JP2000195887A5 - - Google Patents

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Publication number
JP2000195887A5
JP2000195887A5 JP1998369705A JP36970598A JP2000195887A5 JP 2000195887 A5 JP2000195887 A5 JP 2000195887A5 JP 1998369705 A JP1998369705 A JP 1998369705A JP 36970598 A JP36970598 A JP 36970598A JP 2000195887 A5 JP2000195887 A5 JP 2000195887A5
Authority
JP
Japan
Prior art keywords
opening
insulating film
opening area
bonding pad
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998369705A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000195887A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP10369705A priority Critical patent/JP2000195887A/ja
Priority claimed from JP10369705A external-priority patent/JP2000195887A/ja
Publication of JP2000195887A publication Critical patent/JP2000195887A/ja
Publication of JP2000195887A5 publication Critical patent/JP2000195887A5/ja
Pending legal-status Critical Current

Links

JP10369705A 1998-12-25 1998-12-25 電子部品 Pending JP2000195887A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10369705A JP2000195887A (ja) 1998-12-25 1998-12-25 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10369705A JP2000195887A (ja) 1998-12-25 1998-12-25 電子部品

Publications (2)

Publication Number Publication Date
JP2000195887A JP2000195887A (ja) 2000-07-14
JP2000195887A5 true JP2000195887A5 (cg-RX-API-DMAC7.html) 2005-12-15

Family

ID=18495117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10369705A Pending JP2000195887A (ja) 1998-12-25 1998-12-25 電子部品

Country Status (1)

Country Link
JP (1) JP2000195887A (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100691151B1 (ko) * 2005-02-24 2007-03-09 삼성전기주식회사 솔더범프 앵커시스템
US9818710B2 (en) * 2014-03-28 2017-11-14 Intel Corporation Anchored interconnect
JP2016184620A (ja) * 2015-03-25 2016-10-20 大日本印刷株式会社 多層配線構造体
JP2016184619A (ja) * 2015-03-25 2016-10-20 大日本印刷株式会社 多層配線構造体
WO2025206133A1 (ja) * 2024-03-27 2025-10-02 京セラ株式会社 バンプ用電極構造、バンプ構造およびサーマルヘッド

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