JP2000182737A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket capable of being mounted without being processed. SOLUTION: An IC socket is composed of an upper stage socket 1, an IC land 2, a connecting pin 3, a lower stage socket 4, a connecting pin hole 5, and an original IC compatible signal pin 6 to a printed board. The signal pin 6 of the lower stage socket 4 and the connecting pin hole 5 are faced to each other and have electrical conduction. The connection pin hole 5 is also provided on the bottom surface of the upper stage socket 1, corresponds to the IC land 2 on the upper surface, and has electrical conduction. Electric connection and fixing of the lower stage socket 4 and the upper stage socket 1 are performed by inserting the connecting pin 3 into respective holes. Accordingly, even if the IC to be mounted has a package different from an original one, it can be easily mounted without being processed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly to an IC socket in which replacement is considered.

[0002]

2. Description of the Related Art In the development of a printed circuit board as a conventional IC socket, when replacing an IC having a different package in the development of a printed circuit board, pins used for connection are processed or deformed.
A method of connecting by direct soldering is used.

When an IC having a different size or a different number of pins or an incompatible pin arrangement is replaced, the IC
In general, a method is used in which the connection pins are processed or deformed so as not to contact the lands, connected by soldering in accordance with the positions of the common pins, and other signals are connected by lead wires.

[0004]

However, in the method shown in the above-mentioned conventional example, a process such as processing or deformation of the connection pin is required, which is troublesome, and once the connection is made by soldering. There is a problem that it becomes unwieldy when reused.

An object of the present invention is to provide an IC socket that can be replaced without performing any processing.

[0006]

According to a first aspect of the present invention, there is provided an IC socket having a two-stage structure of an upper socket and a lower socket, wherein the upper socket and the lower socket are connected. It has a connection pin and a plurality of connection pin holes for inserting and removing connection pins provided on the bottom surface of the upper socket and the upper surface of the lower socket, and the upper socket and the lower socket are formed by inserting the connection pins into the connection pin holes. Are connected and fixed.

According to a second aspect of the present invention, in the first aspect of the present invention, the plurality of connection pin holes are provided with holes dedicated to power supply and ground.

[0008] The invention described in claim 3 is claim 1 or 2.
In the invention described above, a jumper terminal for performing jump continuity is provided on a side surface of the upper socket.

According to a fourth aspect of the present invention, in an IC socket having a two-stage structure of an upper socket and a lower socket, connection pins for connecting the upper socket and the lower socket are provided on the bottom surface of the upper socket and the upper surface of the lower socket. A plurality of connection pin holes for inserting and removing the connection pins, an upper socket has an IC land corresponding to the connection pin holes, and a lower socket has a signal corresponding to the connection pin holes. The connection pin is inserted into the connection pin hole so that the IC land of the upper socket is electrically connected to the signal pin of the lower socket.

A fifth aspect of the present invention is characterized in that, in the fourth aspect of the present invention, the plurality of connection pin holes are provided with holes dedicated to power supply and ground.

The invention according to claim 6 is the invention according to claim 4 or 5.
In the invention described above, a jumper terminal for performing jump continuity is provided on a side surface of the upper socket.

[0012]

Next, an IC socket according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG.
3 to 3, there is shown an embodiment of an IC socket according to the present invention.

FIG. 1 is an external view showing the configuration of an IC socket according to an embodiment of the present invention. In FIG. 1, an IC socket according to an embodiment of the present invention includes an upper socket 1,
An IC land 2, a connection pin 3, a lower socket 4,
It comprises a connection pinhole 5 and a signal pin 6 compatible with an original IC for a printed circuit board.

As shown in FIG. 1, the signal pins 6 and the connection pin holes 5 of the lower socket 4 are arranged to correspond to each other and have electrical continuity. On the other hand, there is also a connection pin hole (not shown) on the bottom surface of the upper socket 1, which is arranged so as to correspond to the IC land 2 arranged on the upper surface of the upper socket 1 and has electrical continuity. is there.

Electrical connection and fixing between the upper socket 1 and the lower socket 4 are performed by inserting the connection pins 3 into the respective connection pin holes 5.

In the embodiment of the present invention shown in FIG. 1, the original IC is an SOJ (Small Outline J Lead Package) and the upper socket 1 is also for SOJ.・ Package) and DIP (dual in-line)
Package). And
If the pin arrangement in the IC to be replaced is exactly the same as the pin arrangement in the original IC, the connection pins 3 are inserted into all the connection pin holes (pairs) and the upper socket 1 and the lower socket 4 are connected. , Package conversion becomes possible.

FIG. 2 is a plan view of an IC socket according to an embodiment of the present invention. FIG. 2A shows the land of the printed circuit board, FIGS. 2B and 2F show the bottom surface of the lower socket 4,
2c and 2g show the upper surface of the lower socket 4, and FIGS.
h shows the bottom surface of the upper socket 1, and FIGS. 2E and 2I show the upper surface of the upper socket 1.

FIG. 2 shows an example in which an IC having a different number of pins is replaced with an original IC. Where a1 is the power supply,
a2 is a ground, a3 is a first signal pin, which is a common pin.

In FIG. 2C, two connection pin holes are arranged side by side so as to correspond to one signal pin. The outer hole (closer to the outer edge) is used to connect the signal of the lower socket 4 to the upper socket 1, and the inner hole (close to the center line) is used to connect the power supply or the ground.

Therefore, the power supply c1 and the ground c2 are on the inside, the first signal pin c3 is on the outside, and the connection pin 3
(The part indicated by a black circle) to connect the upper socket 1. As shown in FIG. 2d, the bottom surface of the upper socket 1 is wired so that all inner holes are electrically connected to the power supply d1 or the ground d2, and is connected to the IC shown in FIG. Conduction to land.

In FIGS. 2A to 2E, the original first pin and the first pin of the exchange IC are common. For example, even when the first pin and the third pin of the exchange IC are common, the same applies. By simply aligning the position of the first pin of the lower socket 4 with the position of the third pin of the upper socket 1, the power supply and ground pins are connected by inner holes (FIG. 2f).
~ I).

Also, since the pin pitch of the exchange IC may be different, the holes shown in FIGS. 2D and 2H or FIG.
It is not necessary that the positional relationship between the IC land of the hole of FIG. 2i and that of FIG.

When the positions of the power supply and the ground of the exchange IC are different, it is possible to cope with the problem by preparing an upper socket corresponding to the position.

FIG. 3 shows an IC according to another embodiment of the present invention.
It is an external view which shows the structure of a socket. In FIG. 3, an IC socket according to another embodiment of the present invention is configured by providing a jumper terminal 7 that jumps and conducts on a side surface of the upper socket 1.

As shown in FIG. 3, the jumper terminals 7 are arranged so as to correspond to the IC lands 2 on the upper surface and have electrical continuity. Signal pins that cannot be shared with the original IC are not connected by connection pins, but are directly connected to the jumper terminals 7 by lead wires.

[0026]

As is clear from the above description, according to the IC socket of the present invention, even if the IC socket to be replaced is a package different from the original, it can be easily replaced without processing.

Further, according to the IC socket of the present invention, even if the size (number of pins) of the IC socket to be replaced is different, the power supply and the ground can be easily secured, and the connection of the common signal pin is facilitated. be able to.

Further, according to the IC socket of the present invention,
Signal wiring can be performed without processing the IC to be replaced and without direct soldering. Therefore, the IC socket can be reused.

[Brief description of the drawings]

FIG. 1 is an external view showing a configuration of an IC socket according to an embodiment of the present invention.

FIG. 2 is a plan view of an upper socket and a lower socket in the embodiment of the present invention.

FIG. 3 is an external view showing a configuration of an IC socket according to another embodiment of the present invention.

[Explanation of symbols]

 1 upper socket 2 land for IC 3 connection pin 4 lower socket 5 hole for connection pin 6 signal pin 7 terminal for jumper

Claims (6)

[Claims] 1. An IC socket having a two-stage structure of an upper socket and a lower socket, wherein a connection pin for connecting the upper socket and the lower socket is provided on a bottom surface of the upper socket and an upper surface of the lower socket. A plurality of connection pin holes for inserting and removing the connection pins, wherein the upper socket and the lower socket are connected and fixed by inserting the connection pins into the connection pin holes. IC socket. 2. The IC socket according to claim 1, wherein said plurality of connection pin holes are provided with holes dedicated to power supply and ground. 3. The IC socket according to claim 2, further comprising a jumper terminal for performing jump continuity on a side surface of the upper socket. 4. An IC socket having a two-stage structure of an upper socket and a lower socket, wherein a connection pin for connecting the upper socket and the lower socket is provided on a bottom surface of the upper socket and an upper surface of the lower socket. A plurality of connection pin holes for inserting and removing the connection pins, the upper socket has an IC land corresponding to the connection pin holes, and the lower socket has a connection pin hole. An IC socket comprising corresponding signal pins, wherein the connection of the connection pins into the connection pin holes allows conduction between the IC lands of the upper socket and the signal pins of the lower socket. 5. The IC socket according to claim 4, wherein said plurality of connection pin holes have holes dedicated to power supply and ground. 6. The IC socket according to claim 4, further comprising a jumper terminal for performing jump conduction on a side surface of the upper socket.