JP2000192225A - Film forming mask device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film forming mask device which is easy in assembly of the film forming mask device, accurate in positioning a mask, free from any defective insulation and defective disconnection caused by mask deviation, and excellent in workability and reliability. SOLUTION: In a film forming mask device, a storage recessed part 12 to store a plurality of film forming bodies B is formed, a lower mask pattern 11 for film forming is formed in a bottom surface of the storage recessed part, and a lower mask 1 having a spacer integrated with a mask, and an upper mask 2 which is closely attached to an upper surface of the lower mask and has upper mask patterns 21, are provided. The upper mask is provided with projecting parts 22, 23 to press the film forming body against the bottom surface of the storage recessed part at the position corresponding to the forming position of the storage recessed part of the lower mask.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming mask apparatus for forming an electrode material on a crystal piece, a ceramic piece or the like.

[0002]

2. Description of the Related Art For example, in the step of forming an electrode of a quartz oscillator, when a physical vapor deposition of a metal material for an electrode is performed, a mechanical mask device is used to deposit an electrode on a required portion of the quartz piece by a vacuum deposition method or a sputtering method. Had formed. The vapor deposition method using this mechanical mask device is such that a plurality of masks such as spacers for accommodating crystal pieces, upper and lower mask plates, and other auxiliary jigs are stacked, and screwed together, or integrated by magnetic force or the like. It was common to use.

[0003] The reason for using a mask plate or the like in such a dividable state is that it is necessary to peel off and remove the deposition electrode material (silver, gold, aluminum, etc.) adhering between the upper and lower mask plates and the spacer. Because there is. This peeling removal operation is performed by dipping in a specific cleaning liquid. Then, before performing the above-described electrode forming step, a plate body such as a plurality of masks such as the spacers, upper and lower mask plates, and other auxiliary jigs is overlapped and integrated again.

[0004]

In such an integrated operation, the positioning of the spacer and the upper and lower mask plates in the assembling operation of the plate body is performed by using spacers, screw holes provided in the upper and lower masks, or guide pins. And so on. However, in this method, accurate alignment cannot be performed when the spacer and the upper and lower mask plates are overlapped,
In some cases, a mask shift occurred.

[0005] Further, in the configuration in which the three elements of the spacer, the upper mask, and the lower mask are assembled, a gap is formed between the mask and the spacer. For this reason, when a thin crystal piece for a high frequency is used, the crystal piece may enter the gap and cause a mask shift. For example, AT
Taking a cut crystal piece as an example, the fundamental oscillation is 45 MHz
In the above-described crystal blank (frequency (KHz) = 1660 / crystal blank having a thickness of about 0.036 mm or less), many problems such as penetration into the gap between the mask and the spacer occur. Was.

[0006] Then, due to the mask shift, the electrode deposited on the quartz piece shifts, causing insulation failure and disconnection failure.

According to the present invention, the assembly operation of the film forming mask device can be performed easily and accurately, and the mask can be accurately positioned.
It is an object of the present invention to provide a film forming mask device with high workability and reliability, which prevents a thin film formation body from entering a gap between a mask and a spacer, eliminates insulation failure and disconnection failure due to mask displacement. Things.

[0008]

In order to solve the above-mentioned problems, a film forming mask apparatus according to the present invention is provided with a recess for accommodating a plurality of film-forming bodies, and a recess formed in the bottom of the recess. A lower mask in which a lower mask pattern for film formation is formed, a lower mask in which a spacer and a mask are integrally formed, and an upper mask in which an upper mask pattern for film formation is formed in close contact with the upper surface of the lower mask Wherein the upper mask corresponds to a formation position of a storage recess of the lower mask and presses the film formation target against a bottom surface of the storage recess. It is characterized in that a convex portion is formed.

According to the above structure, since the spacer and the lower mask are integrated, the number of components of the film forming mask device can be reduced, and the assembling work of the film forming mask device can be facilitated. A gap formed by the spacer and the lower mask is not formed in the storage recess for storing the formed body. In addition, the upper mask is provided with a convex portion for pressing the film formation target against the bottom surface of the storage recess corresponding to the formation position of the storage recess of the lower mask. The film formation target remains in the storage recess, and does not move to the gap formed by the lower mask and the upper mask, and the film formation target enters the gap formed by the lower mask and the upper mask. Not even.

Therefore, the film formation object does not deviate from the inside of the accommodation recess, the mask does not shift, and the film deposited on the film formation object does not shift. In particular, in a film forming mask device used for forming an electrode such as a quartz oscillator, an electrode formed on a crystal piece is displaced, so that insulation failure and disconnection failure do not occur. Further, since the spacer and the lower mask are formed integrally, there is no need to disassemble them, the stripping and removing operation of the deposition electrode material is easy, and the electrode material remains in the gap between the spacer and the lower mask. Since there is no occurrence, reliable peeling and removal can be performed.

Further, in the above structure, a part of the projection of the upper mask is configured to be in contact with a part of an edge of the storage recess of the lower mask.

According to the above configuration, in addition to the above-mentioned effects,
Since a part of the convex part of the upper mask is configured to be in contact with a part of the edge of the concave part of the lower mask, the convex part and the concave part of the upper mask are in contact with each other. Functions as positioning. Therefore, since the mask pattern of the lower mask and the mask pattern of the upper mask can be easily overlapped without deviation, the assembling work of the film forming mask apparatus is facilitated. There is no displacement of the film deposited on the film forming body. In particular, in a film forming mask device used for forming an electrode such as a quartz oscillator, an electrode formed on a crystal piece is displaced, so that insulation failure and disconnection failure do not occur.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to the drawings, taking the formation of electrodes of a quartz oscillator as an example. FIG. 1 is a sectional view showing a film forming mask apparatus according to an embodiment of the present invention, and FIG.
FIG. 2 is a partially enlarged sectional view of a state where FIG. 1 is assembled.

The film forming mask apparatus comprises a lower mask 1 and an upper mask 2. The lower mask 1 is made of SUS-30
And a lower mask pattern 1 corresponding to a predetermined position of a plurality of crystal blanks B to be described later.
A plurality of 1s are formed corresponding to the individual crystal blanks. On the other hand, on the upper surface of the lower mask, a plurality of accommodating recesses 12 for positioning and accommodating a plurality of crystal blanks B at predetermined intervals are provided corresponding to the positions of the lower mask patterns.

The upper mask 2 is made of a metal plate such as SUS-304. On the upper surface, a plurality of upper mask patterns 21 corresponding to the predetermined positions of the above-described crystal blank B are formed corresponding to the individual crystal blanks. Have been. On the other hand, on the lower surface of the upper mask, the projections 22 and 23 for holding down the crystal blank are formed corresponding to the formation positions of the plurality of housing recesses 12 of the lower mask.
Are formed over a plurality.

In these film forming mask devices,
The mask pattern and the accommodation concave portion of the lower mask, and the mask pattern of the upper mask and the convex portion for holding down the crystal piece can be easily formed by a method such as half etching and pressing. Further, the lower mask may be surface-bonded by thermocompression bonding between the mask on which the mask pattern is formed and the spacer on which the receiving hole is formed, whereby the spacer and the mask are integrated without any gap. A lower mask can be obtained.

The receiving recess 12 of the lower mask 1 is provided.
The crystal blank B, which is a film-forming formation body, is accommodated therein. Subsequently, the upper mask is overlapped with the lower mask 1 to be integrated while the projections 22 and 23 of the upper mask 2 are engaged with the edges of the accommodation recess 12. This is because the upper and lower mask patterns are designed in advance so that the positions of the upper and lower mask patterns are adjusted to the proper positions if the convex portions of the upper mask are brought into contact (locked) with the edge portions of the housing concave portions of the lower mask. The masks can be superimposed without displacement using a mask.

As a method of integrating the lower mask and the upper mask, although not shown, the lower mask and the upper mask may be integrated by tightening with screws. Further, a magnet in which a magnet body is attached to a portion where the lower mask and the upper mask overlap each other in advance may be integrated by a magnet. When a magnet is used, SUS-43 having a higher iron content than SUS-304 is used as a mask material.
0 is more preferable.

By performing physical vapor deposition using such a film forming mask apparatus by a vacuum vapor deposition method, a sputtering method, or the like, a film formed body (quartz piece) having a desired film pattern can be obtained.

Another embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a film forming mask apparatus according to another embodiment of the present invention. The same parts as those in the above embodiment are denoted by the same reference numerals, and a part of the description is omitted.

A film forming mask apparatus according to another embodiment of the present invention comprises a lower mask 1, an upper mask 2, a lower mask holding plate 3, and an upper mask holding plate 4. In another embodiment of the present invention, the lower mask holding plate 3 and the upper mask holding plate 4 are further attached to the outside of the lower mask and the upper mask as shown in the above embodiment to reinforce the mechanical strength. Therefore, compared to the above embodiment,
The thickness of the lower mask and the upper mask can be reduced.

The upper mask 2 is made of a metal plate such as SUS-304. On the upper surface, a plurality of upper mask patterns 21 corresponding to predetermined positions of the above-described crystal blank B are formed corresponding to the individual crystal blanks. Have been. On the other hand, on the lower surface of the upper mask, the upper mask pattern 21 corresponds to the formation position of the plurality of recesses 12 of the lower mask.
A plurality of convex portions 24 and 25 for holding down a crystal piece, which are formed to extend to the formation area, are formed. As described above, since the protrusions 24 and 25 of the present embodiment are formed to extend to the formation area of the upper mask pattern, in the area other than the mask pattern part, the upper mask and the crystal piece are in close contact. In addition, since the deposit is not attached at all, the deposition can be performed with higher precision.

Lower mask holding plate 3, Upper mask holding plate 4
Are made of a metal plate such as SUS-304 and have openings 31 and 41 exposing the lower mask pattern 11 of the lower mask and the upper mask pattern 12 of the upper mask.
Are formed.

The receiving recess 12 of the lower mask 1
A crystal blank B, which is a film-forming formation body, is accommodated therein, and the upper mask is superimposed on the lower mask 1 while the projections 24 and 25 of the upper mask 2 are locked to the edges of the accommodation recess 12. In addition, the lower mask holding plate 3 and the upper mask holding plate 4 are superposed and integrated on the outside of the lower mask 1 and the upper mask 2, respectively.

As a method of integrating these mask holding lower plate, lower mask, upper mask and mask holding upper plate,
Although not shown, they may be integrated by tightening with screws, or may be integrated with a magnet using a magnet in which a magnet body is attached to a portion where the lower mask and the upper mask overlap in advance. Further, the lower mask holding plate and the lower mask, and the upper mask and the upper mask holding plate may be integrated in advance by welding or the like.

By performing physical vapor deposition using such a film forming mask device by a vacuum vapor deposition method, a sputtering method, or the like, a film formed body (crystal blank) having a desired film pattern can be obtained.

It is to be noted that the depth dimension of the lower mask storage recess in the above embodiment is substantially equal to the sum of the thickness dimension of the crystal blank (film-formed body) and the height dimension of the projection, Slightly smaller than the sum is preferable from the viewpoint of preventing slippage in the thickness direction of the crystal blank. Further, in each of the above-described embodiments, the film formation target body is a quartz piece and a quartz oscillator is described as an example. However, a quartz oscillator using a quartz filter, a ceramic, or the like may be used. The present invention can be applied to various film formation bodies such as formation.

[0028]

According to the first aspect of the present invention, since the spacer and the lower mask are integrated, the number of components of the film forming mask device can be reduced, and the assembling operation of the film forming mask device can be facilitated. Further, the film formation object does not shift from the inside of the accommodation recess of the lower mask, the mask does not shift, and the film deposited on the film formation object does not shift. In particular, in a film forming mask device used for forming an electrode such as a quartz oscillator, an electrode formed on a crystal piece is displaced, so that insulation failure and disconnection failure do not occur. Further, since the spacer and the lower mask are integrally formed, the stripping and removing operation of the vapor deposition electrode material is easy, and the peeling and removing operation can be performed without leaving the electrode material.

According to the second aspect, in addition to the above-described functions and effects, the convex portion of the upper mask and the accommodation concave portion of the lower mask function as positioning when assembling the film forming mask apparatus. Therefore, the mask pattern of the lower mask and the mask pattern of the upper mask can be overlapped without displacement, and the assembly work of the film forming mask device can be facilitated. Further, there is no displacement of the film deposited on the film formation object due to the displacement of the upper and lower mask patterns. In particular, in a film forming mask device used for forming an electrode such as a quartz oscillator, an electrode formed on a crystal piece is displaced, so that insulation failure and disconnection failure do not occur.

As described above, according to the present invention, the assembly operation of the film forming mask device can be performed easily and accurately, and the thin film formation target can be prevented from entering the gap between the mask and the spacer. In addition, it is possible to provide a film forming mask device with high workability and high reliability by eliminating insulation failure and disconnection failure due to mask displacement.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a film forming mask apparatus according to an embodiment of the present invention.

FIG. 2 is a partially enlarged sectional view of a state where FIG. 1 is assembled;

FIG. 3 is a sectional view showing a film forming mask apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lower mask 2 Upper mask 3 Mask holding lower plate 4 Mask holding upper plate B Crystal piece

Claims (2)

[Claims] An accommodating recess for accommodating a plurality of film-forming bodies is formed, a lower mask pattern for film formation is formed on a bottom surface of the accommodating recess, and a spacer and a mask are integrally formed. A film forming mask device comprising at least a lower mask and an upper mask which is disposed in close contact with the upper surface of the lower mask and has an upper mask pattern for forming a film formed thereon. A film forming mask apparatus comprising: a projection corresponding to a position where a storage recess of a lower mask is formed and pressing the film formation target against a bottom surface of the storage recess. 2. The film forming method according to claim 1, wherein a part of the convex part of the upper mask is configured to be in contact with a part of an edge of the storage concave part of the lower mask. Mask equipment.