JP2000100983A - Electronic part housing package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part housing package that is equipped with a current path which hardly receives outside noises or transmits noises to the outside and is wound in a thickness direction inside a base, effectively prevents an electronic part housed inside from malfunctioning due to its own noises, and is capable of keeping an electronic part operating normally and stably for a long term. SOLUTION: An electronic part housing package 1 is composed of a base 2 equipped with a signal wiring layer 7, ground wiring layers 8 that sandwich the wiring layer 7 between them, and an electronic part mount A and a lid 3 equipped with a recessed part B that houses electronic parts 4 and 5 mounted on the mount A, where the lid 3 is mounted on the base 2 through the intermediary of a sealer 12 so as to hermetically house the electronic parts 4 and 5 inside. A first metal layer 11 electrically connected to the ground wiring layers 8 is formed on the sides of the base 2 respectively, a second metal layer 13 where triangular prismatic projections 14 of radio wave absorbing material are arranged is provided on the inner wall of the recessed part B, and the second metal layer 13 is electrically connected to the ground wiring layers 8 of the base 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component storage package for storing electronic components.

[0002]

2. Description of the Related Art A conventional package for storing electronic parts has a signal wiring layer, a ground wiring layer, and a power supply wiring layer which are disposed vertically above and below each other with an insulating layer therebetween, and mounts the electronic parts on the upper surface. A base made of an electrically insulating material such as an aluminum oxide sintered body having a mounting portion, and an electronic component such as a semiconductor element also made of an electrically insulating material such as an aluminum oxide sintered body and mounted on the mounting portion of the base. And a lid having a concave portion for forming a space for housing. Then, an electronic component such as a semiconductor element is mounted and fixed on the mounting portion of the base, and each terminal of the electronic component is electrically connected to a signal wiring layer, a ground wiring layer, and a power supply wiring layer provided on the base via, for example, a solder bump. After connection, a lid is then placed on the base such that the electronic component is housed inside and joined by a sealing material made of a conductive adhesive such as silver-epoxy resin or solder, so that the electronic product as a final product is formed. The device is completed.

However, this conventional package for housing electronic parts has a problem that the aluminum oxide sintered body used for the base and the lid has a low shielding effect against noise, and recently, electronic parts such as semiconductor elements have not been used. Since high-speed driving has been performed and it is becoming susceptible to noise, etc., if there is a noise source at an external proximity position, electronic components such as semiconductor elements and bases to be housed inside However, there is a drawback that noise easily invades the signal line provided in the semiconductor device, and as a result, malfunctions of electronic components such as semiconductor elements are caused by the intruded noise.

[0004] Further, there is a problem that an electronic component that performs high-speed driving is liable to generate noise by itself, and the noise generated by the electronic component enters another device to cause adverse effects such as malfunction.

Therefore, in order to solve such a drawback, a signal wiring layer formed on a base is sandwiched between ground wiring layers with an insulating layer interposed therebetween, and a metal layer is formed on the inner wall of the concave portion of the lid. In addition, there has been proposed an electronic component housing package in which a metal layer is electrically connected to a ground wiring layer of a base.

FIG. 3 shows an example of such an electronic component storage package.

In FIG. 3, 21 is a base, 22 is a signal wiring layer,
23 is a ground wiring layer, 24 is a power supply wiring layer, 25 is a semiconductor element, 26 is a capacitor element, 29 is a lid, and 31 is a metal layer.

The base 21 is provided with a signal wiring layer 22, a ground wiring layer 23, and a power supply wiring layer 24 inside and on the surface thereof. The central portion of the upper surface of the base 21 is a mounting portion for mounting electronic components such as the semiconductor element 25 and the capacitor 26, and electronic components such as the semiconductor element 25 and the capacitor 26 are mounted on this mounting portion. Is done.

In this package, the signal wiring layer 22 comprises a base 21
The ground wiring layer 23 and the power supply wiring layer 24 are wide patterns extending in the plane direction of the base 21. The signal wiring layer 22 is electromagnetically shielded by sandwiching the signal wiring layer 22 between the ground wiring layer 23 from above and below.

The signal wiring layer 22, the ground wiring layer 23,
From the power supply wiring layer 24, the cylindrical through conductors 22a, 23a, 24
a extend to the mounting portions on the upper surface of the base 21, and the portions led out to the mounting portions of the through conductors 22 a, 23 a, and 24 a are electrically connected to the electrodes of the electronic components such as the semiconductor element 25 and the capacitance element 26. A connection pad to be connected is formed. The electrodes of electronic components such as the semiconductor element 25 and the capacitor element 26 are connected to these connection pads via the solder 27.

Further, from the signal wiring layer 22, the ground wiring layer 23 and the power supply wiring layer 24, a cylindrical through conductor 22 is formed.
b, 23b, and 24b extend to the lower surface of the base 21, respectively, and terminal pads to which external connection terminals 28 are attached are formed at portions of the through conductors 22b, 23b, and 24b that extend to the lower surface of the base 21. ing. An external connection terminal 28 made of a solder ball is welded to each terminal pad.

Further, a cover 29 on the outer peripheral portion of the upper surface of the base 21 is provided.
A sealing metal layer 30 in the shape of a frame is adhered to a portion where the metal layer 30 is joined, and the sealing metal layer 30 and the ground wiring layer 23 are electrically connected by the cylindrical through conductor 23c. I have.

On the other hand, a metal layer 31 is attached to the lid 29 from the inner wall of the recess to the lower surface, and the metal layer 31 and the sealing metal layer 30 of the base 21 are formed by a conductive material such as silver-epoxy resin or solder. By joining via a sealing material 32 made of a conductive adhesive,
The lid 29 is joined to the upper surface of the base 21 and the metal layer 31 is electrically connected to the ground wiring layer 23.

According to such an electronic component storage package, the signal wiring layer 22 of the base 21 is vertically connected to the ground wiring layer 23.
And a metal layer 31 is applied to the inner wall of the concave portion of the lid 29, and the metal layer 31 is attached to the ground wiring layer 23 of the base 21.
The semiconductor device 25 housed inside the package and the signal wiring layer 22 formed on the base 21 because of being electrically connected to the
The electronic components such as the semiconductor device are electromagnetically shielded by the ground wiring layer 23 and the metal layer 31 so that the signal wiring layer 22 formed on the base 21 and the semiconductor element housed inside the package
Intrusion of external noise into electronic components such as 25 can be effectively suppressed. As a result, the semiconductor element 27 housed inside
And the like can be operated normally and stably.

At the same time, the semiconductor element 25 housed inside
The leakage of noise generated by electronic components and the like to the outside is effectively suppressed. As a result, there is no adverse effect such as erroneous operation on other devices arranged close to each other.

[0016]

However, in such a conventional package for storing electronic parts, the substrate
Although the prevention of intrusion of noise from the vertical direction of 21 was perfect, the prevention of intrusion of noise from the side of base 21 was incomplete. In particular, when there is a current path wound in the thickness direction of the base 21 between, for example, the capacitive element 26 and the semiconductor element 25 as shown by a broken line in FIG. On the other hand, there is a problem to be solved that acts as a loop antenna to receive noise intruding from the side surface of the base 21 and conversely transmit noise from the side surface of the insulating base 21.

Further, a part of noise generated by electronic components such as the semiconductor element 25 housed in the package is reflected by the metal layer 31 attached to the inner wall of the concave portion of the lid 29 and enters the original electronic component. There has also been a problem that an electronic component malfunctions due to noise generated by itself.

The present invention does not receive external noise or transmit noise to the outside due to the current path wound in the thickness direction inside the base, and the electronic components housed therein malfunction due to the noise generated by itself. It is an object of the present invention to provide an electronic component storage package which can effectively prevent the electronic component from operating and can operate the electronic component normally and stably for a long period of time.

[0019]

According to the present invention, there is provided a base having a signal wiring layer, a ground wiring layer sandwiching the signal wiring layer from above and below, and having a mounting portion for mounting an electronic component, and a base mounted on the mounting portion. And a lid having a concave portion for accommodating the electronic component therein, and the electronic component is hermetically accommodated inside by joining the base and the lid via a sealing material. An electronic component storage package, comprising: a first metal layer electrically connected to the ground wiring layer on a side surface of the base; and a triangular prism-shaped radio wave absorbing material on an inner wall of a concave portion of the lid. A second metal layer in which a plurality of protrusions are arranged, and the second metal layer is electrically connected to the ground wiring layer of the base.

Further, according to the present invention, the protrusion has a base length.
0.2-1.0 mm, width 0.2-1.0 mm, height 0.3-1.
It has a triangular prism shape of 0 mm.

According to the electronic component housing package of the present invention, the signal wiring layer of the base is sandwiched between the ground wiring layers, the first metal layer electrically connected to the ground wiring layer is disposed on the side surface of the base, and the lid is provided. Since the second metal layer is applied to the inner wall of the concave portion of the body and the second metal layer is electrically connected to the ground wiring layer, it is accommodated in the signal wiring layer, the current path and the package formed on the base. The electronic component is completely shielded by the ground wiring layer, the first metal layer, and the second metal layer. As a result, external noise does not enter the signal wiring layer and the current path formed on the base and the electronic components housed inside the package, and the electronic components housed inside can be operated normally and stably. Also, no noise is transmitted to the outside.

Further, according to the electronic component housing package of the present invention, the metal layer attached to the inner wall of the concave portion of the lid has, for example, a base length of 0.2 to 1.0 mm and a width of 0.2 to 1.0 m.
m, a plurality of projections made of a triangular prism-shaped radio wave absorbing material with a height of 0.3 to 1.0 mm are arranged, so that even if the electronic components housed inside the package generate noise during operation, the noise is reduced to the projection. The radiation angle is controlled so that it does not enter the original electronic component. As a result, the electronic component can be operated normally and stably.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view showing an example of a package for housing a semiconductor device as a package for housing an electronic component according to the present invention. The package 1 for housing a semiconductor device mainly includes a base 2 and a lid 3. It is composed of

The base 2 is a substantially rectangular plate-like member, and is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum oxide sintered body, a silicon carbide sintered body, a glass ceramic, or the like. It is made of material.

A mounting portion A for mounting the semiconductor element 4 and the capacitance element 5 is formed at the center of the upper surface of the base 2, and the semiconductor element 4 and the capacitance element 5 are connected to the mounting section A via the solder 6. And fixed.

If the base 2 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, a solvent, a plasticizer and the like are added to aluminum oxide and raw material powders of silicon oxide, magnesium oxide, calcium oxide and the like. The resulting slurry is formed into a sheet by a doctor blade method, a calender roll method, or the like to obtain a plurality of green sheets (raw sheets). Processed and laminated in a predetermined order to form a green sheet laminate, and finally this green sheet laminate in a reducing atmosphere,
It is manufactured by firing at a temperature of about 1600 ° C.

The base 2 has a signal wiring layer 7, a ground wiring layer 8, and a power supply wiring layer 9 formed on the inside and on the upper and lower surfaces thereof. These signal wiring layer 7, ground wiring layer 8, and power supply wiring layer 9 function as conductive paths for connecting each electrode (signal electrode, ground electrode, power supply electrode) of the semiconductor element 4 to an external electric circuit.

The signal wiring layer 7 is a narrow band-shaped pattern extending in the plane direction of the base 2, and the ground wiring layer 8 and the power supply wiring layer 9 are wide-area patterns extending in the plane direction of the base 2.

The signal wiring layer 7 is connected to the ground wiring layer 8
, And are electromagnetically shielded.

Therefore, even if noise enters the signal wiring layer 7 from above and below, the noise is cut off by the upper and lower ground wiring layers 8 and the noise does not enter the signal wiring layer 7 to cause the semiconductor element 4 to malfunction.

The signal wiring layer 7, the ground wiring layer 8,
From the power supply wiring layer 9, cylindrical through conductors 7a, 8a, 9a
Extends on the upper surface of the mounting portion A, and the through conductors 7a and 8a
A connection pad electrically connected to each electrode of an electronic component such as the semiconductor element 4 and the capacitance element 5 is formed in a portion led out to the mounting portion A of 9a.

Each electrode (signal electrode, ground electrode, power supply electrode) of the semiconductor element 4 and each electrode (ground electrode / power supply electrode) of the capacitive element 5 are connected to these connection pads via solder 6. .

The capacitance element 5 is electrically connected to the semiconductor element 4 via the ground wiring layer 8 and the power supply wiring layer 9, and when the ground potential or the power supply potential fluctuates transiently, the capacitance element 5 is connected to the semiconductor element 4. This is to prevent malfunction of the semiconductor element 5 due to these potential fluctuations by supplying charges to the element 4, and a current path indicated by a broken line is formed between the capacitive element 5 and the semiconductor element 4. .

Further, the signal wiring layer 7 and the ground wiring layer 8
From the power supply wiring layer 9, cylindrical through conductors 7 b, 8 b.
9b extend to the lower surface of the base 2 respectively, and the portions led out to the lower surface of the base 2 by the through conductors 7b, 8b, 9b include:
A terminal pad to which the external connection terminal 10 is attached is formed.

The external connection terminal 10 is made of, for example, a solder ball and is welded to an external connection pad.

Further, a first metal layer 11 electrically connected to the ground wiring layer 8 is applied from the side surface of the base 2 to the outer peripheral portion of the upper surface.

The first metal layer 11 extends from the side of the base 2
It functions to prevent noise from entering inside and to prevent noise from being radiated to the outside from the side surface of the base 2.

Since the first metal layer 11 is adhered to the side surface of the base 2, even if noise enters the inside of the base 2 from the side, the noise is blocked by the first metal layer 11 and 2 is effectively prevented from entering. Therefore, for example, even if there is a current path wound in the thickness direction of the base 2 inside the base 2 as shown by a broken line, this current path does not receive any noise, and thus the semiconductor element 4 accommodated inside the base 2 is not received. Does not cause a malfunction. At the same time, even if the current path wound in the thickness direction of the base 2 as indicated by the broken line emits noise,
Since this noise is cut off by the first metal layer 11, the noise is effectively prevented from being transmitted to the outside from the side surface of the base 2, so that an electronic device arranged close to the outside may malfunction or the like. Not even.

The portion of the first metal layer 11 applied to the outer peripheral portion of the upper surface of the base 2 acts as a base metal for joining the cover 3 to the base 2, and the cover 3 is electrically conductive on this portion. It is joined via a sealing material 12 made of a conductive adhesive.

The signal wiring layer 7, the ground wiring layer 8, the power supply wiring layer 9, and the first metal layer 11 are formed by metallization of metal powder such as tungsten, molybdenum, copper, silver, and gold. For example, a metal paste obtained by adding a suitable organic solvent and a solvent to a metal powder such as tungsten is mixed on a surface of a green sheet serving as a substrate 2 and a side surface of a green sheet laminate by a conventionally known screen printing method or the like. By printing and applying the thick film method, the substrate 2 is adhered and formed on the inside, the upper and lower surfaces, and the side surfaces.

Further, the base 2 has a cover 3 on its upper surface which is made of silver-based material.
The semiconductor element 4 and the capacitive element 5 are hermetically sealed in a container formed of the base 2 and the lid 3 through a sealing material 12 made of a conductive adhesive such as an epoxy resin.

The lid 3 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass ceramic sintered body, and the lower surface thereof. It has a bowl shape in which a concave portion B for forming a space for accommodating the semiconductor element 4 is formed at the center.

If the lid 3 is made of, for example, an aluminum oxide sintered body, a suitable organic binder and a solvent are added to and mixed with aluminum oxide and raw material powders of silicon oxide, magnesium oxide, calcium oxide and the like. The obtained raw material powder is filled into a press die of a predetermined shape and is formed by applying a constant pressure.
It is manufactured by firing at a temperature of 1500 ° C.

The lid 3 also has a second metal layer 13 made of a metal such as silver-palladium formed from the inner wall of the recess B to the joint surface with the substrate 2. Is electrically connected to a first metal layer 11 adhered to the outer peripheral portion of the upper surface of the first metal layer 11 through a sealing material 12 made of a conductive adhesive such as silver-epoxy resin. In this case, the semiconductor element 4 housed inside is completely shielded by the ground wiring layer 8 provided on the base 2 and the second metal layer 13 of the lid 3 electrically connected to the ground wiring layer 8, The external noise does not enter through the lid 3 and the semiconductor element 4 accommodated inside.
Can be operated normally and stably. At the same time, noise generated by the semiconductor element 4 housed therein does not leak to the outside via the lid 3 and does not adversely affect external devices.

The second metal layer 13 is formed by applying a metal paste obtained by adding a suitable organic binder and a solvent to silver powder and palladium powder and mixing the silver paste and the palladium powder on the inner wall of the recess B of the cover 3 and the joint surface with the base 2. Is applied at a temperature of 900 ° C. to adhere to the inner wall of the concave portion B of the lid 3 and the joint surface with the base 2.

Further, on the second metal layer 13 attached to the inner wall of the concave portion B of the lid 3, a plurality of protrusions 14 made of a triangular-prism-shaped radio wave absorbing material are arranged as shown in FIG.

The projection 14 controls the radiation direction of the noise generated when the semiconductor element 4 housed therein operates, and also functions to absorb the noise. As a result, even if the semiconductor element 4 generates noise during operation, the noise is controlled by the projection 14 and the radiation angle is controlled, and the noise is not absorbed and enters the original semiconductor element 4. It is possible to operate stably.

The protrusions 14 are made of, for example, an organic resin made of expanded polystyrene, expanded polyurethane or the like and having a particle size of 1 to 5 μm.
About m of graphite powder is dispersed and contained, and is attached to the second metal layer 13 attached to the inner wall of the recess B of the lid 3 via an adhesive such as epoxy resin.

The protrusion 14 has a base length of 0.2 to 1.0 m.
m, width 0.2-1.0 mm, height 0.3-1.0 mm, triangular prism shape, base length 0.2-1.0
If the width is 0.2 to 1.0 mm and the height is 0.3 to 1.0 mm, the angle of the side surface becomes 30 to 85 ° with respect to the surface of the second metal layer 13, and the protrusion 14 The radiation angle of the occasionally generated noise can be efficiently controlled, and the noise can be completely prevented from entering the original semiconductor element 4 that has generated the noise, so that the semiconductor element 4 can be more normally and stably operated. Therefore, the protrusion 14 having the triangular prism shape is used.
Has a base length of 0.2 to 1.0 mm and a width of 0.2 to 1.0 mm.
It is preferable that the mm height is in the range of 0.3 to 1.0 mm.

Thus, according to the above-mentioned electronic component housing package, after mounting the electronic component such as the semiconductor element 4 on the mounting portion A of the base 2, each electrode of the electronic component such as the semiconductor element 4 is attached to the base 2. The formed signal wiring layer 7 and ground wiring layer 8
The second metal layer 13 electrically connected to the power supply wiring layer 9 via the solder 6 and finally covering the lid 3 on the upper surface of the base 2 and the inner wall of the recess B of the lid 3 First metal layer formed on
The semiconductor element 4 is air-tightly sealed inside a container including the base 2 and the lid 3 by being electrically connected to the substrate 11 and joined via a sealing material 12 made of a conductive adhesive such as silver-epoxy resin. By sealing, a semiconductor device as a final product is obtained.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, in the example of the above-described embodiment, the second metal layer 13 attached to the lid 3 is formed of silver-palladium metal powder, but this is formed of another metal powder such as tungsten or molybdenum. Is also good.

Further, in the above-described embodiment, the package for storing a semiconductor element has been described as an example. However, the package for storing an electronic component according to the present invention accommodates another type of electronic component such as a crystal unit or a SAW filter. It is also applicable to packages that do.

[0054]

According to the electronic component housing package of the present invention, the first signal wiring layer of the base is sandwiched between the ground wiring layers and the side surface of the base is electrically connected to the ground wiring layer.
Since the metal layer is disposed and the second metal layer is applied to the inner wall of the concave portion of the lid and the second metal layer is electrically connected to the ground wiring layer, the signal wiring layer formed on the base is The current path and the electronic components housed inside the package are completely shielded by the ground wiring layer, the first metal layer, and the second metal layer. As a result, external noise does not enter the signal wiring layer, the current path, and the electronic components housed inside the package formed on the base, and the electronic components housed inside can be operated normally and stably. Also, no noise is transmitted to the outside.

Further, according to the electronic component housing package of the present invention, the metal layer attached to the inner wall of the concave portion of the lid has, for example, a base length of 0.2 to 1.0 mm and a width of 0.2 to 1.0 m.
m, a plurality of protrusions made of a triangular-prism-shaped radio-absorbing material with a height of 0.3 to 1.0 mm are arranged, so that even if the electronic components housed inside the package generate noise during operation, the noise will not Thus, the radiation angle is controlled so as not to enter the original electronic component. As a result, the electronic component can be operated normally and stably.

As described above, according to the present invention, the electronic component housed in the base itself does not receive external noise or transmit noise to the outside due to the current path wound in the thickness direction inside the base. Thus, it is possible to provide an electronic component storage package that can effectively prevent malfunction due to noise generated by the electronic component and can operate the electronic component normally and stably for a long period of time.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining an example of an embodiment of an electronic component housing package of the present invention, taking a semiconductor element housing package for housing a semiconductor element as an example.

FIG. 2 is a perspective view illustrating a projection used in the electronic component storage package shown in FIG. 1;

FIG. 3 is a cross-sectional view illustrating an example of a conventional electronic component storage package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Package for electronic component storage 2 ... Base 3 ... Lid 4 ... Semiconductor element (electronic component) 5 ... Capacitance Element (electronic component) 7 Signal wiring layer 8 Ground wiring layer 9 Power wiring layer 11 First metal layer 12 ... Sealant 13 ... Second metal layer 14

Claims (2)

[Claims] 1. A base having a signal wiring layer, a ground wiring layer sandwiching the signal wiring layer from above and below, and having a mounting portion for mounting an electronic component, and the electronic component mounted on the mounting portion being internally provided. An electronic component housing package comprising a lid having a concave portion for housing, wherein the base and the lid are joined via a sealing material to hermetically accommodate the electronic component therein. A first metal layer electrically connected to the ground wiring layer on a side surface of the base, and a plurality of protrusions made of a triangular prism-shaped radio wave absorbing material are arranged on an inner wall of the concave portion of the lid. An electronic component storage package, wherein the second metal layer is adhered to the substrate and the second metal layer is electrically connected to the ground wiring layer of the base. 2. The protrusion has a base length of 0.2 to 1.
0 mm, width 0.2-1.0 mm, height 0.3-1.
2. The electronic component storage package according to claim 1, wherein the package has a triangular prism shape of 0 mm.