JP2000216572A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent surface temperature rise of the housing of an electronic apparatus effectively while ensuring reduction in size and thickness sufficient for portability of the apparatus. SOLUTION: An electronic part 21 on a printed wiring board 20 mounted on the housing 10 of apparatus is coupled thermally with the heat receiving part 221 of a heat dissipation member 22. Under that assembling state, inside of the housing 10 is partitioned in the planar direction of the printed wiring board 20 by means of the heat dissipation member 22 and the printed wiring board 20. When air is supplied to the heat dissipating part 222 of the heat dissipation member 22 in order to cool the heat dissipating part 222, an air flow is generated in the space between the plate surface of the printed wiring board 20 and the inner wall of the housing 10 partitioned by the heat dissipation member 22 and the printed wiring board 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device such as a portable personal computer (PC).

[0002]

2. Description of the Related Art Recently, in the field of electronic devices of this kind, electronic components for processing various information such as characters, voices, images, etc., for example, MPU (Micro Processing).
(Unit)), and the promotion of multi-function is being promoted. In such an electronic device, the power consumption of the MPU is increased as the integration and performance of the MPU are increased, and the amount of heat generated is increased due to the increase in the power consumption. The amount of heat generated during operation of the entire device is increased.

For this reason, the above electronic equipment is provided with a cooling means for thermally controlling an electronic component such as an MPU of a printed wiring board housed in the equipment housing. As the cooling means, there are known a natural air cooling system using natural convection in the device housing 1 shown in FIG. 5 and a forced air cooling system using a blower fan shown in FIG. However, here, the same reference numerals are given to the same portions in FIGS.

In the natural air cooling system shown in FIG. 4, a predetermined space is provided around the printed wiring board 2 housed in the equipment housing 1 so as to surround the electronic components 3a to 3c of the printed wiring board 2. By forming convection of air in the section, the heat of the electronic components 3a to 3c mounted on the printed wiring board 1 is radiated and cooled.

The forced air cooling system shown in FIG.
a and a heat radiating member 4 called a heat sink provided with a heat radiating portion 4b,
The electronic component 3a, which generates a large amount of heat, is thermally coupled and assembled, and the heat receiving portion 4a of the heat radiation member 4 receives the heat generated by the electronic component 3a of the printed wiring board 2. The received heat is transferred from the heat receiving portion 4a of the heat radiating member 4 to the heat radiating portion 4b. Cool 3a.

On the other hand, in the above-mentioned electronic equipment, recently, there is a demand for promotion of miniaturization and thinning so as to be suitable for carrying, and the printed wiring board 2 on which the electronic components 3a to 3c are mounted is mounted on the equipment housing 1. , There is a tendency that the gap generated in the device housing 1 is very narrow.

[0007] For this reason, in the electronic equipment provided with the cooling means, any type of electronic equipment faces the electronic components 3a to 3c due to heat generated from the electronic components 3a to 3c of the printed wiring board 2. The temperature of the surface of the device housing 1 becomes high, which adversely affects the use of the device housing 1 and is dangerous for safety.

The amount of heat C transmitted to the equipment housing is represented by A, the area of the electronic components 3a to 3c, the heat transfer coefficient of air B, and the temperature difference between the electronic components 3a to 3c and the equipment housing 1 by T. Then, C = A × B × T.

[0009]

As described above, the conventional electronic equipment has a problem that the surface temperature of the equipment housing becomes high.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it has been made possible to prevent the surface temperature of a device housing from rising while ensuring a small size and a thin shape suitable for carrying. The purpose of the present invention is to provide an electronic device.

[0011]

According to the present invention, there is provided an equipment housing for accommodating a printed wiring board on which a plurality of electronic components are mounted, and a printed wiring board disposed in the equipment housing. A partition plate that partitions in the surface direction of the printed wiring board in cooperation with the air blower that blows air into a space between the partition plate, the device housing, and the board surface of the printed wiring board, which are partitioned by the printed wiring board. And an electronic device comprising the means.

According to the above configuration, the air from the air blower flows through the space on the plate surface of the printed wiring board to take heat transferred from the electronic component, thereby cooling the electronic component and cooling the electronic component. Reduce transmission to equipment housing. Therefore, together with high-precision thermal control of the electronic components, a rise in the temperature of the device housing is prevented, and it is possible to easily promote the miniaturization and thinning of the device housing.

[0013] The present invention also provides an apparatus housing for accommodating a printed wiring board on which electronic components are mounted, and one end thermally coupled to the electronic component mounted on the printed wiring board; A heat radiating member is provided, and a heat radiating member that partitions the inside of the device housing in a surface direction of the printed wiring board in cooperation with the printed wiring board, and the device housing that is partitioned by the heat radiating member and the printed wiring board. An electronic device is configured to include a space between the printed wiring board and a plate surface and a blowing unit that blows air to a heat radiating portion of the heat radiating member.

According to the above configuration, the air from the air blowing means flows through the space on the plate surface of the printed wiring board, takes away the heat transferred from the electronic components, and reduces the transfer to the equipment housing.
The heat transmitted to the heat radiating portion of the heat radiating member and transferred is cooled to perform heat control on the electronic component. Therefore, while realizing high-precision thermal control of the electronic components, a rise in the temperature of the device housing is prevented, and the miniaturization and thinning of the device housing can be easily promoted.

Further, in the present invention, a heat radiating fin is provided on at least a portion of the housing of the device which faces at least one surface of the printed wiring board.

According to this, the heat transmitted from the electronic components to the surface of the equipment housing is efficiently radiated into the equipment housing via the radiation fins, and further, the rise in the surface temperature of the equipment housing can be prevented. .

[0017]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows the appearance of an electronic apparatus according to an embodiment of the present invention.
The cover 11 is formed in a substantially box shape, and the keyboard 11 is mounted on the cover 102 so as to be operable by keys. A liquid crystal display (LCD) 12 is attached to the device housing 10 via a hinge mechanism 13 so as to be openable and closable in the arrow direction, corresponding to the keyboard 11.

As shown in FIG. 2, a printed wiring board 20 is accommodated in the equipment housing 10, and the keyboard 11 and the liquid crystal display 12 are electrically connected to the printed wiring board 20. . This printed wiring board 20
Is driven in conjunction with the key operation of the keyboard 11,
Desired information corresponding to the key operation is displayed on the liquid crystal display 1.
2 is displayed.

A plurality of electronic components 21 are mounted on the printed wiring board 20. A desired electronic component 21 for which thermal control of the printed wiring board 20 is required includes a heat receiving portion 2 provided at one end of a heat radiating member 22 called a heat sink.
21 is thermally coupled and attached via a heat conducting member (not shown) such as a cool sheet.

The heat radiating member 22 has a heat radiating portion 2 at the other end.
22 is a plane direction of the printed wiring board 20 and the device housing 1
0 and is formed so as to partition the inside of
A plurality of heat radiation fins 223 are formed so as to protrude in the component mounting surface direction of the printed wiring board 20. Then, the device housing 1
0, the exhaust port 103 is connected to the heat radiating portion 22 of the heat radiating member 22.
2 radiating fins 223 and the device housing 1
0 is provided so as to form an air blowing path between one surface of the printed wiring board 20 and the inner wall of the device housing 10.

Further, a blower fan 23 is provided in the equipment housing 10 in correspondence with the heat radiating portion 222 of the heat radiating member 22. The blower fan 23 is driven and controlled through a control unit (not shown), and blows air toward the heat radiating unit 222 of the heat radiating member 22 in conjunction with the driving of the fan. Then
In conjunction with the air blowing, air moves in the gap between the device housing 10 and the printed wiring board 20 and the heat radiating member 22, and the moving air is guided to the exhaust port 103 of the device housing 10. .

In the above configuration, when the electronic components 21 of the printed wiring board 20 are driven and generate heat, the electronic components 21
Is transmitted to the heat receiving portion 221 of the heat radiating member 22, and is guided from the heat receiving portion 221 to the heat radiating portion 222. Here, the driving of the blower fan 23 is controlled via a control unit (not shown), and the air generated by the blower fan 23 is blown to the radiating fins 223 of the radiating unit 222. The air generated by the blower fan 23 takes away the amount of heat transferred to the radiating fins 223 of the radiating portion 222 of the radiating member 22 and is exhausted from the exhaust port 103 of the device housing 10. The component 21 is cooled via the heat radiating member 22.

At this time, the equipment housing 1 is placed in the equipment housing 10 by the flow of air supplied from the blower fan 23.
0, an air flow is generated between one surface of the printed wiring board 20 and the inner wall of the device housing 10. The moving air deprives heat radiated from the electronic components 21 of the printed wiring board 20 to reduce the transfer of heat to the device housing 10, thereby preventing the surface temperature of the device housing 10 from rising.

Here, the heat quantity Q transmitted from the printed wiring board 20 and the electronic component 21 to the air is V, the wind speed is V, the length of the electronic component 21 is L, the area of the electronic component 21 is M, Assuming that the temperature difference from the above is t, the temperature difference is represented by Q = 3.86 × (V / L) ^1/2 × M × t based on a known heat transfer formula. The amount of heat Q1 carried by the air is represented by Q1 = a × b × t1 × r, where a is the density of the air, b is the specific heat of the air, t1 is the temperature rise of the air, and r is the air volume.

As described above, the electronic device is provided in the device housing 1.
The heat receiving part 221 of the heat dissipating member 22 is thermally coupled to the electronic component 21 of the printed wiring board 20 mounted on the printed circuit board 20. 10 is configured to be partitioned in the plane direction of the printed wiring board 20, and when air is supplied to the radiating section 222 of the radiating member 22 to cool the radiating section 222, the radiating member 22 and the printed wiring board 20 partition. The air flow is generated in the space between the inner wall of the device housing 10 and the plate surface of the printed wiring board 20.

According to this, the air from the blower fan 23 flows through the space on the plate surface of the printed wiring board 20, takes the radiant heat from the electronic component 21, and prevents transmission to the wall surface of the equipment housing 10. At the same time, the heat radiating portion 222 of the heat radiating member 22 is efficiently cooled to realize high-precision heat control of the electronic component 21 and, at the same time, prevent the surface temperature of the device housing 10 from rising. As a result, the arrangement of the printed wiring board 20 close to the wall surface of the device housing 10 is realized, and the gap in the device housing 10 can be set to a minimum, facilitating promotion of miniaturization and thinning. It can be aimed at.

In the above embodiment, the heat radiation member 22
Is thermally coupled to the electronic component 21 of the printed wiring board 20,
Although the forced air cooling system in which the air from the blower fan 23 is blown to the heat radiating portion 222 of the heat radiating member 22 to cool the heat radiating member 22 has been described, the present invention is not limited to this. For example, as shown in FIG. Instead, it is also possible to configure using the partition plate 24. However, in FIG. 3, the same portions as those in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted.

That is, the printed circuit board 2 is
A partition plate 24 is provided corresponding to the plate surface of No. 0, and the partition plate 24 and the printed wiring board 20 cooperate with each other to form an air gap forming an air passage between the partition plate 24 and the inner wall of the device housing 10. . Then, the device housing 10, the printed wiring board 20, and the partition plate 24
In addition to the arrangement of the blower fan 23 corresponding to the above, an exhaust port 103 is provided in the device housing 10 corresponding to the partition plate 24.

Thus, when the blower fan 23 is driven and air is blown, the action of the partition plate 24 causes
The electronic component 21 of the printed wiring board 20 in the device housing 10 moves so that the air in the device housing 10 flows through the gap.
Is cooled directly. At the same time, the air flowing through the gap in the device housing 10 prevents the transfer of heat from the electronic components 21 of the printed wiring board 20 to the inner wall of the device housing 10 and raises the surface temperature of the device housing 10. To block.

The partition plate 24 in FIG.
It is configured using various materials such as a non-thermal conductive material without being limited to the thermal conductive material.

In each of the above embodiments, the device housing 1
0, the air outlet 103 is provided and the air is exhausted from the air outlet 103. However, the present invention is not limited to this.
The same effect can be expected by merely circulating the air blown by the blower fan 23 into the device housing 10 without providing the airflow in the device housing 10.

Further, the present invention is not limited to the above-described embodiments, but may be modified as shown in FIG.
By providing the radiating fins 25 in the configuration, a more favorable effect is expected. However, in FIG. 4, the same parts as those in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted.

That is, the radiating fin 25 is provided at a portion of the printed circuit board 20 of the device housing 10 facing the plate surface on which the electronic component 21 is mounted.

As described above, when air moves between the printed wiring board 20 and the device housing 10 as described above,
The heat radiation from the radiating fins 25 of the device housing 10 can be efficiently radiated, and a rise in the surface temperature of the device housing 10 can be effectively prevented, so that a better effect is expected.

Then, the printed wiring board 20 shown in FIG.
A partition plate is arranged side by side in the surface direction of the printed wiring board 20. By the action of the partition plate 24, one plate surface of the printed wiring board 20 and the device housing 1
0 to form a desired air flow, and
In the method for preventing the rise of the surface temperature of FIG.
The radiation fins 25 may be provided on the inner wall of the device housing 10 shown in FIG. Also in this case, it is possible to promote the prevention of a rise in the surface temperature of the device housing 10 in substantially the same manner.

Therefore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

[0038]

As described in detail above, according to the present invention, it is possible to prevent the surface temperature of the equipment housing from rising while ensuring the small size and thinness of the equipment housing. Electronic equipment can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an external appearance of an electronic apparatus to which an embodiment of the present invention is applied.

FIG. 2 is a side view showing a main part of the electronic device according to the embodiment of the present invention, which is taken out and shown.

FIG. 3 is a sectional view showing a main part of an electronic device according to another embodiment of the present invention.

FIG. 4 is a sectional view showing a main part of an electronic device according to another embodiment of the present invention.

FIG. 5 is a sectional view showing a main part of a conventional electronic device.

FIG. 6 is a sectional view showing a main part of a conventional electronic device.

[Description of Signs] 10 ... Device housing. 101 ... Case. 102 ... Cover. 103 ... exhaust port. 11 ... keyboard. 12 ... Liquid crystal display. 13 ... hinge mechanism. 20 ... printed wiring board. 22 ... heat dissipating member. 221 ... heat receiving part. 222: heat radiating part. 223… radiation fins. 21 Electronic parts. 23 ... Blower fan. 24 ... Partition plate. 25 ... radiation fins.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroshi Nakamura 2-9-9 Suehirocho, Ome City, Tokyo Inside the Toshiba Ome Plant (72) Inventor Jihei Kitabara 2-9-9 Suehirocho, Ome City, Tokyo Stock Company (72) Inventor Katsuhiko Yamamoto 2570-1 Gosuda, Kamo-shi, Niigata Prefecture F-term (reference) 5E322 AA01 AA11 BA01 BA05 BB03 FA04

Claims (5)

[Claims] 1. An apparatus housing in which a printed wiring board on which electronic components are mounted is housed, and the printed wiring board is disposed in the equipment housing and cooperates with the printed wiring board in the equipment housing. A partition plate for partitioning in a plane direction, and blowing means for blowing air into a space between the partition plate, the device housing partitioned by the printed wiring board, and a plate surface of the printed wiring board. Electronics. 2. A device housing in which a printed wiring board on which an electronic component is mounted is accommodated; one end is thermally coupled to the electronic component mounted on the printed wiring board; A heat dissipating member that is provided and partitions the inside of the device housing in the surface direction of the printed wiring board in cooperation with the printed wiring board; the device housing and the printed wiring board partitioned by the heat dissipating member and the printed wiring board An electronic device, comprising: a blowing unit that blows air to a space between the plate and a radiating portion of the radiating member. 3. The electronic device according to claim 2, wherein a radiating fin is provided in a radiating portion of the radiating member. 4. The electronic device according to claim 1, further comprising a radiating fin provided on at least a portion of the device housing facing one surface of the printed wiring board. . 5. The electronic device according to claim 1, wherein the device housing is provided with a discharge port on a downstream side of the air blown by the blower.