JP2000012417A - Device and method for processing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To specify a nozzle position, to which a nozzle is actually moved, and to exactly adjust the discharging position of the nozzle, in a short time. SOLUTION: In place of a substrate, a prescribed jig 210 is made to hold a carrier arm 70a of a substrate carrier robot. In such a state, a nozzle 6 is moved to a discharging position, and the nozzle 6 and jib 210 are made proximate into prescribed relative positional relation. By operating the substrate carrier robot in X and Y-directions in such a proximate state that the jig is moved in the X and Y-directions. There is a position, where light from flood parts 213 and 241 added to the jig 210 is shielded by the nozzle 6 with this movement. Therefore, by performing operation based on the output provided from light-receiving parts 232 and 242, the nozzle position can be specified. In addition, a moving amount for moving the nozzle 6 from this nozzle position to the suitable discharging position can be found, and the discharging position can be adjusted as well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor wafer,
By supplying a predetermined processing liquid to a thin precision substrate (hereinafter simply referred to as a “substrate”) such as a glass substrate for a photomask, a glass substrate for a liquid crystal display device, and a substrate for an optical disk, The present invention relates to a substrate processing apparatus and a substrate processing method for performing processing such as resist coating, development processing, and substrate cleaning.

[0002]

2. Description of the Related Art Conventionally, various processing liquids have been used for performing predetermined processing such as resist coating, development processing, and substrate cleaning on a substrate. A processing liquid such as a resist liquid, a developing liquid, or a cleaning liquid is discharged from a predetermined nozzle toward a substrate to be processed.

FIGS. 19 and 20 are schematic plan views of processing units 400A and 400B for performing processing liquid processing in a conventional substrate processing apparatus.

First, in a processing section 400A shown in FIG. 19, nozzles 411 to 41 for discharging a processing liquid to a substrate are placed at a standby position on the side (X direction side) of the scattering prevention cup 2.
For example, four nozzle arms 421 to 424 having different lengths and provided at the distal end are disposed. These four
The nozzle arms 421 to 424 are attached to the scattering prevention cup 2.
, Are arranged in parallel so that shorter-length nozzle arms are located. Also, the nozzle arm 421
424 are attached so as to be swingable in a horizontal plane about a base end portion.

The four nozzle arms 421 to 424
Desired nozzle arm, for example, nozzle arm 4
22 operates as follows. First, the nozzle arm 422 at the standby position moves up to the moving height position. The raised nozzle arm 422 swings in a horizontal plane, and the nozzle 412 provided at the tip moves upward near the center of rotation of the substrate W. Next, the nozzle arm 422 is lowered, and the nozzle 412 is lowered to a predetermined discharge position. At the discharge position, a predetermined amount of the processing liquid is discharged and supplied from the nozzle 412 to the substrate W held by the spin chuck 1. For example, when the processing liquid is a resist, when the supply of the resist from the nozzle 412 is completed, the substrate W is driven to rotate at a high speed, and a uniform resist film is formed on the surface of the substrate W. Thereafter, the nozzle arm 422 rises to the moving height position, swings back to the standby position side, and further descends to the standby position, thereby completing a series of processes.

Next, in a processing section 400B shown in FIG. 20, for example, four nozzle arms 441 to 44 of the same length are placed at a standby position on the side (X direction side) of the scattering prevention cup 2.
4 are provided, and nozzles 431 to 434 are provided at the tips of the nozzle arms 441 to 444, respectively. Each of the four nozzle arms 441 to 444 is
1 to 444 are arranged in parallel so that the tip portions thereof face the spin chuck 1 side (−X direction side). These nozzle arms 441 to 444 are mounted on a uniaxial drive mechanism 450. The uniaxial drive mechanism 450 slides along the Y-axis direction, thereby moving each nozzle arm 4.
41 to 444 can be moved in the ± Y direction. Further, each of the nozzle arms 441 to 444 is configured to be slidable along the X-axis direction.

The four nozzle arms 441 to 444
Desired nozzle arm, for example, nozzle arm 4
44 operates as follows. First, the uniaxial drive mechanism 450
The nozzle arm 444 moves on the rotation center line of the spin chuck 1 by sliding along the Y axis. Subsequently, the nozzle arm 444 at the standby position is set to -X.
The nozzle 434 moves to the discharge position above the vicinity of the rotation center of the substrate W. At the discharge position, a predetermined amount of the processing liquid is discharged and supplied from the nozzle 434 to the substrate W held by the spin chuck 1. For example, when the processing liquid is a resist, when the supply of the resist from the nozzle 434 is completed, the substrate W is driven to rotate at a high speed, and a uniform resist film is formed on the surface of the substrate W. afterwards,
The nozzle arm 444 moves in the + X direction, returns to the standby position, and ends a series of processing.

The plurality of nozzles are provided in the processing units 400A and 400B in order to discharge and supply different processing liquids to the substrate W in accordance with processing contents.

[0009]

In each of the conventional processing units 400A and 400B as described above, when each nozzle is moved to the discharge position, the nozzle is moved to the designed rotation center position of the substrate W. ing. However, even if the nozzle is moved to the designed rotation center position due to an assembly error or the like, the discharge position where the nozzle has actually moved may not be located at the actual rotation center position. When the processing liquid is supplied to the substrate W from the discharge position shifted from the rotation center position, uneven processing is performed on the substrate surface, which causes a problem.

Therefore, when processing the substrate by supplying the processing liquid to the substrate W, it is necessary to perform uniform processing over the entire surface of the substrate. The discharge position of the nozzle must be strictly adjusted in advance.

Conventionally, prior to performing the treatment with the treatment liquid,
The operator has to manually adjust the nozzle discharge position visually while moving the nozzle to the discharge position and discharging the processing liquid from the nozzle at that position. Then, the ejection position must be individually adjusted for each of the plurality of nozzles provided in each processing unit.

However, such manual adjustment by the operator for each nozzle imposes a burden on the operator, requires a long adjustment time, and has a problem that accurate adjustment of the ejection position cannot be performed. Further, the manual adjustment also causes a variation in the ejection position for each of the plurality of nozzles.

Accordingly, a first object of the present invention is to specify a position where a nozzle has actually moved, and a second object of the present invention is to adjust a discharge position of a nozzle accurately and efficiently in a short time. I do.

[0014]

According to one aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate by supplying a processing solution, comprising: A nozzle for discharging the processing liquid to the substrate, and (b)
Nozzle driving means for moving the nozzle to the discharge position based on predetermined reference position information, and (c) nozzle position specifying means for specifying the nozzle position where the nozzle is actually located when the nozzle is moved to the discharge position Have.

According to a second aspect of the present invention, there is provided the substrate processing apparatus according to the first aspect, further comprising: (d) substrate transport means for holding and transporting the substrate during substrate processing; In a state where a predetermined jig is held by the transfer means instead of the substrate, the jig is brought close to the nozzle moved to the discharge position until a predetermined relative positional relationship is established, and in the close state, the substrate transfer means And a conveyance control unit that moves the jig in a plurality of different directions by driving the nozzle. The nozzle position specifying unit is configured to determine a position of the nozzle based on an output obtained from a nozzle detection sensor attached to the jig in each of the plurality of directions. The nozzle position is specified by the following method.

According to a third aspect of the present invention, there is provided the substrate processing apparatus according to the first aspect, further comprising: (d) a plurality of sensors for detecting nozzles in different directions when the nozzles move to the ejection position. Wherein the nozzle position specifying means specifies the nozzle position when the nozzle is moved to the discharge position based on outputs from a plurality of sensors.

According to a fourth aspect of the present invention, there is provided the substrate processing apparatus of the first aspect, further comprising: (d) correcting means for correcting the reference position information based on the nozzle position.

According to a fifth aspect of the present invention, there is provided the substrate processing apparatus according to the fourth aspect, further comprising: (e) substrate transport means for holding and transporting the substrate during substrate processing; In a state where a predetermined jig is held by the transfer means instead of the substrate, the jig is brought close to the nozzle moved to the discharge position until a predetermined relative positional relationship is established, and in the close state, the substrate transfer means And a conveyance control unit that moves the jig in a plurality of different directions by driving the nozzle. The nozzle position specifying unit is configured to determine a position of the nozzle based on an output obtained from a nozzle detection sensor attached to the jig in each of the plurality of directions. The correction means corrects the reference position information based on the nozzle position and gives the reference position information to the nozzle driving means.

According to a sixth aspect of the present invention, there is provided the substrate processing apparatus according to the fourth aspect, further comprising: (e) a plurality of sensors for detecting the nozzle when the nozzle moves to the ejection position in a plurality of different directions. The nozzle position specifying means specifies the nozzle position when the nozzle is moved to the discharge position based on the output from the plurality of sensors, and the correcting means corrects the reference position information based on the nozzle position and drives the nozzle. It is characterized by giving to means.

According to a seventh aspect of the present invention, in the substrate processing apparatus according to any one of the first to sixth aspects, the nozzle driving means (b-1) moves the nozzle to a position near the discharge position. And (b-2) a second drive mechanism for moving a nozzle near the discharge position in a plurality of directions in a plane parallel to the substrate surface based on the reference position information.

The invention according to claim 8 is a substrate processing method for performing a predetermined processing on a substrate by supplying a processing liquid, wherein (a) a nozzle for discharging the processing liquid is set based on predetermined reference position information. (B) moving the nozzle to the discharge position to specify the nozzle position where the nozzle is actually located when the nozzle is moved to the discharge position;
Correcting the reference position information based on the nozzle position.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <1. Overall Configuration of Substrate Processing Apparatus>
First, the overall configuration of the substrate processing apparatus will be described. FIG.
1 is a perspective view of a substrate processing apparatus 100 according to an embodiment of the present invention. The substrate processing apparatus 100 includes an indexer unit 5A for carrying out and carrying in the substrate W, and a unit arrangement unit 5B for performing various processes on the substrate W.

In the indexer section 5A, the substrate W is carried in and out of the unit arrangement section 5B from a carrier 19 accommodating a plurality of substrates W in a horizontal position, and a plurality of carriers 19 are arranged. ing. A transfer robot TR1 is provided in the indexer unit 5A.
Are taken out one by one, or the substrate W is stored in the carrier 19.

The unit arrangement section 5B includes a processing section (spin coater) 61 for forming a resist film on the substrate surface using a resist as a processing liquid, and a developing processing of the substrate W using a developing liquid as a processing liquid. Processing units (spin developers) 63 and 65 to perform, a plurality of hot plates HP for performing a heating process, and a plurality of cool plates CP for performing a cooling process
And a substrate transfer robot TR2 for holding and transferring the substrate W
Are provided.

The substrate transport robot TR2 has a configuration as shown in FIG. As shown in FIG. 2, the substrate transport robot TR2 is provided on a base 74 movable along the X-axis by a male screw 77 and a guide rail 76, and includes a motor or the like connected to one end of the male screw 77. It is possible to move in the ± X direction by the X-axis drive mechanism. Also, a fixing member 71d attached to the base 74
Is provided with a Z-axis driving mechanism, which is a Z-axis direction elevating mechanism (not shown). By this elevating mechanism, the elevating members 71a to 71c perform the elevating operation. Also, the fixing member 7
A rotation drive mechanism is provided inside 1d so that the substrate transport robot TR2 can be rotated about a predetermined vertical axis. With such mechanisms, the substrate transport robot TR2 can move to a position facing each of the processing units 61, 63, 65, the hot plate HP, and the cool plate CP.

Two transfer arms 70a and 70b are provided at the uppermost portion of the substrate transfer robot TR2, and each of the transfer arms 70a and 70b can independently bend and extend in a predetermined direction. It is configured to be able to. By this bending and stretching operation, the substrate transport robot TR
2 is a hot plate H inside the processing units 61, 63 and 65.
The substrate W can be transported inside the P or the cool plate CP. In the following, a mechanism for bending and extending the transfer arms 70a and 70b is referred to as a Y-axis drive mechanism.

Returning to FIG. 1, the processing units 61, 63, and 65 use different processing liquids, but have the same structure for discharging and supplying the processing liquid to the substrate W from the nozzles.

Hereinafter, the configuration of the processing section 61 will be described as an example. FIG. 3 shows a processing unit 6 according to the embodiment of the present invention.
1 is a side view showing a schematic configuration of FIG. FIG. 4 is a plan view of the processing unit 61 according to the embodiment of the present invention.

As shown in FIG. 4, inside the processing section 61, a mechanism for performing a predetermined processing by rotating the substrate W inside the scattering prevention cup 2 and a processing liquid for the substrate W are provided. And a mechanism for moving the nozzle to a predetermined discharge position when the liquid is supplied.

A mechanism for performing a predetermined process has the following configuration. The spin chuck 1 that holds the substrate W by suction so as to be integrally rotatable is disposed inside the scattering prevention cup 2. As shown in FIG. 3, the spin chuck 1 is attached to the upper end of a rotating shaft 4 that rotates around a vertical axis by driving a motor 3 fixed to the bottom of a processing unit 61. The scattering prevention cup 2 is provided for recovering the scattered processing liquid when the substrate W to which the processing liquid is discharged and supplied is rotated at a high speed, and can be moved up and down by a lifting mechanism (not shown). I have.

The mechanism for moving the nozzle to a predetermined discharge position has the following configuration. As shown in FIG. 3, a two-axis driving mechanism 54 is fixed to the bottom of the processing unit 61. The two-axis drive mechanism functions as a second drive mechanism, and can move the fan-shaped table 10 provided on the upper part freely in two directions orthogonal to the X direction and the Y direction. The fan-shaped table 10 has a nozzle 6 for discharging the processing liquid.
A nozzle arm driving mechanism serving as a first driving mechanism for displacing a nozzle arm 7 provided at a tip end portion between a standing posture and a recumbent posture, thereby moving the nozzle 6 near a predetermined discharge position above the substrate W. 53 are arranged. Further, these nozzle arm driving mechanisms 53 are provided in FIG.
The spin chuck 1 is placed on the fan-shaped table 10 as shown in FIG.
Are arranged in an arc around the rotation center of
The nozzles 6 provided at the tip of each nozzle arm 7 are all arranged so as to face the center of rotation.

The two-axis drive mechanism 54 serving as the second drive mechanism includes:
Drive system support member 11a fixed to the bottom of processing section 61
An X-direction member 11b movably mounted in the X-direction with respect to the drive system support member 11a; and a Y-direction mounted on the X-direction member 11b and movable in the Y-direction orthogonal to the X-direction. And a member for use 11c. Further, the X-direction member 11b is
-Axis motor 1 for moving the camera to an arbitrary position in the X direction
2a, so that the rotational force of the X-axis motor 12a is transmitted to the X-direction member 11b via a screw feed mechanism (not shown). The Y-direction member 11c is similarly configured, but the Y-axis motor 12b is
It is attached in a direction orthogonal to 2a.

A fan-shaped table 10 is mounted on the upper surface of the Y-direction member 11c so as to be integrally movable.
By driving the X-axis motor 12a and the Y-axis motor 12b, the fan-shaped table 10 can be moved in the X and Y directions. Can be moved to a position.

The two-axis driving mechanism 54 is provided to move and adjust the discharge position of the nozzle 6 in the XY plane based on reference position information, which will be described later, after the nozzle 6 has been moved to the vicinity of the discharge position by the nozzle arm driving mechanism 53. Have been.

The nozzle arm driving mechanism 53 serving as the first driving mechanism includes a cam follower 7b provided at a position off the center of the swing displacement on the base end side of the nozzle arm 7, and a cam groove 13a for receiving the cam follower 7b. A nozzle arm guide member 13 formed with a nozzle arm, a nozzle arm support member 9 for supporting the nozzle arm 7 so as to be swingable by an arm swing shaft 7a provided on the base end side of the nozzle arm 7, and a nozzle arm An air cylinder 8 drives the support member 9 up and down.

The operation of moving the nozzle 6 to a position near the discharge position of the substrate W will be described. First, the rod of the air cylinder 8 is contracted, and the nozzle arm 7 is in a standing posture in a standby state. In this state, the nozzle 6 is accommodated in the standby pot 14 fixed to the sector table 10.
When moving the nozzle 6 to the discharge position of the substrate W, the air cylinder 8 is driven to extend the rod. As the rod of the air cylinder 8 extends, the nozzle arm support member 9 rises, and the arm swing shaft 7a on the base end side of the nozzle arm 7 rises. The cam follower 7b also rises with the elevation of the nozzle arm support member 9, but the trajectory of the rise of the cam follower 7b follows the cam groove 13a. The cam groove 13a is provided in the nozzle arm guide member 1
3 is formed so as to be directed outward (in the X direction) toward the upper side. Therefore, as the nozzle arm support member 9 rises, the cam follower 7b performs a counterclockwise operation about the arm swing shaft 7a. As a result, the nozzle arm 7 changes from the standing posture, which is a standby state, to the reclining posture, with the elevation of the nozzle arm support member 9, and can move the nozzle 6 to the discharge position above the substrate W.

The substrate processing apparatus 10 according to this embodiment
0 has the above-described configuration, specifies the nozzle position when each nozzle 6 in the processing unit 61 actually moves to the vicinity of the discharge position, and accurately and efficiently outputs the nozzle discharge position in a short time. A detailed embodiment for performing the adjustment will be described below.

In each of the following embodiments, an example in which the discharge position of the nozzle is the center of rotation of the substrate W will be described as an example, but the present invention is not limited to such an example.

<2. First Embodiment> In this embodiment, a jig is mounted on a processing unit 6 while the substrate transfer robot TR2 holds a predetermined jig on which a nozzle detection sensor is mounted.
1 when the nozzle 6 is moved to the discharge position, the nozzle position where the nozzle 6 is actually located is specified, and the discharge position of the nozzle 6 is automatically adjusted. In this embodiment, it is assumed that the position adjustment when the substrate transport robot TR2 accesses each processing unit has already been completed.

FIG. 5 shows a jig 2 used in this embodiment.
FIG. 5A is a plan view of the jig 210 as viewed from above, and FIG. 5B is a cross-sectional view taken along the line BB in the plan view of FIG.

As shown in FIG. 5, the jig 210 includes a substrate W
And a thin plate-shaped main body 211 having a circular shape substantially the same as that of the main body 211. The main body 211 is formed with a circular opening 220 having a predetermined diameter. The opening 2
The center of the body 20 and the center of the main body 211 are configured to coincide with each other. The main body 211 of the jig 210 is not limited to a circular shape, and may have any shape as long as it can be held by the transfer arms 70a and 70b of the substrate transfer robot TR2.

The main body 211 includes light emitting units 231 and 241
And light receiving units 232 and 242 are provided.
One transmission-type optical sensor is formed by 31 and the light-receiving unit 232, and another transmission-type optical sensor is similarly formed by the light-projecting unit 241 and the light-receiving unit 242. These transmission optical sensors are called nozzle detection sensors. The dotted lines shown in FIG. 5 indicate the optical axes of these nozzle detection sensors, and the two optical axes of the two nozzle detection sensors are attached so as to be orthogonal to each other at the center of the opening 220.

The light projecting units 231 and 241 and the light receiving unit 23
2 and 242 are connected to drive the cable 21
2 are transfer arms 70a, 7 of the substrate transfer robot TR2.
0b.

FIG. 6 is a block diagram showing a control mechanism of the substrate processing apparatus 100 according to this embodiment.
FIG. 6 shows the jig 210 as described above.
FIG. 10 is a block diagram showing a state where the transfer arm is set on one of the transfer arms of R2.

As shown in FIG. 6, the substrate processing apparatus 10
As the zero control mechanism, three control units, that is, a main control unit 30, a transport control unit 40, and a processing control unit 50 are provided.

The main control section 30 is a control section for controlling the transport control section 40 and the processing control section 50 in an integrated manner.
A U31, a display unit 32, and an operation input unit 33 are provided.
The display unit 32 is for displaying processing information and displaying an alarm to the operator.
Is for the operator to input a processing command or the like. The CPU 31 includes the transport control unit 40 and the process control unit 5
An operation command or the like is sent to 0.

The transfer control section 40 functions as transfer control means, and controls the transfer operation of the substrate transfer robot TR2. This transport control unit 40
A U41, an X-axis drive unit 42, a Y-axis drive unit 44, and encoders 43 and 45 are provided. In addition, a driving unit for the rotation operation and the elevating operation of the substrate transport robot TR2 is provided, but is omitted in FIG. The CPU 41 gives a drive command to the X-axis drive unit 42 and the Y-axis drive unit 44, and can acquire the current position where the transfer arms 70a, 70b of the substrate transfer robot TR2 are located from the encoders 43, 45. Further, the CPU 41 is connected to nozzle detection sensors 230 and 240, and is configured to be able to acquire outputs from the respective light receiving units 232 and 242.

The processing control section 50 functions as nozzle driving means, and is a control section for driving the nozzle 6 in the processing section 61. The processing control unit 50 includes the CPU 5
1, a RAM 52, a nozzle arm drive mechanism 53, and a two-axis drive mechanism 54. When moving the nozzle 6 to the ejection position, the CPU 51 acquires reference position information from the RAM 52 and outputs a drive command to the nozzle arm drive mechanism 53 and the two-axis drive mechanism 54 based on the reference position information. If the reference position information is in a state before the later-described correction is performed, whether the initial value “0” is stored,
Alternatively, a theoretical value derived from a design value is initially stored as a movement amount when the nozzle 6 is moved to the ejection position. Further, as shown in FIG. 4, when a plurality of nozzles are provided in the processing unit, the reference position information is set for each nozzle.

A process for adjusting the nozzle discharge position with the above configuration will be described. 7 to 10
9 is a flowchart showing a processing sequence for adjusting the nozzle ejection position.

As shown in FIG. 7, first, in step S1, the operator selects a processing unit for adjusting the discharge position of the nozzle. Here, the operator selects the processing unit 61 to be adjusted and inputs an instruction from the operation input unit 33.

When the processing unit 61 is designated in step S1, the CPU 31 of the main control unit 30
0, the substrate transfer robot TR2 is moved to a position facing the processing unit 61, and a command is issued to extend one of the two transfer arms, for example, the transfer arm 70a, into the processing unit 61.

When the CPU 41 of the transfer control unit 40 receives a command from the main control unit 30, the substrate transfer robot TR
2 to drive the substrate transport robot TR2 to a position facing the processing unit 61, and extend the transport arm 70a into the processing unit 61 (step S2). At this time, the height position of the transfer arm 70a is set to a position approximately several mm higher than the height position at which the substrate W is placed on the spin chuck 1. When the nozzle 6 is moved to the discharge position in a later process, the height position is determined by the jig 21.
It is sufficient that the height position is such that it can enter the inside of the opening 220 provided at 0.

Next, the operator sets the jig 210 on the transfer arm 70a extending inside the processing section 61 (step S3). This state is shown in FIG. As shown in FIG. 11, when setting the jig 210 on the transfer arm 70a, the jig 210 is set so that the optical axes of the nozzle detection sensors 230 and 240 are parallel to the Y axis and the X axis, respectively.

When the setting of the jig 210 is completed, the operator selects the nozzle 6 for adjusting the ejection position from the plurality of nozzles 6 provided, and inputs the setting from the operation input unit 33 of the main control unit 30 ( Step S4).

When the designation of the nozzle 6 is performed, step S
Automatic adjustment 5 is started. The details of the automatic adjustment processing in step S5 are shown in the flowchart of FIG.

When the automatic adjustment is started, the main control unit 3
0 tells the process control unit 50 which nozzle 6 is selected. The CPU 51 of the processing control unit 50
The reference position information of the designated nozzle 6 is read from the RAM 52, and a drive command is sent to the nozzle arm drive mechanism 53 and the two-axis drive mechanism 54 based on the reference position information. By this operation, the nozzle 6 moves to the ejection position based on the preset reference position information before adjustment (step S51). At this time, the height relationship between the nozzle 6 and the jig 210 is as shown in FIG.

Then, in step S52, the nozzle position on the Y axis where the nozzle 6 moved in step S51 is actually located is specified. The main control unit 30 instructs the transport control unit 40 to perform a process for specifying the nozzle position on the Y axis. Then, the process of step S52 is performed in the transport control unit 40. The details of the process of specifying the Y-axis position in step S52 are shown in the flowchart of FIG.

To specify the nozzle position on the Y axis, first, in step S201, the CPU of the transport control unit 40
41 outputs a drive command to the Y-axis drive unit 44 to move the transfer arm 70a of the substrate transfer robot TR2 by about several tens of mm in the −Y direction. The amount of movement here may be such that the nozzle 6 does not exist in the optical path between the light projecting unit 241 and the light receiving unit 242 of the nozzle detection sensor 240 as shown in FIG. Then, the CPU 41 executes the nozzle detection sensor 24
Check the output of 0. Note that the nozzle detection sensor 230,
At 240, if the light receiving units 232 and 242 are receiving light from the light projecting unit, the output is “OFF”, and if not, “ON” is output.

Then, in step S202, if the output of the nozzle detection sensor 240 confirmed in step S201 is "ON", a message indicating an abnormality is sent to the main control unit 30. CPU of main control unit 30
When receiving the abnormal message, the alarm 31 generates an alarm and notifies the operator of the abnormality. On the other hand, step S20
The output of the nozzle detection sensor 240 confirmed in step 1 is “OF
If “F”, it means that the nozzle 6 does not exist in the optical path between the light projecting unit 241 and the light receiving unit 242, and the process proceeds to step S203.

In step S203, the CPU 41 of the transfer control unit 40 sends the transfer arm 70a to the Y-axis drive unit 44.
Is transmitted at a high speed in the + Y direction, and the output of the nozzle detection sensor 240 is set to “OFF”.
The change from the state to the “ON” state is monitored. By this processing, the jig 210 moves at a high speed in the + Y direction, and the CPU 41 keeps monitoring the output of the nozzle detection sensor 240 during the movement.

Then, the CPU 41 operates the nozzle detection sensor 2
When recognizing that the output of the switch 40 has changed from “OFF” to “ON”, the transport arm 70 a
Then, a command is output to immediately stop the high-speed movement (step S204). Here, since the transfer arm 70a is operating at a high speed, the detection point (optical axis) of the nozzle detection sensor 240 has moved further inward from the edge portion of the nozzle 6 even if it is immediately stopped.

Then, in step S205, the CPU 41 of the transport control section 40 gives a command to the Y-axis drive section 44 to further move the transport arm 70a by about several mm in the + Y direction. That is, the jig 210 is moved in the + Y direction so that the nozzle 6 is moved to a position where the light from the nozzle detection sensor 240 is completely blocked. Therefore, the output of the nozzle detection sensor 240 at the time when this step S205 ends is in the “ON” state.

In step S 206, the CPU 41 of the transfer control section 40 sends the transfer arm 70 to the Y-axis drive section 44.
a is sent at a low speed in the −Y direction, and the output of the nozzle detection sensor 240 is turned “ON”.
The change from the state to the “OFF” state is monitored. By this processing, the jig 210 moves at a low speed in the −Y direction, and the CPU 41 keeps monitoring the output of the nozzle detection sensor 240 during the movement.

Then, the CPU 41 detects the nozzle detection sensor 2
When recognizing that the output of the switch 40 has changed from “ON” to “OFF”, the transfer arm 70 a
A command is output to immediately stop the low-speed movement of the transfer arm 70a, and the current position YR on the Y-axis of the transfer arm 70a is obtained from the encoder 45 (step S207).

FIG. 14 is a diagram showing the movement of the detection point as the jig 210 moves. Since the detection point of the nozzle detection sensor 240 moves in the −Y direction at a low speed in step S206, the detection point immediately stopped in step S207 is the current position Y shown in FIG.
It is located at R.

Next, in step S208, the CPU 41 of the transfer control section 40 gives a command to the Y-axis drive section 44 to move the transfer arm 70a again by about several mm in the + Y direction. That is, the jig 210 is moved in the + Y direction so that the nozzle 6 is moved to a position where the light from the nozzle detection sensor 240 is completely blocked. Therefore, the output of the nozzle detection sensor 240 at the time when this step S208 is completed is turned on again.

In step S 209, the CPU 41 of the transfer control unit 40 sends the transfer arm 70 to the Y-axis drive unit 44.
a is sent at a low speed in the + Y direction, and the output of the nozzle detection sensor 240 is turned “ON”.
The change from the state to the “OFF” state is monitored. By this processing, the jig 210 moves at a low speed in the + Y direction, and the CPU 41 continues to monitor the output of the nozzle detection sensor 240 during the movement.

Then, the CPU 41 detects the nozzle detection sensor 2
When recognizing that the output of the switch 40 has changed from “ON” to “OFF”, the transfer arm 70 a
A command is output to immediately stop the low-speed movement of the transfer arm 70a, and the current position YF on the Y-axis of the transfer arm 70a is obtained from the encoder 45 (step S210).

Since the detection point of the nozzle detection sensor 240 moves in the + Y direction at a low speed in step S209, the detection point when immediately stopped in step S210 is located at the current position YF shown in FIG.

Then, in step S211, the CPU 41 of the transport control section 40 sends a command to the Y-axis drive section 44 to move the transport arm 70a to the position of "YR + (YF-YR) / 2". Here, “YR +
The position represented by “(YF−YR) / 2” is the center position Ny on the Y axis of the nozzle 6 as shown in FIG. Therefore, the center position Ny on the Y axis is the nozzle position on the Y axis where the nozzle 6 is actually located, and is expressed as “YR + (YF−Y
R) / 2 ", the nozzle position Ny can be specified.

Thus, the process of specifying the position of the Y axis (step S52) shown in FIG. 8 is completed, and then the process of specifying the position of the X axis (step S53) is performed. That is, in step S53, the nozzle 6 moved in step S51 specifies the nozzle position on the X axis that is actually located. The main control unit 30 instructs the transport control unit 40 to perform a process for specifying the nozzle position on the X axis. Then, in the transfer control unit 40, step S53 is performed.
Is performed.

FIG. 10 is a flowchart showing details of the X-axis position specifying process in step S53. In the process of specifying the position of the X axis, the axis direction in which the substrate transport robot TR2 is moved is the X axis direction, and the sensor used for detecting the nozzle position is the nozzle detection sensor 230. This is the same as the processing for specifying the Y-axis position shown in FIG. Therefore, the description of each step in FIG. 10 will be omitted, and an outline of the X-axis position specifying process will be described with reference to FIG.

As shown in FIG. 14, the substrate transfer robot T
While the jig 210 is held by the transfer arm 70a of R2, the jig 210 is moved at a low speed along the X-axis, and the current position XR of the -X direction edge portion of the nozzle 6 and the current position XF of the + X direction edge portion of the nozzle 6 Is detected, and X that is actually located at the nozzle 6 is detected.
The nozzle position Nx on the axis is specified.

When the nozzle position of the nozzle 6 on the X and Y axes is specified in this way, the transport control unit 40 sends a command to the main control unit 30 at step S4 (see FIG. 7). This indicates that the specification of the nozzle position when the nozzle 6 has been moved to the ejection position has been completed.

When the processing of steps S52 and S53 is performed by the transfer control unit 40, the transfer control unit 40
It will function as nozzle position specifying means.

Next, the process proceeds to the step S54 in FIG. In step S54, the main control unit 30 instructs the process control unit 50 to return the nozzle 6 being moved to the ejection position to the standby position. With this instruction,
The CPU 51 of the processing control unit 50 sends a driving command to the nozzle arm driving mechanism 53 and the two-axis driving mechanism 54, and performs an operation of returning the nozzle 6 at the ejection position to the standby position.

Next, the CPU 31 of the main control unit 30
The specified nozzle positions Nx and Ny are received from the transport control unit 40, and a correction value for the reference position information of the nozzle 6 is derived (step S55). Substrate transfer robot TR
2 has already completed the position adjustment when accessing each processing unit, so that the nozzle positions Nx and Ny are accurate position information. Therefore, if the reference position information of the nozzle 6 is corrected based on these nozzle positions Nx and Ny, it is possible to eliminate the influence of an assembly error and the like.

Then, the main control unit 30 determines in step S
The correction value derived at 55 is sent to the processing control unit 50.

When the CPU 51 of the processing control unit 50 receives the correction value sent from the main control unit 30, it corrects the reference position information of the nozzle 6 stored in the RAM 52 (step S56). At this time, the CPU 51 of the processing control unit 50 functions as a correction unit. Then, by the processing up to this point, the automatic adjustment (step S5) of the nozzle 6 selected in step S4 of FIG. 7 is completed.

Then, proceeding to step S6, the operator determines whether or not to adjust another nozzle provided in the processing section 61. If adjustment is to be performed on other nozzles, the process of selecting a nozzle to be adjusted (step S4) and automatic adjustment (step S5) are repeated after returning TR2 to the access position of the processing unit. If the adjustment of other nozzles is not performed, the process proceeds to step S7, and the processing unit 6
The jig 210 is removed from the transfer arm 70a extended to the inside of the unit 1 and the completion of the automatic adjustment of the nozzle of the processing unit 61 is input from the operation input unit 33. As a result, the substrate transport robot TR2 retreats from the processing unit 61.

Thus, the processing for adjusting the discharge position of the nozzle is all completed. By performing the above-described processing, the reference position information stored in the RAM 52 of the processing control unit 50 is moved not to the position information derived from the design value but to an ejection position suitable for substrate processing. The position information can be corrected. Therefore, when the processing liquid is actually discharged to the substrate W, if the nozzle 6 is moved based on the corrected reference position information, an appropriate processing liquid can be supplied to the substrate W. it can. The processing unit 6
1 is provided with a two-axis driving mechanism 54, so that the fine adjustment of the ejection position of the nozzle 6 in the XY plane
4 can be in charge.

In the above processing contents, the jig 210 is used instead of the substrate W and the transfer arm 70 of the substrate transfer robot TR2.
a while the nozzle 6 is moved to the ejection position.
The jig 210 is brought close to a predetermined relative positional relationship with the substrate transfer robot TR in the close state.
2, the jig 210 is moved in the X direction and the Y direction, respectively, and the nozzle detection sensors 230 and 230 attached to the jig 210 in the X direction and the Y direction, respectively.
The nozzle position is specified based on the output obtained from 240.

Therefore, even if the process of correcting the reference position information is not performed, the nozzle position where the nozzle is currently located can be specified. Can determine whether the ejection position where the nozzle actually moves is an appropriate ejection position prior to the substrate processing. In this case,
By generating an alarm or the like, generation of a defective board can be avoided.

As described above, according to the substrate processing apparatus 100 shown in this embodiment, it is possible to specify the position where the nozzle has actually moved, and it is possible to accurately and quickly reduce the burden on the operator. Thus, the automatic adjustment of the discharge position of the nozzle can be efficiently performed.

Since the nozzle ejection position is automatically adjusted based on the accurate position information of the substrate transfer robot TR2, appropriate reference position information is provided for each of the plurality of nozzles provided in the processing unit 61. Can be set, and the ejection position for each nozzle does not vary.

<3. Second Embodiment> In this embodiment, a plurality of area sensors are mounted inside each processing unit, and the nozzle positions where the nozzles 6 are actually located are specified in different directions of the area sensors. In this embodiment, it is assumed that the position adjustment of the area sensor itself has already been completed. In the following, the processing unit 61 will be described as an example.

FIG. 15 is a plan view showing a processing section 61 of this embodiment. As shown in FIG. 15, in this embodiment, light-emitting units 251 and 261 that emit laser light while scanning them in an XY plane are provided inside a processing unit 61.
And light receiving units 252 and 262 that receive the laser beams from the light projecting units 251 and 261 are provided. Floodlight unit 251
And the light receiving unit 252 form one area sensor 250, and the light projecting unit 261 and the light receiving unit 262 form one area sensor 260.

FIG. 16 is a block diagram showing a processing control section 50 which is a control mechanism of the processing section 61 in this embodiment. As shown in FIG. 16, the processing control unit 50
A U51, a RAM 52, a nozzle arm driving mechanism 53, a two-axis driving mechanism 54, and area sensors 250 and 260 are provided. The CPU 51 controls the area sensors 250 and 26
It is configured to input an output from 0.

The other control mechanisms are the same as those shown in FIG. 6, but in this embodiment, since the area sensor is provided in the processing section 61, the transport control section 4
No sensor is connected to 0.

FIG. 17 is an explanatory diagram of a method for specifying the nozzle position where the nozzle 6 is actually located in this embodiment. As shown in FIG. 17, the light projecting unit 251 of the area sensor 250 scans laser light in the α direction, and the light projecting unit 261 of the area sensor 260 scans laser light in the β direction.

It is assumed that when the nozzle 6 is moved to the ejection position based on the preset reference position information, the nozzle position becomes as shown in FIG. At this time, the CPU 5
When 1 operates each of the area sensors 250 and 260, there is a position where the laser light is blocked by the nozzle 6, so that the signals obtained by the respective light receiving units 252 and 262 are like Sα and Sβ, respectively.

The CPU 51 receives the signals Sα and Sβ. Then, the CPU 51 determines the center position Nα where the nozzle 6 is located on the α-axis based on the change point of each signal Sα, Sβ.
And the center position Nβ where the nozzle 6 on the β axis is located.

In general, it is possible to convert coordinates obtained for an arbitrary rectangular coordinate system into coordinates for another rectangular coordinate system on the same plane by a simple calculation.

Therefore, the CPU 51 converts the nozzle position (Nα, Nβ) obtained in the αβ coordinate system into the nozzle position (Nx, Ny) in the XY coordinate system, so that the nozzle 6 where the nozzle 6 is actually located is The position can be specified. When the αβ coordinate system is converted to the XY coordinate system, the driving direction of the two-axis driving mechanism for finely adjusting the ejection position of the nozzle 6 also matches, so that it is easy to handle as a control amount.

The CPU 51 determines the nozzle position (N
x, Ny) can be specified.
May be corrected.

In this embodiment, two area sensors 250 and 260 are attached.
These need to be arranged to detect nozzles in different directions.

As described above, in this embodiment, each processing section is provided with a plurality of area sensors for detecting the nozzles in a plurality of different directions when the nozzles move to the discharge position. The nozzle position when the nozzle is moved to the ejection position is specified by the output from the area sensor.

Therefore, also in this embodiment, the nozzle position where the nozzle is currently located is specified, and the ejection position of the nozzle is appropriately determined due to an assembly error or the like, even if the process of correcting the reference position information is not particularly performed. In the case of a deviation from a proper discharge position, it is possible to determine whether or not the discharge position where the nozzle actually moves is an appropriate discharge position prior to the substrate processing. In this case, the generation of a defective board can be avoided by generating an alarm or the like.

As described above, according to the substrate processing apparatus 100 shown in this embodiment, it is possible to specify the position where the nozzle has actually moved, and it is possible to accurately and quickly reduce the burden on the operator. Thus, the automatic adjustment of the discharge position of the nozzle can be efficiently performed.

Also, since the nozzle ejection position is automatically adjusted based on the signals detected by the area sensors 250 and 260 adjusted to the correct positions, each of the plurality of nozzles provided in the processing unit 61 , Appropriate reference position information can be set, and there is no variation in the ejection position for each nozzle.

In this embodiment, the CPU
It goes without saying that 51 functions as a nozzle position specifying unit and a correcting unit.

<4. Third Embodiment> In this embodiment, a plurality of movable sensors are mounted inside each processing unit, and the nozzle position where the nozzle 6 is actually located is specified in each sensor in a different direction. . Note that, also in this embodiment, it is assumed that the position adjustment of each sensor itself has already been completed. In the following, the processing unit 61 will be described as an example.

FIG. 18 is a plan view showing a processing section 61 of this embodiment. As shown in FIG. 18, in this embodiment, inside the processing unit 61, light projecting units 271 and 281 that emit laser light and the like in the XY plane, and light projecting units 27
Light receiving units 272 and 282 that receive light from the light sources 1 and 281 are provided. The light emitting unit 271 and the light receiving unit 272 are 1
Sensors 270 are formed, and the light projecting unit 281 and the light receiving unit 28
2 forms one sensor 280.

The light projecting portion 271 and the light receiving portion 272 are provided so as to be movable along the Y axis by the rotation of the male screws 291 and 292, respectively. Here, by synchronizing the rotation operations of the male screws 291 and 292, the nozzle detection sensor 240 shown in the first embodiment can be used.
(See FIG. 11).

The light projecting unit 281 and the light receiving unit 282 are
The male screws 293 and 294 are provided so as to be movable along the X axis by rotating. Also in this case, by synchronizing the rotation operations of the male screws 293 and 294, the same function as that of the nozzle detection sensor 230 (see FIG. 11) shown in the first embodiment can be realized.

Therefore, also in this embodiment, in the state where the light projecting unit 271 and the light receiving unit 272 and the light projecting unit 281 and the light receiving unit 282 are respectively synchronized, the operation is the same as that described in the first embodiment. By performing the above operation, the nozzle position can be specified, and the discharge position of the nozzle can be automatically adjusted. That is, also in the substrate processing apparatus 100 of this embodiment, the position where the nozzle has actually moved can be specified, and the discharge of the nozzle can be performed accurately and efficiently in a short time without putting a burden on the operator. Automatic position adjustment can be performed.

When the sensor is moved by a male screw as in this embodiment, it is necessary to avoid interference between the sensor and the transfer arm of the substrate transfer robot TR2 when transferring the substrate W. It is preferable that the male screw 293 is made sufficiently long so that the sensor is retracted to a region where the transfer of the substrate is not affected.

<5. Modification> In each of the above-described embodiments, as shown in FIG. 3, the nozzle 6 is moved to the vicinity of the discharge position by changing the nozzle arm 7 from the standing posture to the recumbent posture, and the two-axis drive is performed. A technique for automatically adjusting the ejection position of the nozzle 6 is applied to a processing unit configured so that the mechanism 54 finely adjusts the ejection position of the nozzle 6 based on the reference position information.

However, the configuration of each processing unit is not limited to such a configuration.

For example, the conventional processing unit 4 shown in FIG.
The technique for automatically adjusting the ejection position of the nozzle described in each of the above embodiments can also be applied to 00A. That is, the four nozzle arms 42 shown in FIG.
If the movable tables 1 to 424 are arranged on a movable table, and the movable table is configured to be movable in the XY plane by a two-axis driving mechanism, the automatic adjustment of each of the above embodiments can be applied. Further, if the purpose is merely to specify the nozzle position without performing the automatic adjustment, the technique of directly specifying the nozzle position in each embodiment may be applied to the processing unit 400A shown in FIG. it can.

The conventional processing unit 40 shown in FIG.
The technology for automatically adjusting the ejection position of the nozzle described in each of the above embodiments can also be applied to 0B. In this case, the processing unit 400 </ b> B
4 can be independently moved in the X direction and the Y direction, so that the automatic adjustment of each of the above embodiments can be applied without newly providing a two-axis drive mechanism. . It is needless to say that the technique of specifying the nozzle position in each embodiment can be applied.

[0112]

As described above, according to the first aspect of the present invention, the nozzle for discharging the processing liquid to the substrate and the nozzle for moving the nozzle to the discharge position based on predetermined reference position information. Since it includes a driving unit and a nozzle position specifying unit that specifies a nozzle position where the nozzle is actually located when the nozzle is moved to the discharge position, the nozzle position can be specified. It is possible to determine whether or not the position of the nozzle when the nozzle has moved is at an appropriate ejection position. Further, by specifying the nozzle position, it is possible to avoid the occurrence of a defective substrate.

According to the second aspect of the present invention, when a predetermined jig is held by the substrate transfer means instead of the substrate,
By moving the jig close to the nozzle moved to the ejection position until a predetermined relative positional relationship is obtained, and driving the substrate transfer means in the close state, the jig is moved in a plurality of different directions, Since the nozzle position is specified based on the output obtained from the nozzle detection sensor attached to the jig in each of a plurality of directions, the efficiency can be accurately and quickly reduced without providing a sensor in the substrate processing apparatus. The position where the nozzle has actually moved can be specified.

According to the third aspect of the present invention, the nozzle position specifying means is configured to specify the nozzle position when the nozzle is moved to the discharge position based on outputs from a plurality of sensors provided in the apparatus. Therefore, the position where the nozzle has actually moved can be specified accurately and efficiently in a short time.

According to the fourth aspect of the present invention, since the reference position information is corrected based on the specified nozzle position, it becomes possible to adjust the discharge position of the nozzle accurately and efficiently in a short time. .

According to the fifth aspect of the present invention, in a state where a predetermined jig is held by the substrate transfer means instead of the substrate,
By moving the jig close to the nozzle moved to the ejection position until a predetermined relative positional relationship is obtained, and driving the substrate transfer means in the close state, the jig is moved in a plurality of different directions, Nozzle position specifying means,
The nozzle position is specified based on the output obtained from the nozzle detection sensor attached to the jig in each of the plurality of directions, and the correction unit corrects the reference position information based on the nozzle position and gives the reference position information to the nozzle driving unit. With this configuration, it is possible to accurately and efficiently adjust the discharge position of the nozzle in a short time without providing a sensor in the substrate processing apparatus.

According to the sixth aspect of the present invention, the nozzle position specifying means specifies the nozzle position when the nozzle is moved to the discharge position based on the outputs from the plurality of sensors provided in the apparatus, and the correction means However, the configuration is such that the reference position information is corrected based on the nozzle position and given to the nozzle driving means, so that the discharge position of the nozzle can be accurately and efficiently adjusted in a short time.

According to the seventh aspect of the present invention, the nozzle driving means moves the nozzle near the discharge position to the first drive mechanism and moves the nozzle near the discharge position to the substrate surface based on the reference position information. And a second drive mechanism for moving the nozzle in a plurality of directions in a simple plane, so that the discharge position of the nozzle can be moved to an arbitrary position.

According to the eighth aspect of the present invention, the step of moving the nozzle for discharging the processing liquid to the discharge position with respect to the substrate based on the predetermined reference position information, and the step of moving the nozzle to the discharge position when the nozzle is moved to the discharge position Has a step of specifying the nozzle position where the nozzle is actually located, and a step of correcting the reference position information based on the nozzle position, so that the discharge position of the nozzle can be accurately adjusted.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a substrate processing apparatus to which the present invention is applied.

FIG. 2 is a perspective view showing a substrate transfer robot of the substrate processing apparatus to which the present invention is applied.

FIG. 3 is a side view illustrating a schematic configuration of a processing unit according to the embodiment of the present invention.

FIG. 4 is a plan view showing a schematic configuration of a processing unit according to the embodiment of the present invention.

FIG. 5 is a diagram showing a jig used in the first embodiment.

FIG. 6 is a block diagram illustrating a control mechanism of the substrate processing apparatus according to the first embodiment.

FIG. 7 is a first flowchart showing a processing sequence for adjusting a discharge position of a nozzle.

FIG. 8 is a second flowchart showing a processing sequence for adjusting the ejection position of the nozzle.

FIG. 9 is a third flowchart showing a processing sequence for adjusting the ejection position of the nozzle.

FIG. 10 is a fourth flowchart showing a processing sequence for adjusting the discharge position of the nozzle.

FIG. 11 is a plan view showing a state where a jig is set on a transfer arm.

FIG. 12 is a schematic side view showing a height relationship between a nozzle and a jig.

FIG. 13 is a diagram showing an example in which no nozzle exists in the optical path of the nozzle detection sensor 240.

FIG. 14 is a diagram illustrating movement of a detection point accompanying movement of a jig.

FIG. 15 is a plan view illustrating a processing unit according to the second embodiment.

FIG. 16 is a block diagram illustrating a control mechanism of a processing unit according to the second embodiment.

FIG. 17 is an explanatory diagram of a method for specifying a nozzle position according to the second embodiment.

FIG. 18 is a plan view illustrating a processing unit according to the third embodiment.

FIG. 19 is a schematic plan view of a processing unit that performs processing liquid processing in a conventional substrate processing apparatus.

FIG. 20 is a schematic plan view of a processing unit that performs processing liquid processing in a conventional substrate processing apparatus.

[Explanation of symbols]

 6 Nozzle 30 Main controller 40 Transport controller (transport controller) 50 Processing controller (nozzle driver) 53 Nozzle arm drive mechanism (first drive mechanism) 54 Two-axis drive mechanism (second drive mechanism) 61, 63, 65 Processing unit 210 Jig 230, 240 Nozzle detection sensor 250, 260 Area sensor TR2 Substrate transport robot (substrate transport means) W substrate

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5F031 BB01 CC12 EE12 FF03 GG02 GG12 KK20 5F046 DB05 JA02 JA04 LA04 LA11

Claims (8)

[Claims] An apparatus for performing a predetermined processing on a substrate by supplying a processing liquid, comprising: (a) a nozzle for discharging a processing liquid to a substrate; and (b) a nozzle based on predetermined reference position information. Nozzle driving means for moving the nozzle to a discharge position, and (c) a nozzle position specifying means for specifying a nozzle position where the nozzle is actually positioned when the nozzle is moved to the discharge position, Characteristic substrate processing equipment. 2. The apparatus according to claim 1, further comprising: (d) a substrate transporting means for holding and transporting the substrate during substrate processing; and (e) replacing said substrate with said substrate transporting means. In a state where a predetermined jig is held, the jig is brought close to the nozzle moved to the discharge position until a predetermined relative positional relationship is established, and the substrate transfer unit is driven in the close state. Transport control means for moving the jig in a plurality of different directions, respectively, wherein the nozzle position specifying means obtains an output obtained from a nozzle detection sensor attached to the jig in each of the plurality of directions. A substrate processing apparatus that specifies the nozzle position based on the nozzle position. 3. The apparatus according to claim 1, further comprising: (d) a plurality of sensors for detecting the nozzles in a plurality of different directions when the nozzles move to a discharge position, respectively.
A substrate processing apparatus, wherein the nozzle position specifying means specifies the nozzle position when the nozzle is moved to the discharge position based on outputs from the plurality of sensors. 4. The apparatus according to claim 1, further comprising: (d) correction means for correcting the reference position information based on the nozzle position. 5. The apparatus according to claim 4, further comprising: (e) a substrate transport unit for holding and transporting the substrate during substrate processing; and (f) the substrate transport unit instead of the substrate. In a state where a predetermined jig is held, the jig is brought close to the nozzle moved to the ejection position until a predetermined relative positional relationship is established, and the substrate transfer unit is driven in the close state. Transport control means for moving the jig in a plurality of different directions, respectively, wherein the nozzle position specifying means obtains an output obtained from a nozzle detection sensor attached to the jig in each of the plurality of directions. The substrate processing apparatus characterized in that the nozzle position is specified based on the nozzle position, and the correction unit corrects the reference position information based on the nozzle position and supplies the corrected reference position information to the nozzle driving unit. 6. The apparatus according to claim 4, further comprising: (e) a plurality of sensors for detecting the nozzles in a plurality of different directions when the nozzles move to a discharge position, respectively.
The nozzle position specifying means specifies the nozzle position when the nozzle is moved to the discharge position based on the outputs from the plurality of sensors, and the correction means sets the reference based on the nozzle position. A substrate processing apparatus wherein position information is corrected and given to said nozzle driving means. 7. The apparatus according to claim 1, wherein the nozzle driving unit includes: (b-1) a first unit that moves the nozzle to a position near the discharge position.
A driving mechanism, and (b-2) a second driving mechanism that moves a nozzle near the ejection position in a plurality of directions in a plane parallel to the substrate surface based on the reference position information. Substrate processing equipment. 8. A method for performing a predetermined processing on a substrate by supplying a processing liquid, comprising: (a) moving a nozzle for discharging the processing liquid to a discharge position on the substrate based on predetermined reference position information; (B) a step of specifying a nozzle position where the nozzle is actually located when the nozzle is moved to the discharge position; and (c) a step of correcting the reference position information based on the nozzle position. A substrate processing method comprising: