JP2000180871A - Substrate sticking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate sticking device capable of reducing costs and uniforming a pressure to substrates. SOLUTION: Plural pairs of electrode substrates 1a and 1b are crimped orthogonal with the sticking surfaces of electrode substrates 1a and 1b, a pair of crimping means 7 and 8 are provided with a gas pressurizing means 6, and gas pressures are applied to plural pairs of electrode substrates 1a and 1b crimped by the crimped means 7 and 8 by these gas pressurizing means 6. In the case of pressurization by the gas pressurizing means 6, when a flexible member provided on the gas pressurizing means 6 is deformed to the side of electrode substrate and a moving means 5 provided between the flexible member and the electrode substrates 1a and 1b is moved to the side of electrode substrate with the deformation of this flexible member, the moving is detected by a detecting means 11a and based a detecting signal from this detecting means 11a, a control means 12 moves one movable crimping means 8 to a crimping direction and suppresses the deformation of this flexible member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bonding apparatus for bonding a pair of electrode substrates, and more particularly, to a sealing member for sealing liquid crystal between a pair of opposed electrode substrates and an adhesive member for bonding the pair of electrode substrates. Press and heat to cure,
The present invention relates to a device to which an electrode substrate is attached.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a liquid crystal, a sealing member for sealing the liquid crystal and an adhesive member for bonding the pair of electrode substrates are arranged between a pair of opposing electrode substrates, and the sealing member and the adhesive member are pressed. There is a substrate bonding apparatus that is heated and cured to bond an electrode substrate.

[0003] In this substrate bonding apparatus, when the sealing member and the adhesive member are cured, a pair of electrode substrates are superposed and aligned, and then the sheet heating element, the aluminum plate, and the cushioning material are attached to the electrode substrate. They are arranged on both sides, and thereafter, the entire surface of the electrode substrate is pressurized in order to suppress distortion of the electrode substrate due to thermal expansion during heating. As a pressing method, a method of pressing the entire surface of the electrode substrate with a compressed gas through a flexible plate in order to suppress distortion of the electrode substrate has been used.

[0004]

However, in the conventional substrate bonding apparatus using a structure in which the compressed gas is pressurized through such a flexible plate, the movable range of the flexible plate is small. The thermal expansion of the cushioning material can be tolerated if it is on the order of magnitude, but if multiple sets are stacked and processed at the same time, the flexible plate is pushed back and deformed due to the thermal expansion of the cushioning material and the uniform pressure is increased. You won't get it.

If the pressure of the compressed gas is increased so that the flexible plate is not deformed, the gap between the electrode substrates is reduced, resulting in a defective liquid crystal element.

On the other hand, as a method of applying pressure to a substrate, there is a method in which a pressurized chamber by a compressed gas is provided on one side of the substrate and a flat plate is used as a reference. In such a method, the flat plate can withstand pressurization. It is necessary to maintain flatness, and this requires the use of a thick plate as a flat plate.

However, when a thick plate is used, one side of the plate is stretched due to heating, and the plate warps and becomes non-standard. Therefore, use an expensive material such as ceramics with a small stretch, or It is necessary to perform a special processing for forming a flat surface, which increases the cost.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a substrate bonding apparatus capable of reducing the cost and making the pressure applied to the substrate uniform. is there.

[0009]

According to the present invention, there is provided a sealing member which is disposed on a bonding surface of a pair of electrode substrates and seals a liquid crystal injected between the pair of electrode substrates and the pair of electrode substrates. In a substrate bonding apparatus in which a plurality of pairs of electrode substrates are bonded by pressing and heating and curing an adhesive member, the plurality of pairs of electrode substrates are sandwiched in a direction orthogonal to a bonding surface of the electrode substrates. At the same time, at least one of the pair of pinching means provided so as to be movable in a direction orthogonal to the bonding surface, and the pair of electrode substrates provided at the pair of pinching means and pinched by the pinching means Gas pressurizing means for applying pressure by gas, provided in the gas pressurizing means, when pressurizing the gas pressurizing means,
A flexible member that deforms toward the electrode substrate, a moving member that is provided between the flexible member and the electrode substrate, and that moves toward the electrode substrate with the deformation of the flexible member; Detecting means for detecting the movement of the moving member, and control means for moving the one movable holding means in the holding direction based on a detection signal from the detecting means so as to suppress deformation of the flexible member. It is characterized by having.

The present invention also provides a heating means for heating the plurality of pairs of electrode substrates, a heat transfer means for transmitting heat from the heating means to the plurality of pairs of electrode substrates, Heat transfer detecting means for detecting movement of the moving member toward the gas pressurizing means side due to thermal expansion of the plurality of pairs of electrode substrates and heat transfer means, wherein the control means comprises: The movable member is moved in the direction opposite to the clamping direction so as to prevent the moving member from moving toward the gas pressurizing means on the basis of the detection signal from the sensor.

Further, the present invention is characterized in that the holding direction of the pair of holding means is a vertical direction.

Further, the present invention is characterized in that the gas pressurizing means is provided in both of the pair of holding means.

The present invention is characterized in that the pressures of the gas pressurizing means provided in both of the pair of holding means can be set separately.

Further, according to the present invention, the pressing force of the gas pressurizing means provided on both of the pair of holding means is set to be smaller than that of the upper holding means by the load of the plurality of pairs of electrode substrates, heat transfer means and heating means. The lower holding means is set to be higher by the load.

Further, the present invention is characterized in that the sealant contains a one-pack type thermosetting epoxy adhesive.

Further, the present invention is characterized in that the adhesive member includes a thermosetting epoxy adhesive for point-adhering the pair of electrode substrates.

Further, as in the present invention, a plurality of pairs of electrode substrates are sandwiched in a direction perpendicular to the bonding surface of the electrode substrates, and at least one of the pair is provided so as to be movable in a direction perpendicular to the bonding surface. A gas pressurizing means is provided in the holding means, and the gas pressurizing means applies a gas pressure to a plurality of pairs of electrode substrates held by the holding means.
Further, at the time of pressurization by the gas pressurizing means, the flexible member provided in the gas pressurizing means is deformed toward the electrode substrate, and the flexible member and the electrode substrate are deformed along with the deformation of the flexible member. When the moving member provided therebetween moves to the electrode substrate side, the detecting means detects this, and the control means moves one movable holding means in the holding direction based on a detection signal from this detecting means, The deformation of the flexible member is suppressed.

Further, as in the present invention, when heating by the heating means, a heat transfer means for transmitting heat from the heating means to the plurality of pairs of electrode substrates, and a moving member in accordance with thermal expansion of the plurality of pairs of electrode substrates. When moving to the gas pressurizing means side, the heat transfer detecting means detects this, and the control means moves one of the movable holding means in the direction opposite to the holding direction based on a detection signal from the heat transfer detecting means. The moving member is prevented from moving toward the gas pressurizing means.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a configuration of a substrate bonding apparatus according to a first embodiment of the present invention. In the figure,
1 is a substrate bonding apparatus, and this substrate bonding apparatus 1
The fixed upper pressing plate 7 which is one of the pair of holding means for holding a plurality of pairs of electrode substrates, the lower pressing plate 8 which is the other holding means and which can be raised and lowered, and the lower pressing plate 8 are raised and lowered. It has a jack 10 and a motor 9 for driving the jack 10.

In FIG. 1, reference numeral 6 denotes an upper air chamber provided on the bottom surface of the upper pressurizing plate 7 and constituting gas pressurizing means.
Pressure is applied to the electrode substrate sandwiched between the electrodes by air (gas).

Reference numeral 5 denotes an upper metal plate which is a moving member made of aluminum or the like having a uniform thickness for receiving the air pressure. The upper metal plate 5 is moved from the upper pressure plate 7 when the air pressure in the upper air chamber 6 increases. When the air pressure decreases, the upper pressure plate 7 moves so as to approach the upper pressure plate 7, whereby the position of the upper metal plate 5 can be known to determine the level of the pressing force.

Reference numerals 1a and 1b denote a pair of electrode substrates disposed to face each other. At least one of the opposing surfaces of the pair of electrode substrates 1a and 1b has one side for sealing liquid crystal. Liquid Crystal Cell Sealant and Electrode Substrate 1a, 1 as Sealing Member Containing Liquid-Type Thermosetting Epoxy Adhesive
An adhesive bead, which is an adhesive member including a thermosetting epoxy adhesive for spot bonding b, is attached.

Reference numeral 4 denotes a planar heating element, and reference numerals 3a and 3b denote heat plates which contact the pair of electrode substrates 1a and 1b. Here, the heat plates 3a and 3b are for uniformly transferring the heat generated by the heating element 4 disposed therebetween to the electrode substrates 1a and 1b, and are formed of a pair of aluminum having a good heat transfer property. I have. In addition, this heat plate 3
The a, 3b and the planar heating element 4 are formed slightly larger than the electrode substrates 1a, 1b.

2a and 2b are heat plates 3a,
3b and a thinly formed cushioning material disposed between the electrode substrates 1a and 1b. The cushioning materials 2a and 2b are deformed by the air pressure received by the electrode substrates 1a and 1b, and are deformed by
This is for equalizing the air pressure applied to a and 1b. The cushioning members 2a and 2b are provided on the electrode substrate 1
It is formed in substantially the same size as a and 1b.

In the step of curing the sealant and the adhesive bead in the manufacturing process of the liquid crystal element, first, as shown in FIG. After arranging the buffer material 2b in order, the pair of electrode substrates 1a and 1b are arranged.

Next, a buffer material 2a, a heat plate 3a, a planar heating element 4, and a heat plate 3b are sequentially arranged on the pair of electrode substrates 1a and 1b, and a pair of electrode substrates 1a is further disposed thereon. , 1b, and thereafter, the members are arranged in this order. Note that the buffer material 2a, the heat plate 3b, the heating element 4, the heat plate 3a, and the upper metal plate 5 are arranged on the pair of uppermost electrode substrates 1a, 1b.

FIG. 2 is a cross-sectional view of the upper air chamber 6, in which 18 is a rubber sheet which is a flexible member forming the bottom of the upper air chamber 6, and 19 is a rubber sheet press fitting. . Here, when the air is injected from the air injection port 17 and the lower cushioning materials 2a and 2b are deformed by the pressure of the air, the rubber sheet 18 expands downward with the air. Rubber sheet 1
When the swelling 8 expands, it is pressed by the rubber sheet 18 and the upper metal plate 5 descends.

On the other hand, beside the upper metal plate 5, FIG.
As shown in (1), a first sensor 11a as a detecting means for detecting the position of the upper metal plate 5 is provided. Here, the first sensor 11a is for detecting the upper metal plate 5 which is pressed by the rubber sheet 18 and descends,
The detection signal from the first sensor 11a is input to the control means 12.

The control means 12 controls the driving of the motor 9 for raising and lowering the jack 10 as shown in FIG. 3. When the electrode substrates 1a and 1b are bonded, the motor 9 is driven to drive the jack 10. The upper pressure plate 7 is raised and lowered by being raised.

Further, the control means 12 controls the upper pressure plate 7
Is raised and lowered to sandwich the electrode substrates 1a and 1b, and then pressed by the rubber sheet 18 to lower the upper metal plate 5, and when a detection signal is input from the first sensor 11a that detects this,
The motor 9 is driven to raise the lower pressure plate 8 so as to suppress the swelling of the rubber sheet 18.

When the rubber sheet 18 swells in this way, the lower pressure plate 8 is moved upward in the holding direction, and the swelling of the rubber sheet 18 is suppressed, that is, the deformation of the rubber sheet 18 is suppressed. A constant pressing force is applied through the upper metal plate 5 to the electrode substrates 1a, 1b.
Can be added to

On the other hand, the upper metal plate 5 is
After the bonding of a and 1b is started, when the electrode substrates 1a and 1b, the cushioning materials 2a and 2b, and the heat plates 3a and 3b expand due to the heat generated by the heat generating elements 4, the expanded members push up the electrode substrates 1a and 1b. Become like

Here, in order to detect such a rise of the upper metal plate 5, a second sensor 11b as heat transfer detecting means is provided as shown in FIG. When the second sensor 11b detects the pushed-up upper metal plate 5, the control means 12 drives the motor 9 based on the detection signal from the second sensor 11b to lower the lower pressure plate 8. I have.

When the upper metal plate 5 rises in this way, the lower pressure plate 8 is moved in the direction opposite to the clamping direction, thereby preventing the upper air chamber 6 from being crushed by the pushed up upper metal plate 5. be able to.

In FIG. 3, reference numeral 4A denotes a temperature sensor provided on the heating element 4, and the control means 12 controls the heating value of the heating element 4 based on the temperature information from the temperature sensor 4A. I have.

Then, by configuring as described above,
The heat generated by the heat generating elements 4 is controlled by the heat plate 3 while uniformly pressing the bonded electrode substrates 1a and 1b with air pressure.
a, 3b and each of the electrode substrates 1a,
The electrode substrates 1a and 1b can be bonded together by transferring heat to the liquid crystal cell 1b to cure the liquid crystal cell sealant and the adhesive beads.

Next, a description will be given of the operation of bonding the electrode substrate of the present apparatus thus configured.

First, before disposing the pair of electrode substrates 1a and 1b in the present apparatus, one of the pair of electrode substrates 1a and 1b, which is one of the glass substrates on which electrodes and the like are formed (plate thickness:
1.1 mm, size: 300 mm x 340 mm)
A liquid crystal cell sealant (for example, manufactured by Mitsui Chemicals, Inc., trade name: Stractbond XN-21-) by a screen printing method.
F) is printed, and thereafter, adhesive beads having an average particle size of about 5.6 μm (for example, trade name: Trepearl type III, manufactured by Toray Industries, Inc.) are sprayed at an average density of 80 beads per 1 mm ² .

The other one of the pair of electrode substrates 1a and 1b is a glass substrate on which electrodes and the like are formed (thickness: 1.
1 mm), spacers having an average particle size of about 1.04 μm (for example, silica microbeads manufactured by Catalyst Chemical Industry Co., Ltd.) are sprayed at an average density of 300 pieces per 1 mm ^2. The pair of electrode substrates 1a and 1b are formed by overlapping the substrates.

Then, as shown in FIG.
A planar heating element (for example, manufactured by Sakaguchi Electric Heat Co., Ltd., trade name: Samicon 230, watt density: 1 W / cm ² ) 4, a heat plate (plate thickness:
2b aluminum plate) 3b, cushioning material (for example, foamed silicone rubber, manufactured by Tigers Polymer, thickness: 2mm) 2b
The electrode substrates 1a and 1b located at the lowermost position are arranged on the substrate.

Next, after the buffer material 2a, the heat plate 3a, the heating element 4, the heat plate 3b, and the buffer material 2b are arranged on the electrode substrates 1a, 1b, the electrode substrates 1a, 1b
Are arranged, and thereafter each member is arranged in the same manner. After arranging the uppermost electrode substrates 1a and 1b, a buffer material 2a, a heat plate 3b, a heating element 4, a heat plate 3a and an upper metal plate 5 are placed on the electrode substrates 1a and 1b.
Place.

On the other hand, when the start switch (not shown) is operated after the electrode substrates 1a, 1b, etc. are arranged in the apparatus 1, the control means 12 drives the motor 9 and the jack 10 causes the lower pressing plate 8 to be driven. Is raised, and the upper pressure plate 7 and the lower pressure plate 8 sandwich a plurality of pairs of electrode substrates 1a and 1b.
At this time, the upper metal plate 5 contacts the upper air chamber 6 so that there is no gap. Thereafter, the control means 12 introduces pressurized air from the air inlet 17 into the upper air chamber 6, raises the pressure in the upper air chamber to a predetermined pressure of 1 kg / cm ^2, and applies the electrode substrates 1a and 1b. Press.

When the air is injected into the upper air chamber 6, the pressure of the air causes the lower cushioning material 2a,
2b is deformed, and the rubber sheet 18 swells downward with the deformation, and when the upper metal plate 5 is further pressed by the rubber sheet 18, the first sensor 11a detects this, and
The detection signal is output to the control means 12. Then, when the detection signal is input as described above, the control means 12 drives the motor 9 based on the detection signal, raises the lower pressing plate 8 via the jack 10, and suppresses the swelling of the rubber sheet 18. I do.

Next, after the swelling of the rubber sheet 18 is suppressed in this way, the control means 12 energizes each heating element 4 to generate heat. Then, the heat of each of the heating elements 4 is transferred to each of the electrode substrates 1a and 1b via the heat plates 3a and 3b and the cushioning materials 2a and 2b, respectively. Here, at this time, the heat plates 3a,
The heat generated by the heating element 4 is adjusted by a temperature sensor (see FIG. 3) and a temperature controller (not shown) so that the temperature of 3b is maintained at 160 ° C. The temperature of the electrode substrates 1a and 1b is 160 ° C.
It takes 10-15 minutes to reach.

At this time, as the temperature rises,
The pressurized cushioning materials 2a and 2b and the heat plate 3
a, 3b, the heating element 4, the electrode substrates 1a, 1b, etc. expand,
When the upper metal plate 5 moves upward due to the expansion of each member, the second sensor 11b detects the rise of the upper metal plate 5 and outputs a detection signal to the control means 12. Then, when the detection signal is input in this way, the control means 12 lowers the jack 10 via the motor 9 based on the detection signal, thereby preventing the upper air chamber 6 from being collapsed.

Then, the electrode substrates 1a, 1
After the pressing force for b is set to an appropriate value, the electrode substrates 1a,
1b is kept at 160 ° C. for 1 hour, and thereafter, after the power to the heating element 4 is turned off and cooled, the electrode substrates 1a, 1b, etc. are taken out of the apparatus.

Here, when the electrode substrates 1a and 1b taken out were observed, they were substrates having a uniform cell gap without color unevenness. In addition, a cell gap in the display surface of this substrate is measured using an empty cell gap measuring device (TM-123, manufactured by Canon Inc.).
When measured in 0), it was 0.91 to 0.97 μm, which was of sufficient quality to be used.

As described above, when the rubber sheet 18 swells when the electrode substrates 1a and 1b are pressed, the lower pressing plate 8 is moved upward to suppress the deformation of the rubber sheet 18 so that the upper metal plate is suppressed. A constant pressing force can always be applied to the electrode substrates 1a and 1b via the electrode 5, and it is possible to manufacture the electrode substrates 1a and 1b of sufficient quality for use.

When heating the electrode substrates 1a and 1b, if the upper metal plate 5 rises with the expansion of the electrode substrates 1a and 1b, the cushioning materials 2a and 2b, and the heat plates 3a and 3b, the lower pressing plate 8 Is lowered to prevent the upper metal plate 5 from moving, whereby the upper air chamber 6 can be prevented from being crushed by the upper metal plate 5.

Next, a second embodiment of the present invention will be described.

FIG. 4 is a diagram showing the structure of the substrate bonding apparatus according to the present embodiment. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding parts.

In FIG. 8, reference numeral 8A denotes a lower pressing plate, and the lower pressing plate 8A is lighter than the lower pressing plate 8 of the first embodiment described above. Reference numeral 6a denotes a lower air chamber provided on the upper surface of the lower pressurizing plate 8A, and 5a denotes a lower metal plate made of aluminum or the like and having a uniform thickness for receiving air pressure.

Here, as shown in FIG. 5, the lower air chamber 6a has a rubber sheet 18a forming the upper surface of the lower air chamber 6a. Is injected, and when the upper cushioning materials 2a and 2b are deformed by the pressure of the air, the upper cushioning materials 2a and 2b are swelled upward. When the rubber sheet 18a is swelled in this way, the rubber sheet 18a is pressed by the rubber sheet 18a. The lower metal plate 5a rises. In addition, 1
9a is a rubber sheet press fitting.

Next, a description will be given of the operation of bonding the electrode substrate of the present apparatus thus configured.

First, in the curing step of the liquid crystal cell sealant and the adhesive bead, as in the first embodiment described above, before disposing the pair of electrode substrates 1a and 1b in the present apparatus, the pair of electrode substrates 1a and 1b are disposed. electrode substrates 1a, 1b to print a sealant for a liquid crystal cell by screen printing on one glass substrate constituting the, then, the average particle diameter of about 5.6μm adhesive beads 1 mm ² per average eighty Spray with density.

Further, spacers having an average particle size of about 1.04 μm are scattered on the other glass substrate constituting the pair of electrode substrates 1a and 1b at an average density of 300 spacers per 1 mm ² , and then the two glass substrates are dispersed. To form a pair of electrode substrates 1a and 1b.

Next, as shown in FIG. 4, the lower metal plate 5 having a thickness of 8 mm is placed on the lower air chamber 6a provided in the lower pressure plate 8A.
After disposing a, a heat plate 3a, a planar heating element 4, a heat plate 3b, and a buffer 2b are disposed thereon, and then a pair of electrode substrates 1a and 1b are disposed.

Next, a buffer material 2a, a heat plate 3a, a planar heating element 4, a heat plate 3b, and a buffer material 2b are sequentially arranged on the pair of electrode substrates 1a and 1b. The electrode substrates 1a and 1b are arranged, and each member is arranged in this order. Note that a buffer 2a, a heat plate 3b, a heating element 4, a heat plate 3a, and an upper metal plate 5 are arranged on the pair of electrode substrates 1a, 1b located at the uppermost part.

On the other hand, when the start switch (not shown) is operated after the electrode substrates 1a, 1b, etc. are arranged in the apparatus 1, the control means 12 drives the motor 9 and the jack 10 causes the lower pressing plate 8A. And a plurality of pairs of electrode substrates 1a and 1b are sandwiched between the upper pressing plate 7 and the lower pressing plate 8A. At this time, the upper air chamber 6 contains the upper metal plate 5.
Abut so that there is no gap. Thereafter, pressurized air is introduced into the upper and lower air chambers 6, 6a, and the pressure in each air chamber is increased to a predetermined pressure of 1 kg / cm ² to pressurize each of the electrode substrates 1a, 1b.

The upper and lower air chambers 6
When the air is injected into the upper air chamber 6a, the cushioning materials 2a and 2b are deformed by the pressure of the air, and the rubber sheet 18 of the upper air chamber 6 swells downward.
When the upper metal plate 5 descends due to the pressure, the first sensor 11 a detects this and outputs a detection signal to the control means 12. The control means 12 raises the jack 10 via the motor 9 based on the detection signal, and
8 bulge.

Next, after suppressing the swelling of the rubber sheet 18 in this manner, the control means 12 energizes each heating element 4 to generate heat. Then, the heat of each of the heating elements 4 is transferred to each of the electrode substrates 1a and 1b via the heat plates 3a and 3b and the cushioning materials 2a and 2b, respectively. Here, at this time, the heat plates 3a,
The heat generated by the heating element 4 is adjusted by a temperature sensor (see FIG. 3) and a temperature controller (not shown) so that the temperature of 3b is maintained at 160 ° C. The temperature of the electrode substrates 1a and 1b is 160 ° C.
It takes 10-15 minutes to reach.

At this time, as the temperature rises,
The pressurized cushioning materials 2a and 2b and the heat plate 3
a, 3b, the heating element 4, the electrode substrates 1a, 1b, etc. expand,
Due to the expansion of each member, the upper metal plate 5 moves upward,
The lower metal plate 5a moves downward. However, when the upper metal plate 5 rises in this way, it is detected by the second sensor 11b.
And outputs a detection signal to the control means 12. Then, the control means 12 lowers the jack 10 via the motor 9 based on the detection signal so as to prevent the upper air chamber 6 and the lower air chamber 6a from being crushed.

Then, the electrode substrates 1a, 1
After the pressing force for b is set to an appropriate value, the electrode substrates 1a,
1b is kept at 160 ° C. for 1 hour, and thereafter, after the power to the heating element 4 is turned off and cooled, the electrode substrates 1a, 1b, etc. are taken out of the apparatus.

When the electrode substrates 1a and 1b taken out were observed, they were substrates having a uniform cell gap without color unevenness. In addition, the cell gap in the display surface of the substrate is measured using an empty cell gap measuring device (TM-1230, manufactured by Canon Inc.).
Is 0.91 to 0.96 μm,
It was of sufficient quality for use.

As described above, the lower pressure plate 8A is also provided with the air chamber 6a.
By providing the lower pressure plate 8A, the weight of the lower pressure plate 8A can be reduced, and it is not necessary to use a heavy surface plate as the lower pressure plate. This eliminates the use of expensive materials such as ceramics with low elongation as the lower pressure plate,
In addition, since special processing for forming a flat surface during heating is not required, the cost can be reduced.

As described above, when a plurality of pairs of electrode substrates 1a and 1b are sandwiched by the upper pressurizing plate 7 and the lower pressurizing plate 8A, the load of the sandwiched electrode substrates and other members is applied to the lower air chamber 6a. Become like Here, the lower air chamber 6a
In this case, this load is supported by air pressure, but the insufficient portion is supported by the surrounding rubber sheet fasteners 19a, so that slight pressure unevenness occurs.

Therefore, in order to eliminate the pressure unevenness, the pressure of the lower air chamber 6a may be made higher than the pressure of the upper air chamber 6 by an amount corresponding to the load of the member sandwiched between the upper and lower air chambers. .

Next, a third embodiment of the present invention in which the pressure in the lower air chamber 6a is made higher than the pressure in the upper air chamber 6 will be described with reference to FIG.

The structure of the substrate bonding apparatus according to the present embodiment is the same as the apparatus shown in FIG. 4, but in this apparatus, the pressure control of the pressurized air in the upper and lower air chambers 6, 6a is performed. The upper air chamber 6 and the lower air chamber 6a are configured so that they can be separately operated.

Further, in the present embodiment, the pressure of the lower air chamber 6a is made higher than the pressure of the upper air chamber 6 by an amount corresponding to the load of the member sandwiched between the upper and lower air chambers. In this embodiment, this pressure control is performed by the control means shown in FIG.

Next, a description will be given of the operation of bonding the electrode substrate of the present apparatus thus configured.

First, in the curing step of the liquid crystal cell sealant and the adhesive beads, before disposing the pair of electrode substrates 1a and 1b in the present apparatus, as in the second embodiment described above. electrode substrates 1a, 1b to print a sealant for a liquid crystal cell by screen printing on one glass substrate constituting the, then, the average particle diameter of about 5.6μm adhesive beads 1 mm ² per average eighty Spray with density.

Further, spacers having an average particle size of about 1.04 μm are scattered on the other glass substrate constituting the pair of electrode substrates 1a and 1b at an average density of 300 spacers per 1 mm ² , and then the two glass substrates are dispersed. To form a pair of electrode substrates 1a and 1b.

Next, as shown in FIG. 4, the lower metal plate 5 having a thickness of 8 mm is placed on the lower air chamber 6a provided in the lower pressure plate 8A.
After disposing a, a heat plate 3a, a planar heating element 4, a heat plate 3b, and a buffer 2b are disposed thereon, and then a pair of electrode substrates 1a and 1b are disposed.

Next, a buffer material 2a, a heat plate 3a, a planar heating element 4, a heat plate 3b, and a buffer material 2b are sequentially arranged on the pair of electrode substrates 1a and 1b. The electrode substrates 1a and 1b are arranged, and each member is arranged in this order. Note that a buffer 2a, a heat plate 3b, a heating element 4, a heat plate 3a, and an upper metal plate 5 are arranged on the pair of electrode substrates 1a, 1b located at the uppermost part.

On the other hand, when the start switch (not shown) is operated after the electrode substrates 1a, 1b and the like are arranged in the apparatus 1, the control means 12 drives the motor 9 and the jack 10 causes the lower pressing plate 8A. And a plurality of pairs of electrode substrates 1a and 1b are sandwiched between the upper pressing plate 7 and the lower pressing plate 8A. At this time, the upper air chamber 6 contains the upper metal plate 5.
Abut so that there is no gap.

Thereafter, pressurized air is introduced into the upper and lower air chambers 6, 6a, the pressure in the upper air chamber 6 is increased to a predetermined pressure of 1 kgf / cm ² , and the pressure in the lower air chamber 6a is increased. Each electrode substrate 1a, 1b is pressurized by increasing the pressure to the pressure of the air chamber 6 +0.09 kgf / cm ² (the pressure of air corresponding to the load of the member sandwiched between the upper and lower air chambers).

The upper and lower air chambers 6
When the air is injected into the upper air chamber 6a, the cushioning materials 2a and 2b are deformed by the pressure of the air, and the rubber sheet 18 of the upper air chamber 6 swells downward.
When the upper metal plate 5 descends due to the pressure, the first sensor 11 a detects this and outputs a detection signal to the control means 12. The control means 12 raises the jack 10 via the motor 9 based on the detection signal, and
8 bulge.

Next, after suppressing the swelling of the rubber sheet 18 in this way, the control means 12 energizes each heating element 4 to generate heat. Then, the heat of each of the heating elements 4 is transferred to each of the electrode substrates 1a and 1b via the heat plates 3a and 3b and the cushioning materials 2a and 2b, respectively. Here, at this time, the heat plates 3a,
The heat generated by the heating element 4 is adjusted by a temperature sensor (see FIG. 3) and a temperature controller (not shown) so that the temperature of 3b is maintained at 160 ° C. The temperature of the electrode substrates 1a and 1b is 160 ° C.
It takes 10-15 minutes to reach.

At this time, as the temperature rises,
The pressurized cushioning materials 2a and 2b and the heat plate 3
a, 3b, the heating element 4, the electrode substrates 1a, 1b, etc. expand,
Due to the expansion of each member, the upper metal plate 5 moves upward,
The lower metal plate 5a moves downward. However, when the upper metal plate 5 rises in this way, it is detected by the second sensor 11b.
And outputs a detection signal to the control means 12. Then, the control means 12 lowers the jack 10 via the motor 9 based on the detection signal so as to prevent the upper air chamber 6 and the lower air chamber 6a from being crushed.

Then, the electrode substrates 1a, 1
After the pressing force for b is set to an appropriate value, the electrode substrates 1a,
After maintaining 1b at 160 ° C. for 1 hour, the power supply to the heating element 4 is turned off to cool it, and then these electrode substrates 1a, 1b, etc. are taken out of the apparatus.

Here, the extracted electrode substrates 1a, 1
Observation of b showed that the substrate had a uniform cell gap without color unevenness. In addition, a cell gap in the display surface of this substrate is measured using an empty cell gap measuring device (TM-123, manufactured by Canon Inc.).
The value measured in 0) was 0.91 to 0.95 μm, and was of very good quality.

Thus, the upper and lower air chambers 6, 6a
The upper air chamber 6 and the lower air chamber 6
a, the pressure of the lower air chamber 6a is made larger than the pressure of the upper air chamber 6 by an amount corresponding to the load of the member sandwiched between the upper and lower air chambers, so that the pressure is more uniform. The electrode substrates 1a and 1b can be pressurized with a suitable pressure, and a liquid crystal panel having a uniform cell gap and high quality can be manufactured.

Next, a fourth embodiment of the present invention will be described.

In the present embodiment, the first and second arrangement methods and numbers of the liquid crystal cell sealant and the adhesive beads are described above.
-Different from those of the third embodiment.

That is, in the present embodiment, in the above-described curing step of the liquid crystal cell sealant and the adhesive bead, each of the pair of electrode substrates 1a and 1b is disposed before the pair of electrode substrates 1a and 1b are arranged in the present apparatus. A liquid crystal cell sealant was drawn on one of the glass substrates constituting 1a and 1b with a dispenser, and then adhesive beads having an average particle size of about 5.6 μm were sprayed at an average density of 130 beads per 1 mm ² . .

Further, spacers having an average particle size of about 2.4 μm were sprayed on the other glass substrate constituting the pair of electrode substrates 1a and 1b at an average density of 300 spacers per 1 mm ² . Then, the two glass substrates were overlapped to form a pair of electrode substrates 1a and 1b.

Then, after keeping the electrode substrates 1a and 1b at 160 ° C. for 1 hour, the power supply to the heating element 4 was turned off to cool down, and then these electrode substrates 1a and 1b were taken out of the apparatus.

When the electrode substrates 1a and 1b were observed, they were uniform and had a uniform cell gap without color unevenness. The cell gap in the display surface of this substrate was measured with an empty cell gap measuring device (manufactured by Canon, TM-1230) and was found to be 1.87 to 1.97 μm, which was of sufficient quality for use.

Next, a comparative example of the present invention will be described.

FIG. 6 is a diagram showing the configuration of a conventional substrate bonding apparatus according to this comparative example. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding parts.

In the same figure, reference numeral 7A denotes an upper pressing plate, which is lowered by the moving means 15 so as to sandwich the electrode substrates 1a and 1b.

Next, a description will be given of the operation of bonding the electrode substrate of the present apparatus thus configured.

First, in the curing step of the liquid crystal cell sealant and the adhesive beads, one glass constituting each pair of electrode substrates 1a and 1b is disposed before the pair of electrode substrates 1a and 1b are arranged in the present apparatus. A sealant for a liquid crystal cell is printed on the substrate by a screen printing method, and thereafter, the average particle size is 5.6 μm.
m adhesive beads are sprayed at an average density of 80 beads per mm ² .

Further, spacers having an average particle diameter of about 1.04 μm are sprayed on the other glass substrate constituting the pair of electrode substrates 1a and 1b at an average density of 300 spacers per 1 mm ² , and then the two glass substrates are dispersed. To form a pair of electrode substrates 1a and 1b.

Then, after the planar heating element 4, the heat plate 3b, and the buffer 2b are arranged on the pressing table 13, a pair of electrode substrates 1a, 1b is arranged. Next, a buffer 2a, a heat plate 3a, a planar heating element 4, a heat plate 3b, and a buffer 2b are sequentially arranged on the pair of electrode substrates 1a and 1b, and a pair of electrode substrates is further placed thereon. 1
a and 1b are arranged, and thereafter, each member is arranged in this order.
Note that a buffer 2a, a heat plate 3b, a heating element 4, a heat plate 3a, and an upper metal plate 5 are arranged on the pair of electrode substrates 1a, 1b located at the uppermost part.

Next, the upper pressing plate 7A is lowered by the moving means 15, and the cushioning members 2a, 2b are fixed in a slightly compressed state, and the electrode substrates 1a, 1b are sandwiched by the pressing table 13. Thereafter, pressurized air is introduced into the upper air chamber 6 provided on the upper pressurizing plate 7A, and the pressure in the upper air chamber is increased to a predetermined pressure of 1 kg / cm ² to pressurize the electrode substrates 1a and 1b.

At this time, when air is supplied, the cushioning materials 2a and 2b are crushed by the pressure of the air, and the rubber sheet (see FIG. 2) which is a part of the upper air chamber 6 expands. Keep the cushioning material compressed.

Then, each heating element 4 is energized to generate heat. At this time, the temperature of the heat plates 3a, 3b in contact with the electrode substrates 1a, 1b is maintained at 160 ° C.
The heat generated by the heating element 4 is adjusted by a connected temperature sensor (see FIG. 3) and a temperature controller (not shown). The electrode substrate 1
It takes 10 to 15 minutes for the temperatures of a and 1b to reach 160 ° C.

At this time, as the temperature rises, the buffer materials 2a, 2b, the heat plates 3a, 3b, the heating elements 4, the electrode substrates 1a, 1b, etc., which are being pressed expand, and the upper metal plate 5 Rises. When the upper metal plate 5 rises in this manner, the upper metal plate 5 pushes the rubber sheet of the upper air chamber 6 and crushes the upper air chamber 6. The pressurizing table 13 installed at the lower part is deformed such that the upper part is heated and the upper part becomes convex.

Thereafter, the electrode substrates 1a and 1b were held at 160 ° C. for one hour, and then the power supply to the heating element 4 was turned off to cool the device. Thereafter, the electrode substrates 1a and 1b were taken out of the apparatus.

Here, when the substrate taken out was observed, it was found that the substrate had a different color tone between the central part and the peripheral part, and the substrate had severe color unevenness. Further, the degree of the color unevenness differs depending on the input position of the substrate. Both ends in the overlapping order were good, and the one located at the center was bad. Further, when the cell gap in the display surface of the substrate located at the center where the color unevenness was severe was measured by an empty cell gap measuring device (TM-1230, manufactured by Canon Inc.), the center part was about 0.6 μm, and the peripheral part was about 0.6 μm. Was about 0.9 μm. This was a defective product that could not be used.

[0104]

As described above, according to the present invention, when pressurized by the gas pressurizing means, deformation of the flexible member to the electrode substrate side is suppressed, so that the pressing force on the substrate is made uniform. Accordingly, the gap between the pair of substrates can be made uniform.

Further, as in the present invention, during heating by the heating means, the moving member is prevented from moving toward the gas pressurizing means side due to the expansion of a plurality of pairs of electrode substrates, heat transfer means, etc. Can be prevented from collapsing.

Further, by arranging the gas pressurizing means on both sides of the electrode substrate as in the present invention, it is possible to manufacture a panel of good quality and to use a heavy surface plate when manufacturing the apparatus. The apparatus can be manufactured at a low cost without requiring any processing.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a substrate bonding apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional view of an upper air chamber of the substrate bonding apparatus.

FIG. 3 is a control block diagram of control means of the substrate bonding apparatus.

FIG. 4 is a diagram showing a configuration of a substrate bonding apparatus according to the first embodiment of the present invention.

FIG. 5 is a sectional view of a lower air chamber of the substrate bonding apparatus.

FIG. 6 is a diagram showing a configuration of a conventional substrate bonding apparatus according to a comparative example of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate bonding apparatus 1a, 1b Electrode substrate 2a, 2b Buffer material 3a, 3b Heat plate 4 Heating element 5 Upper metal plate 5a Lower metal plate 6 Upper air chamber 6a Lower air chamber 7, 7A Upper pressurizing plate 8, 8A Pressure plate 9 Motor 10 Jack 11a First sensor 11b Second sensor 12 Control means 18, 18a Rubber sheets 19, 19a Rubber sheet holding fitting

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Maki Sunaga 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. F-term (reference) 2H088 FA01 FA30 MA17 2H089 NA48 QA12 QA14

Claims (8)

[Claims] 1. A sealing member, which is disposed on a bonding surface of a pair of electrode substrates and seals liquid crystal injected between the pair of electrode substrates, and an adhesive member that bonds the pair of electrode substrates, are heated and pressed. In the substrate bonding apparatus, a plurality of pairs of electrode substrates are bonded to each other, and the plurality of pairs of electrode substrates are sandwiched in a direction orthogonal to a bonding surface of the electrode substrates, and at least one of the plurality of pairs of the electrode substrates is bonded. A pair of holding means movably provided in a direction orthogonal to the mating surface; and gas pressurization provided on the pair of holding means and applying pressure to the plurality of pairs of electrode substrates held by the holding means by gas. Means, a flexible member provided on the gas pressurizing means, and deformed toward the electrode substrate when the gas pressurizing means pressurizes, provided between the flexible member and the electrode substrate. The flexible A moving member that moves to the electrode substrate side as the material deforms; a detecting unit that detects the movement of the moving member; and the one that suppresses deformation of the flexible member based on a detection signal from the detecting unit. And a control means for moving the movable holding means in the holding direction. 2. A heating means for heating the plurality of pairs of electrode substrates; a heat transfer means for transmitting heat from the heating means to the plurality of pairs of electrode substrates; Heat transfer detecting means for detecting the movement of the moving member toward the gas pressurizing means due to the thermal expansion of the electrode substrate and the heat transfer means, and the control means detects the heat transfer from the heat transfer detecting means. 2. The substrate bonding apparatus according to claim 1, wherein the one movable holding means is moved in a direction opposite to a holding direction so as to prevent the movement member from moving toward the gas pressurizing means based on a signal. . 3. The substrate bonding apparatus according to claim 1, wherein the holding direction of the pair of holding means is a vertical direction. 4. The substrate bonding apparatus according to claim 1, wherein said gas pressurizing means is provided on both of said pair of holding means. 5. The substrate bonding apparatus according to claim 4, wherein the pressures of the gas pressurizing means provided on both of the pair of holding means can be set separately. 6. The pressure of the gas pressurizing means provided on both of the pair of holding means is set lower than the upper holding means, where the load of the plurality of pairs of electrode substrates, heat transfer means and heating means is applied. The substrate bonding apparatus according to claim 5, wherein the holding means is set to be higher by the load. 7. The substrate bonding apparatus according to claim 1, wherein the sealant contains a one-component thermosetting epoxy adhesive. 8. The substrate bonding apparatus according to claim 1, wherein the bonding member includes a thermosetting epoxy adhesive for point bonding the pair of electrode substrates.