JP2000208975A - Stage for controlling temperature and heat exchanger plate provided thereon - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stage for controlling the temperature, which is provided with a thin heat exchanger plate having superior thermal response and uniformity of heat. SOLUTION: A heat exchanger plate 3 is constituted only by a fluid pipe 20, in which temperature-controlled water flows. The fluid pipe 20 is a pipe, of square cross section, having an inlet port 80 and an outlet port 90. In a piping process, the pipe is folded in the vicinity of center so that two pipes for sending and returning are round and spirally wound to form a flat heat exchanger plate 3. In the plate 3, the inlet port 80 and the outlet port 90 are arranged in approximately the same location vicinity, and they are provided between each adhesive plate 1 and a base plate 10. Water which flows from the inlet port 80 goes concentrically around from the outer circulation toward a turning point 60 in the vicinity of the center, and after passing through the turning point 60, it goes around concentrically from the center and flows toward the outlet port 90 in the outer circulation. Accordingly, a sending pipe 60 and a returning pipe 50 are arranged alternatively adjacently.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage for adjusting the temperature of a substrate for heating or cooling a substrate to be mounted.

[0002]

2. Description of the Related Art Thermoelectric conversion modules are used as means for heating or cooling substrates such as semiconductor wafers and liquid crystal substrates.
(Hereinafter referred to as thermoelectric module) is known as a temperature control stage. In general, the temperature control stage mounts a substrate, and heats and cools the substrate by using an upper plate (mounting plate) and a heat exchange module by absorbing or radiating heat from the thermoelectric module. Both sides (plates for heat exchange) are joined together with a plurality of thermoelectric modules interposed therebetween. The heat exchange plate includes a passage (fluid passage) through which water whose temperature is adjusted passes.

[0003]

The heat exchange plate provided on the above-mentioned temperature control stage performs heat exchange uniformly with each thermoelectric module arranged on the heat exchange plate, that is, is excellent in so-called heat uniformity. It is desired.
Therefore, the heat exchange plate needs to have a large heat capacity so that the temperature of the water flowing in the internal fluid passage is uniform over the entire surface of the heat exchange plate, so that the volume of the fluid passage is large and the whole is thick. Be composed.
However, this causes a problem that it becomes difficult to rapidly absorb and radiate heat from each thermoelectric module, that is, the so-called thermal responsiveness becomes poor. Therefore, a heat exchange plate that is thin and has a small heat capacity is desired.
However, when the thickness is reduced, there arises a problem that the heat uniformity is not excellent.

Accordingly, an object of the present invention is to provide a temperature control stage having a thin heat exchange plate having excellent thermal responsiveness and heat uniformity.

[0005]

A temperature adjusting stage according to a first aspect of the present invention comprises a mounting plate on which a substrate is mounted, a thermoelectric conversion module joined to the mounting plate, and a thermoelectric conversion module. A heat exchange plate that is joined to the conversion module and performs heat exchange with the thermoelectric conversion module using a heat medium fluid is provided. The heat exchange plate has a fluid passage for flowing the heat medium fluid, and the fluid passage extends over substantially the entire area of the interface with the thermoelectric conversion module.
It is stretched at a substantially uniform density.

[0006] In a preferred embodiment, the fluid passage has a first flow passage and a second flow passage in which the flow directions of the heat medium fluid are opposite to each other, and the first flow passage and the second flow passage. Are arranged alternately adjacent to each other over substantially the entire area of the joining surface.

In a preferred embodiment, the heat exchange plate is formed by bending a pipe constituting a fluid passage into a flat plate shape.

[0008] In another preferred embodiment, the heat exchange plate includes a flat plate having a recess formed on at least one surface thereof, and a lid plate joined to the flat surface of the flat plate having the recess formed therein. And the fluid passage is a concave passage covered by a lid plate.

In still another preferred embodiment, the heat exchange plate includes a flat plate having a concave path formed on one surface by press working, and a lid plate joined to the flat plate with the concave path formed thereon. And the fluid passage is a concave passage covered by the lid plate.

A temperature adjustment stage according to a second aspect of the present invention includes a mounting plate on which a substrate is mounted, a thermoelectric conversion module bonded to the mounting plate, and a thermoelectric conversion module bonded to the thermoelectric conversion module. A heat exchange plate for performing heat exchange with the thermoelectric conversion module using a heat medium fluid is provided. The heat exchange plate has a heat transfer member having a surface covering substantially the entire area of the bonding surface with the thermoelectric conversion module;
A fluid passage for flowing a heat medium fluid is provided inside the heat transfer member.

[0011]

FIG. 1 shows a sectional configuration of a temperature control stage according to an embodiment of the present invention, and FIG. 2 shows a plan configuration of a heat exchange plate provided in the temperature control stage. . FIG. 1 is a sectional view taken along line AA in FIG.

The temperature adjusting stage includes a substrate mounting plate 13 which is, for example, a circular flat plate, and a plurality of thermoelectric modules 11a, 11b, 11c,. , Each thermoelectric module 11), and a heat exchange plate 3 that performs heat exchange with each thermoelectric module 11 using a temperature-controlled heat medium fluid (eg, water). Further, each thermoelectric module 11 and the heat exchange plate 3 are provided with adhesive plates 10a, 10b, 1
0c,... (Hereinafter referred to as the respective adhesive plates 10), and each thermoelectric module 11 has the heat exchange plate 3 and the mounting plate 1
3 so as to be sandwiched between the base plate 1 and the mounting plate 13. The mounting plate 13 and the base plate 1 are provided with a plurality of bolts 15a, 15b,
... is concluded. Thereby, each thermoelectric module 11 is pressed against the mounting plate 13, and the heat exchange plate 3 is connected to each thermoelectric module 11 via each adhesive plate 10.
Is crimped. In addition, through holes 5a, 5b, 5c (on the mounting plate 13 side) and 12 through which the entire stage passes from the upper surface to the lower surface are provided at approximately three central positions of the temperature adjusting stage.
a, 12b and 12c (the base plate 1 side) are provided.
These three through holes 5a, 5b, 5c and 12a, 12
b and 12c have three lifting pins 9a and 9 for lifting and lowering a substrate (not shown) mounted on the mounting plate 13.
b and 9c are inserted.

Hereinafter, each component will be described.

The mounting plate 13 is made of a metal material having good heat conductivity such as aluminum, and may be a solid metal plate or a panel-type heat pipe. Then, on the upper surface of the mounting plate 13, a substrate such as a semiconductor wafer to be temperature-controlled is mounted.
On the lower surface of the mounting plate 13, each thermoelectric module 11
Is press-bonded via, for example, grease (not shown) having good thermal conductivity.

In each thermoelectric module 11, a large number of P-type semiconductor chips (not shown) and N-type semiconductor chips (not shown) are alternately and two-dimensionally arranged, and they are electrically connected in series. The Peltier effect is generated by passing an electric current through the plate, thereby absorbing the heat from the mounting plate 13 and radiating the heat to the fluid pipe 3, or vice versa. The thermoelectric modules 11 are arranged uniformly over the entire mounting plate 1 so that the temperature distribution on the surface of the mounting plate 1 does not become uneven.

Each adhesive plate 10 is, for example, a thin plate-like member having excellent thermal conductivity, and is interposed between each thermoelectric module 11 and the heat exchange plate 3. An adhesive is applied to the upper surface and the lower surface of each adhesive plate 10, and adheres to the lower surface of each thermoelectric module 11 at the upper surface, and adheres to the upper surface of the heat exchange plate 3 at the lower surface. Thereby, each thermoelectric module 11 and the plate for heat exchange 3
They are joined via the respective adhesive plates 10. Each adhesive plate 10 reduces the variation in flatness of the upper surface of the heat exchange plate 3.
It is made of a material with a certain degree of elasticity (that is, to fill the top surface irregularities). Thereby, the contact area between each adhesive plate 10 and the heat exchange plate 3 is further increased, and the thermal conductivity between the heat exchange plate 3 and each thermoelectric module 11 is improved.

The heat exchange plate 3 absorbs and radiates heat from each thermoelectric module 11 and
As shown in FIG. 2, it is constituted only by a fluid pipe 20 through which temperature-controlled water passes. The fluid pipe 20 is made of a metal such as aluminum, for example.
It is a square pipe with one inlet 80 and one outlet 90. The fluid pipe 20 is folded near the center in a piping process (this will be described later), and
The tubes are wound into a circular spiral to form a plate-like heat exchange plate 3, and the water inlet 80 and the water outlet 90 are arranged in the vicinity of substantially the same place. Board 1
It is interposed between. At this time, the gap 42 between the pipes
1 (see FIG. 1), grease (not shown) having good thermal conductivity is applied to the upper surface of the heat exchange plate 3 so as to fill the gap 42, and each of the adhesive plates 10 and the heat exchange plate 3
The thermal conductivity between the fluid pipe 20 and the fluid pipe 20 is improved. The water entering from the inlet 80 flows concentrically from the outer circumference toward the turning point 60 near the center, and after passing through the turning point 60, concentrically flows from the center toward the outlet 90 on the outer circumference. Flows. Therefore, as can be seen from the cross-sectional structure shown in FIG. 1, water flows from the inlet 80 to the turning point 60 (hereinafter, referred to as an outward path) 40, and the water flows from the turning point 60 to the outlet 90. Fluid passages (hereinafter referred to as “return paths”) 50 are alternately arranged adjacent to each other.

The base plate 1 is, for example, a circular plate made of a metal such as aluminum. The base plate 1 includes bolts 15a and 15 used for fastening to the mounting plate 13.
a plurality of bolt insertion holes 17a, 17 into which b,.
b (see FIG. 1, not shown in FIG. 2). On the upper surface of the base plate 1, five piping bosses 7a used for bending and positioning of the fluid pipe 20 in the fluid pipe 20 piping process,
7b and 19a, 19b, 19c are fixed. Of these, three bosses 19a, 19b, and 19c are cylindrical and are respectively arranged on the elevating pin insertion holes 12a, 12b, and 12c, and the elevating pins 9a, 9b, and 9c pass through the inside. The base plate 1 is also used when piping the fluid pipe 20 in the spiral shape.

Hereinafter, a piping process of the fluid pipe 20 using the base plate 1 will be described with reference to FIG.

First, on the base plate 1, the fluid pipe 20 is
The two bosses 19b and the boss 7a are bent into a U-shape so as to sandwich only the boss 19a, and are arranged on the base plate 1 such that the U-shaped valleys contact the boss 7a. Next, a flat auxiliary plate having substantially the same shape as the base plate 1 is prepared, and the fluid pipe 20 is sandwiched between the base plate 1 and the prepared auxiliary plate. By rotating the base plate 1 about the center 2 as shown by the arrow while pulling the two ends 27a and 27b of the U-shaped fluid pipe 20 outward, the forward path 40 and the return path of the fluid pipe 20 are formed. 50 are aligned and rolled into a circular spiral to form a flat plate. next,
With the fluid pipe 20 formed in a flat shape sandwiched therebetween,
The fluid pipe 20 is pressed by applying pressure to the entire upper surface of the auxiliary plate, and the contact surface of the fluid pipe 20 to each of the adhesive plate 10 (see FIG. 1) and the base plate 1 is made substantially flat. Finally, fluid pipe 2
The 0 end portions 27a and 27b are processed into the water inlet 80 and the water outlet 90 (see FIG. 2), and they are installed near substantially the same place to complete the piping process.

According to such a process, the fluid pipe 20 is
Bending while sandwiching between the auxiliary plate and the base plate 1
Since the fluid pipe 20 is wound (rolled), it is possible to prevent a change (flattening) in the diameter of the fluid pipe 20 that may occur when the fluid pipe 20 is bent.
In particular, a portion 29 which is bent at an absorption angle in contact with the boss 29
A, 29b, 29c, and 29d (see FIG. 2) are effective in increasing the curvature and preventing flattening. Further, since the fluid pipe 20 is pressed to make the contact surface of the fluid pipe 20 (heat exchange plate 3) with the adhesive plate 10 and the base plate 1 substantially flat, the area of the contact surface becomes large, and the fluid pipe 20 becomes large. Can efficiently exchange heat with each thermoelectric module 11 via each adhesive plate 10.

The heat exchange plate 3 is composed of only the fluid pipes 20, and the fluid pipes 20 have an inlet 80 and an outlet 90.
Are provided near the same location, and the outgoing route 40 and the returning route 50 of the water are provided.
Are alternately arranged in a spiral shape. With such a configuration, the temperature difference between the water flowing in the outward path 40 and the water flowing in the return path 50 can be reduced, so that the temperature distribution on the entire upper surface of the heat exchange plate 3 can be made uniform. For this reason, the heat exchange plate 3 has excellent heat uniformity. In addition, since the heat exchange plate 3 is substantially composed of only the fluid pipes 20 and does not include extra parts, the heat exchange plate 3 is thin and has a small heat capacity. Therefore, the thermal response is excellent. Further, the heat exchange plate 3 and each thermoelectric module 11 are connected with bolts 15a,
Since the pressure bonding is performed by using 15b,..., The contact area of the heat exchange plate 3 with each thermoelectric module 11 can be maximized, and the heat exchange efficiency of the heat exchange plate 3 can be improved.

Although it is desirable to provide only one water inlet and one outlet for the temperature control stage, it is also possible to provide two or more water inlets and outlets. For example, the heat exchange plate 3 ′ shown in FIG. 4 has two inlets and two outlets. That is, the outward fluid pipe 20 having the outer inlet 80 and the outlet 92 near the center.
a, and a return-side fluid pipe 20b having an outflow port 90 on the outer periphery and an inflow port 82 near the center are provided in a spiral shape as in FIG. This heat exchange plate 3 'also has the same effect as the heat exchange plate 3 of FIG. 2 having only one inlet and one outlet.

As a second embodiment, a temperature control stage that does not include the base plate 1 as a component can be configured by using the base plate 1 only in a piping process of the fluid pipe 20.

FIG. 5 shows a sectional structure of a temperature control stage having no base plate 1. In FIG. 5, elements having the same functions as the elements described with reference to FIGS. 1 to 3 are denoted by the same reference numerals, and redundant description will be omitted.
(The same applies to the following drawings and description.)

In this temperature adjusting stage, the lower surface of the mounting plate 3 and the upper surface of each thermoelectric module 11 are bonded with a thin-film adhesive sheet (not shown). As the adhesive sheet, a sheet having electrical insulation and heat resistance, such as a polyimide resin, can be employed. The upper surface of the heat exchange plate 3 (or 3 ′) is formed in a good plane without variation in height, and the lower surface of each thermoelectric module 11 and the upper surface of the heat exchange plate 3 are bonded to the above-mentioned adhesive sheet.
(Not shown).

The stage for temperature adjustment shown in FIG. 5 does not require the base plate 1 and the respective adhesive plates 10, so that it is thinner and can have a smaller heat capacity than that of FIG.

FIGS. 6 and 7 are a sectional view of the third embodiment and a plan view of the heat exchange plate. FIG.
FIG. 8 is a sectional view taken along line BB of FIG. 7.

The temperature control stage according to this embodiment includes a heat exchange plate 31 in which a fluid passage 39 is cut. The heat exchange plate 31 is fastened to the mounting plate 13 with a plurality of bolts 15a, 15b,..., And the plurality of thermoelectric modules 11a, 11b, 11c sandwiched between the plates 13, 31 are fixed.

The heat exchange plate 31 includes a substrate 34 having a fluid passage 39 formed on the upper surface thereof, and a cover plate 35 covering the upper surface of the substrate 34.

The substrate 34 is a solid plate made of a material having good heat conductivity such as aluminum, for example, and has a bolt insertion hole 3 into which a plurality of bolts 15a, 15b,.
3a, 33b,... A fluid passage 39 is cut into the upper surface of the substrate 34. The water inlet 80 and the water outlet 90 of the fluid passage 39 have an inlet pipe 41a
And an outlet pipe 41b. The fluid passage 39 has a circular spiral shape substantially similar to that of the embodiment shown in FIG. 2, and has a shape in which the outward path and the return path are alternately arranged.

The cover plate 35 is made of an extremely thin material having good heat conductivity (for example, metal such as aluminum or copper) so as to transmit the temperature of the water flowing through the fluid passage 39 well. 37a, 37b,... The lower surface of the cover plate 35 and the upper surface of the substrate 34 are joined in a watertight manner so that water flowing through the fluid passage 39 does not leak outside.

A fluid passage having the same shape as the fluid passage 39 formed on the upper surface may be formed on the lower surface of the substrate 34.

According to the embodiment shown in FIGS. 6 and 7, it is possible to provide a thin heat exchange plate having excellent heat uniformity and thermal responsiveness.

Next, a fourth embodiment will be described with reference to FIG.

The temperature control stage according to this embodiment includes a heat exchange plate 43 which is formed into a fluid passage 47 by forming a thin plate 45 into irregularities. The lower surface of the mounting plate 13 and the upper surface of each thermoelectric module 11, and the lower surface of each thermoelectric module 11 and the upper surface of the heat exchange plate 43 are bonded with an adhesive sheet (not shown) such as a polyimide resin. .

The heat exchange plate 43 includes a press plate 45
And a cover plate 35.

The press plate 45 is, for example, a single thin stainless steel plate, and has a fluid passage 47 which is pressed as a whole and is recessed on the upper surface thereof. The fluid passage 47 is provided over substantially the entire surface of the press plate 45 in a circular spiral shape as in the above-described embodiment. An inflow pipe and an outflow pipe (not shown) similar to the embodiment of FIG. 7 are attached to an inflow port and an outflow port (not shown) of the water in the fluid passage 47. The lower surface of the press plate 45 can be covered with a heat insulating material (not shown). Thus, heat radiation and heat absorption from the lower surface of the heat exchange plate 43 can be prevented, and the heat exchange efficiency with each thermoelectric module 11 can be further improved.

The lid plate 35 is joined to the upper surface of the press plate 45 in a watertight manner so that water flowing through the fluid passage 47 does not leak outside.

According to such an embodiment, a light and thin heat exchange plate can be provided. Also,
Since the fluid passage is formed by pressing the thin plate, a fluid passage having a desired shape can be easily formed, and a heat exchange plate can be provided at low cost.

By the way, as a modified example of this embodiment, the fluid passage may be constituted by two layers. A thin heat exchange plate can be provided.

The fifth embodiment will be described with reference to FIGS. 9 and 10.

The temperature control stage according to this embodiment includes a heat exchange plate 49 having two layers of fluid passages formed by press working. Mounting plate 13
And the upper surface of each thermoelectric module 11, and the lower surface of each thermoelectric module 11 and the upper surface of the heat exchange plate 49,
Each is bonded with an adhesive sheet (not shown).

The heat exchange plate 49 includes a first layer flat heat exchange section 59 and a second layer flat heat exchange section 61. Each of these heat exchange portions 59 and 61 has the same configuration as the heat exchange plate 43 shown in FIG. That is,
The first layer heat exchange section 59 includes a thin substrate 51 having a press-processed and recessed fluid passage 63 on the lower surface side, and a fluid passage 63.
A cover plate 55 joined to the lower surface of the substrate 51 so that water flowing through the cover 51 does not leak outside. Similarly, the heat exchange section 61 of the second layer also includes a thin substrate 53 having a fluid passage 65 depressed by pressing on the upper surface side, and a lid plate 57 joined to the upper surface of the substrate 53. The lower surface of the first layer heat exchange unit 59 and the upper surface of the second layer heat exchange unit 61 are joined.
The water inlets 67, 69 and the water outlets 71, 73 of these heat exchange parts 59, 61 are respectively provided with an inlet pipe 75,
77 and outlet pipes 79, 81 are attached.

The fluid passages 63 and 65 are formed in, for example, a comb shape as shown in FIG. 10, and in order to make the temperature distribution on the upper surface of the heat exchange plate 49 uniform, the fluid passages of the first layer are formed. By arranging the fluid passages 63 and the fluid passages 65 of the second layer alternately, and by reversing the flow direction of water, the downstream flow path and the upward flow path are arranged alternately adjacently. I do. From the viewpoint of improving the heat exchange efficiency, the lower surface of the heat exchange plate 49, that is, the heat exchange portion 61 of the second layer is used.
Can be covered with a heat insulating material (not shown).

Although several embodiments have been described above, the shape of the fluid passage of the heat exchange plate is described below.
There are various variations other than the above.
For example, two examples of the shape of the fluid passage are shown in FIGS.

The fluid passage 87 of the heat exchange plate 89 shown in FIG. 11 has an inflow port 86 and an outflow port 96 of water at positions opposing each other, for example, between the inflow port 86 and the outflow port 96. The five branch passages branching into the six branch passages 87a to 87f, of which the five branch passages except the branch passage 87a meander, for example, in a substantially N-shape, so that substantially the entire surface of the heat exchange plate 89 is arranged at close intervals. It is going around.

On the other hand, the heat exchange plate 93 shown in FIG.
The fluid passage 95 is provided with a water inlet 88 and a water outlet 98 near substantially the same location, and the substantially entire surface of the heat exchange plate 93 is formed in a spiral shape with its outward path 95a and return path 95b meandering side by side. It goes around at regular intervals. Fluid passage 95
The specific arrangement and the meandering path of each of the heat exchange plates 93 are, for example, four places 91a, 91b, 9
1c and 91d are designed so that the temperature distribution becomes uniform.

The fluid passages 87 and 95 shown in FIGS.
Are fluid tubes, as in some of the embodiments described above.
It may be formed using a (pipe), cut into the surface of a metal plate, or formed by pressing a thin flat plate. As shown in FIGS. 11 and 12, the fluid passages 87, 95
Are arranged densely so that the inflowing water is widely dispersed, the temperature distribution on the entire upper surface of the heat exchange plate can be made uniform, and heat exchange can be performed evenly with each thermoelectric module. it can.

In all of the above, in order to provide a thin heat exchange plate having excellent thermal responsiveness and heat uniformity, fluid passages are provided at a close interval over the entire surface of the plate. On the other hand, even if a fluid passage having a simpler configuration is used, a thin heat exchange plate excellent in thermal responsiveness and heat uniformity can be provided. In the following, an embodiment for that will be described.

FIG. 13 shows a sectional configuration of a temperature control stage according to a sixth embodiment of the present invention, and FIG. 14 shows a configuration of a heat exchange plate provided in the temperature control stage. FIG. 13 is a cross-sectional view taken along line DD of FIG. Further, in the plan view of FIG. 14, the arrangement of a plurality of thermoelectric modules 103a, 103b,..., 103h (hereinafter, each thermoelectric module 103) is also indicated by a dotted line.

This temperature adjusting stage includes a substrate mounting plate 101, thermoelectric modules 103, and a heat exchange plate 105. The lower surface of the mounting plate 101 and the upper surface of each thermoelectric module 103, and the lower surface of each thermoelectric module 103 and the upper surface of the heat exchange plate 105,
Each is bonded with an adhesive sheet (not shown) such as a polyimide resin. By this bonding, the mounting plate 101,
Each thermoelectric module 103 and the heat exchange plate 105 are fixed to each other. Three lifting pins 109 are inserted into three through holes (not numbered) at substantially the center of the temperature control stage.
a, 109b, and 109c are inserted.

The configurations of the mounting plate 101 and each thermoelectric module 103 are the same as those of the mounting plate 13 and each thermoelectric module 11 shown in FIG.

The heat exchange plate 105 has a fluid path 107 having a simple shape of a simple circle, a mat 131 having a certain degree of flexibility as a substrate at the bottom of the plate 105, and a heat path surrounding the fluid path 107. A heat transfer plate 111 is provided to cover the upper surface of the exchange plate 105 and uniformly transmit the temperature of the water in the fluid passage 107 to the entire upper surface of the heat exchange plate 105.

The fluid passage 107 has a water inlet 84 and a water outlet 94, and is formed in a ring shape by a pipe having a circular cross section. A plurality of thermoelectric modules 103 (excluding the thermoelectric module 103b provided at the center of the temperature adjustment stage) are disposed directly above the fluid passage 107.

The mat 131 is made of a flexible resin such as viton or silicone rubber, and is formed in a flat plate shape. The entire upper surface is provided with a recess for filling the fluid passage 107 and the heat transfer plate 111. In particular, near the place where the fluid passage 107 is arranged, a recess having a large depth is provided.
Thereby, it is possible to prevent the unevenness due to the fluid pipe 107 from being formed on the upper surface of the heat exchange plate 105.

The heat transfer plate 111 is made of a resin mixed with a powdered metal excellent in heat transfer, for example, silicon rubber mixed with powdered alumina, and has a certain degree of flexibility. That is, according to the heat transfer plate 111,
Since it is more flexible than a metal material, high adhesiveness, that is, heat transfer, can be obtained without requiring precise processing accuracy. The heat transfer plate 111 has a flat upper surface which is fitted into a recess provided on the upper surface of the mat 131, and is in close contact with the lower surface of each thermoelectric module 103 at the upper surface. Heat transfer plate 11
The fluid passage 107 is embedded in the inside of the fluid passage 1.
The heat transfer plate 111 is in close contact with the entire outer surface of the reference numeral 07.

According to this embodiment, each of the thermoelectric modules 103 and the fluid passage 1
07, the temperature of the water flowing through the fluid passage 107 is quickly and uniformly transmitted to the entire upper surface of the heat exchange plate 105, so that a heat exchange plate excellent in heat responsiveness and heat uniformity is provided. it can. Further, since the heat exchange plate 105 is mostly made of a flexible material, mechanical strain (thermal stress) caused by a temperature difference between the upper surface and the lower surface can be reduced.

FIGS. 15 and 16 show a seventh embodiment. FIG. 15 is a sectional view taken along line EE in FIG. This embodiment is basically the same as the embodiment in FIGS. 13 and 14 except for the configuration of the heat exchange plate.

The heat exchange plate 121 of this embodiment is
A heat transfer mat 141 made of the same material as the heat transfer plate 111 shown in FIGS. 13 and 14 is provided only in a region substantially in contact with each thermoelectric module 103, and in a region not in contact with each thermoelectric module 103 in FIG. , The mat 131 shown in FIG.
And a pad 151 made of the same material. That is, the heat transfer mat 141 includes the thermoelectric modules 103a, 103c to 103f disposed right above the fluid passage 107.
Annular portion 141a in contact with the central portion 1 and the rectangular central portion 1 in contact with the thermoelectric module 103b disposed at the center
41b, and the portions 141a and 141b are connected by a bridge portion 141c. The pad 151 is inserted into a space between the annular portion 141a, the center portion 141b, and the bridge portion 141c of the heat transfer mat 141.
a, 151b, and 151c are inserted. Fluid passage 107 is embedded in heat transfer mat 141.

Each thermoelectric module 103 and the heat exchange plate 121 are composed of the mounting plate 101 and the base plate 117.
And a plurality of bolts 119a, 119
b, ... are fixed. The lower surface of the mounting plate 101 and the upper surface of each thermoelectric module 103, and the lower surface of each thermoelectric module 103 and the upper surface of the heat exchange plate 121,
Each is joined via a heat conductive grease (not shown).

The heat exchange plate 121 quickly and uniformly disperses the temperature of the water flowing through the fluid passage 107,
Heat can be exchanged equally with each thermoelectric module 103.

Although some preferred embodiments of the present invention have been described above, these are merely examples for describing the present invention, and are not intended to limit the scope of the present invention only to these examples. . The present invention can be implemented in other various forms. For example, instead of water, ethylene glycol, Fluorinert (registered trademark), or the like can be used as the temperature control fluid flowing through the heat exchange plate. For the form of the fluid passage, various variations such as a meandering form, a comb-like form, a spiral form, and the like described above may be freely selected, combined, or modified, or a different form may be introduced. Can be. Further, a heat exchange plate can also be configured using only the same material as the heat transfer plate used in the above embodiment.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a temperature control stage according to a first embodiment of the present invention.

FIG. 2 is a plan view of a heat exchange plate provided on the temperature control stage of FIG. 1;

FIG. 3 is a view showing a piping process of a fluid pipe.

FIG. 4 is a plan view showing a modification of the heat exchange plate provided on the temperature control stage of FIG. 1;

FIG. 5 is a cross-sectional view of a temperature control stage according to a second embodiment.

FIG. 6 is a cross-sectional view of a temperature adjusting stage according to a third embodiment.

FIG. 7 is a plan view of a heat exchange plate provided in the temperature control stage of FIG. 6;

FIG. 8 is a sectional view of a temperature adjusting stage according to a fourth embodiment.

FIG. 9 is a sectional view of a temperature adjusting stage according to a fifth embodiment.

FIG. 10 is a plan view of a heat exchange plate provided on the temperature control stage of FIG. 9;

FIG. 11 is a plan view showing a modification of the fluid passage.

FIG. 12 is a plan view showing another modification of the fluid passage.

FIG. 13 is a cross-sectional view of a temperature control stage according to a sixth embodiment.

FIG. 14 is a plan view of a heat exchange plate provided in the temperature control stage of FIG. 13;

FIG. 15 is a sectional view of a temperature adjusting stage according to a seventh embodiment.

FIG. 16 is a plan view of a heat exchange plate provided in the temperature control stage of FIG. 14;

[Explanation of symbols]

1 Base plate 3, 3 ', 31, 43, 49, 89, 93, 105, 1
Reference Signs List 21 Heat exchange plate 11, 103 Thermoelectric conversion module 13, 101 Substrate mounting plate 20 Fluid pipe 34 Substrate 35, 55, 57 Cover plate 39, 47, 65, 87, 95, 107 Fluid passage 45 Press plate 67, 69 , 80, 82, 84, 86, 88 Inlet 71, 73, 90, 92, 94, 96, 98 Outlet 111 Heat transfer plate 141 Heat transfer mat

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Tadayuki Hanamoto 1200 Manda, Hiratsuka-shi, Kanagawa F-term in Komatsu Ltd. Research Laboratory 5E322 AA07 DC01 FA01

Claims (7)

[Claims] 1. A mounting plate on which a substrate is mounted, a thermoelectric conversion module bonded to the mounting plate, and a thermoelectric conversion module bonded to the thermoelectric conversion module and utilizing a heat medium fluid A heat exchange plate for performing heat exchange with the heat exchange plate, the heat exchange plate having a fluid passage through which the heat medium fluid flows, and the fluid passage being substantially the entire area of a joint surface with the thermoelectric conversion module. A temperature control stage for the substrate, which is stretched over the substrate at a substantially uniform density. 2. The fluid passage has a first flow path and a second flow path in which the flow directions of the heat medium fluid are opposite to each other, and the first flow path and the second flow path are the same. The temperature control stage according to claim 1, wherein the temperature control stage is arranged so as to be adjacent to each other alternately over substantially the entire bonding surface. 3. The temperature control stage according to claim 1, wherein the heat exchange plate is formed by bending a pipe constituting the fluid passage into a flat plate shape. 4. The heat exchange plate includes a flat plate having a concave path formed on at least one surface thereof, and a lid plate joined to a surface of the flat plate having the concave path formed therein. The temperature control stage according to claim 1, wherein the passage is a concave passage covered by the lid plate. 5. The heat exchange plate includes a flat plate having a concave path formed on one surface by press working, and a lid plate joined to a surface of the flat plate where the concave path is formed, 2. The temperature control stage according to claim 1, wherein the fluid passage is a concave passage covered by the cover plate. 6. A method of manufacturing a heat exchange plate provided on a temperature adjusting stage of a substrate having a thermoelectric conversion module and performing heat exchange with each of the thermoelectric modules using a heat medium fluid, the method comprising: A step of bending a pipe for flowing into two, a step of forming the folded pipe into a spiral shape and forming a flat plate, and applying a pressure to both surfaces of the flat plate pipe to substantially cut the two surfaces. Producing a plate for heat exchange, comprising: 7. A mounting plate on which a substrate is mounted, a thermoelectric conversion module bonded to the mounting plate, and a thermoelectric conversion module bonded to the thermoelectric conversion module and utilizing a heat medium fluid And a heat exchange plate for performing heat exchange, wherein the heat exchange plate has a heat transfer member having a surface covering substantially the entire area of the joint surface with the thermoelectric conversion module, and inside the heat transfer member. A stage for adjusting the temperature of the substrate, the stage having a fluid passage through which the heat medium fluid flows.