JP2000209116A - Up-converter, double conversion tuner and composite electronic component used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an up-converter and a double conversion tuner that can realize reduction in current consumption and improve a phase noise characteristic and to provide a composite electric component used therefor. SOLUTION: This up-converter 10 modulates a high frequency input signal RF into a higher intermediate frequency output signal IF, and consists of a mixer circuit 11 comprising a high frequency amplifier RF-AMP, a local frequency amplifier LO-AMP, and a mixer MIX, of a local oscillation circuit OSC and of a phase locked loop circuit PLL. In this case, the mixer circuit 11 is realized by a GaAsMMIC, the local oscillation circuit OSC is by an Si element and the phase locked loop PLL is realized by an Si element.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency circuit device such as a television receiver or a video tape recorder, in particular, a CATV.
The present invention relates to an upconverter for reception, a double conversion tuner, and a composite electronic component used for them.

[0002]

2. Description of the Related Art In CATV, retransmission of broadcast radio waves and transmission of programs on dozens of channels using empty channels, mid bands, and super bands are possible. Such a CAT
In V, scrambling of a signal and communication of necessary information are used together for program selection and charging, so that a double conversion tuner is installed in front of a receiver to perform reception.

FIG. 7 is a block diagram of a general double conversion tuner for CATV reception. This tuner is of a type that removes interference or the like by increasing the frequency of an input high-frequency signal with an up-converter and then decreasing the frequency with a down-converter.

A high-frequency signal RF input from an input terminal IN of a double conversion tuner is input to an up-converter 1 via a first band-pass filter BPF1 and an automatic gain adjustment controller AGC. The high-frequency signal RF input to the up-converter 1 is a high-frequency amplifier RF-
The signal is input to the first mixer MIX1 via the AMP. On the other hand, the first phase locked loop circuit PLL1 controls the first local oscillation circuit OSC1 according to the data of the reception channel,
The first local oscillation signal LO1 is supplied to the first local frequency amplifier LO-A.
The signal is input to the first mixer MIX1 via MP1. In the first mixer MIX1, the high frequency signal RF and the first local oscillation signal LO1 are mixed and converted into a first intermediate frequency signal IF1.

[0005] The first intermediate frequency signal IF1 is supplied to a second band pass filter BPF2, a first intermediate frequency amplifier IF1-AM.
P, and is input to the down converter 2 via the third band-pass filter BPF3. The first intermediate frequency signal IF1 input to the down converter 2 is supplied to a second mixer MIX2
Is input to On the other hand, the second phase-locked loop circuit PLL2 changes the second local oscillation circuit O in accordance with the data of the reception channel.
SC2 is controlled to input the second local oscillation signal LO2 to the second mixer MIX2. In the second mixer MIX2, the first intermediate frequency signal IF1 and the second local oscillation signal LO2 are mixed and converted into a second intermediate frequency signal IF2. And a low-pass filter LPF and a second intermediate frequency amplifier IF
The signal is output from the output terminal OUT via the 2-AMP and the fourth band-pass filter BPF4.

FIG. 8 is a sectional view of a conventional double conversion tuner. Double conversion tuner 5
Reference numeral 0 denotes a configuration in which various surface mounting components 52 for circuit configuration are mounted on a printed wiring board 51. In this case, a circuit pattern 53 is formed on the surface of the printed wiring board 51, and the circuit configuration surface mount component 52 is connected to the solder 54. However, in the above configuration, a large number of circuit configuration surface mount components 52 are required, and there is a problem that the double conversion tuner 50 becomes large.

In order to solve this problem, US Pat.
In 625 and 267, the high-frequency amplifier RF-AMP of the up-converter 1, the first local frequency amplifier LO-AMP1,
A method in which the first mixer MIX1 and the first local oscillation circuit OSC1 are provided on the same GaAs chip to configure an IC;
Alternatively, Japanese Patent Application Laid-Open No. 3-268519 discloses a first local frequency amplifier LO-AMP1, a first mixer MIX1, and a first mixer MIX1.
A method has been proposed in which the local oscillation circuit OSC1 is provided on the same GaAs chip to configure an IC, which contributes to miniaturization of the double conversion tuner and improvement of distortion characteristics.

[0008]

However, in the conventional up-converter, the high frequency amplifier, the local frequency amplifier and the mixer constituting the mixing circuit and the local oscillation circuit are provided on the same GaAs chip. There has been a problem that current consumption in the hybrid circuit increases, electrical isolation between the local oscillation circuit and other functional components deteriorates, and unnecessary signals are mixed into the intermediate frequency signal.

Further, since the local oscillation circuit is provided on the GaAs substrate, the poor GaAs noise level affects the phase noise characteristics of the local oscillation circuit, causing a problem when receiving a digital signal. There is also a problem that the phase noise characteristic is deteriorated. Incidentally, when the phase noise characteristic of the local oscillation circuit was measured, it was -48 dBc / Hz (offset 1 kHz).

[0010] Usually, modulation of a digital signal is performed by changing the amplitude and phase of a high-frequency signal. In order for the receiver to demodulate this correctly, it is necessary to accurately determine the amplitude and phase of the received signal. In the double conversion tuner, the first mixer converts the signal into a first intermediate frequency signal and digitally demodulates the signal.
The phase noise characteristic of the first local oscillation circuit affects information on the amplitude and phase of the digitally modulated high-frequency signal. Therefore, if the high frequency signal as the input signal is mixed with the first local frequency signal having poor phase noise characteristics, the amplitude and phase information of the digitally modulated high frequency signal may be different from the original information, and accurate demodulation is performed. Can not. As a result, digital signals require higher phase noise characteristics than analog signals.

The present invention has been made in order to solve such a problem, and an upconverter, a double conversion tuner, and a double conversion tuner capable of realizing reduction of current consumption and improvement of phase noise characteristics are provided. An object is to provide a composite electronic component.

[0012]

In order to solve the above-mentioned problems, an upconverter according to the present invention is an upconverter for converting a high-frequency input signal into a higher intermediate frequency signal, comprising a high-frequency amplifier, a local frequency amplifier, And a GaAs MMIC provided with a mixing circuit composed of a mixer
And a Si element provided with a local oscillation circuit and a Si element provided with a phase locked loop circuit.

Further, the double conversion tuner of the present invention comprises an input circuit, a first mixing circuit, a first local oscillation circuit,
A double conversion tuner including a first phase locked loop circuit, a first intermediate frequency circuit, a second mixing circuit, a second local oscillation circuit, a second phase locked loop circuit, and a second intermediate frequency circuit, and a metal casing. And a first mixed circuit made of GaAsMMIC at a substantially central portion of the housing.
A first local oscillation circuit composed of elements and a first phase-locked loop circuit composed of Si elements are arranged.

Further, the composite electronic component of the present invention has the above-mentioned G
It is characterized by comprising an aAsMMIC and a small outline package or a quad flat package on which the GaAs MMIC is mounted.

According to the upconverter of the present invention, the mixing circuit including the high frequency amplifier, the local frequency amplifier and the mixer is provided in the GaAs MMIC, the local oscillation circuit is provided in the Si element, and the phase locked loop circuit is provided in the Si element. A high frequency signal can be mixed with a local oscillation signal from a local oscillation circuit having a phase noise characteristic required in a digital transmission system.

According to the double conversion tuner of the present invention, since the first mixing circuit, the first local oscillation circuit, and the first phase locked loop circuit are arranged substantially at the center of the metal casing, unnecessary waves to the input terminal are eliminated. Components can be reduced.

According to the composite electronic component of the present invention, since the GaAs MMIC provided with the mixed circuit is mounted on a small outline package or a quad flat package, the interval between external terminals can be reduced, and the mounting substrate can be reduced. Both sides can be used.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram of one embodiment according to the upconverter of the present invention. Upconverter 1
0 sets the high frequency input signal RF to the higher intermediate frequency signal I
F, a high-frequency amplifier RF-AM
P, a mixing circuit 11 including a local frequency amplifier LO-AMP and a mixer MIX, a local oscillation circuit OSC, and a phase locked loop circuit PLL.

At this time, the mixing circuit 11 is a GaAs MMI
C, the local oscillation circuit OSC is provided in the Si element, and the phase locked loop circuit PLL is provided in the Si element.

The high-frequency signal RF input from the input terminal IN of the up-converter 10
The signal is input to the mixer MIX via the F-AMP. on the other hand,
The phase locked loop circuit PLL controls the local oscillation circuit OSC, and inputs the local oscillation signal LO to the mixer MIX via the local frequency amplifier LO-AMP. In the mixer MIX, the high-frequency signal RF and the local oscillation signal LO are mixed,
It is converted to an intermediate frequency signal IF.

FIG. 2 is a diagram showing the phase noise characteristic of the local oscillation circuit, and FIG. 3 is a diagram showing the phase noise characteristic when the local oscillation circuit is controlled by the phase locked loop circuit. In these figures, the solid line shows the case where the local oscillation circuit is made of a Si element as in the present embodiment, and the broken line shows the case where the local oscillation circuit is made of a GaAs IC as in the conventional example.

From FIG. 2, the phase noise characteristic of the local oscillation circuit at 1 kHz is -68 [dBc / Hz] when the local oscillation circuit is constituted by the Si element, and the
In the case of a configuration using an AsIC, the frequency is -48 [dBc / Hz].
It can be seen that the phase noise characteristic at z is improved by about 20 [dBc / Hz] and the phase noise characteristic required for the digital transmission system is -60 [dBc / Hz] or less.

FIG. 3 shows that the phase noise characteristic at 1 kHz when the local oscillation circuit is controlled by the phase-locked loop circuit is-when the local oscillation circuit is constituted by the Si element.
66 [dBc / Hz], and -49 [dBc / Hz] when the local oscillation circuit is composed of GaAsIC.
When the local oscillation circuit is configured by the elements, the phase noise characteristic at 1 kHz is improved by about 17 [dBc / Hz], and the phase noise characteristic required for the digital transmission system is -60 [dBc / Hz] or less. It turns out that you are satisfied.

As described above, according to the upconverter of the embodiment, the mixing circuit composed of the high frequency amplifier, the local frequency amplifier and the mixer is a GaAs MMIC, the local oscillation circuit is a Si element, and the phase locked loop circuit is a Si element. Since each is provided, a high-frequency signal can be mixed with a local oscillation signal from a local oscillation circuit having a phase noise characteristic required in a digital transmission system. Accordingly, accurate demodulation of the intermediate frequency signal, low current consumption of the mixing circuit, and downsizing can be achieved.

Further, since the mixing circuit and the local oscillation circuit are separated from each other, the isolation of the mixing circuit is improved, and it becomes possible to prevent mixing of unnecessary components into the intermediate frequency signal.

FIG. 4 is a block diagram of an embodiment according to the double conversion tuner of the present invention. The double-conversion tuner 20 removes disturbances by increasing the frequency of a high-frequency input signal using an up-converter and then reducing the frequency using a down-converter. It includes a local oscillation circuit OSC1, a first phase locked loop circuit PLL1, a first intermediate frequency circuit 23, a second mixing circuit 24, a second local oscillation circuit OSC2, a second phase locked loop circuit PLL2, and a second intermediate frequency circuit 25.

The operation of the double conversion tuner 20 is the same as that of the conventional example, except that the up-converter 1
Is composed of a GaAs MMIC and a first mixing circuit 22.
The difference is that the local oscillation circuit OSC1 is composed of a Si element, and the first phase locked loop circuit PLL1 is composed of a Si element.

The input circuit 21 comprises a first band pass filter BPF1 and an automatic gain adjustment controller AGC.
The first mixing circuit 22 includes a high-frequency amplifier RF-AMP, a first
Mixer MIX1 and first local frequency amplifier LO-AMP
Consists of one.

The first intermediate frequency circuit 23 includes a second band pass filter BPF2 and a first intermediate frequency amplifier IF1-A.
MP, and a third bandpass filter BPF3, and the second mixing circuit 24 includes a second mixer MIX2.

Further, the second intermediate frequency circuit 25 includes a low-pass filter LPF, a second intermediate frequency amplifier IF2-AM
P, and a fourth bandpass filter BPF4.

FIG. 5 is a layout diagram of the double conversion tuner of FIG. Double conversion tuner 2
0 has a metal housing 26, and the input terminal IN is provided on one side of the long axis of the housing 26, that is, on one vertical side 26a.
Is provided.

The first mixing circuit 22 and the first local oscillation circuit OSC are provided in a second block 27b substantially at the center of the housing 26.
1. A first phase-locked loop circuit PLL1 is arranged, and a first data terminal DT1 to which data is supplied to the first phase-locked loop circuit PLL1 is connected to one of the short axis sides of the housing 26 near the first phase-locked loop circuit PLL1. Side, ie one side 2
6b.

The input circuit 21 is arranged in the first block 27a near the one vertical side surface 26a of the housing 26. Furthermore, the fifth block 2 near the other vertical side surface 26c of the housing 26
7e, a second local oscillation circuit OSC2 and a second phase-locked loop circuit PLL2 are arranged, and a second phase-locked loop circuit PLL
A second data terminal DT2 to which data is supplied to the second phase-locked loop circuit 2 is provided on one side surface 26b of the housing 26 near the second phase-locked loop circuit PLL2.

Further, the first intermediate frequency circuit 23 is disposed in the third block 27c of the housing 26. Further, the second mixing circuit 24 and the second intermediate frequency circuit 25 are arranged in the fourth block 27d of the housing 26, and the output terminal OUT for outputting the second intermediate frequency signal from the second intermediate frequency circuit 25 is connected to the second intermediate frequency circuit 25. It is provided on one side surface 26b of the housing 26 near the frequency circuit 25.

As described above, according to the double conversion tuner of the embodiment, since the first mixing circuit, the first local oscillation circuit, and the first phase locked loop circuit are arranged at the substantially central portion of the metal casing, the input is achieved. Unwanted wave components to the terminals can be reduced.

Further, since the first local oscillation circuit and the second local oscillation circuit are arranged via the first and second intermediate frequency circuits, the first local oscillation signal and the second local oscillation signal are interposed. Can be reduced.

FIG. 6 is (a) a partially crushed top view and (b) a partially crushed side view of one embodiment according to the composite electronic component of the present invention. The composite electronic component 30 corresponds to the upconverter 1 shown in FIG.
4, a GaAs MMIC 31 provided with a mixing circuit 22 used in the double conversion tuner 20 of FIG. 4, a pedestal 33 having a lead terminal 32 made of an iron-nickel alloy or the like, and an epoxy resin. A sealing body 34 is provided.

The composite electronic component 30 is made of GaAsM
The MIC 31 is mounted on the base 33 and the GaAs MMIC 3
1 and the lead terminal 32 are connected by wire bonding (not shown), and the small outline package (SOP: SOP:
Small Outline Package).

As described above, according to the composite electronic component of the embodiment, the GaAs MMIC provided with the mixing circuit is provided in a small outline package (SOP).
e), the distance between external terminals can be reduced, and both sides of the mounting board can be used, so high-density mounting of composite electronic components on the mounting board is possible, Becomes possible.

A GaAs MMIC provided with a mixing circuit
The same effect can be obtained by mounting the pedestal in a quad flat package (QFP) provided with lead terminals at four ends of the pedestal.

[0041]

According to the up converter of the first aspect,
A high frequency amplifier, a local frequency amplifier, and a mixer are provided in a GaAs MMIC, a local oscillation circuit is provided in a Si device, and a phase locked loop circuit is provided in a Si device. It can be mixed with a local oscillation signal from a local oscillation circuit having characteristics. Accordingly, accurate demodulation of the intermediate frequency signal, low current consumption of the mixing circuit, and downsizing can be achieved.

Further, since the mixing circuit and the local oscillation circuit are separated, the isolation of the mixing circuit is improved, and it becomes possible to prevent mixing of unnecessary components into the intermediate frequency signal.

According to the double conversion tuner of the second aspect, since the first mixing circuit, the first local oscillation circuit, and the first phase locked loop circuit are arranged at substantially the center of the metal casing, no need is made for the input terminal. Wave components can be reduced.

According to the third aspect of the present invention, since the GaAs MMIC provided with the mixing circuit is mounted on a small outline package or a quad flat package to form the composite electronic component, the interval between the external terminals is reduced. Since both sides of the mounting board can be used, the composite electronic component can be mounted on the mounting board at a high density, and the size of the upconverter can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram of one embodiment according to the upconverter of the present invention.

FIG. 2 is a diagram illustrating phase noise characteristics of a local oscillation circuit.

FIG. 3 is a diagram illustrating phase noise characteristics of a local oscillation circuit when the local oscillation circuit is controlled by a phase locked loop circuit.

FIG. 4 is a block diagram of one embodiment according to the double conversion tuner of the present invention.

FIG. 5 is a layout diagram of the double conversion tuner of FIG. 4;

FIG. 6 (a) of one embodiment according to the composite electronic component of the present invention;
It is a partially crushed top view, and (b) is a partially crushed side view.

FIG. 7 is a block diagram of a general double conversion tuner for CATV reception.

FIG. 8 is a sectional view of a conventional double conversion tuner.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Up converter 11, 22, 24 Mixing circuit 20 Double conversion tuner 21 Input circuit 23, 25 Intermediate frequency circuit 26 Housing 30 Composite electronic component IF, IF1, IF2 Intermediate frequency signal LO-AMP, LO-AMP1, LO-AMP2
Local frequency amplifier MIX, MIX1, MIX2 Mixer OSC, OSC1, OSC2 Local oscillation circuit PLL, PLL1, PLL2 Phase locked loop circuit RF RF signal RF-AMP RF amplifier

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5J103 AA06 AA16 BA03 BA06 CA08 CB02 CB03 DA01 DA03 DA05 5K020 AA02 AA03 BB09 DD05 DD15 EE01 FF05 GG01 MM02 NN05

Claims (3)

[Claims] An up-converter for converting a high-frequency input signal into a higher intermediate frequency signal, comprising: a GaAs MMIC provided with a mixing circuit including a high-frequency amplifier, a local frequency amplifier, and a mixer; An up-converter comprising a Si element provided with a phase-locked loop circuit and a Si element provided with a phase-locked loop circuit. 2. An input circuit, a first mixing circuit, a first local oscillation circuit, a first phase locked loop circuit, a first intermediate frequency circuit, a second mixing circuit, a second local oscillation circuit, a second phase locked loop circuit, and A double-conversion tuner including a second intermediate frequency circuit, including a metal housing, and a GaAsM
A double-conversion tuner comprising a first mixing circuit composed of an MIC, a first local oscillation circuit composed of a Si element, and a first phase-locked loop circuit composed of a Si element. 3. The Ga according to claim 1 or 2,
A composite electronic component comprising an AsMMIC and a small outline package or a quad flat package on which the GaAs MMIC is mounted.