JP2000195887A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000195887A5 JP2000195887A5 JP1998369705A JP36970598A JP2000195887A5 JP 2000195887 A5 JP2000195887 A5 JP 2000195887A5 JP 1998369705 A JP1998369705 A JP 1998369705A JP 36970598 A JP36970598 A JP 36970598A JP 2000195887 A5 JP2000195887 A5 JP 2000195887A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- insulating film
- opening area
- bonding pad
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10369705A JP2000195887A (ja) | 1998-12-25 | 1998-12-25 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10369705A JP2000195887A (ja) | 1998-12-25 | 1998-12-25 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000195887A JP2000195887A (ja) | 2000-07-14 |
| JP2000195887A5 true JP2000195887A5 (https=) | 2005-12-15 |
Family
ID=18495117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10369705A Pending JP2000195887A (ja) | 1998-12-25 | 1998-12-25 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000195887A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100691151B1 (ko) * | 2005-02-24 | 2007-03-09 | 삼성전기주식회사 | 솔더범프 앵커시스템 |
| US9818710B2 (en) * | 2014-03-28 | 2017-11-14 | Intel Corporation | Anchored interconnect |
| JP2016184620A (ja) * | 2015-03-25 | 2016-10-20 | 大日本印刷株式会社 | 多層配線構造体 |
| JP2016184619A (ja) * | 2015-03-25 | 2016-10-20 | 大日本印刷株式会社 | 多層配線構造体 |
| WO2025206133A1 (ja) * | 2024-03-27 | 2025-10-02 | 京セラ株式会社 | バンプ用電極構造、バンプ構造およびサーマルヘッド |
-
1998
- 1998-12-25 JP JP10369705A patent/JP2000195887A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW429492B (en) | Ball grid array package and its fabricating method | |
| JP2000195887A5 (https=) | ||
| JPH031540U (https=) | ||
| JP2914409B2 (ja) | 半導体素子 | |
| JPH0418474U (https=) | ||
| JPS6395271U (https=) | ||
| JPS5951496U (ja) | 電気炉電極の冷却装置 | |
| JPS61153374U (https=) | ||
| JPH0454153U (https=) | ||
| JPS63187330U (https=) | ||
| JPH022835U (https=) | ||
| JPH0430720U (https=) | ||
| JPS63157948U (https=) | ||
| JPS6367756A (ja) | 混成集積回路装置 | |
| JPH0323937U (https=) | ||
| JPH02122436U (https=) | ||
| JPH0451145U (https=) | ||
| JPH01160836U (https=) | ||
| JPH03110870U (https=) | ||
| JPH03106750U (https=) | ||
| JPH02114918U (https=) | ||
| JPH038449U (https=) | ||
| JPH01117074U (https=) | ||
| JPS61104579U (https=) | ||
| JPH0459138U (https=) |