JP2000274874A - Thermoelectric cooler - Google Patents
Thermoelectric coolerInfo
- Publication number
- JP2000274874A JP2000274874A JP11084929A JP8492999A JP2000274874A JP 2000274874 A JP2000274874 A JP 2000274874A JP 11084929 A JP11084929 A JP 11084929A JP 8492999 A JP8492999 A JP 8492999A JP 2000274874 A JP2000274874 A JP 2000274874A
- Authority
- JP
- Japan
- Prior art keywords
- thermoelectric
- conversion element
- cooling device
- heat
- thermoelectric conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、熱電冷却装置に関
し、特に、耐久性および信頼性に優れた熱電冷却装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric cooling device, and more particularly to a thermoelectric cooling device excellent in durability and reliability.
【０００２】[0002]
【従来の技術】熱電変換素子を備えた熱電冷却装置は、
狭い場所にも据え付け可能である、冷媒ガスが漏洩する
心配がない、重量が軽い、配管することなく据え付けで
きるなどの利点を有し、従来から、家庭用冷蔵庫、自動
車用冷蔵庫などの小型冷蔵庫や、ワインクーラー、冷却
水の精密温度調整器などに利用されている。2. Description of the Related Art Thermoelectric cooling devices provided with thermoelectric conversion elements are:
It has the advantages that it can be installed in narrow places, there is no fear of leakage of refrigerant gas, it is lightweight, it can be installed without piping, and it has been used in small refrigerators such as home refrigerators and automotive refrigerators. It is used in precision coolers, wine coolers and cooling water.
【０００３】図７は、従来の熱電冷却装置の一例を示し
た断面図である。この熱電冷却装置は、熱電変換素子１
００と、熱電変換素子１００の両面に設けられた熱伝導
体２００と、熱電変換素子１００の両面にそれぞれ設け
られたマニホールド３００、３００とを備えている。FIG. 7 is a sectional view showing an example of a conventional thermoelectric cooling device. This thermoelectric cooling device includes a thermoelectric conversion element 1
00, heat conductors 200 provided on both sides of the thermoelectric conversion element 100, and manifolds 300 provided on both sides of the thermoelectric conversion element 100, respectively.
【０００４】熱電変換素子１００は、Ｎ型熱電材料１１
１ａとＰ型熱電材料１１１ｂとが交互に配置されて、Ｃ
ｕなどからなる電極１１２を介して接合されたものであ
り、電極１１２に電流を印加することにより、一方の面
では吸熱し、他方の面では発熱するものである。熱電変
換素子１００の両面には、Ａｌ2Ｏ3などのセラミクスか
らなる板状の熱伝導体２００、２００が接着されてい
る。セラミクスは、金属と比較して、絶縁性に優れると
ともに、熱膨張係数が小さく、その結果、熱応力が小さ
いという利点がある。マニホールド３００、３００内に
は、前記熱伝導体２００、２００を介して熱電変換素子
１００と熱交換される熱移動媒体が注入されている。こ
の熱移動媒体には、水などが用いられ、図７に示す矢印
の方向に流れるようにされている。[0004] The thermoelectric conversion element 100 is composed of an N-type thermoelectric material 11.
1a and the P-type thermoelectric material 111b are alternately arranged, and C
The electrodes 112 are joined via an electrode 112 made of u or the like. When an electric current is applied to the electrode 112, heat is absorbed on one surface and heat is generated on the other surface. Plate-like heat conductors 200 made of ceramics such as Al 2 O 3 are adhered to both surfaces of the thermoelectric conversion element 100. Ceramics has the advantage of being excellent in insulating properties and having a low coefficient of thermal expansion as compared with metals, and as a result, having low thermal stress. A heat transfer medium that is exchanged with the thermoelectric conversion element 100 via the heat conductors 200 is injected into the manifolds 300. As the heat transfer medium, water or the like is used, and the heat transfer medium flows in the direction of the arrow shown in FIG.
【０００５】[0005]
【発明が解決しようとする課題】従来の熱電冷却装置で
は、熱伝導体２００、２００は、Ａｌ2Ｏ3などのセラミ
クスからなるものであり、熱電変換素子１００は、電極
１１２を保護し、熱電変換素子１００の取扱いを容易に
するため、熱伝導体２００、２００と接着されている。
熱伝導体２００、２００を形成しているセラミクスは、
上述したように、金属と比較して熱応力の小さいもので
はあるが、熱電変換素子１００に電流を印加した際に、
熱伝導体２００、２００の熱電変換素子１００側とマニ
ホールド３００側とで温度差が生じると、温度差による
熱伝導体２００、２００の応力により、Ｎ型熱電材料１
１１ａやＰ型熱電材料１１１ｂあるいは電極１１２に亀
裂が発生したり、Ｎ型熱電材料１１１ａまたはＰ型熱電
材料１１１ｂと電極１１２とが剥離したりするという不
都合が生じやすい。このため、電気が導通されない状態
となりやすく、耐久性および信頼性が不十分であり、問
題となっていた。In the conventional thermoelectric cooling device, the heat conductors 200 and 200 are made of ceramics such as Al 2 O 3 , and the thermoelectric conversion element 100 protects the electrode 112 and In order to facilitate the handling of the conversion element 100, it is adhered to the heat conductors 200,200.
The ceramics forming the heat conductors 200, 200 are:
As described above, although the thermal stress is smaller than that of metal, when a current is applied to the thermoelectric conversion element 100,
When a temperature difference occurs between the thermoelectric conversion element 100 side and the manifold 300 side of the heat conductors 200, 200, the stress of the heat conductors 200, 200 due to the temperature difference causes the N-type thermoelectric material 1
There is a tendency that cracks occur in the 11a, the P-type thermoelectric material 111b, or the electrode 112, and the N-type thermoelectric material 111a or the P-type thermoelectric material 111b and the electrode 112 are separated from each other. For this reason, it is easy to be in a state where electricity is not conducted, and durability and reliability are insufficient, which has been a problem.
【０００６】よって本発明は、前記事情に鑑みてなされ
たもので、上記の問題を解決し、熱伝導体として、可撓
性を有する薄膜を使用し、熱電変換素子を構成するＮ型
熱電材料やＰ型熱電材料あるいは電極の亀裂、Ｎ型熱電
材料またはＰ型熱電材料と電極との剥離が生じにくく、
耐久性および信頼性に優れた熱電冷却装置を提供するこ
とを課題としている。Accordingly, the present invention has been made in view of the above circumstances, and solves the above-mentioned problems. The present invention uses a flexible thin film as a heat conductor and forms an N-type thermoelectric material constituting a thermoelectric conversion element. And the cracks of the P-type thermoelectric material or the electrode, the separation of the N-type thermoelectric material or the P-type thermoelectric material from the electrode are less likely to occur,
It is an object to provide a thermoelectric cooling device having excellent durability and reliability.
【０００７】[0007]
【課題を解決するための手段】前記課題は、Ｎ型熱電材
料とＰ型熱電材料とこれら熱電材料からなるチップをそ
の両端で互いに接続する電極とを含む熱電変換素子と、
前記熱電変換素子の両面もしくはどちらか一面に設けら
れ、絶縁性および可撓性を有する薄膜からなる熱伝導体
と、前記熱伝導体が熱移動媒体の流路をなす壁部の一部
を構成しているマニホールドとを備えたことを特徴とす
る熱電冷却装置によって解決できる。The object of the present invention is to provide a thermoelectric conversion element including an N-type thermoelectric material, a P-type thermoelectric material, and electrodes for connecting chips made of these thermoelectric materials at both ends thereof,
A heat conductor provided on both surfaces or one of the surfaces of the thermoelectric conversion element and formed of a thin film having insulation and flexibility, and a part of a wall portion in which the heat conductor forms a flow path of a heat transfer medium. This can be solved by a thermoelectric cooling device characterized by having a manifold that performs the cooling operation.
【０００８】このような熱電冷却装置は、可撓性を有す
る薄膜からなる熱伝導体を備えたものであるので、熱電
変換素子に電流を印加して、熱伝導体の熱電変換素子側
とマニホールド側とで温度差を生じさせても、温度差に
よる熱伝導体の応力は、前記熱伝導体の可撓性によって
吸収されるため、Ｎ型熱電材料やＰ型熱電材料あるいは
電極の亀裂、Ｎ型熱電材料またはＰ型熱電材料と電極と
の剥離が生じにくく、耐久性および信頼性に優れた熱電
冷却装置とすることができる。Since such a thermoelectric cooling device is provided with a heat conductor made of a thin film having flexibility, a current is applied to the thermoelectric conversion element, and the thermoelectric conversion element side of the heat conductor and the manifold are connected. Even if a temperature difference is generated between the heat conductor and the side, the stress of the heat conductor due to the temperature difference is absorbed by the flexibility of the heat conductor, so that the N-type thermoelectric material, the P-type thermoelectric material, the crack of the electrode, Separation between the electrode and the thermoelectric material or the P-type thermoelectric material is less likely to occur, and a thermoelectric cooling device excellent in durability and reliability can be provided.
【０００９】上記の熱電冷却装置においては、前記熱伝
導体が、ポリイミド系の材質で形成されたものであるこ
とが望ましい。また、前記熱伝導体が、複数の層からな
るものであることが望ましい。この場合、前記熱伝導体
が、前記熱電変換素子側の表面を形成する耐熱性フィル
ムと、前記熱電変換素子と反対側の表面を形成する耐水
性フィルムとを有することが望ましい。また、上記の熱
電冷却装置においては、熱電変換素子が、前記熱伝導体
に接着されていることが望ましい。さらに、上記の熱電
冷却装置においては、前記マニホールドの一部を形成す
る前記熱伝導体に、突起が形成されていることが望まし
い。In the above thermoelectric cooling device, it is desirable that the heat conductor is formed of a polyimide-based material. Further, it is desirable that the heat conductor is composed of a plurality of layers. In this case, it is preferable that the heat conductor includes a heat-resistant film forming a surface on the thermoelectric conversion element side and a water-resistant film forming a surface on the side opposite to the thermoelectric conversion element. Further, in the thermoelectric cooling device described above, it is preferable that a thermoelectric conversion element is bonded to the heat conductor. Further, in the thermoelectric cooling device described above, it is preferable that a protrusion is formed on the heat conductor that forms a part of the manifold.
【００１０】[0010]
【発明の実施の形態】図１は、本発明の熱電冷却装置の
一例を示した断面図である。この熱電冷却装置は、熱電
変換素子１０と、前記熱電変換素子１０の両面に設けら
れた熱伝導体２０と、前記熱電変換素子１０の両面にそ
れぞれ設けられたマニホールド３０、４０とを備えてい
る。FIG. 1 is a sectional view showing an example of a thermoelectric cooling device according to the present invention. The thermoelectric cooling device includes a thermoelectric conversion element 10, heat conductors 20 provided on both surfaces of the thermoelectric conversion element 10, and manifolds 30 and 40 provided on both surfaces of the thermoelectric conversion element 10, respectively. .
【００１１】熱電変換素子１０は、図２および図３に示
すように、熱電材料チップ１１であるＮ型熱電材料１１
ａとＰ型熱電材料１１ｂとが交互に配置され、それらを
Ｃｕなどからなる電極１２を介して電気的に接続したも
のである。前記熱電材料チップ１１と電極１２とは、図
３に示すように、半田１３を用いて接合されている。ま
た、図１および図３に示すように、熱電変換素子１０の
縁部には、熱電冷却装置の外部と電気的に接続されるリ
ード線６が設けられ、前記リード線６は、図３に示すよ
うに、電極１２と接続されている。As shown in FIGS. 2 and 3, the thermoelectric conversion element 10 is an N-type thermoelectric material 11 which is a thermoelectric material chip 11.
a and P-type thermoelectric materials 11b are alternately arranged, and they are electrically connected via an electrode 12 made of Cu or the like. The thermoelectric material chip 11 and the electrode 12 are joined using solder 13 as shown in FIG. As shown in FIGS. 1 and 3, a lead wire 6 that is electrically connected to the outside of the thermoelectric cooling device is provided at an edge of the thermoelectric conversion element 10. As shown, it is connected to the electrode 12.
【００１２】熱電変換素子１０の両面には、図１および
図３に示すように、前記熱電変換素子１０よりも大きい
熱伝導体２０が接着されている。熱電変換素子１０と熱
伝導体２０とが接着された部分の外側に位置する前記熱
伝導体２０、２０の周縁部どうしは、熱伝導体２０、２
０の間に密閉した空間を形成するために、アクリロニト
リル−ブタジエン−スチレン（ＡＢＳ）などからなる密
閉リング５を挟んで接着されている。As shown in FIGS. 1 and 3, a heat conductor 20 larger than the thermoelectric conversion element 10 is bonded to both surfaces of the thermoelectric conversion element 10. The peripheral portions of the heat conductors 20, 20 located outside the portion where the thermoelectric conversion element 10 and the heat conductor 20 are bonded to each other,
In order to form a sealed space between 0 and 0, they are bonded with a sealing ring 5 made of acrylonitrile-butadiene-styrene (ABS) or the like interposed therebetween.
【００１３】図１に示すように、マニホールド３０の周
縁壁は、外壁３１と前記熱伝導体２０とにより形成さ
れ、マニホールド４０の周縁壁は、外壁４１と前記熱伝
導体２０とにより形成されている。前記外壁３１、４１
の内部側の面には、複数の柱状の突起３１ａ、４１ａが
それぞれ形成されている。また、マニホールド３０、４
０の一端には、熱移動媒体を注入するための注入口３
４、４４が設けられ、他端には、熱移動媒体を排水する
ため排出口３５、４５が設けられ、前記マニホールド３
０、４０内に熱移動媒体を流すことができるようになっ
ている。前記周縁壁を形成する外壁３１、４１と熱伝導
体２０との境界には、熱移動媒体が洩れないように、そ
れぞれＯリング３２、４２が介在されている。As shown in FIG. 1, a peripheral wall of the manifold 30 is formed by an outer wall 31 and the heat conductor 20, and a peripheral wall of the manifold 40 is formed by an outer wall 41 and the heat conductor 20. I have. The outer walls 31, 41
Are formed with a plurality of columnar projections 31a and 41a, respectively. In addition, manifolds 30, 4
0 has an inlet 3 for injecting a heat transfer medium.
4 and 44, and the other end is provided with discharge ports 35 and 45 for draining the heat transfer medium.
The heat transfer medium can be flowed in the inside of the heat transfer medium 0,40. O-rings 32 and 42 are interposed at the boundaries between the outer walls 31 and 41 forming the peripheral wall and the heat conductor 20 so that the heat transfer medium does not leak.
【００１４】前記熱伝導体２０は、絶縁性を有し、可撓
性を有する薄膜により形成されている。前記薄膜を形成
する材質としては、塩化ビニル、テフロン、ウレタン、
ＥＶＡ、ポリプロピレン、シリコーンゴム、合成ゴム、
ＡＢＳ、ポリエチレン、ポリカーボネート、ＰＥＴ、塩
化ビニリデン、ポリイミド系などが好ましく使用され
る。これらの材質は、耐水性を有している。よって、後
述する複数の層からなる熱伝導体に用いてもよい。中で
もポリイミド系は、耐熱性に優れているため、放熱側の
ように高温になるところでは望ましい。吸熱側のように
低温となるところではポリイミド系の材料よりも耐熱性
の低い材料を使用してもよい。The heat conductor 20 has an insulating property and is formed of a flexible thin film. As a material for forming the thin film, vinyl chloride, Teflon, urethane,
EVA, polypropylene, silicone rubber, synthetic rubber,
ABS, polyethylene, polycarbonate, PET, vinylidene chloride, polyimide and the like are preferably used. These materials have water resistance. Therefore, it may be used for a heat conductor composed of a plurality of layers described later. Above all, polyimide-based materials are excellent in heat resistance, and therefore are desirable in places where the temperature is high, such as on the heat dissipation side. Where the temperature is low, such as on the heat absorption side, a material having lower heat resistance than a polyimide-based material may be used.
【００１５】このような熱電冷却装置を使用するには、
前記リード線６を介して、前記熱電変換素子１０に電流
を印加し、熱電変換素子１０のマニホールド３０側の面
から熱伝導体２０を介して吸熱させるとともに、マニホ
ールド４０側の面から熱伝導体２０を介して放熱させ
る。それと同時に、マニホールド３０、４０の一端に設
けられた注入口３４、４４からマニホールド３０、４０
内に熱移動媒体を注入し、他端に設けられた排出口３
５、４５から排出させる。マニホールド３０、４０内に
注入された熱移動媒体は、注入口３４、４４から排出口
３５、４５に向かって流れるとともに、突起３１ａ、４
１ａと突起３１ａ、４１ａの間を縫うように流れる。そ
して、前記熱移動媒体がマニホールド３０、４０内を通
過する間に、前記熱伝導体２０、２０を介して熱移動媒
体と熱電変換素子１０との熱交換が行われる。すなわ
ち、熱移動媒体の温度は、マニホールド３０を通過する
と、熱電変換素子１０からの吸熱により低下し、マニホ
ールド４０を通過すると、熱電変換素子１０からの放熱
により上昇する。このようにして得られたマニホールド
３０を通過した低い温度の熱移動媒体が、例えば、冷蔵
庫内などの冷却に利用される。In order to use such a thermoelectric cooling device,
A current is applied to the thermoelectric conversion element 10 through the lead wire 6 to absorb heat from the surface of the thermoelectric conversion element 10 on the side of the manifold 30 via the heat conductor 20 and from the surface of the thermoelectric conversion element 10 on the side of the manifold 40. Dissipate heat through 20. At the same time, the manifolds 30, 40 are supplied from inlets 34, 44 provided at one end of the manifolds 30, 40.
A heat transfer medium is injected into the inside, and an outlet 3 provided at the other end is provided.
5. Discharge from 45. The heat transfer medium injected into the manifolds 30 and 40 flows from the inlets 34 and 44 toward the outlets 35 and 45, and the protrusions 31a and 4b.
It flows like sewing between 1a and projections 31a and 41a. Then, while the heat transfer medium passes through the manifolds 30 and 40, heat exchange between the heat transfer medium and the thermoelectric conversion element 10 is performed via the heat conductors 20 and 20. That is, the temperature of the heat transfer medium decreases by absorbing heat from the thermoelectric conversion element 10 when passing through the manifold 30, and increases by radiating heat from the thermoelectric conversion element 10 when passing through the manifold 40. The thus obtained low-temperature heat transfer medium that has passed through the manifold 30 is used for cooling, for example, inside a refrigerator.
【００１６】ここで使用される熱移動媒体としては、比
熱が大きい点から水を主体とするものを採用することが
好ましいが、他の液体であってもよく、特に限定されな
い。吸熱側のマニホールド３０には、凍結を防止するた
めに、前記熱移動媒体に不凍液を添加することが好まし
い。前記不凍液は、特に限定されないが、家庭用冷蔵庫
に用いる熱電冷却装置とする場合には、熱移動媒体が漏
れることも考慮し、プロピレングリコールなどの安全性
の高いものを用いることが好ましい。As the heat transfer medium used here, it is preferable to employ a medium mainly composed of water from the viewpoint of a large specific heat, but other liquids may be used and are not particularly limited. It is preferable to add an antifreeze to the heat transfer medium to the heat-absorbing side manifold 30 in order to prevent freezing. The antifreeze is not particularly limited, but when a thermoelectric cooling device used in a home refrigerator is used, it is preferable to use a highly safe one such as propylene glycol in consideration of leakage of the heat transfer medium.
【００１７】このような熱電冷却装置を製造するには、
まず、熱電材料薄板の上面および下面にＮｉめっきを施
し、これを所定の大きさに切断することにより、Ｎ型熱
電材料１１ａおよびＰ型熱電材料１１ｂを得る。次に、
基板にＣｕからなる複数の電極１２を所定の間隔を離し
て仮止めしたものを２枚用意する。そして、前記電極１
２上にクリーム半田を塗布し、基板の電極１２側を対向
させて、Ｎ型熱電材料１１ａとＰ型熱電材料１１ｂとを
交互に配置して挟持させたのち、半田１３を硬化させ
る。その後、仮止めされていた基板をはずすことによ
り、熱電変換素子１０が得られる。このようにして得ら
れた熱電変換素子１０の両面に、熱伝導体２０を接着す
るとともに、熱伝導体２０、２０の間に密閉リング５を
挟み込んで、熱伝導体２０、２０の間に密閉された空間
を形成する。さらに、熱伝導体２０、２０の外側に、Ｏ
リング３２、４２を介して、外壁３１、４１を設けるこ
とにより、マニホールド３０、４０を形成し、図１に示
す熱電冷却装置が得られる。In order to manufacture such a thermoelectric cooling device,
First, Ni plating is applied to the upper and lower surfaces of the thermoelectric material thin plate, and this is cut into a predetermined size to obtain an N-type thermoelectric material 11a and a P-type thermoelectric material 11b. next,
Two substrates are prepared by temporarily fixing a plurality of electrodes 12 made of Cu on a substrate at predetermined intervals. And the electrode 1
After applying cream solder on the substrate 2, the N-type thermoelectric materials 11a and the P-type thermoelectric materials 11b are alternately arranged and sandwiched with the electrodes 12 of the substrate facing each other, and then the solder 13 is cured. Thereafter, the temporarily fixed substrate is removed to obtain the thermoelectric conversion element 10. The heat conductor 20 is bonded to both sides of the thermoelectric conversion element 10 thus obtained, and the sealing ring 5 is sandwiched between the heat conductors 20, 20 so that the heat conductor 20 is sealed between the heat conductors 20, 20. To form a space. Further, outside the heat conductors 20, 20, O
By providing the outer walls 31, 41 via the rings 32, 42, the manifolds 30, 40 are formed, and the thermoelectric cooling device shown in FIG. 1 is obtained.
【００１８】このような熱電冷却装置は、熱伝導体２０
を、可撓性を有する薄膜としたので、熱電変換素子１０
に電流を印加して、前記熱伝導体２０の熱電変換素子１
０側とマニホールド３０、４０側とで温度差を生じさせ
ても、温度差による熱伝導体２０の応力は、熱伝導体２
０、２０の可撓性によって吸収されるため、熱電材料チ
ップ１１あるいは電極１２の亀裂や、熱電材料チップ１
１と電極１２との剥離が生じにくく、耐久性および信頼
性に優れた熱電冷却装置とすることができる。Such a thermoelectric cooling device includes a heat conductor 20
Is a flexible thin film, so that the thermoelectric conversion element 10
Is applied to the thermoelectric conversion element 1 of the heat conductor 20.
Even if a temperature difference is generated between the zero side and the manifolds 30 and 40, the stress of the heat conductor 20 due to the temperature difference is reduced by the heat conductor 2
0 and 20, the cracks in the thermoelectric material chip 11 or the electrode 12 or the thermoelectric material chip 1
1 and the electrode 12 are hardly peeled off, and a thermoelectric cooling device excellent in durability and reliability can be obtained.
【００１９】また、前記熱電変換素子１０が、前記薄膜
に接着されているので、電極１２を保護することができ
るとともに、熱電変換素子１０の取扱いを容易にするこ
とができ、より一層、耐久性および信頼性に優れた熱電
冷却装置とすることができる。また、接着されている方
が、薄膜と電極１２との間の熱抵抗が小さくなるため、
熱伝達の効率が向上する。Further, since the thermoelectric conversion element 10 is adhered to the thin film, the electrode 12 can be protected and the handling of the thermoelectric conversion element 10 can be facilitated, and the durability can be further improved. And a thermoelectric cooling device excellent in reliability can be obtained. In addition, since the thermal resistance between the thin film and the electrode 12 decreases when the adhesive is bonded,
The efficiency of heat transfer is improved.
【００２０】さらに、前記薄膜が、ポリイミド系の材質
で形成されたものであるので、とくに、耐熱性が求めら
れる放熱側において、優れた耐熱性が得られる。Further, since the thin film is formed of a polyimide-based material, excellent heat resistance can be obtained, particularly on the heat radiation side where heat resistance is required.
【００２１】また、マニホールド３０、４０の外壁３
１、４１の内部側の面に突起３１ａ、４１ａを設けたの
で、マニホールド３０、４０内に注入された熱移動媒体
は、注入口３４、４４から排出口３５、４５に向かって
流れるとともに、突起３１ａ、４１ａと突起３１ａ、４
１ａによって流れが乱れ、突起３１ａ、４１ａと突起３
１ａ、４１ａの間を縫うように流れる。したがって、効
率よく熱移動媒体と熱電変換素子１０との熱交換を行う
ことができる。The outer walls 3 of the manifolds 30 and 40
Since the protrusions 31a and 41a are provided on the inner surfaces of the first and the first 41, the heat transfer medium injected into the manifolds 30 and 40 flows from the inlets 34 and 44 toward the outlets 35 and 45, and the protrusions 31a and 41a. 31a, 41a and projections 31a, 4
The flow is disturbed by 1a, and the protrusions 31a, 41a and the protrusion 3
It flows like sewing between 1a and 41a. Therefore, heat exchange between the heat transfer medium and the thermoelectric conversion element 10 can be performed efficiently.
【００２２】本発明の熱電冷却装置においては、熱伝導
体を複数の層からなるものとしてもよく、例えば、図４
に示すように、熱伝導体２１を、２層の薄膜からなるも
のとしてもよい。この場合、前記熱伝導体２１は、前記
熱電変換素子１０側の表面を形成する耐熱性フィルム２
１ａと、前記熱電変換素子１０と反対側の表面を形成す
る耐水性フィルム２１ｂとからなるものであることが望
ましい。このような熱電冷却装置とすることで、熱伝導
体２１の耐久性および耐水性を向上させることができ、
熱電冷却装置の耐久性および信頼性をより一層高めるこ
とができる。In the thermoelectric cooling device of the present invention, the heat conductor may be composed of a plurality of layers.
As shown in (2), the heat conductor 21 may be made of a two-layer thin film. In this case, the heat conductor 21 is a heat-resistant film 2 forming a surface on the thermoelectric conversion element 10 side.
1a and a water-resistant film 21b forming a surface on the opposite side to the thermoelectric conversion element 10. With such a thermoelectric cooling device, the durability and water resistance of the heat conductor 21 can be improved,
The durability and reliability of the thermoelectric cooling device can be further improved.
【００２３】本発明の熱電冷却装置においては、図５に
示すように、マニホールド７０、８０の外壁７１、８１
の内部側の面に突起を設けず、前記マニホールド７０、
８０の周縁壁の一部を形成する熱伝導体２２に、複数の
突起２２ａを形成してもよい。このような熱電冷却装置
とすることで、図１に示すマニホールド３０、４０の外
壁３１、４１の内部側の面に突起３１ａ、４１ａを設け
た場合と同様に、マニホールド７０、８０内に注入され
た熱移動媒体は、注入口７４、８４から排出口７５、８
５に向かって流れるとともに、突起２２ａ、２２ａによ
って流れが乱れて、突起２２ａ、２２ａの間を縫うよう
に流れ、効率よく熱移動媒体と熱電変換素子１０との熱
交換を行うことができる。In the thermoelectric cooling device of the present invention, as shown in FIG. 5, the outer walls 71, 81 of the manifolds 70, 80
No projection is provided on the inner surface of the
A plurality of protrusions 22a may be formed on the heat conductor 22 which forms a part of the peripheral wall of 80. By adopting such a thermoelectric cooling device, the thermoelectric cooling device is injected into the manifolds 70 and 80 in the same manner as the case where the projections 31a and 41a are provided on the inner surfaces of the outer walls 31 and 41 of the manifolds 30 and 40 shown in FIG. The heat transfer medium is transferred from inlets 74 and 84 to outlets 75 and 8.
5, the flow is disturbed by the protrusions 22a, 22a, and flows like sewing between the protrusions 22a, 22a, so that heat exchange between the heat transfer medium and the thermoelectric conversion element 10 can be performed efficiently.
【００２４】なお、突起の形状は、上述した例のよう
に、柱状とすることができるが、例えば、方形、半球状
としてもよく、とくに限定されない。また、突起の数
は、上述した例のように、複数としてもよいが、１以上
の任意の数とすることができ、特に限定されない。The shape of the projection may be columnar as in the above-described example, but may be, for example, square or hemispherical, and is not particularly limited. The number of protrusions may be plural as in the above-described example, but may be any number of one or more, and is not particularly limited.
【００２５】本発明の熱電冷却装置においては、上述し
た例のように、前記熱電変換素子１０が、前記熱伝導体
２０に接着されているものとすることができるが、熱伝
導体２０は、 密閉リング５とＯリング３２、４２とに
はさまれ、固定されているため、接着されていなくても
よく、とくに限定されない。In the thermoelectric cooling device of the present invention, the thermoelectric conversion element 10 can be bonded to the heat conductor 20 as in the above-described example. Since it is sandwiched and fixed between the sealing ring 5 and the O-rings 32 and 42, it does not need to be bonded and is not particularly limited.
【００２６】本発明の熱電冷却装置においては、上述し
た密閉リング５に代えて、図６に示すような、密閉リン
グ５１にリード線６１を貫通させるようにし、前記密閉
リング５１と熱伝導体２０との間にＯリング５１ａ、５
１ａを介在させた構造としてもよい。In the thermoelectric cooling device of the present invention, a lead 61 is passed through a sealing ring 51 as shown in FIG. O-rings 51a, 5
It may be a structure with 1a interposed.
【００２７】本発明の熱電冷却装置においては、熱伝導
体は、上述した例に示したように、熱電変換素子の両面
に設けることができるが、どちらか一方のみに設けても
よく、用途などに応じて決定することができ、特に限定
されない。In the thermoelectric cooling device of the present invention, the heat conductor can be provided on both sides of the thermoelectric conversion element as shown in the above-described example, but may be provided on only one of them. And it is not particularly limited.
【００２８】本発明の熱電冷却装置においては、熱伝導
体を熱電変換素子の両面側に設けた場合、上述した例に
示したように、マニホールドを、熱電変換素子の両面側
に設けてもよいが、どちらか一方のみに設けてもよく、
用途などに応じて決定することができ、特に限定されな
い。In the thermoelectric cooling device of the present invention, when the heat conductor is provided on both sides of the thermoelectric conversion element, the manifold may be provided on both sides of the thermoelectric conversion element as shown in the above-described example. May be provided in only one of them,
It can be determined according to the use and the like, and is not particularly limited.
【００２９】[0029]
【実施例】以下、実施例を示して本発明を詳しく説明す
る。 ［実施例］１．４ｍｍ四方の断面積を有し、高さ１．６
ｍｍ、１２７対の熱電材料チップ１１を有する熱電変換
素子１０を用い、前記熱電変換素子１０の両面に、ポリ
イミドフィルムからなる熱伝導体２０を接着し、その外
側に、Ｏリング３２、４２を介して、外壁３１、４１を
設けることにより、マニホールド３０、４０を形成し、
図１に示す熱電冷却装置を得た。The present invention will be described below in detail with reference to examples. [Example] A cross section of 1.4 mm square and a height of 1.6
mm, using a thermoelectric conversion element 10 having 127 pairs of thermoelectric material chips 11, a heat conductor 20 made of a polyimide film is adhered to both surfaces of the thermoelectric conversion element 10, and O-rings 32 and 42 By providing the outer walls 31 and 41, the manifolds 30 and 40 are formed,
The thermoelectric cooling device shown in FIG. 1 was obtained.
【００３０】［従来例］実施例と同様の熱電変換素子１
０を用い、前記熱電変換素子１０の両面に、Ａｌ2Ｏ3セ
ラミクスからなる熱伝導体を接着し、その外側に、実施
例と同様にしてマニホールドを形成し、熱電冷却装置を
得た。[Conventional example] The same thermoelectric conversion element 1 as in the embodiment
A thermoelectric cooling device was obtained by bonding a thermal conductor made of Al 2 O 3 ceramics to both surfaces of the thermoelectric conversion element 10 and forming a manifold on the outside thereof in the same manner as in the example.
【００３１】このようにして得られた実施例および従来
例の熱電冷却装置に対し、マニホールド内に流速０．３
ｍ／ｓで２７℃の水を流しながら、最大６Ａの電流を３
０秒毎に３０秒間印加し、前記熱電冷却装置に電流が導
通されない状態となるまでの印加回数を調べた。With respect to the thermoelectric cooling devices of the embodiment and the conventional example thus obtained, a flow rate of 0.3
While flowing 27 ° C. water at m / s, the maximum current of 6 A was 3
The voltage was applied every 30 seconds for 30 seconds, and the number of applications until the current was not conducted to the thermoelectric cooling device was examined.
【００３２】その結果、実施例の熱電冷却装置の印加回
数は、１２００回であり、従来例の熱電冷却装置の印加
回数は、３００回であった。このことより、熱伝導体を
ポリイミドフィルムからなるものとすることで、従来と
比較して耐久性に優れた熱電冷却装置が得られることが
あきらかとなった。As a result, the number of applications of the thermoelectric cooling device of the embodiment was 1200 times, and the number of applications of the thermoelectric cooling device of the conventional example was 300 times. From this, it became clear that a thermoelectric cooling device having more excellent durability compared to the conventional one can be obtained by using a heat conductor made of a polyimide film.
【００３３】[0033]
【発明の効果】以上説明したように、本発明の熱電冷却
装置は、可撓性を有する薄膜からなる熱伝導体を備えた
ものであるので、熱電変換素子に電流を印加して、熱伝
導体の熱電変換素子側とマニホールド側とで温度差を生
じさせても、温度差による熱伝導体の応力によって、熱
電材料チップあるいは電極の亀裂、熱電材料チップと電
極との剥離が生じにくく、耐久性および信頼性に優れた
熱電冷却装置とすることができる。As described above, the thermoelectric cooling device of the present invention is provided with a heat conductor made of a flexible thin film. Even if a temperature difference is generated between the thermoelectric conversion element side and the manifold side of the body, cracks in the thermoelectric material chip or electrode, and separation between the thermoelectric material chip and the electrode hardly occur due to the stress of the heat conductor due to the temperature difference, and the durability A thermoelectric cooling device having excellent performance and reliability can be obtained.
【図１】 本発明の熱電冷却装置の一例を示した断面図
である。FIG. 1 is a sectional view showing an example of a thermoelectric cooling device of the present invention.
【図２】 図１に示した熱電冷却装置の要部の構造を示
した斜視図である。FIG. 2 is a perspective view showing a structure of a main part of the thermoelectric cooling device shown in FIG.
【図３】 図１に示した熱電冷却装置の要部の構造を示
した断面図である。FIG. 3 is a cross-sectional view showing a structure of a main part of the thermoelectric cooling device shown in FIG.
【図４】 本発明の熱電冷却装置に用いられる熱伝導体
の他の例を説明するための図である。FIG. 4 is a diagram for explaining another example of the heat conductor used in the thermoelectric cooling device of the present invention.
【図５】 本発明の熱電冷却装置の他の例を示した断面
図である。FIG. 5 is a sectional view showing another example of the thermoelectric cooling device of the present invention.
【図６】 本発明の熱電冷却装置の他の例の要部を示し
た断面図である。FIG. 6 is a sectional view showing a main part of another example of the thermoelectric cooling device of the present invention.
【図７】 従来の熱電冷却装置の一例を示した断面図で
ある。FIG. 7 is a sectional view showing an example of a conventional thermoelectric cooling device.
５ 密閉リング ６ リード線 １０ 熱電変換素子 １１ 熱電材料チップ １１ａ Ｎ型熱電材料 １１ｂ Ｐ型熱電材料 １２ 電極 １３ 半田 ２０、２１ 熱伝導体 ３０、４０、７０、８０ マニホールド ３１、４１、７１、８１ 外壁 ３１ａ、４１ａ、２２ａ 突起 ３４、４４、７４、８４ 注入口 ３５、４５、７５、８５ 排出口 ３２、４２ Ｏリング 5 Sealing ring 6 Lead wire 10 Thermoelectric conversion element 11 Thermoelectric material chip 11a N-type thermoelectric material 11b P-type thermoelectric material 12 Electrode 13 Solder 20,21 Thermal conductor 30,40,70,80 Manifold 31,41,71,81 Outer wall 31a, 41a, 22a Projection 34, 44, 74, 84 Inlet 35, 45, 75, 85 Outlet 32, 42 O-ring
Claims (6)
電材料からなるチップをその両端で互いに接続する電極
とを含む熱電変換素子と、 前記熱電変換素子の両面もしくはどちらか一面に設けら
れ、絶縁性および可撓性を有する薄膜からなる熱伝導体
と、 前記熱伝導体が熱移動媒体の流路をなす壁部の一部を構
成しているマニホールドとを備えたことを特徴とする熱
電冷却装置。1. A thermoelectric conversion element including an N-type thermoelectric material, a P-type thermoelectric material, and electrodes for connecting chips made of these thermoelectric materials to each other at both ends, and provided on both surfaces or one surface of the thermoelectric conversion device. A heat conductor formed of a thin film having insulation and flexibility; and a manifold in which the heat conductor forms a part of a wall portion forming a flow path of a heat transfer medium. Thermoelectric cooling device.
形成されたものであることを特徴とする請求項１記載の
熱電冷却装置。2. The thermoelectric cooling device according to claim 1, wherein the heat conductor is formed of a polyimide-based material.
であることを特徴とする請求項１または２に記載の熱電
冷却装置。3. The thermoelectric cooling device according to claim 1, wherein the heat conductor comprises a plurality of films.
表面を形成する耐熱性フィルムと、前記熱電変換素子と
反対側の表面を形成する耐水性フィルムとを有すること
を特徴とする請求項３に記載の熱電冷却装置。4. The heat conductor includes a heat-resistant film forming a surface on the thermoelectric conversion element side and a water-resistant film forming a surface on the side opposite to the thermoelectric conversion element. Item 4. A thermoelectric cooling device according to Item 3.
着されていることを特徴とする請求項１ないし４のいず
れかに記載の熱電冷却装置。5. The thermoelectric cooling device according to claim 1, wherein the thermoelectric conversion element is bonded to the heat conductor.
熱伝導体に、突起が形成されていることを特徴とする請
求項１ないし５のいずれかに記載の熱電冷却装置。6. The thermoelectric cooling device according to claim 1, wherein a protrusion is formed on the heat conductor that forms a part of the manifold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11084929A JP2000274874A (en) | 1999-03-26 | 1999-03-26 | Thermoelectric cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11084929A JP2000274874A (en) | 1999-03-26 | 1999-03-26 | Thermoelectric cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000274874A true JP2000274874A (en) | 2000-10-06 |
Family
ID=13844395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11084929A Pending JP2000274874A (en) | 1999-03-26 | 1999-03-26 | Thermoelectric cooler |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000274874A (en) |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7926293B2 (en) | 2001-02-09 | 2011-04-19 | Bsst, Llc | Thermoelectrics utilizing convective heat flow |
| US7942010B2 (en) | 2001-02-09 | 2011-05-17 | Bsst, Llc | Thermoelectric power generating systems utilizing segmented thermoelectric elements |
| US7946120B2 (en) | 2001-02-09 | 2011-05-24 | Bsst, Llc | High capacity thermoelectric temperature control system |
| US8069674B2 (en) | 2001-08-07 | 2011-12-06 | Bsst Llc | Thermoelectric personal environment appliance |
| US8079223B2 (en) | 2001-02-09 | 2011-12-20 | Bsst Llc | High power density thermoelectric systems |
| US8408012B2 (en) | 2005-04-08 | 2013-04-02 | Bsst Llc | Thermoelectric-based heating and cooling system |
| US8424315B2 (en) | 2006-03-16 | 2013-04-23 | Bsst Llc | Thermoelectric device efficiency enhancement using dynamic feedback |
| US8613200B2 (en) | 2008-10-23 | 2013-12-24 | Bsst Llc | Heater-cooler with bithermal thermoelectric device |
| US8631659B2 (en) | 2006-08-02 | 2014-01-21 | Bsst Llc | Hybrid vehicle temperature control systems and methods |
| US8974942B2 (en) | 2009-05-18 | 2015-03-10 | Gentherm Incorporated | Battery thermal management system including thermoelectric assemblies in thermal communication with a battery |
| US9006557B2 (en) | 2011-06-06 | 2015-04-14 | Gentherm Incorporated | Systems and methods for reducing current and increasing voltage in thermoelectric systems |
| US9006556B2 (en) | 2005-06-28 | 2015-04-14 | Genthem Incorporated | Thermoelectric power generator for variable thermal power source |
| US9038400B2 (en) | 2009-05-18 | 2015-05-26 | Gentherm Incorporated | Temperature control system with thermoelectric device |
| KR101565560B1 (en) | 2015-03-05 | 2015-11-13 | 주식회사 씨앤엘 | Cooling Apparatus using thermoelement module |
| US9293680B2 (en) | 2011-06-06 | 2016-03-22 | Gentherm Incorporated | Cartridge-based thermoelectric systems |
| US9306143B2 (en) | 2012-08-01 | 2016-04-05 | Gentherm Incorporated | High efficiency thermoelectric generation |
| US9310112B2 (en) | 2007-05-25 | 2016-04-12 | Gentherm Incorporated | System and method for distributed thermoelectric heating and cooling |
| US9365090B2 (en) | 2004-05-10 | 2016-06-14 | Gentherm Incorporated | Climate control system for vehicles using thermoelectric devices |
| US9447994B2 (en) | 2008-10-23 | 2016-09-20 | Gentherm Incorporated | Temperature control systems with thermoelectric devices |
| US9555686B2 (en) | 2008-10-23 | 2017-01-31 | Gentherm Incorporated | Temperature control systems with thermoelectric devices |
| US9719701B2 (en) | 2008-06-03 | 2017-08-01 | Gentherm Incorporated | Thermoelectric heat pump |
| US10270141B2 (en) | 2013-01-30 | 2019-04-23 | Gentherm Incorporated | Thermoelectric-based thermal management system |
| US10603976B2 (en) | 2014-12-19 | 2020-03-31 | Gentherm Incorporated | Thermal conditioning systems and methods for vehicle regions |
| US10625566B2 (en) | 2015-10-14 | 2020-04-21 | Gentherm Incorporated | Systems and methods for controlling thermal conditioning of vehicle regions |
| US10991869B2 (en) | 2018-07-30 | 2021-04-27 | Gentherm Incorporated | Thermoelectric device having a plurality of sealing materials |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
-
1999
- 1999-03-26 JP JP11084929A patent/JP2000274874A/en active Pending
Cited By (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8495884B2 (en) | 2001-02-09 | 2013-07-30 | Bsst, Llc | Thermoelectric power generating systems utilizing segmented thermoelectric elements |
| US7942010B2 (en) | 2001-02-09 | 2011-05-17 | Bsst, Llc | Thermoelectric power generating systems utilizing segmented thermoelectric elements |
| US7946120B2 (en) | 2001-02-09 | 2011-05-24 | Bsst, Llc | High capacity thermoelectric temperature control system |
| US8079223B2 (en) | 2001-02-09 | 2011-12-20 | Bsst Llc | High power density thermoelectric systems |
| US8375728B2 (en) | 2001-02-09 | 2013-02-19 | Bsst, Llc | Thermoelectrics utilizing convective heat flow |
| US7926293B2 (en) | 2001-02-09 | 2011-04-19 | Bsst, Llc | Thermoelectrics utilizing convective heat flow |
| US8069674B2 (en) | 2001-08-07 | 2011-12-06 | Bsst Llc | Thermoelectric personal environment appliance |
| US9365090B2 (en) | 2004-05-10 | 2016-06-14 | Gentherm Incorporated | Climate control system for vehicles using thermoelectric devices |
| US8408012B2 (en) | 2005-04-08 | 2013-04-02 | Bsst Llc | Thermoelectric-based heating and cooling system |
| US9863672B2 (en) | 2005-04-08 | 2018-01-09 | Gentherm Incorporated | Thermoelectric-based air conditioning system |
| US9006556B2 (en) | 2005-06-28 | 2015-04-14 | Genthem Incorporated | Thermoelectric power generator for variable thermal power source |
| US8424315B2 (en) | 2006-03-16 | 2013-04-23 | Bsst Llc | Thermoelectric device efficiency enhancement using dynamic feedback |
| US8631659B2 (en) | 2006-08-02 | 2014-01-21 | Bsst Llc | Hybrid vehicle temperature control systems and methods |
| US9366461B2 (en) | 2007-05-25 | 2016-06-14 | Gentherm Incorporated | System and method for climate control within a passenger compartment of a vehicle |
| US10464391B2 (en) | 2007-05-25 | 2019-11-05 | Gentherm Incorporated | System and method for distributed thermoelectric heating and cooling |
| US9310112B2 (en) | 2007-05-25 | 2016-04-12 | Gentherm Incorporated | System and method for distributed thermoelectric heating and cooling |
| US10473365B2 (en) | 2008-06-03 | 2019-11-12 | Gentherm Incorporated | Thermoelectric heat pump |
| US9719701B2 (en) | 2008-06-03 | 2017-08-01 | Gentherm Incorporated | Thermoelectric heat pump |
| US9447994B2 (en) | 2008-10-23 | 2016-09-20 | Gentherm Incorporated | Temperature control systems with thermoelectric devices |
| US8613200B2 (en) | 2008-10-23 | 2013-12-24 | Bsst Llc | Heater-cooler with bithermal thermoelectric device |
| US9555686B2 (en) | 2008-10-23 | 2017-01-31 | Gentherm Incorporated | Temperature control systems with thermoelectric devices |
| US10106011B2 (en) | 2009-05-18 | 2018-10-23 | Gentherm Incorporated | Temperature control system with thermoelectric device |
| US9666914B2 (en) | 2009-05-18 | 2017-05-30 | Gentherm Incorporated | Thermoelectric-based battery thermal management system |
| US9038400B2 (en) | 2009-05-18 | 2015-05-26 | Gentherm Incorporated | Temperature control system with thermoelectric device |
| US11264655B2 (en) | 2009-05-18 | 2022-03-01 | Gentherm Incorporated | Thermal management system including flapper valve to control fluid flow for thermoelectric device |
| US8974942B2 (en) | 2009-05-18 | 2015-03-10 | Gentherm Incorporated | Battery thermal management system including thermoelectric assemblies in thermal communication with a battery |
| US11203249B2 (en) | 2009-05-18 | 2021-12-21 | Gentherm Incorporated | Temperature control system with thermoelectric device |
| US9006557B2 (en) | 2011-06-06 | 2015-04-14 | Gentherm Incorporated | Systems and methods for reducing current and increasing voltage in thermoelectric systems |
| US9293680B2 (en) | 2011-06-06 | 2016-03-22 | Gentherm Incorporated | Cartridge-based thermoelectric systems |
| US9306143B2 (en) | 2012-08-01 | 2016-04-05 | Gentherm Incorporated | High efficiency thermoelectric generation |
| US10784546B2 (en) | 2013-01-30 | 2020-09-22 | Gentherm Incorporated | Thermoelectric-based thermal management system |
| US10270141B2 (en) | 2013-01-30 | 2019-04-23 | Gentherm Incorporated | Thermoelectric-based thermal management system |
| US10603976B2 (en) | 2014-12-19 | 2020-03-31 | Gentherm Incorporated | Thermal conditioning systems and methods for vehicle regions |
| US11358433B2 (en) | 2014-12-19 | 2022-06-14 | Gentherm Incorporated | Thermal conditioning systems and methods for vehicle regions |
| KR101565560B1 (en) | 2015-03-05 | 2015-11-13 | 주식회사 씨앤엘 | Cooling Apparatus using thermoelement module |
| US10625566B2 (en) | 2015-10-14 | 2020-04-21 | Gentherm Incorporated | Systems and methods for controlling thermal conditioning of vehicle regions |
| US10991869B2 (en) | 2018-07-30 | 2021-04-27 | Gentherm Incorporated | Thermoelectric device having a plurality of sealing materials |
| US11075331B2 (en) | 2018-07-30 | 2021-07-27 | Gentherm Incorporated | Thermoelectric device having circuitry with structural rigidity |
| US11223004B2 (en) | 2018-07-30 | 2022-01-11 | Gentherm Incorporated | Thermoelectric device having a polymeric coating |
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000274874A (en) | Thermoelectric cooler | |
| TWI247334B (en) | Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system | |
| US7032389B2 (en) | Thermoelectric heat pump with direct cold sink support | |
| US5584183A (en) | Thermoelectric heat exchanger | |
| US6230791B1 (en) | Heat transfer cold plate arrangement | |
| US20100175857A1 (en) | Millichannel heat sink, and stack and apparatus using the same | |
| US20050121065A1 (en) | Thermoelectric module with directly bonded heat exchanger | |
| US9287193B2 (en) | Semiconductor device | |
| US20120023970A1 (en) | Cooling and heating water system using thermoelectric module and method for manufacturing the same | |
| CN104134638A (en) | Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip | |
| US20120305043A1 (en) | Thermoelectric devices with reduction of interfacial losses | |
| JP2007036178A (en) | Thermoelectric converter and heating and cooling apparatus | |
| US20140254099A1 (en) | Electronic component and electronic component cooling method | |
| WO2008077038A9 (en) | Direct thermoelectric chiller assembly | |
| JP2012044183A (en) | Integral heat sink with spiral manifold | |
| CN101794714B (en) | Method of brazing a heat sink | |
| JP7407718B2 (en) | thermoelectric module | |
| US20140291832A1 (en) | Integrated cooling modules of power semiconductor device | |
| JP2006237146A (en) | Cascade module for thermoelectric conversion | |
| US6034317A (en) | Thermoelectric module | |
| WO2011036854A1 (en) | Heat exchanger | |
| KR20210132999A (en) | Power module assembly | |
| JP2011069552A (en) | Heat exchanger | |
| JP2001284513A (en) | Power semiconductor device | |
| KR20100003494A (en) | Thermoelectric cooling device with flexible copper band wire |