release layer 102, and a wiring layer 101 as shown in FIG.
It has.

The transparent base may be of any type as long as it has a light-transmitting property that allows irradiation light to pass therethrough and has heat resistance in the bonding step of the combined substrate. The transmittance of the irradiation light is preferably at least 10%, more preferably at least 50%. This is because if the transmittance is too low, the attenuation of the irradiation light increases, and more energy is required to separate the release layer. For example, quartz glass, soda glass,
Heat-resistant glass such as Corning 7059 and NEC Glass OA-2 can be used. The thickness of the transparent base 103 does not have a large limiting factor, but is 0.1 mm to 0.5 mm.
It is preferably about 0.5 mm, more preferably about 0.5 mm to 1.5 mm. If the thickness of the substrate is too small, the strength is reduced. Conversely, if the substrate is too thick, the irradiation light is attenuated when the transmittance of the base is low. However, when the transmittance of the irradiation light of the base is high, the thickness can be increased beyond the upper limit. Further, in order to make the irradiation light reach the release layer evenly, it is preferable that the thickness of the base is uniform.

The peeling layer 102 causes peeling (also referred to as "intralayer peeling" or "interface peeling") in the layer or at the interface by the supply of energy such as laser light. That is, by irradiating light of a certain intensity,
The bonding force between atoms or molecules in the atoms or molecules constituting the constituent material disappears or decreases, causing ablation or the like and causing peeling. Irradiation with irradiation light releases gas from the peeling layer, which may result in separation. There are a case where the component contained in the release layer is released as a gas to be separated, and a case where the release layer absorbs light to become a gas and the vapor is released to be separated.

The following can be considered as the composition of such a release layer.

1) Amorphous silicon (a-Si) This amorphous silicon may contain H (hydrogen). The content of hydrogen is preferably about 2 at% or more, and more preferably 2 to 20 at%. This is because, when hydrogen is contained, hydrogen is released by light irradiation to generate an internal pressure in the peeling layer, which promotes peeling. The hydrogen content depends on the film formation conditions,
For example, when using the CVD method, its gas composition, gas pressure, gas atmosphere, gas flow rate, gas temperature, substrate temperature,
It is adjusted by appropriately setting conditions such as the power of the light to be input.

2) silicon oxide or silicate compound,
Examples of various oxide ceramics such as titanium oxide or titanate compound, zirconium oxide or zirconate compound, lanthanum oxide or lanthanic acid compound, or dielectric or semiconductor silicon oxide include SiO, SiO ₂ and Si ₃ O ₂ . Examples of the silicate compound include K ₂ Si ₃ and Li ₂
SiO ₃ , CaSiO ₃ , ZrSiO ₄ , and Na ₂ SO ₃ are mentioned. Examples of titanium oxide include TiO, Ti ₂ O ₃ , T
iO ₂ . As the titanate compound, for example, BaTiO ₄ , BaTiO ₃ , Ba ₂ Ti ₉ O ₂₀ , BaTi
₅ O ₁₁ , CaTiO ₃ , SrTiO ₃ , PbTi ₃ , MgT
iO ₃ , ZrTi ₂ , SnTiO ₄ , Al ₂ Ti ₅ , FeT
iO ₃ . Examples of zirconium oxide include Zr
O ₂ . Examples of the zirconate compound include BaZrO ₃ , ZrSiO ₄ , PbZrO ₃ , MgZ
rO ₃ and K ₂ ZrO ₃ .

3) Nitride ceramics such as silicon nitride, aluminum nitride, titanium nitride, etc. 4) Organic polymer materials As organic polymer materials, -CH _2- , -CO- (ketone), -CONH- (add), -NH- (imide),-
COO- (ester), -N = N- (azo), -CH =
Other compositions may be used as long as they have a bond such as N- (shif) (these interatomic bonds are broken by light irradiation), particularly as long as they have many of these bonds.
The organic polymer material may have an aromatic hydrocarbon (one or more benzene rings or a condensed ring thereof) in the structural formula. Specific examples of such organic polymer materials include polyolefins such as polyethylene and polypropylene, polyimides, polyamides, polyesters, polymethyl methacrylate (PMMA), polyphenylene sulfide (PPS), polyether sulfone (PES), and epoxy resins. Is mentioned.

5) Metal As the metal, for example, Al, Li, Ti, Mn, I
n, Sn, Y, La, Ce, Nd, Pr, Gd or Sm, or an alloy containing at least one of these.

The thickness of the release layer is 1 nm to 20 μm
It is preferably about 10 nm to 2 μm, and more preferably about 40 nm to 1 μm. This is because if the thickness of the release layer is too small, the uniformity of the formed film thickness is lost, causing unevenness in the release. If the thickness of the release layer is too large, the power of the irradiation light required for the release ( This is because it is necessary to increase the light amount, or it takes time to remove the residue of the peeling layer left after the peeling.

The method of forming the release layer may be any method that can form the release layer with a uniform thickness, and can be appropriately selected according to various conditions such as the composition and thickness of the release layer. For example, CVD (MOCCVD, low pressure CVD, ECR-CV
D), various vapor deposition methods such as vapor deposition, molecular beam deposition (MB), sputtering, ion plating, and PVD, various platings such as electroplating, immersion plating (dipping), and electroless plating. Method, Langmuir-Blodgett (LB) method, spin coating, spray coating method,
It can be applied to coating methods such as a roll coating method, various printing methods, transfer methods, ink jet methods, powder jet methods and the like. Two or more of these methods may be combined. In particular, when the composition of the release layer is amorphous silicon (a-Si), C
It is preferable to form the film by VD, particularly by low pressure CVD or plasma CVD. In the case where the release layer is formed by using a ceramic by a sol-gel method or by using an organic polymer material, it is preferable to form the film by a coating method, particularly, spin coating.

It is preferable to form an intermediate layer between the peeling layer 102 and the wiring layer 101. This intermediate layer
For example, as a protective layer that physically or chemically protects the wiring layer during manufacturing or use, an insulating layer, a barrier layer that prevents the migration of components to or from the wiring layer (every migration), or a reflective layer At least one of the functions described above. The composition of the intermediate layer can be appropriately selected according to the purpose. For example, in the case of an intermediate layer formed between a separation layer and a transfer layer made of amorphous silicon, a silicon oxide such as SiO ₂ may be used. The composition of another intermediate layer is, for example, Pt, Au, W, T
a, Mo, Al, Cr, Ti or a metal such as an alloy containing these as a main component. The thickness of the intermediate layer is appropriately determined according to the purpose of the formation. Usually 10nm
The thickness is preferably about 5 μm, more preferably about 40 nm to 1 μm. Various methods described for the release layer can be applied as the method for forming the intermediate layer. The intermediate layer may be formed as one layer, or may be formed as two or more layers using a plurality of materials having the same or different compositions.

Combining Step (FIG. 3A): This step is a step of bringing the combined substrates to be joined into contact or approaching each other so that the terminals Cxx correspond to each other. The distance at which the combined substrates are brought close to each other is set so that electrical connection between the corresponding terminals can be reliably performed in the next connection step.

Connection step (FIG. 3 (b)):
Terminals Cxx corresponding to each other on the combined substrate
This is a step of electrically connecting them. Since the corresponding terminals are in contact with or very close to each other, it is possible to apply a known metal connection method to this connection point. For example, as a connection method, any one of a laser CVD method, an ink jet method, electroless plating, lift-off, and plating can be used. FIG. 4 shows the laser CVD method.
A laser CVD apparatus as shown in Fig. 3 is brought close to the terminal C, and a metal is grown on the bonding surface of the terminal by irradiating a laser beam to the bonding point while supplying a reaction gas containing various metal elements, thereby electrically connecting the terminal. It is something to give. According to this method, there is no direct contact with the terminal, so that no displacement occurs. The ink-jet method is a method in which a solution containing a metal element is attached to a joint surface of a terminal by a piezo jet or a bubble jet, and heat treatment or the like is applied to dissolve and connect the metal. Electroless plating is a method in which metal ions in an aqueous solution of a metal salt are deposited as metal on a terminal surface by an oxidation-reduction reaction or a substitution reaction without supplying electric energy. The lift-off method is a method also called a reverse etching method, in which a resist is provided on a terminal, a metal such as aluminum is provided, lift-off is performed by ultrasonic cleaning or the like, and the terminals are connected by this metal. The plating method means a general electrodeposition process in general.

Bonding step (FIG. 3 (c)): This step is performed in the wiring layer 10 having the electrically connected terminals Cxx.
1 is a step of attaching a transfer base 106 via the adhesive layer 105 as a medium. As the adhesive layer 105, the terminal C
Is selected so as to cover the irregularities on the wiring layer 101 including the above, do not affect the circuit elements, and do not soften by heat at the time of peeling. For example, examples of the adhesive layer 105 include various curable adhesives such as a reactive curable adhesive, a thermosetting adhesive, a photocurable adhesive such as an ultraviolet curable adhesive, and an anaerobic curable adhesive. Epoxy, acrylate,
Any adhesive such as a silicone adhesive can be used. The adhesive layer 105 is formed, for example, by applying an adhesive to a thickness enough to sufficiently cover the circuit element by a coating method. When using a curable adhesive, apply the curable adhesive on the transfer-receiving layer, bond the base to it, and then cure the curable adhesive by a curing method according to the characteristics of the curable adhesive. hand,
The transfer base 106 and the wiring layer 101 are bonded. In the case of using a photo-curing adhesive, the translucent transfer base 106 is disposed on the uncured adhesive layer 105, and then the curing base is irradiated with light for curing from the transfer base 106 side to cure the adhesive. Is preferred. Note that the wiring layer 101 may be bonded after forming the bonding layer 105 on the transfer base 106 side. The above-described intermediate layer may be provided between the wiring layer 101 and the adhesive layer 105.

The transfer base 106 is a base which covers the whole of the plurality of substrates A to D and is mechanically fixed as one large substrate. If there is a certain degree of mechanical strength, heat transfer, corrosion resistance, etc. There is no problem even if the characteristics are inferior.
This is because heat is not directly applied to the transfer base side. However, when the combination substrate is configured as an element having light input and output such as a display for display, it is necessary to be formed of a material having a light transmitting property so as not to block such light. For example, as a constituent material of the transfer base, various synthetic resins or various glass materials can be mentioned, and as the glass material, an ordinary (low melting point) inexpensive glass material may be used. When a color filter and other optical elements are required when the combined substrate is used for a display for display, a color filter may be formed on the transfer base.

Peeling step (FIG. 3D):
This is a step in which energy is supplied to the release layer 102 from the transparent base 103 side to cause release in the release layer 102, and the transparent base 103 is released.

Whether the irradiation light causes in-layer peeling, interfacial peeling, or in-layer peeling occurring in the peeling layer is determined by the composition of the peeling layer, irradiation light, and other factors. The factors include, for example, the type, wavelength, intensity, and reaching depth of the irradiation light.

As the irradiation light (laser light) L, the release layer 1
02 may cause any peeling in the layer and / or the interface. For example, light of each wavelength such as X-ray, ultraviolet light, visible light, infrared light (heat ray), laser light, millimeter wave, and microwave can be applied. It may be an electron beam or radiation (α ray, β ray, γ ray) or the like. Among them, a laser beam is preferable in that ablation easily occurs in the peeling layer. Examples of a laser device that generates the laser light L include various gas lasers and solid lasers (semiconductor lasers). In particular, excimer lasers, Nd-YAG lasers, argon lasers, CO ₂ lasers, CO lasers, He-Ne Lasers and the like are preferable, and among them, an escimer laser is particularly preferable. An excimer laser outputs high energy in a short wavelength range, so that ablation can occur in the peeling layer in a very short time. Therefore, there is almost no rise in the temperature of the adjacent layer or the adjacent layer, and the delamination can be achieved while minimizing the deterioration and damage of the layer.

When the peeling layer 102 has a wavelength dependency that causes ablation, the wavelength of the laser light to be applied is
It is preferably about 100 nm to 350 nm. In order to cause the release layer to undergo a layer change such as gas release, vaporization, or sublimation, the wavelength of the irradiated laser beam is 350 n
It is preferably about m to 1200 nm. In addition, the energy density of the laser beam irradiated in the case of excimer lasers, it is preferable to be 10~5000mJ / cm ² or so, and more preferably, especially 100~5299mJ / cm ² approximately. It is preferably about 1 to 1000 nsec, and more preferably about 10 to 100 nsec. If the energy density is low or the irradiation time is short,
If sufficient ablation does not occur and the energy density is high or the irradiation time is long, the irradiation light transmitted through the release layer
The wiring layer 101 may be adversely affected. Light irradiation is preferably performed such that the intensity becomes uniform. The light irradiation direction is not limited to the direction perpendicular to the release layer, and may be a direction inclined at a predetermined angle with respect to the release layer.
When the area of the peeling layer is larger than the irradiation area of one irradiation light, the entire area of the peeling layer may be irradiated with the light in a plurality of times. The same location may be irradiated several times.
Light of different types and different wavelengths (wavelength ranges) may be irradiated to the same region or different regions a plurality of times.

After the transparent base 103 is peeled off, the release layer 10
In the case where the residue of 2 remains on the bottom surface of the wiring layer 101,
Wash with an appropriate washing solution. Further, in order to protect the wiring layer 101, it is preferable that, after the transparent base 103 is peeled off, another substrate is attached or a protective layer is formed with a resin or the like.

The first embodiment has the following advantages.

1) According to the present embodiment, since a large area can be obtained by combining the combined substrates, a large area substrate, such as a large display substrate, which cannot be manufactured conventionally, can be easily manufactured. It is possible to manufacture.

2) According to the present embodiment, the combined boards can be spread two-dimensionally so as to be joined, so that the work can be performed from one side until the terminals are joined, so that the work is easy.

3) According to the present embodiment, since the combined substrate is bonded and then bonded to the transfer base, it is possible to provide a completed substrate having high mechanical strength as a whole.

4) According to the present embodiment, since the bonding portion of the terminal is protected by the transfer base and the adhesive layer, it is possible to protect the electrical contact surface.

5) According to this embodiment, the transparent base is economical because it can be recovered after peeling and reused.

6) According to the present embodiment, by adopting a non-contact connection method such as a laser CVD method for connecting terminals,
The holding of the substrate may be simple, and the displacement is unlikely to occur. Therefore, connection of fine terminals can be performed with high accuracy.

7) According to the present embodiment, since energy is instantaneously applied to the peeling layer by the laser to cause peeling,
Less risk of damaging the wiring layer.

8) According to the present embodiment, since the base is provided on the front side of the wiring layer, this base can be used as a functional substrate such as a color filter or a black matrix.

(Embodiment 2) Embodiment 2 of the present invention relates to a method of bonding a combined substrate which is different from Embodiment 1 described above. Each combination board used in the second embodiment has the same planar outer shape and layer structure as the boards A to D used in the first embodiment (see FIGS. 3A and 6A).
Therefore, the description is omitted. However, since the transparent base 103 is peeled off and collected in a reusable manner, it is possible to avoid an increase in cost even if an expensive one is used.

FIG. 5 shows a cross-sectional view of the joint after the combination joining. As shown in FIG. 5, after bonding, the combined substrate is placed on the second transfer base 112 with an adhesive layer 113.
And the wiring layer 101 is bonded. Terminal C
Are exposed and welded 104 is applied. Embodiment 1
In this embodiment, the base is bonded on the wiring layer 101, whereas the present embodiment is different in that the base is bonded below the wiring layer 101.

Referring to FIG. 6, a method of bonding the combined substrates according to the second embodiment will be described.

Combining Step (FIG. 6 (a)): This step is a step of combining the combined substrates A to D to be joined together by bringing the terminals C into contact with or approaching each other. The distance at which the combined substrates are brought close to each other is set so that electrical connection between the corresponding terminals can be reliably performed in a later connection step.

The first transfer base bonding step (FIG. 6)
(B)): This step is a step of bonding the first transfer base 111 on the wiring layer 101 having the terminal C via the adhesive layer 105. The adhesive layer 105 is the same as in the first embodiment. However, since this adhesive layer is to be peeled again, a material that can be easily peeled by chemical or physical action is used. A material used for the release layer 102 may be used. The first transfer base 111 can be considered similarly to the transfer base 106 of the first embodiment. However, since the first transfer base 111 is peeled off later, light transmittance is not required. Also, since it is reused, there is no problem even if it is expensive.

Peeling Step (FIG. 6C):
In this step, energy is supplied to the release layer 102 from the transparent base 103 side to cause separation of the release layer, and the transparent base 103 is separated. This step may be performed in the same manner as in the first embodiment, and a description thereof will be omitted. However, since the second transfer layer 112 needs to be bonded after the transparent base 103 is peeled off, it is preferable to sufficiently remove the residue of the peeling layer.

The second transfer base bonding step (FIG. 6)
(D)): In this step, the transparent base 10 of the wiring layer 101 is
This is a step of attaching the second transfer base 112 to the surface on the side from which 3 has been peeled off. The second transfer base 112 can be considered in the same manner as the transparent base 103, but must be provided with sufficient mechanical strength because it can be bonded to all the combined substrates in common. Further, since the second transfer base 112 is arranged on the back side of the wiring layer 101 and there is no light input / output, it is not necessary to provide light transmittance like the transfer base 106 of the first embodiment.

The second transfer base 112 is bonded to the wiring layer 101 via the adhesive layer 113. Adhesive layer 113
Has only a function as an adhesive, so that it is sufficient if the adhesive can maintain the adhesive force semipermanently. The material of the adhesive layer 105 can be used for the adhesive layer 113.

Connection step (FIG. 6 (f)):
In the adhesive layer 105 on the wiring layer 101, the first transfer base 1
In this step, the terminals 11 corresponding to each other on the exposed wiring layer 101 are electrically connected to each other. For example, when a water-soluble adhesive is used for the adhesive layer 105, the first transfer base 111 can be separated by leaving the base in water for a while. The adhesive remaining on the surface of the wiring layer 101 after peeling is washed away using a chemical. In particular, since the terminal C needs to be wired, it needs to be sufficiently cleaned. Since the exposed terminals C are in contact with or extremely close to each other, a known metal connection method can be applied to this connection point. For example, as a connection method, the first embodiment
Any one of the laser CVD method, the ink jet method, the electroless plating, the lift-off method, and the plating method described above can be used.

The joining of the combined substrates is completed as described above. If the surface of the wiring layer 101 needs to be protected, a protective layer is further provided on the wiring layer after the terminals are connected by a known method using a resin or the like. You may.

According to the second embodiment, in addition to the same effects as those of the first embodiment, since the surface of the wiring layer 101 is exposed after the combination, it is convenient when wiring or other processing needs to be performed last. .

(Embodiment 3) Embodiment 3 relates to a bonding method different from the above-described bonding method in which a part of a combination substrate is overlapped. FIG. 7 is a plan view when the combination substrates of the third embodiment are combined. In FIG. 7, the substrates A2 to C
2 shows a case where the substrate D2 is newly combined in a state where the two are combined. The arrow in the figure indicates the substrate D
2 shows the connection direction in the case of combining the two. FIG. 8A is a cross-sectional view of the combined substrate bonding portion, and FIG.
In (b), the overlap of the terminals is shown by a broken line in the plan view.

As shown in FIG. 7, the substrates A2 to D2 of the third embodiment are combined substrates which are combined with another substrate, and the ends of which are in contact with other substrates to be joined. It is formed so that it can be combined with or close to. As shown in FIG. 8, the end of the combination substrate is configured to be overlapped with and joined to another substrate. The width of the overlap is set so as to sufficiently cover the terminals. The terminals C of each combination board are arranged such that when combined with another board, their joining surfaces face each other and can be joined. Further, the terminals of another substrate to be joined and the terminals of the combination substrate joined corresponding to the terminals are provided in different shapes. Specifically, as illustrated in FIG. 8B, the bonding surface of the terminal C2A on the other substrate A2 is formed to be slightly larger than the terminal C2D on the one substrate D2. If the form of the corresponding terminal is made different in this way, it is easy to visually grasp the degree of overlap when both are overlapped, which is convenient in manufacturing.

As shown in FIG. 8, the method of bonding substrates according to the present embodiment is to overlap the substrates at the ends so that the terminals of adjacent substrates face each other, and to overlap the terminals by a known bonding method. Weld each other. Since the substrates overlap each other, it is appropriate to use an anisotropic conductive adhesive for bonding.

(Embodiment 4) Embodiment 4 relates to a bonding method different from the above, in which a part of a combination substrate is overlapped. FIG. 9 is a plan view showing a combination of the combination substrates according to the fourth embodiment. In FIG. 9, the substrates A3 to C
3 shows a case where the substrate D3 is newly combined in a state where the substrates 3 are combined. The arrow in the figure indicates the substrate D
3 shows the connection direction in the case of combining the three. FIG. 10A is a cross-sectional view of the combined substrate bonding portion, and FIG.
In FIG. 0 (b), the overlap of the terminals is indicated by a broken line in the plan view.

As shown in FIG. 9, the substrates A3 to D3 of the fourth embodiment are combined substrates which are combined with another substrate and whose ends are in contact with other substrates to be joined. It is formed so that it can be combined with or close to. The ends of the combination substrates are spread and combined in a two-dimensional plane, as in the first and second embodiments. In particular, in the present embodiment, the terminal is configured to be exposed at the end face of the substrate. The terminals C of each combination board are arranged such that the joining surfaces of the terminals are opposed to each other and can be joined when the terminals C are combined with other boards with their end faces in contact with or close to each other. here,
As in the third embodiment, in a corresponding set of terminals, the terminals of another substrate to be bonded and the terminals of the combination substrate to be bonded corresponding to the terminals may be provided in different shapes. Specifically, as illustrated in FIG. 10B, the bonding surface of the terminal C3A of the other substrate A3 is formed to be slightly larger than the terminal C3D of the one substrate D3. When the form of the corresponding terminal is made different in this way, when both are brought into contact, it is easy to visually grasp the degree of contact, which is convenient in manufacturing.

As shown in FIG. 10, the method of joining substrates according to the present embodiment is as follows: adjacent substrates are planarly combined so that end faces of the substrates face each other, and terminals facing each other are welded by a known bonding method. I do. Known joining methods can be applied. In addition, in order to reinforce the combined substrate as a whole, the combined base may be bonded to a reinforcing base extending over a plurality of substrates.

(Other Modifications) The present invention is not limited to the above embodiment, but can be applied in various modifications. For example, the shape of the terminal and the outer shape of the substrate are not restricted by the embodiment, and the design can be changed. Also, the method of bonding the substrates is not limited to the embodiment, and the omission of the process, addition, and other design changes are possible.

In the manufacturing method, in the above embodiment, energy is supplied from the transparent base side and peeled after the transfer base is bonded, but first, energy is supplied to the peeling layer from the transparent base side. Alternatively, the processing may be performed in such an order that the transfer base is adhered, and then a force is applied to peel the transparent base from the release layer.

An arbitrary circuit can be applied to the wiring layer of the combination substrate. For example, if the display panel is modularized to form a display circuit that can be combined, a display device having an arbitrary size can be formed depending on the combination. A display element (liquid crystal or EL) is provided on the substrate.
Element) and drive circuit (display control TFT and driver circuit)
May be formed together.

[0071]

According to the present invention, there is provided a combined substrate and a method of joining the terminals in which terminals can be directly electrically connected to each other in a state where the terminals are brought into contact with or close to each other. Can be manufactured.

[Brief description of the drawings]

FIG. 1 is a plan view of a combination substrate according to a first embodiment.

FIG. 2 is a cross-sectional view of a bonding portion of the combination substrate according to the first embodiment.

FIG. 3 is a sectional view of a bonding process of the combination substrate according to the first embodiment.

FIG. 4 shows an example of a terminal joining method according to the present invention.

FIG. 5 is a sectional view of a joint portion of the combination substrate according to the second embodiment.

FIG. 6 is a cross-sectional view of a bonding process of the combination substrate according to the second embodiment.

FIG. 7 is a plan view of a combination board according to a third embodiment.

FIG. 8 is a sectional view of a joint portion of the combination substrate according to the third embodiment.

FIG. 9 is a plan view of a combination substrate according to a fourth embodiment.

FIG. 10 is a sectional view of a joint portion of the combination substrate according to the fourth embodiment.

[Explanation of symbols]

 Cxx (x is an arbitrary number) terminal 101, 201 wiring layer 102 release layer 103 base 104, 202 welding 105, 113 adhesive layer 106 transfer base 111 first transfer base 112 first 2 transfer base

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kazuo Yudazaka 3-3-5 Yamato, Suwa City, Nagano Prefecture Seiko Epson Corporation F-term (reference) 5E344 AA04 AA23 BB01 BB06 CC23 DD01 EE30

Claims (12)

[Claims] 1. A combined substrate to be joined in combination with another substrate, wherein an end portion is formed so as to be able to be combined in contact with or close to another substrate to be joined, and A combination substrate comprising one or more terminals, wherein the terminals are arranged so as to be directly electrically connectable to terminals provided on the other substrate. 2. The combination board according to claim 1, wherein the terminals are arranged at one or more ends of the board. 3. The combination substrate according to claim 1, wherein terminals of another substrate to be joined and terminals of the combination substrate joined corresponding to the terminals are provided in different shapes. 4. The terminal according to claim 1, wherein the terminal of the other substrate to be joined and the terminal of the combination substrate joined corresponding to the terminal have an identifier indicating that they are to be joined to each other. The combination board as described. 5. The combination substrate according to claim 1, wherein the terminals are arranged so that when they are combined with another substrate, their joining surfaces face in the same direction and can be joined. 6. The combination substrate according to claim 1, wherein the terminals are arranged such that their joint surfaces face and can be joined when combined with another substrate. 7. An end provided with said terminal is configured to overlap with another substrate and to be joined thereto.
The combination substrate according to any one of the above. 8. A light-transmitting transparent base, a peeling layer formed on the transparent base, which is peeled off by supply of energy, and a wiring comprising the terminal arranged at an end. The combination substrate according to claim 1, comprising a layer. 9. A method for joining a combined board using the combined board according to claim 8, wherein the combined boards to be joined are brought into contact with each other or brought close to each other so as to correspond to each other, and Electrically connecting terminals corresponding to each other on the combined substrate; bonding a transfer base via an adhesive layer on the wiring layer having the electrically connected terminals; Supplying energy to the peeling layer from the base side to cause peeling in the peeling layer, and peeling the transparent base. 10. A method of bonding a combined board using the combined board according to claim 8, wherein the combined boards to be joined are brought into contact with each other or brought close to each other so as to correspond to each other, and combined. A first layer is provided on the wiring layer having the terminals through an adhesive layer.
Bonding a transfer base; supplying energy to the release layer from the transparent base side to cause release in the release layer; and peeling the transparent base; and removing the transparent base of the wiring layer. Bonding a second transfer base to the surface on which the base has been peeled off, and peeling the first transfer base on the adhesive layer on the wiring layer;
Electrically connecting the corresponding terminals on the exposed wiring layer to each other. 11. The method according to claim 9, wherein in the step of electrically connecting the terminals, a connecting metal is provided between the terminals by any one of a laser CVD method, an inkjet method, electroless plating, lift-off or plating. Claim 1
0. The method for bonding a combination substrate according to any one of items 0 to 10. 12. The method according to claim 9, wherein the adhesive layer is made of a resin that is cured by supplying energy.