JP2000183208A - Package for housing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing an electronic component for reducing the adverse influence of a noise generated from a ground wiring layer connected with an electronic component housed inside, and for normally and stably operating the electronic component housed in the inside over a long term. SOLUTION: This package for housing an electronic component is constituted of a substrate 1 having a signal wiring layer 2, plural ground wiring layers 4 and 5 interposing this from the upper and lower parts, and placing part for an electronic component 6 and a cover body 7 having a recessed part for housing the electronic component 6 inside. The plural ground wiring layers 4 and 5 are constituted of the first ground wiring layer 4, with which the ground of the electronic component 6 is electrically connected and the second ground wiring layer 5 positioned outside the first ground wiring layer 4, and a metal layer 8 which is the conductive inner wall of the cover body 7 is electrically connected with the second ground wiring layer 5. Thus, the electronic component 6 can be completely sealed by the second group wiring layer 5 in a stable ground state and the metal layer 8, and there will be no adverse influence of a noise generated from the first ground wiring layer 4 on the electronic component 6 or the outside device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage package for storing electronic components.

[0002]

2. Description of the Related Art A conventional package for storing electronic parts has a signal wiring layer, a ground wiring layer, and a power supply wiring layer which are disposed vertically above and below each other with an insulating layer therebetween, and mounts the electronic parts on the upper surface. A base made of an electrically insulating material such as an aluminum oxide sintered body having a mounting portion, and an electronic component such as a semiconductor element also made of an electrically insulating material such as an aluminum oxide sintered body and mounted on the mounting portion of the base. And a lid having a concave portion for forming a space for housing. Then, an electronic component such as a semiconductor element is mounted and fixed on a mounting portion of the base, and each terminal of the electronic component is connected to a signal wiring layer, a ground wiring layer, and a power supply wiring layer provided on the base via a bonding wire or a solder bump. After that, the lid is attached on the base by a sealing material made of a conductive adhesive such as silver-epoxy resin or solder so that the electronic component is housed inside. Thus, an electronic device as a final product is completed.

However, this conventional package for housing electronic parts has a problem that the aluminum oxide sintered body used for the base and the lid has a low shielding effect against noise, and recently, electronic parts such as semiconductor elements have not been used. Since high-speed driving has been performed and it has become susceptible to noise, etc., if there is a noise source at an external proximity position, electronic components such as semiconductor elements and substrates to be housed inside However, there is a drawback that noise enters the signal line provided in the electronic device very easily, and as a result, malfunctions occur in electronic components such as semiconductor elements due to the entered noise.

[0004] Further, there is a problem that an electronic component that performs high-speed driving is liable to generate noise by itself, and the noise generated by the electronic component enters another device to cause adverse effects such as malfunction.

Therefore, in order to solve such a drawback, a signal wiring layer formed on a base is sandwiched between ground wiring layers with an insulating layer interposed therebetween, and a metal layer is formed on the inner wall of the concave portion of the lid. In addition, there has been proposed an electronic component housing package in which the metal layer is electrically connected to a ground wiring layer of a base.

FIG. 2 shows an example of such an electronic component storage package.

In the electronic component housing package shown in FIG. 2, 31 is a base, 32 is a signal wiring layer, 33 is a ground wiring layer, 34 is a power supply wiring layer, 35 is a semiconductor element, 36 is a lid, and 37 is a lid. A conductive metal layer formed on the inner wall of 36, and 38 is an external lead terminal. 41 is a wiring board on which an electronic component storage package is mounted, 42 is a power supply wiring layer inside the wiring board 41, 43
Is a ground wiring layer inside the wiring board 41, and is a signal wiring layer.
The signal wiring layer 32 (not shown) of the wiring board 41, the ground wiring layers 33 and 43, and the power supply wiring layers 34 and 42 are electrically connected via external lead terminals 38, respectively.

The base 31 is provided with a signal wiring layer 32, a ground wiring layer 33, and a power supply wiring layer 34 inside and on the surface thereof. The central portion of the upper surface of the base 31 is a semiconductor element.
It is a mounting portion for mounting electronic components such as 35 and a capacitor, and electronic components such as a semiconductor device 35 and a capacitor are mounted on this mounting portion.

In this package, the signal wiring layer 32 is formed of a base 31.
The ground wiring layer 33 extends in the plane direction of the base 31 and is a pattern having a larger area facing at least the signal wiring layer 32. The signal wiring layer 32 and the power wiring layer 34 are sandwiched from above and below by the ground wiring layer 33, thereby electromagnetically shielding the signal wiring layer 32 and the power wiring layer 34.

The signal wiring layer 32, the ground wiring layer 33,
From the power supply wiring layer 34, through conductors (32a), 33a, and 34a electrically connect the respective layers and extend to a mounting portion on the upper surface of the base 31, and these through conductors (32a), 33a, and 33a.
A connection pad electrically connected to each electrode of an electronic component such as the semiconductor element 35 and the capacitance element is formed in a portion led out to the mounting portion 34a. Each electrode of electronic components such as the semiconductor element 35 and the capacitor is connected to these connection pads via the bonding wire 39.

Further, the signal wiring layer 32 and the ground wiring layer 33
And from the power supply wiring layer 34, the through conductors 32a, 33a, 34a
Extend also to the lower surface of the base 31, respectively, and these through conductors
Terminal pads to which the external lead terminals 38 are attached are formed on the portions of the bases 32a, 33a, and 34a that extend to the lower surface of the base 31. An external lead terminal 38 is attached to each terminal pad.

Further, a cover 36 on the outer peripheral portion of the upper surface of the base 31 is provided.
A frame-shaped metal layer for sealing is adhered to a portion where is bonded, and the metal layer for sealing and the ground wiring layer 33 are electrically connected by the through conductor 33a.

On the other hand, a metal layer 37 is attached to the lid 36 from the inner wall of the recess to the lower surface. The metal layer 37 and the metal layer for sealing the base 31 are formed of a conductive material such as silver-epoxy resin or solder. By joining via a sealing material 40 made of an adhesive, the lid 36 is joined to the upper surface of the base 31, and the metal layer 37, which is a conductive inner wall, is electrically connected to the ground wiring layer 33.

According to this electronic component storage package, the signal wiring layer 32 inside the base 31 is sandwiched between the ground wiring layers 33 from above and below, and the metal layer 37 which is the conductive inner wall of the concave portion of the lid 36 is connected to the base 31. Electronic components such as the signal wiring layer 32 formed on the base 31 and the semiconductor element 35 housed inside the package are electromagnetically connected to the ground wiring layer 33 and the metal layer 37. EMI (Electro-Magnetic Interference)
(Electromagnetic wave interference) Shielding can effectively prevent external noise from entering the electronic components such as the signal wiring layer 32 formed on the base 31 and the semiconductor element 35 housed inside the package. . As a result, electronic components such as the semiconductor element 35 housed therein can be operated normally and stably. At the same time, the leakage of noise generated by electronic components such as the semiconductor element 35 housed inside to the outside is effectively suppressed, which may adversely affect other devices arranged in the vicinity such as malfunction. Absent.

[0015]

However, in such a conventional package for storing electronic parts, the substrate
Although the prevention of noise from entering the inside of the base 31 from the vertical direction of the lid 31 and the outer peripheral side of the lid 36 is almost complete, it is conducted to the ground of the semiconductor element 35 by switching at the time of operation of the semiconductor element 35 or the like. The ground wiring layer 33 inside the base 31 becomes unstable, and this ground wiring layer 33
This causes a problem that EMI noise is generated. For this reason, a sufficient EMI shielding effect cannot be obtained, which adversely affects the electronic components such as the semiconductor element 35 housed therein and other devices arranged close to the outside, such as malfunctions, which may cause a malfunction. In addition, there is a problem to be solved that it is difficult to operate stably.

On the other hand, the entire electronic component housing package is covered with a metal shield, and the metal shield is electrically connected to the ground wiring layer 43 of the wiring board 41 to take a ground to take EMI measures. It is also possible. However, in this case, an extra space for disposing the metal shield around the electronic component storage package is required, and there has been a problem that the size cannot be reduced.

The present invention has been devised in view of the above-mentioned problems of the prior art, and has as its object to reduce the adverse effect of noise generated from a ground wiring layer connected to electronic components housed therein. It is an object of the present invention to provide an electronic component storage package that can suppress the electronic components contained therein and operate normally and stably for a long period of time.

[0018]

The electronic component housing package of the present invention has a signal wiring layer and a plurality of ground wiring layers sandwiching the signal wiring layer from above and below, and mounts the electronic component on the upper surface. Consisting of a base having a mounting portion and a lid having a recess for accommodating the electronic component mounted on the mounting portion inside, and joining the base and the lid via a sealing material. An electronic component housing package for hermetically housing the electronic component therein, wherein the plurality of ground wiring layers are electrically connected to a ground of the electronic component.
And a second ground wiring layer located outside the first ground wiring layer. The inner wall of the lid is made conductive and the inner wall is formed of the second ground wiring layer.
And electrically connected to the ground wiring layer.

According to the electronic component storage package of the present invention, the signal wiring layer of the base is sandwiched between the plurality of ground wiring layers, and the plurality of ground wiring layers are electrically connected to the ground of the electronic component. One ground wiring layer,
A second ground wiring layer located outside the first ground wiring layer inside the substrate and grounded separately from the first ground wiring layer is provided, and the second ground wiring layer is covered with a cover. Since the electronic component is electrically connected to the conductive inner wall of the body, the ground of the electronic component is generated from the first ground wiring layer electrically connected to the electronic component when the electronic component is operated.
The MI noise is completely shielded by the stable second ground wiring layer and the inner wall of the lid. As a result, adverse effects such as malfunctions are not exerted on electronic components housed inside or other devices arranged close to the outside, and these can be normally and stably operated.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view showing an example of a package for housing a semiconductor element as a package for storing an electronic component according to the present invention. In the electronic component housing package shown in FIG. 1, 1 is a base, 2 is a signal wiring layer, 3 is a power wiring layer, 4 is a first ground wiring layer, 5 is a second ground wiring layer, and 6 is an electronic component. 7 is a lid, 8 is a conductive metal layer formed on the inner wall of the lid 7, and 9 is an external lead terminal.

Reference numeral 12 denotes a wiring board on which an electronic component storage package is mounted, 13 denotes a power supply wiring layer inside the wiring board 12, and 14 denotes a ground wiring layer inside the wiring board 12. In addition, signal wiring layers (not shown) are formed on the upper and lower surfaces of the wiring board 12. The signal wiring layer 2 and the signal wiring layer of the wiring board 12, the power wiring layer 3 and the power wiring layer 13, the first ground wiring layer 4, the second ground wiring layer 5, and the ground wiring layer 14 are connected to external leads, respectively. It is electrically connected via the terminal 9.

The base 1 is a substantially rectangular plate-like member, and is made of an inorganic electric material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, or a glass ceramic. It is composed of an insulating material, various kinds of organic electric insulating materials, or a composite electric insulating material in which an inorganic insulating powder is dispersed and contained in an organic insulating resin.

A mounting portion for mounting electronic components such as a semiconductor element 6 and a capacitor is formed at the center of the upper surface of the base 1, and the semiconductor element 6 is attached to this mounting portion via solder or the like. Fixed.

When the substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, a solvent, a plasticizer and the like are added to aluminum oxide and raw material powders of silicon oxide, magnesium oxide, calcium oxide and the like. The resulting slurry is formed into a sheet by a doctor blade method, a calendar roll method, or the like to obtain a plurality of green sheets (raw sheets). Processed and laminated in a predetermined order to form a green sheet laminate, and finally this green sheet laminate in a reducing atmosphere,
It is manufactured by firing at a temperature of about 1600 ° C.

The base 1 also has a signal wiring layer 2, a power supply wiring layer 3, a first ground wiring layer 4,
A second ground wiring layer 5 is provided. These signal wiring layer 2, power supply wiring layer 3, first ground wiring layer 4,
The second ground wiring layer 5 connects each electrode (signal electrode, ground electrode, power supply electrode) of the semiconductor element 6 to a signal wiring layer (not shown) of the wiring board 12, a power supply wiring layer 13, and a ground wiring layer 14.
Etc. function as a conductive path for connection to an external electric circuit.

The signal wiring layer 2 is a thin band-shaped pattern extending in the plane direction of the base 1. First ground wiring layer 4
The second ground wiring layer 5 and the power supply wiring layer 3 are wide-area patterns extending in the plane direction of the base 1. The first ground wiring layer 4 has at least a larger area facing the signal wiring layer 2 and is electrically connected to the ground of the semiconductor element 6 housed in the package. Further, the second ground wiring layer 5 is located outside the first ground wiring layer 4 in the base 1 and faces the first ground wiring layer 4 and has a larger area than the first ground wiring layer 4. Is electrically connected to the ground of an external electric circuit separately from the ground wiring layer 4 and the metal layer 8 which is a conductive inner wall of the lid 7.
Is electrically connected to

The signal wiring layer 2 is sandwiched between the first ground wiring layer 4 and the second ground wiring layer 5 from above and below, and the first ground wiring layer 4 is sandwiched by the second ground wiring layer 5. The signal wiring layer 2, the first ground wiring layer 4, and the semiconductor element 6 are electromagnetically shielded from each other.

Therefore, even if noise enters the signal wiring layer 2 from above and below, the noise is cut off by the upper and lower ground wiring layers 4 and 5, and it is possible that the noise enters the signal wiring layer 2 and causes the semiconductor element 6 to malfunction. Absent.

Further, even if the first ground wiring layer 4 to which the ground is electrically connected becomes unstable when the semiconductor element 6 operates and noise occurs, the noise is generated by the first ground wiring layer 4. Is shielded by the second ground wiring layer 5 in a stable ground state located outside the semiconductor device 6, so that this noise may adversely affect the semiconductor element 6 itself or other devices arranged close to the outside such as malfunction. There is no.

From the signal wiring layer 2, the power supply wiring layer 3, the first ground wiring layer 4, and the second ground wiring layer 5, through conductors 2a, 3a, 4a, and 5a are formed in respective layers according to the specification of the package. It extends to the upper surface, the lower surface, etc. of the base 1. At the portions of the through conductors 2a, 3a, and 4a extending to the upper surface of the base 1, connection pads that are electrically connected to electrodes of electronic components such as the semiconductor element 6 and the capacitance element are formed.

Each electrode (signal electrode, ground electrode, power supply electrode) of the semiconductor element 6 and each electrode (ground electrode / power supply electrode) of the capacitance element and the like are connected to these connection pads via bonding wires 10 and the like. Is done. Note that a so-called flip-chip mounting structure may be used instead of the bonding wire 10 using a solder bump or the like.

Here, the capacitive element mounted on the mounting portion together with the semiconductor element 6 is electrically connected to the semiconductor element 6 via the first ground wiring layer 4 and the power supply wiring layer 3, and the ground potential and the power supply potential are changed. By supplying a charge to the semiconductor element 6 from this capacitance element when it fluctuates transiently,
This is to prevent a malfunction of the semiconductor element 6 due to these potential fluctuations.

Further, through conductors 2a, 3a, 4a, and 5a extend from the signal wiring layer 2, the power wiring layer 3, the first ground wiring layer 4, and the second ground wiring layer 5 to the lower surface of the base 1, respectively. And these through conductors 2a and 3a
A terminal pad to which the external lead terminal 9 is attached is formed at a portion led out to the lower surface of the base 1 at 4a and 5a.

It is to be noted that the electronic component housing package may be mounted on the wiring board 12 in a so-called flip-chip manner as a bump electrode such as a solder ball instead of the external lead terminal 9.

The second ground wiring layer 5 to the base 1
A sealing metal layer for joining the lid 7 to the base 1 is formed on the through conductor 5a led out to the outer peripheral portion of the upper surface, and the lid 7 is formed of a conductive adhesive on the sealing metal layer. It is joined via a sealing material 11 made of the same. As a result, the metal layer 8 applied from the inner wall to the lower surface of the concave portion of the lid 7 is electrically connected to the second ground wiring layer 5.

The signal wiring layer 2, power supply wiring layer 3, first ground wiring layer 4, and second ground wiring layer 5 are formed by, for example, metal powder metalization of tungsten, molybdenum, copper, silver, gold, or the like. I have. For example, a metal paste obtained by adding a suitable organic solvent and a solvent to a metal powder such as tungsten is mixed on a surface of a green sheet as a substrate 1 and a side surface of a green sheet laminate by a conventionally known screen printing method or the like. By printing and applying the thick film method, the substrate 1 is adhered and formed on the inside, the upper and lower surfaces, and the side surfaces.

Further, the base 1 has a cover 7 on its upper surface formed of silver-based material.
The electronic components such as the semiconductor element 6 are hermetically sealed in a container formed by the base 1 and the lid 7 through a sealing material 11 made of a conductive adhesive such as an epoxy resin.

The lid 7 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass ceramic sintered body, etc. It has a bowl shape in which a concave portion for forming a space for accommodating the semiconductor element 6 therein is formed in the center of the lower surface.

If the lid 7 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and a solvent are added to aluminum oxide and raw material powder such as silicon oxide, magnesium oxide and calcium oxide. The obtained raw material powder is filled into a press die of a predetermined shape and is formed by applying a constant pressure.
It is manufactured by firing at a temperature of 1500 ° C.

The lid 7 is also provided on the base 1 from the inner wall of the recess.
A metal layer 8 made of a metal such as silver-palladium is formed on the bonding surface of the base 1, and the metal layer 8 is formed on a sealing metal layer adhered to the outer peripheral portion of the upper surface of the base 1 by a silver-epoxy resin or the like. They are electrically connected via a sealing material 11 made of a conductive adhesive. In this case, the semiconductor element 6 housed inside
Are the first ground wiring layer 4 provided on the base 1 and the second ground wiring layer 4.
Is completely shielded by the ground wiring layer 5 and the metal layer 8 of the lid 7 electrically connected to the second ground wiring layer 5, so that external noise does not enter through the lid 7,
The semiconductor element 6 housed therein can be operated normally and stably. At the same time, noise generated by the semiconductor element 6 housed therein does not leak to the outside through the lid 7 and does not adversely affect external devices.

The metal layer 8 is formed by adding a metal paste obtained by adding and mixing an appropriate organic binder and a solvent to silver powder and palladium powder on the inner wall of the concave portion of the lid 7 and the joint surface with the substrate 1 by a well-known screen. It is applied by a printing method, and thereafter, it is baked at a temperature of 900 ° C. to be attached to the inner wall of the concave portion of the lid 7 and the joint surface with the base 1.

The lid 7 may be made entirely of a conductive material such as metal to make the inner wall conductive. In this case, the lid 7 is also a lid of a sealed container and functions as an electromagnetic wave shield. be able to. As such a metal material for the lid 7, an iron-nickel alloy, an iron-nickel-cobalt alloy, or the like may be used.

Thus, according to the above-mentioned electronic component storage package, after mounting the electronic component such as the semiconductor element 6 on the mounting portion of the base 1, each electrode of the electronic component such as the semiconductor element 6 is formed on the base 1. Signal wiring layer 2, power supply wiring layer 3, first
Is electrically connected to the ground wiring layer 4 via a bonding wire 10. Finally, a lid 7 is provided on the upper surface of the base 1, and a metal layer 8 which is a conductive inner wall of a concave portion of the lid 7 is provided on the base 1. A sealing material made of a conductive adhesive such as silver-epoxy resin so as to be electrically connected to a sealing metal layer formed by being electrically connected to the second ground wiring layer 5 on the outer peripheral portion of the upper surface. Then, the semiconductor device 6 is hermetically sealed in a container formed of the base 1 and the lid 7 so as to obtain a semiconductor device as a final product.

Note that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. For example, in the above-described example, the metal layer 8 attached to the lid 7 is formed of a silver-palladium metal powder, but may be formed of another metal powder such as tungsten or molybdenum.

Further, in the above-described example, the package for housing a semiconductor element has been described as an example. However, the package for housing an electronic component of the present invention can be applied to a package for housing other types of electronic components such as a crystal unit and a SAW filter. Applicable.

[0047]

According to the electronic component storage package of the present invention, the signal wiring layer of the base is sandwiched between the signal wiring layers of the base by a plurality of ground wiring layers, and the plurality of ground wiring layers are connected to the ground of the electronic component. Is electrically connected to the first
And a second ground wiring layer located inside the substrate and outside the first ground wiring layer and grounded separately from the first ground wiring layer. EMI noise generated from the first ground wiring layer to which the ground of the electronic component is electrically connected when the electronic component is operated, since the ground wiring layer of the electronic component is electrically connected to the conductive inner wall of the lid. Is completely shielded by the second ground wiring layer and the inner wall of the lid in a stable ground state. As a result, adverse effects such as malfunctions are not exerted on electronic components housed inside or other devices arranged close to the outside, and these can be normally and stably operated.

As described above, according to the present invention, the adverse effects of noise generated from the ground wiring layer connected to the electronic components housed therein are suppressed, and the electronic components housed therein operate normally and stably for a long period of time. An electronic component storage package that can be provided can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an embodiment of an electronic component storage package according to the present invention.

FIG. 2 is a cross-sectional view illustrating an example of a conventional electronic component storage package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Signal wiring layer 3 ... Power supply wiring layer 4 ... 1st ground wiring layer 5 ... 2nd Ground wiring layer 6: Semiconductor element (electronic component) 7: Lid 8: Metal layer (conductive inner wall)

Claims (1)

[Claims] A base having a signal wiring layer and a plurality of ground wiring layers sandwiching the signal wiring layer from above and below, and having a mounting portion for mounting an electronic component on an upper surface;
A lid having a concave portion for accommodating the electronic component mounted on the mounting portion, the electronic component being internally formed by joining the base and the lid via a sealing material. An electronic component storage package adapted to be hermetically stored, wherein the plurality of ground wiring layers include a first ground wiring layer electrically connected to a ground of the electronic component, and a first ground. A second ground wiring layer located outside the wiring layer, wherein the inner wall of the lid is made conductive and the inner wall is electrically connected to the second ground wiring layer. Electronic component storage package.