JP2000196406A - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JP2000196406A JP2000196406A JP10373820A JP37382098A JP2000196406A JP 2000196406 A JP2000196406 A JP 2000196406A JP 10373820 A JP10373820 A JP 10373820A JP 37382098 A JP37382098 A JP 37382098A JP 2000196406 A JP2000196406 A JP 2000196406A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- lid
- surface acoustic
- support base
- peripheral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、弾性表面波装置に
係わり、特に、移動体通信用端末の周波数フィルタ等と
して好適する弾性表面波装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave device, and more particularly, to a surface acoustic wave device suitable as a frequency filter or the like of a mobile communication terminal.
【０００２】[0002]
【従来の技術】弾性表面波素子は、ＬｉＴａＯ3 、Ｌｉ
ＮｂＯ3 、水晶のような圧電材料から成る基板（圧電性
基板）上に、櫛歯状電極（ＩＤＴ：Inter Digital Tran
sducer）、反射器（Ｇｒ）、ボンディングパッド等の電
極層が配設された構造を有し、櫛歯状電極（ＩＤＴ）に
より、電気的信号と弾性表面波（ＳＡＷ）との変換を行
ない、信号を送受信する素子である。そして、弾性表面
波フィルタ、弾性表面波発振器、遅延回路等のデバイス
に用いられている。2. Description of the Related Art Surface acoustic wave devices include LiTaO 3 , Li
A comb-shaped electrode (IDT: Inter Digital Tran) is formed on a substrate (piezoelectric substrate) made of a piezoelectric material such as NbO 3 or quartz.
sducer), a reflector (Gr), a bonding pad, and other electrode layers. The comb-shaped electrode (IDT) converts an electrical signal into a surface acoustic wave (SAW). An element that transmits and receives signals. And it is used for devices such as surface acoustic wave filters, surface acoustic wave oscillators, and delay circuits.
【０００３】そして、このような弾性表面波素子を用い
た装置は、薄型化・小型化が可能であるというメリット
により、近年、特に携帯電話などの移動体通信の分野で
広く用いられるようになっている。[0003] In recent years, devices using such surface acoustic wave devices have been widely used, especially in the field of mobile communications such as mobile phones, because of the merit that they can be made thinner and smaller. ing.
【０００４】このような弾性表面波装置では、弾性表面
波素子が、以下に示すようにパッケージングされてい
る。すなわち、例えばセラミック製の箱形の支持基材内
に、弾性表面波素子がマウントされ、支持基材の内周面
に設けられた信号端子（接続パッド）と圧電性基板上の
ボンディングパッドとが、ＡｕまたはＡｌのワイヤーに
より接続されている。また、支持基材の上端部の金属枠
上に金属製の蓋体が被せられ、金属枠と蓋体とが溶接さ
れている。なお、支持基材の下面には、外部接続端子が
配設されており、この外部接続端子と前記接続パッドと
が、ヴィアホールあるいはキャスタレーションにより導
通されている。そして、このような構造を有する弾性表
面波装置が、プリント配線板上に表面実装されること
で、高密度で小型化された機器が実現される。In such a surface acoustic wave device, a surface acoustic wave element is packaged as described below. That is, for example, a surface acoustic wave element is mounted in a ceramic box-shaped support substrate, and a signal terminal (connection pad) provided on the inner peripheral surface of the support substrate and a bonding pad on the piezoelectric substrate are connected. , Au or Al wires. In addition, a metal lid is placed on the metal frame at the upper end of the supporting base material, and the metal frame and the lid are welded. An external connection terminal is provided on the lower surface of the support base material, and the external connection terminal and the connection pad are electrically connected by a via hole or castellation. The surface acoustic wave device having such a structure is surface-mounted on a printed wiring board, thereby realizing a high-density and compact device.
【０００５】近年、弾性表面波装置の小型化をさらに進
めるために、弾性表面波素子を基材にフリップチップ実
装する技術が開発されている。フリップチップ実装で
は、圧電性基板のボンディングパッドにＡｕ等でパンプ
を形成し、この弾性表面波素子を、導電性パターンの形
成された支持基材上にフェースダウンで搭載し、支持基
材の接続パッドに当接されたパンプを、超音波等を印加
しながら加圧・加熱して接合する。こうして弾性表面波
素子が実装された支持基材上には、例えばセラミック製
の蓋体が被せられ、支持基材と蓋体との間は、エポキシ
樹脂のような熱硬化性樹脂の接着剤により接着され封止
される。In recent years, in order to further reduce the size of the surface acoustic wave device, a technique for flip-chip mounting a surface acoustic wave element on a base material has been developed. In flip-chip mounting, a pump is formed on a bonding pad of a piezoelectric substrate with Au or the like, and the surface acoustic wave element is mounted face-down on a supporting substrate on which a conductive pattern is formed, and connection of the supporting substrate is performed. The pump in contact with the pad is joined by applying pressure and heat while applying ultrasonic waves or the like. On the support substrate on which the surface acoustic wave element is mounted in this manner, for example, a lid made of ceramic is covered, and a gap between the support substrate and the lid is made of a thermosetting resin adhesive such as an epoxy resin. Glued and sealed.
【０００６】このように弾性表面波素子がフリップチッ
プ実装された弾性表面波装置では、支持基材側にワイヤ
ー接続部を設ける必要がないばかりでなく、支持基材の
側周部と圧電性基板との間に、ワイヤーボンディング用
のツールが入るスペースを確保する必要がないので、装
置の小型化をより進めることができる。[0006] In the surface acoustic wave device in which the surface acoustic wave element is flip-chip mounted as described above, it is not necessary to provide a wire connection portion on the supporting base material side, and the side peripheral portion of the supporting base material and the piezoelectric substrate are not required. Since there is no need to secure a space for a tool for wire bonding between them, the size of the device can be further reduced.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、従来か
らの弾性表面波装置においては、以下に示すような問題
があった。However, the conventional surface acoustic wave device has the following problems.
【０００８】すなわち、弾性表面波素子がフリップチッ
プ実装された装置では、その品質管理の一環として不良
原因等の解析のために、支持基材に接合された蓋体を開
けて（開缶して）、内部の導電性パターンや圧電性基板
の表面を観察することが常套的に行なわれている。そし
て、支持基材と蓋体との間が熱硬化性樹脂の接着剤によ
り接合・封止された装置では、開缶するには、特殊な溶
剤を用いて接着剤を溶解させる必要が有り、作業に時間
がかかるばかりでなく、溶剤が引火性を有し、作業が危
険であるという問題があった。また、溶剤を使用せず、
機械的に力を加えるだけで蓋体を開けようとすると、内
部の圧電性基板等を破損してしまうおそれがあった。That is, in a device in which the surface acoustic wave element is flip-chip mounted, the lid joined to the supporting base material is opened (opened) to analyze the cause of failure as part of quality control. ), Observation of the inner conductive pattern and the surface of the piezoelectric substrate is routinely performed. Then, in a device in which the supporting base material and the lid are joined and sealed with a thermosetting resin adhesive, in order to open the can, it is necessary to dissolve the adhesive using a special solvent, In addition to the time required for the operation, there is a problem that the solvent is flammable and the operation is dangerous. Also, without using a solvent,
If an attempt is made to open the lid only by applying a mechanical force, the internal piezoelectric substrate or the like may be damaged.
【０００９】本発明は、これらの問題を解決するために
なされたもので、支持基材に弾性表面波素子がフリップ
チップ実装された小型の弾性表面波装置において、接着
剤を溶解させるための特殊な溶剤を使用することなく、
容易に開缶することができる装置を提供することを目的
とする。SUMMARY OF THE INVENTION The present invention has been made to solve these problems. In a small surface acoustic wave device in which a surface acoustic wave element is flip-chip mounted on a supporting substrate, a special surface acoustic wave device for dissolving an adhesive is provided. Without using any solvents
An object is to provide a device that can be easily opened.
【００１０】[0010]
【課題を解決するための手段】本発明の第１の発明の弾
性表面波装置は、少なくとも一主面に配線層が配設され
た支持基材と、主面に櫛歯状電極が配設された圧電性基
板を有し、該圧電性基板が前記支持基材の前記主面にフ
ェイスダウンに搭載され、バンプを介して接続された弾
性表面波素子と、前記弾性表面波素子の上方を覆うよう
に、前記支持基材上に被せて配置された蓋体と、該蓋体
と前記支持基材とを接着し封止する樹脂接着層とを備え
た弾性表面波装置において、前記蓋体または前記支持基
材の側周面に、これらの接合面に連接して凹部を形成し
たことを特徴とする。According to a first aspect of the present invention, there is provided a surface acoustic wave device having at least one main surface on which a wiring layer is provided and a main surface having a comb-like electrode. Having a piezoelectric substrate, the piezoelectric substrate is mounted face-down on the main surface of the support substrate, and a surface acoustic wave element connected via bumps, and above the surface acoustic wave element. The surface acoustic wave device, comprising: a lid disposed over the support base so as to cover the resin; and a resin adhesive layer for bonding and sealing the lid and the support base. Alternatively, a concave portion is formed on the side peripheral surface of the supporting base material so as to be connected to the joining surface.
【００１１】この第１の発明の弾性表面波装置では、蓋
体または支持基材の側周面に、樹脂接着層が挟み込まれ
た蓋体と支持基材との接合面に連接するように、凹部が
形成されているので、この凹部に、例えば工具の先端部
を挿入して、こじるように力を加えることにより、凹部
が形成された蓋体または支持基材に対して、対応する相
手方から離脱する方向の力を容易に加えることができ
る。そして、内部の弾性表面波素子（圧電性基板）に損
傷を与えることなく、接合部を破断して蓋体を開けるこ
とができる。In the surface acoustic wave device according to the first aspect of the present invention, the surface of the lid or the supporting substrate is connected to the joining surface between the lid and the supporting substrate with the resin adhesive layer interposed therebetween. Since the recess is formed, the tip of the tool is inserted into the recess, for example, and a force is applied to pry, so that the counterpart corresponding to the cover or the support base on which the recess is formed is formed. A force in the direction of detachment can be easily applied. Then, the joint can be broken and the lid can be opened without damaging the internal surface acoustic wave element (piezoelectric substrate).
【００１２】ここで、支持基材と、それと対応する平面
形状を有する蓋体とは、ともにセラミックにより構成す
ることが好ましいが、これらの少くとも一方、特に支持
基材を、ポリイミド樹脂等の樹脂製とすることも可能で
ある。Here, it is preferable that the supporting base material and the lid body having a corresponding planar shape are both made of ceramics. At least one of these supporting base materials is preferably made of a resin such as a polyimide resin. It is also possible to make it.
【００１３】また、蓋体または支持基材の側周面に設け
られる凹部の形状は、溝状とし、この凹溝を、蓋体と支
持基材との接合面に沿って配設することができる。凹部
を溝状とした場合には、これを、蓋体または支持基材の
少なくとも一つの側周面に、幅方向の全体に亘って形成
することができる。また、凹部を、多角形の開口部を有
する凹穴とし、蓋体または支持基材の側周面に、１個ま
たは２個以上スポット的に形成することができる。ま
た、スポット的に形成された凹部では、前記した工具に
よる力が、凹部の内壁面で上滑りして逃げることがな
く、凹部が形成された蓋体または支持基材に伝達しやす
いように、開口部の外形を多角形、特に正方形のような
四角形とすることが望ましい。[0013] Further, the shape of the concave portion provided on the side peripheral surface of the lid or the support base may be a groove, and the concave groove may be provided along the joint surface between the lid and the support base. it can. When the concave portion is formed in a groove shape, the concave portion can be formed on at least one side peripheral surface of the lid or the supporting base material over the entire width direction. Further, the concave portion may be a concave hole having a polygonal opening, and one or two or more spots may be formed on the side peripheral surface of the lid or the support base material. Further, in the concave portion formed in a spot shape, the force by the tool described above is not slid up on the inner wall surface of the concave portion and escapes, so that the force is easily transmitted to the lid or the supporting base material in which the concave portion is formed. It is desirable that the outer shape of the part be a polygon, particularly a square such as a square.
【００１４】さらに、蓋体と支持基材とがそれぞれ矩形
の平面形状を有している場合には、凹部は、これらの矩
形の短辺側の側周面に配設することが望ましい。短辺側
の側周面に凹部を配設した場合には、蓋体または支持基
材に対して、その接合・封止を開ける力をより効果的に
加えることができる。Further, when the lid and the supporting substrate have rectangular planar shapes, it is preferable that the concave portion is disposed on the side peripheral surface on the shorter side of these rectangles. In the case where the concave portion is provided on the side peripheral surface on the short side, a force for opening the joining / sealing can be more effectively applied to the lid or the supporting base material.
【００１５】本発明の第２の発明の弾性表面波装置は、
少なくとも一主面に配線層が配設された支持基材と、主
面に櫛歯状電極が配設された圧電性基板を有し、該圧電
性基板が前記支持基材の前記主面にフェイスダウンに搭
載され、バンプを介して接続された弾性表面波素子と、
前記弾性表面波素子の上方を覆うように、前記支持基材
上に被せて配置された蓋体と、該蓋体と前記支持基材と
を接着し封止する樹脂接着層とを備えた弾性表面波装置
において、前記蓋体が、前記支持基材との接合面上で一
方向にずれて載置され、前記ずれ方向の一方の側におい
て、前記蓋体の側周面が前記支持基材の側周面より外側
に突出し、かつ反対の側において、前記支持基材の側周
面が前記蓋体の側周面より外側に突出していることを特
徴とする。A surface acoustic wave device according to a second aspect of the present invention comprises:
A supporting substrate having a wiring layer disposed on at least one principal surface thereof, and a piezoelectric substrate having a comb-shaped electrode disposed on the principal surface, wherein the piezoelectric substrate is disposed on the principal surface of the supporting substrate. A surface acoustic wave element mounted face down and connected via bumps,
An elastic member comprising: a lid disposed over the support substrate so as to cover an upper part of the surface acoustic wave element; and a resin adhesive layer that adheres and seals the lid and the support substrate. In the surface acoustic wave device, the lid is placed so as to be shifted in one direction on a bonding surface with the support base material, and on one side in the shift direction, a side peripheral surface of the lid is the support base material. , And on the opposite side, the side peripheral surface of the support base protrudes outward from the side peripheral surface of the lid.
【００１６】この第２の発明の弾性表面波装置では、蓋
体と支持基材とが、これらの接合面上で一方向にずれて
配置されており、ずれ方向の一方の側で、蓋体の側周面
が支持基材の側周面に対して外側に突出すると同時に、
反対の側で、支持基材の側周面が蓋体の側周面に対して
外側に突出しているので、蓋体と支持基材のそれぞれ突
出した側周面を、万力などの工具で挟んで締め付けるこ
とにより、樹脂接着層による接合部に接合面に対して平
行な剪断力を加えることができる。そして、内部の圧電
性基板に損傷を与えることなく、接合部を容易に破断
し、開缶することができる。In the surface acoustic wave device according to the second aspect of the present invention, the lid and the supporting base material are arranged so as to be shifted in one direction on the joint surface thereof, and the lid is supported on one side in the shifting direction. At the same time that the side peripheral surface of the protrusion projects outward with respect to the side peripheral surface of the support base material,
On the opposite side, the side peripheral surface of the support base protrudes outward with respect to the side peripheral surface of the lid. By sandwiching and tightening, a shearing force parallel to the bonding surface can be applied to the bonding portion formed by the resin adhesive layer. Then, the joint can be easily broken and the can can be opened without damaging the internal piezoelectric substrate.
【００１７】ここで、支持基材と、それと対応する平面
形状を有する蓋体とは、ともにセラミックにより構成す
ることが好ましいが、これらの少くとも一方、特に支持
基材を、ポリイミド樹脂等の樹脂製とすることも可能で
ある。Here, it is preferable that both the supporting base material and the lid having a planar shape corresponding to the supporting base material are made of ceramic. At least one of the supporting base materials is particularly made of a resin such as a polyimide resin. It is also possible to make it.
【００１８】また、蓋体の側周面が支持基材のそれに対
して突出している突出部の長さは、この突出部の内周面
と、支持基材上に搭載・実装された圧電性基板の側周面
との間の最小の間隔より、小さくすることが望ましい。
このように構成された弾性表面波装置では、接合部の破
断時に蓋体がずれ動いた場合に、蓋体の内周面が圧電性
基板に当たることがなく、圧電性基板の損傷・破壊がよ
り効果的に防止される。The length of the projecting portion of which the side peripheral surface of the lid protrudes from that of the supporting substrate is determined by the inner peripheral surface of the projecting portion and the piezoelectric material mounted and mounted on the supporting substrate. It is desirable to make the distance smaller than the minimum distance between the side peripheral surface of the substrate.
In the surface acoustic wave device configured as described above, when the lid is displaced and moved when the joint is broken, the inner peripheral surface of the lid does not hit the piezoelectric substrate, and the piezoelectric substrate is more damaged and broken. Effectively prevented.
【００１９】さらに、蓋体と支持基材とがそれぞれ矩形
の平面形状を有している場合、蓋体のずらす方向は矩形
の長辺に平行な方向とし、側周面の突出部を短辺側に配
設することが望ましい。このように蓋体を長辺に平行に
ずらして、突出部を短辺側に配設した場合には、長辺側
に設けた場合に比べて、蓋体をずらしたことによる支持
基材の実装面積の減少分がより少ないという利点があ
る。Further, when the lid and the supporting base material have a rectangular planar shape, the direction in which the lid is shifted is a direction parallel to the long side of the rectangle, and the projecting portion of the side peripheral surface is the short side. It is desirable to arrange on the side. When the lid is shifted in parallel to the long side and the protruding portion is arranged on the short side in this way, the support base is shifted by shifting the lid as compared with the case where the projection is provided on the long side. There is an advantage that the reduction in the mounting area is smaller.
【００２０】[0020]
【発明の実施の形態】以下、本発明の実施例を、図面に
基づいて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００２１】図１および図２は、それぞれ本発明の弾性
表面波装置の第１の実施例を示す斜視図および断面図で
ある。なお、図１では、支持基材と蓋体とを接着する前
の状態を示す。FIGS. 1 and 2 are a perspective view and a sectional view, respectively, showing a first embodiment of a surface acoustic wave device according to the present invention. FIG. 1 shows a state before the supporting base material and the lid are bonded.
【００２２】これらの図において、符号１は、セラミッ
ク製で平面形状が矩形の浅い箱形の支持基材を示し、こ
の支持基材１の内底面には接続パッド２が配設されてい
る。また、支持基材１の外底面には、外部接続パッド３
が配設されており、この外部接続パッド３と内底面の接
続パッド２とが、ヴィアホール４を介して導通されてい
る。そして、このように配線層が形成された支持基材１
の接続パッド２形成面に、圧電性基板５上に櫛歯状電極
６とボンディングパッド７等がそれぞれ形成された弾性
表面波素子８が、フェースダウンに配置されて搭載さ
れ、ボンディングパッド７と支持基材１の接続パッド２
とが、Ａｕバンプ９を介して接合されている。なお、支
持基材１の内底面の接続パッド２と外部接続パッド３と
の接続は、ヴィアホール４に代わり、図３に示すように
設けられた導電路（キャスタレーション）４ａを介して
行なうこともできる。In these figures, reference numeral 1 denotes a shallow box-shaped support substrate made of ceramic and having a rectangular planar shape, and a connection pad 2 is provided on the inner bottom surface of the support substrate 1. The external connection pads 3 are provided on the outer bottom surface of the support base material 1.
The external connection pad 3 is electrically connected to the connection pad 2 on the inner bottom surface via the via hole 4. Then, the supporting substrate 1 on which the wiring layer is formed as described above
A surface acoustic wave element 8 having a comb-shaped electrode 6, a bonding pad 7, and the like formed on a piezoelectric substrate 5 is mounted face-down on the surface on which the connection pad 2 is formed. Connection pad 2 of substrate 1
Are bonded via the Au bump 9. The connection between the connection pads 2 on the inner bottom surface of the support base 1 and the external connection pads 3 is performed via conductive paths (castellations) 4a provided as shown in FIG. Can also.
【００２３】また、こうして弾性表面波素子８がフリッ
プチップ実装された支持基材１上に、セラミック製で支
持基材１と同じ矩形の平面形状を有する蓋体１０が被せ
られ、支持基材１と蓋体１０との間が、エポキシ樹脂の
ように熱硬化性樹脂から成る接着剤（図示を省略。）に
より、接合され封止されている。ここで、蓋体１０の対
向する２つの短辺側の側周面の下端部には、接着剤が挟
着された支持基材１との接合面Ｆに沿って、かつ幅方向
の全体に亘って、溝状の凹部１１が設けられている。A cover 10 made of ceramic and having the same rectangular planar shape as the support base 1 is placed on the support base 1 on which the surface acoustic wave element 8 is flip-chip mounted. And the lid 10 are joined and sealed by an adhesive (not shown) made of a thermosetting resin such as an epoxy resin. Here, the lower end of the side peripheral surface on the two opposite short sides of the lid 10 is formed along the joint surface F with the support base material 1 where the adhesive is sandwiched and in the entire width direction. A groove-shaped recess 11 is provided over the entire surface.
【００２４】このように構成される第１の実施例の弾性
表面波装置では、蓋体１０の側周面に設けられた凹部１
１に、スクリュードライバーのような工具の先端部を挿
入し、こじるようにして蓋体１０に上向きの力を加える
ことにより、接着剤による接合部を容易に破断し、蓋体
１０を開けることができる。そして、この接合部の破断
の際に、内部に搭載・実装された弾性表面波素子８の圧
電性基板５に損傷を与えることがなく、不良等の解析を
支障なく能率的に行なうことができる。In the surface acoustic wave device according to the first embodiment thus configured, the concave portion 1 provided on the side peripheral surface of the lid 10 is provided.
1, by inserting the tip of a tool such as a screwdriver and prying and applying an upward force to the lid 10, the joint portion by the adhesive is easily broken, and the lid 10 can be opened. it can. Then, when the joint is broken, the piezoelectric substrate 5 of the surface acoustic wave element 8 mounted and mounted therein is not damaged, and the analysis of defects and the like can be efficiently performed without any trouble. .
【００２５】次に、本発明の第２の実施例について説明
する。Next, a second embodiment of the present invention will be described.
【００２６】第２の実施例の弾性表面波装置では、図４
および図５にそれぞれ示すように、蓋体１０が、支持基
材１との接合面Ｆ上で、矩形の長辺に平行な方向にずれ
て配置されており、蓋体１０の短辺側の一方の側周面
が、下方の支持基材１の側周面に対して外側に突出して
配置され、かつ反対の短辺側において、支持基材１の側
周面が上方の蓋体１０の側周面に対して外側に突出して
配置されている。そして、蓋体１０の側周面が支持基材
１のそれより外側に突出している長さＬは、この蓋体１
０の突出部の内周面と、支持基材１上に搭載・実装され
た圧電性基板５の側周面との間の最小間隔ｄより、小さ
く設定されている。なお、第２の実施例で、その他の部
分は第１の実施例と同様に構成されているので、説明を
省略する。In the surface acoustic wave device of the second embodiment, FIG.
As shown in FIG. 5 and FIG. 5, the lid 10 is disposed on the joint surface F with the support substrate 1 so as to be shifted in a direction parallel to the long side of the rectangle. One side peripheral surface is disposed so as to protrude outward with respect to the side peripheral surface of the lower supporting substrate 1, and on the opposite short side, the side peripheral surface of the supporting substrate 1 is It is arranged to protrude outward with respect to the side peripheral surface. The length L of the side peripheral surface of the lid 10 projecting outward from that of the support substrate 1 is equal to the length L of the lid 1.
The distance d is set smaller than the minimum distance d between the inner peripheral surface of the zero protruding portion and the side peripheral surface of the piezoelectric substrate 5 mounted and mounted on the support substrate 1. In the second embodiment, the other parts are configured in the same manner as the first embodiment, and thus the description is omitted.
【００２７】このように構成される第２の実施例の弾性
表面波装置では、以下に示すように、簡単な操作で効率
的に開缶作業を行なうことができる。すなわち、図５に
示すように、蓋体１０と支持基材１のそれぞれ突出した
側周面に、万力１２のような締め付け工具の挟持部１３
を当て、締め付け力（矢印で示す。）を加えることによ
り、樹脂接着剤による接合部に、蓋体１０と支持基材１
との接合面Ｆに対して平行な剪断力を加えることができ
る。そして、内部に収容された圧電性基板５に損傷を与
えることなく、容易に接合部を破断することができる。
なお、図中、符号１４は万力の雄ねじ部を示し、１５は
ハンドルを示す。In the surface acoustic wave device of the second embodiment configured as described above, the can opening operation can be efficiently performed by a simple operation as described below. That is, as shown in FIG. 5, a clamping portion 13 of a fastening tool such as a vise 12 is provided on each of the protruding side peripheral surfaces of the lid 10 and the support base material 1.
, And a fastening force (indicated by an arrow) is applied, so that the lid 10 and the supporting substrate 1
And a shearing force parallel to the joining surface F with the contact member. Then, the joint can be easily broken without damaging the piezoelectric substrate 5 housed therein.
In the drawings, reference numeral 14 denotes a vice male screw portion, and reference numeral 15 denotes a handle.
【００２８】さらに、蓋体１０の側周面の突出長さＬ
が、この蓋体１０の突出部の内周面と、支持基材１上に
搭載・実装された圧電性基板５の側周面との最小間隔ｄ
より、小さく設定されているので、接合部が破断した際
に、蓋体１０の内周面が圧電性基板５に当たってこれを
損傷・破壊するおそれがなく、開缶作業の作業性がさら
に向上するという利点がある。Further, the projecting length L of the side peripheral surface of the lid 10
Is the minimum distance d between the inner peripheral surface of the protruding portion of the lid 10 and the side peripheral surface of the piezoelectric substrate 5 mounted and mounted on the support substrate 1.
Since it is set smaller, the inner peripheral surface of the lid 10 does not hit the piezoelectric substrate 5 and may be damaged or broken when the joint is broken, and the workability of the can opening operation is further improved. There is an advantage.
【００２９】なお、本発明は上記した実施例に限定され
るものではなく、発明の趣旨を逸脱しない範囲でいろい
ろに変形させることができる。The present invention is not limited to the above-described embodiment, but can be variously modified without departing from the spirit of the invention.
【００３０】[0030]
【発明の効果】以上の記載から明らかなように、本発明
によれば、弾性表面波素子がフリップチップ実装された
小型の弾性表面波装置において、蓋体と支持基材との間
の接合部を、特殊な溶媒を用いることなく容易に破断し
て、蓋体を開けることができる。そして、開缶の際に、
弾性表面波素子に損傷を与えることがない。As is apparent from the above description, according to the present invention, in a small surface acoustic wave device in which a surface acoustic wave element is flip-chip mounted, a bonding portion between a lid and a supporting base material is provided. Can be easily broken without using a special solvent, and the lid can be opened. And when opening the can,
There is no damage to the surface acoustic wave element.
【図１】本発明の弾性表面波装置の第１の実施例を概略
的に示す斜視図。FIG. 1 is a perspective view schematically showing a first embodiment of a surface acoustic wave device according to the present invention.
【図２】本発明の第１の実施例の断面図。FIG. 2 is a cross-sectional view of the first embodiment of the present invention.
【図３】本発明の第１の実施例における接続パッドの別
の接続構造を示す断面図。FIG. 3 is a sectional view showing another connection structure of the connection pad according to the first embodiment of the present invention.
【図４】本発明の第２の実施例を概略的に示す斜視図。FIG. 4 is a perspective view schematically showing a second embodiment of the present invention.
【図５】本発明の第２の実施例の断面図。FIG. 5 is a sectional view of a second embodiment of the present invention.
【図６】第２の実施例の弾性表面波装置を万力等で開缶
する方法を示す図。FIG. 6 is a view showing a method of opening the surface acoustic wave device according to the second embodiment with a vice or the like.
１………支持基材 ２………接続パッド ５………圧電性基板 ６………櫛歯状電極 ７………ボンディングパッド ８………Ａｕバンプ １０………蓋体 １１………凹部 １２………万力 DESCRIPTION OF SYMBOLS 1 ... Support base material 2 ... Connection pad 5 ... Piezoelectric substrate 6 ... Comb-shaped electrode 7 ... Bonding pad 8 ... Au bump 10 ... Lid 11 ... Recess 12: vise
Claims (8)
支持基材と、 主面に櫛歯状電極が配設された圧電性基板を有し、該圧
電性基板が前記支持基材の前記主面にフェイスダウンに
搭載され、バンプを介して接続された弾性表面波素子
と、 前記弾性表面波素子の上方を覆うように、前記支持基材
上に被せて配置された蓋体と、 該蓋体と前記支持基材とを接着し封止する樹脂接着層と
を備えた弾性表面波装置において、 前記蓋体または前記支持基材の側周面に、これらの接合
面に連接して凹部を形成したことを特徴とする弾性表面
波装置。1. A support substrate having a wiring layer disposed on at least one main surface thereof, and a piezoelectric substrate having a comb-shaped electrode disposed on a main surface thereof, wherein the piezoelectric substrate is provided with the support substrate. A surface acoustic wave element mounted face-down on the main surface of the surface acoustic wave element and connected via bumps, and a cover body disposed over the support base material so as to cover above the surface acoustic wave element. A surface acoustic wave device provided with a resin adhesive layer that bonds and seals the lid and the support substrate, wherein a side peripheral surface of the lid or the support substrate is connected to a joining surface thereof. A surface acoustic wave device characterized in that a concave portion is formed by forming a concave portion.
れ矩形の平面形状を有し、その短辺側の側周面に、前記
凹部が配設されていることを特徴とする請求項１記載の
弾性表面波装置。2. The device according to claim 1, wherein the support base and the lid each have a rectangular planar shape, and the concave portion is provided on a side peripheral surface on a short side thereof. The surface acoustic wave device according to claim 1.
って配設されていることを特徴とする請求項１または２
記載の弾性表面波装置。3. The device according to claim 1, wherein the recess has a groove shape and is provided along the joint surface.
The surface acoustic wave device according to claim 1.
材の側周面の一部分に、多角形の開口部を有するように
形成されていることを特徴とする請求項１または２記載
の弾性表面波装置。4. The method according to claim 1, wherein the recess is formed so as to have a polygonal opening in a part of a side peripheral surface of the lid or the support base. Surface acoustic wave device.
支持基材と、 主面に櫛歯状電極が配設された圧電性基板を有し、該圧
電性基板が前記支持基材の前記主面にフェイスダウンに
搭載され、バンプを介して接続された弾性表面波素子
と、 前記弾性表面波素子の上方を覆うように、前記支持基材
上に被せて配置された蓋体と、 該蓋体と前記支持基材とを接着し封止する樹脂接着層と
を備えた弾性表面波装置において、 前記蓋体が、前記支持基材との接合面上で一方向にずれ
て載置され、前記ずれ方向の一方の側において、前記蓋
体の側周面が前記支持基材の側周面より外側に突出し、
かつ反対の側において、前記支持基材の側周面が前記蓋
体の側周面より外側に突出していることを特徴とする弾
性表面波装置。5. A supporting substrate having at least one main surface on which a wiring layer is disposed, and a piezoelectric substrate having a comb-shaped electrode disposed on a main surface, wherein the piezoelectric substrate is provided with the supporting substrate. A surface acoustic wave element mounted face-down on the main surface of the surface acoustic wave element and connected via bumps, and a cover body disposed over the support base material so as to cover above the surface acoustic wave element. A surface acoustic wave device comprising a resin adhesive layer that adheres and seals the lid and the support substrate, wherein the lid is displaced in one direction on a joint surface with the support substrate. Placed, on one side of the shift direction, the side peripheral surface of the lid protrudes outward from the side peripheral surface of the support base material,
A surface acoustic wave device wherein a side peripheral surface of the support base protrudes outward from a side peripheral surface of the lid on an opposite side.
れ矩形の平面形状を有し、前記蓋体および前記支持基材
の側周面の突出部が、前記矩形の短辺側に設けられてい
ることを特徴とする請求項５記載の弾性表面波装置。6. The support base and the lid each have a rectangular planar shape, and a protrusion on a side peripheral surface of the lid and the support base is provided on a short side of the rectangle. The surface acoustic wave device according to claim 5, wherein:
の突出部の内周面と、前記圧電性基板の側周面との最小
間隔よりも小さいことを特徴とする請求項５または６記
載の弾性表面波装置。7. A projection length of a side peripheral surface of the lid is smaller than a minimum distance between an inner peripheral surface of a projection of the lid and a side peripheral surface of the piezoelectric substrate. The surface acoustic wave device according to claim 5.
れセラミックにより構成されていることを特徴とする請
求項１乃至７のいずれか１項記載の弾性表面波装置。8. The surface acoustic wave device according to claim 1, wherein the support base and the lid are each made of ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10373820A JP2000196406A (en) | 1998-12-28 | 1998-12-28 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10373820A JP2000196406A (en) | 1998-12-28 | 1998-12-28 | Surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000196406A true JP2000196406A (en) | 2000-07-14 |
Family
ID=18502816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10373820A Withdrawn JP2000196406A (en) | 1998-12-28 | 1998-12-28 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000196406A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012080188A (en) * | 2010-09-30 | 2012-04-19 | Kyocera Corp | Elastic wave device, and method of manufacturing the same |
-
1998
- 1998-12-28 JP JP10373820A patent/JP2000196406A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012080188A (en) * | 2010-09-30 | 2012-04-19 | Kyocera Corp | Elastic wave device, and method of manufacturing the same |
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