JP2000228435A - Wafer treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent particle from sticking to a wafer, etc., while restraining prolongation of an operation time during lifting operation of a wafer holding part. SOLUTION: A wafer W is held by a wafer holding part 10 and is moved vertically between a rotation treatment position RP and a delivery position TP by a pulse control type motor 20. A control part 12 controls the pulse control type motor 20 according to a lifting operation pattern of the wafer holding part 10 which is inputted from an operation panel 13. As for a lifting operation pattern of the wafer holding part 10, if lifting speed of the wafer holding part 10 in proximity to the rotation treatment position RP is made lower than lifting speed in an area except proximity to the rotation treatment position RP, generation of air flow due to vertical movement of the wafer holding part 10 or the wafer W held thereby is restrained and whirl of particle, etc., is prevented. Meanwhile, lifting operation is also prevented from requiring a long time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a glass substrate for a liquid crystal display, a substrate for a color filter, a printed wiring board,
The present invention relates to a substrate processing apparatus that performs a predetermined process such as a resist coating process while rotating a substrate for a plasma display panel, a semiconductor substrate, a glass substrate for a photomask, a reticle, and the like (hereinafter, simply referred to as a “substrate”).

[0002]

2. Description of the Related Art Generally, for a substrate as described above,
A series of substrate processes is achieved by sequentially performing a resist coating process, an exposure process, a development process, and a heat treatment associated therewith. The series of substrate processing is performed by transporting a substrate by a transport mechanism between substrate processing apparatuses that perform various processes such as a resist coating process.

Conventionally, as a transport mechanism, a transport mechanism that travels above a plurality of substrate processing apparatuses arranged in series has been used. When performing a series of substrate processing,
It is necessary to perform a delivery operation of the substrate between the substrate processing apparatus and the transport mechanism, and when the transport mechanism does not have a vertical movement mechanism, the substrate processing apparatus performs the delivery operation by raising and lowering the substrate. I have.

FIG. 11 is a schematic view of a main part of a conventional substrate processing apparatus. Substrate holder 11 for holding substrate in horizontal position
Numeral 0 is supported by a rotating shaft 115 provided along the vertical direction, and performs a rotating operation as the rotating shaft 115 rotates. The rotation shaft 115 is connected to the air cylinder 120 via a support member 121. Thereby, the rotation processing position (solid line position in the figure) where the rotation processing of the substrate is performed in accordance with the expansion and contraction operation of the air cylinder 120, and the delivery position (the two-dot chain line position in the figure) where the transfer of the substrate to and from the transport mechanism is performed. The substrate holding unit 110 performs the elevating operation between the steps.

That is, the substrate holding unit 110 that has received the substrate from the transport mechanism at the delivery position moves down to the rotation processing position. When the rotation processing of the substrate is completed, the substrate holding unit 1
10 moves up from the rotation processing position to the delivery position, and delivers the substrate to the transport mechanism. By repeating such operations, the substrates are sequentially processed.

[0006]

However, in the prior art, the elevating operation is performed by the air cylinder 120, and the elevating operation pattern of the substrate holding unit 110 is always constant. For this reason, the following problems have occurred.

First, since the lifting / lowering operation pattern of the substrate holding unit 110 is constant and the substrate holding unit 110 moves up and down at a high speed even in the vicinity of the rotation processing position, particles adhering to the cup 130 etc. There is a problem that the held substrate is wound up by an air current generated by the vertical movement of the held substrate, adheres to the substrate and the substrate holding unit 110, and is contaminated. In order to avoid this, a method of lowering the elevating speed of the substrate holding unit 110 may be considered. However, in this case, the elevating operation of the substrate requires a long time, and the time required for the entire substrate processing is also long. Become.

For example, in an apparatus for performing a liquid coating process such as a resist coating process, the stop position of the substrate holding unit 110 may be determined in addition to the rotation processing position and the delivery position described above, as well as a coating position where a coating process is performed by a slit nozzle. May be provided. In such a case, as shown in FIG. 12, another air cylinder 125 is connected in series to the air cylinder 120, and the two air cylinders are driven independently, so that the substrate holding unit 110 can be moved to three height positions. (Rotation processing position, delivery position, application position). However, when two air cylinders are connected, the mechanism becomes complicated, and adjustment of the stop position of the substrate holding unit 110 becomes extremely difficult.

In the apparatus for performing the liquid coating process, the liquid is supplied to the substrate by the slit nozzle 140 scanning the horizontal direction above the substrate held by the substrate holding unit 110 while discharging the liquid. In this case, in order to maintain the uniformity of the processing, it is necessary that the slit nozzle 140 performs scanning while keeping a certain distance from the substrate. But,
Since the elevating operation pattern of the substrate holding unit 110 is constant, the stop position of the substrate holding unit 110 is also always constant, and when the thickness of the substrate to be processed is changed, the distance between the slit nozzle 140 and the substrate is reduced. A complicated operation such as using a stopper member to change the stop position of the air cylinder 120 was required to keep the air cylinder 120 constant.

Further, in many cases, a plurality of air drives (eg, air cylinders) driven by air are used in one substrate processing apparatus, and many are used in other substrate processing apparatuses. Is always there. The flow rate of the air supplied to the air cylinder 120 fluctuates depending on the operation timings of the air drive units, and the operation of the air cylinder 120 becomes unstable. May be exerted.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has an object to prevent a particle from adhering to a substrate or the like while suppressing a prolonged operation time when the substrate holding unit moves up and down. It is an object to provide a processing device.

Another object of the present invention is to provide a substrate processing apparatus capable of easily adjusting the position of a substrate holding unit without performing a complicated operation.

Still another object of the present invention is to provide a substrate processing apparatus capable of stably lifting and lowering a substrate holding unit without being affected by a change in air flow rate.

[0014]

Means for Solving the Problems To solve the above problems, the invention of claim 1 is a substrate processing apparatus for performing a predetermined process while rotating a substrate, wherein (a) the substrate is placed in a substantially horizontal posture. Holding, a substrate holding unit that performs a rotating operation, (b) elevating means for elevating the substrate holding unit, and (c) control means for controlling the elevating means to make the elevating speed of the substrate holding unit variable. , Is provided.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the present invention, the control means controls the elevating means so that the substrate holding unit stops at an arbitrary stop position. I have.

According to a third aspect of the present invention, in the substrate processing apparatus according to the second aspect of the present invention, there is further provided: (d) an input means for inputting an elevating operation pattern of the substrate holding unit,
The control means controls the elevating means so that the substrate holding unit moves up and down in accordance with the input elevating operation pattern.

According to a fourth aspect of the present invention, in the substrate processing apparatus according to any one of the first to third aspects, the lifting means includes a motor.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<First Embodiment> FIG. 1 is a schematic diagram showing a main part of a first embodiment of a substrate processing apparatus according to the present invention. This apparatus supplies a photoresist to a substrate, rotates the photoresist, and performs a resist coating process.

The substrate processing apparatus according to the first embodiment includes a substrate holding unit 10 for holding a substrate W, a substrate W and a substrate holding unit 1.
Pulse control type motor 2 as lifting means for raising and lowering 0
0, a control unit 12 for controlling the operation of the apparatus, and an operation panel 13 as input means for inputting a vertical movement pattern of the substrate holding unit 10.

The substrate holding section 10 holds the substrate W in a horizontal posture by vacuum suction. The substrate holding unit 10 is supported by a rotating shaft 15 provided along the vertical direction. The rotation shaft 15 is driven to rotate by the rotation mechanism 14. That is, the substrate holding unit 10 performs the rotation operation by the rotation mechanism 14 while holding the substrate W in the horizontal posture.

The rotary shaft 15 is rotatably supported at its bottom by the chuck support 11. Chuck support 11
Is screwed into a ball screw 21 of a pulse control type motor 20 via a plurality of balls. Pulse control type motor 2
When 0 rotates the ball screw 21 in the forward or reverse direction, the chuck support 11 moves up and down accordingly. That is, the pulse control type motor 20 is
The substrate holding unit 10 is moved up and down by a so-called ball screw mechanism.

In the first embodiment, a servo motor or a stepping motor is applied as the pulse control type motor 20. Each motor is a motor driven by applying a pulse signal, and is a motor whose rotation speed and angle can be controlled by adjusting the interval and number of pulses. However, the servo motor differs from the stepping motor in that the servo motor includes a feedback circuit based on the measurement result by the encoder.

The control unit 12 is configured using a computer, and includes a rotation mechanism 14 and a pulse control type motor 2.
0 to control these operations. Therefore, the rotation speed and the rotation angle of the pulse control type motor 20 are controlled by the control unit 12.

The operation panel 13 is a panel for an operator to input a lifting / lowering operation pattern of the substrate holding unit 10 from outside the apparatus. The elevating operation pattern input from the operation panel 13 is transmitted to the control unit 12. Then, the control unit 12 controls the pulse control type motor 20 based on the transmitted lifting operation pattern.

The operation of the substrate processing apparatus of the first embodiment having the above configuration will be briefly described. First, in a state where the substrate holding unit 10 has been raised to the delivery position TP,
An unprocessed substrate W is received from a transport mechanism (not shown). When the substrate holding unit 10 receives the substrate W, the pulse-controlled motor 20 rotates the ball screw 21 based on a signal from the control unit 12. As the ball screw 21 rotates, the chuck support 11, the substrate holding unit 10, and the substrate W descend.

At this time, the control unit 12 controls the pulse control type motor 20 based on the up / down operation pattern of the substrate holding unit 10 which is input from the operation panel 13 in advance.
Then, the control unit 12 determines that the substrate holding unit 10
The pulse control type motor 20 is controlled so as to stop descending.

When the substrate holding unit 10 stops descending at the application position CP, the slit nozzle 18 starts moving in the horizontal direction, and scans the substrate W while discharging the photoresist to supply the photoresist to the substrate W. I do. When the supply of the photoresist to the substrate W is completed, the pulse control type motor 20 is again turned on based on the signal from the control unit 12.
And the substrate W is lowered.

Also at this time, the control unit 12 controls the pulse control type motor 20 based on the elevating operation pattern of the substrate holding unit 10 inputted from the operation panel 13. FIG. 8 is a diagram illustrating an example of an elevating operation pattern of the substrate holding unit 10. As shown by the solid line in the figure, the substrate holding unit 1 is moved at a constant acceleration from the movement start position, that is, the application position CP.
The descent speed of 0 is accelerated, and when the speed reaches a predetermined speed, the substrate holding unit 10 is temporarily lowered at that descent speed. afterwards,
Before the movement stop position, that is, before the rotation processing position RP, the descent speed of the substrate holding unit 10 is reduced at a constant acceleration, and the substrate holding unit 10 is stopped at the rotation processing position RP. Further, as the elevating operation pattern of FIG. 8, for example, as shown by a dotted line portion of the graph, after the descent speed is reduced at a constant acceleration before the rotation processing position RP,
An elevating operation pattern in which the deceleration is temporarily stopped, a constant speed is maintained near the rotation processing position RP for a predetermined time, and then the deceleration is again reduced at a constant acceleration to the stop position may be adopted. Further, the lifting operation pattern in FIG. 8 is not limited thereto, and at least the lifting speed when the substrate holding unit 10 is located near the rotation processing position RP is lower than the lifting speed when the substrate holding unit 10 is located other than near the rotation processing position RP. What is necessary is just to make such a lifting operation pattern.

When the substrate holding unit 10 is lowered to the rotation processing position RP, the rotation mechanism 14 rotates the substrate holding unit 10 and the substrate W based on an instruction from the control unit 12. As the substrate W rotates, the photoresist supplied thereon spreads by centrifugal force and is uniformly applied on the surface of the substrate W. The photoresist scattered by the rotation of the substrate W is transferred to the substrate holding unit 10 at the rotation processing position RP.
Is collected in the cup 16 arranged around the.

When the rotation processing of the substrate W is completed, the control unit 1
2, the pulse control type motor 20 raises the substrate holding unit 10 and the substrate W from the rotation processing position RP to the delivery position TP. Also at this time, the control unit 12 controls the pulse control type motor 20 based on the elevating operation pattern of the substrate holding unit 10 as shown in FIG. That is, the rising speed of the substrate holding unit 10 is accelerated from the movement start position (the rotation processing position RP) at a constant acceleration, and when the speed reaches a predetermined speed, the substrate holding unit 10 is temporarily raised at the rising speed. Thereafter, just before the movement stop position (transfer position TP), the rising speed of the substrate holding unit 10 is reduced at a constant acceleration, and the substrate holding unit 10 is stopped at the transfer position TP. Further, as the elevating operation pattern shown in FIG. 9, for example, as shown by the dotted line portion of the graph, after maintaining a constant speed at a low speed near the rotation processing position RP which is the movement start position, at a constant acceleration Substrate holder 1
A speed pattern in which the rising speed of 0 is accelerated and reaches the speed indicated by the solid line in FIG. 9 may be used. Further, the lifting / lowering operation pattern is not limited thereto, and at least the lifting / lowering speed when the substrate holding unit 10 is located near the rotation processing position RP is lower than the lifting / lowering speed when the substrate holding unit 10 is located outside the rotation processing position RP. What is necessary is just to make such a raising / lowering operation pattern similar to the above.

Thereafter, the substrate W is transferred from the substrate holding unit 10 to the transport mechanism, and the resist coating process ends.

As described above, the substrate processing apparatus of the first embodiment uses the pulse control type motor 20 capable of controlling the rotation speed and the rotation angle as the substrate holding unit 10 and the means for raising and lowering the substrate W. Controls the rotation speed and rotation angle. The rotation speed of the pulse control type motor 20 becomes the rotation speed of the ball screw 21 as it is,
The lifting speed of the substrate holding unit 10 is defined. The rotation angle of the pulse control type motor 20 is directly
The rotation angle of the substrate holding unit 10 is defined by the rotation angle. In other words, in the substrate processing apparatus of the first embodiment, the control unit 12
Is controlled, the lifting speed of the substrate holding unit 10 is made variable, and the substrate holding unit 10 is stopped at an arbitrary stop position.

Therefore, if the control unit 12 controls the rotation speed of the pulse control type motor 20 based on the elevating operation pattern as shown in FIG. 8 or FIG. 9, at least the substrate holding unit 10 is located near the rotation processing position RP. The ascending / descending speed at the position is lower than the ascending / descending speed at a position other than the vicinity of the rotation processing position RP. In the vicinity of the rotation processing position RP, the substrate holding unit 10 moves up and down at a relatively low speed, so that the generation of airflow due to the vertical movement of the substrate holding unit 10 or the substrate W held by the substrate holding unit 10 is suppressed, and particles adhering to the cup 16 and the like are suppressed. Winding is prevented. As a result, the substrate holding unit 1
It is possible to prevent particles from adhering to the substrate W and the like at the time of the 0 elevating operation. The vicinity of the rotation processing position RP means a region from the height position of the upper end of the cup 16 to the rotation processing position RP.

On the other hand, since the substrate holding unit 10 moves up and down at a relatively high speed at positions other than the vicinity of the rotation processing position RP, it is possible to prevent the elevating operation of the substrate W from taking a long time. That is, it is possible to prevent particles from adhering to the substrate W and the like while suppressing an increase in operation time when the substrate holding unit 10 moves up and down.

The control unit 12 controls the pulse control type motor 2
By controlling the rotation angle of the substrate holding unit 10
Is stopped at an arbitrary stop position, so that the substrate holding unit 10 stops at three height positions (that is, the rotation processing position RP, the delivery position TP, and the coating position CP) as in the related art. There is no need to provide two air cylinders (see FIG. 11), and a simple mechanism is sufficient.

Further, as described above, it is necessary to scan the slit nozzle 18 while keeping the distance between the slit nozzle 18 and the substrate W constant at the application position CP, as described above. In the substrate processing apparatus described above, since the substrate holding unit 10 is stopped at an arbitrary stop position by the control unit 12, even if the thickness of the substrate W to be processed is changed, The distance between the slit nozzle 18 and the substrate W can be easily kept constant by changing the stop position of the substrate holding unit 10 without providing a mechanism (for example, a mechanism for vertically moving the slit nozzle 18). Specifically, for example, it can be easily performed only by changing the elevating operation pattern input from the operation panel 13.

That is, in the substrate processing apparatus of the first embodiment, the pulse control type motor 2 capable of controlling the rotation angle is used.
0 is used as a control means, and the control unit 12 controls the rotation angle of the pulse control type motor 20 so that the substrate holding unit 10 stops at an arbitrary stop position. This makes it possible to easily adjust the position of the substrate holding unit 10 without performing a complicated operation.

Further, since the pulse control type motor 20 is used as the lifting / lowering means of the substrate holding unit 10, the substrate holding unit can be stably held without being affected by the air flow rate change caused by the operation timing of the other air driving unit. The lifting operation of the unit 10 can be performed.

In the first embodiment, the so-called ball screw mechanism using the ball screw 21 is used to convert the rotation of the pulse control type motor 20 into the lifting and lowering of the substrate holding unit 10. A feed screw shaft is applied, and the chuck support portion 1 is directly attached to the feed screw shaft.
A so-called feed screw shaft mechanism in which 1 is screwed may be used.

<Second Embodiment> FIG. 2 is a schematic diagram showing a main part of a second embodiment of the substrate processing apparatus according to the present invention. This apparatus supplies a photoresist to a substrate, rotates the photoresist, and performs a resist coating process.

The difference between the substrate processing apparatus of the second embodiment and the substrate processing apparatus of the first embodiment is the lifting mechanism of the substrate holding unit 10. The substrate processing apparatus of the first embodiment differs from the substrate processing apparatus of FIG. While a so-called ball screw mechanism using a ball screw 21 is used to convert the rotation of the substrate holding unit 10 into a vertical movement, the substrate processing apparatus of the second embodiment employs a pulse-controlled motor using a pulley and a wire. 3
The rotation of 0, 35 is transmitted to the substrate holding unit 10.

The pulse control type motors 30 and 35 are the same as the pulse control type motor 20 of the first embodiment, and a servo motor or a stepping motor is applied. However,
The pulse control type motor 20 according to the first embodiment rotates about a vertical axis, whereas the pulse control type motors 30 and 35 according to the second embodiment use a horizontal direction (a direction perpendicular to the plane of FIG. 2). Rotate around the axis.

A drive pulley 31 is fixedly mounted on the rotation shaft of the pulse control type motor 30. A drive pulley 32 is fixedly mounted on the rotation shaft of the pulse control motor 35. A wire 3 is provided between the driving pulley 31 and the driving pulley 32.
3 are wound. The chuck support 11 is connected to the wire 33. Accordingly, when the pulse control type motor 30 winds the wire 33 downward, the chuck supporting part 11, the substrate holding part 10 and the substrate W descend accordingly, and the pulse control type motor 35 winds the wire 33 upward. When taken, the chuck supporting portion 11,
The substrate holding unit 10 and the substrate W rise.

The remaining points other than the lifting / lowering mechanism of the substrate holding unit 10 are the same as those of the substrate processing apparatus of the first embodiment. The operation of the substrate processing apparatus according to the second embodiment is the same as the operation of the substrate processing apparatus according to the first embodiment.

Also in this case, the substrate processing apparatus of the second embodiment can control the rotation speed and the rotation angle as the substrate holder 10 and the means for lifting and lowering the substrate W, similarly to the substrate processing apparatus of the first embodiment. Pulse control motors 30, 35
And the control unit 12 controls the rotation speed and the rotation angle thereof. Pulse control motors 30, 35
Is the winding speed of the wire 33, and defines the elevating speed of the substrate holding unit 10. In addition, the rotation angle of the pulse control type motors 30 and 35 becomes the winding length of the wire 33, and defines the vertical stop position of the substrate holding unit 10. In other words, in the substrate processing apparatus according to the second embodiment, the controller 12 controls the pulse-controlled motors 30 and 35 so that the elevating speed of the substrate holder 10 can be changed and the substrate holder 10 can be freely moved. It stops at the stop position.

Therefore, similarly to the first embodiment, it is possible to prevent particles from adhering to the substrate W and the like while suppressing the operation time from being prolonged during the elevating operation of the substrate holding unit 10. Further, the position of the substrate holding unit 10 can be easily adjusted without providing a complicated mechanism or performing a complicated operation. Further, the lifting operation of the substrate holding unit 10 can be performed stably without being affected by the change in the air flow rate caused by the operation timing of the other air driving unit.

Note that a steel belt may be used instead of the wire 33.

<Third Embodiment> FIG. 3 is a schematic diagram showing a main part of a third embodiment of the substrate processing apparatus according to the present invention. This apparatus supplies a photoresist to a substrate, rotates the photoresist, and performs a resist coating process.

The difference between the substrate processing apparatus of the third embodiment and the substrate processing apparatus of the first embodiment is the lifting mechanism of the substrate holding unit 10. The substrate processing apparatus of the first embodiment differs from the substrate processing apparatus of FIG. In contrast to the so-called ball screw mechanism using the ball screw 21 for converting the pressure into the elevation of the substrate holding unit 10, the substrate processing apparatus of the third embodiment employs a pulse control using a timing belt and a timing pulley. The rotation of the motor 40 is transmitted to the substrate holding unit 10.

The pulse control type motor 40 is the same as the pulse control type motor 20 of the first embodiment, and employs a servo motor or a stepping motor. However, the pulse control type motor 20 according to the first embodiment rotates about a vertical direction, whereas the pulse control type motor 40 according to the third embodiment uses a horizontal direction (a direction perpendicular to the plane of the paper of FIG. 3). Rotate around the axis.

A drive pulley 41 using a timing pulley is fixedly mounted on the rotation shaft of the pulse control type motor 40. A timing belt 43 is wound around a driven pulley 42 and a driving pulley 41 that are rotatably provided. The chuck support 11 is fixed to the timing belt 43. Therefore, when the pulse control type motor 40 rotates the drive pulley 41 in the forward or reverse direction and rotates the timing belt 43, the chuck supporting unit 11, the substrate holding unit 10, and the substrate W move up and down accordingly.

The remaining points other than the lifting mechanism of the substrate holding unit 10 are the same as those of the substrate processing apparatus of the first embodiment, and therefore, are denoted by the same reference numerals and description thereof is omitted. The operation of the substrate processing apparatus of the third embodiment is the same as the operation of the substrate processing apparatus of the first embodiment.

Also in this case, the substrate processing apparatus of the third embodiment can control the rotation speed and the rotation angle as the means for lifting and lowering the substrate holding unit 10 and the substrate W, similarly to the substrate processing apparatus of the first embodiment. The rotation speed and the rotation angle are controlled by the control unit 12 using the pulse control type motor 40. The rotation speed of the pulse control type motor 40 is
The rotation speed of the timing belt 43 becomes the rotation speed of the substrate holding unit 1.
A lifting speed of 0 is specified. In addition, the pulse control type motor 4
The rotation angle of 0 is the traveling distance of the timing belt 43, and defines the vertical stop position of the substrate holding unit 10. In other words, also in the substrate processing apparatus of the third embodiment, the control unit 12 controls the pulse control type motor 40, thereby making the lifting speed of the substrate holding unit 10 variable and stopping the substrate holding unit 10 at an arbitrary stop. It stops at the position.

Therefore, similarly to the first embodiment, it is possible to prevent particles from adhering to the substrate W and the like while suppressing an increase in operation time when the substrate holding unit 10 is moved up and down. Further, the position of the substrate holding unit 10 can be easily adjusted without providing a complicated mechanism or performing a complicated operation. Further, the lifting operation of the substrate holding unit 10 can be stably performed without being affected by a change in the air flow rate due to the operation timing of another air driving unit.

<Fourth Embodiment> FIG. 4 is a schematic diagram showing a main part of a fourth embodiment of the substrate processing apparatus according to the present invention. This apparatus supplies a photoresist to a substrate, rotates the photoresist, and performs a resist coating process.

The difference between the substrate processing apparatus of the fourth embodiment and the substrate processing apparatus of the first embodiment is the lifting mechanism of the substrate holding unit 10. Is converted into the elevation of the substrate holding unit 10, whereas the substrate processing apparatus of the fourth embodiment
The substrate holding unit 10 is moved up and down by the linear pulse motor 50.

The linear pulse motor 50 is a linear motor in which the linear guide section 51 is driven by giving a pulse signal, and controls the moving speed and moving distance of the linear guide section 51 by adjusting the interval and the number of pulses. A possible motor. Further, the linear pulse motor 50 has an encoder section 52, and measures the moving speed and the moving distance of the linear guide section 51, and
2 That is, the control unit 12 controls the moving speed and the moving distance of the linear guide unit 51 by the feedback control.

The chuck support 11 is provided with the linear guide 5
1 fixed. Therefore, the linear pulse motor 50
Drives the linear guide portion 51 up and down, the chuck support portion 11, the substrate holding portion 10, and the substrate W
Goes up and down.

The remaining points other than the lifting / lowering mechanism of the substrate holding unit 10 are the same as those of the substrate processing apparatus of the first embodiment. The operation of the substrate processing apparatus according to the fourth embodiment is the same as the operation of the substrate processing apparatus according to the first embodiment.

In this manner, the moving speed and moving distance of the linear guide portion 51 as the means for lifting and lowering the substrate holding portion 10 and the substrate W are the same as those of the substrate processing device of the first embodiment. The moving speed and the moving distance are controlled by the control unit 12 using the linear pulse motor 50 capable of controlling the moving speed. Linear guide part 51
The moving speed of the substrate holder directly defines the elevating speed of the substrate holding unit 10. Further, the moving distance of the linear guide 51 directly defines the vertical stop position of the substrate holding unit 10. In other words, also in the substrate processing apparatus according to the fourth embodiment, the control unit 12 controls the linear pulse motor 50
Is controlled, the lifting speed of the substrate holding unit 10 is made variable, and the substrate holding unit 10 is stopped at an arbitrary stop position.

Accordingly, similarly to the first embodiment, it is possible to prevent particles from adhering to the substrate W and the like while suppressing the operation time from being lengthened during the elevating operation of the substrate holding unit 10. Further, the position of the substrate holding unit 10 can be easily adjusted without providing a complicated mechanism or performing a complicated operation. Further, the lifting operation of the substrate holding unit 10 can be stably performed without being affected by a change in the air flow rate due to the operation timing of another air driving unit.

<Fifth Embodiment> Next, a fifth embodiment of the substrate processing apparatus according to the present invention will be described.
The substrate processing apparatus according to the fifth embodiment also supplies a photoresist to a substrate and rotates the substrate to perform a resist coating process. However, the lifting mechanism is different from the substrate processing apparatuses according to the first to fourth embodiments. That is, in the substrate processing apparatuses according to the first to fourth embodiments, the lifting mechanism using an electric driving force using a motor is used. However, the substrate processing apparatus according to the fifth embodiment uses a lifting mechanism using air pressure. Mechanism.

FIG. 5 is a diagram showing a schematic configuration of an elevating mechanism of the substrate processing apparatus according to the fifth embodiment. Note that points other than the elevating mechanism are the same as those of the substrate processing apparatuses of the first to fourth embodiments, and thus description thereof will be omitted. In addition, the fifth
The operation of the entire substrate processing apparatus of the embodiment is the same as that of the substrate processing apparatuses of the first to fourth embodiments.

The lifting mechanism of the substrate processing apparatus according to the fifth embodiment is a lifting mechanism using a pneumatic servo system 60.
The pneumatic servo system 60 is a system that can control the operating speed and the moving distance of the piston rod 61 by performing feedback control of the amount of air supplied to the cylinder 62 by the control unit 12 based on the position information from the position sensor 66. .

The chuck support 11 for supporting the substrate holding unit 10 is fixed to the piston rod 61. Also,
The position of the piston rod 61 is measured by a position sensor 66. As the position sensor 66, for example, a potentiometer may be used. The position information of the piston rod 61 measured by the position sensor 66 is transmitted to the control unit 12.

The control unit 12 drives the servo valves 64 and 65 based on the transmitted position information of the piston rod 61 to control the amount of air supplied to both sides of the piston 63 in the cylinder 62. Then, the piston 63 is driven by the air pressure difference between the two sides of the piston 63 in the cylinder 62, and the piston rod 6
1. chuck support portion 11, substrate holding portion 10, and substrate W
Goes up and down.

In the pneumatic servo system 60, since the control unit 12 adjusts the pneumatic pressure difference between the two sides of the piston 63 in the cylinder 62 based on the position information from the position sensor 66, the operating speed and the moving distance of the piston rod 61 are adjusted. Can be controlled.

That is, the substrate processing apparatus according to the fifth embodiment is similar to the substrate processing apparatus according to the first embodiment in that the substrate holding section 10
A pneumatic servo system 60 capable of controlling the operating speed and moving distance of the piston rod 61 is used as a means for lifting and lowering the substrate W, and the operating speed and moving distance are controlled by the control unit 12. The operating speed of the piston rod 61 directly defines the elevating speed of the substrate holding unit 10.
Further, the moving distance of the piston rod 61 directly defines the vertical stop position of the substrate holding unit 10. In other words, also in the substrate processing apparatus of the fifth embodiment, the control unit 12 controls the pneumatic servo system 60 serving as the elevating means so that the elevating speed of the substrate holding unit 10 is variable and the substrate holding unit 10 It stops at an arbitrary stop position.

Therefore, similarly to the first embodiment, it is possible to prevent particles from adhering to the substrate W and the like while suppressing an increase in operation time when the substrate holding unit 10 moves up and down. Further, the position of the substrate holding unit 10 can be easily adjusted without providing a complicated mechanism or performing a complicated operation.

As described above, in the fifth embodiment, the pneumatic servo system 60 is applied as the lifting mechanism using pneumatic pressure, but an electro-pneumatic stepping cylinder may be used instead. An electropneumatic stepping cylinder is an air cylinder that drives a pneumatic switching valve by a servo motor or a stepping motor and can precisely adjust the pneumatic pressure in the cylinder. Therefore, even if a stepping cylinder is used, the elevation speed and the elevation stop position of the substrate holding unit 10 can be controlled, and the same effects as described above can be obtained. The stepping cylinder is not limited to the electropneumatic type but may be an electrohydraulic type.

<Sixth Embodiment> Next, a sixth embodiment of the substrate processing apparatus according to the present invention will be described.
FIG. 6 is a schematic configuration diagram of a main part of a sixth embodiment of the substrate processing apparatus according to the present invention.

The substrate processing apparatus according to the sixth embodiment differs from the substrate processing apparatus according to the first embodiment in the lifting mechanism of the substrate holding unit 10. The substrate processing apparatus according to the first embodiment uses a In contrast to the lifting drive source of the holding unit 10, the substrate processing apparatus of the sixth embodiment has
A general air cylinder 70 is used as a zero drive source.

As another difference, the substrate processing apparatus according to the sixth embodiment includes a cam switch 71 and a three-way valve 75. The cam switch 71 is a switch that switches on / off between a state in which the chuck supporting portion 11 is in contact with the cam body 72 and a state in which the chuck support section 11 is separated from the cam body 72. When the substrate holding unit 10 is located near the rotation processing position RP, the cam switch 71
1 is located near the solid line position in FIG.
When the cam member 72 contacts the cam body 72 and the cam body 72 is pushed to the position indicated by the solid line in the drawing, the presence of the chuck supporting portion 11 is detected, and the fact is transmitted to the control portion 12. That is, when the substrate holding unit 10 is located near the rotation processing position RP, the cam switch 71 plays a role as a detecting unit for detecting that fact.

When the control unit 12 receives the detection signal from the cam switch 71, it controls the three-way valve 75 to connect the air cylinder 70 to the low-pressure air line (or low-flow air line). Conversely, when the control unit 12 does not receive the detection signal from the cam switch 71, the three-way valve 75
To connect the air cylinder 70 to the high-pressure air line (or high-flow air line).

Therefore, the substrate holding unit 10 is moved to the rotation processing position R
When it is located near P, the chuck supporting portion 11 is in contact with the cam body 72, and the cam body 72 is pushed to the position indicated by the solid line in the figure, and the air cylinder 70 is connected to the low-pressure air line. As a result, the driving speed of the air cylinder 70 becomes low, and the substrate holding unit 1 near the rotation processing position RP.
Since 0 moves up and down at a relatively low speed, the generation of airflow due to the up and down movement of the substrate holding unit 10 or the substrate W held by it is suppressed, and the particles attached to the cup 16 and the like are prevented from being wound up. As a result, it is possible to prevent particles from adhering to the substrate W or the like during the elevating operation of the substrate holding unit 10.

On the other hand, when the substrate holding unit 10 is in the rotation processing position RP
If it is located outside the vicinity, the chuck support 11 is separated from the cam body 72, the cam body 72 returns to the position indicated by the two-dot chain line in the figure, and the air cylinder 70 and the high-pressure air line are connected. Accordingly, the driving speed of the air cylinder 70 becomes higher than when the substrate holding unit 10 is located near the rotation processing position RP, and the substrate holding unit 10 moves up and down at a relatively high speed other than near the rotation processing position RP. ,
It is also possible to prevent the elevating operation of the substrate W from taking a long time.
The operation of the entire substrate processing apparatus according to the sixth embodiment is the same as that of the first embodiment.
This is the same as that of the substrate processing apparatus of the fifth to fifth embodiments.

As described above, in the substrate processing apparatus according to the sixth embodiment, although the general air cylinder 70 is used as the means for lifting and lowering the substrate holding unit 10 and the substrate W, the detection signal from the cam switch 71 is used. The controller 12 controls the driving speed of the air cylinder 70 based on The driving speed of the air cylinder 70 defines the elevating speed of the substrate holding unit 10. In other words, in the substrate processing apparatus according to the sixth embodiment, the control unit 12 indirectly controls the air cylinder 70 as the elevating means via the three-way valve 75, thereby making the elevating speed of the substrate holding unit 10 variable. It can be said that.

Therefore, the substrate processing apparatus of the sixth embodiment also
As in the first embodiment, it is possible to prevent particles from adhering to the substrate W or the like while suppressing an increase in operation time during the elevating operation of the substrate holding unit 10. Note that the cam switch 71 itself may be provided near the rotation processing position RP, and the substrate holding unit 10 may directly operate the cam switch 71. Further, it is preferable to use a shock absorber in combination to reduce the impact when the substrate holding unit 10 stops at the rotation processing position RP.

In the substrate processing apparatus of the sixth embodiment, the cam switch 71 cannot control the vertical stop position of the substrate holding unit 10. However, the conventional substrate processing apparatus (see FIG. 10) does not have the cam switch 71 and the cam switch 71. Three-way valve 75
Only by providing the above, it is possible to prevent the particles from adhering due to the air current, so that the cost can be reduced.

<Seventh Embodiment> Next, a seventh embodiment of the substrate processing apparatus according to the present invention will be described.
FIG. 7 is a schematic configuration diagram of a main part of a seventh embodiment of the substrate processing apparatus according to the present invention.

The difference between the substrate processing apparatus of the seventh embodiment and the substrate processing apparatus of the first embodiment is the lifting mechanism of the substrate holding unit 10. The substrate processing apparatus of the first embodiment uses a pulse-controlled motor 20 for the substrate. In contrast to the lifting drive source of the holding unit 10, the substrate processing apparatus of the seventh embodiment is
A reversible type speed control motor 80 is used as a zero drive source. Note that the so-called ball screw mechanism using the ball screw 81 for converting the rotation of the speed control motor 80 into the elevation of the substrate holding unit 10 is the same as in the first embodiment.

As another difference, the substrate processing apparatus according to the seventh embodiment has an optical sensor 82. The sensor 82 detects the chuck supporting portion 11 when the substrate holding portion 10 is located near the rotation processing position RP, that is, when the chuck supporting portion 11 is located near the solid line position in the drawing, and controls the fact. The information is transmitted to the unit 12. That is, when the substrate holding unit 10 is located near the rotation processing position RP, the sensor 82 plays a role as a detecting unit that detects that fact.

When the control unit 12 receives the detection signal from the sensor 82, it controls the speed control motor 80 to reduce its operation speed. Conversely, the control unit 12
When the control signal is not received from the sensor 82, the speed control motor 80 is controlled to increase the operation speed.

Therefore, when the substrate holding unit 10 is in the rotation processing position R
When it is located in the vicinity of P, the rotation speed of the ball screw 81 is low, and in the vicinity of the rotation processing position RP, the substrate holding unit 10 moves up and down at a relatively low speed.
The generation of airflow due to the vertical movement of the substrate 0 or the substrate W held thereby is suppressed, and the winding up of particles attached to the cup 16 or the like is prevented. As a result, it is possible to prevent particles from adhering to the substrate W or the like during the elevating operation of the substrate holding unit 10.

On the other hand, when the substrate holding unit 10 is in the rotation processing position RP
When it is located near the rotation processing position RP, the rotation speed of the ball screw 81 becomes higher than when it is located near the rotation processing position RP.
Since 0 moves up and down at a relatively high speed, it is possible to prevent the elevating operation of the substrate W from taking a long time. The operation of the entire substrate processing apparatus according to the seventh embodiment is the same as that of the substrate processing apparatuses according to the first to sixth embodiments.

As described above, in the substrate processing apparatus of the seventh embodiment, the speed control motor 80 capable of controlling the rotation speed is used as the substrate holding unit 10 and the means for elevating and lowering the substrate W, and the sensor 82 supplies the detection signal to the detection signal. The control unit 12 controls the rotation speed based on this. The rotation speed of the speed control motor 80 becomes the rotation speed of the ball screw 81 as it is, and defines the elevating speed of the substrate holding unit 10. In other words, in the substrate processing apparatus according to the seventh embodiment, the control unit 12 controls the speed control motor 80
Is controlled, the elevating speed of the substrate holding unit 10 is made variable.

Therefore, the substrate processing apparatus of the seventh embodiment also
As in the first embodiment, it is possible to prevent particles from adhering to the substrate W or the like while suppressing an increase in operation time during the elevating operation of the substrate holding unit 10. Note that the sensor 82 may be provided near the rotation processing position RP to directly detect the substrate holding unit 10.

Further, since the speed control motor 80 is used as a means for raising and lowering the substrate holding unit 10, the substrate holding unit can be stably maintained without being affected by a change in air flow rate due to the operation timing of another air driving unit. 10 lifting operations can be performed.

Since the rotation angle of the speed control motor 80 cannot be controlled, it is impossible to control the vertical stop position of the substrate holding unit 10 as in the sixth embodiment.

<Modifications> Although the embodiments of the present invention have been described above, the present invention is not limited to the above examples. For example, in the first to fifth embodiments, the lifting / lowering operation pattern of the substrate holding unit 10 is not limited to the pattern shown in FIGS. 8 and 9, but may be the pattern shown by the solid line and the dotted line in FIG. Is also good. The elevating operation pattern of the substrate holding unit 10 shown in FIG. 10 is an elevating operation pattern having a curved change. Also in this modification, at least an elevating operation pattern in which the elevating speed when the substrate holding unit 10 is positioned near the rotation processing position RP is lower than the elevating speed when the substrate holding unit 10 is positioned other than near the rotation processing position RP. It is good.

Further, the substrate processing apparatus described in the above embodiment is an apparatus for supplying a photoresist to a substrate and rotating the substrate to perform a resist coating process. Any device may be used as long as it performs a predetermined process while rotating it. For example, it may be a substrate processing device that performs a developing process by supplying a developer to a substrate and rotating the substrate.

[0093]

As described above, according to the first aspect of the present invention, since the control means for controlling the elevating means to vary the elevating speed of the substrate holding unit is provided, the control means is provided near the rotation processing position. By controlling the lifting speed of the substrate holding unit to be lower than the lifting speed other than near the rotation processing position, the generation of airflow due to the vertical movement of the substrate holding unit or the substrate held by it is suppressed, and the lifting of particles etc. is prevented. On the other hand, it is also possible to prevent the elevating operation from taking a long time.

According to the second aspect of the present invention, since the elevating means is controlled so that the substrate holding portion stops at an arbitrary stop position, it can be easily provided without providing a complicated mechanism or performing a complicated operation. The position of the substrate holding unit can be adjusted in advance.

According to the third aspect of the present invention, there is provided an input means for inputting an elevating operation pattern of the substrate holder, and the elevating means is moved up and down in accordance with the elevating operation pattern inputted to the controller. Since the control is performed, the elevating speed and the stop position of the substrate holding unit can be easily set and changed.

According to the fourth aspect of the present invention, since the lifting / lowering means includes a motor, the substrate holding portion can be stably mounted without being affected by a change in air flow rate due to the operation timing of another air driving portion. A lifting operation can be performed.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a main part of a first embodiment of a substrate processing apparatus according to the present invention.

FIG. 2 is a schematic configuration diagram of a main part of a second embodiment of the substrate processing apparatus according to the present invention.

FIG. 3 is a schematic diagram illustrating a main part of a third embodiment of the substrate processing apparatus according to the present invention.

FIG. 4 is a schematic configuration diagram of a main part of a fourth embodiment of the substrate processing apparatus according to the present invention.

FIG. 5 is a diagram illustrating a schematic configuration of an elevating mechanism of a substrate processing apparatus according to a fifth embodiment.

FIG. 6 is a schematic configuration diagram of a main part of a sixth embodiment of the substrate processing apparatus according to the present invention.

FIG. 7 is a schematic configuration diagram of a main part of a seventh embodiment of the substrate processing apparatus according to the present invention.

FIG. 8 is a diagram illustrating an example of an elevating operation pattern of the substrate holding unit.

FIG. 9 is a diagram illustrating an example of an elevating operation pattern of the substrate holding unit.

FIG. 10 is a view showing another example of the elevating operation pattern of the substrate holding unit.

FIG. 11 is a schematic view of a main part of a conventional substrate processing apparatus.

FIG. 12 is a schematic diagram of a main part of another example of the conventional substrate processing apparatus.

[Explanation of symbols]

 Reference Signs List 10 board holding unit 12 control unit 13 operation panel 20, 30, 35, 40 pulse control type motor 50 linear pulse motor 60 pneumatic servo system 70 air cylinder 71 cam switch 80 speed control motor 82 sensor W board

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshiaki Ito 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori-Terauchi, Kamigyo-ku, Kyoto Dainippon Screen Mfg. Co., Ltd. (72) Inventor Eiji Okuno, Kyoto, Kyoto 4-chome Tenjin, Horikawa-dori Terunouchi-ku 1-1-1 Kitamachi, Dainippon Screen Mfg. Co., Ltd. F term (reference) 5F031 CA05 CA07 HA58 HA59 LA07 MA24 MA26 MA27 5F046 JA02 JA10 JA13

Claims (4)

[Claims] 1. A substrate processing apparatus for performing a predetermined process while rotating a substrate, comprising: (a) a substrate holding unit that holds a substrate in a substantially horizontal posture and performs a rotation operation; A substrate processing apparatus comprising: elevating means for elevating and lowering a unit; and (c) control means for controlling the elevating means to change the elevating speed of the substrate holding unit. 2. The substrate processing apparatus according to claim 1, wherein the control unit controls the elevating unit so that the substrate holding unit stops at an arbitrary stop position. 3. The substrate processing apparatus according to claim 2, further comprising: (d) an input unit for inputting an elevating operation pattern of the substrate holding unit, wherein the control unit operates according to the input elevating operation pattern. A substrate processing apparatus, comprising: controlling the elevating means so that a substrate holding unit moves up and down. 4. The substrate processing apparatus according to claim 1, wherein said lifting means includes a motor.